US7535152B2 - Lamb wave device - Google Patents
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- US7535152B2 US7535152B2 US12/099,839 US9983908A US7535152B2 US 7535152 B2 US7535152 B2 US 7535152B2 US 9983908 A US9983908 A US 9983908A US 7535152 B2 US7535152 B2 US 7535152B2
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Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
- H03H9/02559—Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/25—Constructional features of resonators using surface acoustic waves
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
- H03H3/10—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves for obtaining desired frequency or temperature coefficient
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
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- H03H9/02015—Characteristics of piezoelectric layers, e.g. cutting angles
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- H—ELECTRICITY
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- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02228—Guided bulk acoustic wave devices or Lamb wave devices having interdigital transducers situated in parallel planes on either side of a piezoelectric layer
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- H—ELECTRICITY
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- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
Definitions
- the present invention relates to a Lamb wave device using a Lamb wave propagating in a piezoelectric thin film, and more particularly, to a Lamb wave device used as a resonator or a filter.
- devices using various waves excited using a piezoelectric effect have been proposed and used.
- devices using a surface acoustic wave that is, energy that concentrates in the vicinity of a surface of an elastic body and propagates, have been widely used as a resonator, a filter, and other suitable devices.
- the Lamb wave is one type of bulk wave, that is, one type of plate wave, and is an elastic wave which propagates in a piezoelectric body while reflecting off two primary surfaces thereof when the thickness of the piezoelectric body is equal to or less than the wavelength of the elastic wave.
- an SH wave is also known.
- preferred embodiments of the present invention provide a Lamb wave device which not only obtains a higher bandwidth by increasing the electromechanical coupling coefficient but also suppresses the influence of undesired spurious responses.
- a Lamb wave device which includes a base substrate, a piezoelectric thin film provided on the base substrate and having a floating portion floating above the base substrate, the floating portion having a first surface facing the base substrate and a second surface opposite to the first surface, and an IDT electrode disposed on at least one of the first and the second surfaces of the piezoelectric thin film.
- the piezoelectric thin film is formed of LiTaO 3 or LiNbO 3 , and the c-axis of the piezoelectric thin film is set in approximately the same direction as that of a perpendicular line to the first and the second surfaces of the piezoelectric thin film, and the crystal structure of the piezoelectric thin film is a rotation twin crystal with the c-axis functioning as the rotation axis.
- the piezoelectric thin film is made of LiNbO 3
- the IDT electrode is made of Al or an alloy including Al as a primary component
- the thickness of the IDT electrode is represented by h
- the thickness of the piezoelectric thin film is represented by d
- the wavelength of a usage mode of the Lamb wave is represented by ⁇ , h and d satisfy one of the following conditions I to III. 0.01 ⁇ h/d ⁇ 0.24 and 0.090 ⁇ d/ ⁇ 0.107 I 0.01 ⁇ h/d ⁇ 0.24 and 0.133 ⁇ d/ ⁇ 0.233 II 0.01 ⁇ h/d ⁇ 0.24 and 0.257 ⁇ d/ ⁇ 0.300 III
- the piezoelectric thin film is made of LiTaO 3
- the IDT electrode is made of Al or an alloy including Al as a primary component
- the thickness of the IDT electrode is represented by h
- the thickness of the piezoelectric thin film is represented by d
- the wavelength of a usage mode of the Lamb wave is represented by ⁇ , h and d satisfy one of the following conditions IV to VI. 0.01 ⁇ h/d ⁇ 0.26 and 0.093 ⁇ d/ ⁇ 0.125 IV 0.01 ⁇ h/d ⁇ 0.26 and 0.141 ⁇ d/ ⁇ 0.240 V 0.01 ⁇ h/d ⁇ 0.26 and 0.260 ⁇ d/ ⁇ 0.300 VI
- the IDT electrode is formed on the second surface of the piezoelectric thin film.
- the IDT electrode is provided on the first surface of the piezoelectric thin film.
- the piezoelectric thin film is made of LiTaO 3 or LiNbO 3
- the c-axis is set in approximately the same direction as that of a perpendicular line to the first and the second surfaces of the piezoelectric thin film, and the crystal structure thereof is a rotation twin crystal
- the fundamental mode S 0 of the symmetric mode and/or the fundamental mode SH 0 of the SH mode is not generated, and out-of-band spurious responses based on these modes are suppressed.
- a Lamb wave device having superior frequency properties is provided.
- a device having a central frequency of about 2 GHz to about 10 GHz and a fractional band width of about 1% to about 10% can be provided.
- the Lamb wave device according to preferred embodiments of the present invention may be applied to various devices, such as a resonator.
- the piezoelectric thin film is made of LiNbO 3
- the IDT electrode is made of Al or an alloy including Al as a primary component, and h and d satisfy one of the above conditions I to III, the generation of spurious responses in the vicinity of the pass band is effectively suppressed, and ripples generated in the pass band and spurious responses in the vicinity of the pass band are suppressed.
- the IDT electrode is formed of Al or an alloy containing Al as a primary component, and h and d satisfy one of the above conditions IV to VI, as is the case described above, the generation of spurious responses in the vicinity of the pass band is suppressed, and ripples generated in the pass band and spurious responses in the vicinity of the pass band are effectively suppressed.
- the Lamb wave device can be easily provided.
- the IDT electrode may be formed on the first surface of the piezoelectric thin film, and in this case, since the IDT electrode faces the base substrate and is not exposed to the outside, a metal powder generated from a metal material used for an exterior packaging case is not likely to adhere to the IDT electrode. Thus, property defects caused by the adhesion of a metal powder are suppressed, and a Lamb wave device having superior environmental resistance and/or humidity resistance is provided.
- FIG. 1 is a schematic front cross-sectional view of a Lamb wave device according to a preferred embodiment of the present invention.
- FIG. 2 is a view showing an XRD spectrum of a LiNbO 3 thin film provided on a ZnO epitaxial film.
- FIG. 3A is a view showing the result, which is obtained by actual measurement, of the change in impedance with the acoustic velocity when a LiNbO 3 thin film of a Lamb wave device of a preferred embodiment has a twin crystal structure.
- FIG. 3B is a view showing the result, which is obtained by simulation, of the change in impedance with the acoustic velocity when a LiNbO 3 thin film of a Lamb wave device of a preferred embodiment has a twin crystal structure.
- FIG. 3C is a view showing the relationship between the impedance and the acoustic velocity, which is obtained by simulation when a LiNbO 3 thin film has a single crystal structure.
- FIG. 4 is a view showing the change in electromechanical coupling coefficient K 2 with h/d of each mode in which in a Lamb wave device of a preferred embodiment of the present invention, an IDT electrode is provided on a LiNbO 3 thin film using Al, and the ratio d/ ⁇ is set to about 0.10.
- FIG. 5 is a view showing the change in electromechanical coupling coefficient K 2 of each mode of a Lamb wave when h/d is set to about 0.24, and the ratio d/ ⁇ is changed in the range of about 0.08 to about 0.3.
- FIG. 6 is a view showing the change in electromechanical coupling coefficient K 2 with h/d of each mode in which in a Lamb wave device of a preferred embodiment of the present invention, the IDT electrode is provided on a LiTaO 3 thin film using Al, and the ratio d/ ⁇ is set to about 0.10.
- FIG. 7 is a view showing the change in electromechanical coupling coefficient K 2 with d/ ⁇ of each mode in which in a Lamb wave device of a preferred embodiment of the present invention, the IDT electrode is provided on a LiTaO 3 thin film using Al, and the ratio h/d of the thickness d of the electrode to the wavelength ⁇ is set to about 0.26.
- FIG. 1 is a schematic front cross-sectional view illustrating a Lamb wave device according to a preferred embodiment of the present invention.
- a Lamb wave device 1 includes a base substrate 2 and a piezoelectric thin film 3 provided thereon.
- the piezoelectric thin film 3 is disposed on an upper surface 2 a of the base substrate 2 .
- a floating portion of the piezoelectric thin film 3 is provided above the upper surface 2 a of the base substrate 2 with a gap interposed therebetween.
- a first surface 3 a of the piezoelectric thin film 3 faces the upper surface 2 a of the base substrate 2 with the gap interposed therebetween, and an IDT electrode 4 is disposed on a second surface 3 b which is an outer surface and which is a surface opposite to the first surface 3 a .
- the IDT electrode 4 is provided to define a desired resonator or filter.
- the base substrate 2 is preferably made of a LiNbO 3 single crystal substrate.
- the piezoelectric thin film 3 is made of a LiNbO 3 thin film, the c-axis of the piezoelectric thin film 3 is set in approximately the same direction as that of a perpendicular line to the first and the second surfaces 3 a and 3 b of the piezoelectric thin film 3 , and the crystal structure of the piezoelectric thin film 3 is a rotation twin crystal having the c-axis functioning as the rotation axis.
- a ZnO epitaxial film used as an underlying layer is formed so that the c-axis is in a direction substantially perpendicular to the upper surface 2 a of the base substrate 2 .
- a material forming the base substrate 2 is not limited to the above-described material as long as an epitaxial film can be formed thereon so that the c-axis is in a direction substantially perpendicular to the upper surface 2 a of the base substrate 2 .
- the base substrate 2 may be formed of another piezoelectric single crystal, such as a LiTaO 3 single crystal or sapphire.
- the piezoelectric thin film 3 is formed.
- the piezoelectric thin film 3 is made of a LiNbO 3 thin film in this preferred embodiment.
- a LiTaO 3 thin film may also be used instead of the LiNbO 3 thin film.
- the piezoelectric thin film 3 is formed on the ZnO epitaxial film thus formed as an underlying layer, the c-axis of the piezoelectric thin film 3 is in a direction substantially perpendicular to the upper surface 2 a of the base substrate 2 , and the piezoelectric thin film 3 formed of LiNbO 3 is a twin epitaxial film.
- a LiNbO 3 single crystal or a LiTaO 3 single crystal naturally has 3-fold rotational symmetry around the c-axis.
- the results shown in FIG. 2 were obtained. That is, as apparent from an XRD spectrum shown in FIG. 2 , it was confirmed that an actually formed LiNbO 3 thin film has 6-fold rotation symmetry.
- the LiNbO 3 film thus formed is a rotation twin epitaxial film.
- LiNbO 3 or LiTaO 3 formed thereon has two orientation directions.
- a material used as an underlayer is not limited to ZnO, and a metal epitaxial film, such as Cu or Pt, may also be used.
- etching holes are formed in the LiNbO 3 thin film or LiTaO 3 thin film.
- a dry process such as Ar ion milling or reactive ion etching
- the IDT electrode 4 is formed.
- the ZnO epitaxial film used as an underlying layer is removed by etching using an acid, and as a result, a space A shown in FIG. 1 is formed.
- the Lamb wave device 1 of this preferred embodiment is obtained as described above.
- the relationship between the acoustic velocity and the impedance of a resonator of the LiNbO 3 thin film of the Lamb wave device 1 was measured. The results are shown in FIG. 3A .
- FIG. 3B shows the results, obtained by simulation, of the relationship between the acoustic velocity and the impedance of the LiNbO 3 thin film of the Lamb wave device 1 , which were obtained by simulation using a finite element method.
- FIG. 3C is a view showing the relationship between the acoustic velocity and the impedance of the structure of a comparative example having the same configuration as described above except that a LiNbO 3 thin film of the Lamb wave device 1 does not have a twin crystal structure but is a single crystal, which is obtained by simulation.
- the piezoelectric thin film 3 has a twin crystal structure, it is found that undesired spurious responses are effectively suppressed.
- the results shown in FIGS. 3B and 3C were obtained by a finite element method.
- the thickness of the LiNbO 3 thin film is set to about 0.155 ⁇
- the IDT electrode 4 was formed of Al
- the thickness thereof is set to about 0.03 ⁇
- the duty ratio is set to about 0.47.
- the piezoelectric thin film portion was equally divided into about 80 regions with respect to the elastic wave propagation direction, an Euler angle (0°, 0°, ⁇ 0 ) portion and an Euler angle (0°, 0°, ⁇ 0 +180°) portion were alternately arranged, and ⁇ 0 is set to about 15°. In any propagation direction, the same results can be obtained as those obtained with respect to ⁇ 0 .
- FIGS. 3A to 3C show the results when the piezoelectric thin film 3 was a LiNbO 3 thin film, when a LiTaO 3 thin film was used, similar results to those described above could be obtained.
- FIGS. 4 and 5 show the electromechanical coupling coefficient of a Lamb wave.
- h indicates the thickness of the IDT electrode
- d indicates the thickness of the piezoelectric thin film
- X indicates the wavelength of a Lamb wave.
- FIG. 4 shows the change in electromechanical coupling coefficient of each mode of the Lamb wave with the change in h/d when d/ ⁇ is set to about 0.1. As shown in FIG.
- the mode of the Lamb wave is defined by Xn(i). That is, X indicates the type of mode, for example, A indicates the asymmetric mode, and S indicates the symmetric mode.
- X indicates the type of mode, for example, A indicates the asymmetric mode, and S indicates the symmetric mode.
- n is an integer of 0 or more and indicates the order of the mode, that is, the number of nodes of the maximum displacement component in the thickness direction of the piezoelectric thin film.
- “i” is an integer of 1 or more and indicates the number of nodes of the maximum displacement component in a half-wavelength region in the propagation direction of the Lamb wave. In particular, when “i” is 1, the notation of (i) is omitted.
- FIG. 5 is a view showing the change in electromechanical coupling coefficient K 2 of each mode of the Lamb wave when h/d was fixed at about 0.24 and d/ ⁇ was changed in the range of about 0.08 to about 0.3.
- the electromechanical coupling coefficient K 2 of the A1 mode which is the main mode, decreases, and the electromechanical coupling coefficients K 2 of the other modes increase.
- These ranges of d/ ⁇ as described above are not suitable for filters.
- the electromechanical coupling coefficient of a Lamb wave was obtained when the thickness of the IDT electrode 4 and that of the piezoelectric thin film 3 were variously changed.
- the results are shown in FIGS. 6 and 7 . Similar to FIGS. 4 and 5 , in FIGS. 6 and 7 , h indicates the thickness of the IDT electrode, d indicates the thickness of the piezoelectric thin film, and ⁇ indicates the wavelength of the Lamb wave.
- a finite element method was used for the calculation.
- FIG. 6 shows the change in electromechanical coupling coefficient of each mode of the Lamb wave with the change in h/d when d/ ⁇ is set to about 0.1. As shown in FIG. 6 , it was found that when h/d exceeds approximately about 0.26, the electromechanical coupling coefficient K 2 of the A1 mode, which is the main mode, decreases, and the electromechanical coupling coefficients K 2 of the other modes increase.
- FIG. 7 is a view showing the change in electromechanical coupling coefficient K 2 of each mode of the Lamb wave when h/d was fixed at about 0.26 and d/ ⁇ was changed in the range of about 0.08 to about 0.3.
- the electromechanical coupling coefficient K 2 of the A1 mode which is the main mode, decreases, and the electromechanical coupling coefficients K 2 of the other modes increase.
- the IDT electrode 4 is provided on the second surface 3 b of the piezoelectric thin film 3 .
- the IDT electrode 4 since the IDT electrode 4 is provided on the upper surface of the piezoelectric thin film 3 , that is, on the surface exposed to the outside, the IDT electrode 4 can be easily formed. Thus, an inexpensive Lamb wave device 1 can be produced.
- the IDT electrode 4 may be provided on the first surface 3 a of the piezoelectric thin film 3 , that is, on the inside surface facing the base substrate 2 .
- the IDT electrode 4 is provided on the first surface 3 a , which is the inside surface facing the space A, even when a metal powder separated from a metal exterior packaging case falls, short-circuiting and/or property defects are not likely to occur.
- a Lamb wave device which is not likely to be varied by adhesion of a metal powder and which has superior environmental resistance, such as humidity resistance, can be provided.
- the twin crystal is defined as one solid in which at least two single crystals of one substance are bonded to each other in accordance with a specific symmetric relationship.
- the rotation twin crystal having the c-axis that functions as the rotation axis is defined as a twin crystal having a symmetric relationship which can be represented such that, when individual single crystals, that is, constituent elements, are represented by Euler angles, the Euler angles rotate to each other around the c axis.
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Abstract
Description
0.01≦h/d≦0.24 and 0.090≦d/λ≦0.107 I
0.01≦h/d≦0.24 and 0.133≦d/λ≦0.233 II
0.01≦h/d≦0.24 and 0.257≦d/λ≦0.300 III
0.01≦h/d≦0.26 and 0.093≦d/λ≦0.125 IV
0.01≦h/d≦0.26 and 0.141≦d/λ≦0.240 V
0.01≦h/d≦0.26 and 0.260≦d/λ≦0.300 VI
0.090≦d/λ≦0.107 I
0.133≦d/λ≦0.233 II
0.257≦d/λ≦0.300, III
the electromechanical coupling coefficient of the modes other than the A1 mode, which is the main mode, can be sufficiently suppressed, and as a result, the generation of spurious responses is suppressed, so that a Lamb wave device having desirable properties is provided. In addition, instead of Al used as a material for the IDT electrode, the same results as described above can be obtained when an alloy including Al as a primary component is used. When h/d is less than about 0.01, due to the actual loss in an electric current concomitant with an increase in an electrical resistance of the electrode, the insertion loss is degraded. Thus, h/d is preferably at least about 0.01.
0.093≦d/λ≦0.125 IV
0.141≦d/λ≦0.240 V
0.260≦d/λ≦0.300, VI
the electromechanical coupling coefficient of the modes other than the A1 mode, which is the main mode, can be sufficiently suppressed, and as a result, the generation of spurious responses is suppressed, so that a Lamb wave device having desirable properties is provided. In addition, instead of Al used as a material for the IDT electrode, the same results as described above can be obtained when an alloy including Al as a primary component is used. When h/d is less than about 0.01, due to the actual loss in an electric current concomitant with an increase in an electrical resistance of the electrode, the insertion loss is degraded. Thus, h/d is preferably at least about 0.01.
Claims (5)
0.01≦h/d≦0.24 and 0.090≦d/λ≦0.107 I
0.01≦h/d≦0 24 and 0.133≦d/λ≦0233 II
0.01≦h/d≦0.24 and 0.257≦d/λ≦0.300. III
0.01≦h/d≦0.26 and 0.093≦d/λ≦0.125 IV
0.01≦h/d≦0.26 and 0.141≦d/λ≦0.240 V
0.01≦h/d≦0.26 and 0.260≦d/λ≦0.300. VI
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PCT/JP2006/319852 WO2007046236A1 (en) | 2005-10-19 | 2006-10-04 | Lamb wave device |
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PCT/JP2006/319852 Continuation WO2007046236A1 (en) | 2005-10-19 | 2006-10-04 | Lamb wave device |
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EP (1) | EP1947765B1 (en) |
JP (1) | JP4613960B2 (en) |
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US20090102316A1 (en) * | 2007-10-22 | 2009-04-23 | Stmicroelectronics Sa | Lamb wave resonator |
US20100123367A1 (en) * | 2008-11-19 | 2010-05-20 | Ngk Insulators, Ltd. | Lamb wave device |
US20100181868A1 (en) * | 2008-12-17 | 2010-07-22 | Sand9, Inc. | Multi-port mechanical resonating devices and related methods |
US20100327995A1 (en) * | 2009-06-30 | 2010-12-30 | Commissariat a L'Energie Atomique at aux Energies Alternatives | Guided Acoustic Wave Resonant Device and Method for Producing the Device |
US20110148531A1 (en) * | 2009-12-23 | 2011-06-23 | Sand9, Inc. | Oscillators having arbitrary frequencies and related systems and methods |
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US9651376B2 (en) | 2010-03-01 | 2017-05-16 | Analog Devices, Inc. | Microelectromechanical gyroscopes and related apparatus and methods |
US10032976B2 (en) | 2010-04-20 | 2018-07-24 | Analog Devices, Inc. | Microelectromechanical gyroscopes and related apparatus and methods |
US10491192B1 (en) | 2018-06-15 | 2019-11-26 | Resonant Inc. | Transversely-excited film bulk acoustic resonator |
US10601392B2 (en) | 2018-06-15 | 2020-03-24 | Resonant Inc. | Solidly-mounted transversely-excited film bulk acoustic resonator |
US10637438B2 (en) | 2018-06-15 | 2020-04-28 | Resonant Inc. | Transversely-excited film bulk acoustic resonators for high power applications |
US10756697B2 (en) | 2018-06-15 | 2020-08-25 | Resonant Inc. | Transversely-excited film bulk acoustic resonator |
US10784833B2 (en) | 2017-04-04 | 2020-09-22 | Vanguard International Semiconductor Singapore Pte. Ltd. | Lamb acoustic wave resonator and filter with self-aligned cavity via |
US10790802B2 (en) | 2018-06-15 | 2020-09-29 | Resonant Inc. | Transversely excited film bulk acoustic resonator using rotated Y-X cut lithium niobate |
US10797675B2 (en) | 2018-06-15 | 2020-10-06 | Resonant Inc. | Transversely excited film bulk acoustic resonator using rotated z-cut lithium niobate |
US10800649B2 (en) | 2016-11-28 | 2020-10-13 | Analog Devices International Unlimited Company | Planar processing of suspended microelectromechanical systems (MEMS) devices |
US10819309B1 (en) | 2019-04-05 | 2020-10-27 | Resonant Inc. | Transversely-excited film bulk acoustic resonator package and method |
US10826462B2 (en) | 2018-06-15 | 2020-11-03 | Resonant Inc. | Transversely-excited film bulk acoustic resonators with molybdenum conductors |
US10843920B2 (en) | 2019-03-08 | 2020-11-24 | Analog Devices International Unlimited Company | Suspended microelectromechanical system (MEMS) devices |
US10868513B2 (en) | 2018-06-15 | 2020-12-15 | Resonant Inc. | Transversely-excited film bulk acoustic filters with symmetric layout |
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US11482981B2 (en) | 2020-07-09 | 2022-10-25 | Resonanat Inc. | Transversely-excited film bulk acoustic resonators with piezoelectric diaphragm supported by piezoelectric substrate |
US11496113B2 (en) | 2020-11-13 | 2022-11-08 | Resonant Inc. | XBAR devices with excess piezoelectric material removed |
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US12081187B2 (en) | 2018-06-15 | 2024-09-03 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator |
US12088281B2 (en) | 2021-02-03 | 2024-09-10 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator with multi-mark interdigital transducer |
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US12113510B2 (en) | 2021-02-03 | 2024-10-08 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonators with multiple piezoelectric membrane thicknesses on the same chip |
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US12126316B2 (en) | 2021-04-16 | 2024-10-22 | Murata Manufacturing Co., Ltd | Transversely-excited film bulk acoustic resonator |
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Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4315174B2 (en) | 2006-02-16 | 2009-08-19 | セイコーエプソン株式会社 | Manufacturing method of lamb wave type high frequency device |
GB0723526D0 (en) * | 2007-12-03 | 2008-01-09 | Airbus Uk Ltd | Acoustic transducer |
WO2010004741A1 (en) * | 2008-07-11 | 2010-01-14 | パナソニック株式会社 | Plate wave element and electronic equipment using same |
JP2010088109A (en) | 2008-09-05 | 2010-04-15 | Panasonic Corp | Acoustic wave element, and electronic equipment using the same |
JP5367612B2 (en) * | 2009-02-17 | 2013-12-11 | 日本碍子株式会社 | Lamb wave device |
WO2012086441A1 (en) * | 2010-12-24 | 2012-06-28 | 株式会社村田製作所 | Elastic wave device and production method thereof |
WO2013021948A1 (en) * | 2011-08-08 | 2013-02-14 | 株式会社村田製作所 | Elastic wave device |
DE112013002520B4 (en) * | 2012-05-15 | 2017-08-17 | Murata Manufacturing Co., Ltd. | Component for elastic waves |
CN103308609B (en) * | 2013-06-26 | 2015-05-20 | 哈尔滨工业大学 | Lamb wave mode control method based on electromagnetic ultrasonic emission transducer |
CN105337586B (en) * | 2015-12-03 | 2018-04-17 | 天津大学 | Lamb wave resonator |
JP6662490B2 (en) * | 2017-04-26 | 2020-03-11 | 株式会社村田製作所 | Elastic wave device |
JP7073392B2 (en) * | 2017-10-23 | 2022-05-23 | 京セラ株式会社 | Elastic wave element |
CN115552794A (en) * | 2020-04-29 | 2022-12-30 | 株式会社村田制作所 | Transverse excited film bulk acoustic resonator with controllable conductor side wall angle |
JPWO2023234383A1 (en) * | 2022-06-01 | 2023-12-07 | ||
WO2024178667A1 (en) * | 2023-03-01 | 2024-09-06 | 中国科学技术大学 | Lamb-wave resonator and manufacturing method therefor |
WO2024190677A1 (en) * | 2023-03-15 | 2024-09-19 | 京セラ株式会社 | Elastic wave resonator and communication device |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH036912A (en) | 1989-06-02 | 1991-01-14 | Fujitsu Ltd | Surface acoustic wave element |
JP2002152007A (en) | 2000-11-15 | 2002-05-24 | Hitachi Ltd | Lamb wave type elastic wave resonator |
JP2003017969A (en) | 2001-06-27 | 2003-01-17 | Takaya Watanabe | Surface acoustic wave device |
JP2003309447A (en) | 2002-02-12 | 2003-10-31 | Seiko Epson Corp | Surface acoustic wave device |
JP2004072204A (en) | 2002-08-02 | 2004-03-04 | Hitachi Ltd | High frequency acoustic wave device using aluminum nitride piezoelectric thin film |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5003822A (en) * | 1989-10-02 | 1991-04-02 | Joshi Shrinivas G | Acoustic wave microsensors for measuring fluid flow |
JP2983252B2 (en) * | 1990-05-14 | 1999-11-29 | 株式会社東芝 | Piezoelectric thin film device |
CN1382979A (en) * | 2001-04-20 | 2002-12-04 | 中国科学院长春光学精密机械与物理研究所 | Laminated electrostatic lamb wave miniature sensor |
-
2006
- 2006-10-04 KR KR20087008990A patent/KR100904368B1/en active IP Right Grant
- 2006-10-04 JP JP2007540914A patent/JP4613960B2/en active Active
- 2006-10-04 CN CN2006800392745A patent/CN101292423B/en active Active
- 2006-10-04 EP EP20060811192 patent/EP1947765B1/en active Active
- 2006-10-04 WO PCT/JP2006/319852 patent/WO2007046236A1/en active Application Filing
-
2008
- 2008-04-09 US US12/099,839 patent/US7535152B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH036912A (en) | 1989-06-02 | 1991-01-14 | Fujitsu Ltd | Surface acoustic wave element |
JP2002152007A (en) | 2000-11-15 | 2002-05-24 | Hitachi Ltd | Lamb wave type elastic wave resonator |
JP2003017969A (en) | 2001-06-27 | 2003-01-17 | Takaya Watanabe | Surface acoustic wave device |
JP2003309447A (en) | 2002-02-12 | 2003-10-31 | Seiko Epson Corp | Surface acoustic wave device |
JP2004072204A (en) | 2002-08-02 | 2004-03-04 | Hitachi Ltd | High frequency acoustic wave device using aluminum nitride piezoelectric thin film |
Non-Patent Citations (2)
Title |
---|
Mizutani et al., "Analysis of Lamb Wave Propagation Characteristics in Rotated Y-Cut X-Propagation LiNbO3 Plates" vol. J68 A, No. 5. pp. 496 503, May 1985. |
Official communication issued in counterpart International Application No. PCT/JP2006/319852, mailed on Jan. 23, 2007. |
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US20090102316A1 (en) * | 2007-10-22 | 2009-04-23 | Stmicroelectronics Sa | Lamb wave resonator |
US20100123367A1 (en) * | 2008-11-19 | 2010-05-20 | Ngk Insulators, Ltd. | Lamb wave device |
US7965015B2 (en) | 2008-11-19 | 2011-06-21 | Ngk Insulators, Ltd. | Lamb wave device |
US8937425B2 (en) | 2008-12-17 | 2015-01-20 | Sand 9, Inc. | Mechanical resonating structures including a temperature compensation structure |
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US9762202B2 (en) | 2008-12-17 | 2017-09-12 | Analog Devices, Inc. | Method of manufacturing a mechanical resonating structure |
US9602074B2 (en) | 2008-12-17 | 2017-03-21 | Analog Devices, Inc. | Mechanical resonating structures including a temperature compensation structure |
US8686614B2 (en) * | 2008-12-17 | 2014-04-01 | Sand 9, Inc. | Multi-port mechanical resonating devices and related methods |
US8362675B2 (en) | 2008-12-17 | 2013-01-29 | Sand 9, Inc. | Mechanical resonating structures including a temperature compensation structure |
US8689426B2 (en) | 2008-12-17 | 2014-04-08 | Sand 9, Inc. | Method of manufacturing a resonating structure |
US8629599B2 (en) | 2008-12-17 | 2014-01-14 | Sand 9, Inc. | Mechanical resonating structures including a temperature compensation structure |
US20100327995A1 (en) * | 2009-06-30 | 2010-12-30 | Commissariat a L'Energie Atomique at aux Energies Alternatives | Guided Acoustic Wave Resonant Device and Method for Producing the Device |
US8692630B2 (en) * | 2009-06-30 | 2014-04-08 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Guided acoustic wave resonant device and method for producing the device |
US20110181366A1 (en) * | 2009-12-23 | 2011-07-28 | Sand9, Inc. | Oscillators having arbitrary frequencies and related systems and methods |
US20110151856A1 (en) * | 2009-12-23 | 2011-06-23 | Sand9, Inc. | Oscillators having arbitrary frequencies and related systems and methods |
US20110148531A1 (en) * | 2009-12-23 | 2011-06-23 | Sand9, Inc. | Oscillators having arbitrary frequencies and related systems and methods |
US8704604B2 (en) | 2009-12-23 | 2014-04-22 | Sand 9, Inc. | Oscillators having arbitrary frequencies and related systems and methods |
US8736388B2 (en) | 2009-12-23 | 2014-05-27 | Sand 9, Inc. | Oscillators having arbitrary frequencies and related systems and methods |
US8228127B2 (en) | 2009-12-23 | 2012-07-24 | Sand 9, Inc. | Oscillators having arbitrary frequencies and related systems and methods |
US9013245B2 (en) | 2009-12-23 | 2015-04-21 | Sand 9, Inc. | Oscillators having arbitrary frequencies and related systems and methods |
US8604888B2 (en) | 2009-12-23 | 2013-12-10 | Sand 9, Inc. | Oscillators having arbitrary frequencies and related systems and methods |
US9651376B2 (en) | 2010-03-01 | 2017-05-16 | Analog Devices, Inc. | Microelectromechanical gyroscopes and related apparatus and methods |
US10032976B2 (en) | 2010-04-20 | 2018-07-24 | Analog Devices, Inc. | Microelectromechanical gyroscopes and related apparatus and methods |
US9075077B2 (en) | 2010-09-20 | 2015-07-07 | Analog Devices, Inc. | Resonant sensing using extensional modes of a plate |
US9172351B2 (en) | 2010-11-08 | 2015-10-27 | Agency For Science, Technology And Research | Piezoelectric resonator having electrode fingers with electrode patches |
US9383208B2 (en) | 2011-10-13 | 2016-07-05 | Analog Devices, Inc. | Electromechanical magnetometer and applications thereof |
US9112134B2 (en) * | 2012-03-07 | 2015-08-18 | Taiyo Yuden Co., Ltd. | Resonator, frequency filter, duplexer, electronic device, and method of manufacturing resonator |
US20130234805A1 (en) * | 2012-03-07 | 2013-09-12 | Taiyo Yuden Co., Ltd. | Resonator, frequency filter, duplexer, electronic device, and method of manufacturing resonator |
US10800649B2 (en) | 2016-11-28 | 2020-10-13 | Analog Devices International Unlimited Company | Planar processing of suspended microelectromechanical systems (MEMS) devices |
US10784833B2 (en) | 2017-04-04 | 2020-09-22 | Vanguard International Semiconductor Singapore Pte. Ltd. | Lamb acoustic wave resonator and filter with self-aligned cavity via |
US11929731B2 (en) | 2018-02-18 | 2024-03-12 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator with optimized electrode mark, and pitch |
US11881834B2 (en) | 2018-06-15 | 2024-01-23 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator with reduced spurious modes |
US12095446B2 (en) | 2018-06-15 | 2024-09-17 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator with optimized electrode thickness, mark, and pitch |
US10790802B2 (en) | 2018-06-15 | 2020-09-29 | Resonant Inc. | Transversely excited film bulk acoustic resonator using rotated Y-X cut lithium niobate |
US10797675B2 (en) | 2018-06-15 | 2020-10-06 | Resonant Inc. | Transversely excited film bulk acoustic resonator using rotated z-cut lithium niobate |
US10637438B2 (en) | 2018-06-15 | 2020-04-28 | Resonant Inc. | Transversely-excited film bulk acoustic resonators for high power applications |
US12244299B2 (en) | 2018-06-15 | 2025-03-04 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator with periodic etched holes |
US10826462B2 (en) | 2018-06-15 | 2020-11-03 | Resonant Inc. | Transversely-excited film bulk acoustic resonators with molybdenum conductors |
US12244295B2 (en) | 2018-06-15 | 2025-03-04 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonators with two-layer electrodes having a narrower top layer |
US10868513B2 (en) | 2018-06-15 | 2020-12-15 | Resonant Inc. | Transversely-excited film bulk acoustic filters with symmetric layout |
US10868512B2 (en) | 2018-06-15 | 2020-12-15 | Resonant Inc. | High power transversely-excited film bulk acoustic resonators on Z-cut lithium niobate |
US10868510B2 (en) | 2018-06-15 | 2020-12-15 | Resonant Inc. | Transversely-excited film bulk acoustic resonator with half-lambda dielectric layer |
US10911023B2 (en) | 2018-06-15 | 2021-02-02 | Resonant Inc. | Transversely-excited film bulk acoustic resonator with etch-stop layer |
US10911017B2 (en) | 2018-06-15 | 2021-02-02 | Resonant Inc. | Solidly mounted transversely excited film bulk acoustic resonator using rotated Z-cut lithium niobate |
US12237827B2 (en) | 2018-06-15 | 2025-02-25 | Murata Manufacturing Co., Ltd. | Solidly-mounted transversely-excited film bulk acoustic filters with multiple piezoelectric plate thicknesses |
US10917070B2 (en) | 2018-06-15 | 2021-02-09 | Resonant Inc. | Bandpass filter with frequency separation between shunt and series resonators set by dielectric layer thickness |
US12237826B2 (en) | 2018-06-15 | 2025-02-25 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator with optimized electrode thickness, mark, and pitch |
US10985730B2 (en) | 2018-06-15 | 2021-04-20 | Resonant Inc. | Filter devices having high power transversely-excited film bulk acoustic resonators |
US10985728B2 (en) | 2018-06-15 | 2021-04-20 | Resonant Inc. | Transversely-excited film bulk acoustic resonator and filter with a uniform-thickness dielectric overlayer |
US10985726B2 (en) | 2018-06-15 | 2021-04-20 | Resonant Inc. | Transversely excited film bulk acoustic resonator with recessed interdigital transducer fingers |
US10992284B2 (en) | 2018-06-15 | 2021-04-27 | Resonant Inc. | Filter using transversely-excited film bulk acoustic resonators with multiple frequency setting layers |
US12231113B2 (en) | 2018-06-15 | 2025-02-18 | Murata Manufacturing Co., Ltd. | Rotation in XY plane to suppress spurious modes in XBAR devices |
US10992283B2 (en) | 2018-06-15 | 2021-04-27 | Resonant Inc. | High power transversely-excited film bulk acoustic resonators on rotated Z-cut lithium niobate |
US10998877B2 (en) | 2018-06-15 | 2021-05-04 | Resonant Inc. | Film bulk acoustic resonator fabrication method with frequency trimming based on electric measurements prior to cavity etch |
US10998882B2 (en) | 2018-06-15 | 2021-05-04 | Resonant Inc. | XBAR resonators with non-rectangular diaphragms |
US12224732B2 (en) | 2018-06-15 | 2025-02-11 | Murata Manufacturing Co., Ltd. | Solidly-mounted transversely-excited film bulk acoustic resonators and filters for 27 GHz communications bands |
US11114996B2 (en) | 2018-06-15 | 2021-09-07 | Resonant Inc. | Transversely-excited film bulk acoustic resonators with molybdenum conductors |
US11114998B2 (en) | 2018-06-15 | 2021-09-07 | Resonant Inc. | Transversely-excited film bulk acoustic resonators for high power applications |
US11139794B2 (en) | 2018-06-15 | 2021-10-05 | Resonant Inc. | Transversely-excited film bulk acoustic resonator |
US11146232B2 (en) | 2018-06-15 | 2021-10-12 | Resonant Inc. | Transversely-excited film bulk acoustic resonator with reduced spurious modes |
US11146244B2 (en) | 2018-06-15 | 2021-10-12 | Resonant Inc. | Solidly-mounted transversely excited film bulk acoustic resonator using rotated Y-X cut lithium niobate |
US11146231B2 (en) | 2018-06-15 | 2021-10-12 | Resonant Inc. | Solidly-mounted transversely-excited film bulk acoustic resonator with recessed interdigital transducer fingers |
US11146238B2 (en) | 2018-06-15 | 2021-10-12 | Resonant Inc. | Film bulk acoustic resonator fabrication method |
US11165407B2 (en) | 2018-06-15 | 2021-11-02 | Resonant Inc. | Solidly-mounted transversely-excited film bulk acoustic resonator |
US11171629B2 (en) | 2018-06-15 | 2021-11-09 | Resonant Inc. | Transversely-excited film bulk acoustic resonator using pre-formed cavities |
US11201601B2 (en) | 2018-06-15 | 2021-12-14 | Resonant Inc. | Transversely-excited film bulk acoustic resonator with multiple diaphragm thicknesses and fabrication method |
US12218650B2 (en) | 2018-06-15 | 2025-02-04 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator |
US11228296B2 (en) | 2018-06-15 | 2022-01-18 | Resonant Inc. | Transversely-excited film bulk acoustic resonator with a cavity having a curved perimeter |
US12212306B2 (en) | 2018-06-15 | 2025-01-28 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator with multiple diaphragm thicknesses and fabrication method |
US11239822B2 (en) | 2018-06-15 | 2022-02-01 | Resonant Inc. | Transversely-excited film bulk acoustic resonator using YX-cut lithium niobate for high power applications |
US12191837B2 (en) | 2018-06-15 | 2025-01-07 | Murata Manufacturing Co., Ltd. | Solidly-mounted transversely-excited film bulk acoustic device |
US11264966B2 (en) | 2018-06-15 | 2022-03-01 | Resonant Inc. | Solidly-mounted transversely-excited film bulk acoustic resonator with diamond layers in Bragg reflector stack |
US12191838B2 (en) | 2018-06-15 | 2025-01-07 | Murata Manufacturing Co., Ltd. | Solidly-mounted transversely-excited film bulk acoustic device and method |
US12184261B2 (en) | 2018-06-15 | 2024-12-31 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator with a cavity having round end zones |
US12176878B2 (en) | 2018-06-15 | 2024-12-24 | Murata Manufacturing Co., Ltd. | Solidly-mounted transversely-excited film bulk acoustic resonator with recessed interdigital transducer fingers |
US12170516B2 (en) | 2018-06-15 | 2024-12-17 | Murata Manufacturing Co., Ltd. | Filters using transversly-excited film bulk acoustic resonators with frequency-setting dielectric layers |
US11323089B2 (en) | 2018-06-15 | 2022-05-03 | Resonant Inc. | Filter using piezoelectric film bonded to high resistivity silicon substrate with trap-rich layer |
US11323095B2 (en) | 2018-06-15 | 2022-05-03 | Resonant Inc. | Rotation in XY plane to suppress spurious modes in XBAR devices |
US11323091B2 (en) | 2018-06-15 | 2022-05-03 | Resonant Inc. | Transversely-excited film bulk acoustic resonator with diaphragm support pedestals |
US11323090B2 (en) | 2018-06-15 | 2022-05-03 | Resonant Inc. | Transversely-excited film bulk acoustic resonator using Y-X-cut lithium niobate for high power applications |
US11323096B2 (en) | 2018-06-15 | 2022-05-03 | Resonant Inc. | Transversely-excited film bulk acoustic resonator with periodic etched holes |
US12160225B2 (en) | 2018-06-15 | 2024-12-03 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator package |
US11349450B2 (en) | 2018-06-15 | 2022-05-31 | Resonant Inc. | Symmetric transversely-excited film bulk acoustic resonators with reduced spurious modes |
US11349452B2 (en) | 2018-06-15 | 2022-05-31 | Resonant Inc. | Transversely-excited film bulk acoustic filters with symmetric layout |
US12149227B2 (en) | 2018-06-15 | 2024-11-19 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator package |
US12149229B2 (en) | 2018-06-15 | 2024-11-19 | Murata Manufacturing Co., Ltd. | Filter using transversely-excited film bulk acoustic resonators with two frequency setting layers |
US11374549B2 (en) | 2018-06-15 | 2022-06-28 | Resonant Inc. | Filter using transversely-excited film bulk acoustic resonators with divided frequency-setting dielectric layers |
US12143092B2 (en) | 2018-06-15 | 2024-11-12 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonators and filters with trap-rich layer |
US12119805B2 (en) | 2018-06-15 | 2024-10-15 | Murata Manufacturing Co., Ltd. | Substrate processing and membrane release of transversely-excited film bulk acoustic resonator using a sacrificial tub |
US12119808B2 (en) | 2018-06-15 | 2024-10-15 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator package |
US12095445B2 (en) | 2018-06-15 | 2024-09-17 | Murata Manufacturing Co., Ltd. | High power acoustic resonators |
US10756697B2 (en) | 2018-06-15 | 2020-08-25 | Resonant Inc. | Transversely-excited film bulk acoustic resonator |
US12095448B2 (en) | 2018-06-15 | 2024-09-17 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator package and method |
US12088280B2 (en) | 2018-06-15 | 2024-09-10 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator package |
US12088272B2 (en) | 2018-06-15 | 2024-09-10 | Murata Manufacturing Co., Ltd. | Solidly-mounted transversely-excited film bulk acoustic resonator |
US12081187B2 (en) | 2018-06-15 | 2024-09-03 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator |
US12040781B2 (en) | 2018-06-15 | 2024-07-16 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator package |
US12040778B2 (en) | 2018-06-15 | 2024-07-16 | Murata Manufacturing Co., Ltd. | High frequency, high power film bulk acoustic resonators |
US12034428B2 (en) | 2018-06-15 | 2024-07-09 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic filter using pitch to establish frequency separation between resonators |
US12021502B2 (en) | 2018-06-15 | 2024-06-25 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator with multi-mark electrodes and optimized electrode thickness |
US11677375B2 (en) | 2018-06-15 | 2023-06-13 | Murata Manufacturing Co., Ltd. | Transversely excited film bulk acoustic resonator with recessed interdigital transducer fingers |
US11677376B2 (en) | 2018-06-15 | 2023-06-13 | Murata Manufacturing Co, Ltd. | Solidly-mounted transversely-excited film bulk acoustic resonator with recessed interdigital transducer fingers |
US11689185B2 (en) | 2018-06-15 | 2023-06-27 | Murata Manufacturing Co., Ltd. | Solidly-mounted transversely-excited film bulk acoustic resonator with recessed interdigital transducer fingers using rotated y-x cut lithium niobate |
US12021504B2 (en) | 2018-06-15 | 2024-06-25 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator with a front-side dielectric layer and optimized pitch and mark |
US12021503B2 (en) | 2018-06-15 | 2024-06-25 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator with optimized piezoelectric plate thickness and having multiple pitches and marks |
US11728785B2 (en) | 2018-06-15 | 2023-08-15 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator using pre-formed cavities |
US12009798B2 (en) | 2018-06-15 | 2024-06-11 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonators with electrodes having irregular hexagon cross-sectional shapes |
US11996822B2 (en) | 2018-06-15 | 2024-05-28 | Murata Manufacturing Co., Ltd. | Wide bandwidth time division duplex transceiver |
US11736086B2 (en) | 2018-06-15 | 2023-08-22 | Murata Manufacturing Co., Ltd. | Filter using transversely-excited film bulk acoustic resonators with divided frequency-setting dielectric layers |
US11996827B2 (en) | 2018-06-15 | 2024-05-28 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator with periodic etched holes |
US11990888B2 (en) | 2018-06-15 | 2024-05-21 | Murata Manufacturing Co., Ltd. | Resonator using YX-cut lithium niobate for high power applications |
US11984872B2 (en) | 2018-06-15 | 2024-05-14 | Murata Manufacturing Co., Ltd. | Film bulk acoustic resonator fabrication method |
US11984868B2 (en) | 2018-06-15 | 2024-05-14 | Murata Manufacturing Co., Ltd. | Filter using piezoelectric film bonded to high resistivity silicon substrate with trap-rich layer |
US11817840B2 (en) | 2018-06-15 | 2023-11-14 | Murata Manufacturing Co., Ltd. | XBAR resonators with non-rectangular diaphragms |
US11967945B2 (en) | 2018-06-15 | 2024-04-23 | Murata Manufacturing Co., Ltd. | Transversly-excited film bulk acoustic resonators and filters |
US11824520B2 (en) | 2018-06-15 | 2023-11-21 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator with optimized electrode thickness, mark, and pitch |
US11831289B2 (en) | 2018-06-15 | 2023-11-28 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator with reduced spurious modes |
US11967942B2 (en) | 2018-06-15 | 2024-04-23 | Murata Manufacturing Co., Ltd | Transversely-excited film bulk acoustic filters with symmetric layout |
US11949399B2 (en) | 2018-06-15 | 2024-04-02 | Murata Manufacturing Co., Ltd. | Solidly-mounted transversely-excited film bulk acoustic resonator with diamond layers in Bragg reflector stack |
US11942922B2 (en) | 2018-06-15 | 2024-03-26 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator with optimized electrode thickness, mark, and pitch |
US11870424B2 (en) | 2018-06-15 | 2024-01-09 | Murata Manufacturing Co., Ltd. | Filters using transversly-excited film bulk acoustic resonators with frequency-setting dielectric layers |
US11870423B2 (en) | 2018-06-15 | 2024-01-09 | Murata Manufacturing Co., Ltd. | Wide bandwidth temperature-compensated transversely-excited film bulk acoustic resonator |
US11876498B2 (en) | 2018-06-15 | 2024-01-16 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator with multiple diaphragm thicknesses and fabrication method |
US11936361B2 (en) | 2018-06-15 | 2024-03-19 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonators |
US10601392B2 (en) | 2018-06-15 | 2020-03-24 | Resonant Inc. | Solidly-mounted transversely-excited film bulk acoustic resonator |
US11929735B2 (en) | 2018-06-15 | 2024-03-12 | Murata Manufacturing Co., Ltd. | XBAR resonators with non-rectangular diaphragms |
US11888465B2 (en) | 2018-06-15 | 2024-01-30 | Murata Manufacturing Co., Ltd. | Bandpass filter with frequency separation between shunt and series resonators set by dielectric layer thickness |
US11888463B2 (en) | 2018-06-15 | 2024-01-30 | Murata Manufacturing Co., Ltd. | Multi-port filter using transversely-excited film bulk acoustic resonators |
US10491192B1 (en) | 2018-06-15 | 2019-11-26 | Resonant Inc. | Transversely-excited film bulk acoustic resonator |
US11929727B2 (en) | 2018-06-15 | 2024-03-12 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator with reduced spurious modes |
US11923821B2 (en) | 2018-06-15 | 2024-03-05 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator with reduced spurious modes |
US11901878B2 (en) | 2018-06-15 | 2024-02-13 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonators with two-layer electrodes with a wider top layer |
US11916540B2 (en) | 2018-06-15 | 2024-02-27 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator with periodic etched holes |
US11901874B2 (en) | 2018-06-15 | 2024-02-13 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator with half-lambda dielectric layer |
US11909381B2 (en) | 2018-06-15 | 2024-02-20 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonators with two-layer electrodes having a narrower top layer |
US10843920B2 (en) | 2019-03-08 | 2020-11-24 | Analog Devices International Unlimited Company | Suspended microelectromechanical system (MEMS) devices |
US11901873B2 (en) | 2019-03-14 | 2024-02-13 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator with partial BRAGG reflectors |
US12095437B2 (en) | 2019-04-05 | 2024-09-17 | Murata Manufacturing Co., Ltd. | Method of fabricating transversely-excited film bulk acoustic resonator |
US10819309B1 (en) | 2019-04-05 | 2020-10-27 | Resonant Inc. | Transversely-excited film bulk acoustic resonator package and method |
US12119798B2 (en) | 2019-04-05 | 2024-10-15 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator package and method |
US12095438B2 (en) | 2019-04-05 | 2024-09-17 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator package and method |
US12088270B2 (en) | 2019-04-05 | 2024-09-10 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator package and method |
US11955952B2 (en) | 2019-06-24 | 2024-04-09 | Murata Manufacturing Co., Ltd. | Solidly-mounted transversely-excited bulk acoustic resonator split ladder filter |
US11381221B2 (en) | 2019-06-24 | 2022-07-05 | Resonant Inc. | Transversely-excited bulk acoustic resonator split ladder filter |
US12113517B2 (en) | 2019-06-24 | 2024-10-08 | Murata Manufacturing Co., Ltd. | Transversely-excited bulk acoustic resonator split ladder filter |
US11705885B2 (en) | 2019-06-27 | 2023-07-18 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator with lateral etch stop |
US12034423B2 (en) | 2019-06-27 | 2024-07-09 | Murata Manufacturing Co., Ltd | XBAR frontside etch process using polysilicon sacrificial layer |
US12095444B2 (en) | 2019-06-27 | 2024-09-17 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator with lateral etch stop |
US10911021B2 (en) | 2019-06-27 | 2021-02-02 | Resonant Inc. | Transversely-excited film bulk acoustic resonator with lateral etch stop |
US11736090B2 (en) | 2019-07-18 | 2023-08-22 | Murata Manufacturing Co., Ltd. | Film bulk acoustic resonators in thin LN-LT layers |
US10944380B1 (en) | 2019-07-18 | 2021-03-09 | Resonant Inc. | Film bulk acoustic resonators in thin LN-LT layers |
US11716070B2 (en) | 2019-07-18 | 2023-08-01 | Murata Manufacturing Co., Ltd. | Film bulk acoustic sensors using thin LN-LT layer |
US11251775B2 (en) | 2019-07-18 | 2022-02-15 | Resonant Inc. | Film bulk acoustic resonators in thin LN-LT layers |
US12009804B2 (en) | 2019-08-28 | 2024-06-11 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator with interdigital transducer with varied mark and pitch |
US11949403B2 (en) | 2019-08-28 | 2024-04-02 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator with interdigital transducer with varied mark and pitch |
US11206009B2 (en) | 2019-08-28 | 2021-12-21 | Resonant Inc. | Transversely-excited film bulk acoustic resonator with interdigital transducer with varied mark and pitch |
US12081198B2 (en) | 2020-02-18 | 2024-09-03 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator with a back-side dielectric layer and an etch-stop layer |
US11967946B2 (en) | 2020-02-18 | 2024-04-23 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator with a bonding layer and an etch-stop layer |
US11996826B2 (en) | 2020-02-18 | 2024-05-28 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator with thermally conductive etch-stop layer |
US12028049B2 (en) | 2020-02-28 | 2024-07-02 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator filters with sub-resonators having different mark and pitch |
US11418167B2 (en) | 2020-02-28 | 2022-08-16 | Resonant, Inc. | Transversely-excited film bulk acoustic resonator with multi-pitch interdigital transducer |
CN113328721A (en) * | 2020-02-28 | 2021-08-31 | 谐振公司 | Transverse-excitation film bulk acoustic resonator with multi-pitch interdigital transducer |
US12255625B2 (en) | 2020-02-28 | 2025-03-18 | Murata Manufacturing Co., Ltd. | Filter using transversely-excited film bulk acoustic resonators with inductively coupled sub-resonators |
US11916539B2 (en) | 2020-02-28 | 2024-02-27 | Murata Manufacturing Co., Ltd. | Split-ladder band N77 filter using transversely-excited film bulk acoustic resonators |
US11368139B2 (en) | 2020-04-20 | 2022-06-21 | Resonant Inc. | Small transversely-excited film bulk acoustic resonators with enhanced Q-factor |
US12040783B2 (en) | 2020-04-20 | 2024-07-16 | Murata Manufacturing Co., Ltd. | Low loss transversely-excited film bulk acoustic resonators and filters |
US12040779B2 (en) | 2020-04-20 | 2024-07-16 | Murata Manufacturing Co., Ltd. | Small transversely-excited film bulk acoustic resonators with enhanced Q-factor |
US11283424B2 (en) | 2020-05-04 | 2022-03-22 | Resonant Inc. | Transversely-excited film bulk acoustic resonator with etched conductor patterns |
US11811391B2 (en) | 2020-05-04 | 2023-11-07 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator with etched conductor patterns |
US11967943B2 (en) | 2020-05-04 | 2024-04-23 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator with etched conductor patterns |
US11469733B2 (en) | 2020-05-06 | 2022-10-11 | Resonant Inc. | Transversely-excited film bulk acoustic resonators with interdigital transducer configured to reduce diaphragm stress |
US11909374B2 (en) | 2020-05-06 | 2024-02-20 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonators with interdigital transducer configured to reduce diaphragm stress |
US12074584B2 (en) | 2020-05-28 | 2024-08-27 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonators with two-layer electrodes |
US11996825B2 (en) | 2020-06-17 | 2024-05-28 | Murata Manufacturing Co., Ltd. | Filter using lithium niobate and rotated lithium tantalate transversely-excited film bulk acoustic resonators |
US11329628B2 (en) | 2020-06-17 | 2022-05-10 | Resonant Inc. | Filter using lithium niobate and lithium tantalate transversely-excited film bulk acoustic resonators |
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Also Published As
Publication number | Publication date |
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JP4613960B2 (en) | 2011-01-19 |
KR100904368B1 (en) | 2009-06-23 |
CN101292423A (en) | 2008-10-22 |
KR20080063310A (en) | 2008-07-03 |
JPWO2007046236A1 (en) | 2009-04-23 |
US20080179989A1 (en) | 2008-07-31 |
CN101292423B (en) | 2010-08-25 |
EP1947765B1 (en) | 2012-04-11 |
EP1947765A1 (en) | 2008-07-23 |
WO2007046236A1 (en) | 2007-04-26 |
EP1947765A4 (en) | 2009-09-02 |
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