US6324047B1 - Symmetrical feed-thru - Google Patents
Symmetrical feed-thru Download PDFInfo
- Publication number
- US6324047B1 US6324047B1 US09/587,968 US58796800A US6324047B1 US 6324047 B1 US6324047 B1 US 6324047B1 US 58796800 A US58796800 A US 58796800A US 6324047 B1 US6324047 B1 US 6324047B1
- Authority
- US
- United States
- Prior art keywords
- feed
- filter construction
- electrode plates
- electrode
- thru
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000010276 construction Methods 0.000 claims abstract description 47
- 239000003990 capacitor Substances 0.000 claims abstract description 19
- 239000003989 dielectric material Substances 0.000 claims description 8
- 238000013461 design Methods 0.000 abstract description 14
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 230000001052 transient effect Effects 0.000 abstract description 2
- 238000009434 installation Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000003491 array Methods 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
- 229910002113 barium titanate Inorganic materials 0.000 description 2
- 230000001413 cellular effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- 230000000747 cardiac effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/35—Feed-through capacitors or anti-noise capacitors
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H2001/0014—Capacitor filters, i.e. capacitors whose parasitic inductance is of relevance to consider it as filter
Definitions
- the present invention relates to a multi-layer ceramic capacitor or varistor adapted to be mounted on the surface of a circuit board.
- the invention relates to a square chip design for a capacitor or varistor for mounting on an electronic circuit board with corner terminations. More precisely, the present invention relates to a symmetrical multi-layer capacitor or varistor chip design for mounting on a circuit board to act as a filter therefore, with corner terminations and unoriented feed-thrus placed diagonally across the chip.
- Electromagnetic Interference could potentially render a circuit useless or worse still it could cause an incorrect answer to be generated from a computer by randomly powering a gate up or down.
- filtering out undesirable signal noise i.e., unwanted frequencies
- Feed-thru filter devices are well know in the art. They have been used in everything from cellular phones and laptop computers to implantable medical devices such as cardiac pacemakers. Their primary function is to attenuate undesirable or transient voltage frequencies or EMI from a signal passing through a circuit. They can be either capacitor- or varistor-based devices.
- a chip requires a significant amount of care be exercised during the manufacture, packaging, and installation of the chip. Sometimes a chip requires additional machinery or man-hours to ensure that the chip is oriented properly throughout the manufacturing process.
- the termination process is the widely-used industry process in which chips are oriented to form the terminals on the sides of the chip and then re-oriented to form the terminals on the ends of the chip.
- the electrically conductive terminals allow for electrical connection between the lead structures of the electrode plates and the circuitry in which the chip is ultimately placed.
- Additional United States Patents provide examples of capacitor-based feed-thru filters for use in attenuating undesired signal frequencies. Examples include U.S. Pat. Nos. 3,255,396; 3,320,557; 3,426,257; 3,989,988; 4,747,019; 4,908,590; 5,097,389; 5,650,759; and 5,595,829. The complete disclosures of all such patents (including all figures and descriptions thereof) are fully incorporated herein by reference.
- a principal object of the subject invention is an improved design for feed-thru filters with respect to manufacturing difficulties. More particularly, a main concern is improved design layouts for feed-thru filters that enhance manufacturing ease and require less printed circuit board (PCB) space while maintaining at least the same capabilities as prior art feed-thru filters.
- PCB printed circuit board
- Another more particular object of the subject invention is to provide a feed-thru filter that by design requires no side or end orientation for manufacturing and implementation. In such a context, it still a further object to provide such a feed-thru filter which is square in shape.
- Still another more particular object of the subject invention is to provide a square feed-thru filter with terminals in each of the four corners, wherein the terminals extend along the entirety of the height of the chip. It is a further more particular object of the subject invention to provide a feed-thru filter wherein the feed-thrus are oriented diagonally across the chip.
- Such a design includes a symmetrical, square design employing a multi-layer capacitor/varistor based feed-thru filter.
- the feed-thru filter comprises an interleaved series of electrode plates made of any capacitor/varistor material well known in the industry, for example zinc oxide. Other examples of such materials would be barium titanate or tantillum for use with the capacitor based variation of the subject invention.
- each plate At one set of opposing corners of each plate extend electrode tab structures for electrical connection to the terminals of the device.
- Each plate has its electrode tab structures in the opposite set of opposing corners from the plate either above, below, or both above and below it. In other words, the plates are interdigitated.
- the feed-thru filter itself, has four terminals total, one in each corner of the device.
- the terminals extend along the entirety of the height of the device. It is these terminals, to which, the electrode tab structures of each electrode plate are attached. They are arranged in such a way so that the polarity of a set of terminals in opposing corners is the same. That set of terminals, however, will have a different polarity from the remaining set of terminals.
- the feed-thru filter of the subject invention utilizes less space with greater capability while enhancing the ease of manufacturing and implementation of itself.
- the present invention's symmetric square-shape leaves greater room on the PCB than does a discoidal or rectangular design. With today's push toward miniaturization, integration of components into smaller and smaller areas is absolutely mandatory. In its shape alone, the present invention has solved problems for circuit designers.
- the instant invention enables manufacturers to create the corner terminals on existing machinery without concern as to the orientation of the chip.
- a square chip with corner terminals can be processed through the termination process without end or side orientation.
- the termination process merely adds the terminals at the corners. It is not required that the terminals be placed at an exact location along the length of the rectangular chip.
- the use of just four terminals, one for each corner allows for the termination process to create the terminals in just one pass through the machinery as opposed to multiple passes for other chips.
- the chip requires less effort in packaging and installation, yet provides equal or greater performance.
- FIG. 1A is a schematic diagram showing the feed-thru direction between opposing corner terminals and the ground.
- FIG. 1B is an overhead view of the multi-layer symmetrical chip showing the corner terminations.
- FIG. 1C is a schematic diagram showing the feed-thru direction between opposing corner terminals in a direction opposite that in FIG. 1 A and the ground.
- FIG. 1D is a front view of the multi-layer symmetrical chip showing each alternating layer's connection to a corner terminal via tab electrode structures and how the corner terminals extend along the entirety of the chip's height.
- FIG. 2 is a schematic diagram showing the orientation of corner terminals and their interdigitated polarities.
- FIG. 3 is an exploded view of at least three of the ceramic electrode plates within the symmetric chip showing the alternating direction of the feed-thru and their respective main electrode portions and tab electrode structures.
- FIG. 1B represents an overhead view of a multi-layer symmetrical chip showing corner terminations.
- the subject invention comprises a feed-thru filter construction 10 having a square-shaped symmetrical body 11 (i.e., a length-to-width ratio of 1:1) with an electrically conductive terminal 12 , 14 in each corner of the construction 10 .
- An exemplary measurement of one embodiment is approximately 40 mils by 40 mils with a height of up to 35 mils maximum.
- the construction 10 is a passive component, it can be either a capacitor or a varistor based component.
- the feed-thru paths are unoriented until installation of the chip 10 . While the pathway (as indicated by the arrows in the figures) is diagonal across each electrode plate 16 , 18 , 20 , only installation determines the direction of the flow of current through the construction 10 . Additionally, the construction 10 has four electrically conductive terminals 12 , 14 . There is one terminal 12 , 14 in each corner of the construction 10 . It is these terminals 12 , 14 that provide the electrical connection between the construction 10 and the circuitry into which it is ultimately placed.
- the internal composition of the construction 10 comprise a plurality of electrode plates 16 , 18 , 20 stacked, pressed, and sintered together in a spaced apart arrangement to form the filter through which the signal passes.
- These electrode plates 16 , 18 , 20 can be made of any material used in the industry in the construction of either a capacitor or varistor. Examples of such materials include zinc oxide and barium titanate.
- each electrode plate 16 , 18 , 20 has at least a five mil border 28 of the dielectric material 15 except where the electrical connection between the electrode plates 16 , 18 , 20 and the terminals 12 , 14 is made.
- the first electrode plate 16 shown in FIG. 3, is designed to have a main electrode portion 30 and two electrode tab structures 22 extending therefrom.
- the electrode tab structures 22 extend into a set of opposing corners.
- the second electrode plate 18 has an identical main electrode portion 32 and two identical electrode tab structures 24 .
- the electrode tab structures 24 of the second electrode plate 18 extend into the opposite set of opposed corners.
- the third electrode plate 20 is identical in all respects to the first electrode plate 16 .
- the fourth electrode plate (not shown) would be identical in all respects to the second electrode plate 18 .
- the multiple electrode plates 16 , 18 , 20 are interdigitated to alternating sets of opposed corners. It is in those two sets of opposed corners where the electrode tab structures 22 , 24 , 26 and the terminals 12 , 14 are electrically connected.
- the terminals 12 , 14 extend along the entirety of the height of the body 11 . As can be seen in FIG. 2, each of the sets of terminals 12 , 14 gain an opposing polarity once installed. As the construction 10 is symmetrical and unoriented prior to its installation, one of ordinary skill in the art would recognize that either terminal set 12 , 14 could become positive and either could become negative.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Thermistors And Varistors (AREA)
Abstract
Description
Claims (27)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/587,968 US6324047B1 (en) | 2000-06-06 | 2000-06-06 | Symmetrical feed-thru |
AU2001275242A AU2001275242A1 (en) | 2000-06-06 | 2001-06-05 | Symmetrical feed-thru |
PCT/US2001/018138 WO2001095350A1 (en) | 2000-06-06 | 2001-06-05 | Symmetrical feed-thru |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/587,968 US6324047B1 (en) | 2000-06-06 | 2000-06-06 | Symmetrical feed-thru |
Publications (1)
Publication Number | Publication Date |
---|---|
US6324047B1 true US6324047B1 (en) | 2001-11-27 |
Family
ID=24351922
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/587,968 Expired - Fee Related US6324047B1 (en) | 2000-06-06 | 2000-06-06 | Symmetrical feed-thru |
Country Status (3)
Country | Link |
---|---|
US (1) | US6324047B1 (en) |
AU (1) | AU2001275242A1 (en) |
WO (1) | WO2001095350A1 (en) |
Cited By (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040108137A1 (en) * | 2002-12-10 | 2004-06-10 | Litton Systems, Inc. | Cross connect via for multilayer printed circuit boards |
US6873513B2 (en) | 1997-04-08 | 2005-03-29 | X2Y Attenuators, Llc | Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
US6894884B2 (en) | 1997-04-08 | 2005-05-17 | Xzy Attenuators, Llc | Offset pathway arrangements for energy conditioning |
US6954346B2 (en) | 1997-04-08 | 2005-10-11 | Xzy Attenuators, Llc | Filter assembly |
US7042303B2 (en) | 1998-04-07 | 2006-05-09 | X2Y Attenuators, Llc | Energy conditioning circuit assembly |
US7042703B2 (en) | 2000-03-22 | 2006-05-09 | X2Y Attenuators, Llc | Energy conditioning structure |
US7050284B2 (en) | 1997-04-08 | 2006-05-23 | X2Y Attenuators, Llc | Component carrier |
US20060158348A1 (en) * | 2005-01-14 | 2006-07-20 | Landisinc. | Utility meter having RF protection |
US7106570B2 (en) | 1997-04-08 | 2006-09-12 | Xzy Altenuators, Llc | Pathway arrangement |
US7110227B2 (en) | 1997-04-08 | 2006-09-19 | X2Y Attenuators, Llc | Universial energy conditioning interposer with circuit architecture |
US7110235B2 (en) | 1997-04-08 | 2006-09-19 | Xzy Altenuators, Llc | Arrangement for energy conditioning |
US7113383B2 (en) | 2000-04-28 | 2006-09-26 | X2Y Attenuators, Llc | Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning |
US7141899B2 (en) | 1998-04-07 | 2006-11-28 | X2Y Attenuators, Llc | Component carrier |
US7180718B2 (en) | 2003-01-31 | 2007-02-20 | X2Y Attenuators, Llc | Shielded energy conditioner |
US7193831B2 (en) | 2000-10-17 | 2007-03-20 | X2Y Attenuators, Llc | Energy pathway arrangement |
US7224564B2 (en) | 2000-10-17 | 2007-05-29 | X2Y Attenuators, Llc | Amalgam of shielding and shielded energy pathways and other elements for single or multiple circuitries with common reference node |
US7262949B2 (en) | 2000-08-15 | 2007-08-28 | X2Y Attenuators, Llc | Electrode arrangement for circuit energy conditioning |
US7274549B2 (en) | 2000-12-15 | 2007-09-25 | X2Y Attenuators, Llc | Energy pathway arrangements for energy conditioning |
US7301748B2 (en) | 1997-04-08 | 2007-11-27 | Anthony Anthony A | Universal energy conditioning interposer with circuit architecture |
US7321485B2 (en) | 1997-04-08 | 2008-01-22 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
US7336467B2 (en) | 2000-10-17 | 2008-02-26 | X2Y Attenuators, Llc | Energy pathway arrangement |
US7336468B2 (en) | 1997-04-08 | 2008-02-26 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
US20080129198A1 (en) * | 2006-12-01 | 2008-06-05 | Hong Kong Applied Science And Technology Research Institute Co. Ltd. | Light-emitting diode device |
US7423860B2 (en) | 1997-04-08 | 2008-09-09 | X2Y Attenuators, Llc | Multi-functional energy conditioner |
US7427816B2 (en) | 1998-04-07 | 2008-09-23 | X2Y Attenuators, Llc | Component carrier |
US7440252B2 (en) | 2003-05-29 | 2008-10-21 | X2Y Attenuators, Llc | Connector related structures including an energy conditioner |
US7443647B2 (en) | 1997-04-08 | 2008-10-28 | X2Y Attenuators, Llc | Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
US7586728B2 (en) | 2005-03-14 | 2009-09-08 | X2Y Attenuators, Llc | Conditioner with coplanar conductors |
US7630188B2 (en) | 2005-03-01 | 2009-12-08 | X2Y Attenuators, Llc | Conditioner with coplanar conductors |
US7675729B2 (en) | 2003-12-22 | 2010-03-09 | X2Y Attenuators, Llc | Internally shielded energy conditioner |
US7817397B2 (en) | 2005-03-01 | 2010-10-19 | X2Y Attenuators, Llc | Energy conditioner with tied through electrodes |
US8026777B2 (en) | 2006-03-07 | 2011-09-27 | X2Y Attenuators, Llc | Energy conditioner structures |
US8761875B2 (en) | 2006-08-03 | 2014-06-24 | Cardiac Pacemakers, Inc. | Method and apparatus for selectable energy storage partitioned capacitor |
US9054094B2 (en) | 1997-04-08 | 2015-06-09 | X2Y Attenuators, Llc | Energy conditioning circuit arrangement for integrated circuit |
US9093974B2 (en) | 2012-09-05 | 2015-07-28 | Avx Corporation | Electromagnetic interference filter for implanted electronics |
US20160240314A1 (en) * | 2015-02-13 | 2016-08-18 | Murata Manufacturing Co., Ltd. | Multilayer capacitor |
US10204737B2 (en) | 2014-06-11 | 2019-02-12 | Avx Corporation | Low noise capacitors |
US10874865B2 (en) | 2017-11-06 | 2020-12-29 | Avx Corporation | EMI feedthrough filter terminal assembly containing a resin coating over a hermetically sealing material |
Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3255396A (en) | 1964-01-02 | 1966-06-07 | Sprague Electric Co | Feed-through capacitor |
US3320557A (en) | 1963-04-02 | 1967-05-16 | Globe Union Inc | Feed-through capacitor |
US3426257A (en) | 1967-10-19 | 1969-02-04 | David Youngquist | Multiple capacitor and method of making the same |
US3989988A (en) | 1974-11-27 | 1976-11-02 | Siemens Aktiengesellschaft | Interference suppression feed-through capacitor |
US4747019A (en) | 1984-12-14 | 1988-05-24 | Murata Manufacturing Co., Ltd. | Feedthrough capacitor arrangement |
US4908590A (en) | 1986-01-14 | 1990-03-13 | Murata Manufacturing Co., Ltd. | Chip-like LC filter |
US5034849A (en) | 1989-03-20 | 1991-07-23 | Siemens Aktiengesellschaft | Axially-wound electrical capacitor |
US5097389A (en) | 1989-03-03 | 1992-03-17 | Murata Manufacturing Co., Ltd. | Structure for fixing feedthrough capacitor in high-frequency device and manufacturing method of high-frequency device |
US5448445A (en) | 1993-03-05 | 1995-09-05 | Matsushita Electric Industrial Co., Ltd. | Three-terminal capacitor and assembly |
US5650759A (en) | 1995-11-09 | 1997-07-22 | Hittman Materials & Medical Components, Inc. | Filtered feedthrough assembly having a mounted chip capacitor for medical implantable devices and method of manufacture therefor |
US5880925A (en) * | 1997-06-27 | 1999-03-09 | Avx Corporation | Surface mount multilayer capacitor |
EP0915488A2 (en) | 1997-11-10 | 1999-05-12 | Murata Manufacturing Co., Ltd. | Multilayer capacitor |
US5910879A (en) | 1996-06-27 | 1999-06-08 | Herbert; Edward | 3- and 4-terminal capacitors with "Faraday-shielded" connections |
US5923523A (en) | 1996-04-30 | 1999-07-13 | Herbert; Edward | High current, low inductance capacitor packages |
US5930109A (en) * | 1997-11-07 | 1999-07-27 | Pacesetter, Inc. | Electrolytic capacitor with multiple independent anodes |
US5959829A (en) * | 1998-02-18 | 1999-09-28 | Maxwell Energy Products, Inc. | Chip capacitor electromagnetic interference filter |
JPH11329902A (en) | 1998-05-15 | 1999-11-30 | Nec Corp | Solid electrolytic capacitor and manufacture thereof |
US6061227A (en) * | 1997-06-30 | 2000-05-09 | Taiyo Yuden Co., Ltd. | Multilayer LC complex component |
-
2000
- 2000-06-06 US US09/587,968 patent/US6324047B1/en not_active Expired - Fee Related
-
2001
- 2001-06-05 WO PCT/US2001/018138 patent/WO2001095350A1/en active Application Filing
- 2001-06-05 AU AU2001275242A patent/AU2001275242A1/en not_active Abandoned
Patent Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3320557A (en) | 1963-04-02 | 1967-05-16 | Globe Union Inc | Feed-through capacitor |
US3255396A (en) | 1964-01-02 | 1966-06-07 | Sprague Electric Co | Feed-through capacitor |
US3426257A (en) | 1967-10-19 | 1969-02-04 | David Youngquist | Multiple capacitor and method of making the same |
US3989988A (en) | 1974-11-27 | 1976-11-02 | Siemens Aktiengesellschaft | Interference suppression feed-through capacitor |
US4747019A (en) | 1984-12-14 | 1988-05-24 | Murata Manufacturing Co., Ltd. | Feedthrough capacitor arrangement |
US4908590A (en) | 1986-01-14 | 1990-03-13 | Murata Manufacturing Co., Ltd. | Chip-like LC filter |
US5097389A (en) | 1989-03-03 | 1992-03-17 | Murata Manufacturing Co., Ltd. | Structure for fixing feedthrough capacitor in high-frequency device and manufacturing method of high-frequency device |
US5034849A (en) | 1989-03-20 | 1991-07-23 | Siemens Aktiengesellschaft | Axially-wound electrical capacitor |
US5448445A (en) | 1993-03-05 | 1995-09-05 | Matsushita Electric Industrial Co., Ltd. | Three-terminal capacitor and assembly |
US5650759A (en) | 1995-11-09 | 1997-07-22 | Hittman Materials & Medical Components, Inc. | Filtered feedthrough assembly having a mounted chip capacitor for medical implantable devices and method of manufacture therefor |
US5923523A (en) | 1996-04-30 | 1999-07-13 | Herbert; Edward | High current, low inductance capacitor packages |
US5910879A (en) | 1996-06-27 | 1999-06-08 | Herbert; Edward | 3- and 4-terminal capacitors with "Faraday-shielded" connections |
US5880925A (en) * | 1997-06-27 | 1999-03-09 | Avx Corporation | Surface mount multilayer capacitor |
US6061227A (en) * | 1997-06-30 | 2000-05-09 | Taiyo Yuden Co., Ltd. | Multilayer LC complex component |
US5930109A (en) * | 1997-11-07 | 1999-07-27 | Pacesetter, Inc. | Electrolytic capacitor with multiple independent anodes |
EP0915488A2 (en) | 1997-11-10 | 1999-05-12 | Murata Manufacturing Co., Ltd. | Multilayer capacitor |
US5959829A (en) * | 1998-02-18 | 1999-09-28 | Maxwell Energy Products, Inc. | Chip capacitor electromagnetic interference filter |
JPH11329902A (en) | 1998-05-15 | 1999-11-30 | Nec Corp | Solid electrolytic capacitor and manufacture thereof |
Cited By (68)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7593208B2 (en) | 1997-04-08 | 2009-09-22 | X2Y Attenuators, Llc | Multi-functional energy conditioner |
US7609500B2 (en) | 1997-04-08 | 2009-10-27 | X2Y Attenuators, Llc | Universal energy conditioning interposer with circuit architecture |
US6894884B2 (en) | 1997-04-08 | 2005-05-17 | Xzy Attenuators, Llc | Offset pathway arrangements for energy conditioning |
US6954346B2 (en) | 1997-04-08 | 2005-10-11 | Xzy Attenuators, Llc | Filter assembly |
US7920367B2 (en) | 1997-04-08 | 2011-04-05 | X2Y Attenuators, Llc | Method for making arrangement for energy conditioning |
US7916444B2 (en) | 1997-04-08 | 2011-03-29 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
US7050284B2 (en) | 1997-04-08 | 2006-05-23 | X2Y Attenuators, Llc | Component carrier |
US9373592B2 (en) | 1997-04-08 | 2016-06-21 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
US7106570B2 (en) | 1997-04-08 | 2006-09-12 | Xzy Altenuators, Llc | Pathway arrangement |
US7110227B2 (en) | 1997-04-08 | 2006-09-19 | X2Y Attenuators, Llc | Universial energy conditioning interposer with circuit architecture |
US7110235B2 (en) | 1997-04-08 | 2006-09-19 | Xzy Altenuators, Llc | Arrangement for energy conditioning |
US8018706B2 (en) | 1997-04-08 | 2011-09-13 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
US8023241B2 (en) | 1997-04-08 | 2011-09-20 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
US7768763B2 (en) | 1997-04-08 | 2010-08-03 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
US8587915B2 (en) | 1997-04-08 | 2013-11-19 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
US7733621B2 (en) | 1997-04-08 | 2010-06-08 | X2Y Attenuators, Llc | Energy conditioning circuit arrangement for integrated circuit |
US7688565B2 (en) | 1997-04-08 | 2010-03-30 | X2Y Attenuators, Llc | Arrangements for energy conditioning |
US7336468B2 (en) | 1997-04-08 | 2008-02-26 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
US7301748B2 (en) | 1997-04-08 | 2007-11-27 | Anthony Anthony A | Universal energy conditioning interposer with circuit architecture |
US7321485B2 (en) | 1997-04-08 | 2008-01-22 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
US6873513B2 (en) | 1997-04-08 | 2005-03-29 | X2Y Attenuators, Llc | Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
US9054094B2 (en) | 1997-04-08 | 2015-06-09 | X2Y Attenuators, Llc | Energy conditioning circuit arrangement for integrated circuit |
US9019679B2 (en) | 1997-04-08 | 2015-04-28 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
US7423860B2 (en) | 1997-04-08 | 2008-09-09 | X2Y Attenuators, Llc | Multi-functional energy conditioner |
US7609501B2 (en) | 1997-04-08 | 2009-10-27 | X2Y Attenuators, Llc | Manufacture including shield structure |
US8004812B2 (en) | 1997-04-08 | 2011-08-23 | X2Y Attenuators, Llc | Energy conditioning circuit arrangement for integrated circuit |
US9036319B2 (en) | 1997-04-08 | 2015-05-19 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
US7443647B2 (en) | 1997-04-08 | 2008-10-28 | X2Y Attenuators, Llc | Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
US7042303B2 (en) | 1998-04-07 | 2006-05-09 | X2Y Attenuators, Llc | Energy conditioning circuit assembly |
US7427816B2 (en) | 1998-04-07 | 2008-09-23 | X2Y Attenuators, Llc | Component carrier |
US7141899B2 (en) | 1998-04-07 | 2006-11-28 | X2Y Attenuators, Llc | Component carrier |
US7042703B2 (en) | 2000-03-22 | 2006-05-09 | X2Y Attenuators, Llc | Energy conditioning structure |
US7113383B2 (en) | 2000-04-28 | 2006-09-26 | X2Y Attenuators, Llc | Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning |
US7262949B2 (en) | 2000-08-15 | 2007-08-28 | X2Y Attenuators, Llc | Electrode arrangement for circuit energy conditioning |
US7224564B2 (en) | 2000-10-17 | 2007-05-29 | X2Y Attenuators, Llc | Amalgam of shielding and shielded energy pathways and other elements for single or multiple circuitries with common reference node |
US7193831B2 (en) | 2000-10-17 | 2007-03-20 | X2Y Attenuators, Llc | Energy pathway arrangement |
US7336467B2 (en) | 2000-10-17 | 2008-02-26 | X2Y Attenuators, Llc | Energy pathway arrangement |
US7428134B2 (en) | 2000-10-17 | 2008-09-23 | X2Y Attenuators, Llc | Energy pathway arrangements for energy conditioning |
US7433168B2 (en) | 2000-10-17 | 2008-10-07 | X2Y Attenuators, Llc | Amalgam of shielding and shielded energy pathways and other elements for single or multiple circuitries with common reference node |
US7274549B2 (en) | 2000-12-15 | 2007-09-25 | X2Y Attenuators, Llc | Energy pathway arrangements for energy conditioning |
US20040108137A1 (en) * | 2002-12-10 | 2004-06-10 | Litton Systems, Inc. | Cross connect via for multilayer printed circuit boards |
US7180718B2 (en) | 2003-01-31 | 2007-02-20 | X2Y Attenuators, Llc | Shielded energy conditioner |
US7440252B2 (en) | 2003-05-29 | 2008-10-21 | X2Y Attenuators, Llc | Connector related structures including an energy conditioner |
US7675729B2 (en) | 2003-12-22 | 2010-03-09 | X2Y Attenuators, Llc | Internally shielded energy conditioner |
US20060158348A1 (en) * | 2005-01-14 | 2006-07-20 | Landisinc. | Utility meter having RF protection |
US7761249B2 (en) * | 2005-01-14 | 2010-07-20 | Landis+Gyr, Inc. | Utility meter having RF protection |
US7782587B2 (en) | 2005-03-01 | 2010-08-24 | X2Y Attenuators, Llc | Internally overlapped conditioners |
US7817397B2 (en) | 2005-03-01 | 2010-10-19 | X2Y Attenuators, Llc | Energy conditioner with tied through electrodes |
US8547677B2 (en) | 2005-03-01 | 2013-10-01 | X2Y Attenuators, Llc | Method for making internally overlapped conditioners |
US8014119B2 (en) | 2005-03-01 | 2011-09-06 | X2Y Attenuators, Llc | Energy conditioner with tied through electrodes |
US9001486B2 (en) | 2005-03-01 | 2015-04-07 | X2Y Attenuators, Llc | Internally overlapped conditioners |
US7630188B2 (en) | 2005-03-01 | 2009-12-08 | X2Y Attenuators, Llc | Conditioner with coplanar conductors |
US7974062B2 (en) | 2005-03-01 | 2011-07-05 | X2Y Attenuators, Llc | Internally overlapped conditioners |
US7586728B2 (en) | 2005-03-14 | 2009-09-08 | X2Y Attenuators, Llc | Conditioner with coplanar conductors |
US8026777B2 (en) | 2006-03-07 | 2011-09-27 | X2Y Attenuators, Llc | Energy conditioner structures |
US8761875B2 (en) | 2006-08-03 | 2014-06-24 | Cardiac Pacemakers, Inc. | Method and apparatus for selectable energy storage partitioned capacitor |
US20080129198A1 (en) * | 2006-12-01 | 2008-06-05 | Hong Kong Applied Science And Technology Research Institute Co. Ltd. | Light-emitting diode device |
US9093974B2 (en) | 2012-09-05 | 2015-07-28 | Avx Corporation | Electromagnetic interference filter for implanted electronics |
US10154616B2 (en) | 2012-09-05 | 2018-12-11 | Avx Corporation | Electromagnetic interference filter for implanted electronics |
US10204737B2 (en) | 2014-06-11 | 2019-02-12 | Avx Corporation | Low noise capacitors |
US10923277B2 (en) | 2014-06-11 | 2021-02-16 | Avx Corporation | Low noise capacitors |
US11817262B2 (en) | 2014-06-11 | 2023-11-14 | KYOCERA AVX Components Corporation | Low noise capacitors |
US20160240314A1 (en) * | 2015-02-13 | 2016-08-18 | Murata Manufacturing Co., Ltd. | Multilayer capacitor |
US10186377B2 (en) * | 2015-02-13 | 2019-01-22 | Murata Manufacturing Co., Ltd. | Multilayer capacitor |
US20190131068A1 (en) * | 2015-02-13 | 2019-05-02 | Murata Manufacturing Co., Ltd. | Multilayer capacitor |
US10600567B2 (en) * | 2015-02-13 | 2020-03-24 | Murata Manufacturing Co., Ltd. | Multilayer capacitor |
US10874865B2 (en) | 2017-11-06 | 2020-12-29 | Avx Corporation | EMI feedthrough filter terminal assembly containing a resin coating over a hermetically sealing material |
US11369800B2 (en) | 2017-11-06 | 2022-06-28 | KYOCERA AVX Components Corporation | EMI feedthrough filter terminal assembly containing a laminated insulative seal |
Also Published As
Publication number | Publication date |
---|---|
AU2001275242A1 (en) | 2001-12-17 |
WO2001095350A1 (en) | 2001-12-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6324047B1 (en) | Symmetrical feed-thru | |
US7292429B2 (en) | Low inductance capacitor | |
US8149565B2 (en) | Circuit board device and integrated circuit device | |
US6407904B1 (en) | Multi-layer capacitor | |
KR101557157B1 (en) | Land Grid Feed Thru Loewess EL Technologies | |
KR102171678B1 (en) | Multi-layered ceramic capacitor and board for mounting the same | |
US8179210B2 (en) | Electrical multilayer component with shielding and resistance structures | |
US5392019A (en) | Inductance device and manufacturing process thereof | |
US7432784B2 (en) | Noise filter and mounted structure of noise filter | |
US7403369B2 (en) | Low inductance multilayer capacitor | |
JP2002508114A (en) | Surface mount multilayer capacitors | |
US20040223289A1 (en) | Multi-layer capacitor, wiring board, and high-frequency circuit | |
US5495213A (en) | LC noise filter | |
TW575886B (en) | Electrical several-layer element and interference-suppression circuit with said element | |
JPH0653075A (en) | Laminated ceramic capacitor for balanced line | |
WO2002011160A1 (en) | Integrated dual frequency noise attenuator and transient suppressor | |
EP1659597A2 (en) | Multilayer capacitor | |
CN219164535U (en) | Filter circuit and power supply device including the same | |
KR101051620B1 (en) | Multilayer capacitor | |
CN104282437A (en) | Multilayer ceramic capacitor and board for mounting the same | |
JPH04257112A (en) | Laminated chip t-type filter | |
US8098477B2 (en) | Feedthrough multilayer capacitor with capacitance components connected in parallel | |
JP3135443B2 (en) | Multilayer ceramic capacitors | |
JPH0456207A (en) | Monolithic ceramic capacitor and circuit using the same | |
KR20050089493A (en) | Multi-layer ceramic capacitor |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: AVX LIMITED, UNITED KINGDOM Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HAYWORTH, WILSON R.;REEL/FRAME:010846/0979 Effective date: 20000602 |
|
AS | Assignment |
Owner name: AVX CORPORATION, SOUTH CAROLINA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:AVX LIMITED;REEL/FRAME:011363/0491 Effective date: 20001201 |
|
FPAY | Fee payment |
Year of fee payment: 4 |
|
REMI | Maintenance fee reminder mailed | ||
LAPS | Lapse for failure to pay maintenance fees | ||
STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
|
FP | Lapsed due to failure to pay maintenance fee |
Effective date: 20091127 |