US3882003A - Vinyl ester resin and process for curing same with ionizing radiation in the presence of amines - Google Patents
Vinyl ester resin and process for curing same with ionizing radiation in the presence of amines Download PDFInfo
- Publication number
- US3882003A US3882003A US391108A US39110873A US3882003A US 3882003 A US3882003 A US 3882003A US 391108 A US391108 A US 391108A US 39110873 A US39110873 A US 39110873A US 3882003 A US3882003 A US 3882003A
- Authority
- US
- United States
- Prior art keywords
- mixture
- vinyl
- hydrogen
- group
- alkyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 35
- 239000011347 resin Substances 0.000 title claims abstract description 35
- 229920001567 vinyl ester resin Polymers 0.000 title claims abstract description 26
- 150000001412 amines Chemical class 0.000 title claims abstract description 16
- 230000005865 ionizing radiation Effects 0.000 title claims abstract description 14
- 238000000034 method Methods 0.000 title claims description 17
- 239000000203 mixture Substances 0.000 claims abstract description 42
- 239000000178 monomer Substances 0.000 claims abstract description 27
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 16
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 7
- 239000001257 hydrogen Substances 0.000 claims description 22
- 229910052739 hydrogen Inorganic materials 0.000 claims description 22
- 125000000217 alkyl group Chemical group 0.000 claims description 21
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 14
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical group [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 14
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 14
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 12
- -1 VINYL CARBOXYLIC ACIDS Chemical class 0.000 claims description 11
- 239000002253 acid Substances 0.000 claims description 11
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Chemical group BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims description 10
- 239000000460 chlorine Substances 0.000 claims description 10
- 229920000647 polyepoxide Polymers 0.000 claims description 10
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 9
- 150000002118 epoxides Chemical group 0.000 claims description 9
- 229910052794 bromium Inorganic materials 0.000 claims description 8
- 229910052801 chlorine Inorganic materials 0.000 claims description 8
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 7
- 150000000376 2-oxazolines Chemical class 0.000 claims description 7
- 229920003986 novolac Polymers 0.000 claims description 6
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 5
- 150000002357 guanidines Chemical class 0.000 claims description 5
- UYMKPFRHYYNDTL-UHFFFAOYSA-N ethenamine Chemical class NC=C UYMKPFRHYYNDTL-UHFFFAOYSA-N 0.000 claims description 3
- 125000002768 hydroxyalkyl group Chemical group 0.000 claims description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical group ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 claims 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- CIUQDSCDWFSTQR-UHFFFAOYSA-N [C]1=CC=CC=C1 Chemical group [C]1=CC=CC=C1 CIUQDSCDWFSTQR-UHFFFAOYSA-N 0.000 claims 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 1
- 125000003700 epoxy group Chemical group 0.000 claims 1
- ORGHESHFQPYLAO-UHFFFAOYSA-N vinyl radical Chemical class C=[CH] ORGHESHFQPYLAO-UHFFFAOYSA-N 0.000 claims 1
- 239000000463 material Substances 0.000 description 18
- 238000001723 curing Methods 0.000 description 12
- 238000000576 coating method Methods 0.000 description 9
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 6
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 6
- 239000010408 film Substances 0.000 description 6
- 150000002431 hydrogen Chemical class 0.000 description 6
- IMSODMZESSGVBE-UHFFFAOYSA-N 2-Oxazoline Chemical compound C1CN=CO1 IMSODMZESSGVBE-UHFFFAOYSA-N 0.000 description 5
- 230000008901 benefit Effects 0.000 description 5
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 5
- 230000005855 radiation Effects 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 238000003847 radiation curing Methods 0.000 description 4
- KYVBNYUBXIEUFW-UHFFFAOYSA-N 1,1,3,3-tetramethylguanidine Chemical compound CN(C)C(=N)N(C)C KYVBNYUBXIEUFW-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229940095095 2-hydroxyethyl acrylate Drugs 0.000 description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- ZRALSGWEFCBTJO-UHFFFAOYSA-N Guanidine Chemical compound NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 2
- 239000005041 Mylar™ Substances 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 239000008199 coating composition Substances 0.000 description 2
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 150000002918 oxazolines Chemical class 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 1
- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 1
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- IEVADDDOVGMCSI-UHFFFAOYSA-N 2-hydroxybutyl 2-methylprop-2-enoate Chemical compound CCC(O)COC(=O)C(C)=C IEVADDDOVGMCSI-UHFFFAOYSA-N 0.000 description 1
- GUXJXWKCUUWCLX-UHFFFAOYSA-N 2-methyl-2-oxazoline Chemical compound CC1=NCCO1 GUXJXWKCUUWCLX-UHFFFAOYSA-N 0.000 description 1
- NJBCRXCAPCODGX-UHFFFAOYSA-N 2-methyl-n-(2-methylpropyl)propan-1-amine Chemical compound CC(C)CNCC(C)C NJBCRXCAPCODGX-UHFFFAOYSA-N 0.000 description 1
- QZPSOSOOLFHYRR-UHFFFAOYSA-N 3-hydroxypropyl prop-2-enoate Chemical compound OCCCOC(=O)C=C QZPSOSOOLFHYRR-UHFFFAOYSA-N 0.000 description 1
- RXNYJUSEXLAVNQ-UHFFFAOYSA-N 4,4'-Dihydroxybenzophenone Chemical compound C1=CC(O)=CC=C1C(=O)C1=CC=C(O)C=C1 RXNYJUSEXLAVNQ-UHFFFAOYSA-N 0.000 description 1
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 1
- CIIILUMBZOGKDF-UHFFFAOYSA-N 5-methyl-4,5-dihydro-1,3-oxazole Chemical compound CC1CN=CO1 CIIILUMBZOGKDF-UHFFFAOYSA-N 0.000 description 1
- YEMVKBHTRGTNJT-UHFFFAOYSA-N 5-phenyl-4,5-dihydro-1,3-oxazole Chemical compound C1N=COC1C1=CC=CC=C1 YEMVKBHTRGTNJT-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- WBYWAXJHAXSJNI-SREVYHEPSA-N Cinnamic acid Chemical compound OC(=O)\C=C/C1=CC=CC=C1 WBYWAXJHAXSJNI-SREVYHEPSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical group C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- 102100026933 Myelin-associated neurite-outgrowth inhibitor Human genes 0.000 description 1
- CHJJGSNFBQVOTG-UHFFFAOYSA-N N-methyl-guanidine Natural products CNC(N)=N CHJJGSNFBQVOTG-UHFFFAOYSA-N 0.000 description 1
- JPYHHZQJCSQRJY-UHFFFAOYSA-N Phloroglucinol Natural products CCC=CCC=CCC=CCC=CCCCCC(=O)C1=C(O)C=C(O)C=C1O JPYHHZQJCSQRJY-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical group C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229930016911 cinnamic acid Natural products 0.000 description 1
- 235000013985 cinnamic acid Nutrition 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000007859 condensation product Substances 0.000 description 1
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- SWSQBOPZIKWTGO-UHFFFAOYSA-N dimethylaminoamidine Natural products CN(C)C(N)=N SWSQBOPZIKWTGO-UHFFFAOYSA-N 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 150000003944 halohydrins Chemical class 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 229910052809 inorganic oxide Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
- ZIUHHBKFKCYYJD-UHFFFAOYSA-N n,n'-methylenebisacrylamide Chemical compound C=CC(=O)NCNC(=O)C=C ZIUHHBKFKCYYJD-UHFFFAOYSA-N 0.000 description 1
- OMNKZBIFPJNNIO-UHFFFAOYSA-N n-(2-methyl-4-oxopentan-2-yl)prop-2-enamide Chemical compound CC(=O)CC(C)(C)NC(=O)C=C OMNKZBIFPJNNIO-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- QCDYQQDYXPDABM-UHFFFAOYSA-N phloroglucinol Chemical compound OC1=CC(O)=CC(O)=C1 QCDYQQDYXPDABM-UHFFFAOYSA-N 0.000 description 1
- 229960001553 phloroglucinol Drugs 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002987 primer (paints) Substances 0.000 description 1
- 230000000135 prohibitive effect Effects 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- 229940086542 triethylamine Drugs 0.000 description 1
- HVYVMSPIJIWUNA-UHFFFAOYSA-N triphenylstibine Chemical compound C1=CC=CC=C1[Sb](C=1C=CC=CC=1)C1=CC=CC=C1 HVYVMSPIJIWUNA-UHFFFAOYSA-N 0.000 description 1
- UIYCHXAGWOYNNA-UHFFFAOYSA-N vinyl sulfide Chemical group C=CSC=C UIYCHXAGWOYNNA-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
- C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
- C08G59/1461—Unsaturated monoacids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
- C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
- C08F299/026—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from the reaction products of polyepoxides and unsaturated monocarboxylic acids, their anhydrides, halogenides or esters with low molecular weight
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S525/00—Synthetic resins or natural rubbers -- part of the class 520 series
- Y10S525/922—Polyepoxide polymer having been reacted to yield terminal ethylenic unsaturation
Definitions
- This invention relates to the field of ionizing radiation cure of polymerizable materials and to coatings of same and especially relates to a promoter to reduce the ionizing radiation level or dosage necessary to effect a cure of said materials.
- radiation curing offers a number of advantages over thermal catalystinitiated cures: immediate initiation of polymerization, extended pot-life of the curable materials, little temperature rise so heat sensitive substrates may be employed in coatings, better control of the polymerization reaction, superior substrate-coating bonds are produced and much higher concentrations of radicals may be produced instantaneously.
- these advantages are difficult to realize if the curable materials require high curing doses of ionizing radiation since the economics become prohibitive.
- Commercialization then depends on reducing the cost of the curing process by finding methods and materials to effect a cure at lower dosages.
- the curing dosage of ionizing radiation required to cure in an inert atmosphere a mixture of certain vinyl monomers and a polymerizable vinyl ester resin is reduced by adding to the mix ture at least 0.3 weight percent of certain nitrogen containing materials.
- the vinyl ester resin is prepared by reacting essentially equivalent amounts of an unsaturated monocarboxylic acid, such as methacrylic acid, with a polyepoxide of a polyhydric phenol having more than one epoxide group per molecule.
- unsaturated monocarboxylic acid such as methacrylic acid
- a polyepoxide of a polyhydric phenol having more than one epoxide group per molecule.
- the nitrogen materials include 2-oxazolines, guanidines and certain amines which are more fully described hereafter.
- Vinyl ester resins are a newer class of thermosettable resins which may be generally defined as a reaction product of an unsaturated monocarboxylic acid with a polyepoxide resin having more than one epoxide or oxirane group per molecule.
- the reactants are usually combined in about equivalent proportions of acid to epoxide groups, whereby the reaction of said acid with said epoxide produces a terminal polymerizable group connected to the polymer chain by linkages.
- a vinyl ester resin prepared by reacting about equivalent amounts of acrylic acid with a diglycidyl ether of bisphenol A may be illustrated by the following formula:
- useful polymerizable vinyl ester resins include those which are prepared by reacting an unsaturated monocarboxylic acid with a polyepoxide of a polyhydric phenol wherein the polyepoxide has an epoxide equivalent weight of about up to 1000 and even higher.
- Said polyepoxides are made by reacting at least about two moles of an epihalohydrin, such as epichlorohydrin, with one mole of a polyhydric phenol and a sufiicient amount of an alkali to combine with the halogen of the halohydrin.
- Unsaturated monocarboxylic acids useful in preparing vinyl ester resins have the formula where R, may be hydrogen, chlorine, bromine or phenyl and R, may be hydrogen, chlorine, bromine or a lower alkyl group of l to 4 carbon atoms.
- Said acids include acrylic acid, methacrylic acid, cinnamic acid, a-chloroacrylic acid and the like.
- Catalysts include tertiary amines such as tris(dimethylaminomethyl)phenol, onium catalysts, triphenyl stibine and triphenyl phosphine and the like.
- tertiary amines such as tris(dimethylaminomethyl)phenol
- onium catalysts triphenyl stibine
- triphenyl phosphine and the like triphenyl phosphine and the like.
- hydroquinone or other like polymerization inhibitors are added to prevent polymerization during the preparation of the resin.
- the polymerizable materials comprise a mixture of said vinyl ester resin with certain copolymerizable vinyl monomers. Only certain monomers may be employed with this invention provided the monomers are essentially nonvolatile. By this it is meant to exclude monomers which are predominantly gases at ambient temperatures. It is obvious that if the monomer is too volatile a substantial portion of the monomer would evaporate from a film or coating before the mixture of monomer and resin could be cured. Monomers which are normally liquid at room temperature may be used even though there may be a small loss of monomer by evaporation. It is possible to operate the process of this invention under higher pressures than atmospheric pressure to minimize any loss of said normally liquid monomers.
- polyunsaturated polymerizable monomers within the above classes may be used including ethylene glycol dimethacrylate, trimethylol propane trimethacrylate, methylene bisacrylamide and other similar monomers.
- the polymerizable materials of this invention are especially useful in coating various substrates such as metal, wood and the like either as a primer coating andlor a finished coating.
- at least 0.3 weight percent of the nitrogen containing material is added to the polymerizable materials. While quite large amounts of the nitrogen containing material may be added there is no advantage in doing so.
- the amount ranges from about 0.5 to 10 weight percent and most preferably from about 2 to 5 weight percent.
- ⁇ additives When employed as coating formulations other additives may be incorporated into the coating, for example, various inert fillers and pigments such as kaolin clay, titanium dioxide, silica, various inorganic oxides and the like. Films cast from the coating formulations may be rapidly cured by exposing them in an inert atmosphere to ionizing radiation (accelerated particulate radiation). A beam intensity of at least 50 microam peres is usually employed, but this invention is not limited thereto and lower beam intensities may be employed.
- the films or coatings will range in thickness from about 0.1 mil up to about mils. However, depending on the accelerating voltage, thicknesses up to 250 mils or higher are feasible.
- the radiation curing step should be performed in an inert atmosphere. By this it is meant an atmosphere which is essentially free of oxygen since the presence of oxygen may result in an undesirable tacky surface. It is sufficient for this purpose to place a thin film of a plastic material such as a polyester (Mylar) film on the cast film or coating.
- a plastic material such as a polyester (Mylar) film
- Accelerated particulate (ionizing) radiation includes particles such as electrons, protons, deuterons, other ions and the like.
- a variety of devices are available to provide accelerated electron radiation or varying voltages and beam intensities. Typical of such devices is the familiar Van de Graaff accelerator.
- Similar commercial accelerators utilizing various acceleration means are available from Texas Nuclear Corporation, (cascade rectified system) High Voltage Engineering, (insulated core transformer system) General Electric (a resonant transformer design) and Radiation Dynamics, Inc. (radio frequency cascade rectifier system).
- Nitrogen containing materials include 2-oxazolines, guanidines and certain amines.
- the 2-oxazolines include 2-oxazoline itself, and substituted 2-oxazolines having the formula wherein R and R" may be hydrogen, ethyl, methyl, phenyl and the like. R may be an alkyl, aryl, aralkyl group or hydrogen.
- Such substituted oxazolines include 2-methyl-2-oxazoline, 2,S-diphenyl-Z-oxazoline; 2- phenyl, 5-methyl-2-oxazoline; 2-methyl, 5-phenyl-2- oxazoline and the like.
- 2-oxazolines are the bis oxazolines such as 2,2- tetramethylene bis(2-oxazoline), 2,2'-oxydiethylene bis(2-oxazoline; 2,2 thiodiethylene bis(2-oxazoline) and the like.
- Guanidines include guanidine, tetramethyl guanidine and the like.
- Amines which may be employed have the formula R,R R N wherein R, may be an alkyl or an aralkyl group, R and R each may be hydrogen or an alkyl group or R, and R together may be a cyclic alkylene radical or an oxydialkylene radical.
- Alkyl groups include methyl, ethyl, propyl, n-butyl, isobutyl and higher alkyl groups.
- Typical amines include mono-, diand trin butyl amine, di-isobutyl amine, triethyl amine, cyclohexylamine, benzyl amine, morpholine, piperidine and the like.
- a vinyl ester resin was prepared by reacting methacrylic acid (3 l%) with a glycidyl polyether of bisphenol A having an epoxide equivalent weight (EEW) of 186-192 (D.E.R. 331). The vinyl ester resin was then mixed with n-butyl acrylate in the proportions of 2/1 and to this resin was then added 3% of various nitrogen containing compounds, based on weight of resin and monomer. A film was cast with a 7 mil draw-down bar on a Q-panel (4 X l2 X 0.03 inch) and covered with a 2 mil sheet of Mylar (polyester) film to exclude air.
- EW epoxide equivalent weight
- the coated polished steel Q panel was then passed through a 2 Mev electron beam from a Van de Graaf accelerator filtered with 0.33 gm/cm A1.
- a 50 microampere beam current and a conveyor speed of 3.4 cm/sec delivered a dose of 0.1 Megarad (Mrad) for each pass through the beam.
- EXAMPLE 3 Another vinyl ester resin made by reacting methacrylic acid (32.0%) with a mixture of D.E.R. 331 (17.7%) and an epoxy novolac (50.3%) having an EEW of 175-182 was mixed with n-butyl acrylate (2/1 and tested as in Example 1. Without an accelerator 0.5-0.6 Mrad was required to cure the mixture. The addition of 3% of di-n-butyl amine, 2-oxazoline or tetramethylguanidine reduced the dosage to cure to 0.2, 0.4 and 0.3 Mrad, respectively.
- EXAMPLE 4 The resin of Example 3 was mixed with 2-hydroxyethyl-acrylate 50/50 and the curing dosage was reduced from 0.3 to 0.15 Mrad.
- EXAMPLE 5 A further series of tests were run with the vinyl ester resin of Example 1 mixed with different monomers and employing various accelerating materials of the invention. The curing dose in Mrad for each of the various combinations employing the procedure of Example 1 is shown below.
- a process for curing a mixture of a polymerizable vinyl ester resin and a nonvolatile vinyl monomer selected from the group consisting of vinyl carboxylic acids, vinyl nitriles, vinyl amides, alkyl and liydroxyalkyl esters of vinyl carboxylic acids wherein the alkyl group contains from 1 to 8 carbons, and mixtures thereof said process comprises exposing said mixture in an inert atmosphere to ionizing radiation, said mixture having added thereto about 2 to 5 weight percent based on the weight of the mixture of an amine having the formula R,R R N where R, is an alkyl or aralkyl group, R is hydrogen and R may be hydrogen or an alkyl group or R and R together may be a cyclic alkylene radical or an oxydialkylene radical; and wherein said vinyl ester resin is prepared by reacting essentially equivalent amounts of a polyepoxide of a polyhydric phenol having more than one epoxide group per molecule with an uns
- thermosettable mixture suitable for curing by exposure to low levels of ionizing radiation comprising a mixture of a polymerizable vinyl ester resin and a nonvolatile vinyl monomer selected from the group consisting of vinyl carboxylic acids, vinyl nitriles, vinyl amides, alkyl and hydroxyalkyl esters of vinyl carboxylic acids wherein the alkyl group contains from 1 to 8 carbons, and mixtures thereof, said mixture having added thereto about 2 to 5 weight percent based on the weight of the mixture of a nitrogen containing compound selected from the group consisting of 2- oxazolines, guanidines and amines having the formula R R R N where R, is an alkyl or aralkyl group, R is hy drogen and R each may be hydrogen or an alkyl group or R, and R together may be a cyclic alkylene radical or an oxydialykylene radical; and wherein said polyrnerizable vinyl ester resin is prepared by reacting essentially equivalent amounts of
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Abstract
The addition of about 2 to 5 weight percent of certain amines to a thermosettable mixture of certain vinyl monomers and a polymerizable vinyl ester resin reduces the dosage level of ionizing radiation required to cure the mixture.
Description
United States Patent 1 1 1111 3,882,003
Mani et al. May 6, 1975 VINYL ESTER RESIN AND PROCESS FOR [56] References Cited RADIATION THE PRESENCE OF 2,673,l51 3/1954 Gerhart 96/1 15 P AMINES 3,301,143 1/1961 Fekete 61 al. 260/837 R Inventors: Inder Mani Midland Mich Bearden R 1 3,420,914 1/1969 May 260/837 R Asslgneei The Dow Chemical p y 3,669,911 6/1912 Najvar 260/2.5 N
Midland, Mich. 3,676,398 1/1912 D'AlellO 260/837 R 3,683,045 8/1972 Baldwin 260/837 R [22] Filed: Aug. 27, 1973 [21] Appl. No.: 391,108 Primary Examiner-Murray Tillman Related Application Data Assistant ExammerR1chard B. Turer Attorney, Agent, or Firml-l. L. Aamoth [62] D1v1s|0n of Ser. No. 142,853, May 13, 1971, Pat. No.
[57] ABSTRACT [52] Cl 204/159'16; 1 7/9331; 1 17/132 B; The addition of about 2 to 5 weight percent of certain 117/82 BE; 7H6! 23; 117/161 Uzi amines to a thermosettable mixture of certain vinyl 204/ 59-15; 204/ 159193 204/159'233 monomers and a polymerizable vinyl ester resin re- 204/ 15918; 260/836; 260/837 R duces the dosage level of ionizing radiation required [51] Int. Cl. C08! 1/00; COSf 1/00 to cure the mixture [58] Field of Search 260/836, 837 R;
204/159.15, 159.19, 159.16 8 Claims, No Drawings VINYL ESTER RESIN AND PROCESS FOR CURING SAME WITH IONIZING RADIATION IN THE PRESENCE OF AMINES This is a division of application Ser. No. 142,853, filed May 13, 1971, now U.S. Pat. No. 3,816,283.
BACKGROUND OF THE INVENTION This invention relates to the field of ionizing radiation cure of polymerizable materials and to coatings of same and especially relates to a promoter to reduce the ionizing radiation level or dosage necessary to effect a cure of said materials.
From a commercial standpoint radiation curing offers a number of advantages over thermal catalystinitiated cures: immediate initiation of polymerization, extended pot-life of the curable materials, little temperature rise so heat sensitive substrates may be employed in coatings, better control of the polymerization reaction, superior substrate-coating bonds are produced and much higher concentrations of radicals may be produced instantaneously. However, these advantages are difficult to realize if the curable materials require high curing doses of ionizing radiation since the economics become prohibitive. Commercialization then depends on reducing the cost of the curing process by finding methods and materials to effect a cure at lower dosages.
The search for means to accelerate or promote radiation curing is evident by a number of patents relating to certain polymerizable materials. While neither the promoters or the polymerizable materials employed correspond in any way to this invention, patents representative of such efforts include US. Pat. Nos. 3,202,5l3; 3,251,759; 3,265,604; 3,352,771 and 2,979,446. Commercially it is desirable to be able to cure at dosages of no more than 2 to 3 megarads but it would be of great advantage to be able to cure at l megarad or even less.
SUMMARY OF THE INVENTION According to this invention the curing dosage of ionizing radiation required to cure in an inert atmosphere a mixture of certain vinyl monomers and a polymerizable vinyl ester resin is reduced by adding to the mix ture at least 0.3 weight percent of certain nitrogen containing materials.
The vinyl ester resin is prepared by reacting essentially equivalent amounts of an unsaturated monocarboxylic acid, such as methacrylic acid, with a polyepoxide of a polyhydric phenol having more than one epoxide group per molecule. The nitrogen materials include 2-oxazolines, guanidines and certain amines which are more fully described hereafter.
DESCRIPTION OF THE INVENTION Vinyl ester resins are a newer class of thermosettable resins which may be generally defined as a reaction product of an unsaturated monocarboxylic acid with a polyepoxide resin having more than one epoxide or oxirane group per molecule. The reactants are usually combined in about equivalent proportions of acid to epoxide groups, whereby the reaction of said acid with said epoxide produces a terminal polymerizable group connected to the polymer chain by linkages. A vinyl ester resin prepared by reacting about equivalent amounts of acrylic acid with a diglycidyl ether of bisphenol A may be illustrated by the following formula:
I cn -cu-c-ocu encn o Q (011 The general methods by which vinyl ester resins may be prepared are thoroughly described in the patent literature. Representative patents which describe the resins and their preparation include US. Pat. Nos. 3,066,112; 3,179,623; 3,256,226; 3,301,743 and 3,377,406.
For this invention useful polymerizable vinyl ester resins include those which are prepared by reacting an unsaturated monocarboxylic acid with a polyepoxide of a polyhydric phenol wherein the polyepoxide has an epoxide equivalent weight of about up to 1000 and even higher. Said polyepoxides are made by reacting at least about two moles of an epihalohydrin, such as epichlorohydrin, with one mole of a polyhydric phenol and a sufiicient amount of an alkali to combine with the halogen of the halohydrin. Polyhydric phenols include the familiar bisphenol A as well as p,p'- dihydroxydiphenyl, p,p'-dihydroxyphenyl sulfone p,p'-dihydroxybenzophenone, p,p'-dihydroxydiphenylmethane, the various other position isomers of the above polyhydric phenols, polyhydric phenolic formaldehyde condensation products (novolac resins) and the like. Mononuclear phenols such as resorcinol, catechol, hydroquinone, phloroglucinol and the like may also be employed. The polyepoxides are characterized in having more than one epoxide group per molecule.
Unsaturated monocarboxylic acids useful in preparing vinyl ester resins have the formula where R, may be hydrogen, chlorine, bromine or phenyl and R, may be hydrogen, chlorine, bromine or a lower alkyl group of l to 4 carbon atoms. Said acids include acrylic acid, methacrylic acid, cinnamic acid, a-chloroacrylic acid and the like.
Various catalysts may be used in the preparation of vinyl ester resins. Catalysts include tertiary amines such as tris(dimethylaminomethyl)phenol, onium catalysts, triphenyl stibine and triphenyl phosphine and the like. Usually hydroquinone or other like polymerization inhibitors are added to prevent polymerization during the preparation of the resin.
According to this invention the polymerizable materials comprise a mixture of said vinyl ester resin with certain copolymerizable vinyl monomers. Only certain monomers may be employed with this invention provided the monomers are essentially nonvolatile. By this it is meant to exclude monomers which are predominantly gases at ambient temperatures. It is obvious that if the monomer is too volatile a substantial portion of the monomer would evaporate from a film or coating before the mixture of monomer and resin could be cured. Monomers which are normally liquid at room temperature may be used even though there may be a small loss of monomer by evaporation. It is possible to operate the process of this invention under higher pressures than atmospheric pressure to minimize any loss of said normally liquid monomers.
Useful monomers meeting the above requirements include both monoand polyunsaturated monomers. Polymerizable monounsaturated monomers include vinyl carboxylic acids such as acrylic and methacrylic acid; vinyl nitrile monomers such as acrylonitrile and methacrylonitrile; alkyl and hydroxyalkyl esters of vinyl carboxylic acids such as methyl acrylate, butyl acrylate, cyclohexyl methacrylate, hydroxyethyl methacrylate, hydroxypropyl acrylate, hydroxybutyl methacrylate and the like where the alkyl group contains from 1 to about 8 carbon atoms; vinyl amide monomers such as acrylamide, diacetone acrylamide and the like; and mixtures thereof. Aromatic monomers such as styrene are inoperative with this invention.
A variety of polyunsaturated polymerizable monomers within the above classes may be used including ethylene glycol dimethacrylate, trimethylol propane trimethacrylate, methylene bisacrylamide and other similar monomers.
The polymerizable materials of this invention are especially useful in coating various substrates such as metal, wood and the like either as a primer coating andlor a finished coating. In order to obtain the benefits of this invention at least 0.3 weight percent of the nitrogen containing material is added to the polymerizable materials. While quite large amounts of the nitrogen containing material may be added there is no advantage in doing so. Preferably the amount ranges from about 0.5 to 10 weight percent and most preferably from about 2 to 5 weight percent.
When employed as coating formulations other additives may be incorporated into the coating, for example, various inert fillers and pigments such as kaolin clay, titanium dioxide, silica, various inorganic oxides and the like. Films cast from the coating formulations may be rapidly cured by exposing them in an inert atmosphere to ionizing radiation (accelerated particulate radiation). A beam intensity of at least 50 microam peres is usually employed, but this invention is not limited thereto and lower beam intensities may be employed.
Generally the films or coatings will range in thickness from about 0.1 mil up to about mils. However, depending on the accelerating voltage, thicknesses up to 250 mils or higher are feasible. The radiation curing step should be performed in an inert atmosphere. By this it is meant an atmosphere which is essentially free of oxygen since the presence of oxygen may result in an undesirable tacky surface. It is sufficient for this purpose to place a thin film of a plastic material such as a polyester (Mylar) film on the cast film or coating.
Other means may be used such as curing in a chamber containing an essentially oxygen free atmosphere such as nitrogen, helium, argon and the like.
Accelerated particulate (ionizing) radiation includes particles such as electrons, protons, deuterons, other ions and the like. However, from an industrial standpoint, the cost and availability of machines limit ionizing radiation curing to accelerated electrons for the immediate future. A variety of devices are available to provide accelerated electron radiation or varying voltages and beam intensities. Typical of such devices is the familiar Van de Graaff accelerator. Similar commercial accelerators utilizing various acceleration means are available from Texas Nuclear Corporation, (cascade rectified system) High Voltage Engineering, (insulated core transformer system) General Electric (a resonant transformer design) and Radiation Dynamics, Inc. (radio frequency cascade rectifier system).
Nitrogen containing materials include 2-oxazolines, guanidines and certain amines. The 2-oxazolines include 2-oxazoline itself, and substituted 2-oxazolines having the formula wherein R and R" may be hydrogen, ethyl, methyl, phenyl and the like. R may be an alkyl, aryl, aralkyl group or hydrogen. Such substituted oxazolines include 2-methyl-2-oxazoline, 2,S-diphenyl-Z-oxazoline; 2- phenyl, 5-methyl-2-oxazoline; 2-methyl, 5-phenyl-2- oxazoline and the like. Also included within the term 2-oxazolines are the bis oxazolines such as 2,2- tetramethylene bis(2-oxazoline), 2,2'-oxydiethylene bis(2-oxazoline; 2,2 thiodiethylene bis(2-oxazoline) and the like. Guanidines include guanidine, tetramethyl guanidine and the like.
Amines which may be employed have the formula R,R R N wherein R, may be an alkyl or an aralkyl group, R and R each may be hydrogen or an alkyl group or R, and R together may be a cyclic alkylene radical or an oxydialkylene radical. Alkyl groups include methyl, ethyl, propyl, n-butyl, isobutyl and higher alkyl groups. Typical amines include mono-, diand trin butyl amine, di-isobutyl amine, triethyl amine, cyclohexylamine, benzyl amine, morpholine, piperidine and the like.
The following non-limiting examples will further illustrate the invention. All parts and percentages are by weight unless otherwise specified.
EXAMPLE 1 A vinyl ester resin was prepared by reacting methacrylic acid (3 l%) with a glycidyl polyether of bisphenol A having an epoxide equivalent weight (EEW) of 186-192 (D.E.R. 331). The vinyl ester resin was then mixed with n-butyl acrylate in the proportions of 2/1 and to this resin was then added 3% of various nitrogen containing compounds, based on weight of resin and monomer. A film was cast with a 7 mil draw-down bar on a Q-panel (4 X l2 X 0.03 inch) and covered with a 2 mil sheet of Mylar (polyester) film to exclude air. The coated polished steel Q panel was then passed through a 2 Mev electron beam from a Van de Graaf accelerator filtered with 0.33 gm/cm A1. A 50 microampere beam current and a conveyor speed of 3.4 cm/sec delivered a dose of 0.1 Megarad (Mrad) for each pass through the beam.
Without any accelerator the resin required 0.5 megarads (Mrad) to cure. While this dose level is already low, the addition of di-n-butyl amine reduced the dosage required to 0.1-0.2 Mrad. Similarly, when tetramethylguanidine and 2-oxazoline were employed as the accelerators the dosage was reduced to 0.2 and 0.4 Mrad, respectively. Tests made with styrene in place of the butyl acrylate failed to evidence the reduction in curing dosage.
EXAMPLE 2 When the resin of the previous example was mixed with 2-hydroxyethyl acrylate (50/50), the mixture required 0.3 Mrad to cure. Even at this low dosage the addition of 3% by weight of dibutyl amine reduce the dosage to cure to 0.15 Mrads.
EXAMPLE 3 Another vinyl ester resin made by reacting methacrylic acid (32.0%) with a mixture of D.E.R. 331 (17.7%) and an epoxy novolac (50.3%) having an EEW of 175-182 was mixed with n-butyl acrylate (2/1 and tested as in Example 1. Without an accelerator 0.5-0.6 Mrad was required to cure the mixture. The addition of 3% of di-n-butyl amine, 2-oxazoline or tetramethylguanidine reduced the dosage to cure to 0.2, 0.4 and 0.3 Mrad, respectively.
EXAMPLE 4 The resin of Example 3 was mixed with 2-hydroxyethyl-acrylate 50/50 and the curing dosage was reduced from 0.3 to 0.15 Mrad.
EXAMPLE 5 A further series of tests were run with the vinyl ester resin of Example 1 mixed with different monomers and employing various accelerating materials of the invention. The curing dose in Mrad for each of the various combinations employing the procedure of Example 1 is shown below.
Curing Dose, Mrad Resin of Example 1 mixed with Similar to Example 5 another series of tests were made with the resin of Example 3 with the following results.
Curing Dose, Mrad Resin of Example 3 mixed with lt will be understood that the present invention is not limited to the specific materials, steps and other specific details described above but may embody various modifications insofar as they are defined in the following claims.
What is claimed is:
l. A process for curing a mixture of a polymerizable vinyl ester resin and a nonvolatile vinyl monomer selected from the group consisting of vinyl carboxylic acids, vinyl nitriles, vinyl amides, alkyl and liydroxyalkyl esters of vinyl carboxylic acids wherein the alkyl group contains from 1 to 8 carbons, and mixtures thereof, said process comprises exposing said mixture in an inert atmosphere to ionizing radiation, said mixture having added thereto about 2 to 5 weight percent based on the weight of the mixture of an amine having the formula R,R R N where R, is an alkyl or aralkyl group, R is hydrogen and R may be hydrogen or an alkyl group or R and R together may be a cyclic alkylene radical or an oxydialkylene radical; and wherein said vinyl ester resin is prepared by reacting essentially equivalent amounts of a polyepoxide of a polyhydric phenol having more than one epoxide group per molecule with an unsaturated acid having the formula where R, is chlorine, bromine, hydrogen or phenyl and R is hydrogen, chlorine, bromine or a loweralkyl group of l to 4 carbon atoms.
2. The process of claim 1 wherein said polyhydric phenol is bisphenol A, a novolac resin or mixtures thereof.
3. The process of claim 1 wherein said unsaturated acid is acrylic acid or methacrylic acid.
4. The process of claim 1 wherein R in the amine formula is hydrogen.
5. A thermosettable mixture suitable for curing by exposure to low levels of ionizing radiation comprising a mixture of a polymerizable vinyl ester resin and a nonvolatile vinyl monomer selected from the group consisting of vinyl carboxylic acids, vinyl nitriles, vinyl amides, alkyl and hydroxyalkyl esters of vinyl carboxylic acids wherein the alkyl group contains from 1 to 8 carbons, and mixtures thereof, said mixture having added thereto about 2 to 5 weight percent based on the weight of the mixture of a nitrogen containing compound selected from the group consisting of 2- oxazolines, guanidines and amines having the formula R R R N where R, is an alkyl or aralkyl group, R is hy drogen and R each may be hydrogen or an alkyl group or R, and R together may be a cyclic alkylene radical or an oxydialykylene radical; and wherein said polyrnerizable vinyl ester resin is prepared by reacting essentially equivalent amounts of a polyepoxide of a polyhydric phenol having more than one epoxide group per molecule and an unsaturated acid having the formula where R, is hydrogen, chlorine, bromine or phenyl and R is hydrogen, chlorine, bromine or a lower alkyl group of l to 4 carbon atoms.
6. The mixture of claim 5 wherein said polyhydric phenol is bisphenol A, a novolac resin or mixtures thereof.
7. The mixture of claim 5 wherein said unsaturated acid is acrylic acid or methacrylic acid.
8. The mixture of claim 5 wherein R in the amine formula is hydrogen.
Claims (8)
1. A PROCESS FOR CURING A MIXTURE OF A POLYMERIZABLE VINYL ESTER RESIN AND A NONVOLATILE VINYL MONOMER SELECTED FROM THE GROUP CONSISTING OF VINYL CARBOXYLIC ACIDS, VINYL NITRILES, VINYL AMIDES, ALKYL AND HYDROXYALKYL ESTERS OF VINYL CARBOXYLIC ACIDS WHEREIN THE ALKYL GROUP CONTAINS FROM 1 TO 8 CARBONS, AND MIXTURES THEREOF, SAID PROCESS COMPRISES EXPOSING SAID MIXTURE IN AN INERT ATMOSPHERE TO IONIZING RADIATION, SAID MIXTURE HAVING ADDED THERETO ABOUT 2 TO 5 WEIGHT PERCENT BASED ON THE WEIGHT OF THE MIXTURE OF AN AMINE HAVING THE FORMULA R1R2R3N WHERE R1 IS AN ALKYL OR ARALKYL GROUP, R2 IS HYDROGEN AND R3 MAY BE HYDROGEN OR AN ALKYL GROUP OR R1 AND R3 TOGETHER MAY BE A CYCLIC ALKYLENE RADICAL OR AN OXIDIALKYLENE RADICAL; AND WHEREIN SAID VINYL ESTER RESIN IS PREPARED BY REACTING ESSENTIALLY EQUIVALENT AMOUNTS OF A POLYEPOXIDE OF A POLYHYDRIC PHENOL HAVING MORE THAN ONE EPOXIDE GROUP PER MOLECULE WITH AN UNSATURATED ACID HAVING THE FORMULA R1-CH=C(-R2)-COOH WHERE R1 IS CHLORINE, BROMINE, HYDROGEN OR PHENYL AND R2 IS HYDROGEN, CHLORINE, BROMINE OR A LOWERALKYL GROUP OF 1 TO 4 CARBON ATOMS.
2. The process of claim 1 wherein said polyhydric phenol is bisphenol A, a novolac resin or mixtures thereof.
3. The process of claim 1 wherein said unsaturated acid is acrylic acid or methacrylic acid.
4. The process of claim 1 wherein R3 in the amine formula is hydrogen.
5. A thermosettable mixture suitable for curing by exposure to low levels of ionizing radiation comprising a mixture of a polymerizable vinyl ester resin and a nonvolatile vinyl monomer selected from the group consisting of vinyl carboxylic acids, vinyl nitriles, vinyl amides, alkyl and hydroxyalkyl esters of vinyl carboxylic acids wherein the alkyl group contains from 1 to 8 carbons, and mixtures thereof, said mixture having added thereto about 2 to 5 weight percent based on the weight of the mixture of a nitrogen containing compound selected from the group consisting of 2-oxazolines, guanidines and amines having the formula R1R2R3N where R1 is an alkyl or aralkyl group, R2 is hydrogen and R3 each may be hydrogen or an alkyl group or R1 and R3 together may be a cyclic alkylene radical or an oxydialykylene radical; and wherein said polymerizable vinyl ester resin is prepared by reacting essentially equivalent amounts of a polyepoxide of a polyhydric phenol having more than one epoxide group per molecule and an unsaturated acid having the formula
6. The mixture of claim 5 wherein said polyhydric phenol is bisphenol A, a novolac resin or mixtures thereof.
7. The mixture of claim 5 wherein said unsaturated acid is acrylic acid or methacrylic acid.
8. The mixture of claim 5 wherein R3 in the amine formula is hydrogen.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US391108A US3882003A (en) | 1971-05-13 | 1973-08-27 | Vinyl ester resin and process for curing same with ionizing radiation in the presence of amines |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US00142853A US3816283A (en) | 1971-05-13 | 1971-05-13 | Radiation polymerizable vinyl ester resins containing 2-oxazoline and guanidine additives |
| US391108A US3882003A (en) | 1971-05-13 | 1973-08-27 | Vinyl ester resin and process for curing same with ionizing radiation in the presence of amines |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US4091050A (en) * | 1976-01-27 | 1978-05-23 | Ppg Industries, Inc. | Method for the preparation of mixtures of (meth)acrylic terminated polyether resin and 3-halo-2-hydroxypropyl (meth)acrylate |
| US4108803A (en) * | 1976-03-23 | 1978-08-22 | Ciba-Geigy Corporation | Photopolymerizable epoxy resins containing pendant unsaturated ester or amidomethyl groups |
| US4233425A (en) * | 1978-11-15 | 1980-11-11 | The Dow Chemical Company | Addition polymerizable polyethers having pendant ethylenically unsaturated urethane groups |
| US4293672A (en) * | 1980-06-27 | 1981-10-06 | Shell Oil Company | Process for stabilizing polyester compositions |
| US4798877A (en) * | 1985-04-08 | 1989-01-17 | The Dow Chemical Company | Radiation-curable resins |
| US4935454A (en) * | 1986-09-26 | 1990-06-19 | Amp Incorporated | Broad spectrum light and heat curable sealant composition and method of using same |
| US5395269A (en) * | 1985-07-01 | 1995-03-07 | The Whitaker Corporation | Method of sealing electrical connectors using a broad spectrum light and heat curable composition |
| US10189188B2 (en) * | 2016-05-20 | 2019-01-29 | Canon Kabushiki Kaisha | Nanoimprint lithography adhesion layer |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US4091050A (en) * | 1976-01-27 | 1978-05-23 | Ppg Industries, Inc. | Method for the preparation of mixtures of (meth)acrylic terminated polyether resin and 3-halo-2-hydroxypropyl (meth)acrylate |
| US4108803A (en) * | 1976-03-23 | 1978-08-22 | Ciba-Geigy Corporation | Photopolymerizable epoxy resins containing pendant unsaturated ester or amidomethyl groups |
| US4233425A (en) * | 1978-11-15 | 1980-11-11 | The Dow Chemical Company | Addition polymerizable polyethers having pendant ethylenically unsaturated urethane groups |
| US4293672A (en) * | 1980-06-27 | 1981-10-06 | Shell Oil Company | Process for stabilizing polyester compositions |
| US4798877A (en) * | 1985-04-08 | 1989-01-17 | The Dow Chemical Company | Radiation-curable resins |
| US5395269A (en) * | 1985-07-01 | 1995-03-07 | The Whitaker Corporation | Method of sealing electrical connectors using a broad spectrum light and heat curable composition |
| US4935454A (en) * | 1986-09-26 | 1990-06-19 | Amp Incorporated | Broad spectrum light and heat curable sealant composition and method of using same |
| US10189188B2 (en) * | 2016-05-20 | 2019-01-29 | Canon Kabushiki Kaisha | Nanoimprint lithography adhesion layer |
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