US3819502A - Line- and spotplating machine - Google Patents
Line- and spotplating machine Download PDFInfo
- Publication number
- US3819502A US3819502A US00256847A US25684772A US3819502A US 3819502 A US3819502 A US 3819502A US 00256847 A US00256847 A US 00256847A US 25684772 A US25684772 A US 25684772A US 3819502 A US3819502 A US 3819502A
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- recited
- metal strip
- wheel
- plating
- ring
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- Expired - Lifetime
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 122
- 239000002184 metal Substances 0.000 claims abstract description 122
- 238000005868 electrolysis reaction Methods 0.000 claims abstract description 72
- 238000007747 plating Methods 0.000 claims abstract description 53
- 239000003792 electrolyte Substances 0.000 claims abstract description 45
- 239000013013 elastic material Substances 0.000 claims description 10
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- 230000001105 regulatory effect Effects 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 5
- 238000001914 filtration Methods 0.000 claims description 4
- 239000012530 fluid Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 239000012780 transparent material Substances 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 2
- 239000012811 non-conductive material Substances 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 238000011144 upstream manufacturing Methods 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 23
- 229910052737 gold Inorganic materials 0.000 description 23
- 239000010931 gold Substances 0.000 description 23
- 239000000463 material Substances 0.000 description 10
- 238000009713 electroplating Methods 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 238000007792 addition Methods 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
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- 239000004020 conductor Substances 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- -1 phosphorbronze Substances 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920005439 Perspex® Polymers 0.000 description 1
- 241001363516 Plusia festucae Species 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
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- 230000008021 deposition Effects 0.000 description 1
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- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 1
- 239000010956 nickel silver Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- KXXXUIKPSVVSAW-UHFFFAOYSA-K pyranine Chemical compound [Na+].[Na+].[Na+].C1=C2C(O)=CC(S([O-])(=O)=O)=C(C=C3)C2=C2C3=C(S([O-])(=O)=O)C=C(S([O-])(=O)=O)C2=C1 KXXXUIKPSVVSAW-UHFFFAOYSA-K 0.000 description 1
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- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0671—Selective plating
Definitions
- ABSTRACT Apparatus for continuously plating metal on a metal strip including a plating wheel defining an electrolysis chamber with an annular slot opening at the periphery thereof, an anode mounted on the plating wheel in the electrolysis chamber, a closed system for supplying electrolyte to the electrolysis chamber, and a shoulder on the periphery of the wheel to receive a metal strip to be plated, the metal strip closing at least a portion of the slot opening to define a wall of the electrolysis chamber and functioning as a cathode such that the [56] References Cited UNITED STATES PATENTS metal strip has a metal pattern plated on the side supported on the shoulder.
- Gold is used because (a) it has excellent corrosion resistance, (b) it has very good electrical properties, (c) it can be easily cold-welded and soldered, etc. A good corrosion-resistance guarantees a long existance of properties named under (b) and (c).
- methods have been developed by certain companies for functional plating. In many cases, however, such methods increase labor costs dramatically.
- stripmetal e.g. brass, phosphorbronze, nickel silver etc.
- Such stripmaterial is usually up to 100 mm wide and between 0,1 and 1 mm thick.
- Such a material could be provided with a gold line in such a way that during the stamping operation of the component the gold would be exactly on the functional area, an important saving of costly gold could be obtained.
- Such material is commercially available under names as rolled gold, double or walz gold.
- Electroplating of gold offers the possibility to obtain similar properties of hardness and wear resistance with co-deposition of only minor amounts of other metals (0.1 1 percent). It is even possible to obtain hardnesses of 300 VH with gold with a min. purity of 99.99 percent.
- electroplating can be applied in any desired thickness.
- the purpose of the invention is to provide an apparatus for plating lines or spots on metal strips in a continuous way.
- the complete apparatus includes, as usual in electroplating, of a pre-treatment sequence, in which it is also possible to apply thin undercoatings.
- Such undercoatings of the entire strip nickel is the most preferred metal for this purpose have a dual function. They avoid diffusion of gold into the base material, and corrosion of those parts of the strips which are not goldplated.
- the invention provides an apparatus of a type as mentioned above with'the characteristic that the apparatus has a plating wheel including sides defining an electrolysis chamber which discharges in a slot at the periphery of the wheel, which slot has at least a portion thereof closed by a strip on which the metal pattern is to be plated, said strip covering a part of the circumference of the wheel and being transported with a certain velocity and hence driving the wheel, whereby there are a suitable electrolyte and an anode in said electrolysis chamber and whereby the strip serves as a cathode, with the result that when leaving the circumference of the wheel the strip will be coated with the desired metal pattern on that side which has been previously engaged with the wheel.
- the apparatus is also provided with a tension regulator which guarantees leakproof engagement of every type of a strip on to the wheel.
- the apparatus of the invention as hitherto described has been designed for electroplating metal patterns on a full metal strip which logically closes the circular electrolysis chamber entirely.
- the apparatus in this condition is not suitable for plating patterns on perforated strips because the electrolyte of the electrolysis chamber would flow away through the perforations in the metal strip.
- the present invention has also for its object to provide means for plating perforated metal strips e.g.
- an apparatus for continuously plating of line-or spot metal patterns in particular precious metal on metal strips which apparatus has a wheel in which an electrolysis chamber, which discharges into a slot in the circumference of the wheel or into a perforated rim, can be covered over a part of the circumference of the wheel by the strip on which the metal pattern must be plated, which strip engages with a part of the circumfer'ence of the wheel and is transported at a certain velocity and so drives the wheel, whereby there are a suitable electrolyte and an anode inside the electrolysis chamber, and whereby the strip acts as cathode with the result that said strip on leaving the wheel will be plated with the desired metal pattern on that side which has been previously engaged with the wheel, with the improvement that the apparatus for electroplating perforated metal strip has also an endless carrier band which is lead over a number of rollers and is in engagement with the same or a smaller part of the circumference of the wheel than the metal strip to
- This carrier band is preferably made from a base material which is strong and has low elasticity, coated with a top layer of elastic material. It is evident that the carrier band will be used in such a way that the elastic coating is engaged with the perforated metal strip.
- the electrolysis wheel includes two rings which can rotate on a stationary shaft on bearings spaced at a certain distance, which rings also enclose the ring-shaped electrolysis chamber and, as a further extension of the invention, one of these rings has nearby its circumference an axial rim which is also attached to the edge of the other ring, said rim carrying the metal strip to be plated and having a number of holes which define the discontinuous slot and function as the mask or mold, and determine shape and location of the metal spots to be plated on to the strip.
- This rim forms a sufficiently strong base for the perforated metal strip and the carrier band. It is evident that the outside of the rim should be made of elastic material to prevent leakage.
- the carrier band will be wetted through the perforations in the metal strip with electrolyte and hence can wet the metal strip to be plated at the back side and form substitution stains on said metal strip when it comes anew in contact with the backside of the metal strip.
- a rinsing stage through which the carrier band runs after having served its purpose and before it is reused.
- FIG. 1 is a schematic view of the complete plating unit
- FIG. 2 is a schematic side view of the apparatus of FIG. 1 embodying the present invention
- FIG. 3 is a view, partly sectioned through line III-III over the electrolysis wheel used in FIG. 2,
- F IG. 4 is a view partly sectioned through line IVIV over the wheel of FIG. 3,
- FIG. 5 is a view of a piece of strip plated with a gold line with the apparatus according to this invention.
- FIG. 6 is an illustration of the mold with which spots can be plated instead of a continuous line
- FIG. 7 is a section through line VII-VII of FIG. 1 over an adjustable tension regulator which controls the tension in the metal strip,
- FIG. 8 is a partial section similar to FIG. 6 showing a variation of the apparatus of this invention for the application of two metal lines simultaneously,
- FIG. 9 shows a schematic sideview of the apparatus of this invention
- FIGS. 10a and 10b show a section and topview, respectively, of the carrier band
- FIG. 11 is a section along line III-III of FIG. 9,
- FIG. 12 is a side view and partially a section of the wheel of FIG. 11,
- FIG. 13 is a partial section along the line VV of FIG. 12 and FIG. 14 is a top view of the perforated metal strip which hasbeen plated with gold spots with the apparatus of this invention.
- FIG. 1 shows the entire electroplating apparatus.
- a stock of strip 4 to be plated On the decoiling structure 42 is a stock of strip 4 to be plated.
- This strip runs through an adjustable tension regulator 43, a pre-treatment section 44, the apparatus of this invention 1, an after-treatment section 45, a drive unit 46 with variable speed control, including a socalled S-roll, which pulls the strip without slip, a second adjustable tension regulator 47 which controls the tension under which the plated strip 4 will be coiled on reeling apparatus 48.
- the heart of this electroplating apparatus is shown in FIG. 2.
- This apparatus mainly comprises an electrolysis plating wheel 1 over the circumference of which the pre-treated and now partially to be plated strip 4 is lead by means of two guiding rollers 37 and 38.
- FIG. 3 shows the section of the shaft of wheel 1, of FIG. 2, along the line IIIIII.
- the supports of which are not further indicated, two ring members 8 and 9 are positioned in a revolving situation.
- Ring 8 has bearings with ring 26, which has an L-shaped section, and with ring 28, which rings are positioned by nut 31 on shaft 10.
- Ring 9 has a bearing on ring 27, which has an L-shaped section, and also in a disc-shaped ring 29, which rings are positioned by nut 32.
- the two flat rings 28 and 29 hold between them the electrolysis distributor 23.
- the complete assembly is fixed on shaft by ridge on shaft 10.
- the electrolysis distributor 23 is first pushed on the shaft against ridge 30 after which ring 29, ring 9 and finally ring 27 are mounted, after which the total assembly is fixed by means of nut 32.
- the width of the slot 3 at the outside of the wheel, ie at the side adjacent to the strip 4, is larger than at the inner side, i.e. the side oriented towards the electrolysis chamber 2.
- the edges of the metal pattern to be deposited is somewhat screened by the material of the rings 8 and 9, so that an accelerated metal deposition at said edges is counteracted and a uniform layer thickness is achieved.
- the electrolysis chamber 2 is formed by the two rings 8 and 9 and in this electrolysis chamber 2 an anode is positioned in the form of an isoluble platinum plated titanium strip annulus 6 having a large number of small holes therein and, functions therefore also as an electrolysis distributor.
- Anode 6 is connected to the titanium wire 25, shown in the upper portion of FIG. 3, and wire 25 extends through the slot between ring 27 and 28 to the exterior.
- an anode such as metal pellets in two anode compartments attached to the sides of distributor 23 in which case the outside of the electrolysis distributor 23 should be of plastic.
- the electrolyte electrolysis distributor 23 is provided with a number of radial channels 24 defined by radially extending ribs.
- the electrolyte 5 is supplied to the wheel through pipe 22 (see also FIG. 2) from which it flows into the interior 33 of shaft 10.
- radial channels 34 are present enabling the electrolyte to flow into the circular space between shaft 10 and the inside of the electrolysis distributor. From this ringshaped space 40 the electrolyte flows through radial channels 24 in the electrolysis distributor 23 and through the perforations in the electrolysis distributor- /anode 6 with force into the ring-shaped electrolysis chamber 2 against strip 4, from which it overflows through perforations 17 in rings 8 and 9.
- the level of the electrolyte in chamber 2 is controlled by the position of valve 41 (see FIG. 2).
- the thickness of the electroplated stripes 7 can be adjusted by means of the speed of strip 4, the concentration of the electrolyte 5, and the current as supplied by the source of current (not indicated in drawing) to which anode 6 and strip 4 acting as a cathode are connected.
- the positioning of the anode, and the injection system with respect to the strip allows an extremely rapid metal deposition.
- the adjustment rings 11 and 12 enclose strip 4 in such a way that it is impossible that electrolyte overflowing through hole 17 along the outside of rings 8 and 9 could reach the backside of strip 4 with the effect that the strip will remain dry at that side, and that no metal deposition will take place.
- spotplating of strip 4 is desired instead of the continuous line the leakage preventing elements 13 and 14 are replaced by a leakage preventing mold 15, as shown in FIG. 6, which carries strip 4. Strip will then only be plated at the location of the holes 16 in the mold.
- strip 4 when strip 4 must be plated with several parallel lines of the same or different materials the strip can be lead successively over separate apparatus in succession of which adjustment rings 11 and 12 being so positioned that each successive pattern is plated on the desired location. If required, patterns can be plated on top of each other. If, however, the uncoated area between two parallel plated stripes is larger than 5 mm a rim ring 53 can be introduced between rings 8 and 9, as shown in FIG. 8, adjustable on threaded bars 56 between rings 8 and 9, and carrying at its circumference, one or more leakage preventing elements 54 and 55. Such a rim ring 53 does not prevent free flowing of the electrolyte and can be positioned on bars 56 at any desired place. Very wide strips can be plated with several rim rings with more than two stripes in one operation.
- FIG 7 a section is shown of the tension regulator 43 of FIG. 1.
- Strip 4 is guided in the regulator over three rollers, the two top ones, of which one 50 is visible, having a fixed position in frame 51, while the lower roller 49 can move vertically in frame 51.
- roller 49 actuates two limit switches which control the drive motor of decoiling apparatus 42, see FIG. 1: in the top position of roller 49 the motor is switched on and in the lower position the motor is switched off.
- the strip 1 to be plated comes from a pretreatment line not indicated in the drawing towards the first roller 37, then over the actual electrolysis wheel 1 and continues over the second guiding roller 38 towards an after-treatment sequence which again is not indicated. Pre-treatment and after-treatment are no part of this invention and are for this reason not shown.
- the electrolysis wheel 1 is again rotable on the shaft, placed in the tank 18, containing electrolyte 5.
- the electrolyte is drawn from this tank 5 through the suction pipe 21 by the pump 19 and transported through the filter/heat exchanger 20 and, valve 41 to the inside of shaft 11 into the electrolysis wheel 1 after which the electrolyte 5 overflows through the holes 17 in the sides of wheel 1 in tank 18.
- the level L of the electrolyte within the wheel 1 is controlled by valve 41 and is visible from the outside due to wheel 1 being made of a transparant non-conducting material.
- Tank 18 is mounted on the frame 39 which is attached to the floor.
- the metal strip 4 is transported in the direction of the arrow and drives the electrolysis wheel 1.
- carrier band 58 which is lead over four guiding rollers 60 up till 63 and driven by the revolving electrolysis wheel 1 itself.
- the carrier band 58 is kept under tension by a regulator assembly 64 including a pivotally mounted arm 66 carrying a pressure roller 68 at one end and an adjustment weight 70 at the other end.
- FIG. 10a shows carrier band 58 as constructed with a non-expandable base layer 72 and an elastic top layer 74, the latter layer contacting metal strip 4 during operation. Because the elastic side 74 of the carrier band is wetted with electrolyte through the perforations in metal strip 4, this could lead to formation of metal stains on the back side of metal strip 4. To avoid this, FIG. 9 shows a rinse assembly 76 which cleans the carrier band 58 before re-use.
- FIG. 11 shows a section of electrolysis wheel 1, again assembled over the stationary shaft 10 with an interior space 33.
- two rings 78 and 80 are mounted on bearings, each of these rings rotating in an L-shaped ring 26, 27 on a flat disk 28, 29, respectively.
- Disks 28 and 29 are fixed together by nuts 31, 32.
- an electrolysis distributor 23 having jets 82 is located, the jets operating as an anode.
- This anode 82 is connected by means of titanium wire 25 through holes in rings 27, 29 to a source of current.
- the electrolyte 5 is fed through the interior of shaft 10, the radial channels in the electrolysis distributor 23, and the jets 82 into the electrolysis chamber 2, and the electrolyte leaves the chamber again through holes 17 in rings 78, 80.
- the two rings 78, 80 are in this case not independently revolving, but ring 78 carries a rim 84 which is attached to ring 80 by bolts 46. This rim 84 carries a number of holes 88 which control the shape and position of the metal spots to be plated on the perforated metal strip 1.
- pilot pins 92, 94 which engage with pilot holes 96 in metal strip 4, as shown in FIGS. 13 and 14.
- carrier band 58 can, if desired, carry reference holes 98, as shown in FIG. 10!).
- FIG. 14 shows an example of the perforated metal strip in topview which can be plated automatically and continuously with spots in a machine of this invention. Such strips are frequently used for the manufacture of integrated circuits and the strip supplies in this way the conductors which only require functional gold plating.
- the plated areas are indicated in FIG. 14 by dotted squares 100.
- Apparatus for continuously plating metal on a metal strip comprising a plating wheel having sides defining an electrolysis chamber with an annular slot opening at the periphery of said wheel, anode means mounted on said plating wheel in said electrolysis chamber, electrolyte means supplied in said electrolysis chamber, shoulder means carried on the periphery of said wheel, and transport means supplying a metal strip to be plated to said wheel, said metal strip being sup ported on said shoulder means to close at least a portion of said slot opening to define a wall of said electrolysis chamber, said metal strip being connected as a cathode, said plating wheel including a shaft having an axis about which said wheel rotates, an electrolyte distributor including a ring-shaped chamber surrounding said shaft and a plurality of radial channels communicating with said ring-shaped chamber and with said electrolysis chamber, and jet means disposed at the point where said radial channels communicate with said electrolysis chamber for distributing said electrolyte in jets in said electrolysis chamber.
- said transport means includes a plurality of rollers and an endless carrier band engaging and carrying said metal strip and arranged around said rollers, said carrier band guiding said metal strip into engagement with said shoulder means to close at least said portion of said slot opening, and the side of said carrier band engaging said metal strip being made of an elastic material to prevent leakage from said electrolysis chamber.
- said transport means includes cleaning means for rinsing said carrier band after said carrier band leaves said plating wheel to remove electrolyte therefrom.
- said plating wheel includes a stationary shaft, first and second ring members mounted on bearings on said stationary shaft in spaced relation, a peripheral rim portion of said first ring member being attached to said second ring member, said rim portion having a plurality of holes therein to define said slot opening discontinuously to function as a mask for plating the metal pattern on said metal strip.
- said plating wheel includes a stationary shaft and said sides include a pair of ring members mounted on hearings on said shaft in spaced relation, the space between said rings defining said electrolysis chamber and said slot opening at the periphery of said rings.
- said plating wheel includes a rim ring disposed between said ring members at the periphery thereof, said shoulder means and said rim ring carrying annular sealing members to form a pair of openings to permit plating of two metal patterns simultaneously.
- said shaft has a bore therein and a plurality of radial holes communicating with said bore
- said ring members include radially extending ribs defining a ring-shaped chamber around said shaft communicating with said radial holes and defining a plurality of radial channels communicating with said ringshaped chambers and said electrolysis chamber
- said ring members having discharge holes therein
- said electrolyte means includes tank means disposed below said plating wheel to collect electrolyte, filtering and heating exchanging means, and supply means including a pump and valve means to controllably force a fluid electrolyte from said tank means through said filtering and heat exchanging means, said bore, said radial holes in said shaft, said ring-shaped chamber, said radial channels, said electrolysis chamber and said discharge holes to said tank means whereby the supply of electrolyte to said electrolysis chamber is continuously replenished.
- said plating wheel includes a pair of adjustment rings each carried by one of said ring members, said adjustment rings being axially adjustable along said shaft to determine the location on said metal strip of the metal pattern to be plated and to permit plating of metal strips of varying widths.
- said plating wheel includes a ring-like mold element made of elastic nonconductive material and having a plurality of holes therein, said mold element engaging said metal strip and said shoulder means whereby a spotted metal pattern can be plated on said metal strip.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL7107171A NL150860B (nl) | 1971-05-25 | 1971-05-25 | Om een vaste as draaibare elektrolytverdeelinrichting, alsmede metalen band voorzien van een metaallaag in een vlekpatroon, vervaardigd onder gebruikmaking van deze inrichting. |
NLAANVRAGE7109404,A NL170027C (nl) | 1971-05-25 | 1971-07-07 | Verbetering van een om een vaste as draaibare elektrolyt-verdeelinrichting. |
Publications (1)
Publication Number | Publication Date |
---|---|
US3819502A true US3819502A (en) | 1974-06-25 |
Family
ID=26644660
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US00256847A Expired - Lifetime US3819502A (en) | 1971-05-25 | 1972-05-25 | Line- and spotplating machine |
Country Status (8)
Country | Link |
---|---|
US (1) | US3819502A (nl) |
BE (1) | BE783967A (nl) |
CH (1) | CH576007A5 (nl) |
FR (1) | FR2139037B1 (nl) |
GB (1) | GB1396343A (nl) |
HK (2) | HK29180A (nl) |
IT (1) | IT955826B (nl) |
NL (1) | NL170027C (nl) |
Cited By (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3855108A (en) * | 1973-05-17 | 1974-12-17 | Duerrwaechter E Dr Doduco | Continuous strip electroplating apparatus |
US3962063A (en) * | 1974-12-18 | 1976-06-08 | Advanced Materials Systems, Inc. | Selective plating apparatus |
US3974056A (en) * | 1975-05-23 | 1976-08-10 | Ann Arbor Circuits, Inc. | Electroplating selected portions of a strip |
US3986945A (en) * | 1974-01-21 | 1976-10-19 | Galentan Ag | Device for the continuous application of strip-, ribbon- or spot-shaped coatings |
DE2615326A1 (de) * | 1975-06-14 | 1976-12-23 | Electroplating Eng | Verfahren und einrichtung zum selektiven plattieren |
US4014773A (en) * | 1974-07-31 | 1977-03-29 | Daiichi Denshi Kogyo Kabushiki Kaisha | Apparatus for electrolytic treatment |
US4030999A (en) * | 1975-10-06 | 1977-06-21 | National Semiconductor Corporation | Stripe on strip plating apparatus |
US4036725A (en) * | 1975-11-21 | 1977-07-19 | National Semiconductor Corporation | Wheel selective jet plating system |
US4264416A (en) * | 1973-10-04 | 1981-04-28 | Noz Francis X | Method for continuous application of strip ribbon or patch-shaped coatings to a metal tape |
US4388157A (en) * | 1981-03-07 | 1983-06-14 | Galentan Ag | Method of applying coverings in the form of completely or not completely closed loops |
US4431500A (en) * | 1981-12-15 | 1984-02-14 | Vanguard Research Associates, Inc. | Selective electroplating apparatus |
US4493757A (en) * | 1981-03-07 | 1985-01-15 | Galentan, A.G. | Device for applying blot-shaped coverings by electro-plating |
US4579831A (en) * | 1983-03-29 | 1986-04-01 | Chevron Research Company | Method of zeolitic catalyst manufacture |
US4880507A (en) * | 1987-12-10 | 1989-11-14 | Learonal, Inc. | Tin, lead or tin/lead alloy electrolytes for high speed electroplating |
US5069762A (en) * | 1991-01-18 | 1991-12-03 | Usx Corporation | Appartaus for improved current transfer in radial cell electroplating |
US5104510A (en) * | 1990-02-16 | 1992-04-14 | Texas Instruments Incorporated | Plating system |
US5174887A (en) * | 1987-12-10 | 1992-12-29 | Learonal, Inc. | High speed electroplating of tinplate |
US5242562A (en) * | 1992-05-27 | 1993-09-07 | Gould Inc. | Method and apparatus for forming printed circuits |
US5512154A (en) * | 1993-01-28 | 1996-04-30 | Meco Equipment Engineers B.V. | Apparatus for selectively electroplating apertured metal or metallized products |
US5721007A (en) * | 1994-09-08 | 1998-02-24 | The Whitaker Corporation | Process for low density additive flexible circuits and harnesses |
FR2828890A1 (fr) * | 2001-08-24 | 2003-02-28 | Itt Mfg Enterprises Inc | Dispositif de depot en continu par electrodeposition et composants electriques ou electroniques fabriques en bande comportant une couche de placage par electrodeposition |
US20030188965A1 (en) * | 2002-04-05 | 2003-10-09 | 3M Innovative Properties Company | Web processing method and apparatus |
WO2005056882A1 (en) * | 2003-12-12 | 2005-06-23 | Outokumpu Copper Products Oy | Method of manufacturing thin conductors on a carrier web and the conductor manufactured with this method |
WO2005056881A1 (en) * | 2003-12-12 | 2005-06-23 | Outokumpu Oyj | Method of manufacturing thin foils on a carrier web and the product manufactured with this method |
US6969672B1 (en) * | 2001-07-19 | 2005-11-29 | Advanced Micro Devices, Inc. | Method and apparatus for controlling a thickness of a conductive layer in a semiconductor manufacturing operation |
EP1696052A2 (en) | 2005-02-28 | 2006-08-30 | Rohm and Haas Electronic Materials, L.L.C. | Improved acid electrolytes |
US20100084264A1 (en) * | 2008-10-08 | 2010-04-08 | Mark William Neff | Electroplating system with electroplating wheel |
CN102586830A (zh) * | 2011-01-10 | 2012-07-18 | 深圳市奥美特科技有限公司 | 金属丝表面镀金或镀钯的设备及方法 |
CN103924276A (zh) * | 2014-04-29 | 2014-07-16 | 深圳市崇辉表面技术开发有限公司 | 表面贴装型发光二极管支架的电镀系统及电镀方法 |
CN106702445A (zh) * | 2016-12-01 | 2017-05-24 | 深圳市奥美特科技有限公司 | 选择电镀设备及其选择电镀模具 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4473445A (en) * | 1983-12-22 | 1984-09-25 | Amp Incorporated | Selectively plating interior surfaces of loose piece electrical terminals |
DE3708779A1 (de) * | 1986-11-22 | 1988-06-01 | Schempp & Decker Maschinenbau | Vorrichtung zum galvanischen beschichten eines elektrisch leitenden gegenstandes |
DE10065643C2 (de) * | 2000-12-29 | 2003-03-20 | Egon Huebel | Vorrichtung und Verfahren zum elektrochemischen Behandeln von bandförmigem und plattenförmigem Gut |
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US3537971A (en) * | 1967-08-07 | 1970-11-03 | Rca Corp | Apparatus for electroplating a ribbon |
US3539490A (en) * | 1967-11-28 | 1970-11-10 | Sylvania Electric Prod | Plating of stripes on longitudinal electrically conductive material |
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- 1972-05-24 GB GB4511274A patent/GB1396343A/en not_active Expired
- 1972-05-25 CH CH770572A patent/CH576007A5/xx not_active IP Right Cessation
- 1972-05-25 FR FR7218685A patent/FR2139037B1/fr not_active Expired
- 1972-05-25 IT IT24822/72A patent/IT955826B/it active
- 1972-05-25 US US00256847A patent/US3819502A/en not_active Expired - Lifetime
- 1972-05-25 BE BE783967A patent/BE783967A/nl not_active IP Right Cessation
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- 1980-05-29 HK HK290/80A patent/HK29080A/xx unknown
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US2591042A (en) * | 1947-01-08 | 1952-04-01 | Conmar Prod Corp | Apparatus for electrolytic treatment of spaced metallic elements |
US3152977A (en) * | 1960-12-08 | 1964-10-13 | United States Steel Corp | Roll for marking metal strip |
GB1098182A (en) * | 1963-12-27 | 1968-01-10 | Ibm | Electrolyte or electroless plating process |
US3468785A (en) * | 1966-06-21 | 1969-09-23 | Photocircuits Corp | Apparatus for electroplating selected areas |
US3537971A (en) * | 1967-08-07 | 1970-11-03 | Rca Corp | Apparatus for electroplating a ribbon |
US3539490A (en) * | 1967-11-28 | 1970-11-10 | Sylvania Electric Prod | Plating of stripes on longitudinal electrically conductive material |
Cited By (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3855108A (en) * | 1973-05-17 | 1974-12-17 | Duerrwaechter E Dr Doduco | Continuous strip electroplating apparatus |
US4264416A (en) * | 1973-10-04 | 1981-04-28 | Noz Francis X | Method for continuous application of strip ribbon or patch-shaped coatings to a metal tape |
US3986945A (en) * | 1974-01-21 | 1976-10-19 | Galentan Ag | Device for the continuous application of strip-, ribbon- or spot-shaped coatings |
US4014773A (en) * | 1974-07-31 | 1977-03-29 | Daiichi Denshi Kogyo Kabushiki Kaisha | Apparatus for electrolytic treatment |
US3962063A (en) * | 1974-12-18 | 1976-06-08 | Advanced Materials Systems, Inc. | Selective plating apparatus |
US3974056A (en) * | 1975-05-23 | 1976-08-10 | Ann Arbor Circuits, Inc. | Electroplating selected portions of a strip |
DE2615326A1 (de) * | 1975-06-14 | 1976-12-23 | Electroplating Eng | Verfahren und einrichtung zum selektiven plattieren |
US4030999A (en) * | 1975-10-06 | 1977-06-21 | National Semiconductor Corporation | Stripe on strip plating apparatus |
US4036725A (en) * | 1975-11-21 | 1977-07-19 | National Semiconductor Corporation | Wheel selective jet plating system |
US4388157A (en) * | 1981-03-07 | 1983-06-14 | Galentan Ag | Method of applying coverings in the form of completely or not completely closed loops |
US4493757A (en) * | 1981-03-07 | 1985-01-15 | Galentan, A.G. | Device for applying blot-shaped coverings by electro-plating |
US4431500A (en) * | 1981-12-15 | 1984-02-14 | Vanguard Research Associates, Inc. | Selective electroplating apparatus |
US4579831A (en) * | 1983-03-29 | 1986-04-01 | Chevron Research Company | Method of zeolitic catalyst manufacture |
US4880507A (en) * | 1987-12-10 | 1989-11-14 | Learonal, Inc. | Tin, lead or tin/lead alloy electrolytes for high speed electroplating |
US5174887A (en) * | 1987-12-10 | 1992-12-29 | Learonal, Inc. | High speed electroplating of tinplate |
US5104510A (en) * | 1990-02-16 | 1992-04-14 | Texas Instruments Incorporated | Plating system |
US5069762A (en) * | 1991-01-18 | 1991-12-03 | Usx Corporation | Appartaus for improved current transfer in radial cell electroplating |
US5429738A (en) * | 1992-05-27 | 1995-07-04 | Gould Inc. | Method for forming printed circuits by elctroplating |
US5242562A (en) * | 1992-05-27 | 1993-09-07 | Gould Inc. | Method and apparatus for forming printed circuits |
US5512154A (en) * | 1993-01-28 | 1996-04-30 | Meco Equipment Engineers B.V. | Apparatus for selectively electroplating apertured metal or metallized products |
US5721007A (en) * | 1994-09-08 | 1998-02-24 | The Whitaker Corporation | Process for low density additive flexible circuits and harnesses |
US6969672B1 (en) * | 2001-07-19 | 2005-11-29 | Advanced Micro Devices, Inc. | Method and apparatus for controlling a thickness of a conductive layer in a semiconductor manufacturing operation |
FR2828890A1 (fr) * | 2001-08-24 | 2003-02-28 | Itt Mfg Enterprises Inc | Dispositif de depot en continu par electrodeposition et composants electriques ou electroniques fabriques en bande comportant une couche de placage par electrodeposition |
WO2003018881A1 (fr) * | 2001-08-24 | 2003-03-06 | Itt Manufacturing Enterprises Inc. | Dispositif de depot en continu par electrodeposition et composants electriques ou electroniques fabriques en bande comportant une couche de placage par electrodeposition |
US20050074934A1 (en) * | 2001-08-24 | 2005-04-07 | Jean-Louis Guyot | Electrodeposited layer |
US6991717B2 (en) * | 2002-04-05 | 2006-01-31 | 3M Innovative Properties Company | Web processing method and apparatus |
US20030188965A1 (en) * | 2002-04-05 | 2003-10-09 | 3M Innovative Properties Company | Web processing method and apparatus |
US20060116268A1 (en) * | 2002-04-05 | 2006-06-01 | 3M Innovative Properties Company | Web processing method and apparatus |
WO2005056881A1 (en) * | 2003-12-12 | 2005-06-23 | Outokumpu Oyj | Method of manufacturing thin foils on a carrier web and the product manufactured with this method |
WO2005056882A1 (en) * | 2003-12-12 | 2005-06-23 | Outokumpu Copper Products Oy | Method of manufacturing thin conductors on a carrier web and the conductor manufactured with this method |
EP1696052A2 (en) | 2005-02-28 | 2006-08-30 | Rohm and Haas Electronic Materials, L.L.C. | Improved acid electrolytes |
US20100084264A1 (en) * | 2008-10-08 | 2010-04-08 | Mark William Neff | Electroplating system with electroplating wheel |
US8551301B2 (en) | 2008-10-08 | 2013-10-08 | Tyco Electronics Corporation | Electroplating system with electroplating wheel |
CN102586830A (zh) * | 2011-01-10 | 2012-07-18 | 深圳市奥美特科技有限公司 | 金属丝表面镀金或镀钯的设备及方法 |
CN103924276A (zh) * | 2014-04-29 | 2014-07-16 | 深圳市崇辉表面技术开发有限公司 | 表面贴装型发光二极管支架的电镀系统及电镀方法 |
CN106702445A (zh) * | 2016-12-01 | 2017-05-24 | 深圳市奥美特科技有限公司 | 选择电镀设备及其选择电镀模具 |
Also Published As
Publication number | Publication date |
---|---|
CH576007A5 (nl) | 1976-05-31 |
IT955826B (it) | 1973-09-29 |
HK29080A (en) | 1980-06-06 |
HK29180A (en) | 1980-06-06 |
FR2139037B1 (nl) | 1977-08-26 |
NL170027C (nl) | 1982-09-16 |
NL170027B (nl) | 1982-04-16 |
FR2139037A1 (nl) | 1973-01-05 |
DE2265041A1 (de) | 1975-12-18 |
DE2265041B2 (de) | 1977-04-21 |
DE2225391A1 (de) | 1972-12-07 |
NL7109404A (nl) | 1973-01-09 |
DE2225391B2 (de) | 1976-04-22 |
GB1396343A (en) | 1975-06-04 |
BE783967A (nl) | 1972-11-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: MECO EQUIPMENT ENGINEERS, DE BEVERSPIJKEN 3, 5221 Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:GALENTAN AG;REEL/FRAME:004269/0493 Effective date: 19840425 |