US3447957A - Method of making a smooth surfaced adhesive binder xerographic plate - Google Patents
Method of making a smooth surfaced adhesive binder xerographic plate Download PDFInfo
- Publication number
- US3447957A US3447957A US390738A US3447957DA US3447957A US 3447957 A US3447957 A US 3447957A US 390738 A US390738 A US 390738A US 3447957D A US3447957D A US 3447957DA US 3447957 A US3447957 A US 3447957A
- Authority
- US
- United States
- Prior art keywords
- resin
- plate
- binder
- binder film
- cover plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011230 binding agent Substances 0.000 title description 60
- 238000004519 manufacturing process Methods 0.000 title description 12
- 239000000853 adhesive Substances 0.000 title description 11
- 230000001070 adhesive effect Effects 0.000 title description 11
- 229920005989 resin Polymers 0.000 description 47
- 239000011347 resin Substances 0.000 description 47
- 239000000758 substrate Substances 0.000 description 23
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 16
- 239000000463 material Substances 0.000 description 16
- 238000000034 method Methods 0.000 description 16
- 239000000203 mixture Substances 0.000 description 16
- 239000007788 liquid Substances 0.000 description 14
- 239000011248 coating agent Substances 0.000 description 9
- 238000000576 coating method Methods 0.000 description 9
- 238000001816 cooling Methods 0.000 description 9
- 229910052757 nitrogen Inorganic materials 0.000 description 8
- 239000002245 particle Substances 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- CMSGUKVDXXTJDQ-UHFFFAOYSA-N 4-(2-naphthalen-1-ylethylamino)-4-oxobutanoic acid Chemical compound C1=CC=C2C(CCNC(=O)CCC(=O)O)=CC=CC2=C1 CMSGUKVDXXTJDQ-UHFFFAOYSA-N 0.000 description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 6
- 229920001187 thermosetting polymer Polymers 0.000 description 6
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 5
- 229910052980 cadmium sulfide Inorganic materials 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 4
- 239000005083 Zinc sulfide Substances 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 239000000839 emulsion Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- 229910052725 zinc Inorganic materials 0.000 description 4
- 239000011701 zinc Substances 0.000 description 4
- 229910052984 zinc sulfide Inorganic materials 0.000 description 4
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 4
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 229920000180 alkyd Polymers 0.000 description 3
- 230000008602 contraction Effects 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 229920001490 poly(butyl methacrylate) polymer Polymers 0.000 description 3
- 239000011669 selenium Substances 0.000 description 3
- 229910052711 selenium Inorganic materials 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 239000011787 zinc oxide Substances 0.000 description 3
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000004840 adhesive resin Substances 0.000 description 2
- 229920006223 adhesive resin Polymers 0.000 description 2
- 238000007605 air drying Methods 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000005670 electromagnetic radiation Effects 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- UKWHYYKOEPRTIC-UHFFFAOYSA-N mercury(ii) oxide Chemical compound [Hg]=O UKWHYYKOEPRTIC-UHFFFAOYSA-N 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 239000000025 natural resin Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical compound C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 description 1
- UKUVVAMSXXBMRX-UHFFFAOYSA-N 2,4,5-trithia-1,3-diarsabicyclo[1.1.1]pentane Chemical compound S1[As]2S[As]1S2 UKUVVAMSXXBMRX-UHFFFAOYSA-N 0.000 description 1
- RUMACXVDVNRZJZ-UHFFFAOYSA-N 2-methylpropyl 2-methylprop-2-enoate Chemical compound CC(C)COC(=O)C(C)=C RUMACXVDVNRZJZ-UHFFFAOYSA-N 0.000 description 1
- 235000007173 Abies balsamea Nutrition 0.000 description 1
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- 239000004857 Balsam Substances 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 241000252206 Cypriniformes Species 0.000 description 1
- BWGNESOTFCXPMA-UHFFFAOYSA-N Dihydrogen disulfide Chemical compound SS BWGNESOTFCXPMA-UHFFFAOYSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 244000018716 Impatiens biflora Species 0.000 description 1
- 240000006240 Linum usitatissimum Species 0.000 description 1
- 235000004431 Linum usitatissimum Nutrition 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical group [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 229920001800 Shellac Polymers 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000004110 Zinc silicate Substances 0.000 description 1
- 150000001241 acetals Chemical class 0.000 description 1
- LZBCVRCTAYKYHR-UHFFFAOYSA-N acetic acid;chloroethene Chemical compound ClC=C.CC(O)=O LZBCVRCTAYKYHR-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 229940052288 arsenic trisulfide Drugs 0.000 description 1
- IWLBIFVMPLUHLK-UHFFFAOYSA-N azane;formaldehyde Chemical compound N.O=C IWLBIFVMPLUHLK-UHFFFAOYSA-N 0.000 description 1
- 235000013871 bee wax Nutrition 0.000 description 1
- 239000012166 beeswax Substances 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical compound [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 description 1
- LJLWNMFUZWUGPO-UHFFFAOYSA-N calcium strontium disulfide Chemical compound [S--].[S--].[Ca++].[Sr++] LJLWNMFUZWUGPO-UHFFFAOYSA-N 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 229920003086 cellulose ether Polymers 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 235000004426 flaxseed Nutrition 0.000 description 1
- IVJISJACKSSFGE-UHFFFAOYSA-N formaldehyde;1,3,5-triazine-2,4,6-triamine Chemical compound O=C.NC1=NC(N)=NC(N)=N1 IVJISJACKSSFGE-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- PEDCQBHIVMGVHV-UHFFFAOYSA-N glycerol Substances OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- PNHVEGMHOXTHMW-UHFFFAOYSA-N magnesium;zinc;oxygen(2-) Chemical compound [O-2].[O-2].[Mg+2].[Zn+2] PNHVEGMHOXTHMW-UHFFFAOYSA-N 0.000 description 1
- 229960003671 mercuric iodide Drugs 0.000 description 1
- 229940101209 mercuric oxide Drugs 0.000 description 1
- YFDLHELOZYVNJE-UHFFFAOYSA-L mercury diiodide Chemical compound I[Hg]I YFDLHELOZYVNJE-UHFFFAOYSA-L 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 235000019809 paraffin wax Nutrition 0.000 description 1
- 235000019271 petrolatum Nutrition 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 239000005297 pyrex Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000004208 shellac Substances 0.000 description 1
- 235000013874 shellac Nutrition 0.000 description 1
- 229940113147 shellac Drugs 0.000 description 1
- ZLGIYFNHBLSMPS-ATJNOEHPSA-N shellac Chemical compound OCCCCCC(O)C(O)CCCCCCCC(O)=O.C1C23[C@H](C(O)=O)CCC2[C@](C)(CO)[C@@H]1C(C(O)=O)=C[C@@H]3O ZLGIYFNHBLSMPS-ATJNOEHPSA-N 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- QXKXDIKCIPXUPL-UHFFFAOYSA-N sulfanylidenemercury Chemical compound [Hg]=S QXKXDIKCIPXUPL-UHFFFAOYSA-N 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- XSMMCTCMFDWXIX-UHFFFAOYSA-N zinc silicate Chemical compound [Zn+2].[O-][Si]([O-])=O XSMMCTCMFDWXIX-UHFFFAOYSA-N 0.000 description 1
- 235000019352 zinc silicate Nutrition 0.000 description 1
- UQMZPFKLYHOJDL-UHFFFAOYSA-N zinc;cadmium(2+);disulfide Chemical compound [S-2].[S-2].[Zn+2].[Cd+2] UQMZPFKLYHOJDL-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G5/00—Recording members for original recording by exposure, e.g. to light, to heat, to electrons; Manufacture thereof; Selection of materials therefor
- G03G5/02—Charge-receiving layers
- G03G5/04—Photoconductive layers; Charge-generation layers or charge-transporting layers; Additives therefor; Binders therefor
- G03G5/05—Organic bonding materials; Methods for coating a substrate with a photoconductive layer; Inert supplements for use in photoconductive layers
- G03G5/0525—Coating methods
Definitions
- This invention relates in general to xerography and more specifically to a xerographic binder plate and a method for its production.
- an electrostatic latent image is formed on a photoconductive insulating layer and is developed through the deposition thereof on finely divided electroscopic materials.
- the developed image may then be fixed in place or transferred to a copy sheet Where it is permanently fixed.
- the photoconductive insulating layer which is referred to in the art as a plate regardless of its shape or flexibility, is first charged to sensitize it and is then exposed to a light image or other pattern of activating electromagnetic radiation which serves to dissipate the charge in radiation-struck areas, thus forming a charge pattern which conforms to the electromagnetic radiation pattern which impinges upon the plate.
- This charge pattern is then developed or made visible by the charge-wise deposition on the plate of an electroscopic or electrostatically, attractable, finely divided, colored material which is referred to in the art as toner.
- xerographic plates Although reusable, homogeneously structured xerographic plates, such as those made with amorphous selenium, have enjoyed extremely wide commercial success because they are capable of producing many thousands of extremely high quality copies, attention has recently been drawn to heterogeneous xerographic plates known in the art as binder plates and composed of finely divided, photoconductive materials dispersed in an insulating, adhesive, film-forming binder. Xerographic plates of this latter type are described, for example in US. Patents 2,663,636 to Middleton and 3,121,006 to Middleton and Reynolds.
- Yet another object of this invention is to define a method of making xerographic plates under pressure with highly adhesive materials.
- the xerographic plate of this invention is constructed by first blending the desired photoconductive insulating particles with an insulating film-forming adhesive resin and coating this blend on a supporting substrate.
- an insulating film-forming adhesive resin for inclusion in binder-type xerographic plates, any suitable particulate photoconductive insulating material may be employed.
- Typical photoconductive insulating materials include zinc sulfide, cadmium selenide, red lead (Pb O arsenic disulfide, arsenic trisulfide, titanium dioxide, zinc titanate, zinc silicate, zinc magnesium oxide, mercuric iodide, mercuric oxide, mercuric sulfide, indium trisulfide and calcium strontium sulfide.
- the particular resin employed as the adhesive binder material may be either a natural or synthetic resin having either thermoplastic or thermosetting characteristics.
- silicones such as phenyl-methylpolysiloxane resins and vinyl chloride-acetate copolymer resins are, perhaps, the most widely-known binder resins for this type of xerographic plate, any suitable insulating, adhesive, filmforming resin may be employed.
- Typical insulating adhesive film-forming resins including both natural and synthetic resins of both thermoplastic and thermosetting nature are as follows: polystyrene, polybutylmethacrylate, chlorinated rubber, cellulose esters and ethers such as ethyl cellulose and nitrocellulose; alkyd resins such as linseed oil-glycerol alkyds as well as other polyesters, polyurethanes, polyamides, polycarbonates, styrene-butadiene copolymers, soya-alkyds, shellac, paraffin wax, carnauba Wax, beeswax, cumarone resins, indene resins, balsam resins modified with colophony, polyvinyl acetals, polyacrylic and polymethacrylic esters such as polybutylmethacrylate, polymethylmethacrylate, copolymers of methylacrylate and ethylmethacrylate, copolymers of nbuty
- the adhesive resin may be blended with the particulate photoconductor in the powdered form or in any suitable liquid form such as from a hot melt of the resin, from a solution of the resin in an organic solvent or from a water emulsion of the resin.
- suitable hardenable resins are, of course, liquid at room temperature and may be used as such. If the resin is of the thermosetting or hardenable variety, a catalyst or accelerator is included in the resin-photoconductor blend.
- the ratio between the binder resin and the photoconductive particles is the same as that generally employed with binder-type xerographic plates of conventional fabrication. These plates usually contain a ratio between resin and photoconductive particles of from about 1 part resin and parts photoconductive particles to about 2 parts resin and 1 part photoconductive particles (all parts by weight). The actual proportions will, of course, depend upon the specific materials employed as well as on the properties and characteristics desired in the final plate produced.
- the substrate upon which the resin-photoconductive particle blend is coated is employed to provide physical support for the layer and in some cases to act as a ground, thereby permitting the photoconductive insulating layer to receive an electrostatic charge in the dark and permitting charges to migrate when exposed to light.
- the support may be eliminated from the final plate construction.
- the self-supporting layer may be brought in contact with a grounded conductive plate during charging or if positive electrostatic charges are placed on one side of the plate, as by corona charging, as described in US.
- Patent 2,777,957 to Walkup the simultaneous deposition of negative charges on the other side of the plate, also by corona charging, will create an induced or virtual ground plane within the body of the plate just as if the charges of opposite polarity had been supplied to the interface by being induced up from a grounded substrate.
- this type of substrate may be produced by coating a thin layer of tin oxide, or indium oxide on glass or a heat resistant plastic such as polyethylene terephthalate or tetrafluoroethylene or other material having a coefficient of thermal expansion about the same as that of the binder.
- the substrate is only to be used temporarily in the fabrication of the plate, and it is desired that the substance be removed at the completion of fabrication, it is selected to have a coefiicient of thermal expansion significantly diflferent from that of the photoconductive binder film and may consist, for example, of brass, copper, steel, zinc or the like.
- the binder film the photoconductor-resin blend
- the binder film a very smooth cover plate is clamped thereon.
- This plate is also selected to have a coefiicient of thermal expansion significantly different from that of the binder film and may also consist of brass, stainless steel, copper, nickel, zinc or the like.
- the thus formed clamped sandwich is then subjected to heat if the resin is initially in solid form or is a liquid resin to be heat cured. This tends to soften and reduce the viscosity of the resin so that it will more readily wet and come into intimate contact with the pressure plate clamped to its surface.
- the application of this heat treatment serves the additional function of curing the resin. The amount and duration of heat application will, of course,
- the resin is initially liquid and it is desired to cure it at room temperature, it is merely held in the clamped condition until the cure is complete resulting in resin solidification. In this case the heating step is eliminated. After completion of this heating step, the sandwich is allowed to cool to about room temperature and is then unclamped and cooled to a low enough temperature so that the difierences in thermal expansion between the cover plate and the resin film cause the two layers to separate. Upon removal of the cover plate, an extremely smooth, uniform, resin binder film surface is found to exist.
- the substrate is also selected so as to have a significant difference in coeflicient of thermal expansion from that of the resin binder film it will also separate from this film upon cooling. If, on the other hand, the coefficient of the thermal expansion of the substrate and the binder film are roughly the same, separation of these two layers will not take place, and the resulting xerographic binder plate will include the supporting substrate firmly bonded beneath it.
- Example I 100 parts by weight of powdered photoconductive cadmium sulfide having an average size of about 25 microns in diameter are blended with 61 parts by weight of a powdered bisphenol A-epichlorohydrin-type epoxy resin and 2.56 parts by weight of a diethylamine triamine curing agent and made into a slurry with deionized water. The slurry is then coated on a NESA coated Pyrex glass plate (a thin coating of tin oxide on borosilicate glass) with a stainless steel spatuala. A polished molybdenum plate is clamped against the top surface of the belnd, resulting from the slurry after air drying, and the sandwich structure is then cured at 250 F. for 10 minutes.
- NESA coated Pyrex glass plate a thin coating of tin oxide on borosilicate glass
- Example [Ill The method of Example I is repeated except for the fact that the powdered epoxy resin is replaced with the same amount of epoxy in an acetone solution and curing conditions are 122 F. for 45 minutes. These conditions produce equal good results with those of Example 'I. Curing is carried out only after the acetone is fully evaporated 01f.
- Example III A polystyrene emulsion, made with a polymer having a melting point of (3., is blended with powdered zinc sulfide (C.P. grade) in sufiicient quantity to produce a l to 1 ratio by volume between the resin solids and the zinc sulfide photoconductor. The water emulsion is then agitated to promote thorough mixing and coated on a NESA glass substrate. After thorough air drying, a polished aluminum plate is clamped face down on the surface of the binder film formed by the dried emulsion and this sandwich structure is baked for 15 minutes at 150 (3. followed by cooling to room temperature. The sandwich is then dipped in liquid nitrogen and after removal of the clamp, the aluminum plate is easily separated from the underlying binder film, thus producing an extremely smooth surface.
- C.P. grade powdered zinc sulfide
- Example IV The procedure of Example H1 is repeated except that the zinc sulfide photoconductor is replaced with phosphor No. 1200 (zinc cadmium sulfide, available from E. I. du Pont de Nemours and Company) with equally good results.
- Example V One part by weight of 'French process zinc oxide, available from the 'New Jersey Zinc Company under the trade name, Florence Green Seal No. 8, is added to a solution of 1 part by weight of polybutylmethacrylate in 4 parts by weight of toluene and ball milled for 3 hours. This blend is then coated on a NESA glass substrate and air dried. Following drying, a polished aluminum plate is placed with its polished side facing the coating and clamped thereon under pressure. This sandwich is then baked for minutes at 115 C. and after cooling, it is dipped in liquid nitrogen. Upon removal of the clamp, the polished aluminum plate falls away from the sandwich structure leaving behind an extremely smooth surfaced binder film.
- 'French process zinc oxide available from the 'New Jersey Zinc Company under the trade name, Florence Green Seal No. 8 is added to a solution of 1 part by weight of polybutylmethacrylate in 4 parts by weight of toluene and ball milled for 3 hours. This blend is then coated on a NES
- Example VI 0.45 gram of an epoxy resin of the type described in connection with Example I are mixed with a few drops of a cross linking agent and 1.00 gram of photoconductive cadmium sulfide. This mixture is placed on a NESA glass plate and a polished molybdenum sheet is clamped over the mixture, the clamped plate is then cured for about 5 hours at 50 C., at which time the clamps are removed and liquid nitrogen is then poured on the molybdenum sheet which is then simply stripped free of the cadmium sulfide-epoxy layer. The separation is very clean resulting in an extremely smooth and glossy cadminum sulfide-epoxy surface. The surface is very hard and well cured and is well bonded to the NESA glass substrate.
- Example VII A slurry is first prepared consisting of 11% by weight of poly-methyl-methacrylate and 89% by Weight of cadmium sulfide photoconductor with the resin incorporated as a xylene solution and viscosity adjusted with the solvent for easy application. This mix is then applied to a NESA glass substrate through a stainless steel screen after which the screen is separated from the mix and the solvent is thoroughly removed by heating in a drying oven set at 65 C. The layer is then cooled in a dessicator. A flexible metal sheet is then placed on the binder layer surface and the surface is smoothed by rolling a heated roller over the [cover plate.
- the 5 mil thick aluminum cover plate has a size such that it extends well beyond the area of the plate so that after the heated roller has passed over the cover plate and it has cooled to room temperature, the cover plate is removed by immersing only its portion which extends beyond the plate into liquid nitrogen. Because of the high heat conductivity of the aluminum, even the portion of the aluminum over the plate is cooled very rapidly and contracts sufficiently to break the bond between the cover plate and the binder film beneath it result ing in a very smooth surfaced binder film.
- a xerographic plate comprising blending a particulate photoconductor with an adhesive, insulating film-forming resin to form a uniform mix, coating said mix on a supporting substrate to form a binder film thereon, pressing a smooth-surfaced cover plate against said binder film to form a fabricating laminate while holding said resin in liquid form, to adhere said binder film to said cover plate, said cover plate having a significantly different coefficient of thermal expansion than said binder film, solidifying said resin, cooling said laminate sufficiently to break the bond between said binder film and said cover plate due to the differences in contraction of said binder film and said cover plate and removing said cover plate whereby an extremely smooth surfaced xerographic binder plate is formed.
- a method according to claim 1 including employing a thermosetting resin to form said binder film and heating said fabricating laminate at a high enough temperature for a long enough time to cure said resin.
- thermosetting resin includes an epoxy polymer and a curing agent.
- a method according to claim 1 including using a substrate having a coefficient of thermal expansion closer to that of said binder film than to the coefficient of thermal expansion of said cover plate and cooling said fabricating laminate sufficiently to break the bond between said binder film and said cover plate but not sufliciently to break the bond between said binder film and said substrate.
- a method according to claim 1 including using a substrate having a coefficient of thermal expansion significantly different from that of said binder film, and cooling said fabricating laminate sufficiently to break the bonds between said binder film and said cover plate and between said binder film and said substrate.
- a xerographic plate comprising blending a particulate photoconductor with an adhesive, insulating film-forming resin to form a uniform mix, coating said mix on a supporting substrate to form a binder film thereon, pressing a smooth-surfaced cover plate against said binder film to form a fabricating laminate while holding said resin in viscous form, to adhere said binder film to said cover plate, said cover plate having a significantly dilferent coefiicient of thermal expansion than said binder film, solidifying said resin, cooling said laminate sufiiciently to break the bond between said binder film and said cover plate due to the differences in contraction of said binder film and said cover plate and removing said cover plate whereby an extremely smooth surfaced xerographic binder plate is formed.
- a xerographic plate comprising blending a particulate photoconductor with an adhesive, insulating film-forming resin to form a uniform mix, coating said mix on a smooth-surfaced cover plate to form a binder film thereon, pressing a supporting substrate against said binder film to form a fabricating laminate while holding said resin in liquid form to adhere said binder film to said cover plate, said cover plate having a significantly different coefficient of thermal expansion than said binder film, solidifying said resin, cooling said laminate sufficiently to break the' bond between said binder film and said cover plate due to the differences in contraction of said binder film and said cover plate, and removing said cover plate whereby an extremely smooth surfaced xerographic binder plate is formed.
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- Photoreceptors In Electrophotography (AREA)
Description
United States Patent 3,447,957 METHOD OF MAKING A SMOOTH SURFACED ADHESIVE BINDER XEROGRAPHIC PLATE Arthur J. Behringer, Webster, N.Y., assignor to Xerox Corporation, Rochester, N.Y., a corporation of New York No Drawing. Filed Aug. 19, 1964, Ser. No. 390,738 Int. 'Cl. B44c 1/22; (30811 13/24 US. Cl. 117-201 11 Claims ABSTRACT OF THE DISCLOSURE obtained.
This invention relates in general to xerography and more specifically to a xerographic binder plate and a method for its production.
In the art of xerography as originally disclosed by Carlson in US. Patent 2,297,691 and as further amplified by many related patents in the field, an electrostatic latent image is formed on a photoconductive insulating layer and is developed through the deposition thereof on finely divided electroscopic materials. The developed image may then be fixed in place or transferred to a copy sheet Where it is permanently fixed. In most applications, the photoconductive insulating layer, which is referred to in the art as a plate regardless of its shape or flexibility, is first charged to sensitize it and is then exposed to a light image or other pattern of activating electromagnetic radiation which serves to dissipate the charge in radiation-struck areas, thus forming a charge pattern which conforms to the electromagnetic radiation pattern which impinges upon the plate. This charge pattern is then developed or made visible by the charge-wise deposition on the plate of an electroscopic or electrostatically, attractable, finely divided, colored material which is referred to in the art as toner.
Although reusable, homogeneously structured xerographic plates, such as those made with amorphous selenium, have enjoyed extremely wide commercial success because they are capable of producing many thousands of extremely high quality copies, attention has recently been drawn to heterogeneous xerographic plates known in the art as binder plates and composed of finely divided, photoconductive materials dispersed in an insulating, adhesive, film-forming binder. Xerographic plates of this latter type are described, for example in US. Patents 2,663,636 to Middleton and 3,121,006 to Middleton and Reynolds.
Owing to the fact that xerographic plates are generally used in photographic imaging systems, it is very important that they have smooth surfaces and when they are being used in high resolution imaging systems, the surfaces must be extremely smooth in order to correctly reproduce the image. Extreme smoothness of the plate surface is also preferred to produce good-quality images in electroded charge transfer systems such as the one described in FIGURE 6 of my copending application, Serial No. 309,665, filed Sept. 18, 1963, now US. Patent No. 3,253,65 3 since this smoothness not only provides a good focal plane for light impingement, but also allows for "ice very uniform spacing between it and the surface to which its charge is later transferred in image configuration.
Although extremely smooth xerographic plates of the homogeneous variety have been produced by vacuum evaporating material such as amorphous selenium, it is much more difficult to produce smooth-surfaced bindertype xerographic plates since because of their heterogeneous nature, these plate materials cannot be vacuum evaporated and further because the particulate photoconductive material included therein tends to make for a rough plate surface.
Accordingly, it is an objective of this invention to describe a method for the production of extremely smooth binder-type xerographic plates.
Yet another object of this invention is to define a method of making xerographic plates under pressure with highly adhesive materials.
The above and still further objects may be accomplished in accordance with the present invention, generally speaking, by coating a composite mixture of the photoconductive particles and an insulating, adhesive, film-forming resin on a substrate having a coeflicient of heat expansion roughly the same as that of the composite binder plate material, pressing an extremely smooth surface cover over the free top surface of the binder coating and holding the sandwich formed by these elements under pressure with the resin in liquid form and then in solid form. Since the cover material is selected so as to have a distinctly different coefficient of thermal expansion from that of the composite binder layer, separation of the adhering cover from the binder is achieved by a large temperature change of the sandwich structure as by dipping in liquid nitrogen or the like.
The xerographic plate of this invention is constructed by first blending the desired photoconductive insulating particles with an insulating film-forming adhesive resin and coating this blend on a supporting substrate. Although particulate zinc oxide, particulate selenium and particulate cadmium sulfide are the most well-known and widely-used materials for inclusion in binder-type xerographic plates, any suitable particulate photoconductive insulating material may be employed. Typical photoconductive insulating materials include zinc sulfide, cadmium selenide, red lead (Pb O arsenic disulfide, arsenic trisulfide, titanium dioxide, zinc titanate, zinc silicate, zinc magnesium oxide, mercuric iodide, mercuric oxide, mercuric sulfide, indium trisulfide and calcium strontium sulfide.
The particular resin employed as the adhesive binder material may be either a natural or synthetic resin having either thermoplastic or thermosetting characteristics. Here again, as with the photoconductive materials, although silicones such as phenyl-methylpolysiloxane resins and vinyl chloride-acetate copolymer resins are, perhaps, the most widely-known binder resins for this type of xerographic plate, any suitable insulating, adhesive, filmforming resin may be employed. Typical insulating adhesive film-forming resins including both natural and synthetic resins of both thermoplastic and thermosetting nature are as follows: polystyrene, polybutylmethacrylate, chlorinated rubber, cellulose esters and ethers such as ethyl cellulose and nitrocellulose; alkyd resins such as linseed oil-glycerol alkyds as well as other polyesters, polyurethanes, polyamides, polycarbonates, styrene-butadiene copolymers, soya-alkyds, shellac, paraffin wax, carnauba Wax, beeswax, cumarone resins, indene resins, balsam resins modified with colophony, polyvinyl acetals, polyacrylic and polymethacrylic esters such as polybutylmethacrylate, polymethylmethacrylate, copolymers of methylacrylate and ethylmethacrylate, copolymers of nbutyl and iso-butylmethacrylate, polyvinylidene chloride, polyvinyl butyral, epoxides and amine-formaldehyde con;
densation products such as melamine formaldehyde. It should be noted, however, that epoxies, constitute a preferred form of the invention because they make very hard smooth layers with excellent electrical properties. The adhesive resin may be blended with the particulate photoconductor in the powdered form or in any suitable liquid form such as from a hot melt of the resin, from a solution of the resin in an organic solvent or from a water emulsion of the resin. Many suitable hardenable resins are, of course, liquid at room temperature and may be used as such. If the resin is of the thermosetting or hardenable variety, a catalyst or accelerator is included in the resin-photoconductor blend. The ratio between the binder resin and the photoconductive particles is the same as that generally employed with binder-type xerographic plates of conventional fabrication. These plates usually contain a ratio between resin and photoconductive particles of from about 1 part resin and parts photoconductive particles to about 2 parts resin and 1 part photoconductive particles (all parts by weight). The actual proportions will, of course, depend upon the specific materials employed as well as on the properties and characteristics desired in the final plate produced.
' The substrate upon which the resin-photoconductive particle blend is coated is employed to provide physical support for the layer and in some cases to act as a ground, thereby permitting the photoconductive insulating layer to receive an electrostatic charge in the dark and permitting charges to migrate when exposed to light. Obviously, where the composite layer of resin binder and photoconductive particles have sufiicient strength to form a self-supporting layer the support may be eliminated from the final plate construction. In this case (or if a non-conductive substrate is used) the self-supporting layer may be brought in contact with a grounded conductive plate during charging or if positive electrostatic charges are placed on one side of the plate, as by corona charging, as described in US. Patent 2,777,957 to Walkup, the simultaneous deposition of negative charges on the other side of the plate, also by corona charging, will create an induced or virtual ground plane within the body of the plate just as if the charges of opposite polarity had been supplied to the interface by being induced up from a grounded substrate. When it is desired to include a substrate in the final plate structure, this type of substrate may be produced by coating a thin layer of tin oxide, or indium oxide on glass or a heat resistant plastic such as polyethylene terephthalate or tetrafluoroethylene or other material having a coefficient of thermal expansion about the same as that of the binder. If, on the other hand, the substrate is only to be used temporarily in the fabrication of the plate, and it is desired that the substance be removed at the completion of fabrication, it is selected to have a coefiicient of thermal expansion significantly diflferent from that of the photoconductive binder film and may consist, for example, of brass, copper, steel, zinc or the like.
Once the photoconductor-resin blend (hereafter referred to as the binder film) is coated on the supporting substrate and any water or solvent is completely removed from the binder film, a very smooth cover plate is clamped thereon. This plate is also selected to have a coefiicient of thermal expansion significantly different from that of the binder film and may also consist of brass, stainless steel, copper, nickel, zinc or the like. The thus formed clamped sandwich is then subjected to heat if the resin is initially in solid form or is a liquid resin to be heat cured. This tends to soften and reduce the viscosity of the resin so that it will more readily wet and come into intimate contact with the pressure plate clamped to its surface. In the case where a thermosetting resin is employed, the application of this heat treatment serves the additional function of curing the resin. The amount and duration of heat application will, of course,
vary depending upon the particular resin selected for use in the plate, its melting point, or the time required for a cure of the resin if it is to be heat cured. Obviously if the resin is initially liquid and it is desired to cure it at room temperature, it is merely held in the clamped condition until the cure is complete resulting in resin solidification. In this case the heating step is eliminated. After completion of this heating step, the sandwich is allowed to cool to about room temperature and is then unclamped and cooled to a low enough temperature so that the difierences in thermal expansion between the cover plate and the resin film cause the two layers to separate. Upon removal of the cover plate, an extremely smooth, uniform, resin binder film surface is found to exist. As will be clear, if the substrate is also selected so as to have a significant difference in coeflicient of thermal expansion from that of the resin binder film it will also separate from this film upon cooling. If, on the other hand, the coefficient of the thermal expansion of the substrate and the binder film are roughly the same, separation of these two layers will not take place, and the resulting xerographic binder plate will include the supporting substrate firmly bonded beneath it.
This technique for the production of smooth surfaced binder-type xerographic plates is particularly effective with some photoconductive materials which cannot be made in sizes smaller than about 25 micronsin diameter without losing their photoconductivity, whereas in the past, it has been virtually impossible to make smooth surfaced binder plates with these materials by any of the known techniques.
The general nature of the invention having been at forth, the following examples are now presented as illustrations of the method of carrying out the invention.
Example I 100 parts by weight of powdered photoconductive cadmium sulfide having an average size of about 25 microns in diameter are blended with 61 parts by weight of a powdered bisphenol A-epichlorohydrin-type epoxy resin and 2.56 parts by weight of a diethylamine triamine curing agent and made into a slurry with deionized water. The slurry is then coated on a NESA coated Pyrex glass plate (a thin coating of tin oxide on borosilicate glass) with a stainless steel spatuala. A polished molybdenum plate is clamped against the top surface of the belnd, resulting from the slurry after air drying, and the sandwich structure is then cured at 250 F. for 10 minutes. Since this temperature is well above the melting point of the epoxy resin, a smooth, continuous binder film is formed which also takes on a good hard cure under these conditions. After removal from the oven and cooling to room temperature to facilitate handling, the sandwich structure is dipped in liquid nitrogen and upon removal from the nitrogen bath, the molybdenum plate is easily separated from the binder film leaving behind an extremely, smooth surfaced photoconductive binder film.
Example [Ill The method of Example I is repeated except for the fact that the powdered epoxy resin is replaced with the same amount of epoxy in an acetone solution and curing conditions are 122 F. for 45 minutes. These conditions produce equal good results with those of Example 'I. Curing is carried out only after the acetone is fully evaporated 01f.
Example III A polystyrene emulsion, made with a polymer having a melting point of (3., is blended with powdered zinc sulfide (C.P. grade) in sufiicient quantity to produce a l to 1 ratio by volume between the resin solids and the zinc sulfide photoconductor. The water emulsion is then agitated to promote thorough mixing and coated on a NESA glass substrate. After thorough air drying, a polished aluminum plate is clamped face down on the surface of the binder film formed by the dried emulsion and this sandwich structure is baked for 15 minutes at 150 (3. followed by cooling to room temperature. The sandwich is then dipped in liquid nitrogen and after removal of the clamp, the aluminum plate is easily separated from the underlying binder film, thus producing an extremely smooth surface.
Example IV The procedure of Example H1 is repeated except that the zinc sulfide photoconductor is replaced with phosphor No. 1200 (zinc cadmium sulfide, available from E. I. du Pont de Nemours and Company) with equally good results.
Example V One part by weight of 'French process zinc oxide, available from the 'New Jersey Zinc Company under the trade name, Florence Green Seal No. 8, is added to a solution of 1 part by weight of polybutylmethacrylate in 4 parts by weight of toluene and ball milled for 3 hours. This blend is then coated on a NESA glass substrate and air dried. Following drying, a polished aluminum plate is placed with its polished side facing the coating and clamped thereon under pressure. This sandwich is then baked for minutes at 115 C. and after cooling, it is dipped in liquid nitrogen. Upon removal of the clamp, the polished aluminum plate falls away from the sandwich structure leaving behind an extremely smooth surfaced binder film.
Example VI 0.45 gram of an epoxy resin of the type described in connection with Example I are mixed with a few drops of a cross linking agent and 1.00 gram of photoconductive cadmium sulfide. This mixture is placed on a NESA glass plate and a polished molybdenum sheet is clamped over the mixture, the clamped plate is then cured for about 5 hours at 50 C., at which time the clamps are removed and liquid nitrogen is then poured on the molybdenum sheet which is then simply stripped free of the cadmium sulfide-epoxy layer. The separation is very clean resulting in an extremely smooth and glossy cadminum sulfide-epoxy surface. The surface is very hard and well cured and is well bonded to the NESA glass substrate.
Example VII A slurry is first prepared consisting of 11% by weight of poly-methyl-methacrylate and 89% by Weight of cadmium sulfide photoconductor with the resin incorporated as a xylene solution and viscosity adjusted with the solvent for easy application. This mix is then applied to a NESA glass substrate through a stainless steel screen after which the screen is separated from the mix and the solvent is thoroughly removed by heating in a drying oven set at 65 C. The layer is then cooled in a dessicator. A flexible metal sheet is then placed on the binder layer surface and the surface is smoothed by rolling a heated roller over the [cover plate. The 5 mil thick aluminum cover plate has a size such that it extends well beyond the area of the plate so that after the heated roller has passed over the cover plate and it has cooled to room temperature, the cover plate is removed by immersing only its portion which extends beyond the plate into liquid nitrogen. Because of the high heat conductivity of the aluminum, even the portion of the aluminum over the plate is cooled very rapidly and contracts sufficiently to break the bond between the cover plate and the binder film beneath it result ing in a very smooth surfaced binder film.
What is claimed is:
1. The method of making a xerographic plate comprising blending a particulate photoconductor with an adhesive, insulating film-forming resin to form a uniform mix, coating said mix on a supporting substrate to form a binder film thereon, pressing a smooth-surfaced cover plate against said binder film to form a fabricating laminate while holding said resin in liquid form, to adhere said binder film to said cover plate, said cover plate having a significantly different coefficient of thermal expansion than said binder film, solidifying said resin, cooling said laminate sufficiently to break the bond between said binder film and said cover plate due to the differences in contraction of said binder film and said cover plate and removing said cover plate whereby an extremely smooth surfaced xerographic binder plate is formed.
2. A method according to claim 1 including employing a thermosetting resin to form said binder film and heating said fabricating laminate at a high enough temperature for a long enough time to cure said resin.
3. A method according to claim 2 in which said thermosetting resin includes an epoxy polymer and a curing agent.
4. A method according to claim 1 in which said photoconductor is cadmium sulfide.
5. A method according to claim 1 in Which said photoconductor is zinc oxide.
6. A method according to claim 1 including using a substrate having a coefficient of thermal expansion closer to that of said binder film than to the coefficient of thermal expansion of said cover plate and cooling said fabricating laminate sufficiently to break the bond between said binder film and said cover plate but not sufliciently to break the bond between said binder film and said substrate.
7. A method according to claim 1 including using a substrate having a coefficient of thermal expansion significantly different from that of said binder film, and cooling said fabricating laminate sufficiently to break the bonds between said binder film and said cover plate and between said binder film and said substrate.
8. A method according to claim 1 wherein said laminate is cooled by immersing in a liquified gas.
9. A method according to claim 1 wherein said laminate is cooled by immersing in liquid nitrogen.
10. The method of making a xerographic plate comprising blending a particulate photoconductor with an adhesive, insulating film-forming resin to form a uniform mix, coating said mix on a supporting substrate to form a binder film thereon, pressing a smooth-surfaced cover plate against said binder film to form a fabricating laminate while holding said resin in viscous form, to adhere said binder film to said cover plate, said cover plate having a significantly dilferent coefiicient of thermal expansion than said binder film, solidifying said resin, cooling said laminate sufiiciently to break the bond between said binder film and said cover plate due to the differences in contraction of said binder film and said cover plate and removing said cover plate whereby an extremely smooth surfaced xerographic binder plate is formed.
11. The method of making a xerographic plate comprising blending a particulate photoconductor with an adhesive, insulating film-forming resin to form a uniform mix, coating said mix on a smooth-surfaced cover plate to form a binder film thereon, pressing a supporting substrate against said binder film to form a fabricating laminate while holding said resin in liquid form to adhere said binder film to said cover plate, said cover plate having a significantly different coefficient of thermal expansion than said binder film, solidifying said resin, cooling said laminate sufficiently to break the' bond between said binder film and said cover plate due to the differences in contraction of said binder film and said cover plate, and removing said cover plate whereby an extremely smooth surfaced xerographic binder plate is formed.
References Cited UNITED STATES PATENTS 2,320,536 2/1943 Pollack et al. 11765.2 2,370,562 2/ 1945 Meunier 11764 (Other references on following page) 1 7 Middleton 96-1.5 Curler et a1 117--64 Jones 117-64 Middleton et a1. 961.5 Strahl 11764 V 8 MURRAY KATZ, Primary Examiner.
US. Cl. X.R.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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US39073864A | 1964-08-19 | 1964-08-19 |
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US3447957A true US3447957A (en) | 1969-06-03 |
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US390738A Expired - Lifetime US3447957A (en) | 1964-08-19 | 1964-08-19 | Method of making a smooth surfaced adhesive binder xerographic plate |
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Cited By (9)
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US3519421A (en) * | 1967-09-26 | 1970-07-07 | Gaf Corp | Electrophotographic recording material |
US3607260A (en) * | 1965-06-25 | 1971-09-21 | Agfa Gevaert Nv | Mixed-resin binders for electrophotographic plates |
US3619153A (en) * | 1968-05-24 | 1971-11-09 | Xerox Corp | Photoconductive element and process employing a substituted silylisobutylethylenediamine adhesive interlayer |
JPS516557A (en) * | 1974-07-04 | 1976-01-20 | Matsushita Electric Ind Co Ltd | DENSHISHASHINKANKOBANNO SEIZOHO |
US4105448A (en) * | 1974-08-23 | 1978-08-08 | Fuji Photo Film Co., Ltd. | Electrophotographic photosensitive layer and marking method |
FR2417796A1 (en) * | 1978-02-20 | 1979-09-14 | Philips Nv | PROCESS FOR THE MANUFACTURE OF AN ELECTROPHOTOGRAPHIC RECORDING PRODUCT |
US4220697A (en) * | 1977-07-29 | 1980-09-02 | Hoechst Aktiengesellschaft | Electrophotographic recording material |
US4252883A (en) * | 1972-04-28 | 1981-02-24 | Canon Kabushiki Kaisha | Process for producing electrophotographic photosensitive member |
US20050282702A1 (en) * | 2002-07-19 | 2005-12-22 | Sadao Murasawa | Photocatalyst-containing base material |
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US4252883A (en) * | 1972-04-28 | 1981-02-24 | Canon Kabushiki Kaisha | Process for producing electrophotographic photosensitive member |
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US20050282702A1 (en) * | 2002-07-19 | 2005-12-22 | Sadao Murasawa | Photocatalyst-containing base material |
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