US3057789A - Gold plating bath and process - Google Patents
Gold plating bath and process Download PDFInfo
- Publication number
- US3057789A US3057789A US795613A US79561359A US3057789A US 3057789 A US3057789 A US 3057789A US 795613 A US795613 A US 795613A US 79561359 A US79561359 A US 79561359A US 3057789 A US3057789 A US 3057789A
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- US
- United States
- Prior art keywords
- gold
- article
- sodium
- bath
- cyanide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title description 23
- 239000010931 gold Substances 0.000 title description 23
- 229910052737 gold Inorganic materials 0.000 title description 23
- 238000007747 plating Methods 0.000 title description 9
- ZWZLRIBPAZENFK-UHFFFAOYSA-J sodium;gold(3+);disulfite Chemical compound [Na+].[Au+3].[O-]S([O-])=O.[O-]S([O-])=O ZWZLRIBPAZENFK-UHFFFAOYSA-J 0.000 claims description 10
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 claims description 9
- 150000003839 salts Chemical class 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000000243 solution Substances 0.000 description 10
- 239000003109 Disodium ethylene diamine tetraacetate Substances 0.000 description 5
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 5
- 235000019301 disodium ethylene diamine tetraacetate Nutrition 0.000 description 5
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- BHZRJJOHZFYXTO-UHFFFAOYSA-L potassium sulfite Chemical compound [K+].[K+].[O-]S([O-])=O BHZRJJOHZFYXTO-UHFFFAOYSA-L 0.000 description 3
- 235000019252 potassium sulphite Nutrition 0.000 description 3
- 229910052708 sodium Inorganic materials 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- 239000002585 base Substances 0.000 description 2
- 239000010953 base metal Substances 0.000 description 2
- 239000002738 chelating agent Substances 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 235000010265 sodium sulphite Nutrition 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- WOFVPNPAVMKHCX-UHFFFAOYSA-N N#C[Au](C#N)C#N Chemical class N#C[Au](C#N)C#N WOFVPNPAVMKHCX-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000001340 alkali metals Chemical group 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229940108928 copper Drugs 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- -1 disodium ethylenediamine tetraacetate cop per complex Chemical class 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- FDWREHZXQUYJFJ-UHFFFAOYSA-M gold monochloride Chemical compound [Cl-].[Au+] FDWREHZXQUYJFJ-UHFFFAOYSA-M 0.000 description 1
- IZLAVFWQHMDDGK-UHFFFAOYSA-N gold(1+);cyanide Chemical compound [Au+].N#[C-] IZLAVFWQHMDDGK-UHFFFAOYSA-N 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical class [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 description 1
- FQENQNTWSFEDLI-UHFFFAOYSA-J sodium diphosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])([O-])=O FQENQNTWSFEDLI-UHFFFAOYSA-J 0.000 description 1
- 229940048086 sodium pyrophosphate Drugs 0.000 description 1
- VMDSWYDTKFSTQH-UHFFFAOYSA-N sodium;gold(1+);dicyanide Chemical compound [Na+].[Au+].N#[C-].N#[C-] VMDSWYDTKFSTQH-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-L sulfite Chemical class [O-]S([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-L 0.000 description 1
- 235000019818 tetrasodium diphosphate Nutrition 0.000 description 1
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 description 1
- KRZKNIQKJHKHPL-UHFFFAOYSA-J tripotassium;gold(1+);disulfite Chemical compound [K+].[K+].[K+].[Au+].[O-]S([O-])=O.[O-]S([O-])=O KRZKNIQKJHKHPL-UHFFFAOYSA-J 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
Definitions
- This invention relates to the'metal coating art and has particular reference to a process and composition for coating surfaces of a base metal with an electro plate of gold or a gold alloy.
- One of the objects of this invention is to produce a bath that is stable and will not precipitate the gold on standing and will not build up decomposition products during use.
- this invention includes the discovery that an electrolytic bath may be prepared having incorporated therein a complex of sodium gold sulfite. This bath may be modified so that other elements may be deposited with the gold.
- the above quantities of material are added per liter of water solution.
- the bath is operated at a temperature of 100 F. to 140 F. This bath operates at a current density of 1 ampere per square foot for rack plating and 3 amperes per square foot for barrel plating.
- Example 2 The same solution is used as in Example 1, except that 0.075 gram of disodium ethylenediamine tetraacetate cop per complex is added for each liter of solution.
- This solution will produce. a brilliant gold deposit up to .005 inch thick. This plating contains traces of copper.
- Example 4 Sodium gold sulfite grams per liter 3 to 4 Hexamethyleneamine C H N do 40 Ethylenediaminetetraacetic acid (disodium ethylenediamine tetraacetate), 40% cc 40 Disodium ethylenediamine tetraacetate is used as a chelating agent.
- Other chelating agents may be used, such as sodium pyrophosphate, but the E.D.T.A. is the preferred compound.
- sodium gold sulfite serves as the gold supply salt as well as the conductive medium and while 3 to 4 grams per liter is the preferred concentration, and given in all of the examples, it may be varied from this concentration to contain more or less gold and this expression refers to the actual gold content, and not to the gross weight of the complex.
- sodium gold sulfite complex has been used, potassium sulfite or other metal sulfites of the alkali metal group may also be used to form the complex; but the preferred material is the sodium or potassium sulfite.
- the gold complex is prepared by taking a gold chloride solution and adding ammonium hydroxide to it to produce a precipitate. This is then filtered and washed and dissolved by adding an alkali sulfite. The sodium and potassium sulfites are the preferred materials. This then produces a solution containing all of the gold originally present as the chloride. This solution is the solution used in the above examples and referred to as the sodium gold sulfite complex. The exact composition of this salt has not been determined, but it is believed that this has the formula:
- the base article to be gold plates is cleaned by any known method and is usually polished and has the gold applied thereto in thicknesses of 1 to 3 millionths of an inch, but the present process allows, for the first time, a heavier plating of gold, up to 0.01 inch or even thicker, and the plate is bright and does not need polishing, as the plate acquires a greater brilliance as the depth of the gold increases.
- the gold in the plate, as described in the present invention is a dense, compact, fine-grained deposit and is not of the porous nature obtained by the deposition of gold in the usual cyanide bath.
- This novel deposit produces an article that has heretofore been unknown.
- the surface of the base article must be cleaned, but it does not have to be polished in order to deposit thereon a gold plate of high brilliancy. This is also obtained by this process for the first time, as heretofore it has been necessary in order to obtain a bright plate to have the base metal of the same or greater brightness.
- a process for coating the surface of a conductive article which comprises, immersing the article in an electrolytic bath cyanide free containing a sodium gold sulfite complex, and passing an electric current between an anode and said article as a cathode.
- a process for coating the surface of a conductive article which comprises, immersing the article in an electrolytic bath cyanide free containing a sodium gold sulfite complex, and a soluble salt of another metal and passing an electric current between an anode and said article as a cathode.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Description
United States PatentEOT 3,057,789 GOLD PLATING BATH AND PROCESS Paul T. Smith, 375 Putnam Pike, Smithfield, RJ. N Drawing. Filed Feb. 26, 1959, Ser. No. 795,613
' 4 laims. (Cl. 204-46) This invention relates to the'metal coating art and has particular reference to a process and composition for coating surfaces of a base metal with an electro plate of gold or a gold alloy.
Heretofore methods of gold plating in aqueous solutions have employed formulae using the single salt of gold cyanide (AuCN) or the double salt of either potassium or sodium gold cyanide These single or double gold cyanide salts are dissolved in solutions containing an excess of either sodium or potassium cyanides. Heat, electrolysis, absorption of gases and many other phenomena continuously bring about decomposition of the cyanide salts to complexes of carbonates and other related and deleterious products.
Heretofore it has been the practice to use a cyanide bath for gold plating. This cyanide bath has always been a source of danger, because of the poisonous character of the cyanide and requires special precautions to be taken in the plant to protect the operating personnel. Also the plate obtained from this solution when applied to a bright under surface is only bright itself when the thickness of the gold plate is in the order of threeor fourmillionths of an inch. In order to obtain slightly thicker plates evenly with a bright surface, the industry has used certain brighteners which are added to the bath to allow bright plating up to a thousandth of an inch.
One of the objects of this invention is to produce a bath that is stable and will not precipitate the gold on standing and will not build up decomposition products during use.
It is also an object of this invention to provide an electrolytic bath that will plate a bright gold deposit on an unpolished article.
It is a still further object of this invention to provide an electrolytic bath that will plate a bright gold deposit up to 0.01 inch.
Briefly, this invention includes the discovery that an electrolytic bath may be prepared having incorporated therein a complex of sodium gold sulfite. This bath may be modified so that other elements may be deposited with the gold.
Various features of novelty which characterize this invention are pointed out with particularity in the claims annexed to and forming part of this specification. For a better understanding of the invention, its advantages and specific objects obtained with its use, reference should be had to the accompanying descriptive matter in which has been described a preferred embodiment of the invention.
In order to better illustrate the invention, the following specific examples are set forth, but it will be understood that these examples are for purposes of illustration only, and are not to be considered as limitations to this invention.
The above quantities of material are added per liter of water solution. The bath is operated at a temperature of 100 F. to 140 F. This bath operates at a current density of 1 ampere per square foot for rack plating and 3 amperes per square foot for barrel plating.
3,057,789 Patented Oct. 9, 1962 Example 2 The same solution is used as in Example 1, except that 0.075 gram of disodium ethylenediamine tetraacetate cop per complex is added for each liter of solution.
This solution will produce. a brilliant gold deposit up to .005 inch thick. This plating contains traces of copper.
1 Example 3 Sodium gold sulfite 3 to 4 grams per liter.
Hexamethyleneamine C H N 40 grams per liter. Temperature F. to F. Current density 1 to 3 amperes per square foot. Anode Insoluble.
v Example 4 Sodium gold sulfite grams per liter 3 to 4 Hexamethyleneamine C H N do 40 Ethylenediaminetetraacetic acid (disodium ethylenediamine tetraacetate), 40% cc 40 Disodium ethylenediamine tetraacetate is used as a chelating agent. Other chelating agents may be used, such as sodium pyrophosphate, but the E.D.T.A. is the preferred compound.
In all of the aboe examples sodium gold sulfite serves as the gold supply salt as well as the conductive medium and while 3 to 4 grams per liter is the preferred concentration, and given in all of the examples, it may be varied from this concentration to contain more or less gold and this expression refers to the actual gold content, and not to the gross weight of the complex.
Wherein in the above examples, sodium gold sulfite complex has been used, potassium sulfite or other metal sulfites of the alkali metal group may also be used to form the complex; but the preferred material is the sodium or potassium sulfite.
The gold complex is prepared by taking a gold chloride solution and adding ammonium hydroxide to it to produce a precipitate. This is then filtered and washed and dissolved by adding an alkali sulfite. The sodium and potassium sulfites are the preferred materials. This then produces a solution containing all of the gold originally present as the chloride. This solution is the solution used in the above examples and referred to as the sodium gold sulfite complex. The exact composition of this salt has not been determined, but it is believed that this has the formula:
The base article to be gold plates is cleaned by any known method and is usually polished and has the gold applied thereto in thicknesses of 1 to 3 millionths of an inch, but the present process allows, for the first time, a heavier plating of gold, up to 0.01 inch or even thicker, and the plate is bright and does not need polishing, as the plate acquires a greater brilliance as the depth of the gold increases.
The gold in the plate, as described in the present invention, is a dense, compact, fine-grained deposit and is not of the porous nature obtained by the deposition of gold in the usual cyanide bath. This novel deposit produces an article that has heretofore been unknown.
The surface of the base article, as pointed out above, must be cleaned, but it does not have to be polished in order to deposit thereon a gold plate of high brilliancy. This is also obtained by this process for the first time, as heretofore it has been necessary in order to obtain a bright plate to have the base metal of the same or greater brightness.
While in accordance with the provisions of the statute,
there has been described the best form of embodiment of this invention known, it will be apparent to those skilled in the art that changes may be made in the process without departing from the spirit of this invention as set forth in the appended claims, and that in some cases certain features may be used to advantage without a corresponding use of other features.
What is claimed is:
1. A process for coating the surface of a conductive article which comprises, immersing the article in an electrolytic bath cyanide free containing a sodium gold sulfite complex, and passing an electric current between an anode and said article as a cathode.
2. An electrolytic bath cyanide free containing a potassium gold sulfite complex and disodium ethylenediamine tetraacetate.
3. An electrolytic bath cyanide free containing a sodium gold sulfite complex and disodium ethylenediamine tetraacetate.
4. A process for coating the surface of a conductive article which comprises, immersing the article in an electrolytic bath cyanide free containing a sodium gold sulfite complex, and a soluble salt of another metal and passing an electric current between an anode and said article as a cathode.
References Cited in the file of this patent UNITED STATES PATENTS 923,864 Levy June 8, 1909 967,488 Baker Aug. 16, 1910 1,581,030 Smith Apr. 13, 1926 2,654,702 De Long Oct. 6, 1953 2,724,687 Spreter et al. Nov. 22, 1955 2,765,269 Ostrow et al. Oct. 2, 1956 2,801,960 Seegmiller Aug. 6, 1957 FOREIGN PATENTS 105,299 Germany Aug. 2, 1899 998,841 France Sept. 26, 1951 OTHER REFERENCES Mellor: Comprehensive Treatise on Inorganic and Theoretical Chemistry, vol. 10, 1930, pages 280, 281.
Claims (1)
- 4. A PROCESS FOR COATING THE SURFACE OF A CONDUCTIVE ARTICLE WHICH COMPRISES, IMMERSING THE ARTICLE IN AN ELECTROLYTIC BATH CYANIDE FREE CONTAINING A SODIUM GOLD SULFITE COMPLEX, AND A SOLUBLE SALT OF ANOTHER METAN AND PASSING AN ELECTRIC CURRENT BETWEEN AN ANODE AND SAID ARTICLE AS A CATHODE.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US795613A US3057789A (en) | 1959-02-26 | 1959-02-26 | Gold plating bath and process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US795613A US3057789A (en) | 1959-02-26 | 1959-02-26 | Gold plating bath and process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US3057789A true US3057789A (en) | 1962-10-09 |
Family
ID=25166003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US795613A Expired - Lifetime US3057789A (en) | 1959-02-26 | 1959-02-26 | Gold plating bath and process |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US3057789A (en) |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3475292A (en) * | 1966-02-10 | 1969-10-28 | Technic | Gold plating bath and process |
| US3505182A (en) * | 1965-10-01 | 1970-04-07 | Texas Instruments Inc | Method and solution for gold electroplating |
| US3516848A (en) * | 1965-10-18 | 1970-06-23 | Sel Rex Corp | Process and solution for sensitizing substrates for electroless plating |
| DE2039157A1 (en) * | 1969-08-08 | 1971-02-18 | Sel Rex Corp | Electrolysis bath |
| US3883409A (en) * | 1972-07-10 | 1975-05-13 | Degussa | Gold alloy electroplating bath |
| US3904493A (en) * | 1972-08-10 | 1975-09-09 | Oxy Metal Industries Corp | Gold sulfite baths containing organophosphorus compounds |
| US3966880A (en) * | 1975-06-17 | 1976-06-29 | American Chemical & Refining Company Inc. | Method for producing alkali metal gold sulfite |
| US3990954A (en) * | 1973-12-17 | 1976-11-09 | Oxy Metal Industries Corporation | Sulfite gold plating bath and process |
| US4012294A (en) * | 1972-08-10 | 1977-03-15 | Oxy Metal Industries Corporation | Gold sulfite baths containing organophosphorous compounds |
| DE2829980A1 (en) * | 1977-08-29 | 1979-03-15 | Systemes Traitements Surfaces | Aqueous solution of monovalent ammonium gold sulphite, the process for its production and the electrolysis bath containing this solution |
| FR2460345A1 (en) * | 1979-07-03 | 1981-01-23 | Smagunova Nina | Stable gold electroplating soln. - contg. potassium EDTA gold sulphate complex, alkali metal EDTA salt, potassium sulphate and potassium hydrogen phosphate |
| US4334294A (en) * | 1979-07-20 | 1982-06-08 | International Business Machines Corporation | Restore circuit for a semiconductor storage |
| US4497696A (en) * | 1982-01-18 | 1985-02-05 | Shemyakina Elena V | Gold-plating electrolyte and process for preparing same |
| US5277790A (en) * | 1992-07-10 | 1994-01-11 | Technic Incorporated | Non-cyanide electroplating solution for gold or alloys thereof |
| US6126807A (en) * | 1999-04-30 | 2000-10-03 | Lucent Technologies Inc. | Process for making sodium gold sulfite solution |
| US6165342A (en) * | 1996-07-23 | 2000-12-26 | Degussa Huls Aktiengesellschaft | Cyanide-free electroplating bath for the deposition of gold and gold alloys |
| DE112021008234T5 (en) | 2021-09-16 | 2024-07-11 | P & S, Galvasols | HIGH SPEED ELECTROFORMING/ELECTROPLATING BATH FOR PURE GOLD |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE105299C (en) * | ||||
| US923864A (en) * | 1908-02-03 | 1909-06-08 | Alfred Levy | Process for the electric dissociation of metals by the wet method. |
| US967488A (en) * | 1909-05-17 | 1910-08-16 | Alexander A Eberson | Process of making barium sulfite. |
| US1581030A (en) * | 1925-09-03 | 1926-04-13 | Smith Stanley Cochran | Process of forming sulphite of lead |
| FR998841A (en) * | 1949-10-10 | 1952-01-23 | Direct silver plating of metals | |
| US2654702A (en) * | 1948-09-03 | 1953-10-06 | Dow Chemical Co | Electrodepostion of metal from alkaline cyanide bath |
| US2724687A (en) * | 1952-05-08 | 1955-11-22 | Spreter Victor | Baths for the deposit of gold alloys by electroplating |
| US2765269A (en) * | 1954-11-19 | 1956-10-02 | Barnet D Ostrow | Bath for plating bright gold |
| US2801960A (en) * | 1956-09-06 | 1957-08-06 | Seegmiller Robert | Gold plating process |
-
1959
- 1959-02-26 US US795613A patent/US3057789A/en not_active Expired - Lifetime
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE105299C (en) * | ||||
| US923864A (en) * | 1908-02-03 | 1909-06-08 | Alfred Levy | Process for the electric dissociation of metals by the wet method. |
| US967488A (en) * | 1909-05-17 | 1910-08-16 | Alexander A Eberson | Process of making barium sulfite. |
| US1581030A (en) * | 1925-09-03 | 1926-04-13 | Smith Stanley Cochran | Process of forming sulphite of lead |
| US2654702A (en) * | 1948-09-03 | 1953-10-06 | Dow Chemical Co | Electrodepostion of metal from alkaline cyanide bath |
| FR998841A (en) * | 1949-10-10 | 1952-01-23 | Direct silver plating of metals | |
| US2724687A (en) * | 1952-05-08 | 1955-11-22 | Spreter Victor | Baths for the deposit of gold alloys by electroplating |
| US2765269A (en) * | 1954-11-19 | 1956-10-02 | Barnet D Ostrow | Bath for plating bright gold |
| US2801960A (en) * | 1956-09-06 | 1957-08-06 | Seegmiller Robert | Gold plating process |
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3505182A (en) * | 1965-10-01 | 1970-04-07 | Texas Instruments Inc | Method and solution for gold electroplating |
| US3516848A (en) * | 1965-10-18 | 1970-06-23 | Sel Rex Corp | Process and solution for sensitizing substrates for electroless plating |
| US3475292A (en) * | 1966-02-10 | 1969-10-28 | Technic | Gold plating bath and process |
| DE2039157A1 (en) * | 1969-08-08 | 1971-02-18 | Sel Rex Corp | Electrolysis bath |
| FR2060092A1 (en) * | 1969-08-08 | 1971-06-11 | Sel Rex Corp | |
| US3883409A (en) * | 1972-07-10 | 1975-05-13 | Degussa | Gold alloy electroplating bath |
| US3904493A (en) * | 1972-08-10 | 1975-09-09 | Oxy Metal Industries Corp | Gold sulfite baths containing organophosphorus compounds |
| US4012294A (en) * | 1972-08-10 | 1977-03-15 | Oxy Metal Industries Corporation | Gold sulfite baths containing organophosphorous compounds |
| US3990954A (en) * | 1973-12-17 | 1976-11-09 | Oxy Metal Industries Corporation | Sulfite gold plating bath and process |
| US3966880A (en) * | 1975-06-17 | 1976-06-29 | American Chemical & Refining Company Inc. | Method for producing alkali metal gold sulfite |
| DE2829980A1 (en) * | 1977-08-29 | 1979-03-15 | Systemes Traitements Surfaces | Aqueous solution of monovalent ammonium gold sulphite, the process for its production and the electrolysis bath containing this solution |
| US4192723A (en) * | 1977-08-29 | 1980-03-11 | Systemes De Traitements De Surfaces S.A. | Aqueous solution of monovalent gold and ammonium sulfite complex, process for the preparation thereof and electrolytic bath obtained therefrom for the plating of gold or gold alloys |
| FR2460345A1 (en) * | 1979-07-03 | 1981-01-23 | Smagunova Nina | Stable gold electroplating soln. - contg. potassium EDTA gold sulphate complex, alkali metal EDTA salt, potassium sulphate and potassium hydrogen phosphate |
| US4334294A (en) * | 1979-07-20 | 1982-06-08 | International Business Machines Corporation | Restore circuit for a semiconductor storage |
| US4497696A (en) * | 1982-01-18 | 1985-02-05 | Shemyakina Elena V | Gold-plating electrolyte and process for preparing same |
| US5277790A (en) * | 1992-07-10 | 1994-01-11 | Technic Incorporated | Non-cyanide electroplating solution for gold or alloys thereof |
| US6165342A (en) * | 1996-07-23 | 2000-12-26 | Degussa Huls Aktiengesellschaft | Cyanide-free electroplating bath for the deposition of gold and gold alloys |
| US6126807A (en) * | 1999-04-30 | 2000-10-03 | Lucent Technologies Inc. | Process for making sodium gold sulfite solution |
| US6423202B1 (en) | 1999-04-30 | 2002-07-23 | Lucent Technologies Inc | Process for making gold salt for use in electroplating |
| DE112021008234T5 (en) | 2021-09-16 | 2024-07-11 | P & S, Galvasols | HIGH SPEED ELECTROFORMING/ELECTROPLATING BATH FOR PURE GOLD |
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