US2742413A - Bright copper plating bath - Google Patents
Bright copper plating bath Download PDFInfo
- Publication number
- US2742413A US2742413A US348581A US34858153A US2742413A US 2742413 A US2742413 A US 2742413A US 348581 A US348581 A US 348581A US 34858153 A US34858153 A US 34858153A US 2742413 A US2742413 A US 2742413A
- Authority
- US
- United States
- Prior art keywords
- bath
- copper
- thiourea
- plating bath
- copper plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 title claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title description 32
- 229910052802 copper Inorganic materials 0.000 title description 32
- 239000010949 copper Substances 0.000 title description 32
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims description 26
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 13
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 claims description 8
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims description 8
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 claims description 8
- LRFVTYWOQMYALW-UHFFFAOYSA-N 9H-xanthine Chemical compound O=C1NC(=O)NC2=C1NC=N2 LRFVTYWOQMYALW-UHFFFAOYSA-N 0.000 claims description 7
- HTKFORQRBXIQHD-UHFFFAOYSA-N allylthiourea Chemical compound NC(=S)NCC=C HTKFORQRBXIQHD-UHFFFAOYSA-N 0.000 claims description 5
- 229960001748 allylthiourea Drugs 0.000 claims description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 4
- 235000010299 hexamethylene tetramine Nutrition 0.000 claims description 4
- 239000004312 hexamethylene tetramine Substances 0.000 claims description 4
- 229960004011 methenamine Drugs 0.000 claims description 4
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 claims description 4
- 229940075420 xanthine Drugs 0.000 claims description 3
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 2
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 claims 1
- WCYWZMWISLQXQU-UHFFFAOYSA-N methyl Chemical class [CH3] WCYWZMWISLQXQU-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 description 10
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- RYYVLZVUVIJVGH-UHFFFAOYSA-N caffeine Chemical compound CN1C(=O)N(C)C(=O)C2=C1N=CN2C RYYVLZVUVIJVGH-UHFFFAOYSA-N 0.000 description 6
- 239000000945 filler Substances 0.000 description 6
- 150000003585 thioureas Chemical class 0.000 description 6
- 229910017464 nitrogen compound Inorganic materials 0.000 description 5
- IPCRBOOJBPETMF-UHFFFAOYSA-N N-acetylthiourea Chemical compound CC(=O)NC(N)=S IPCRBOOJBPETMF-UHFFFAOYSA-N 0.000 description 4
- -1 methylthiourea Chemical class 0.000 description 4
- YAPQBXQYLJRXSA-UHFFFAOYSA-N theobromine Chemical compound CN1C(=O)NC(=O)C2=C1N=CN2C YAPQBXQYLJRXSA-UHFFFAOYSA-N 0.000 description 4
- LPHGQDQBBGAPDZ-UHFFFAOYSA-N Isocaffeine Natural products CN1C(=O)N(C)C(=O)C2=C1N(C)C=N2 LPHGQDQBBGAPDZ-UHFFFAOYSA-N 0.000 description 3
- 229960001948 caffeine Drugs 0.000 description 3
- VJEONQKOZGKCAK-UHFFFAOYSA-N caffeine Natural products CN1C(=O)N(C)C(=O)C2=C1C=CN2C VJEONQKOZGKCAK-UHFFFAOYSA-N 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- ZFXYFBGIUFBOJW-UHFFFAOYSA-N theophylline Chemical compound O=C1N(C)C(=O)N(C)C2=C1NC=N2 ZFXYFBGIUFBOJW-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 description 2
- 229910052921 ammonium sulfate Inorganic materials 0.000 description 2
- 235000011130 ammonium sulphate Nutrition 0.000 description 2
- 239000001166 ammonium sulphate Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 125000000623 heterocyclic group Chemical group 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 150000002830 nitrogen compounds Chemical class 0.000 description 2
- 229960004559 theobromine Drugs 0.000 description 2
- 229960000278 theophylline Drugs 0.000 description 2
- KQJQICVXLJTWQD-UHFFFAOYSA-N N-Methylthiourea Chemical compound CNC(N)=S KQJQICVXLJTWQD-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910001651 emery Inorganic materials 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 150000003222 pyridines Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Definitions
- the acid copper bath in so far makes a favorable exception on the baths, that it has some filling action, in other words, partially fills up gaps, pits and other unevennesses in the surface so that one aimed at improving the filling action of the copper bath, while maintaining other favorable properties such as the capacity to deposit a soft coating on the metal, etc.
- objects are electrolytically provided with a copper deposit with the aid of an acid bath by using a bath con taining the combination of a water-soluble derivative of thiourea and a water-soluble heterocyclic nitrogen compound.
- the invention extends to the preparation of an acid copper bath containing the combination of thiourea or a added tothe-bath in combination with the heterocyclic nitrogen compounds allyl thiourea is preferred as well"
- the invention is elucidated by the followingsiexarnpleszi' I Example I V
- This bath was brought at a temperature of 30 C. and was kept in motion by blowing in a current of air.
- the anode was of copper.
- As the cathode a 50 cm. long iron tube with a diameter of 3.5 cm. and a wall thickness of 2 mm.
- the cathode current density of the main treatment in 1 the acid copper bath according to the invention was adjusted to 8 a./dm. and in 20 minutes 32; of copper was deposited on the tube.
- the copper layer was soft and lustrous, and the numerous unevennesses originally present on the surface of the tube, had substantially disappeared after the electro-deposition of the copper in the above-described bath.
- Example III An acid copper bath of the following composition was prepared:
- a bright copper plating bath comprising copper sulfate, sulfuric acid, a brightener in proportion of 5 to mg. per liter of solution, said brightener being selected from the group consisting of thiourea, allylthiourea and acetylthiourea, and a filler selected from the group consisting of xanthine and its methyl homologues, hexamethylene tetramine, pyridine and morpholine.
- a bath according to claim 1, wherein said brightener is allylthiourea.
- a bath according to claim 1, wherein said brightener is acetylthiourea.
- a bath according to claim 1 hexamethylene tetramine.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL2742412X | 1952-07-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US2742413A true US2742413A (en) | 1956-04-17 |
Family
ID=19875526
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US348581A Expired - Lifetime US2742413A (en) | 1952-07-05 | 1953-04-13 | Bright copper plating bath |
| US348582A Expired - Lifetime US2742412A (en) | 1952-07-05 | 1953-04-13 | Electrolytic deposition of copper |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US348582A Expired - Lifetime US2742412A (en) | 1952-07-05 | 1953-04-13 | Electrolytic deposition of copper |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US2742413A (xx) |
| BE (1) | BE518440A (xx) |
| DE (2) | DE962129C (xx) |
| NL (4) | NL170870B (xx) |
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3075899A (en) * | 1958-04-26 | 1963-01-29 | Dehydag Gmbh | Baths for the production of metal electroplates |
| US4009087A (en) * | 1974-11-21 | 1977-02-22 | M&T Chemicals Inc. | Electrodeposition of copper |
| EP0952242A1 (en) * | 1998-04-21 | 1999-10-27 | Applied Materials, Inc. | Electro deposition chemistry |
| US20020113039A1 (en) * | 1999-07-09 | 2002-08-22 | Mok Yeuk-Fai Edwin | Integrated semiconductor substrate bevel cleaning apparatus and method |
| US6478937B2 (en) | 2001-01-19 | 2002-11-12 | Applied Material, Inc. | Substrate holder system with substrate extension apparatus and associated method |
| US6551484B2 (en) | 1999-04-08 | 2003-04-22 | Applied Materials, Inc. | Reverse voltage bias for electro-chemical plating system and method |
| US6571657B1 (en) | 1999-04-08 | 2003-06-03 | Applied Materials Inc. | Multiple blade robot adjustment apparatus and associated method |
| US6576110B2 (en) | 2000-07-07 | 2003-06-10 | Applied Materials, Inc. | Coated anode apparatus and associated method |
| US20030146102A1 (en) * | 2002-02-05 | 2003-08-07 | Applied Materials, Inc. | Method for forming copper interconnects |
| US6610189B2 (en) | 2001-01-03 | 2003-08-26 | Applied Materials, Inc. | Method and associated apparatus to mechanically enhance the deposition of a metal film within a feature |
| US20030201166A1 (en) * | 2002-04-29 | 2003-10-30 | Applied Materials, Inc. | method for regulating the electrical power applied to a substrate during an immersion process |
| US20030201184A1 (en) * | 1999-04-08 | 2003-10-30 | Applied Materials, Inc. | Method and associated apparatus for tilting a substrate upon entry for metal deposition |
| US20040020780A1 (en) * | 2001-01-18 | 2004-02-05 | Hey H. Peter W. | Immersion bias for use in electro-chemical plating system |
| US20040200725A1 (en) * | 2003-04-09 | 2004-10-14 | Applied Materials Inc. | Application of antifoaming agent to reduce defects in a semiconductor electrochemical plating process |
| US20040206628A1 (en) * | 2003-04-18 | 2004-10-21 | Applied Materials, Inc. | Electrical bias during wafer exit from electrolyte bath |
| US6808612B2 (en) | 2000-05-23 | 2004-10-26 | Applied Materials, Inc. | Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio |
| US20050092601A1 (en) * | 2003-10-29 | 2005-05-05 | Harald Herchen | Electrochemical plating cell having a diffusion member |
| US20050092602A1 (en) * | 2003-10-29 | 2005-05-05 | Harald Herchen | Electrochemical plating cell having a membrane stack |
| US6913680B1 (en) | 2000-05-02 | 2005-07-05 | Applied Materials, Inc. | Method of application of electrical biasing to enhance metal deposition |
| US20060102467A1 (en) * | 2004-11-15 | 2006-05-18 | Harald Herchen | Current collimation for thin seed and direct plating |
| US20060175201A1 (en) * | 2005-02-07 | 2006-08-10 | Hooman Hafezi | Immersion process for electroplating applications |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE962489C (de) * | 1954-02-10 | 1957-04-25 | Dehydag Gmbh | Sparbeizmittel zum Schutze von Metallen bei der Behandlung mit sauren Mitteln |
| DE1007592B (de) * | 1955-01-19 | 1957-05-02 | Dehydag Gmbh | Bad zur Herstellung von galvanischen Metallueberzuegen |
| US2853443A (en) * | 1956-04-25 | 1958-09-23 | Westinghouse Electric Corp | Addition agent for acid copper electrolytes |
| BE565994A (xx) * | 1957-04-16 | |||
| US2931760A (en) * | 1957-09-25 | 1960-04-05 | Leon R Westbrook | Acid copper plating |
| US3770599A (en) * | 1971-05-24 | 1973-11-06 | Oxy Metal Finishing Corp | Acid zinc plating baths |
| US4474649A (en) * | 1982-06-21 | 1984-10-02 | Asarco Incorporated | Method of thiourea addition of electrolytic solutions useful for copper refining |
| JPH02232391A (ja) * | 1988-12-21 | 1990-09-14 | Internatl Business Mach Corp <Ibm> | アデイテイブ鍍金浴および方法 |
| US6565729B2 (en) * | 1998-03-20 | 2003-05-20 | Semitool, Inc. | Method for electrochemically depositing metal on a semiconductor workpiece |
| TWI223678B (en) * | 1998-03-20 | 2004-11-11 | Semitool Inc | Process for applying a metal structure to a workpiece, the treated workpiece and a solution for electroplating copper |
| US20100140098A1 (en) * | 2008-05-15 | 2010-06-10 | Solopower, Inc. | Selenium containing electrodeposition solution and methods |
| EP3074552A1 (en) * | 2013-11-25 | 2016-10-05 | Enthone, Inc. | Electrodeposition of copper |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2391289A (en) * | 1941-09-15 | 1945-12-18 | Jr John F Beaver | Bright copper plating |
| CA461186A (en) * | 1949-11-22 | John Franklin Beaver, Jr. | Bright copper plating | |
| US2700020A (en) * | 1952-06-02 | 1955-01-18 | Houdaille Hershey Corp | Plating copper |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA477508A (en) * | 1951-10-02 | Brown Henry | Electrodeposition of nickel from acid baths | |
| DE104111C (xx) * | ||||
| US2196588A (en) * | 1937-05-26 | 1940-04-09 | Du Pont | Electroplating |
| US2315802A (en) * | 1940-04-20 | 1943-04-06 | Harshaw Chem Corp | Nickel plating |
| US2389179A (en) * | 1941-02-21 | 1945-11-20 | Udylite Corp | Electrodeposition of metals |
| US2489538A (en) * | 1941-05-24 | 1949-11-29 | Gen Motors Corp | Electrodeposition of copper |
| US2355505A (en) * | 1941-10-03 | 1944-08-08 | Purdue Research Foundation | Electrodeposition of bright zinc |
| US2462870A (en) * | 1942-07-09 | 1949-03-01 | Gen Motors Corp | Electrodeposition of copper |
| US2472393A (en) * | 1944-09-25 | 1949-06-07 | American Steel & Wire Co | Process and bath for copper coating ferrous metal |
| BE504701A (xx) * | 1950-07-17 |
-
0
- NL NL81606D patent/NL81606C/xx active
- NL NL84048D patent/NL84048C/xx active
- NL NLAANVRAGE7413473,A patent/NL170871B/xx unknown
- NL NLAANVRAGE7106028,A patent/NL170870B/xx unknown
- BE BE518440D patent/BE518440A/xx unknown
-
1952
- 1952-07-30 DE DEN5865A patent/DE962129C/de not_active Expired
- 1952-07-30 DE DEN5864A patent/DE940860C/de not_active Expired
-
1953
- 1953-04-13 US US348581A patent/US2742413A/en not_active Expired - Lifetime
- 1953-04-13 US US348582A patent/US2742412A/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA461186A (en) * | 1949-11-22 | John Franklin Beaver, Jr. | Bright copper plating | |
| US2391289A (en) * | 1941-09-15 | 1945-12-18 | Jr John F Beaver | Bright copper plating |
| US2700020A (en) * | 1952-06-02 | 1955-01-18 | Houdaille Hershey Corp | Plating copper |
Cited By (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3075899A (en) * | 1958-04-26 | 1963-01-29 | Dehydag Gmbh | Baths for the production of metal electroplates |
| US4009087A (en) * | 1974-11-21 | 1977-02-22 | M&T Chemicals Inc. | Electrodeposition of copper |
| US6610191B2 (en) | 1998-04-21 | 2003-08-26 | Applied Materials, Inc. | Electro deposition chemistry |
| US6350366B1 (en) | 1998-04-21 | 2002-02-26 | Applied Materials, Inc. | Electro deposition chemistry |
| EP0952242A1 (en) * | 1998-04-21 | 1999-10-27 | Applied Materials, Inc. | Electro deposition chemistry |
| US6113771A (en) * | 1998-04-21 | 2000-09-05 | Applied Materials, Inc. | Electro deposition chemistry |
| US20030205474A1 (en) * | 1998-04-21 | 2003-11-06 | Applied Materials, Inc. | Electro deposition chemistry |
| US20030201184A1 (en) * | 1999-04-08 | 2003-10-30 | Applied Materials, Inc. | Method and associated apparatus for tilting a substrate upon entry for metal deposition |
| US6551484B2 (en) | 1999-04-08 | 2003-04-22 | Applied Materials, Inc. | Reverse voltage bias for electro-chemical plating system and method |
| US6571657B1 (en) | 1999-04-08 | 2003-06-03 | Applied Materials Inc. | Multiple blade robot adjustment apparatus and associated method |
| US20020113039A1 (en) * | 1999-07-09 | 2002-08-22 | Mok Yeuk-Fai Edwin | Integrated semiconductor substrate bevel cleaning apparatus and method |
| US20030213772A9 (en) * | 1999-07-09 | 2003-11-20 | Mok Yeuk-Fai Edwin | Integrated semiconductor substrate bevel cleaning apparatus and method |
| US6913680B1 (en) | 2000-05-02 | 2005-07-05 | Applied Materials, Inc. | Method of application of electrical biasing to enhance metal deposition |
| US6808612B2 (en) | 2000-05-23 | 2004-10-26 | Applied Materials, Inc. | Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio |
| US6576110B2 (en) | 2000-07-07 | 2003-06-10 | Applied Materials, Inc. | Coated anode apparatus and associated method |
| US6610189B2 (en) | 2001-01-03 | 2003-08-26 | Applied Materials, Inc. | Method and associated apparatus to mechanically enhance the deposition of a metal film within a feature |
| US20040020780A1 (en) * | 2001-01-18 | 2004-02-05 | Hey H. Peter W. | Immersion bias for use in electro-chemical plating system |
| US6478937B2 (en) | 2001-01-19 | 2002-11-12 | Applied Material, Inc. | Substrate holder system with substrate extension apparatus and associated method |
| US20030146102A1 (en) * | 2002-02-05 | 2003-08-07 | Applied Materials, Inc. | Method for forming copper interconnects |
| US20030201166A1 (en) * | 2002-04-29 | 2003-10-30 | Applied Materials, Inc. | method for regulating the electrical power applied to a substrate during an immersion process |
| US6911136B2 (en) | 2002-04-29 | 2005-06-28 | Applied Materials, Inc. | Method for regulating the electrical power applied to a substrate during an immersion process |
| US20040200725A1 (en) * | 2003-04-09 | 2004-10-14 | Applied Materials Inc. | Application of antifoaming agent to reduce defects in a semiconductor electrochemical plating process |
| US20040206628A1 (en) * | 2003-04-18 | 2004-10-21 | Applied Materials, Inc. | Electrical bias during wafer exit from electrolyte bath |
| US20050092601A1 (en) * | 2003-10-29 | 2005-05-05 | Harald Herchen | Electrochemical plating cell having a diffusion member |
| US20050092602A1 (en) * | 2003-10-29 | 2005-05-05 | Harald Herchen | Electrochemical plating cell having a membrane stack |
| US20060102467A1 (en) * | 2004-11-15 | 2006-05-18 | Harald Herchen | Current collimation for thin seed and direct plating |
| US20060175201A1 (en) * | 2005-02-07 | 2006-08-10 | Hooman Hafezi | Immersion process for electroplating applications |
Also Published As
| Publication number | Publication date |
|---|---|
| US2742412A (en) | 1956-04-17 |
| NL170870B (nl) | |
| DE962129C (de) | 1957-04-18 |
| BE518440A (xx) | |
| NL170871B (nl) | |
| NL84048C (xx) | |
| DE940860C (de) | 1956-03-29 |
| NL81606C (xx) |
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