US2572228A - Etch for offset plate making - Google Patents
Etch for offset plate making Download PDFInfo
- Publication number
- US2572228A US2572228A US175030A US17503050A US2572228A US 2572228 A US2572228 A US 2572228A US 175030 A US175030 A US 175030A US 17503050 A US17503050 A US 17503050A US 2572228 A US2572228 A US 2572228A
- Authority
- US
- United States
- Prior art keywords
- etch
- chloride
- solution
- chromium
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000243 solution Substances 0.000 description 18
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 15
- 229910052804 chromium Inorganic materials 0.000 description 14
- 239000011651 chromium Substances 0.000 description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 13
- 229910052802 copper Inorganic materials 0.000 description 13
- 239000010949 copper Substances 0.000 description 13
- 239000002253 acid Substances 0.000 description 10
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 8
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 7
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 6
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical class [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 6
- 239000001110 calcium chloride Substances 0.000 description 6
- 229910001628 calcium chloride Inorganic materials 0.000 description 6
- 235000011148 calcium chloride Nutrition 0.000 description 6
- 229920000084 Gum arabic Polymers 0.000 description 5
- 241000978776 Senegalia senegal Species 0.000 description 5
- 239000000205 acacia gum Substances 0.000 description 5
- 235000010489 acacia gum Nutrition 0.000 description 5
- 235000007831 chromium(III) chloride Nutrition 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 4
- 235000011147 magnesium chloride Nutrition 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 3
- 150000001805 chlorine compounds Chemical class 0.000 description 3
- 229960000359 chromic chloride Drugs 0.000 description 3
- LJAOOBNHPFKCDR-UHFFFAOYSA-K chromium(3+) trichloride hexahydrate Chemical compound O.O.O.O.O.O.[Cl-].[Cl-].[Cl-].[Cr+3] LJAOOBNHPFKCDR-UHFFFAOYSA-K 0.000 description 3
- 239000011636 chromium(III) chloride Substances 0.000 description 3
- 239000003517 fume Substances 0.000 description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 239000011575 calcium Substances 0.000 description 2
- AHXGRMIPHCAXFP-UHFFFAOYSA-L chromyl dichloride Chemical class Cl[Cr](Cl)(=O)=O AHXGRMIPHCAXFP-UHFFFAOYSA-L 0.000 description 2
- 229910001629 magnesium chloride Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- YZCKVEUIGOORGS-UHFFFAOYSA-N Hydrogen atom Chemical compound [H] YZCKVEUIGOORGS-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric Acid Chemical class [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical class Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 235000015165 citric acid Nutrition 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000004451 qualitative analysis Methods 0.000 description 1
- 239000012047 saturated solution Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/04—Printing plates or foils; Materials therefor metallic
- B41N1/08—Printing plates or foils; Materials therefor metallic for lithographic printing
- B41N1/10—Printing plates or foils; Materials therefor metallic for lithographic printing multiple
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/26—Acidic compositions for etching refractory metals
Definitions
- This invention relates to the art of lithographic printing. and is directed at the production or a material which will dissolve chromium without attacking either copper or a light hardene bichromated gum arabic solution.
- a lithographic plate consisting of a grained copper surface coated with chromium in all but'the printing areas.
- the plate is made from a blank in which a continuous chrome layer covers the copper; this plate is coated with a bichromated gum arabic solution, exposed through a positive to harden the nonprinting areas, developed with a conventional developer which removes the unhardened gum coating without attacking the light-hardened portion, and then treated with an etching solution whose function it is to dissolve the chromium in the portions where it has been laid bare by the developer, without attacking the copper or the light-hardened gum fllm.
- My new etch consists of a concentrated aqueous solution or a water-soluble chloride of the group consisting of calcium and maghesium chlorides, a small amount of acid, and a r proportion of a chromic. or stannic salt.
- the essential base 01 my etch is a rather concentrated aqueous solution of a very watersoluble chloride; these concentrated solutions are widely used in ofiset plate making, since they reduce the solubility of the hardened gum solution in the aqueous system.
- Calcium chloride seems to give me best results, with magnesium chlorides reasonably close to it in action. alkali metal, barium, strontium and aluminum chlorides do not yield solutions which are sumciently inert to the hardened gum solution; the
- chromic and stannic salts which are preferably present as the chloride
- other easily reducible salts are either not sufliciently soluble, or reduce to the metal and plate out, or attack the copper or the resist, or both.
- Typical satisfactory etches include the following:
- Example 1 16 liquid ounces 415 Be. calcium chloride solution (79% CaChGHiO) 4 liquid ounces Be. chromic chloride solution (saturated solution) liquid ounce concentrated nitric acid This etches chromium rapidly without fuming, and without attacking copper.
- Example 3 Like Example 1, but substituting concentrated magnesium chloride solution of the calcium chloride.
- Example 4 As will be noted. the etches consist of essentially concentrated solutions, a major proportion of calcium or magnesium chloride, a minor proportion of tin or chromic chloride, and a small amount oi acid suilicient to get the pH down below 2.0.
- An etch which dissolves chromium without attacking copper, and which has relatively slow action on a light-hardened bichromated gum arabic film consisting of a concentrated solution of a chloride of the group consisting of calcium and magnesium chlorides, a minor proportion of a concentrated solution of a chloride of the group consisting of stannic and chromic chlorides, and a small amount of acid suflicient to reduce the pH to below 2.0.
- etch which dissolves chromium without attacking copper, and which has relatively slow action on.
- a light-hardened bichromated gum arabic illm. consisting of a concentrated solution of calcium chloride, a minor proportion of a concentrated solution of a chloride of the group consisting oi stannic and chromic chlorides, and hydrochhoric acid suiiicient to reduce the pH to below 2.
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Printing Plates And Materials Therefor (AREA)
- ing And Chemical Polishing (AREA)
Description
Patented Oct. 23, 1951 ETCH FOB OFFSET PLATE MAKING Paul .I. Whyzmnsis, Jamaica, is. Y assignor to Interchemlcal Corporation, New f rk, N. Y., a
corporation of Ohio No Drawing. Application July 20, 1950, Serial No. 175,030
Claims. (CI. 41-42) This invention relates to the art of lithographic printing. and is directed at the production or a material which will dissolve chromium without attacking either copper or a light hardene bichromated gum arabic solution.
In my U. S. Patent No. 2,291,854, issued August 4, 1942, there is described a lithographic plate consisting of a grained copper surface coated with chromium in all but'the printing areas. The plate is made from a blank in which a continuous chrome layer covers the copper; this plate is coated with a bichromated gum arabic solution, exposed through a positive to harden the nonprinting areas, developed with a conventional developer which removes the unhardened gum coating without attacking the light-hardened portion, and then treated with an etching solution whose function it is to dissolve the chromium in the portions where it has been laid bare by the developer, without attacking the copper or the light-hardened gum fllm.
In the past, this etch has consisted of various chemicals which yield hydrochloric acid, which reacts vigorously with chromium but does not attack copper. Unfortunately, such etches fume badly, making it disagreeable to work over the plate unless special fume control is provided.
A number of materials which do not fume have been developed, but they either act very slowly on the chromium or they produce difliculties by attacking either the resist or the copper.
l have discovered a non-fuming etch which attacks chromium without attacking copper. and which does not attack the resist for a much longer period than is required for complete etching of the chromium. My new etch consists of a concentrated aqueous solution or a water-soluble chloride of the group consisting of calcium and maghesium chlorides, a small amount of acid, and a r proportion of a chromic. or stannic salt.
The essential base 01 my etch is a rather concentrated aqueous solution of a very watersoluble chloride; these concentrated solutions are widely used in ofiset plate making, since they reduce the solubility of the hardened gum solution in the aqueous system. Calcium chloride seems to give me best results, with magnesium chlorides reasonably close to it in action. alkali metal, barium, strontium and aluminum chlorides do not yield solutions which are sumciently inert to the hardened gum solution; the
same applies to most other chlorides except zinc. which I have found is an inhibitor tor the etching of chromium. and ferric chloride. which attackscopper.
Tothebaseladdasmallamotmtoianacid:
The
about 2 liquid ounces of commercial acid per gallon of chloride solution seems to be an optimum quantity. Less acid tends to slow down etching time, while more acid does not speed it up. However, etching is obtained with any quantity from 1 ounce per gallon up (pl-I below 2.0) I have used hydrochloric, nitric, sulphuric, acetic, phosphoric, lactic, hydroxy acetic, citric, oxalic, and tartaric acids, and even resorcinol to get the necessary acidity; while some acids (e. g. acetic, phosphoric) are slightly slower, and some give precipitates (e. g. sulfuric with 08.01:) they all can be used. 4
What makes my new etch eflective is the use of a minor proportion of a. control agent of the group consisting of a stannlc or chromic salt, which will react with the nascent hydrogen formed by the reaction of the hydrochloric acid in the etch with chromium, to regenerate hydrochloric acid. This prevents the ebullition of gases, and thus no fuming occurs.
I have found chromic and stannic salts (which are preferably present as the chloride) to be unique in their action; other easily reducible salts are either not sufliciently soluble, or reduce to the metal and plate out, or attack the copper or the resist, or both. I have unsuccessfully tried to use, among others, antimonic, ferric, silver, mercuric and cobaltic chlorides.
Typical satisfactory etches include the following:
Example 1 16 liquid ounces 415 Be. calcium chloride solution (79% CaChGHiO) 4 liquid ounces Be. chromic chloride solution (saturated solution) liquid ounce concentrated nitric acid This etches chromium rapidly without fuming, and without attacking copper.
Ezample 2 Like Example 1, but replacing the concentrated nitric acid by concentrated hydrochloric acid. works equally well.
Example 3 Like Example 1, but substituting concentrated magnesium chloride solution of the calcium chloride.
Example 4 r As will be noted. the etches consist of essentially concentrated solutions, a major proportion of calcium or magnesium chloride, a minor proportion of tin or chromic chloride, and a small amount oi acid suilicient to get the pH down below 2.0.
Obviously, examples can be multiplied, without departing from the spirit of the invention, which is set forth in the claims.
I claim:
1. An etch which dissolves chromium without attacking copper, and which has relatively slow action on a light-hardened bichromated gum arabic film, consisting of a concentrated solution of a chloride of the group consisting of calcium and magnesium chlorides, a minor proportion of a concentrated solution of a chloride of the group consisting of stannic and chromic chlorides, and a small amount of acid suflicient to reduce the pH to below 2.0.
2. An etch which dissolves chromium without attacking copper, and which has relatively slow action on a light-hardened bichromated sum arabic film, consisting of a concentrated solution 01' calcium chloride, a minor proportion of a conamount oi acid suilicient to reduce the pH to below 2.0.
4. An etch which dissolves chromium without attacking copper, and which has relatively slow action on a light-hardened bichromated gum arabic film, consisting of a concentrated solution 0! calcium chloride, a minor proportion of a con centrated solution of chromic chloride, and a small amount of acid suilicient to reduce the pH to below 2.0.
5. An etch which dissolves chromium without attacking copper, and which has relatively slow action on. a light-hardened bichromated gum arabic illm. consisting of a concentrated solution of calcium chloride, a minor proportion of a concentrated solution of a chloride of the group consisting oi stannic and chromic chlorides, and hydrochhoric acid suiiicient to reduce the pH to below 2.
PAUL J. WHYZMUZIS.
REFERENCES CITED The following references are of record in the file of this patent:
UNITED STATES PATENTS Number Name Date 2,220,252 Loeiiler Nov. 5, 1940 2,270,712 Wood Jan. 20, 1942 OTHER REFERENCES Smith: Qualitative Analysis, Educational Publishers, St. Louis, Mo, 1947, pp. 4 and 5.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US175030A US2572228A (en) | 1950-07-20 | 1950-07-20 | Etch for offset plate making |
GB30214/50A GB689338A (en) | 1950-07-20 | 1950-12-11 | Improvements in an etch for making lithographic printing plates |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US175030A US2572228A (en) | 1950-07-20 | 1950-07-20 | Etch for offset plate making |
Publications (1)
Publication Number | Publication Date |
---|---|
US2572228A true US2572228A (en) | 1951-10-23 |
Family
ID=22638545
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US175030A Expired - Lifetime US2572228A (en) | 1950-07-20 | 1950-07-20 | Etch for offset plate making |
Country Status (2)
Country | Link |
---|---|
US (1) | US2572228A (en) |
GB (1) | GB689338A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2687345A (en) * | 1950-11-22 | 1954-08-24 | Printing Dev Inc | Etching composition for lithographic plates |
US2904414A (en) * | 1954-08-04 | 1959-09-15 | Allied Res Products Inc | Formulation for producing a protective bright chemically polished surface on zinc and cadmium |
US2950181A (en) * | 1955-01-14 | 1960-08-23 | Quod Bonum Nv | Method of retouching etchings in intaglio printing forms and printing forms treated according to this method |
US3052582A (en) * | 1959-10-05 | 1962-09-04 | Boeing Co | Process of chemical milling and acid aqueous bath used therefor |
US3061494A (en) * | 1959-10-05 | 1962-10-30 | Boeing Co | Process of chemical milling and acid aqueous bath used therefor |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2220252A (en) * | 1938-06-10 | 1940-11-05 | Addressograph Multigraph | Method of preparing planographic plates |
US2270712A (en) * | 1940-04-12 | 1942-01-20 | Harris Seybold Potter Co | Etching lithographic plates |
-
1950
- 1950-07-20 US US175030A patent/US2572228A/en not_active Expired - Lifetime
- 1950-12-11 GB GB30214/50A patent/GB689338A/en not_active Expired
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2220252A (en) * | 1938-06-10 | 1940-11-05 | Addressograph Multigraph | Method of preparing planographic plates |
US2270712A (en) * | 1940-04-12 | 1942-01-20 | Harris Seybold Potter Co | Etching lithographic plates |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2687345A (en) * | 1950-11-22 | 1954-08-24 | Printing Dev Inc | Etching composition for lithographic plates |
US2904414A (en) * | 1954-08-04 | 1959-09-15 | Allied Res Products Inc | Formulation for producing a protective bright chemically polished surface on zinc and cadmium |
US2950181A (en) * | 1955-01-14 | 1960-08-23 | Quod Bonum Nv | Method of retouching etchings in intaglio printing forms and printing forms treated according to this method |
US3052582A (en) * | 1959-10-05 | 1962-09-04 | Boeing Co | Process of chemical milling and acid aqueous bath used therefor |
US3061494A (en) * | 1959-10-05 | 1962-10-30 | Boeing Co | Process of chemical milling and acid aqueous bath used therefor |
Also Published As
Publication number | Publication date |
---|---|
GB689338A (en) | 1953-03-25 |
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