US20200008318A1 - Fan module and electronic device with the same - Google Patents
Fan module and electronic device with the same Download PDFInfo
- Publication number
- US20200008318A1 US20200008318A1 US16/022,964 US201816022964A US2020008318A1 US 20200008318 A1 US20200008318 A1 US 20200008318A1 US 201816022964 A US201816022964 A US 201816022964A US 2020008318 A1 US2020008318 A1 US 2020008318A1
- Authority
- US
- United States
- Prior art keywords
- fan
- printed circuit
- circuit board
- fan module
- connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D25/00—Pumping installations or systems
- F04D25/02—Units comprising pumps and their driving means
- F04D25/08—Units comprising pumps and their driving means the working fluid being air, e.g. for ventilation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/60—Mounting; Assembling; Disassembling
- F04D29/601—Mounting; Assembling; Disassembling specially adapted for elastic fluid pumps
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
- H05K7/1488—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures
- H05K7/1489—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures characterized by the mounting of blades therein, e.g. brackets, rails, trays
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
Definitions
- the subject matter herein generally relates to a fan module, and more particularly to electronic device having a fan module.
- a fan for heat dissipation.
- a printed circuit board of the fan is electrically connected to a main board or a connector of the electronic device.
- the printed circuit board and the main board are disposed in a same direction, that is to say, the circuit board is parallel to the main board, and an overall space of the fan is increased in a depth direction.
- FIG. 1 is an exploded view of an embodiment of a fan module.
- FIG. 2 is an isometric view of a supporting frame in a first angle of view in FIG. 1 .
- FIG. 3 is an isometric view of the supporting frame in a second angle of view in FIG. 1 .
- FIG. 4 is an isometric view of a printed circuit board in FIG. 1 .
- FIG. 5 is an isometric view of the fan module in FIG. 1 .
- FIG. 6 is an side isometric view of the fan module in FIG. 1 .
- FIG. 7 is an isometric view of an embodiment of electronic device with the fan module in FIG. 1 .
- FIG. 8 is an isometric view of a main board assembled with a connector of the electronic device shown in FIG. 7 .
- FIG. 9 is an isometric view of the fan module assembled with the connector in FIG. 7 .
- FIG. 10 is a cross-sectional view of the fan module assembled with the connector in FIG. 7 .
- FIG. 11 is a partial cross-sectional view of the fan module assembled with the connector in FIG. 7 .
- an embodiment of a fan module 100 includes a tray 10 , a fan 20 , a supporting frame 30 , a printed circuit board 40 and a fastener 50 .
- the tray 10 , the fan 20 , the supporting frame 30 and the printed circuit board 40 are mounted together by the fastener 50 .
- the fan 20 is received by the tray 10 .
- the tray 10 defines a first connecting hole 12
- the fan 20 defines a second connecting hole 22 relative to the first connecting hole 12
- the fastener 50 passes through the first connecting hole 12 and the second connecting hole 22 to mount the tray 10 and the fan 20 .
- the tray 10 and the fan 20 may adopt other mounting methods, such as a buckle, a clamp, and so on.
- the supporting frame 30 includes a supporting portion 32 and a connecting lug 34 , the supporting portion 32 and the connecting lug 34 form a receiving space.
- the connecting lug 34 extends from both sides of the supporting portion 32 .
- the supporting portion 32 includes a plate 322 , a block 324 extending vertically from both side of the plate 322 , and a guiding bar extending vertically from both side of the plate 322 .
- the block 324 is connected to the guiding bar 326 , and the block 324 is located above the guiding bar 326 .
- the guiding bar 326 is longer than the block 324 .
- the plate 322 and the block 324 together forms a receiving groove 328 .
- the connecting lug 34 has a rib 342 , a protruding post 344 and a third connecting hole 346 .
- the rib 342 and the guiding bar 326 are on the same plane.
- the printed circuit board 40 includes a main body 42 and a conducting strip 44 .
- the main body 42 includes a connecting portion 422 and a mounting portion 424 .
- the mounting portion 424 defines a positioning hole 4243 and a fourth connecting hole 4244 , and the conducting trip 44 is on the connecting portion 424 .
- FIGS. 1 to 5 when the fan module 100 assembled, the fan 20 is placed and received in the tray 10 .
- the first connecting hole 12 of the tray 10 corresponds to the second connecting hole 22 of the fan 20 .
- the supporting frame 30 is close to the fan 20 , the receiving space 36 of the supporting frame contacts with fan 20 , and the second connecting hole 22 corresponds to the third connecting hole 346 of the supporting frame 30 , the main body 42 of the printed circuit board is positioned on the supporting frame 30 .
- the protruding post 344 of the supporting frame 30 passes through the positioning hole 4242 of the printed circuit board 40 .
- the main body 42 is guided by the guiding bar 326 , the mounting portion 424 is positioned on the connecting lug 34 through the rib 342 .
- the connecting portion 422 enters into the receiving groove 328 of the supporting frame 30 , and the third connecting hole 346 of the supporting frame 30 corresponds to the fourth connecting hole 4244 of the printed circuit board 40 , and then the fan module 100 is mounted by the fastener 50 .
- a width of the connecting portion 422 is equal to a width of the receiving groove 328 to locate the connecting portion 422 .
- the mounting portion 424 is located below the guiding bar 326 and the rib 342 to locate the mounting portion 424 .
- the fan module 100 when the fan module 100 is assembled on the electronic device, the fan module has a length H 1 +H 2 in a depth direction.
- the printed circuit board 40 is assembled on the fan module in a thickness d direction. Because of the small thickness d, the supporting frame 30 used to support the printed circuit board has the small size H 2 in the depth direction, and greatly reduces the overall size of the fan module length H 1 +H 2 .
- the electronic device 600 includes a shell 62 and a fan module 100 .
- the shell 62 has a plurality of openings 64 for a fan module 100 to be inserted into.
- Inside shell 62 is a main board 66 , a connector 68 and other electronic components (not shown).
- the main board 66 includes a base board 662 and a extension 664 .
- the connector 68 is disposed on an edge of the extension 664 .
- the connector 68 has a elastic trip 682 for electrical connection to the printed circuit board 40 of the fan module 100 .
- the electronic device 600 may be a server, a memory, and so on, which needs heat dissipation.
- the connector 68 is guided and limited by the guiding bar 326 .
- the extension 664 located between two of the protruding post 344 , and the connector 68 corresponds to the conducting strip 44 of the printed circuit board 40 .
- the main board 55 is in a plane is perpendicular to a plane of the printed circuit board 40 .
- the printed circuit board 40 is assembled in a thickness direction. Because of small thickness of the printed circuit board, the main board in a plane is perpendicular to a plane of the printed circuit board, and the supporting frame is compact to have the printed circuit board mounted on the fan, which is greatly reducing the size of the fan module in a depth direction with space saved and low cost.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
- The subject matter herein generally relates to a fan module, and more particularly to electronic device having a fan module.
- Electronic devices such as mainframes, servers, and so on need a fan for heat dissipation. For the traditional fan module, a printed circuit board of the fan is electrically connected to a main board or a connector of the electronic device. Actually, the printed circuit board and the main board are disposed in a same direction, that is to say, the circuit board is parallel to the main board, and an overall space of the fan is increased in a depth direction. When the fan is assembled to the electronic devices, an overall space of the electronic devices needs to be increased, increasing device size and costs.
- Thus, there is room for improvement within the art.
- Many aspects of the present disclosure are better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present disclosure. It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements.
-
FIG. 1 is an exploded view of an embodiment of a fan module. -
FIG. 2 is an isometric view of a supporting frame in a first angle of view inFIG. 1 . -
FIG. 3 is an isometric view of the supporting frame in a second angle of view inFIG. 1 . -
FIG. 4 is an isometric view of a printed circuit board inFIG. 1 . -
FIG. 5 is an isometric view of the fan module inFIG. 1 . -
FIG. 6 is an side isometric view of the fan module inFIG. 1 . -
FIG. 7 is an isometric view of an embodiment of electronic device with the fan module inFIG. 1 . -
FIG. 8 is an isometric view of a main board assembled with a connector of the electronic device shown inFIG. 7 . -
FIG. 9 is an isometric view of the fan module assembled with the connector inFIG. 7 . -
FIG. 10 is a cross-sectional view of the fan module assembled with the connector inFIG. 7 . -
FIG. 11 is a partial cross-sectional view of the fan module assembled with the connector inFIG. 7 . - It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures, and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale and the proportions of certain parts have been exaggerated to better illustrate details and features of the present disclosure.
- The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like reference numerals indicate the same or similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references can mean “at least one”.
- Referring to
FIG. 1 , an embodiment of afan module 100 includes atray 10, afan 20, a supportingframe 30, a printedcircuit board 40 and afastener 50. Thetray 10, thefan 20, the supportingframe 30 and the printedcircuit board 40 are mounted together by thefastener 50. Thefan 20 is received by thetray 10. In an embodiment, thetray 10 defines a first connectinghole 12, thefan 20 defines a second connectinghole 22 relative to the first connectinghole 12, thefastener 50 passes through the first connectinghole 12 and the second connectinghole 22 to mount thetray 10 and thefan 20. In another embodiment, thetray 10 and thefan 20 may adopt other mounting methods, such as a buckle, a clamp, and so on. - In
FIGS. 2 and 3 , the supportingframe 30 includes a supportingportion 32 and a connectinglug 34, the supportingportion 32 and the connectinglug 34 form a receiving space. The connectinglug 34 extends from both sides of the supportingportion 32. The supportingportion 32 includes aplate 322, ablock 324 extending vertically from both side of theplate 322, and a guiding bar extending vertically from both side of theplate 322. Theblock 324 is connected to theguiding bar 326, and theblock 324 is located above theguiding bar 326. Theguiding bar 326 is longer than theblock 324. Theplate 322 and theblock 324 together forms a receivinggroove 328. The connectinglug 34 has arib 342, a protrudingpost 344 and a third connectinghole 346. Therib 342 and theguiding bar 326 are on the same plane. - In
FIG. 3 , the printedcircuit board 40 includes amain body 42 and a conductingstrip 44. Themain body 42 includes a connectingportion 422 and amounting portion 424. Themounting portion 424 defines a positioning hole 4243 and a fourth connectinghole 4244, and the conductingtrip 44 is on the connectingportion 424. - In
FIGS. 1 to 5 , when thefan module 100 assembled, thefan 20 is placed and received in thetray 10. The first connectinghole 12 of thetray 10 corresponds to the second connectinghole 22 of thefan 20. The supportingframe 30 is close to thefan 20, thereceiving space 36 of the supporting frame contacts withfan 20, and the second connectinghole 22 corresponds to the third connectinghole 346 of the supportingframe 30, themain body 42 of the printed circuit board is positioned on the supportingframe 30. - In detail, the protruding
post 344 of the supportingframe 30 passes through thepositioning hole 4242 of the printedcircuit board 40. Themain body 42 is guided by theguiding bar 326, themounting portion 424 is positioned on the connectinglug 34 through therib 342. The connectingportion 422 enters into thereceiving groove 328 of the supportingframe 30, and the third connectinghole 346 of the supportingframe 30 corresponds to the fourth connectinghole 4244 of the printedcircuit board 40, and then thefan module 100 is mounted by thefastener 50. A width of the connectingportion 422 is equal to a width of thereceiving groove 328 to locate the connectingportion 422. Themounting portion 424 is located below theguiding bar 326 and therib 342 to locate themounting portion 424. - In
FIG. 6 , when thefan module 100 is assembled on the electronic device, the fan module has a length H1+H2 in a depth direction. The printedcircuit board 40 is assembled on the fan module in a thickness d direction. Because of the small thickness d, the supportingframe 30 used to support the printed circuit board has the small size H2 in the depth direction, and greatly reduces the overall size of the fan module length H1+H2. - In
FIGS. 7 and 8 , theelectronic device 600 includes a shell 62 and afan module 100. On one side, the shell 62 has a plurality of openings 64 for afan module 100 to be inserted into. Inside shell 62 is amain board 66, aconnector 68 and other electronic components (not shown). Themain board 66 includes abase board 662 and aextension 664. Theconnector 68 is disposed on an edge of theextension 664. Theconnector 68 has aelastic trip 682 for electrical connection to the printedcircuit board 40 of thefan module 100. Theelectronic device 600 may be a server, a memory, and so on, which needs heat dissipation. - In
FIG. 9 , when thefan module 100 is assembled with theelectronic device 600, theconnector 68 is guided and limited by the guidingbar 326. Theextension 664 located between two of the protrudingpost 344, and theconnector 68 corresponds to the conductingstrip 44 of the printedcircuit board 40. The main board 55 is in a plane is perpendicular to a plane of the printedcircuit board 40. - In
FIGS. 10 and 11 , when thefan module 10 is assembled to themain board 66 of theelectronic device 600, the conductingstrip 44 of the printedcircuit board 40 is electrically connected to theelastic trip 682 of theconnector 68. The length H3 of the assembly is smaller than the overall size of the fan module length H1+H2. An internal space of theelectronic device 600 is saved. - The fan module and electronic device with the same, the printed
circuit board 40 is assembled in a thickness direction. Because of small thickness of the printed circuit board, the main board in a plane is perpendicular to a plane of the printed circuit board, and the supporting frame is compact to have the printed circuit board mounted on the fan, which is greatly reducing the size of the fan module in a depth direction with space saved and low cost. - The embodiments shown and described above are only examples. Many details are often found in the art such as the features of a fan module and electronic device with the same. Therefore, many such details are neither shown nor described. Even though numerous characteristics and advantages of the present technology have been set forth in the foregoing description, together with details of the structure and function of the present disclosure, the disclosure is illustrative only, and changes may be made in the detail, especially in matters of shape, size, and arrangement of the parts within the principles of the present disclosure, up to and including the full extent established by the broad general meaning of the terms used in the claims. It will therefore be appreciated that the embodiments described above may be modified within the scope of the claims.
Claims (10)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16/022,964 US10524385B1 (en) | 2018-06-29 | 2018-06-29 | Fan module and electronic device with the same |
| CN201811143508.1A CN110657112B (en) | 2018-06-29 | 2018-09-28 | Fan module and electronic device with same |
| TW108118460A TWI707625B (en) | 2018-06-29 | 2019-05-28 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16/022,964 US10524385B1 (en) | 2018-06-29 | 2018-06-29 | Fan module and electronic device with the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| US10524385B1 US10524385B1 (en) | 2019-12-31 |
| US20200008318A1 true US20200008318A1 (en) | 2020-01-02 |
Family
ID=69008500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US16/022,964 Active 2038-07-27 US10524385B1 (en) | 2018-06-29 | 2018-06-29 | Fan module and electronic device with the same |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US10524385B1 (en) |
| CN (1) | CN110657112B (en) |
| TW (1) | TWI707625B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113840514A (en) * | 2021-08-23 | 2021-12-24 | 奇鋐科技股份有限公司 | Fan structure applied to automatic assembly of a system motherboard |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10784235B2 (en) | 2018-01-30 | 2020-09-22 | Cree Fayetteville, Inc. | Silicon carbide power module |
| TWI805985B (en) | 2021-01-13 | 2023-06-21 | 緯創資通股份有限公司 | Case |
| CN113721736A (en) * | 2021-09-15 | 2021-11-30 | 英业达科技有限公司 | Server |
| CN114025561A (en) * | 2021-10-26 | 2022-02-08 | 合肥联宝信息技术有限公司 | Electronic device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4263493B2 (en) * | 2003-01-28 | 2009-05-13 | 富士通株式会社 | Casing, device unit and fan unit |
| TW200516208A (en) * | 2003-11-14 | 2005-05-16 | Delta Electronics Inc | Contact device for hot swap fan |
| CN2699018Y (en) * | 2004-02-02 | 2005-05-11 | 鸿富锦精密工业(深圳)有限公司 | Fan motor |
| TW200421074A (en) * | 2004-06-03 | 2004-10-16 | Asia Vital Components Co Ltd | A stand structure having positioning function |
| CN2735050Y (en) * | 2004-09-14 | 2005-10-19 | 元山科技工业股份有限公司 | Outer pole cooling fan |
| TWM333603U (en) * | 2007-12-05 | 2008-06-01 | Universal Scient Ind Co Ltd | Wireless remote-controlled heat-dissipating device applied on mainboard |
| US20130100613A1 (en) * | 2010-06-28 | 2013-04-25 | Nec Corporation | Fan unit, electronic device, and method for manufacturing fan unit |
| CN201867722U (en) | 2010-11-18 | 2011-06-15 | 英业达股份有限公司 | Fan module mounting structure |
| TWI485332B (en) * | 2010-12-08 | 2015-05-21 | Hon Hai Prec Ind Co Ltd | Fan module |
| TWI502134B (en) * | 2010-12-22 | 2015-10-01 | Delta Electronics Inc | Fan |
| CN102999089B (en) * | 2011-09-08 | 2015-11-25 | 英业达股份有限公司 | Server |
| TW201328478A (en) * | 2011-12-20 | 2013-07-01 | Inventec Corp | Server |
| CN103869900A (en) * | 2012-12-12 | 2014-06-18 | 鸿富锦精密工业(深圳)有限公司 | Battery module fixing device |
| US9615471B2 (en) * | 2015-05-27 | 2017-04-04 | Quanta Computer Inc. | Component carrier |
| CN206397761U (en) * | 2016-11-01 | 2017-08-11 | 东莞永立电机有限公司 | Thin Brushless DC Fan |
| JP2018178899A (en) * | 2017-04-17 | 2018-11-15 | 日本電産株式会社 | Fan device |
| TWI652567B (en) * | 2017-12-26 | 2019-03-01 | 技嘉科技股份有限公司 | Heat sink device with a plurality of heat dissipation areas and motherboard with the heat sink device |
-
2018
- 2018-06-29 US US16/022,964 patent/US10524385B1/en active Active
- 2018-09-28 CN CN201811143508.1A patent/CN110657112B/en active Active
-
2019
- 2019-05-28 TW TW108118460A patent/TWI707625B/en active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113840514A (en) * | 2021-08-23 | 2021-12-24 | 奇鋐科技股份有限公司 | Fan structure applied to automatic assembly of a system motherboard |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110657112A (en) | 2020-01-07 |
| TWI707625B (en) | 2020-10-11 |
| US10524385B1 (en) | 2019-12-31 |
| CN110657112B (en) | 2021-07-13 |
| TW202002752A (en) | 2020-01-01 |
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