US20150287428A1 - Dampers for actuator assembly of hard disk drive - Google Patents
Dampers for actuator assembly of hard disk drive Download PDFInfo
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- US20150287428A1 US20150287428A1 US14/245,932 US201414245932A US2015287428A1 US 20150287428 A1 US20150287428 A1 US 20150287428A1 US 201414245932 A US201414245932 A US 201414245932A US 2015287428 A1 US2015287428 A1 US 2015287428A1
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- adhesive
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- actuator assembly
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- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
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Definitions
- FIG. 2 is a top perspective view of an actuator assembly, with vibration dampers, of a magnetic storage device according to one embodiment
- the configuration of a first vibration damper is different than a second vibration damper if at least one of (i) the configuration of the adhesive layer of the first vibration damper is different than the configuration of the adhesive layer of the second vibration damper; and (ii) the configuration of the constraining layer of the first vibration damper is different than the configuration of the constraining layer of the second vibration damper.
- only the configuration of the adhesive layer of the first vibration damper is different than the configuration of the adhesive layer of the second vibration damper.
- only the configuration of the constraining layer of the first vibration damper is different than the configuration of the constraining layer of the second vibration damper.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Moving Of Heads (AREA)
- Supporting Of Heads In Record-Carrier Devices (AREA)
Abstract
Description
- This disclosure relates generally to electronic information storage devices, and more particularly to reducing vibrations of components of information storage devices.
- Hard disk drives (“HDDs”) are widely used to store digital data or electronic information for enterprise data processing systems, computer workstations, portable computing devices, digital audio players, digital video players, and the like. Generally, HDDs store data on a disk with a layer of magnetic material. A transducer head, e.g., read-write head, includes a writing component that magnetically polarizes areas or bits of the magnetic material with one or two polarities to encode either binary zeros or ones. Thus, data is recorded as magnetically encoded areas or bits of magnetic polarity. The direction of the magnetization points in different directions, which can be referred to as a positive state and a negative state. Each bit can store information (generally binary information in the form of either a 1 or a 0) according to the magnetic polarization state of the bit. Typically, bits are arranged along respective radially-adjacent (e.g., concentric) annular tracks of a disk. A single disk can include space for millions of tracks each with millions of bits. A transducer head also includes a reading component that detects the magnetic polarity of each bit or area and generates an electrical signal that approximates the magnetic polarity. The signal is processed to recover the binary data recorded on the magnetic material.
- The disks of an HDD rotate as transducer heads hover over the respective disks to read data from and write data to the disks. Rotation of the disks is driven by a spindle motor that is rotatably coupled to the disks via a central spindle. The position of the transducer heads relative to the disks, and the location on the disks from which data is read or to which data is written, is controlled via actuation of an actuator. The actuator controls the movement of the plurality of armatures each securing a respective one of the transducer heads. As the disks rotate, the actuator actuates to rotate the armatures and move the transducer heads radially inwardly or outwardly over the disks.
- The dynamic performance of an HDD is a major mechanical factor for achieving higher data capacity as well as for manipulating the data faster. The quantity of data tracks recorded on the disk surface is determined partly by how well the transducer heads and a desired data track can be positioned relative to each other and made to follow each other in a stable and controlled manner. There are many factors that can influence the ability of an HDD to perform the function of positioning the transducer heads and following the data track with the heads. One such factor is undesirable motions that can come about through unwanted vibrations of components of the HDD.
- A need exists for an apparatus and system for reducing the vibration of the components of an HDD that overcomes the shortcomings of conventional HDDs. The subject matter of the present application has been developed in response to the present state of HDD art, and in particular, in response to problems and needs in the art that have not yet been fully solved by currently available HDDs.
- According to one embodiment, an actuator assembly for a magnetic storage device includes a top surface and a bottom surface that opposes the top surface. The actuator assembly also includes a first constraining layer that is secured to the top surface by a first adhesive layer. The first adhesive layer is positioned between the top surface and the first constraining layer. Additionally, the actuator assembly includes a second constraining layer that is secured to the bottom surface by a second adhesive layer. The second adhesive layer is positioned between the bottom surface and the second constraining layer. At least one of (i) the first constraining layer is configured differently than the second constraining layer; and (ii) the first adhesive layer is configured differently than the second adhesive layer.
- In some implementations of the actuator assembly, the first and second constraining layers each includes a rigid sheet. The rigid sheet can be made from a metallic material.
- According to certain implementations of the actuator assembly, the first constraining layer is configured differently than the second constraining layer. The first constraining layer can be made from a first material and the second constraining layer can be made from a second material that is different than the first material. The first constraining layer can have a first thickness and the second constraining layer can have a second thickness that is different than the first thickness. The first constraining layer can have a first shape and the second constraining layer can have a second shape that is different than the first shape. According to one implementation, the first and second adhesive layers are configured the same.
- In certain implementations of the actuator assembly, the first and second adhesive layers each is made from a visco-elastic adhesive. The first and second adhesive layers can have a lower stiffness than the first and second constraining layers, respectively, in some implementations.
- According to yet some implementations of the actuator assembly, the first adhesive layer is configured differently than the second adhesive layer. The first adhesive layer can be made from a first adhesive and the second adhesive layer can be made from a second adhesive that is different than the first adhesive. The first adhesive layer can have a first thickness and the second adhesive layer can have a second thickness that is different than the first thickness. The first adhesive layer can have a first shape and the second adhesive layer can have a second shape that is different than the first shape. The first and second constraining layers can be configured the same.
- In some implementations of the actuator assembly, the first constraining layer is configured differently than the second constraining layer, and the first adhesive layer is configured differently than the second adhesive layer.
- According to certain implementations, the actuator assembly can also include at least one armature that supports a read-write head. The top surface is a top surface of the at least one armature and the bottom surface is a bottom surface of the at least one armature.
- The actuator assembly can include a coil support in some implementations. In such implementations, the top surface can be a top surface of the coil support and the bottom surface can be a bottom surface of the coil support.
- In yet another embodiment, a magnetic storage device includes at least one magnetic disk and at least one armature that is rotatably movable relative to the at least one magnetic disk. The at least one armature includes a first surface and a second surface that opposes the first surface. The magnetic storage device also includes a first vibration damper that is secured to the first surface. The first vibration damper includes a first constraining layer and a first adhesive layer that is positioned between the first surface and the first constraining layer. The magnetic storage device additionally includes a second vibration damper that is secured to the second surface. The second vibration damper includes a second constraining layer and a second adhesive layer that is positioned between the second surface and the second constraining layer. The first vibration damper is configured differently than the second vibration damper.
- According to another embodiment, an apparatus for damping vibrations in an actuator assembly for a magnetic storage device is described. The actuator assembly includes a top surface and a bottom surface that opposes the top surface. The apparatus includes a first rigid sheet that is secured to the top surface by a first visco-elastic adhesive. The first visco-elastic adhesive is positioned between the top surface and the first rigid sheet. The apparatus also includes a second rigid sheet that is secured to the bottom surface by a second visco-elastic adhesive. The second visco-elastic adhesive is positioned between the bottom surface and the second rigid sheet. The first rigid sheet is configured differently than the second rigid sheet, and the first visco-elastic adhesive is configured differently than the second visco-elastic adhesive.
- Reference throughout this specification to features, advantages, or similar language does not imply that all of the features and advantages that may be realized with the present disclosure should be or are in any single embodiment. Rather, language referring to the features and advantages is understood to mean that a specific feature, advantage, or characteristic described in connection with an embodiment is included in at least one embodiment of the subject matter disclosed herein. Thus, discussion of the features and advantages, and similar language, throughout this specification may, but do not necessarily, refer to the same embodiment.
- The described features, structures, advantages, and/or characteristics of the subject matter of the present disclosure may be combined in any suitable manner in one or more embodiments and/or implementations. In the following description, numerous specific details are provided to impart a thorough understanding of embodiments of the subject matter of the present disclosure. One skilled in the relevant art will recognize that the subject matter of the present disclosure may be practiced without one or more of the specific features, details, components, materials, and/or methods of a particular embodiment or implementation. In other instances, additional features and advantages may be recognized in certain embodiments and/or implementations that may not be present in all embodiments or implementations. Further, in some instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring aspects of the subject matter of the present disclosure. The features and advantages of the subject matter of the present disclosure will become more fully apparent from the following description and appended claims, or may be learned by the practice of the subject matter as set forth hereinafter.
- In order that the advantages of the disclosure will be readily understood, a more particular description of the disclosure briefly described above will be rendered by reference to specific embodiments that are illustrated in the appended drawings. Understanding that these drawings depict only typical embodiments of the disclosure and are not therefore to be considered to be limiting of its scope, the subject matter of the present application will be described and explained with additional specificity and detail through the use of the accompanying drawings, in which:
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FIG. 1 is a perspective view of a magnetic storage device with vibration dampers according to one embodiment; -
FIG. 2 is a top perspective view of an actuator assembly, with vibration dampers, of a magnetic storage device according to one embodiment; -
FIG. 3 is a bottom perspective view of an actuator assembly, with vibration dampers, of a magnetic storage device according to one embodiment; and -
FIG. 4 is a cross-sectional side view of a component, with vibration dampers, of a magnetic storage device according to another embodiment. - Referring to
FIG. 1 , amagnetic storage device 100, according to one embodiment, is depicted as a hard disk drive (HDD). The HDD can be configured similarly to a conventional HDD as depicted generally in the illustrated embodiments. Alternatively, the HDD can be configured similarly to a so-called hybrid HDD that includes a combination of flash media and magnetic disk media. In yet other embodiments, themagnetic storage device 100 can be another type of magnetic storage device, or yet another type of data storage device, such as an optical recording device. Basically, theHDD 100 includes anactuator assembly 140, one ormore disks 115, aspindle 121 driven by a spindle motor, and abase 130. The base 130 forms part of a housing, shown with a cover removed, that contains internal components of the HDD within the housing. - The
actuator assembly 140 includes a plurality ofarmatures 105 coupled to abase 155, transducer heads 110, anactuator 118, a yolk assembly 142 (see, e.g.,FIG. 2 ), and aspindle 125. Eachtransducer head 110 is secured to anend portion 107 of a respective armature 105 (a second transducer head attached to each armature is not shown). Although theHDD 100 is shown having fourarmatures 105, onetransducer head 110 per armature, fourdisks 115, one yolk assembly, any number of armatures, heads, disks, and yolk assemblies may be employed. - The
armatures 105 extend parallel to each other away from the base 155 tocantilevered end portions 107. Eacharmature 105 is a relatively thin plate-like element, which has a width that, in certain implementations, decreases in a direction extending away from thebase 155. Thearmatures 105 are spaced apart vertically (e.g., top-to-bottom direction) such that adisk 115 can be positioned between adjacent armatures. In some instances, thearmatures 105 are spaced an equal distance apart from each other. Eacharmature 105 defines atop surface 157 and abottom surface 161 that opposes the top surface. In certain implementations, the top andbottom surfaces corresponding armature 105. According to certain implementations, the top andbottom surfaces corresponding armature 105. The opposing surfaces can, but need not, be flat. Thearmatures 105 may include apertures for attachment of other components or for weight saving purposes. The apertures can extend from thetop surface 157 to thebottom surface 161 of each armature. In some embodiments, thearmatures 105 are integrally formed with the base 155 such that they form a monolithic one-piece construction with the base. In other embodiments, thearmatures 105 are formed separate from thebase 155 and coupled to the base in a separate processing step via any of various coupling techniques. - The
yolk assembly 142 includes coil supports 158 and acoil 171 coupled to the coil supports. The coil supports 158 can be arms that are coupled to and extend away from thebase 155. The coil supports 158 are spaced-apart to support thecoil 171 between the coil supports. Although the coil supports 158 extend only partially around a periphery of thecoil 171, in some implementations, the coil supports 158 may extend entirely around a periphery of the coil. Like thearmatures 105, eachcoil support 158 defines atop surface 159 and abottom surface 163 that opposes the top surface. In some embodiments, the coil supports 158 are integrally formed with the base 155 such that they form a monolithic one-piece construction with the base. In other embodiments, the coil supports 158 are formed separate from thebase 155 and coupled to the base in a separate processing step via any of various coupling techniques. - The
coil 171 includes an electrically-conductive wire wrapped about itself in a coiled configuration. Theactuator 118 interacts with thecoil 171 to rotate the coil, as well as thebase 155 andarmatures 105, about thespindle 125. In one implementation, the actuator 118 passes current through thecoil 171, which results in a torque applied to the actuator. Thebase 155 includes anaperture 127 that receives thespindle 125. Theaperture 127 is configured to retain thespindle 125 and allow rotation of the base 155 relative to the spindle. - The
armatures 105,base 155, and coil supports 158 are made from a substantially rigid material. For example, in one embodiment, one or more of thearmatures 105,base 155, and coil supports 158 is made from a metal, such as aluminum. In other embodiments, one or more of thearmatures 105,base 155, and coil supports 158 is made from another substantially rigid material, such as ceramic, composite, polymer, and the like. - The
spindle 121 is operably connected to thebase 130 via the spindle motor, which is coupled to the base. Thespindle 121 is co-rotatably coupled to the spindle motor such that the spindle motor rotatably drives the spindle. Accordingly, thespindle 121 can be considered to be part of or integral with the spindle motor. Thedisks 115 are operably connected to thespindle 121 viarespective hubs 120 fixedly secured to respective disks and co-rotatably coupled to the spindle. In this manner, thespindle 121 defines a central axis of eachdisk 115. As thespindle 121 rotates, thedisks 115 correspondingly rotate as indicated bydirectional arrow 190. Accordingly, the spindle motor can be operatively controlled to rotate the disks 115 a controlled amount and at a controlled rate. Thedisks 115 can include magnetic recording media organized into a plurality of tracks that store data. - As the
disks 115 rotate, the actuator 118 positions thearmatures 105 and theheads 110 connected to each armature, such that the heads are positioned over a specified radial area of the disks for read or write operations. In an idle mode, theactuator 118 is controlled to position thearmatures 105 radially outwardly such that each head is parked or unloaded onto aramp support 117 secured to the base. - The
HDD 100 may also include an electrical hardware board mounted to thebase 130. In this manner, the electrical hardware board is on-board or contained within theHDD 100, as opposed to forming part of an electrical device external to or separate from the HDD. Generally, the electrical hardware board includes hardware and/or circuitry used to control operation of the various components of theHDD 100. The electrical hardware board may include a printed circuit board on or in which the hardware and/or circuitry is mounted. - To reduce vibrations in the
actuator assembly 140, the actuator assembly includes a plurality of vibration dampers or damper sets. Each vibration damper set includes two or more vibration dampers. For example, referring toFIG. 2 , a plurality oftop vibration dampers 150 are shown secured to thetop surfaces 157 ofrespective armatures 105. In the illustrated embodiment, thetop vibration dampers 150 are positioned on thetop surfaces 157 between theaperture 127 of thebase 155 and theend portions 107 of thearmatures 105. Similarly, as shown inFIG. 3 , a plurality ofbottom vibration dampers 152 are secured to the bottom surfaces 161 ofrespective armatures 105. The top andbottom vibration dampers armature 105 can be defined collectively as a vibration damper set or pair. - Moreover, the top and
bottom vibration dampers top vibration damper 150 secured to a givenarmature 105 has a first configuration and thebottom vibration damper 152 secured to the same armature has a second configuration that is different than the first configuration. In some implementations, the configuration of each vibration damper can be defined as at least one of a material composition, thickness, and shape of the vibration damper. Accordingly, the configuration of a top vibration damper is different than the configuration of a bottom vibration damper when one or more of the material composition, thickness, and shape of the top vibration damper is different than the material composition, thickness, and shape, respectively, of the bottom vibration damper. In other implementations, the configuration of each vibration damper can be defined according to other characteristics as desired. In some embodiments, the configuration of one damper is considered different than another damper when the configurations vary substantially. According to some implementations, two configurations vary substantially when a differing characteristic varies by more than a certain percentage threshold. In one implementation, the percentage threshold can be about 5%. In yet some implementations, the configuration of one damper is considered different than another damper when the configurations vary more than nominally. - Each damper includes a constraining layer and an adhesive layer. Generally, the constraining or stiffener layer is secured to a surface of a component of a storage device by the adhesive layer. The adhesive layer is applied directly onto the surface of the component. The constraining layer is coupled directly onto the adhesive layer, such that the adhesive layer is positioned between the surface of the component and the constraining layer.
- In one exemplary embodiment shown in
FIG. 4 , thetop vibration damper 150 includes a constraininglayer 154 and anadhesive layer 170. The constraininglayer 154 is secured to thetop surface 157 of thearmature 105 of theHDD 100. Theadhesive layer 170 is applied directly onto thetop surface 157 of thearmature 105. The constraininglayer 154 is coupled directly onto theadhesive layer 170, such that the adhesive layer is positioned between thetop surface 157 of thearmature 105 and the constraining layer. Thebottom vibration damper 152 also includes a constraininglayer 156 and anadhesive layer 172. The constraininglayer 156 is secured to thebottom surface 161 of thearmature 105 of theHDD 100. Theadhesive layer 172 is applied directly onto thebottom surface 161 of thearmature 105. The constraininglayer 156 is coupled directly onto theadhesive layer 172, such that the adhesive layer is positioned between thebottom surface 161 of thearmature 105 and the constraining layer. As described above, the top andbottom vibration dampers layer 154 andadhesive layer 170 of thetop vibration damper 150 being first or top constraining and adhesive layers, and the constraininglayer 156 andadhesive layer 172 of thebottom vibration damper 152 being second or bottom constraining and adhesive layers. - The
adhesive layers bottom vibration dampers adhesive layers bottom surfaces layers armature 105. Generally, the adhesive material has sufficient adhesion properties to adequately secure the constraininglayers bottom surfaces layers bottom surfaces adhesive layers adhesive layers layers bottom surfaces adhesive layers layers bottom surfaces adhesive layers - The adhesive materials of the
adhesive layers adhesive layers adhesive layers adhesive layer 170 is made from a first adhesive and the bottomadhesive layer 172 is made from a second adhesive that is different than the first adhesive. For example, the first adhesive can have a chemical composition that is different than the second adhesive. In one example, the first adhesive can have different adhesion properties than the second adhesive. In yet another example, the first adhesive can have different damping properties than the second adhesive. In any of the above examples, the topadhesive layer 170 is considered to be configured differently than the bottomadhesive layer 172. However, in alternative embodiments, the first and second adhesives can be the same. - In addition to the type of adhesive, the damping characteristics of the
adhesive layers adhesive layers adhesive layer adhesive layers FIG. 4 , the firstadhesive layer 170 may be thicker than the secondadhesive layer 172. However, in other implementations, the secondadhesive layer 172 may be thicker than the firstadhesive layer 170. In some embodiments, the first and secondadhesive layers - The damping characteristics of the
adhesive layers adhesive layers FIG. 2 , for example, the topadhesive layer 170 of the damper set on anadjacent armature 105 below thetopmost armature 105 has a shape that is different than the shapes of the other topadhesive layers 170, as well as the shape of the bottomadhesive layer 172 of the same set (see, e.g.,FIG. 3 ). Alternatively, in some embodiments, the first and secondadhesive layers - The constraining
layers bottom vibration dampers adhesive layers layers adhesive layers layers adhesive layers armature 105 vibrates during operation of theHDD 100. In some implementations, one or both the constraininglayers - The materials of the constraining
layers layers layers layers layer 154 is made from a first constraining material and thebottom constraining layer 156 is made from a second constraining material that is different than the first constraining material. For example, the first constraining material can have a chemical composition that is different than the second constraining material. In one example, the first constraining material can have different stiffness properties than the second constraining material. In any of the above examples where the constraining materials are different, the top constraininglayer 154 is considered to be configured differently than thebottom constraining layer 156. However, in alternative embodiments, the first and second constraining materials can be the same. - In addition to the type of material, the constraining characteristics of the constraining
layers layers layer layers FIG. 4 , the first constraininglayer 154 may be thicker than the second constraininglayer 156. However, in other implementations, the second constraininglayer 156 may be thicker than the first constraininglayer 154. In some embodiments, the first and second constraininglayers - The constraining characteristics of the constraining
layers layers FIG. 2 , for example, the top constraininglayer 154 of the damper set on anadjacent armature 105 below thetopmost armature 105 has a shape that is different than the shapes of the other top constraininglayers 154, as well as the shape of thebottom constraining layer 156 of the same set (see, e.g.,FIG. 3 ). Alternatively, in some embodiments, the first and second constraininglayers - As defined herein, the configuration of a first vibration damper is different than a second vibration damper if at least one of (i) the configuration of the adhesive layer of the first vibration damper is different than the configuration of the adhesive layer of the second vibration damper; and (ii) the configuration of the constraining layer of the first vibration damper is different than the configuration of the constraining layer of the second vibration damper. In one implementation, only the configuration of the adhesive layer of the first vibration damper is different than the configuration of the adhesive layer of the second vibration damper. In another implementation, only the configuration of the constraining layer of the first vibration damper is different than the configuration of the constraining layer of the second vibration damper. According to yet another implementation, both the configuration of the adhesive layer of the first vibration damper is different than the configuration of the adhesive layer of the second vibration damper, and the configuration of the constraining layer of the first vibration damper is different than the configuration of the constraining layer of the second vibration damper.
- The configuration of the adhesive layer of a first vibration damper is different than the configuration of the adhesive layer of a second vibration damper if the adhesive layer of the first vibration damper has a different material composition, thickness, shape and/or other characteristic than the adhesive layer of the second vibration damper. Similarly, the configuration of the constraining layer of a first vibration damper is different than the configuration of the constraining layer of a second vibration damper if the constraining layer of the first vibration damper has a different material composition, thickness, shape and/or other characteristic than the constraining layer of the second vibration damper.
- As mentioned above, vibration dampers with different configurations may produce different vibration damping characteristics. Often, the vibration damping characteristics of vibration dampers are dependent on external factors, such as the operating temperature of the layers of the vibration dampers. For example, for a given temperature, one vibration damper may produce certain damping characteristics that are different than the damping characteristics produced by a differently configured vibration damper at the same temperature. In contrast, one vibration damper at a given temperature (or temperature range) may produce the same damping characteristics as a differently configured vibration damper at a different temperature (or temperature range). Accordingly, in some implementations, to ensure similar damping characteristics across a broader temperature range, a vibration damper set with differently configured vibration dampers can be applied to an armature (or other component) in an opposing manner as described above. Referring to
FIG. 4 above, in one specific implementation, thetop vibration damper 150 can be configured to achieve a certain vibration reduction factor at a relatively higher range of temperatures, and thebottom vibration damper 152 can be configured to achieve the same vibration reduction factor at a relatively lower range of temperatures. The higher and lower range of temperatures can be contiguous in some embodiments. - Although the above described embodiments refer to the placement of differently configured vibration dampers on opposing surfaces of armatures of an actuator assembly of an HDD, in other embodiments, the differently configured vibration dampers can be placed on opposing surfaces of other moving (or non-moving) components of an HDD, data storage device, or other electronic device to achieve similar results without departing from the essence of the present disclosure. For example, as shown in
FIGS. 2-4 ,top vibration dampers 160 are shown secured totop surfaces 159 of respective coil supports 158. Similarly,bottom vibration dampers 162 are secured to the bottom surfaces 163 of respective coil supports 158. The top andbottom vibration dampers coil support 158 can be defined collectively as a vibration damper set or pair. The features of the top andbottom vibration dampers bottom vibrations dampers bottom vibration dampers FIG. 4 . - Although some of the above embodiments are described and shown to place differently configured dampers on opposing or opposite surfaces of a component, in some implementations it may be desirable to place differently configured dampers on adjacent or orthogonal surfaces, such as a top surface and a perpendicular side/edge surface.
- Reference throughout this specification to “one embodiment,” “an embodiment,” or similar language means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present disclosure. Thus, appearances of the phrases “in one embodiment,” “in an embodiment,” and similar language throughout this specification may, but do not necessarily, all refer to the same embodiment.
- In the above description, certain terms may be used such as “top,” “bottom,” “up,” “down,” “upper,” “lower,” “horizontal,” “vertical,” “left,” “right,” and the like. These terms are used, where applicable, to provide some clarity of description when dealing with relative relationships. But, these terms are not intended to imply absolute relationships, positions, and/or orientations. For example, with respect to an object, a “top” surface can become a “bottom” surface simply by turning the object over. Nevertheless, it is still the same object. Further, the terms “including,” “comprising,” “having,” and variations thereof mean “including but not limited to” unless expressly specified otherwise. An enumerated listing of items does not imply that any or all of the items are mutually exclusive and/or mutually inclusive, unless expressly specified otherwise. The terms “a,” “an,” and “the” also refer to “one or more” unless expressly specified otherwise. Further, the term “plurality” can be defined as “at least two.”
- Additionally, instances in this specification where one element is “coupled” to another element can include direct and indirect coupling. Direct coupling can be defined as one element coupled to and in some contact with another element. Indirect coupling can be defined as coupling between two elements not in direct contact with each other, but having one or more additional elements between the coupled elements. Also, securing one element to another element can include direct and indirect securing. Additionally, as used herein, “adjacent” does not necessarily denote contact (i.e., one element can be adjacent to another without being in contact with the other).
- As used herein, the phrase “at least one of”, when used with a list of items, means different combinations of one or more of the listed items may be used and only one of the items in the list may be needed. The item may be a particular object, thing, or category. In other words, “at least one of” means any combination of items or number of items may be used from the list, but not all of the items in the list may be required. For example, “at least one of item A, item B, and item C” may mean item A; item A and item B; item B; item A, item B, and item C; or item B and item C. In some cases, “at least one of item A, item B, and item C” may mean, for example, without limitation, two of item A, one of item B, and ten of item C; four of item B and seven of item C; or some other suitable combination.
- The subject matter of the present disclosure may be embodied in other specific forms without departing from its spirit or essential characteristics. The described embodiments are to be considered in all respects only as illustrative and not restrictive. The scope of the disclosure is, therefore, indicated by the appended claims rather than by the foregoing description. All changes which come within the meaning and range of equivalency of the claims are to be embraced within their scope.
Claims (23)
Priority Applications (2)
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US14/245,932 US9153261B1 (en) | 2014-04-04 | 2014-04-04 | Dampers for actuator assembly of hard disk drive |
US14/835,466 US20150364155A1 (en) | 2014-04-04 | 2015-08-25 | Dampers for actuator assembly of hard disk drive |
Applications Claiming Priority (1)
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US14/245,932 US9153261B1 (en) | 2014-04-04 | 2014-04-04 | Dampers for actuator assembly of hard disk drive |
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US14/835,466 Division US20150364155A1 (en) | 2014-04-04 | 2015-08-25 | Dampers for actuator assembly of hard disk drive |
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US9153261B1 US9153261B1 (en) | 2015-10-06 |
US20150287428A1 true US20150287428A1 (en) | 2015-10-08 |
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US14/835,466 Abandoned US20150364155A1 (en) | 2014-04-04 | 2015-08-25 | Dampers for actuator assembly of hard disk drive |
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US14/835,466 Abandoned US20150364155A1 (en) | 2014-04-04 | 2015-08-25 | Dampers for actuator assembly of hard disk drive |
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US20170309312A1 (en) * | 2016-04-26 | 2017-10-26 | Seagate Technology Llc | Methods and devices for detecting shock events |
US10354681B1 (en) | 2018-06-28 | 2019-07-16 | Sandisk Technologies Llc | Tunnel magnetoresistance read head including side shields containing nanocrystalline ferromagnetic particles |
US10755733B1 (en) | 2019-03-05 | 2020-08-25 | Sandisk Technologies Llc | Read head including semiconductor spacer and long spin diffusion length nonmagnetic conductive material and method of making thereof |
US11348607B1 (en) * | 2021-06-21 | 2022-05-31 | Western Digital Technologies, Inc. | Management of actuator dynamics in a multiple actuator hard disk drive with an unequal number of heads on the two outer arms of each actuator |
US11527262B2 (en) * | 2021-02-17 | 2022-12-13 | Kabushiki Kaisha Toshiba | Disk device having a multi-actuator assembly with a protective member attached to the tip of an actuator arm |
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JP6064951B2 (en) * | 2014-08-25 | 2017-01-25 | Tdk株式会社 | Dynamic vibration absorber, flexure and head support mechanism |
US10629230B2 (en) | 2017-04-20 | 2020-04-21 | Western Digital Technologies, Inc. | Method of forming a magnetic head |
MX2021006267A (en) | 2018-11-27 | 2021-08-11 | Avery Dennison Corp | Multilayer tape constructions for low-temperature vibration damping with tunable adhesion. |
US11626137B1 (en) | 2022-01-31 | 2023-04-11 | Western Digital Technologies, Inc. | Heat assisted magnetic recording (HAMR) write head containing a near-field transducer with diffusion barrier and method of making thereof |
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US9153261B1 (en) | 2015-10-06 |
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