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US20130233528A1 - Heat dissipating assembly - Google Patents

Heat dissipating assembly Download PDF

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Publication number
US20130233528A1
US20130233528A1 US13/690,285 US201213690285A US2013233528A1 US 20130233528 A1 US20130233528 A1 US 20130233528A1 US 201213690285 A US201213690285 A US 201213690285A US 2013233528 A1 US2013233528 A1 US 2013233528A1
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US
United States
Prior art keywords
latching
heat dissipating
fins
dissipating assembly
size
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/690,285
Inventor
Chun-Wei Yang
Li-Fu Xu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Wuhan Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Wuhan Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Wuhan Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Wuhan Co Ltd
Assigned to HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (WUHAN) CO., LTD. reassignment HON HAI PRECISION INDUSTRY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: XU, LI-FU, YANG, CHUN-WEI
Publication of US20130233528A1 publication Critical patent/US20130233528A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present disclosure relates to heat dissipating assemblies, and particularly to a heat dissipating assembly with a heat exchanger.
  • a heat exchanger includes a base adhered to an electronic component (such as CPU) and a plurality of fins extending from the base. The plurality of fins are perpendicularly formed from the base which may increase cost.
  • FIG. 1 is an assembled, isometric view of an embodiment of a heat dissipating assembly.
  • FIG. 2 is an exploded, isometric view of FIG. 1 .
  • FIG. 3 is an isometric view of a heat exchanger of FIG. 2 .
  • FIG. 4 is an enlarged view of a circled portion IV of FIG. 3 .
  • FIG. 5 is an exploded view of a first fin and a second fin of FIG. 3 .
  • FIGS. 1 and 2 show a heat dissipating assembly in accordance with an embodiment.
  • the heat dissipating assembly includes two seats 10 , a base 20 , a heat exchanger 30 , and two pipes 50 .
  • the two seats 10 are secured to a motherboard (not shown).
  • Each of the two seats 10 includes a supporting portion 11 and two securing tabs 13 , extending from two opposite ends of the supporting portion 11 .
  • the supporting portion 11 defines two positioning holes 111 corresponding to the base 20 .
  • Four securing members 15 are located on each securing tab 13 , to secure the two seats 10 to the motherboard.
  • the base 20 includes a board 21 .
  • Three elongated latching posts 23 protruding from an upper surface of the board 21 .
  • the three latching posts 23 are parallel to each other, to engage with the heat exchanger 30 .
  • Each of the three latching posts 23 has a first extending direction, and each of the first extending directions are parallel to each other.
  • Each of the three latching posts 23 includes a neck portion 231 and a head portion 233 , connected to the neck portion 231 .
  • a size of the head portion 233 is greater than a size of the neck portion 231 .
  • the board 21 defines four installation holes 211 corresponding to the two positioning holes of each of the two seats 10 .
  • Two receiving slots 25 are defined in the board 21 , for receiving the two pipes 50 .
  • the two receiving slots 25 are positioned in a lower portion of the board 21 and parallel to each other.
  • the heat exchanger 30 includes a first fin 31 and a plurality of parallel second fins 33 .
  • Each of the first fins 31 and the second fins 33 includes a fin body 311 , a first flange 313 , and a second flange 314 .
  • the first flange 313 and the second flange 314 extend from two opposite edges of the fin body 311 .
  • the first flange 313 and the second flange 314 are substantially parallel to each other and perpendicular to the fin body 311 .
  • the fin body 311 defines three latching slots 315 extending to the first flange 313 , corresponding to the three latching posts 23 .
  • Each of the latching slots 315 includes a narrow portion 3151 and a wide portion 3153 , in communication with the narrow portion 3151 .
  • a size of the wide portion 3153 is greater than a size of the narrow portion 3151 , but it is smaller than the size of the head portion 233 .
  • a touching piece 316 (shown in FIG. 5 ), surrounding each latching slot 315 , is located on the fin body 311 . The touching piece 316 connects to the first flange 313 .
  • Each of the first flange 313 and the second flange 314 defines two cutouts 3131 extending to the fin body 311 .
  • Two engaging portions 331 are located on each of the first flange 313 and the second flange 314 of each second fin 33 . Each engaging portion 331 is positioned in front of each cutout 3131 .
  • each engaging portion 331 is made of plastic.
  • Each of the two pipes 50 includes a heat conducting portion 51 , a heat dissipating portion 53 , and a connecting portion 55 , connecting the heat conducting portion 51 with the heat dissipating portion 53 .
  • the heat dissipating portion 53 is inserted into the heat exchanger 30 , and the heat conducting portion 51 is received in each receiving slot 25 .
  • FIGS. 1 and 3 show that in assembly, each engaging portion 331 of one of the second fins 33 is engaged into each cutout 3131 of the first fin 31 , to secure the one of the second fins 33 to the first fin 31 .
  • the other of the second fins 33 are connected one by one using the same way.
  • the heat exchanger 30 is thereby assembled.
  • the first fin 31 and the plurality of second fins 33 cooperatively define three elongated latching slots 315 corresponding to the three latching post 23 .
  • Each of the three latching slots 315 has a second extending direction, and the second extending directions are parallel to each other and parallel to the first extending direction.
  • the base 20 is secured to the two seats 10 via four locking members 40 .
  • the heat exchanger 30 is moved towards the base 20 .
  • Each head portion 233 of the three latching posts 23 is inserted into each narrow portion 3151 to deform the fin body 311 , until the head portion 233 is engaged into the wide portion 3153 .
  • the fin body 311 resiliently rebounds to engage the touching piece 316 with each neck portion 231 , to secure the heat exchanger 30 to the base 20 .
  • the touching piece 316 abuts the corresponding latching post 23 in a direction substantially perpendicular to the extending direction, to dissipating heat from the base 20 .
  • the first flange 313 of the heat exchanger 30 abuts the board 21 of the base 20 .
  • the heat exchanger 30 is pulled away from the base 20 .
  • the touching piece 316 is resiliently deformable to disengage the head portion 233 from the latching slot 315 , to detach the heat exchanger 30 .

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat dissipating assembly includes a heat exchanger and a base. The heat exchanger defines at least one latching slot. A touching piece is surrounded the latching slot. The base includes at least one latching post. The touching piece is resiliently deformable to engage the at least one latching post in the at least one latching slot. The touching piece abuts the at least one latching post.

Description

    BACKGROUND
  • 1. Technical Field
  • The present disclosure relates to heat dissipating assemblies, and particularly to a heat dissipating assembly with a heat exchanger.
  • 2. Description of Related Art
  • Electronic devices generate heat during operation. Electronic components in electronic devices may overheat and become damaged if the heat is not dissipated quickly. Fans and heat exchangers are used to draw heat away from the electronic components. Generally, a heat exchanger includes a base adhered to an electronic component (such as CPU) and a plurality of fins extending from the base. The plurality of fins are perpendicularly formed from the base which may increase cost.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • Many aspects of the embodiments can be better understood with references to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
  • FIG. 1 is an assembled, isometric view of an embodiment of a heat dissipating assembly.
  • FIG. 2 is an exploded, isometric view of FIG. 1.
  • FIG. 3 is an isometric view of a heat exchanger of FIG. 2.
  • FIG. 4 is an enlarged view of a circled portion IV of FIG. 3.
  • FIG. 5 is an exploded view of a first fin and a second fin of FIG. 3.
    •  DETAILED DESCRIPTION
  • The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
  • FIGS. 1 and 2 show a heat dissipating assembly in accordance with an embodiment. The heat dissipating assembly includes two seats 10, a base 20, a heat exchanger 30, and two pipes 50.
  • The two seats 10 are secured to a motherboard (not shown). Each of the two seats 10 includes a supporting portion 11 and two securing tabs 13, extending from two opposite ends of the supporting portion 11. The supporting portion 11 defines two positioning holes 111 corresponding to the base 20. Four securing members 15 are located on each securing tab 13, to secure the two seats 10 to the motherboard.
  • The base 20 includes a board 21. Three elongated latching posts 23 protruding from an upper surface of the board 21. The three latching posts 23 are parallel to each other, to engage with the heat exchanger 30. Each of the three latching posts 23 has a first extending direction, and each of the first extending directions are parallel to each other. Each of the three latching posts 23 includes a neck portion 231 and a head portion 233, connected to the neck portion 231. A size of the head portion 233 is greater than a size of the neck portion 231. The board 21 defines four installation holes 211 corresponding to the two positioning holes of each of the two seats 10. Two receiving slots 25 are defined in the board 21, for receiving the two pipes 50. The two receiving slots 25 are positioned in a lower portion of the board 21 and parallel to each other.
  • Referring to FIGS. 4-5, the heat exchanger 30 includes a first fin 31 and a plurality of parallel second fins 33. Each of the first fins 31 and the second fins 33 includes a fin body 311, a first flange 313, and a second flange 314. The first flange 313 and the second flange 314 extend from two opposite edges of the fin body 311. The first flange 313 and the second flange 314 are substantially parallel to each other and perpendicular to the fin body 311. The fin body 311 defines three latching slots 315 extending to the first flange 313, corresponding to the three latching posts 23. Each of the latching slots 315 includes a narrow portion 3151 and a wide portion 3153, in communication with the narrow portion 3151. A size of the wide portion 3153 is greater than a size of the narrow portion 3151, but it is smaller than the size of the head portion 233. A touching piece 316 (shown in FIG. 5), surrounding each latching slot 315, is located on the fin body 311. The touching piece 316 connects to the first flange 313. Each of the first flange 313 and the second flange 314 defines two cutouts 3131 extending to the fin body 311. Two engaging portions 331 are located on each of the first flange 313 and the second flange 314 of each second fin 33. Each engaging portion 331 is positioned in front of each cutout 3131. In one embodiment, each engaging portion 331 is made of plastic.
  • Each of the two pipes 50 includes a heat conducting portion 51, a heat dissipating portion 53, and a connecting portion 55, connecting the heat conducting portion 51 with the heat dissipating portion 53. The heat dissipating portion 53 is inserted into the heat exchanger 30, and the heat conducting portion 51 is received in each receiving slot 25.
  • FIGS. 1 and 3 show that in assembly, each engaging portion 331 of one of the second fins 33 is engaged into each cutout 3131 of the first fin 31, to secure the one of the second fins 33 to the first fin 31. The other of the second fins 33 are connected one by one using the same way. The heat exchanger 30 is thereby assembled. The first fin 31 and the plurality of second fins 33 cooperatively define three elongated latching slots 315 corresponding to the three latching post 23. Each of the three latching slots 315 has a second extending direction, and the second extending directions are parallel to each other and parallel to the first extending direction.
  • The base 20 is secured to the two seats 10 via four locking members 40. The heat exchanger 30 is moved towards the base 20. Each head portion 233 of the three latching posts 23 is inserted into each narrow portion 3151 to deform the fin body 311, until the head portion 233 is engaged into the wide portion 3153. The fin body 311 resiliently rebounds to engage the touching piece 316 with each neck portion 231, to secure the heat exchanger 30 to the base 20. The touching piece 316 abuts the corresponding latching post 23 in a direction substantially perpendicular to the extending direction, to dissipating heat from the base 20. The first flange 313 of the heat exchanger 30 abuts the board 21 of the base 20.
  • In disassembly, the heat exchanger 30 is pulled away from the base 20. The touching piece 316 is resiliently deformable to disengage the head portion 233 from the latching slot 315, to detach the heat exchanger 30.
  • It is to be understood, however, that even though numerous characteristics and advantages of the embodiments have been set forth in the foregoing description, together with details of the structure and function of the present disclosure, the disclosure is illustrative only, and changes may be made in detail, especially in the matters of shape, size, and arrangement of parts within the principles of the embodiments to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims (17)

What is claimed is:
1. A heat dissipating assembly, comprising:
a base comprising at least one latching post; and
a heat exchanger defining at least one latching slot, a touching piece surrounding the at least one latching slot;
wherein the touching piece is resiliently deformable to engage the at least one latching post in the at least one latching slot, and the touching piece abuts the at least one latching post.
2. The heat dissipating assembly of claim 1, wherein the heat exchanger comprises a first fin and a plurality of second fins, the first fin defines a cutout, an engaging portion extends from each of the plurality of second fins, and one of the plurality of second fins is elastically engaged in the cutout to secure the one of the plurality of second fins to the first fin.
3. The heat dissipating assembly of claim 2, wherein each of the plurality of second fins defines a cutout, the cutout of one of the plurality of second fins receives the engaging portion of adjacent second fin, to secure two adjacent second fins together.
4. The heat dissipating assembly of claim 1, wherein the at least one latching post comprises a head portion and a neck portion connected to the head portion, the latching slot comprises a wide portion and a narrow portion that is in communication with the wide portion, the head portion is engaged in the wide portion, and the neck portion is engaged in the narrow portion.
5. The heat dissipating assembly of claim 4, wherein a size of the head portion is greater than a size of the neck portion.
6. The heat dissipating assembly of claim 5, wherein a size of the wide portion is greater than a size of the narrow portion, and the size of the head portion is greater than the size of the wide portion.
7. The heat dissipating assembly of claim 2, wherein the base further comprising a board, each of the first fin and the plurality of second fins comprising a flange, and the flange abuts the board.
8. The heat dissipating assembly of claim 1, wherein the at least one latching post comprises three latching posts, and each of the three latching posts has a first extending direction, and the first extending directions are parallel to each other.
9. The heat dissipating assembly of claim 1, wherein the at least one latching slot comprises three latching slots, each of the three latching slots has a second extending direction, and the second extending directions are parallel to each other.
10. A heat dissipating assembly, comprising:
a heat exchanger defining at least one latching slot; the at least one latching slot comprises a narrow portion and a wide portion communication with the wide portion, a touching piece surrounding the at least one latching slot; and
a base comprising at least one latching post, the at least one latching post comprises a head portion and neck portion connected to the head portion; the head portion extends through the narrow portion to be engaged in the wide portion, and the neck portion is engaged in the narrow portion, to secure the at least one latching slot to secure the heat exchanger to the base; and the touching piece abuts the at least one latching slot.
11. The heat dissipating assembly of claim 10, wherein the heat exchanger comprising a first fin and a plurality of second fins, the first fin defines a cutout, an engaging portion extends from each of the plurality of second fins, and one of the plurality of second fins is elastically engaged in the cutout to secure the one of the plurality of second fins to the first fin.
12. The heat dissipating assembly of claim 11, wherein each of the plurality of second fins defines a cutout, the cutout of one of the second fins receives the engaging portion of adjacent second fin, to secure two adjacent second fins together.
13. The heat dissipating assembly of claim 10, wherein a size of the head portion is greater than a size of the neck portion.
14. The heat dissipating assembly of claim 13, wherein a size of the wide portion is greater than a size of the narrow portion, and the size of the head portion is greater than the size of the wide portion.
15. The heat dissipating assembly of claim 11, wherein the base further comprises a board, each of the first fin and the plurality of second fins comprising a flange, and the flange abuts the board.
16. The heat dissipating assembly of claim 10, wherein the at least one latching post comprises three latching posts, and each of the three latching posts has a first extending direction, and the first extending directions are parallel to each other.
17. The heat dissipating assembly of claim 10, wherein the at least one latching slot comprises three latching slots, each of the three latching slots has a second extending direction, and the second extending directions are parallel to each other.
US13/690,285 2012-03-12 2012-11-30 Heat dissipating assembly Abandoned US20130233528A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN2012100631029A CN103313577A (en) 2012-03-12 2012-03-12 Heat radiator
CN201210063102.9 2012-03-12

Publications (1)

Publication Number Publication Date
US20130233528A1 true US20130233528A1 (en) 2013-09-12

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US (1) US20130233528A1 (en)
CN (1) CN103313577A (en)
TW (1) TW201338688A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104812211A (en) * 2015-04-01 2015-07-29 太仓陶氏电气有限公司 Frequency converter radiator
EP2894954A4 (en) * 2013-12-06 2016-06-15 Marchesi Metal Technology Suzhou Co Ltd Heat dissipation housing structure connected to heat dissipation fin

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109341374B (en) * 2018-11-14 2024-04-09 苏州永腾电子制品有限公司 High-efficiency radiator

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6860321B2 (en) * 2003-01-30 2005-03-01 Molex Incorporated Heat-dissipating device
US20050051297A1 (en) * 2003-09-05 2005-03-10 Jui-Chen Kuo Heat sink
US7441592B2 (en) * 2006-11-26 2008-10-28 Tsung-Hsien Huang Cooler module
US20090229790A1 (en) * 2008-03-13 2009-09-17 Asia Vital Components Co., Ltd. Radiating fin assembly for thermal module
US20090242168A1 (en) * 2008-03-27 2009-10-01 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink assembly and method for manufacturing the same
US7650929B2 (en) * 2007-09-30 2010-01-26 Tsung-Hsien Huang Cooler module

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6860321B2 (en) * 2003-01-30 2005-03-01 Molex Incorporated Heat-dissipating device
US20050051297A1 (en) * 2003-09-05 2005-03-10 Jui-Chen Kuo Heat sink
US7441592B2 (en) * 2006-11-26 2008-10-28 Tsung-Hsien Huang Cooler module
US7650929B2 (en) * 2007-09-30 2010-01-26 Tsung-Hsien Huang Cooler module
US20090229790A1 (en) * 2008-03-13 2009-09-17 Asia Vital Components Co., Ltd. Radiating fin assembly for thermal module
US20090242168A1 (en) * 2008-03-27 2009-10-01 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink assembly and method for manufacturing the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2894954A4 (en) * 2013-12-06 2016-06-15 Marchesi Metal Technology Suzhou Co Ltd Heat dissipation housing structure connected to heat dissipation fin
CN104812211A (en) * 2015-04-01 2015-07-29 太仓陶氏电气有限公司 Frequency converter radiator

Also Published As

Publication number Publication date
TW201338688A (en) 2013-09-16
CN103313577A (en) 2013-09-18

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AS Assignment

Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:YANG, CHUN-WEI;XU, LI-FU;REEL/FRAME:029388/0938

Effective date: 20121128

Owner name: HONG FU JIN PRECISION INDUSTRY (WUHAN) CO., LTD.,

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:YANG, CHUN-WEI;XU, LI-FU;REEL/FRAME:029388/0938

Effective date: 20121128

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION