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US20130153189A1 - Heat dissipating fin, heat dissipating device and method of manufacturing the same - Google Patents

Heat dissipating fin, heat dissipating device and method of manufacturing the same Download PDF

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Publication number
US20130153189A1
US20130153189A1 US13/329,313 US201113329313A US2013153189A1 US 20130153189 A1 US20130153189 A1 US 20130153189A1 US 201113329313 A US201113329313 A US 201113329313A US 2013153189 A1 US2013153189 A1 US 2013153189A1
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US
United States
Prior art keywords
heat dissipating
overflow
fixing portion
proof structure
fin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/329,313
Inventor
Chia-Yu Lin
Yen Tsai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cooler Master Development Corp
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US13/329,313 priority Critical patent/US20130153189A1/en
Assigned to COOLER MASTER CO., LTD. reassignment COOLER MASTER CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LIN, CHIA-YU, TSAI, YEN
Priority to US13/426,598 priority patent/US9431271B2/en
Publication of US20130153189A1 publication Critical patent/US20130153189A1/en
Assigned to COOLER MASTER DEVELOPMENT CORPORATION reassignment COOLER MASTER DEVELOPMENT CORPORATION CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: COOLER MASTER CO., LTD.
Priority to US14/453,621 priority patent/US20140345136A1/en
Abandoned legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D53/00—Making other particular articles
    • B21D53/02—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D19/00—Casting in, on, or around objects which form part of the product
    • B22D19/0063—Casting in, on, or around objects which form part of the product finned exchangers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P2700/00—Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
    • B23P2700/10—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/14—Fastening; Joining by using form fitting connection, e.g. with tongue and groove
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Definitions

  • the invention relates to a heat dissipating fin, a heat dissipating device and a method of manufacturing the same and, more particularly, to a heat dissipating fin capable of preventing overflow while manufacturing a heat dissipating device.
  • Heat dissipating device is a significant component for electronic products. When an electronic product is operating, the current in circuit will generate unnecessary heat due to impedance. If the heat is accumulated in the electronic components of the electronic product without dissipating immediately, the electronic components may get damage due to the accumulated heat. Therefore, the performance of heat dissipating device is a significant issue for the electronic product.
  • FIG. 1 is a schematic diagram illustrating a flat-type heat dissipating fin 12 of the prior art
  • FIG. 2 is a schematic diagram illustrating a cylinder-type heat dissipating fin 22 of the prior art.
  • a heat dissipating device is usually equipped with a flat-type heat dissipating fin 12 shown in FIG. 1 or a cylinder-type heat dissipating fin 22 shown in FIG. 2 .
  • the flat-type heat dissipating fin 12 and the cylinder-type heat dissipating fin 22 are formed with the bases 10 , 20 integrally by a die casting process.
  • the flat-type heat dissipating fin 12 or the cylinder-type heat dissipating fin 22 has a draft angle a between 2 degrees and 3 degrees so that the whole weight of the fin is heavy and the height of the fin is limited. Furthermore, the number of heat dissipating fins is reduced in the heat dissipating device due to the draft angle a so that the heat dissipating area is not enough and the heat dissipating efficiency is worse.
  • the invention provides a heat dissipating fin capable of preventing overflow while manufacturing a heat dissipating device.
  • the heat dissipating fin is formed by a forming process without the draft angle of the conventional heat dissipating fin, so as to solve the aforesaid problems.
  • the invention forms the heat dissipating fin by the forming process (e.g. aluminum extrusion process, rivet forming process, etc.) first and then forms the base, which covers the fixing portion of the heat dissipating fin, by the die casting process with the melt metal material.
  • the heat dissipating fin of the invention has the overflow-proof structure capable of preventing the melt metal material from overflowing during the die casting process so as to prevent deckle edge from being generated. Since the heat dissipating fin of the invention is formed by the forming process, the draft angle of the conventional heat dissipating fin is unnecessary for the heat dissipating fin of the invention.
  • the whole weight of the heat dissipating fin of the invention can be lighter and the height of the heat dissipating fin of the invention can be higher than the prior art. Furthermore, the number of heat dissipating fins of the invention can be increased in the heat dissipating device so that the heat dissipating area can be increased and the heat dissipating efficiency can be enhanced.
  • FIG. 1 is a schematic diagram illustrating a flat-type heat dissipating fin of the prior art.
  • FIG. 2 is a schematic diagram illustrating a cylinder-type heat dissipating fin of the prior art.
  • FIG. 3 is a schematic diagram illustrating a heat dissipating device according to a first embodiment of the invention.
  • FIG. 4 is a cross-sectional view illustrating the heat dissipating device along line A-A shown in FIG. 3 .
  • FIG. 5 is a schematic diagram illustrating the heat dissipating fin shown in FIG. 3 .
  • FIG. 6 is a flowchart illustrating a method of manufacturing the heat dissipating device shown in FIG. 3 .
  • FIG. 7 is a cross-sectional view illustrating a heat dissipating fin according to a second embodiment of the invention.
  • FIG. 8 is a cross-sectional view illustrating a heat dissipating fin according to a third embodiment of the invention.
  • FIG. 9 is a cross-sectional view illustrating a heat dissipating fin according to a fourth embodiment of the invention.
  • FIG. 10 is a cross-sectional view illustrating a heat dissipating fin according to a fifth embodiment of the invention.
  • FIG. 11 is a cross-sectional view illustrating the heat dissipating device along line B-B shown in FIG. 10 .
  • FIG. 12 is a schematic diagram illustrating the heat dissipating fin shown in FIG. 10 .
  • FIG. 13 is a flowchart illustrating a method of manufacturing the heat dissipating device shown in FIG. 10 .
  • FIG. 14 is a cross-sectional view illustrating a heat dissipating fin according to a sixth embodiment of the invention.
  • FIG. 3 is a schematic diagram illustrating a heat dissipating device 3 according to a first embodiment of the invention
  • FIG. 4 is a cross-sectional view illustrating the heat dissipating device 3 along line A-A shown in FIG. 3
  • FIG. 5 is a schematic diagram illustrating the heat dissipating fin 32 shown in FIG. 3
  • the heat dissipating device 3 comprises a base 30 and a plurality of heat dissipating fins 32 .
  • FIGS. 3 the heat dissipating device 3 comprises a base 30 and a plurality of heat dissipating fins 32 .
  • each of the heat dissipating fins 32 comprises a heat dissipating portion 320 , a fixing portion 322 and an overflow-proof structure 324 .
  • the fixing portion 322 is fixed in the base 30 .
  • the overflow-proof structure 324 is connected between the heat dissipating portion 320 and the fixing portion 322 .
  • a width W 1 of the overflow-proof structure 324 is larger than a width W 2 of the heat dissipating portion 320 and larger than a width W 3 of the fixing portion 322 .
  • a length L of the overflow-proof structure 324 protruded from the fixing portion 322 can be between 1 mm and 10 mm, wherein a thickness of the overflow-proof structure 324 is uniform. In another embodiment, a thickness of the overflow-proof structure 324 may vary gradiently.
  • each of the heat dissipating fins 32 may further comprise a recess structure 326 formed on the fixing portion 322 .
  • the recess structure 326 is arc-shaped.
  • the recess structure 326 may be polygon-shaped.
  • FIG. 6 is a flowchart illustrating a method of manufacturing the heat dissipating device 3 shown in FIG. 3 .
  • step S 100 is performed to form a plurality of heat dissipating fins 32 by a forming process.
  • the aforesaid forming process may be an aluminum extrusion process so as to form each of the heat dissipating fins 32 as a flat-type heat dissipating fin.
  • step S 102 is performed to put the fixing portion 322 of each of the heat dissipating fins 32 into a mold (not shown).
  • Step S 104 is then performed to pour a melt metal material (e.g. aluminum, etc.) into the mold.
  • a melt metal material e.g. aluminum, etc.
  • step S 106 is performed to process the melt metal material by a die casting process so as to form the base 30 , wherein the base 30 covers the fixing portion 322 of each of the heat dissipating fins 32 , as shown in FIG. 4 .
  • the overflow-proof structure 324 of each of the heat dissipating fins 32 is capable of preventing the melt metal material from overflowing during the die casting process so as to prevent deckle edge from being generated.
  • the overflow-proof structure 324 protruded from the fixing portion 322 is between 1 mm and 10 mm
  • the overflow-proof structure 324 can prevent the melt metal material from overflowing during the die casting process effectively so as to prevent deckle edge from being generated.
  • the recess structure 326 of each of the heat dissipating fins 32 can hold the metal material effectively so as to enhance the combination strength between the base 30 and the heat dissipating fins 32 .
  • FIG. 7 is a cross-sectional view illustrating a heat dissipating fin 42 according to a second embodiment of the invention.
  • the difference between the heat dissipating fin 42 and the aforesaid heat dissipating fin 32 is that the heat dissipating fin 42 further comprises a protruding structure 420 .
  • the protruding structure 420 protrudes from one end of the fixing portion 322 .
  • the protruding structure 420 of the heat dissipating fin 42 can cooperate with the overflow-proof structure 324 to hold the metal material so as to enhance the combination strength between the base 30 and the heat dissipating fin 42 .
  • the same elements in FIG. 7 and FIG. 4 are represented by the same numerals, so the repeated explanation will not be depicted herein again.
  • the heat dissipating fin 42 can be also formed by the forming process of the aforesaid step S 100 .
  • FIG. 8 is a cross-sectional view illustrating a heat dissipating fin 52 according to a third embodiment of the invention.
  • the difference between the heat dissipating fin 52 and the aforesaid heat dissipating fin 32 is that the heat dissipating fin 52 further comprises a hook structure 520 .
  • the hook structure 520 is formed in the recess structure 326 .
  • the hook structure 520 of the heat dissipating fin 52 can hook the metal material so as to enhance the combination strength between the base 30 and the heat dissipating fin 52 .
  • the same elements in FIG. 8 and FIG. 4 are represented by the same numerals, so the repeated explanation will not be depicted herein again.
  • the heat dissipating fin 52 can be also formed by the forming process of the aforesaid step S 100 .
  • FIG. 9 is a cross-sectional view illustrating a heat dissipating fin 62 according to a fourth embodiment of the invention.
  • the difference between the heat dissipating fin 62 and the aforesaid heat dissipating fin 32 is that the heat dissipating fin 62 further comprises an extending structure 620 and does not comprise the aforesaid recess structure 326 .
  • the extending structure 620 is extended from the overflow-proof structure 324 toward the fixing portion 322 , and the overflow-proof structure 324 and the extending structure 620 are formed as U-shape.
  • the heat dissipating fin 62 shown in FIG. 9
  • the extending structure 620 of the heat dissipating fin 62 can cooperate with the overflow-proof structure 324 to hold the metal material so as to enhance the combination strength between the base 30 and the heat dissipating fin 62 .
  • the same elements in FIG. 9 and FIG. 4 are represented by the same numerals, so the repeated explanation will not be depicted herein again.
  • the heat dissipating fin 62 can be also formed by the forming process of the aforesaid step S 100 .
  • FIG. 10 is a schematic diagram illustrating a heat dissipating device 7 according to a fifth embodiment of the invention
  • FIG. 11 is a cross-sectional view illustrating the heat dissipating device 7 along line B-B shown in FIG. 10
  • FIG. 12 is a schematic diagram illustrating the heat dissipating fin 72 shown in FIG. 10 .
  • the heat dissipating device 7 comprises a base 70 and a plurality of heat dissipating fins 72 .
  • FIGS. 10 the heat dissipating device 7 comprises a base 70 and a plurality of heat dissipating fins 72 .
  • each of the heat dissipating fins 72 comprises a heat dissipating portion 720 , a fixing portion 722 , an overflow-proof structure 724 and a protruding structure 726 .
  • the fixing portion 722 and the protruding structure 726 are fixed in the base 70 .
  • the overflow-proof structure 724 is connected between the heat dissipating portion 720 and the fixing portion 722 .
  • a width W 1 of the overflow-proof structure 724 is larger than a width W 2 of the heat dissipating portion 720 and larger than a width W 3 of the fixing portion 722 .
  • a length L of the overflow-proof structure 724 protruded from the fixing portion 722 can be between 1 mm and 10 mm.
  • the protruding structure 726 protrudes from one end of the fixing portion 722 .
  • a thickness of the overflow-proof structure 724 varies gradiently. In another embodiment, a thickness of the overflow-proof structure 724 may be uniform.
  • FIG. 13 is a flowchart illustrating a method of manufacturing the heat dissipating device 7 shown in FIG. 10 .
  • step S 200 is performed to form a plurality of heat dissipating fins 72 by a forming process.
  • the aforesaid forming process may be a rivet forming process so as to form each of the heat dissipating fins 72 as a cylinder-type heat dissipating fin.
  • step S 202 is performed to put the fixing portion 722 and the protruding structure 726 of each of the heat dissipating fins 72 into a mold (not shown).
  • Step S 204 is then performed to pour a melt metal material (e.g.
  • step S 206 is performed to process the melt metal material by a die casting process so as to form the base 70 , wherein the base 70 covers the fixing portion 722 and the protruding structure 726 of each of the heat dissipating fins 72 , as shown in FIG. 11 .
  • the overflow-proof structure 724 of each of the heat dissipating fins 72 is capable of preventing the melt metal material from overflowing during the die casting process so as to prevent deckle edge from being generated.
  • the overflow-proof structure 724 can prevent the melt metal material from overflowing during the die casting process effectively so as to prevent deckle edge from being generated. Furthermore, the protruding structure 726 of each of the heat dissipating fins 72 can cooperate with the overflow-proof structure 724 to hold the metal material so as to enhance the combination strength between the base 70 and the heat dissipating fins 72 .
  • FIG. 14 is a cross-sectional view illustrating a heat dissipating fin 82 according to a sixth embodiment of the invention.
  • the difference between the heat dissipating fin 82 and the aforesaid heat dissipating fin 72 is that the heat dissipating fin 82 further comprises a recess structure 820 .
  • the recess structure 820 is formed on the fixing portion 722 .
  • the recess structure 820 of the heat dissipating fin 82 can hold the metal material effectively so as to enhance the combination strength between the base 70 and the heat dissipating fin 82 .
  • the same elements in FIG. 14 and FIG. 11 are represented by the same numerals, so the repeated explanation will not be depicted herein again.
  • the heat dissipating fin 82 can be also formed by the forming process of the aforesaid step S 200 .
  • the invention forms the heat dissipating fin by the forming process (e.g. aluminum extrusion process, rivet forming process, etc.) first and then forms the base, which covers the fixing portion of the heat dissipating fin, by the die casting process with the melt metal material.
  • the heat dissipating fin of the invention has the overflow-proof structure capable of preventing the melt metal material from overflowing during the die casting process so as to prevent deckle edge from being generated. Since the heat dissipating fin of the invention is formed by the forming process, the draft angle of the conventional heat dissipating fin is unnecessary for the heat dissipating fin of the invention.
  • the whole weight of the heat dissipating fin of the invention can be lighter and the height of the heat dissipating fin of the invention can be higher than the prior art.
  • the number of heat dissipating fins of the invention can be increased in the heat dissipating device so that the heat dissipating area can be increased and the heat dissipating efficiency can be enhanced.
  • the invention may form the recess structure, the protruding structure, the hook structure and/or the extending structure on the heat dissipating fin so as to enhance the combination strength between the base and the heat dissipating fin.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat dissipating device includes a base and a plurality of heat dissipating fins. Each of the heat dissipating fins includes a heat dissipating portion, a fixing portion and an overflow-proof structure. The fixing portion is fixed in the base. The overflow-proof structure is connected between the heat dissipating portion and the fixing portion. A width of the overflow-proof structure is larger than a width of the heat dissipating portion and larger than a width of the fixing portion.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The invention relates to a heat dissipating fin, a heat dissipating device and a method of manufacturing the same and, more particularly, to a heat dissipating fin capable of preventing overflow while manufacturing a heat dissipating device.
  • 2. Description of the Prior Art
  • Heat dissipating device is a significant component for electronic products. When an electronic product is operating, the current in circuit will generate unnecessary heat due to impedance. If the heat is accumulated in the electronic components of the electronic product without dissipating immediately, the electronic components may get damage due to the accumulated heat. Therefore, the performance of heat dissipating device is a significant issue for the electronic product.
  • Referring to FIGS. 1 and 2, FIG. 1 is a schematic diagram illustrating a flat-type heat dissipating fin 12 of the prior art, and FIG. 2 is a schematic diagram illustrating a cylinder-type heat dissipating fin 22 of the prior art. In general, a heat dissipating device is usually equipped with a flat-type heat dissipating fin 12 shown in FIG. 1 or a cylinder-type heat dissipating fin 22 shown in FIG. 2. As shown in FIGS. 1 and 2, the flat-type heat dissipating fin 12 and the cylinder-type heat dissipating fin 22 are formed with the bases 10, 20 integrally by a die casting process. Due to the requirement of mold stripping during the die casting process, the flat-type heat dissipating fin 12 or the cylinder-type heat dissipating fin 22 has a draft angle a between 2 degrees and 3 degrees so that the whole weight of the fin is heavy and the height of the fin is limited. Furthermore, the number of heat dissipating fins is reduced in the heat dissipating device due to the draft angle a so that the heat dissipating area is not enough and the heat dissipating efficiency is worse.
    • SUMMARY OF THE INVENTION
  • The invention provides a heat dissipating fin capable of preventing overflow while manufacturing a heat dissipating device. The heat dissipating fin is formed by a forming process without the draft angle of the conventional heat dissipating fin, so as to solve the aforesaid problems.
  • As mentioned in the above, the invention forms the heat dissipating fin by the forming process (e.g. aluminum extrusion process, rivet forming process, etc.) first and then forms the base, which covers the fixing portion of the heat dissipating fin, by the die casting process with the melt metal material. The heat dissipating fin of the invention has the overflow-proof structure capable of preventing the melt metal material from overflowing during the die casting process so as to prevent deckle edge from being generated. Since the heat dissipating fin of the invention is formed by the forming process, the draft angle of the conventional heat dissipating fin is unnecessary for the heat dissipating fin of the invention. Therefore, the whole weight of the heat dissipating fin of the invention can be lighter and the height of the heat dissipating fin of the invention can be higher than the prior art. Furthermore, the number of heat dissipating fins of the invention can be increased in the heat dissipating device so that the heat dissipating area can be increased and the heat dissipating efficiency can be enhanced.
  • These and other objectives of the present invention will no doubt become obvious to those of ordinary skill in the art after reading the following detailed description of the preferred embodiment that is illustrated in the various figures and drawings.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a schematic diagram illustrating a flat-type heat dissipating fin of the prior art.
  • FIG. 2 is a schematic diagram illustrating a cylinder-type heat dissipating fin of the prior art.
  • FIG. 3 is a schematic diagram illustrating a heat dissipating device according to a first embodiment of the invention.
  • FIG. 4 is a cross-sectional view illustrating the heat dissipating device along line A-A shown in FIG. 3.
  • FIG. 5 is a schematic diagram illustrating the heat dissipating fin shown in FIG. 3.
  • FIG. 6 is a flowchart illustrating a method of manufacturing the heat dissipating device shown in FIG. 3.
  • FIG. 7 is a cross-sectional view illustrating a heat dissipating fin according to a second embodiment of the invention.
  • FIG. 8 is a cross-sectional view illustrating a heat dissipating fin according to a third embodiment of the invention.
  • FIG. 9 is a cross-sectional view illustrating a heat dissipating fin according to a fourth embodiment of the invention.
  • FIG. 10 is a cross-sectional view illustrating a heat dissipating fin according to a fifth embodiment of the invention.
  • FIG. 11 is a cross-sectional view illustrating the heat dissipating device along line B-B shown in FIG. 10.
  • FIG. 12 is a schematic diagram illustrating the heat dissipating fin shown in FIG. 10.
  • FIG. 13 is a flowchart illustrating a method of manufacturing the heat dissipating device shown in FIG. 10.
  • FIG. 14 is a cross-sectional view illustrating a heat dissipating fin according to a sixth embodiment of the invention.
    •  DETAILED DESCRIPTION
  • Referring to FIGS. 3 to 5, FIG. 3 is a schematic diagram illustrating a heat dissipating device 3 according to a first embodiment of the invention, FIG. 4 is a cross-sectional view illustrating the heat dissipating device 3 along line A-A shown in FIG. 3, and FIG. 5 is a schematic diagram illustrating the heat dissipating fin 32 shown in FIG. 3. As shown in FIGS. 3 and 4, the heat dissipating device 3 comprises a base 30 and a plurality of heat dissipating fins 32. As shown in FIGS. 4 and 5, each of the heat dissipating fins 32 comprises a heat dissipating portion 320, a fixing portion 322 and an overflow-proof structure 324. The fixing portion 322 is fixed in the base 30. The overflow-proof structure 324 is connected between the heat dissipating portion 320 and the fixing portion 322. A width W1 of the overflow-proof structure 324 is larger than a width W2 of the heat dissipating portion 320 and larger than a width W3 of the fixing portion 322. In this embodiment, a length L of the overflow-proof structure 324 protruded from the fixing portion 322 can be between 1 mm and 10 mm, wherein a thickness of the overflow-proof structure 324 is uniform. In another embodiment, a thickness of the overflow-proof structure 324 may vary gradiently.
  • Furthermore, each of the heat dissipating fins 32 may further comprise a recess structure 326 formed on the fixing portion 322. In this embodiment, the recess structure 326 is arc-shaped. In another embodiment, the recess structure 326 may be polygon-shaped.
  • Referring to FIG. 6, FIG. 6 is a flowchart illustrating a method of manufacturing the heat dissipating device 3 shown in FIG. 3. First of all, step S100 is performed to form a plurality of heat dissipating fins 32 by a forming process. In this embodiment, the aforesaid forming process may be an aluminum extrusion process so as to form each of the heat dissipating fins 32 as a flat-type heat dissipating fin. Afterward, step S102 is performed to put the fixing portion 322 of each of the heat dissipating fins 32 into a mold (not shown). Step S104 is then performed to pour a melt metal material (e.g. aluminum, etc.) into the mold. Finally, step S106 is performed to process the melt metal material by a die casting process so as to form the base 30, wherein the base 30 covers the fixing portion 322 of each of the heat dissipating fins 32, as shown in FIG. 4. In this embodiment, the overflow-proof structure 324 of each of the heat dissipating fins 32 is capable of preventing the melt metal material from overflowing during the die casting process so as to prevent deckle edge from being generated. When the length L of the overflow-proof structure 324 protruded from the fixing portion 322 is between 1 mm and 10 mm, the overflow-proof structure 324 can prevent the melt metal material from overflowing during the die casting process effectively so as to prevent deckle edge from being generated. Furthermore, the recess structure 326 of each of the heat dissipating fins 32 can hold the metal material effectively so as to enhance the combination strength between the base 30 and the heat dissipating fins 32.
  • Referring to FIG. 7 along with FIG. 4, FIG. 7 is a cross-sectional view illustrating a heat dissipating fin 42 according to a second embodiment of the invention. The difference between the heat dissipating fin 42 and the aforesaid heat dissipating fin 32 is that the heat dissipating fin 42 further comprises a protruding structure 420. As shown in FIG. 7, the protruding structure 420 protrudes from one end of the fixing portion 322. When the heat dissipating fin 32 shown in FIG. 4 is replaced by the heat dissipating fin 42 shown in FIG. 7, the protruding structure 420 of the heat dissipating fin 42 can cooperate with the overflow-proof structure 324 to hold the metal material so as to enhance the combination strength between the base 30 and the heat dissipating fin 42. It should be noted that the same elements in FIG. 7 and FIG. 4 are represented by the same numerals, so the repeated explanation will not be depicted herein again. Moreover, the heat dissipating fin 42 can be also formed by the forming process of the aforesaid step S100.
  • Referring to FIG. 8 along with FIG. 4, FIG. 8 is a cross-sectional view illustrating a heat dissipating fin 52 according to a third embodiment of the invention. The difference between the heat dissipating fin 52 and the aforesaid heat dissipating fin 32 is that the heat dissipating fin 52 further comprises a hook structure 520. As shown in FIG. 8, the hook structure 520 is formed in the recess structure 326. When the heat dissipating fin 32 shown in FIG. 4 is replaced by the heat dissipating fin 52 shown in FIG. 8, the hook structure 520 of the heat dissipating fin 52 can hook the metal material so as to enhance the combination strength between the base 30 and the heat dissipating fin 52. It should be noted that the same elements in FIG. 8 and FIG. 4 are represented by the same numerals, so the repeated explanation will not be depicted herein again. Moreover, the heat dissipating fin 52 can be also formed by the forming process of the aforesaid step S100.
  • Referring to FIG. 9 along with FIG. 4, FIG. 9 is a cross-sectional view illustrating a heat dissipating fin 62 according to a fourth embodiment of the invention. The difference between the heat dissipating fin 62 and the aforesaid heat dissipating fin 32 is that the heat dissipating fin 62 further comprises an extending structure 620 and does not comprise the aforesaid recess structure 326. As shown in FIG. 9, the extending structure 620 is extended from the overflow-proof structure 324 toward the fixing portion 322, and the overflow-proof structure 324 and the extending structure 620 are formed as U-shape. When the heat dissipating fin 32 shown in FIG. 4 is replaced by the heat dissipating fin 62 shown in FIG. 9, the extending structure 620 of the heat dissipating fin 62 can cooperate with the overflow-proof structure 324 to hold the metal material so as to enhance the combination strength between the base 30 and the heat dissipating fin 62. It should be noted that the same elements in FIG. 9 and FIG. 4 are represented by the same numerals, so the repeated explanation will not be depicted herein again. Moreover, the heat dissipating fin 62 can be also formed by the forming process of the aforesaid step S100.
  • Referring to FIGS. 10 to 12, FIG. 10 is a schematic diagram illustrating a heat dissipating device 7 according to a fifth embodiment of the invention, FIG. 11 is a cross-sectional view illustrating the heat dissipating device 7 along line B-B shown in FIG. 10, and FIG. 12 is a schematic diagram illustrating the heat dissipating fin 72 shown in FIG. 10. As shown in FIGS. 10 and 11, the heat dissipating device 7 comprises a base 70 and a plurality of heat dissipating fins 72. As shown in FIGS. 11 and 12, each of the heat dissipating fins 72 comprises a heat dissipating portion 720, a fixing portion 722, an overflow-proof structure 724 and a protruding structure 726. The fixing portion 722 and the protruding structure 726 are fixed in the base 70. The overflow-proof structure 724 is connected between the heat dissipating portion 720 and the fixing portion 722. A width W1 of the overflow-proof structure 724 is larger than a width W2 of the heat dissipating portion 720 and larger than a width W3 of the fixing portion 722. In this embodiment, a length L of the overflow-proof structure 724 protruded from the fixing portion 722 can be between 1 mm and 10 mm. The protruding structure 726 protrudes from one end of the fixing portion 722. In this embodiment, a thickness of the overflow-proof structure 724 varies gradiently. In another embodiment, a thickness of the overflow-proof structure 724 may be uniform.
  • Referring to FIG. 13, FIG. 13 is a flowchart illustrating a method of manufacturing the heat dissipating device 7 shown in FIG. 10. First of all, step S200 is performed to form a plurality of heat dissipating fins 72 by a forming process. In this embodiment, the aforesaid forming process may be a rivet forming process so as to form each of the heat dissipating fins 72 as a cylinder-type heat dissipating fin. Afterward, step S202 is performed to put the fixing portion 722 and the protruding structure 726 of each of the heat dissipating fins 72 into a mold (not shown). Step S204 is then performed to pour a melt metal material (e.g. aluminum, etc.) into the mold. Finally, step S206 is performed to process the melt metal material by a die casting process so as to form the base 70, wherein the base 70 covers the fixing portion 722 and the protruding structure 726 of each of the heat dissipating fins 72, as shown in FIG. 11. In this embodiment, the overflow-proof structure 724 of each of the heat dissipating fins 72 is capable of preventing the melt metal material from overflowing during the die casting process so as to prevent deckle edge from being generated. When the length L of the overflow-proof structure 724 protruded from the fixing portion 722 is between 1 mm and 10 mm, the overflow-proof structure 724 can prevent the melt metal material from overflowing during the die casting process effectively so as to prevent deckle edge from being generated. Furthermore, the protruding structure 726 of each of the heat dissipating fins 72 can cooperate with the overflow-proof structure 724 to hold the metal material so as to enhance the combination strength between the base 70 and the heat dissipating fins 72.
  • Referring to FIG. 14 along with FIG. 11, FIG. 14 is a cross-sectional view illustrating a heat dissipating fin 82 according to a sixth embodiment of the invention. The difference between the heat dissipating fin 82 and the aforesaid heat dissipating fin 72 is that the heat dissipating fin 82 further comprises a recess structure 820. As shown in FIG. 14, the recess structure 820 is formed on the fixing portion 722. When the heat dissipating fin 72 shown in FIG. 11 is replaced by the heat dissipating fin 82 shown in FIG. 14, the recess structure 820 of the heat dissipating fin 82 can hold the metal material effectively so as to enhance the combination strength between the base 70 and the heat dissipating fin 82. It should be noted that the same elements in FIG. 14 and FIG. 11 are represented by the same numerals, so the repeated explanation will not be depicted herein again. Moreover, the heat dissipating fin 82 can be also formed by the forming process of the aforesaid step S200.
  • As mentioned in the above, the invention forms the heat dissipating fin by the forming process (e.g. aluminum extrusion process, rivet forming process, etc.) first and then forms the base, which covers the fixing portion of the heat dissipating fin, by the die casting process with the melt metal material. The heat dissipating fin of the invention has the overflow-proof structure capable of preventing the melt metal material from overflowing during the die casting process so as to prevent deckle edge from being generated. Since the heat dissipating fin of the invention is formed by the forming process, the draft angle of the conventional heat dissipating fin is unnecessary for the heat dissipating fin of the invention. Therefore, the whole weight of the heat dissipating fin of the invention can be lighter and the height of the heat dissipating fin of the invention can be higher than the prior art. Furthermore, the number of heat dissipating fins of the invention can be increased in the heat dissipating device so that the heat dissipating area can be increased and the heat dissipating efficiency can be enhanced. Moreover, the invention may form the recess structure, the protruding structure, the hook structure and/or the extending structure on the heat dissipating fin so as to enhance the combination strength between the base and the heat dissipating fin.
  • Those skilled in the art will readily observe that numerous modifications and alterations of the device and method may be made while retaining the teachings of the invention. Accordingly, the above disclosure should be construed as limited only by the metes and bounds of the appended claims.

Claims (23)

1. A heat dissipating fin comprising:
a heat dissipating portion;
a fixing portion; and
an overflow-proof structure connected between the heat dissipating portion and the fixing portion;
wherein a width of the overflow-proof structure is larger than a width of the heat dissipating portion.
2. The heat dissipating fin of claim 1, wherein a length of the overflow-proof structure protruded from the fixing portion is between 1 mm and 10 mm.
3. The heat dissipating fin of claim 1, further comprising a recess structure formed on the fixing portion.
4. The heat dissipating fin of claim 3, further comprising a hook structure formed in the recess structure.
5. The heat dissipating fin of claim 1, further comprising a protruding structure protruded from one end of the fixing portion.
6. The heat dissipating fin of claim 1, further comprising an extending structure extended from the overflow-proof structure toward the fixing portion.
7. The heat dissipating fin of claim 6, wherein the overflow-proof structure and the extending structure are formed as U-shape.
8. The heat dissipating fin of claim 1, wherein a thickness of the overflow-proof structure is uniform or varies gradiently.
9. A heat dissipating device comprising:
a base; and
a plurality of heat dissipating fins, each of the heat dissipating fins comprising:
a heat dissipating portion;
a fixing portion fixed in the base; and
an overflow-proof structure connected between the heat dissipating portion and the fixing portion;
wherein a width of the overflow-proof structure is larger than a width of the heat dissipating portion.
10. The heat dissipating device of claim 9, wherein each of the heat dissipating fins further comprises a recess structure formed on the fixing portion.
11. The heat dissipating device of claim 10, wherein each of the heat dissipating fins further comprises a hook structure formed in the recess structure.
12. The heat dissipating device of claim 9, wherein each of the heat dissipating fins further comprises a protruding structure protruded from one end of the fixing portion.
13. The heat dissipating device of claim 9, wherein each of the heat dissipating fins further comprises an extending structure extended from the overflow-proof structure toward the fixing portion.
14. The heat dissipating device of claim 13, wherein the overflow-proof structure and the extending structure are formed as U-shape.
15. The heat dissipating device of claim 9, wherein a thickness of the overflow-proof structure is uniform or varies gradiently.
16. A method of manufacturing a heat dissipating device comprising:
forming a plurality of heat dissipating fins by a forming process, wherein each of the heat dissipating fins comprises a heat dissipating portion, a fixing portion and an overflow-proof structure, the overflow-proof structure is connected between the heat dissipating portion and the fixing portion, a width of the overflow-proof structure is larger than a width of the heat dissipating portion;
putting the fixing portion of each of the heat dissipating fins into a mold;
pouring a melt metal material into the mold; and
processing the melt metal material by a die casting process so as to form a base, wherein the base covers the fixing portion of each of the heat dissipating fins and the overflow-proof structure of each of the heat dissipating fins prevents the melt metal material from overflowing.
17. The method of claim 16, wherein the forming process is an aluminum extrusion process and each of the heat dissipating fins is a flat-type heat dissipating fin, or the forming process is a rivet forming process and each of the heat dissipating fins is a cylinder-type heat dissipating fin.
18. The method of claim 16, wherein forming a plurality of heat dissipating fins by a forming process further comprises forming a recess structure on the fixing portion.
19. The method of claim 16, wherein forming a plurality of heat dissipating fins by a forming process further comprises forming a protruding structure on the fixing portion and enabling the protruding structure to protrude from one end of the fixing portion.
20. The method of claim 16, wherein forming a plurality of heat dissipating fins by a forming process further comprises forming an extending structure on the overflow-proof structure and enabling the extending structure to extend from the overflow-proof structure toward the fixing portion.
21. The heat dissipating fin of claim 1, wherein the width of the overflow-proof structure is larger than a width of the fixing portion.
22. The heat dissipating device of claim 9, wherein the width of the overflow-proof structure is larger than a width of the fixing portion.
23. The method of claim 16, wherein the width of the overflow-proof structure is larger than a width of the fixing portion.
US13/329,313 2011-12-18 2011-12-18 Heat dissipating fin, heat dissipating device and method of manufacturing the same Abandoned US20130153189A1 (en)

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US14/453,621 US20140345136A1 (en) 2011-12-18 2014-08-07 Heat dissipating fin, heat dissipating device and method of manufacturing the same

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USD903610S1 (en) * 2019-08-28 2020-12-01 Carbice Corporation Flexible heat sink
USD904322S1 (en) * 2019-08-28 2020-12-08 Carbice Corporation Flexible heat sink
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USD906269S1 (en) * 2019-08-28 2020-12-29 Carbice Corporation Flexible heat sink
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