US20130133357A1 - Container data center - Google Patents
Container data center Download PDFInfo
- Publication number
- US20130133357A1 US20130133357A1 US13/326,239 US201113326239A US2013133357A1 US 20130133357 A1 US20130133357 A1 US 20130133357A1 US 201113326239 A US201113326239 A US 201113326239A US 2013133357 A1 US2013133357 A1 US 2013133357A1
- Authority
- US
- United States
- Prior art keywords
- container
- space
- evaporator
- data center
- condenser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20827—Liquid cooling with phase change within rooms for removing heat from cabinets, e.g. air conditioning devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
- H05K7/1497—Rooms for data centers; Shipping containers therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20745—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
Definitions
- the present disclosure relates to container data centers, and particularly, to a container data center with a heat dissipation system.
- Data centers are centralized computing facilities that include many servers, often arranged on server racks, with one rack containing a number of servers.
- the servers In a working state, the servers generate a large amount of heat in the data center.
- Air conditioners are usually employed to dissipate the heat.
- the conventional air conditioners take up a lot of space in the container, which is unfit for a container data center with limited space.
- FIG. 1 is a schematic view of a container data center in accordance with an exemplary embodiment.
- FIG. 2 is a schematic diagram of the container data center of FIG. 1 , showing airflow within the container data center.
- an embodiment of a container data center 100 includes a container 10 and a number of racks 20 arranged in at least one row.
- a number of computer servers (not shown) are arranged in racks 20 .
- the container 10 is hollow and includes a front panel 12 , a back panel 13 , a top panel 14 , and a spacing plate 15 .
- the spacing plate 15 is spaced a preset distance from the top panel 14 .
- the container 10 is divided by the racks 20 into a first space 101 and a second space 102 .
- the data center 100 further includes a heat dissipation system 30 arranged in the top portion of the container 10 , to dissipate the heat generated by the computer servers in the container 10 .
- the heat dissipation system 30 includes a first portion 31 arranged on the bottom side of the spacing plate 15 and a second portion 32 arranged on the top side of the spacing plate 15 .
- the first portion 31 includes a first intake 311 communicating with the first space 101 , a first outlet 312 communicating with the second space 102 , a first fan 313 and an evaporator 314 .
- the second portion 32 includes a second intake 321 , a second outlet 322 , a second fan 323 and a condenser 324 .
- a valve 35 and a compressor 36 are connected between the condenser 324 and the evaporator 314 by a first pipe 33 and a second pipe 34 .
- valve 35 , the compressor 36 , the condenser 324 and the evaporator 314 form a loop.
- the loop is filled with refrigerant, in this embodiment, the refrigerant is Freon.
- the evaporator 314 allows compressed refrigerant to evaporate from its liquid state to gaseous, which absorbs a lot of heat.
- the hot airflow from the first space 101 through the first intake 311 can be cooled by the evaporator 314 , and then, the cooled airflow flows into the second space 102 via the first outlet 322 .
- the heat generated by the servers is dissipated.
- the gaseous refrigerant flows from the evaporator 413 to the condenser 324 which is used to condense the refrigerant from its gaseous to its liquid state.
- the cooled air flow from the second space 102 to the first space 101 through the racks 20 to bring the heat away from the racks 20 .
- the compressor 36 increases the pressure of the gaseous refrigerant to circulate the refrigerant in the loop.
- the valve 35 controls the flow of the refrigerant.
- the first fan 313 is arranged adjacent to at least one of the first intake 311 or the first outlet 312 to accelerate the air flow between the first portion 31 and the first space 101 and the second space 102 .
- the second fan 323 is arranged adjacent to at least one of the second intake 321 or the second outlet 322 , to accelerate the air flow from outside of the container 10 to the second portion 32 through the second intake 321 and to accelerate the air flow from the second portion 32 to the outside of the container 10 through the second outlet 322 to cool the condenser 324 .
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A container data center includes a container and a number of racks containing a number of computer servers. The racks divide the container into a first space and a second space. The container further includes a heat dissipation system including a first portion. The first portion includes a first intake communicating with the first space, an evaporator, and a first outlet communicating with the second space. The evaporator cools the airflow coming from the first space through the first intake, and the first outlet exhaust the cooled airflow to the second space.
Description
- 1. Technical Field
- The present disclosure relates to container data centers, and particularly, to a container data center with a heat dissipation system.
- 2. Description of Related Art
- With increasing use of online applications, the need for computer data centers has increased rapidly. Data centers are centralized computing facilities that include many servers, often arranged on server racks, with one rack containing a number of servers. In a working state, the servers generate a large amount of heat in the data center. Air conditioners are usually employed to dissipate the heat. However, the conventional air conditioners take up a lot of space in the container, which is unfit for a container data center with limited space.
- Many aspects of the present disclosure should be better understood with reference to the following drawings. The units in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present disclosure. Moreover, in the drawings, like reference numerals designate corresponding portions throughout the several views.
-
FIG. 1 is a schematic view of a container data center in accordance with an exemplary embodiment. -
FIG. 2 is a schematic diagram of the container data center ofFIG. 1 , showing airflow within the container data center. - Embodiments of the present disclosure will now be described in detail, with reference to the accompanying drawings.
- Referring to
FIG. 1 , an embodiment of acontainer data center 100 includes acontainer 10 and a number ofracks 20 arranged in at least one row. A number of computer servers (not shown) are arranged inracks 20. - Referring to
FIG. 2 , thecontainer 10 is hollow and includes afront panel 12, aback panel 13, atop panel 14, and aspacing plate 15. Thespacing plate 15 is spaced a preset distance from thetop panel 14. Thecontainer 10 is divided by theracks 20 into afirst space 101 and asecond space 102. - The
data center 100 further includes aheat dissipation system 30 arranged in the top portion of thecontainer 10, to dissipate the heat generated by the computer servers in thecontainer 10. - The
heat dissipation system 30 includes afirst portion 31 arranged on the bottom side of thespacing plate 15 and asecond portion 32 arranged on the top side of thespacing plate 15. Thefirst portion 31 includes afirst intake 311 communicating with thefirst space 101, afirst outlet 312 communicating with thesecond space 102, afirst fan 313 and anevaporator 314. Thesecond portion 32 includes asecond intake 321, asecond outlet 322, asecond fan 323 and acondenser 324. Avalve 35 and acompressor 36 are connected between thecondenser 324 and theevaporator 314 by afirst pipe 33 and asecond pipe 34. Thus, thevalve 35, thecompressor 36, thecondenser 324 and theevaporator 314 form a loop. The loop is filled with refrigerant, in this embodiment, the refrigerant is Freon. Theevaporator 314 allows compressed refrigerant to evaporate from its liquid state to gaseous, which absorbs a lot of heat. Thus, the hot airflow from thefirst space 101 through thefirst intake 311 can be cooled by theevaporator 314, and then, the cooled airflow flows into thesecond space 102 via thefirst outlet 322. Thus, the heat generated by the servers is dissipated. Simultaneously, the gaseous refrigerant flows from the evaporator 413 to thecondenser 324 which is used to condense the refrigerant from its gaseous to its liquid state. The cooled air flow from thesecond space 102 to thefirst space 101 through theracks 20 to bring the heat away from theracks 20. Thecompressor 36 increases the pressure of the gaseous refrigerant to circulate the refrigerant in the loop. Thevalve 35 controls the flow of the refrigerant. - In this embodiment, the
first fan 313 is arranged adjacent to at least one of thefirst intake 311 or thefirst outlet 312 to accelerate the air flow between thefirst portion 31 and thefirst space 101 and thesecond space 102. - The
second fan 323 is arranged adjacent to at least one of thesecond intake 321 or thesecond outlet 322, to accelerate the air flow from outside of thecontainer 10 to thesecond portion 32 through thesecond intake 321 and to accelerate the air flow from thesecond portion 32 to the outside of thecontainer 10 through thesecond outlet 322 to cool thecondenser 324. - It is believed that the present embodiments and their advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the disclosure or sacrificing all of its material advantages, the examples hereinbefore described merely being exemplary embodiments of the present disclosure.
Claims (6)
1. A container data center comprising:
a plurality of racks accomodating a plurality of computer servers and arranged in at least one row; and
a container containing the plurality of racks and divided by the racks into a first space and a second space;
a heat dissipation system arranged in a top portion of the container, the heat dissipation system comprising a first portion defining a first intake communicating with the first space, a first outlet communicating with the second space, and an evaporator, wherein the evaporator cools airflow from the first space flowing through the first intake, and the first outlet exhausts the cooled airflow to the second space.
2. The container data center as described in claim 1 , wherein the first portion further comprises a fan arranged adjacent to the first intake or the first outlet.
3. The container data center as described in claim 1 , wherein the container further comprises a top panel and a spacing plate, the spacing plate is spaced a preset distance from the top panel, the heat dissipation system further comprises a second portion, the first portion is arranged on a bottom side of the spacing plate and the second portion is arranged on a top side of the spacing plate, the second portion comprises a condenser connected with the evaporator by a first pipe and a second pipe; the condenser, the evaporator, the first pipe, and the second pipe form a loop which is filled with refrigerant, the evaporator allows compressed refrigerant to evaporate from its liquid state to gaseous state to cool hot airflow coming from the first space, the gaseous refrigerant flows from the evaporator to the condenser, the condenser is configured to condense the refrigerant from gaseous state to liquid state.
4. The container data center as described in claim 3 , wherein the second portion further defines a second intake communicating with an outside of the container, a second outlet communicating with the outside, and comprises a second fan arranged adjacent to the second intake or the second outlet, to accelerate airflow from outside of the container to the second portion through the second intake, and to accelerate airflow from the second portion to the outside of the container through the second outlet to cool the condenser.
5. The container data center as described in claim 3 , wherein the container further comprises a compressor connected between the evaporator and the condenser, the compressor is configured to increase the pressure of the gaseous refrigerant to circulate the refrigerant in the loop.
6. The container data center as described in claim 3 , wherein the container further comprises a valve connected between the evaporator and the condenser to control the flow of the refrigerant.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100143053 | 2011-11-24 | ||
| TW100143053A TW201322902A (en) | 2011-11-24 | 2011-11-24 | Container data center |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US20130133357A1 true US20130133357A1 (en) | 2013-05-30 |
Family
ID=48465554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US13/326,239 Abandoned US20130133357A1 (en) | 2011-11-24 | 2011-12-14 | Container data center |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20130133357A1 (en) |
| TW (1) | TW201322902A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140260365A1 (en) * | 2013-03-12 | 2014-09-18 | Hussmann Corporation | Portable refrigeration unit for palletized product |
| US20150305204A1 (en) * | 2014-04-18 | 2015-10-22 | Hon Hai Precision Industry Co., Ltd. | Data center with cooling system |
| US20160050788A1 (en) * | 2014-08-13 | 2016-02-18 | Sixsigma Networks Mexico, S.A. De C.V. | Mobile data processing center |
| JP2016061483A (en) * | 2014-09-17 | 2016-04-25 | 新日鉄住金エンジニアリング株式会社 | Cooling box and container type data center including the same |
| CN107072122A (en) * | 2017-06-07 | 2017-08-18 | 苏州安瑞可机柜系统有限公司 | A kind of modular data center |
| CN108990382A (en) * | 2018-08-14 | 2018-12-11 | 深圳市艾特网能技术有限公司 | A kind of refrigeration system suitable for container-type data center |
| CN112804861A (en) * | 2021-01-21 | 2021-05-14 | 北京百度网讯科技有限公司 | Refrigeration system of container data center |
| CN114501930A (en) * | 2021-12-30 | 2022-05-13 | 无锡天云数据中心科技有限公司 | A container data center indirect refrigeration system |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI608333B (en) * | 2015-01-08 | 2017-12-11 | Chunghwa Telecom Co Ltd | Combined data center and its heat dissipation method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090105884A1 (en) * | 2006-05-19 | 2009-04-23 | Shinichi Kaga | Cooling Storage Cabinet and Method of Operating the Same |
| US20090154096A1 (en) * | 2007-12-17 | 2009-06-18 | International Business Machines Corporation | Apparatus and method for facilitating cooling of an electronics system |
| US20100064714A1 (en) * | 2008-09-16 | 2010-03-18 | Hitachi Cable, Ltd. | Data center |
-
2011
- 2011-11-24 TW TW100143053A patent/TW201322902A/en unknown
- 2011-12-14 US US13/326,239 patent/US20130133357A1/en not_active Abandoned
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090105884A1 (en) * | 2006-05-19 | 2009-04-23 | Shinichi Kaga | Cooling Storage Cabinet and Method of Operating the Same |
| US20090154096A1 (en) * | 2007-12-17 | 2009-06-18 | International Business Machines Corporation | Apparatus and method for facilitating cooling of an electronics system |
| US20100064714A1 (en) * | 2008-09-16 | 2010-03-18 | Hitachi Cable, Ltd. | Data center |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140260365A1 (en) * | 2013-03-12 | 2014-09-18 | Hussmann Corporation | Portable refrigeration unit for palletized product |
| US9459037B2 (en) * | 2013-03-12 | 2016-10-04 | Hussmann Corporation | Portable refrigeration unit for palletized product |
| US20150305204A1 (en) * | 2014-04-18 | 2015-10-22 | Hon Hai Precision Industry Co., Ltd. | Data center with cooling system |
| US20160050788A1 (en) * | 2014-08-13 | 2016-02-18 | Sixsigma Networks Mexico, S.A. De C.V. | Mobile data processing center |
| US9565788B2 (en) * | 2014-08-13 | 2017-02-07 | Sixsigma Networks Mexico, S.A., De C.V. | Mobile data processing center |
| JP2016061483A (en) * | 2014-09-17 | 2016-04-25 | 新日鉄住金エンジニアリング株式会社 | Cooling box and container type data center including the same |
| CN107072122A (en) * | 2017-06-07 | 2017-08-18 | 苏州安瑞可机柜系统有限公司 | A kind of modular data center |
| WO2018223547A1 (en) * | 2017-06-07 | 2018-12-13 | 苏州安瑞可机柜系统有限公司 | Modular data centre |
| CN108990382A (en) * | 2018-08-14 | 2018-12-11 | 深圳市艾特网能技术有限公司 | A kind of refrigeration system suitable for container-type data center |
| CN112804861A (en) * | 2021-01-21 | 2021-05-14 | 北京百度网讯科技有限公司 | Refrigeration system of container data center |
| CN114501930A (en) * | 2021-12-30 | 2022-05-13 | 无锡天云数据中心科技有限公司 | A container data center indirect refrigeration system |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201322902A (en) | 2013-06-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment |
Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:WEI, CHAO-KE;REEL/FRAME:027391/0428 Effective date: 20111212 |
|
| STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |