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US20130133357A1 - Container data center - Google Patents

Container data center Download PDF

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Publication number
US20130133357A1
US20130133357A1 US13/326,239 US201113326239A US2013133357A1 US 20130133357 A1 US20130133357 A1 US 20130133357A1 US 201113326239 A US201113326239 A US 201113326239A US 2013133357 A1 US2013133357 A1 US 2013133357A1
Authority
US
United States
Prior art keywords
container
space
evaporator
data center
condenser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/326,239
Inventor
Chao-Ke Wei
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hon Hai Precision Industry Co Ltd
Original Assignee
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Precision Industry Co Ltd filed Critical Hon Hai Precision Industry Co Ltd
Assigned to HON HAI PRECISION INDUSTRY CO., LTD. reassignment HON HAI PRECISION INDUSTRY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: WEI, CHAO-KE
Publication of US20130133357A1 publication Critical patent/US20130133357A1/en
Abandoned legal-status Critical Current

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208Liquid cooling with phase change
    • H05K7/20827Liquid cooling with phase change within rooms for removing heat from cabinets, e.g. air conditioning devices
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1485Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1497Rooms for data centers; Shipping containers therefor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718Forced ventilation of a gaseous coolant
    • H05K7/20745Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device

Definitions

  • the present disclosure relates to container data centers, and particularly, to a container data center with a heat dissipation system.
  • Data centers are centralized computing facilities that include many servers, often arranged on server racks, with one rack containing a number of servers.
  • the servers In a working state, the servers generate a large amount of heat in the data center.
  • Air conditioners are usually employed to dissipate the heat.
  • the conventional air conditioners take up a lot of space in the container, which is unfit for a container data center with limited space.
  • FIG. 1 is a schematic view of a container data center in accordance with an exemplary embodiment.
  • FIG. 2 is a schematic diagram of the container data center of FIG. 1 , showing airflow within the container data center.
  • an embodiment of a container data center 100 includes a container 10 and a number of racks 20 arranged in at least one row.
  • a number of computer servers (not shown) are arranged in racks 20 .
  • the container 10 is hollow and includes a front panel 12 , a back panel 13 , a top panel 14 , and a spacing plate 15 .
  • the spacing plate 15 is spaced a preset distance from the top panel 14 .
  • the container 10 is divided by the racks 20 into a first space 101 and a second space 102 .
  • the data center 100 further includes a heat dissipation system 30 arranged in the top portion of the container 10 , to dissipate the heat generated by the computer servers in the container 10 .
  • the heat dissipation system 30 includes a first portion 31 arranged on the bottom side of the spacing plate 15 and a second portion 32 arranged on the top side of the spacing plate 15 .
  • the first portion 31 includes a first intake 311 communicating with the first space 101 , a first outlet 312 communicating with the second space 102 , a first fan 313 and an evaporator 314 .
  • the second portion 32 includes a second intake 321 , a second outlet 322 , a second fan 323 and a condenser 324 .
  • a valve 35 and a compressor 36 are connected between the condenser 324 and the evaporator 314 by a first pipe 33 and a second pipe 34 .
  • valve 35 , the compressor 36 , the condenser 324 and the evaporator 314 form a loop.
  • the loop is filled with refrigerant, in this embodiment, the refrigerant is Freon.
  • the evaporator 314 allows compressed refrigerant to evaporate from its liquid state to gaseous, which absorbs a lot of heat.
  • the hot airflow from the first space 101 through the first intake 311 can be cooled by the evaporator 314 , and then, the cooled airflow flows into the second space 102 via the first outlet 322 .
  • the heat generated by the servers is dissipated.
  • the gaseous refrigerant flows from the evaporator 413 to the condenser 324 which is used to condense the refrigerant from its gaseous to its liquid state.
  • the cooled air flow from the second space 102 to the first space 101 through the racks 20 to bring the heat away from the racks 20 .
  • the compressor 36 increases the pressure of the gaseous refrigerant to circulate the refrigerant in the loop.
  • the valve 35 controls the flow of the refrigerant.
  • the first fan 313 is arranged adjacent to at least one of the first intake 311 or the first outlet 312 to accelerate the air flow between the first portion 31 and the first space 101 and the second space 102 .
  • the second fan 323 is arranged adjacent to at least one of the second intake 321 or the second outlet 322 , to accelerate the air flow from outside of the container 10 to the second portion 32 through the second intake 321 and to accelerate the air flow from the second portion 32 to the outside of the container 10 through the second outlet 322 to cool the condenser 324 .

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A container data center includes a container and a number of racks containing a number of computer servers. The racks divide the container into a first space and a second space. The container further includes a heat dissipation system including a first portion. The first portion includes a first intake communicating with the first space, an evaporator, and a first outlet communicating with the second space. The evaporator cools the airflow coming from the first space through the first intake, and the first outlet exhaust the cooled airflow to the second space.

Description

    BACKGROUND
  • 1. Technical Field
  • The present disclosure relates to container data centers, and particularly, to a container data center with a heat dissipation system.
  • 2. Description of Related Art
  • With increasing use of online applications, the need for computer data centers has increased rapidly. Data centers are centralized computing facilities that include many servers, often arranged on server racks, with one rack containing a number of servers. In a working state, the servers generate a large amount of heat in the data center. Air conditioners are usually employed to dissipate the heat. However, the conventional air conditioners take up a lot of space in the container, which is unfit for a container data center with limited space.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • Many aspects of the present disclosure should be better understood with reference to the following drawings. The units in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present disclosure. Moreover, in the drawings, like reference numerals designate corresponding portions throughout the several views.
  • FIG. 1 is a schematic view of a container data center in accordance with an exemplary embodiment.
  • FIG. 2 is a schematic diagram of the container data center of FIG. 1, showing airflow within the container data center.
  • DETAILED DESCRIPTION
  • Embodiments of the present disclosure will now be described in detail, with reference to the accompanying drawings.
  • Referring to FIG. 1, an embodiment of a container data center 100 includes a container 10 and a number of racks 20 arranged in at least one row. A number of computer servers (not shown) are arranged in racks 20.
  • Referring to FIG. 2, the container 10 is hollow and includes a front panel 12, a back panel 13, a top panel 14, and a spacing plate 15. The spacing plate 15 is spaced a preset distance from the top panel 14. The container 10 is divided by the racks 20 into a first space 101 and a second space 102.
  • The data center 100 further includes a heat dissipation system 30 arranged in the top portion of the container 10, to dissipate the heat generated by the computer servers in the container 10.
  • The heat dissipation system 30 includes a first portion 31 arranged on the bottom side of the spacing plate 15 and a second portion 32 arranged on the top side of the spacing plate 15. The first portion 31 includes a first intake 311 communicating with the first space 101, a first outlet 312 communicating with the second space 102, a first fan 313 and an evaporator 314. The second portion 32 includes a second intake 321, a second outlet 322, a second fan 323 and a condenser 324. A valve 35 and a compressor 36 are connected between the condenser 324 and the evaporator 314 by a first pipe 33 and a second pipe 34. Thus, the valve 35, the compressor 36, the condenser 324 and the evaporator 314 form a loop. The loop is filled with refrigerant, in this embodiment, the refrigerant is Freon. The evaporator 314 allows compressed refrigerant to evaporate from its liquid state to gaseous, which absorbs a lot of heat. Thus, the hot airflow from the first space 101 through the first intake 311 can be cooled by the evaporator 314, and then, the cooled airflow flows into the second space 102 via the first outlet 322. Thus, the heat generated by the servers is dissipated. Simultaneously, the gaseous refrigerant flows from the evaporator 413 to the condenser 324 which is used to condense the refrigerant from its gaseous to its liquid state. The cooled air flow from the second space 102 to the first space 101 through the racks 20 to bring the heat away from the racks 20. The compressor 36 increases the pressure of the gaseous refrigerant to circulate the refrigerant in the loop. The valve 35 controls the flow of the refrigerant.
  • In this embodiment, the first fan 313 is arranged adjacent to at least one of the first intake 311 or the first outlet 312 to accelerate the air flow between the first portion 31 and the first space 101 and the second space 102.
  • The second fan 323 is arranged adjacent to at least one of the second intake 321 or the second outlet 322, to accelerate the air flow from outside of the container 10 to the second portion 32 through the second intake 321 and to accelerate the air flow from the second portion 32 to the outside of the container 10 through the second outlet 322 to cool the condenser 324.
  • It is believed that the present embodiments and their advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the disclosure or sacrificing all of its material advantages, the examples hereinbefore described merely being exemplary embodiments of the present disclosure.

Claims (6)

What is claimed is:
1. A container data center comprising:
a plurality of racks accomodating a plurality of computer servers and arranged in at least one row; and
a container containing the plurality of racks and divided by the racks into a first space and a second space;
a heat dissipation system arranged in a top portion of the container, the heat dissipation system comprising a first portion defining a first intake communicating with the first space, a first outlet communicating with the second space, and an evaporator, wherein the evaporator cools airflow from the first space flowing through the first intake, and the first outlet exhausts the cooled airflow to the second space.
2. The container data center as described in claim 1, wherein the first portion further comprises a fan arranged adjacent to the first intake or the first outlet.
3. The container data center as described in claim 1, wherein the container further comprises a top panel and a spacing plate, the spacing plate is spaced a preset distance from the top panel, the heat dissipation system further comprises a second portion, the first portion is arranged on a bottom side of the spacing plate and the second portion is arranged on a top side of the spacing plate, the second portion comprises a condenser connected with the evaporator by a first pipe and a second pipe; the condenser, the evaporator, the first pipe, and the second pipe form a loop which is filled with refrigerant, the evaporator allows compressed refrigerant to evaporate from its liquid state to gaseous state to cool hot airflow coming from the first space, the gaseous refrigerant flows from the evaporator to the condenser, the condenser is configured to condense the refrigerant from gaseous state to liquid state.
4. The container data center as described in claim 3, wherein the second portion further defines a second intake communicating with an outside of the container, a second outlet communicating with the outside, and comprises a second fan arranged adjacent to the second intake or the second outlet, to accelerate airflow from outside of the container to the second portion through the second intake, and to accelerate airflow from the second portion to the outside of the container through the second outlet to cool the condenser.
5. The container data center as described in claim 3, wherein the container further comprises a compressor connected between the evaporator and the condenser, the compressor is configured to increase the pressure of the gaseous refrigerant to circulate the refrigerant in the loop.
6. The container data center as described in claim 3, wherein the container further comprises a valve connected between the evaporator and the condenser to control the flow of the refrigerant.
US13/326,239 2011-11-24 2011-12-14 Container data center Abandoned US20130133357A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW100143053 2011-11-24
TW100143053A TW201322902A (en) 2011-11-24 2011-11-24 Container data center

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US20130133357A1 true US20130133357A1 (en) 2013-05-30

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140260365A1 (en) * 2013-03-12 2014-09-18 Hussmann Corporation Portable refrigeration unit for palletized product
US20150305204A1 (en) * 2014-04-18 2015-10-22 Hon Hai Precision Industry Co., Ltd. Data center with cooling system
US20160050788A1 (en) * 2014-08-13 2016-02-18 Sixsigma Networks Mexico, S.A. De C.V. Mobile data processing center
JP2016061483A (en) * 2014-09-17 2016-04-25 新日鉄住金エンジニアリング株式会社 Cooling box and container type data center including the same
CN107072122A (en) * 2017-06-07 2017-08-18 苏州安瑞可机柜系统有限公司 A kind of modular data center
CN108990382A (en) * 2018-08-14 2018-12-11 深圳市艾特网能技术有限公司 A kind of refrigeration system suitable for container-type data center
CN112804861A (en) * 2021-01-21 2021-05-14 北京百度网讯科技有限公司 Refrigeration system of container data center
CN114501930A (en) * 2021-12-30 2022-05-13 无锡天云数据中心科技有限公司 A container data center indirect refrigeration system

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI608333B (en) * 2015-01-08 2017-12-11 Chunghwa Telecom Co Ltd Combined data center and its heat dissipation method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090105884A1 (en) * 2006-05-19 2009-04-23 Shinichi Kaga Cooling Storage Cabinet and Method of Operating the Same
US20090154096A1 (en) * 2007-12-17 2009-06-18 International Business Machines Corporation Apparatus and method for facilitating cooling of an electronics system
US20100064714A1 (en) * 2008-09-16 2010-03-18 Hitachi Cable, Ltd. Data center

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090105884A1 (en) * 2006-05-19 2009-04-23 Shinichi Kaga Cooling Storage Cabinet and Method of Operating the Same
US20090154096A1 (en) * 2007-12-17 2009-06-18 International Business Machines Corporation Apparatus and method for facilitating cooling of an electronics system
US20100064714A1 (en) * 2008-09-16 2010-03-18 Hitachi Cable, Ltd. Data center

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140260365A1 (en) * 2013-03-12 2014-09-18 Hussmann Corporation Portable refrigeration unit for palletized product
US9459037B2 (en) * 2013-03-12 2016-10-04 Hussmann Corporation Portable refrigeration unit for palletized product
US20150305204A1 (en) * 2014-04-18 2015-10-22 Hon Hai Precision Industry Co., Ltd. Data center with cooling system
US20160050788A1 (en) * 2014-08-13 2016-02-18 Sixsigma Networks Mexico, S.A. De C.V. Mobile data processing center
US9565788B2 (en) * 2014-08-13 2017-02-07 Sixsigma Networks Mexico, S.A., De C.V. Mobile data processing center
JP2016061483A (en) * 2014-09-17 2016-04-25 新日鉄住金エンジニアリング株式会社 Cooling box and container type data center including the same
CN107072122A (en) * 2017-06-07 2017-08-18 苏州安瑞可机柜系统有限公司 A kind of modular data center
WO2018223547A1 (en) * 2017-06-07 2018-12-13 苏州安瑞可机柜系统有限公司 Modular data centre
CN108990382A (en) * 2018-08-14 2018-12-11 深圳市艾特网能技术有限公司 A kind of refrigeration system suitable for container-type data center
CN112804861A (en) * 2021-01-21 2021-05-14 北京百度网讯科技有限公司 Refrigeration system of container data center
CN114501930A (en) * 2021-12-30 2022-05-13 无锡天云数据中心科技有限公司 A container data center indirect refrigeration system

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Legal Events

Date Code Title Description
AS Assignment

Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:WEI, CHAO-KE;REEL/FRAME:027391/0428

Effective date: 20111212

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION