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US20100038055A1 - Heat dispensing unit for memory chip - Google Patents

Heat dispensing unit for memory chip Download PDF

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Publication number
US20100038055A1
US20100038055A1 US12/230,640 US23064008A US2010038055A1 US 20100038055 A1 US20100038055 A1 US 20100038055A1 US 23064008 A US23064008 A US 23064008A US 2010038055 A1 US2010038055 A1 US 2010038055A1
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US
United States
Prior art keywords
plates
connection
heat dispensing
heat
dispensing unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/230,640
Inventor
Wei-Hau Chen
Steven Yen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Comptake Tech Inc
Original Assignee
Comptake Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Comptake Tech Inc filed Critical Comptake Tech Inc
Assigned to COMPTAKE TECHNOLOGY INC. reassignment COMPTAKE TECHNOLOGY INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, WEI-HAU, YEN, STEVEN
Publication of US20100038055A1 publication Critical patent/US20100038055A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat dispensing unit for removing heat from memory chips.
  • a conventional heat dispensing unit 30 for memory chips is shown in FIG. 4 and generally includes two heat conductive pads 301 , two heat dispensing plates 302 and two clamps 303 , wherein the heat conductive pads 301 are attached to in sides of the two heat dispensing plates 302 which have hooks 302 a, engaging holes 302 b and engaging pieces 302 c on a top thereof.
  • the engaging pieces 302 c each have a downward positioning plates 302 d which are located corresponding to the U-shaped restriction slots 304 on outsides of the heat dispensing plates 302 .
  • a through hole 305 is located above the restriction slot 304 and a guide slot 306 is located above the through hole 305 so that when the two clamps 303 clamp the two heat dispensing plates 302 , the two clamps 303 are mounted onto the two positioning plates 302 d and the hoods 303 a are engaged with the through hole 305 via the guide slots 306 so that the two heat dispensing plates 302 can clamp the memory chip 20 .
  • the heat generated from the memory chip 2 is conducted to the heat dispensing unit 30 and releases to air.
  • the conventional heat dispensing unit 30 includes a complicated structure which includes hooks 303 a, restriction slots 304 , through holes 305 and guide slots 306 .
  • the complicated structure makes the heat dispensing unit 30 to be expensive and time consuming when manufacturing.
  • the two clamps 303 clamp at the top edges of the two heat dispensing plates 302 so that it is impossible to add extra heat dispensing plates 302 onto the top edges.
  • the existed heat dispensing unit cannot efficiently dispense the high temperature generated from the latest chips which operate at very high speed and the low efficient heat dispensing unit restricts the use of the high end CPU in computers.
  • the present invention intends to provide a heat dispensing unit for memory chips wherein the heat dispensing plates are easily manufactured and can be quickly connected to each other.
  • the present invention relates to a heat dispensing unit which comprises two heat dispensing plates between which the chip is clamped.
  • Each heat dispensing plate includes two connection plates bending from two ends thereof.
  • the two connection plates of one of the two heat dispensing plates have a connection piece and the two connection plates of the other one of the two heat dispensing plates have a connection port defined therein.
  • Each of the connection pieces has a contacting portion which is engaged with an inside of the connection port corresponding thereto when the connection pieces are connected to the connection ports.
  • the primary object of the present invention is to provide a heat dispending unit for chips and the two heat dispensing plates are easily connected to each other without using clamps.
  • Another object of the present invention is to provide a heat dispending unit for chips wherein the gap between the two heat dispensing plates is covered by two flanges on two respective tops of the two heat dispensing plates.
  • FIG. 1 is an exploded view to show the heat dispensing unit of the present invention
  • FIG. 2 is a perspective view to show the heat dispensing unit of the present invention
  • FIG. 2A is an enlarged view to show the connection of the connection piece and the connection ports of the heat dispensing unit of FIG. 2 ;
  • FIG. 3 is a perspective view to show the heat dispensing unit of the present invention, wherein the chip is clamped between the two heat dispensing plates of the present invention, and
  • FIG. 4 is an exploded view to show the conventional heat dispensing unit.
  • the heat dispensing unit 1 of the present invention comprises two heat dispensing plates 1 and each heat dispensing plate 1 has a heat conductive pad 15 attached to the inside thereof so that the chip 2 ( FIG. 3 ) that is clamped between the two heat dispensing plates 1 has sufficient contact area for removing heat therefrom.
  • Each heat dispensing plate 1 has two connection plates 11 bending from two ends thereof and the two connection plates 11 of one of the two heat dispensing plates have a connection piece 12 extending therefrom and the two connection plates 11 of the other one of the two heat dispensing plates 1 have a connection port 13 defined therein.
  • the connection piece 12 is a plate split from the connection plate 11 and the connection port 13 is a rectangular hole defined through the connection plate 11 .
  • Each of the connection pieces 12 has a contacting portion 121 which is engaged with an inside of the connection port 13 corresponding thereto when the connection pieces 12 are connected to the connection ports 13 .
  • Two guide units 14 are connected to each of the two heat dispensing plates 1 and each guide unit 14 is composed of a first bending plate 14 a which is located beside the connection piece 12 and a second bending plate 14 b which is located beside the connection port 13 .
  • the first and second bending plates 14 a, 14 b are arranged such that when the two heat dispensing plates 1 are connected to each other, the first and second bending plates 14 a, 14 b are overlapped to each other.
  • the guide units 14 guide the two heat dispensing plates 1 to be connected correctly so that the connection pieces 12 are easily engaged with the connection ports 13 . Once the connection pieces 12 are engaged with the connection ports 13 , no extra clamps are needed to hold the two heat dispensing plates 1 .
  • Each of the heat dispensing plates 1 further includes a flange 16 extending from a top thereof so as to cover a gap between the two heat dispensing plates 1 .
  • the flanges 16 avoid dust from entering the gap between the two heat dispensing plates 1 .

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat dispensing unit includes two heat dispensing plates between which the chip is clamped. Each heat dispensing plate includes two connection plates bending from two ends thereof and the two connection plates have a connection piece or a connection port so that when the two heat dispensing plates are connected to each other, the connection pieces are connected to the connection ports.

Description

    BACKGROUND OF THE INVENTION
  • (1) Field of the Invention
  • The present invention relates to a heat dispensing unit for removing heat from memory chips.
  • (2) Description of the Prior Art
  • A conventional heat dispensing unit 30 for memory chips is shown in FIG. 4 and generally includes two heat conductive pads 301, two heat dispensing plates 302 and two clamps 303, wherein the heat conductive pads 301 are attached to in sides of the two heat dispensing plates 302 which have hooks 302 a, engaging holes 302 b and engaging pieces 302 c on a top thereof. When the two heat dispensing plates 302 are combined, a space is defined therebetween and the memory chip 2 is clamped. The engaging pieces 302 c each have a downward positioning plates 302 d which are located corresponding to the U-shaped restriction slots 304 on outsides of the heat dispensing plates 302. A through hole 305 is located above the restriction slot 304 and a guide slot 306 is located above the through hole 305 so that when the two clamps 303 clamp the two heat dispensing plates 302, the two clamps 303 are mounted onto the two positioning plates 302 d and the hoods 303 a are engaged with the through hole 305 via the guide slots 306 so that the two heat dispensing plates 302 can clamp the memory chip 20. The heat generated from the memory chip 2 is conducted to the heat dispensing unit 30 and releases to air.
  • However, the conventional heat dispensing unit 30 includes a complicated structure which includes hooks 303 a, restriction slots 304, through holes 305 and guide slots 306. The complicated structure makes the heat dispensing unit 30 to be expensive and time consuming when manufacturing. Besides, the two clamps 303 clamp at the top edges of the two heat dispensing plates 302 so that it is impossible to add extra heat dispensing plates 302 onto the top edges.
  • The existed heat dispensing unit cannot efficiently dispense the high temperature generated from the latest chips which operate at very high speed and the low efficient heat dispensing unit restricts the use of the high end CPU in computers.
  • The present invention intends to provide a heat dispensing unit for memory chips wherein the heat dispensing plates are easily manufactured and can be quickly connected to each other.
    • SUMMARY OF THE INVENTION
  • The present invention relates to a heat dispensing unit which comprises two heat dispensing plates between which the chip is clamped. Each heat dispensing plate includes two connection plates bending from two ends thereof. The two connection plates of one of the two heat dispensing plates have a connection piece and the two connection plates of the other one of the two heat dispensing plates have a connection port defined therein. Each of the connection pieces has a contacting portion which is engaged with an inside of the connection port corresponding thereto when the connection pieces are connected to the connection ports.
  • The primary object of the present invention is to provide a heat dispending unit for chips and the two heat dispensing plates are easily connected to each other without using clamps.
  • Another object of the present invention is to provide a heat dispending unit for chips wherein the gap between the two heat dispensing plates is covered by two flanges on two respective tops of the two heat dispensing plates.
  • The present invention will become more obvious from the following description when taken in connection with the accompanying drawings which show, for purposes of illustration only, a preferred embodiment in accordance with the present invention.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is an exploded view to show the heat dispensing unit of the present invention;
  • FIG. 2 is a perspective view to show the heat dispensing unit of the present invention;
  • FIG. 2A is an enlarged view to show the connection of the connection piece and the connection ports of the heat dispensing unit of FIG. 2;
  • FIG. 3 is a perspective view to show the heat dispensing unit of the present invention, wherein the chip is clamped between the two heat dispensing plates of the present invention, and
  • FIG. 4 is an exploded view to show the conventional heat dispensing unit.
    •  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • Referring to FIGS. 1, 2, 2A and 3, the heat dispensing unit 1 of the present invention comprises two heat dispensing plates 1 and each heat dispensing plate 1 has a heat conductive pad 15 attached to the inside thereof so that the chip 2 (FIG. 3) that is clamped between the two heat dispensing plates 1 has sufficient contact area for removing heat therefrom.
  • Each heat dispensing plate 1 has two connection plates 11 bending from two ends thereof and the two connection plates 11 of one of the two heat dispensing plates have a connection piece 12 extending therefrom and the two connection plates 11 of the other one of the two heat dispensing plates 1 have a connection port 13 defined therein. In this embodiment, the connection piece 12 is a plate split from the connection plate 11 and the connection port 13 is a rectangular hole defined through the connection plate 11. Each of the connection pieces 12 has a contacting portion 121 which is engaged with an inside of the connection port 13 corresponding thereto when the connection pieces 12 are connected to the connection ports 13.
  • Two guide units 14 are connected to each of the two heat dispensing plates 1 and each guide unit 14 is composed of a first bending plate 14 a which is located beside the connection piece 12 and a second bending plate 14 b which is located beside the connection port 13. The first and second bending plates 14 a, 14 b are arranged such that when the two heat dispensing plates 1 are connected to each other, the first and second bending plates 14 a, 14 b are overlapped to each other. The guide units 14 guide the two heat dispensing plates 1 to be connected correctly so that the connection pieces 12 are easily engaged with the connection ports 13. Once the connection pieces 12 are engaged with the connection ports 13, no extra clamps are needed to hold the two heat dispensing plates 1.
  • Each of the heat dispensing plates 1 further includes a flange 16 extending from a top thereof so as to cover a gap between the two heat dispensing plates 1. The flanges 16 avoid dust from entering the gap between the two heat dispensing plates 1.
  • While we have shown and described the embodiment in accordance with the present invention, it should be clear to those skilled in the art that further embodiments may be made without departing from the scope of the present invention.

Claims (5)

1. A heat dispensing unit comprising:
two heat dispensing plates and a chip being clamped between the two heat dispensing plates, each heat dispensing plate having two connection plates bending from two ends thereof, the two connection plates of one of the two heat dispensing plates having a connection piece and the two connection plates of the other one of the two heat dispensing plates having a connection port defined therein, each of the connection pieces having a contacting portion which is engaged with an inside of the connection port corresponding thereto when the connection pieces are connected to the connection ports.
2. The heat dispensing unit as claimed in claim 1, wherein two guide units are connected to each of the two heat dispensing plates and each guide unit is composed of a first bending plate which is located beside the connection piece and a second bending plate which is located beside the connection port, the first and second bending plates are overlapped to each other when the two heat dispensing plates are connected to each other.
3. The heat dispensing unit as claimed in claim 1, wherein the connection piece is a plate split from the connection plate.
4. The heat dispensing unit as claimed in claim 1, wherein the connection port is a rectangular hole defined through the connection plate.
5. The heat dispensing unit as claimed in claim 1, wherein each of the heat dispensing plates includes a flange extending from a top thereof so as to cover a gap between the two heat dispensing plates.
US12/230,640 2008-08-18 2008-09-03 Heat dispensing unit for memory chip Abandoned US20100038055A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW097214763 2008-08-18
TW097214763U TWM355002U (en) 2008-08-18 2008-08-18 Improved memory heat sink

Publications (1)

Publication Number Publication Date
US20100038055A1 true US20100038055A1 (en) 2010-02-18

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
US12/230,640 Abandoned US20100038055A1 (en) 2008-08-18 2008-09-03 Heat dispensing unit for memory chip

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US (1) US20100038055A1 (en)
TW (1) TWM355002U (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD626520S1 (en) * 2010-03-23 2010-11-02 Comptake Technology Inc. Heat-dissipating device for memory
USD626521S1 (en) * 2010-03-23 2010-11-02 Comptake Technology Inc. Heat-dissipating device for memory
USD659110S1 (en) * 2010-03-23 2012-05-08 ComTake Technology, Inc. Heat-dissipating device for memory
US20140202675A1 (en) * 2013-01-22 2014-07-24 Comptake Technology Inc. Heat dissipation unit used in memory device
USD755186S1 (en) * 2015-02-20 2016-05-03 Katun Corporation Toner container memory chip

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5473509A (en) * 1992-09-24 1995-12-05 Siemens Aktiengesellschaft Electronic control unit
US5548483A (en) * 1995-01-24 1996-08-20 Elco Corporation Frameless IC card and housing therefor
US5966287A (en) * 1997-12-17 1999-10-12 Intel Corporation Clip on heat exchanger for a memory module and assembly method
US7221569B2 (en) * 2004-09-15 2007-05-22 Comptake Technology Co., Ltd. Memory heat-dissipating device
US20070165382A1 (en) * 2006-01-16 2007-07-19 Nanya Technology Corporation Heat sink assembly
US7262971B2 (en) * 2006-01-05 2007-08-28 Comptake Technology Co., Ltd Memory cooling device
US7312996B2 (en) * 2005-03-14 2007-12-25 Wan Chien Chang Heat sink for memory strips
US7408781B1 (en) * 2007-06-01 2008-08-05 Comptake Technology Inc. Cooling device for memory chips
US7457122B2 (en) * 2006-02-22 2008-11-25 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Memory module assembly including a clip for mounting a heat sink thereon
US7483273B2 (en) * 2005-05-27 2009-01-27 Shinko Electric Industries Co., Ltd. Semiconductor module and semiconductor module heat radiation plate

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5473509A (en) * 1992-09-24 1995-12-05 Siemens Aktiengesellschaft Electronic control unit
US5548483A (en) * 1995-01-24 1996-08-20 Elco Corporation Frameless IC card and housing therefor
US5966287A (en) * 1997-12-17 1999-10-12 Intel Corporation Clip on heat exchanger for a memory module and assembly method
US7221569B2 (en) * 2004-09-15 2007-05-22 Comptake Technology Co., Ltd. Memory heat-dissipating device
US7312996B2 (en) * 2005-03-14 2007-12-25 Wan Chien Chang Heat sink for memory strips
US7483273B2 (en) * 2005-05-27 2009-01-27 Shinko Electric Industries Co., Ltd. Semiconductor module and semiconductor module heat radiation plate
US7262971B2 (en) * 2006-01-05 2007-08-28 Comptake Technology Co., Ltd Memory cooling device
US20070165382A1 (en) * 2006-01-16 2007-07-19 Nanya Technology Corporation Heat sink assembly
US7457122B2 (en) * 2006-02-22 2008-11-25 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Memory module assembly including a clip for mounting a heat sink thereon
US7408781B1 (en) * 2007-06-01 2008-08-05 Comptake Technology Inc. Cooling device for memory chips

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD626520S1 (en) * 2010-03-23 2010-11-02 Comptake Technology Inc. Heat-dissipating device for memory
USD626521S1 (en) * 2010-03-23 2010-11-02 Comptake Technology Inc. Heat-dissipating device for memory
USD659110S1 (en) * 2010-03-23 2012-05-08 ComTake Technology, Inc. Heat-dissipating device for memory
US20140202675A1 (en) * 2013-01-22 2014-07-24 Comptake Technology Inc. Heat dissipation unit used in memory device
USD755186S1 (en) * 2015-02-20 2016-05-03 Katun Corporation Toner container memory chip
USD755793S1 (en) * 2015-02-20 2016-05-10 Katun Corporation Toner container memory chip

Also Published As

Publication number Publication date
TWM355002U (en) 2009-04-11

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Legal Events

Date Code Title Description
AS Assignment

Owner name: COMPTAKE TECHNOLOGY INC.,TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHEN, WEI-HAU;YEN, STEVEN;REEL/FRAME:021520/0435

Effective date: 20080828

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION