US20080029720A1 - LED lighting arrangement including light emitting phosphor - Google Patents
LED lighting arrangement including light emitting phosphor Download PDFInfo
- Publication number
- US20080029720A1 US20080029720A1 US11/640,533 US64053306A US2008029720A1 US 20080029720 A1 US20080029720 A1 US 20080029720A1 US 64053306 A US64053306 A US 64053306A US 2008029720 A1 US2008029720 A1 US 2008029720A1
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- United States
- Prior art keywords
- phosphor
- optical component
- lighting arrangement
- group
- providing
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- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 2
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- GZCRRIHWUXGPOV-UHFFFAOYSA-N terbium atom Chemical compound [Tb] GZCRRIHWUXGPOV-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
- H10H20/8512—Wavelength conversion materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/0883—Arsenides; Nitrides; Phosphides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/7734—Aluminates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
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- C09K11/77342—Silicates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
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- C09K11/7741—Sulfates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
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- C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
- C09K11/7774—Aluminates
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V13/00—Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/00 - F21V11/00
- F21V13/12—Combinations of only three kinds of elements
- F21V13/14—Combinations of only three kinds of elements the elements being filters or photoluminescent elements, reflectors and refractors
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- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/10—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings
- F21V3/12—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings the coatings comprising photoluminescent substances
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/04—Refractors for light sources of lens shape
- F21V5/041—Ball lenses
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/10—Refractors for light sources comprising photoluminescent material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
- F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/30—Semiconductor lasers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/264—Up to 3 mils
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Definitions
- This invention relates to solid-state lighting applications which comprise light emitting diodes (LEDs) which include a light emitting phosphor, photoluminescent material, to generate light of a desired color, that is in a different part of the wavelength spectrum from the LEDs.
- LEDs light emitting diodes
- the invention concerns LED-based lighting arrangements which generate light in the visible part of the spectrum and in particular, although not exclusively white light.
- the invention provides an optical component for such a lighting arrangement and methods of fabricating a lighting arrangement and an optical component.
- the invention provides a phosphor material for coating an optical component or as a part of optical designs in lighting arrangements.
- light is defined as electromagnetic radiation in a wavelength range 300 nm (Ultraviolet) to 1000 nm (Infrared).
- the invention concerns lighting arrangements which emit light in the visible part of the spectrum that is 380 to 750 nm.
- White light emitting diodes are known in the art and are a relatively recent innovation. It was not until LEDs emitting in the blue/ultraviolet of the electromagnetic spectrum were developed that it became practical to develop white light sources based on LEDs.
- white light generating LEDs (“white LEDs”) include a phosphor, that is a photoluminescent material, which absorbs a portion of the radiation emitted by the LED and re-emits radiation of a different color (wavelength). For example the LED emits blue light in the visible part of the spectrum and the phosphor re-emits yellow light. Alternatively the phosphor can emit a combination of green and red light, green and yellow or yellow and red light.
- a known yellow phosphor is a YAG-based phosphor having a main emission wavelength peak that varies in wavelength range from 530 to 590 nm depending on the composition of the phosphors. Further examples of phosphors are described in our co-pending patent application U.S.
- the photoluminescent materials have a formula A 2 SiO 4 :Eu 2+ D where A is a divalent metal selected from the group consisting of Sr, Ca, Ba, Mg, Zn and Cd and D is a dopant selected from the group consisting of F, Cl, Br, I, P, S and N.
- A is a divalent metal selected from the group consisting of Sr, Ca, Ba, Mg, Zn and Cd
- D is a dopant selected from the group consisting of F, Cl, Br, I, P, S and N.
- Such phosphors emit light of intensities that are greater than either known YAG compounds or silicate-based phosphors.
- FIG. 1 a high brightness white LED 2 is shown.
- the LED 2 comprises an LED chip 4 which is mounted within a plastic or metal reflection cup 6 and the LED chip is then encapsulated within an encapsulating material, typically an epoxy resin 8 .
- the encapsulation material includes the phosphor material for providing color conversion.
- the inner surface of the cup 6 is silvered to reflect stray light towards a lens 10 which is mounted on the surface of the encapsulating epoxy resin 8 .
- the inventor has appreciated that such an arrangement has limitations and the present invention arose in an endeavor to mitigate, at least in part, these limitations.
- the high temperature at the output of the LED combined with its close proximity the phosphor material can give rise to a light characteristic which is temperature dependent and in some cases thermal degradation of the phosphor material can occur.
- the uniformity of color of light emitted by such LEDs can be difficult to maintain with the phosphor distributed within the epoxy resin since light passing through different path lengths will encounter and be absorbed by differing amounts of phosphor.
- the fabrication of such LEDs is time consuming due to the encapsulation and subsequent placement of the lens.
- a lighting arrangement comprising: a radiation source configured to emit radiation having a first wavelength range; a phosphor configured to absorb at least a portion of said first wavelength range radiation and emit radiation having a second wavelength range; and an optical component through which at least said first wavelength range radiation passes, characterized in that the phosphor is provided on a surface of the optical component.
- the phosphor is provided as a substantially uniform thickness layer on said surface of the optical component. Such an arrangement ensures a more uniform color of emitted light.
- the optical component can have a number of forms and typically comprises a lens for focusing the radiation to increase the intensity of the emitted light.
- the optical component can be for directing the radiation thus acting as a waveguide or as a window through which the radiation passes.
- the phosphor can be provided on inner or outer surfaces of the optical component and this will determine whether said second wavelength range radiation also passes through the optical component.
- the optical component has a substantially planar surface and the phosphor is provided on said substantially planar surface.
- An advantage of applying the phosphor to the planar surface is that it is easier to produce a uniform thickness layer.
- the optical component can have a convex or concave surface and the phosphor is provided on said convex or concave surfaces.
- the optical component has a substantially hemispherical surface and the phosphor is provided on said hemispherical surface.
- the optical component comprises a substantially hemispherical shell and the phosphor is provided on the inner hemispherical surface.
- the phosphor can be provided on at least a part of the outer hemispherical surface.
- the optical component comprises a substantially spherical shell and the phosphor is provided on at least a part of the inner or outer spherical surfaces.
- Such a form finds particular application as a light source for replacing incandescent light sources.
- the optical component comprises a hollow cylinder and the phosphor is provided on at least a part of the inner or outer surfaces.
- the optical component is made of a plastics material such as a polycarbonate and silicone or a glass such as a silica-based glass.
- the optical component comprises a material which is at least substantially transparent to said first wavelength range radiation and where the phosphor is provided on an inner surface of the component the material is further substantially transparent to the second wavelength range radiation.
- the phosphor comprises a powder which is incorporated within an epoxy resin, a silicone material or a polymer material to form a mixture and the phosphor mixture is then applied to the optical component to form a layer of phosphor on the optical component surface.
- the phosphor mixture advantageously further incorporates a light diffusing material such as titanium oxide, silica, alumina, etc. Such a light diffusing material has as low an absorption of light as possible.
- the phosphor advantageously comprises a phosphor which emits luminescent light when illuminated by radiation in wavelength range from 300 nm to 550 nm.
- a YAG-based phosphor which comprises a photoluminescent material having a formula (YA) 3 (AlB) 5 (OC) 12 :Ce 3+ where A is a trivalent metal selected from the group comprising Gd, Tb, La, Sm or divalent metal ions such as Sr, Ca, Ba, Mg, Zn and Cd, B comprising Si, B, P, and Ga and C is a dopant selected from the group comprising F, Cl, Br, I, P, S and N.
- the phosphor comprises a photoluminescent material having a formula A 2 SiO 4 :Eu 2+ D where A is a divalent metal selected from the group comprising Sr, Ca, Ba, Mg, Zn and Cd and D is a dopant selected from the group comprising F, Cl, Br, I, P, S and N.
- an orange-red silicate-based phosphor having a formula (SrM1) 3 Si(OD) 5 :Eu where M1 is selected from the group comprising Ba, Ca, Mg, Zn . . . and where D is selected from the group comprising F, Cl, S, and N.
- SrM1 is selected from the group comprising Ba, Ca, Mg, Zn . . .
- D is selected from the group comprising F, Cl, S, and N.
- Such a phosphor is advantageously used for emitting light in a wavelength range from green to yellow (580 to 630 nm).
- the phosphor comprises a red silicon nitride based phosphor having a formula (SrM1)Si 5 N 8 where M1 is selected from the group comprising Sr, Ca, Mg, and Zn.
- the phosphor comprises a red sulfate based phosphor having a formula of (SrM1)S where M1 is selected from the group comprising Ca, Ba, and Mg.
- the phosphor can comprise a green sulfate based phosphor having a formula of (SrM1)(GaM2) 2 S 4 :Eu where M1 is selected from the group comprising Ca, Ba, and Mg, and M2 is selected from the group comprising Al and In.
- the radiation source comprises a light emitting diode, advantageously a Gallium Nitride based LED.
- the radiation source is operable to emit radiation having a wavelength range of 300 to 500 nm.
- the phosphor composition is configured to emit radiation having a wavelength ranging from 450 to 700 nm.
- an optical component for a lighting arrangement of a type comprising a radiation source configured to emit radiation having a first wavelength range; a phosphor configured to absorb at least a portion of said first wavelength range radiation and emit radiation having a second wavelength range; and said optical component configured such that at least said first wavelength range radiation passes through the optical component, and characterized in that said phosphor is provided on a surface of said optical component.
- Such an optical component provides the advantages of reducing the manufacturing steps and hence cost and emits a more uniform color light. Moreover such an optical component can be used to provide direct color conversion in an LED arrangement.
- the phosphor is advantageously provided as a substantially uniform thickness layer on said surface of the optical component.
- the optical component preferably has a substantially planar surface and the phosphor is provided on said substantially planar surface.
- the optical component has a convex or concave surface and the phosphor is provided on said convex or concave surfaces by for example spraying or printing related coating methods.
- the optical component has a substantially hemispherical surface and the phosphor is provided on said hemispherical surface.
- the optical component can comprise a substantially hemispherical shell and the phosphor is provided on the inner hemispherical surface.
- Such an arrangement provides environmental protection of the phosphor.
- the phosphor is provided on the outer hemispherical surface.
- the optical component comprises a substantially spherical shell and the phosphor is provided on at least a part of the inner or outer spherical surfaces.
- the optical component comprises a hollow cylinder and the phosphor is provided on at least a part of the inner or outer surfaces.
- the phosphor comprises a powder which is incorporated within an epoxy resin, a silicone material or a polymer material to form a mixture and then the phosphor mixture is applied to the optical component to form a layer of phosphor on the optical component surface.
- the phosphor mixture advantageously further comprises a light diffusing material.
- the optical component is fabricated from a plastics material or a glass.
- the phosphor advantageously comprises a photoluminescent material having a formula A 2 SiO 4 :Eu 2+ D where A is a divalent metal selected from the group comprising Sr, Ca, Ba, Mg, Zn and Cd and D is a dopant selected from the group comprising F, Cl, Br, I, P, S and N.
- a method of fabricating a lighting arrangement comprising: providing a radiation source configured to emit radiation having a first wavelength range and an optical component through which said radiation passes; and providing on a surface of the optical component a phosphor configured to absorb at least a portion of said first wavelength range radiation and emit radiation having a second wavelength range.
- the method further comprises providing the phosphor as a substantially uniform thickness layer on said surface of the optical component.
- the optical component can have a substantially planar surface, convex or concave surfaces and the method comprises providing the phosphor on said substantially planar surface, convex or concave surfaces.
- the optical component has a substantially hemispherical surface and the method comprises providing the phosphor on said hemispherical surface.
- the optical component comprises a substantially hemispherical shell and the method comprises providing the phosphor on the inner or outer hemispherical surfaces.
- the optical component can comprise a substantially spherical shell and the method comprises providing the phosphor on at least a part of the inner or outer spherical surfaces.
- the optical component comprises a hollow cylinder and the method comprises providing the phosphor on at least a part of the inner or outer surfaces.
- the optical component is preferably fabricated from a plastics material or glass.
- an optical component for a lighting arrangement of a type comprising a radiation source configured to emit radiation having a first wavelength range; a phosphor configured to absorb at least a portion of said first wavelength range radiation and emit radiation having a second wavelength range; and said optical component being configured such that at least said first wavelength range radiation passes through the optical component the method comprising providing said phosphor on a surface of the optical component.
- the method advantageously comprises providing the phosphor as a substantially uniform thickness layer.
- the method preferably comprises providing the phosphor on said substantially planar surface.
- the method can comprise providing the phosphor on said convex or concave surfaces.
- the optical component has a substantially hemispherical surface and the method comprises providing the phosphor on said hemispherical surface.
- the method comprises providing the phosphor on the inner or outer hemispherical surfaces.
- the optical component comprises a substantially spherical shell the method comprises providing the phosphor on at least a part of the inner or outer spherical surfaces.
- the optical component can comprise a hollow cylinder and the method comprises providing the phosphor on at least a part of the inner or outer surfaces.
- the phosphor comprises a powder and the method comprises incorporating the phosphor within an epoxy resin or silicone material or polymer material to form a mixture and then applying the phosphor mixture to the optical component to form a layer of phosphor on the optical component surface.
- the mixture can be applied by painting the mixture onto the surface of the optical component, spraying or other known deposition techniques.
- the optical component is then advantageously spun or tape casting to distribute the mixture uniformly over the surface to thereby ensure a uniform thickness of phosphor forms.
- the method further comprises incorporating a light diffusing material, for example titanium oxide, silica, alumina in the phosphor mixture.
- a light diffusing material for example titanium oxide, silica, alumina
- the light diffusing material can be provided as a separate layer.
- the phosphor comprises a photoluminescent material having a formula A 2 SiO 4 :Eu 2+ D where A is a divalent metal selected from the group comprising Sr, Ca, Ba, Mg, Zn and Cd and D is a dopant selected from the group comprising F, Cl, Br, I, P, S and N.
- the method further comprises fabricating the optical component from a plastics material or glass.
- a plurality of optical components in the form of an array said array of optical components having a common planar surface, and said phosphor is deposited on the planar surface.
- the phosphor is provided as a substantially uniform thickness layer on said planar surface of the array of optical components.
- a phosphor material for coating an optical component of an LED comprising a phosphor powder incorporated within an epoxy resin, a silicone material or a polymer material.
- the phosphor material further incorporates a light diffusing material.
- an optical component for a lighting arrangement of a type comprising a radiation source configured to emit radiation having a first wavelength range; a phosphor configured to absorb at least a portion of said first wavelength range radiation and emit radiation having a second wavelength range; and said optical component being configured such that at least said first wavelength range radiation passes through the optical component, and characterized in that said phosphor is incorporated in said optical component.
- FIG. 1 is a schematic representation of a known white LED as already described
- FIGS. 2 to 7 are schematic representations of LED lighting arrangements in accordance with the invention.
- FIG. 8 is a schematic representation of a method of fabricating an optical component for an LED lighting arrangement in accordance with the invention.
- the LED lighting arrangement 20 is for generating light of a selected color for example white light.
- the lighting arrangement comprises a LED chip 22 , preferably a Gallium Nitride chip, which is operable to produce light, radiation, preferably of wavelength in a range 300 to 500 nm.
- the LED chip 22 is mounted inside a stainless steel enclosure or reflection cup 24 which has metallic silver deposited on its inner surface to reflect light towards the output of the lighting arrangement.
- a convex lens 26 is provided to focus light output from the arrangement.
- the lens 26 is substantially hemispherical in form.
- the lens 26 can be made of a plastics material such as polycarbonates or glass such as silica based glass or any material substantially transparent to the wavelengths of light generated by the LED chip 22 .
- the lens 26 has a planar, substantially flat, surface 28 onto which there is provided a layer of phosphor 30 before the lens is mounted to the enclosure 22 .
- the phosphor 30 preferably comprises a photoluminescent material having a formula A 2 SiO 4 :Eu 2+ D where A is a divalent metal selected from the group comprising Sr (Strontium), Ca (Calcium), Ba (Barium), Mg (Magnesium), Zn (Zinc) and Cd (Cadmium) and D is a dopant selected from the group comprising F (Fluorine), Cl (Chlorine), Br (Bromine), I (Iodine), P (Phosphorous), S (Sulfur) and N (Nitrogen) as disclosed in our co-pending patent application U.S.
- the phosphor which is in the form of a powder is mixed with an adhesive material such as epoxy or a silicone resin, or a transparent polymer material and the mixture is then applied to the surface of the lens to provide the phosphor layer 30 .
- the mixture can be applied by painting, dropping or spraying or other deposition techniques which will be readily apparent to those skilled in the art.
- the phosphor mixture preferably further includes a light diffusing material such as titanium oxide, silica or alumina to ensure a more uniform light output.
- the color of light emitted from the lighting arrangement can be controlled by appropriate selection of the phosphor composition as well as the thickness of the phosphor layer which will determine the proportion of output light originating from the phosphor.
- the phosphor layer is preferably of uniform thickness and has a typical thickness in a range 20 to 500 ⁇ m.
- An advantage of the lighting arrangement of the invention is that no phosphor need be incorporated within the encapsulation materials in the LED package. Moreover the color of the light output by the arrangement can be readily changed by providing a different lens having an appropriate phosphor layer. This enables large scale production of a common laser package. Moreover such a lens provides direct color conversion in an LED lighting arrangement.
- FIG. 3 there is shown an LED lighting arrangement in accordance with a further embodiment in which the phosphor 30 is provided as a layer on the outer convex surface 32 of the lens 26 .
- the lens 26 is dome shaped in form.
- FIG. 4 shows an LED lighting arrangement in accordance with a further embodiment in which the lens 26 comprises a substantially hemispherical shell and the phosphor 30 is provided on the inner surface 34 of the lens 26 .
- An advantage of providing the phosphor on the inner surface is that the lens 26 then provides environmental protection for the LED and phosphor.
- the phosphor can be applied as a layer of the outer surface of the lens 26 (not shown).
- FIG. 5 illustrates an LED arrangement in which the lens 26 , optical component, comprises a substantially spherical shell and the phosphor 30 is deposited as a layer on at least a part of the inner 36 or outer spherical 38 surfaces and the LED chip 22 is mounted within the spherical shell.
- the chip are oriented such that they each emit light in differing directions. Such a form is preferred as a light source for replacing existing incandescent light sources (light bulbs).
- the optical component 26 comprises a hollow cylindrical form and the phosphor is applied to the inner 40 or outer 42 curved surfaces.
- the laser chip preferably comprises a linear array of laser chips that are arranged along the axis of the cylinder.
- the lens 26 can comprise a solid cylinder (not shown).
- FIG. 7 shows an LED arrangement in which the optical component comprise a solid substantially spherical lens 26 and the phosphor is provided on at least a part of the spherical surface 44 .
- the phosphor is applied to only a portion of the surface, which surface is then mounted within the volume defined by the enclosure. By mounting the lens 26 in this way this provides environmental protection of the phosphor 30 .
- FIG. 8 there is shown a preferred method of fabricating lenses in accordance with the invention.
- An array of lenses 46 is provided in which the lenses have a common planar surface 48 onto which the phosphor 30 is provided.
- the lenses 36 are substantially hemispherical in form. After the phosphor has been deposited the lenses can be separated and mounted to the LED assemblies. Such a method is found to be particularly advantageous for mass production of the optical components.
- the present invention is not restricted to the specific embodiments described and that modifications can be made which are within the scope of the invention.
- the phosphor can be deposited onto other optical components such as for example a window through which light passes though is not necessarily focused or directed or a waveguide which guides, directs, light.
- the optical component can have many forms which will be readily apparent to those skilled in the art.
- the phosphor and LED chip can be selected depending on the intended application to provide light of a desired color. It is also envisaged to provide two or more phosphor materials to achieve the desired color, spectral content, of emitted light.
- the different phosphors can be provided by mixing the powdered material and incorporating them within a single layer or alternatively by providing multiple layers of different phosphors.
- Examples of preferred phosphors are:
- green sulfate based phosphors having a general formula (SrM1)(GaM2) 2 S 4 :Eu where M1 is selected from the group comprising Ca, Ba, and Mg, and where M2 is selected from the group comprising Al and In.
- the invention further provides a novel optical component and method of fabrication thereof.
- the phosphor within material comprising the optical component.
- the phosphor can be provided as a layer on the encapsulating material.
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Abstract
A lighting arrangement (20) comprises: a radiation source, LED chip, (22) configured to emit radiation having a first wavelength range; a phosphor, photoluminescent material, (30) configured to absorb at least a portion of said first wavelength range radiation and emit radiation having a second wavelength range; and an optical component, lens, (26) through which at least said first wavelength range radiation passes. The LED is characterized in that the phosphor is provided on a surface (28) of the optical component.
Description
- 1. Field of the Invention
- This invention relates to solid-state lighting applications which comprise light emitting diodes (LEDs) which include a light emitting phosphor, photoluminescent material, to generate light of a desired color, that is in a different part of the wavelength spectrum from the LEDs. In particular, although not exclusively, the invention concerns LED-based lighting arrangements which generate light in the visible part of the spectrum and in particular, although not exclusively white light. Moreover the invention provides an optical component for such a lighting arrangement and methods of fabricating a lighting arrangement and an optical component. Furthermore the invention provides a phosphor material for coating an optical component or as a part of optical designs in lighting arrangements.
- 2. State of the Art
- In the context of this patent application light is defined as electromagnetic radiation in a wavelength range 300 nm (Ultraviolet) to 1000 nm (Infrared). Primarily, although not exclusively the invention concerns lighting arrangements which emit light in the visible part of the spectrum that is 380 to 750 nm.
- White light emitting diodes (LEDs) are known in the art and are a relatively recent innovation. It was not until LEDs emitting in the blue/ultraviolet of the electromagnetic spectrum were developed that it became practical to develop white light sources based on LEDs. As is known white light generating LEDs (“white LEDs”) include a phosphor, that is a photoluminescent material, which absorbs a portion of the radiation emitted by the LED and re-emits radiation of a different color (wavelength). For example the LED emits blue light in the visible part of the spectrum and the phosphor re-emits yellow light. Alternatively the phosphor can emit a combination of green and red light, green and yellow or yellow and red light. The portion of the visible blue light emitted by the LED which is not absorbed by the phosphor mixes with the yellow light emitted to provide light which appears to the eye as being white. A known yellow phosphor is a YAG-based phosphor having a main emission wavelength peak that varies in wavelength range from 530 to 590 nm depending on the composition of the phosphors. Further examples of phosphors are described in our co-pending patent application U.S. 2006/0028122 in which the photoluminescent materials have a formula A2SiO4:Eu2+D where A is a divalent metal selected from the group consisting of Sr, Ca, Ba, Mg, Zn and Cd and D is a dopant selected from the group consisting of F, Cl, Br, I, P, S and N. Such phosphors emit light of intensities that are greater than either known YAG compounds or silicate-based phosphors.
- It is predicted that white LEDs could potentially replace incandescent light sources due to their long operating lifetimes, typically many 100,000 of hours, and their high efficiency. Already high brightness LEDs are used in vehicle brake lights and indicators as well as traffic lights and flash lights.
- To increase the intensity of light emitted from an LED it is known to include a lens made of a plastics material or glass to focus the light emission and to thereby increase intensity. Referring to
FIG. 1 a high brightnesswhite LED 2 is shown. TheLED 2 comprises anLED chip 4 which is mounted within a plastic ormetal reflection cup 6 and the LED chip is then encapsulated within an encapsulating material, typically anepoxy resin 8. The encapsulation material includes the phosphor material for providing color conversion. Typically the inner surface of thecup 6 is silvered to reflect stray light towards alens 10 which is mounted on the surface of the encapsulatingepoxy resin 8. - The inventor has appreciated that such an arrangement has limitations and the present invention arose in an endeavor to mitigate, at least in part, these limitations. For example for high intensity LEDs having a high intensity output larger than 1 W, the high temperature at the output of the LED combined with its close proximity the phosphor material can give rise to a light characteristic which is temperature dependent and in some cases thermal degradation of the phosphor material can occur. Moreover the uniformity of color of light emitted by such LEDs can be difficult to maintain with the phosphor distributed within the epoxy resin since light passing through different path lengths will encounter and be absorbed by differing amounts of phosphor. Furthermore the fabrication of such LEDs is time consuming due to the encapsulation and subsequent placement of the lens.
- According to a first aspect of the invention there is provided a lighting arrangement comprising: a radiation source configured to emit radiation having a first wavelength range; a phosphor configured to absorb at least a portion of said first wavelength range radiation and emit radiation having a second wavelength range; and an optical component through which at least said first wavelength range radiation passes, characterized in that the phosphor is provided on a surface of the optical component. The invention provides the advantage of reducing the manufacturing steps and hence cost and also provides a more uniform color of output light.
- Advantageously the phosphor is provided as a substantially uniform thickness layer on said surface of the optical component. Such an arrangement ensures a more uniform color of emitted light.
- The optical component can have a number of forms and typically comprises a lens for focusing the radiation to increase the intensity of the emitted light. Alternatively the optical component can be for directing the radiation thus acting as a waveguide or as a window through which the radiation passes. The phosphor can be provided on inner or outer surfaces of the optical component and this will determine whether said second wavelength range radiation also passes through the optical component. For example in one implementation the optical component has a substantially planar surface and the phosphor is provided on said substantially planar surface. An advantage of applying the phosphor to the planar surface is that it is easier to produce a uniform thickness layer. Alternatively the optical component can have a convex or concave surface and the phosphor is provided on said convex or concave surfaces.
- In one implementation the optical component has a substantially hemispherical surface and the phosphor is provided on said hemispherical surface. Preferably, the optical component comprises a substantially hemispherical shell and the phosphor is provided on the inner hemispherical surface. Alternatively the phosphor can be provided on at least a part of the outer hemispherical surface. In a further alternative embodiment the optical component comprises a substantially spherical shell and the phosphor is provided on at least a part of the inner or outer spherical surfaces. Such a form finds particular application as a light source for replacing incandescent light sources. In yet a further embodiment the optical component comprises a hollow cylinder and the phosphor is provided on at least a part of the inner or outer surfaces.
- Advantageously, the optical component is made of a plastics material such as a polycarbonate and silicone or a glass such as a silica-based glass. The optical component comprises a material which is at least substantially transparent to said first wavelength range radiation and where the phosphor is provided on an inner surface of the component the material is further substantially transparent to the second wavelength range radiation.
- In a preferred implementation the phosphor comprises a powder which is incorporated within an epoxy resin, a silicone material or a polymer material to form a mixture and the phosphor mixture is then applied to the optical component to form a layer of phosphor on the optical component surface. To improve the uniformity of light emitted from the lighting arrangement the phosphor mixture advantageously further incorporates a light diffusing material such as titanium oxide, silica, alumina, etc. Such a light diffusing material has as low an absorption of light as possible.
- The phosphor advantageously comprises a phosphor which emits luminescent light when illuminated by radiation in wavelength range from 300 nm to 550 nm. One example of the phosphor advantageously comprises a YAG-based phosphor which comprises a photoluminescent material having a formula (YA)3(AlB)5(OC)12:Ce3+ where A is a trivalent metal selected from the group comprising Gd, Tb, La, Sm or divalent metal ions such as Sr, Ca, Ba, Mg, Zn and Cd, B comprising Si, B, P, and Ga and C is a dopant selected from the group comprising F, Cl, Br, I, P, S and N. In another implementation the phosphor comprises a photoluminescent material having a formula A2SiO4:Eu2+D where A is a divalent metal selected from the group comprising Sr, Ca, Ba, Mg, Zn and Cd and D is a dopant selected from the group comprising F, Cl, Br, I, P, S and N.
- In yet a further embodiment an orange-red silicate-based phosphor having a formula (SrM1)3Si(OD)5:Eu where M1 is selected from the group comprising Ba, Ca, Mg, Zn . . . and where D is selected from the group comprising F, Cl, S, and N. Such a phosphor is advantageously used for emitting light in a wavelength range from green to yellow (580 to 630 nm).
- Alternatively the phosphor comprises a red silicon nitride based phosphor having a formula (SrM1)Si5N8 where M1 is selected from the group comprising Sr, Ca, Mg, and Zn.
- In another embodiment the phosphor comprises a red sulfate based phosphor having a formula of (SrM1)S where M1 is selected from the group comprising Ca, Ba, and Mg.
- In yet another embodiment the phosphor can comprise a green sulfate based phosphor having a formula of (SrM1)(GaM2)2S4:Eu where M1 is selected from the group comprising Ca, Ba, and Mg, and M2 is selected from the group comprising Al and In.
- Preferably, the radiation source comprises a light emitting diode, advantageously a Gallium Nitride based LED.
- The present invention finds particular application for white light sources and the radiation source is operable to emit radiation having a wavelength range of 300 to 500 nm. Preferably, the phosphor composition is configured to emit radiation having a wavelength ranging from 450 to 700 nm.
- According to a second aspect of the invention there is provided an optical component for a lighting arrangement of a type comprising a radiation source configured to emit radiation having a first wavelength range; a phosphor configured to absorb at least a portion of said first wavelength range radiation and emit radiation having a second wavelength range; and said optical component configured such that at least said first wavelength range radiation passes through the optical component, and characterized in that said phosphor is provided on a surface of said optical component.
- Such an optical component provides the advantages of reducing the manufacturing steps and hence cost and emits a more uniform color light. Moreover such an optical component can be used to provide direct color conversion in an LED arrangement.
- To ensure the uniformity of color of light generated by the optical component, the phosphor is advantageously provided as a substantially uniform thickness layer on said surface of the optical component.
- For ease of fabrication the optical component preferably has a substantially planar surface and the phosphor is provided on said substantially planar surface. Alternatively, the optical component has a convex or concave surface and the phosphor is provided on said convex or concave surfaces by for example spraying or printing related coating methods.
- In one implementation the optical component has a substantially hemispherical surface and the phosphor is provided on said hemispherical surface. The optical component can comprise a substantially hemispherical shell and the phosphor is provided on the inner hemispherical surface. Such an arrangement provides environmental protection of the phosphor. Alternatively, the phosphor is provided on the outer hemispherical surface. In a further embodiment the optical component comprises a substantially spherical shell and the phosphor is provided on at least a part of the inner or outer spherical surfaces. In yet a further implementation the optical component comprises a hollow cylinder and the phosphor is provided on at least a part of the inner or outer surfaces.
- Preferably, the phosphor comprises a powder which is incorporated within an epoxy resin, a silicone material or a polymer material to form a mixture and then the phosphor mixture is applied to the optical component to form a layer of phosphor on the optical component surface. To ensure a uniform light intensity output the phosphor mixture advantageously further comprises a light diffusing material.
- Preferably, the optical component is fabricated from a plastics material or a glass.
- The phosphor advantageously comprises a photoluminescent material having a formula A2SiO4:Eu2+D where A is a divalent metal selected from the group comprising Sr, Ca, Ba, Mg, Zn and Cd and D is a dopant selected from the group comprising F, Cl, Br, I, P, S and N.
- According to third aspect of the invention there is provided a method of fabricating a lighting arrangement comprising: providing a radiation source configured to emit radiation having a first wavelength range and an optical component through which said radiation passes; and providing on a surface of the optical component a phosphor configured to absorb at least a portion of said first wavelength range radiation and emit radiation having a second wavelength range.
- Advantageously the method further comprises providing the phosphor as a substantially uniform thickness layer on said surface of the optical component.
- The optical component can have a substantially planar surface, convex or concave surfaces and the method comprises providing the phosphor on said substantially planar surface, convex or concave surfaces.
- In one implementation the optical component has a substantially hemispherical surface and the method comprises providing the phosphor on said hemispherical surface. Preferably, the optical component comprises a substantially hemispherical shell and the method comprises providing the phosphor on the inner or outer hemispherical surfaces. Alternatively, the optical component can comprise a substantially spherical shell and the method comprises providing the phosphor on at least a part of the inner or outer spherical surfaces. In a further alternative arrangement the optical component comprises a hollow cylinder and the method comprises providing the phosphor on at least a part of the inner or outer surfaces.
- The optical component is preferably fabricated from a plastics material or glass.
- According to a further aspect of the invention there is provided a method of fabricating an optical component for a lighting arrangement of a type comprising a radiation source configured to emit radiation having a first wavelength range; a phosphor configured to absorb at least a portion of said first wavelength range radiation and emit radiation having a second wavelength range; and said optical component being configured such that at least said first wavelength range radiation passes through the optical component the method comprising providing said phosphor on a surface of the optical component.
- To ensure uniform color conversion the method advantageously comprises providing the phosphor as a substantially uniform thickness layer.
- When the optical component has a substantially planar surface the method preferably comprises providing the phosphor on said substantially planar surface.
- Alternatively where the optical component has a convex or concave surface the method can comprise providing the phosphor on said convex or concave surfaces.
- In yet a further alternative arrangement the optical component has a substantially hemispherical surface and the method comprises providing the phosphor on said hemispherical surface. Where the optical component comprises a substantially hemispherical shell the method comprises providing the phosphor on the inner or outer hemispherical surfaces. Moreover where the optical component comprises a substantially spherical shell the method comprises providing the phosphor on at least a part of the inner or outer spherical surfaces. Alternatively the optical component can comprise a hollow cylinder and the method comprises providing the phosphor on at least a part of the inner or outer surfaces.
- In a preferred method the phosphor comprises a powder and the method comprises incorporating the phosphor within an epoxy resin or silicone material or polymer material to form a mixture and then applying the phosphor mixture to the optical component to form a layer of phosphor on the optical component surface. The mixture can be applied by painting the mixture onto the surface of the optical component, spraying or other known deposition techniques. When the phosphor is to be applied to a planar surface the optical component is then advantageously spun or tape casting to distribute the mixture uniformly over the surface to thereby ensure a uniform thickness of phosphor forms.
- Advantageously the method further comprises incorporating a light diffusing material, for example titanium oxide, silica, alumina in the phosphor mixture. Alternatively the light diffusing material can be provided as a separate layer.
- Advantageously, the phosphor comprises a photoluminescent material having a formula A2SiO4:Eu2+D where A is a divalent metal selected from the group comprising Sr, Ca, Ba, Mg, Zn and Cd and D is a dopant selected from the group comprising F, Cl, Br, I, P, S and N.
- The method further comprises fabricating the optical component from a plastics material or glass.
- For ease of fabrication, and in accordance with a particularly preferred method of the invention a plurality of optical components in the form of an array, said array of optical components having a common planar surface, and said phosphor is deposited on the planar surface. Advantageously, the phosphor is provided as a substantially uniform thickness layer on said planar surface of the array of optical components.
- In accordance with a further aspect of the invention there is provided a phosphor material for coating an optical component of an LED comprising a phosphor powder incorporated within an epoxy resin, a silicone material or a polymer material. Advantageously the phosphor material further incorporates a light diffusing material.
- In accordance with yet a further aspect of the invention there is provided an optical component for a lighting arrangement of a type comprising a radiation source configured to emit radiation having a first wavelength range; a phosphor configured to absorb at least a portion of said first wavelength range radiation and emit radiation having a second wavelength range; and said optical component being configured such that at least said first wavelength range radiation passes through the optical component, and characterized in that said phosphor is incorporated in said optical component.
-
FIG. 1 is a schematic representation of a known white LED as already described; -
FIGS. 2 to 7 are schematic representations of LED lighting arrangements in accordance with the invention; and -
FIG. 8 is a schematic representation of a method of fabricating an optical component for an LED lighting arrangement in accordance with the invention. - In order that the present invention is better understood, embodiments of the invention will now be described by way of example only with reference to the accompanying drawings.
- Referring to
FIG. 2 there is shown a LED lighting arrangement 20 in accordance with the invention. The LED lighting arrangement 20 is for generating light of a selected color for example white light. The lighting arrangement comprises aLED chip 22, preferably a Gallium Nitride chip, which is operable to produce light, radiation, preferably of wavelength in a range 300 to 500 nm. TheLED chip 22 is mounted inside a stainless steel enclosure orreflection cup 24 which has metallic silver deposited on its inner surface to reflect light towards the output of the lighting arrangement. Aconvex lens 26 is provided to focus light output from the arrangement. In the example illustrated thelens 26 is substantially hemispherical in form. Thelens 26 can be made of a plastics material such as polycarbonates or glass such as silica based glass or any material substantially transparent to the wavelengths of light generated by theLED chip 22. - In the embodiment in
FIG. 2 thelens 26 has a planar, substantially flat,surface 28 onto which there is provided a layer ofphosphor 30 before the lens is mounted to theenclosure 22. Thephosphor 30 preferably comprises a photoluminescent material having a formula A2SiO4:Eu2+D where A is a divalent metal selected from the group comprising Sr (Strontium), Ca (Calcium), Ba (Barium), Mg (Magnesium), Zn (Zinc) and Cd (Cadmium) and D is a dopant selected from the group comprising F (Fluorine), Cl (Chlorine), Br (Bromine), I (Iodine), P (Phosphorous), S (Sulfur) and N (Nitrogen) as disclosed in our co-pending patent application U.S. 2006/0028122 the content of which is hereby incorporated by way of reference thereto. The phosphor which is in the form of a powder is mixed with an adhesive material such as epoxy or a silicone resin, or a transparent polymer material and the mixture is then applied to the surface of the lens to provide thephosphor layer 30. The mixture can be applied by painting, dropping or spraying or other deposition techniques which will be readily apparent to those skilled in the art. Moreover the phosphor mixture preferably further includes a light diffusing material such as titanium oxide, silica or alumina to ensure a more uniform light output. - The color of light emitted from the lighting arrangement can be controlled by appropriate selection of the phosphor composition as well as the thickness of the phosphor layer which will determine the proportion of output light originating from the phosphor. To ensure a uniform output color the phosphor layer is preferably of uniform thickness and has a typical thickness in a range 20 to 500 μm.
- An advantage of the lighting arrangement of the invention is that no phosphor need be incorporated within the encapsulation materials in the LED package. Moreover the color of the light output by the arrangement can be readily changed by providing a different lens having an appropriate phosphor layer. This enables large scale production of a common laser package. Moreover such a lens provides direct color conversion in an LED lighting arrangement.
- Referring to
FIG. 3 there is shown an LED lighting arrangement in accordance with a further embodiment in which thephosphor 30 is provided as a layer on the outerconvex surface 32 of thelens 26. In this embodiment thelens 26 is dome shaped in form. -
FIG. 4 shows an LED lighting arrangement in accordance with a further embodiment in which thelens 26 comprises a substantially hemispherical shell and thephosphor 30 is provided on theinner surface 34 of thelens 26. An advantage of providing the phosphor on the inner surface is that thelens 26 then provides environmental protection for the LED and phosphor. Alternatively the phosphor can be applied as a layer of the outer surface of the lens 26 (not shown). -
FIG. 5 illustrates an LED arrangement in which thelens 26, optical component, comprises a substantially spherical shell and thephosphor 30 is deposited as a layer on at least a part of the inner 36 or outer spherical 38 surfaces and theLED chip 22 is mounted within the spherical shell. To ensure uniform emission of radiation a plurality of LED chips are advantageously incorporated in which the chip are oriented such that they each emit light in differing directions. Such a form is preferred as a light source for replacing existing incandescent light sources (light bulbs). - Referring to
FIG. 6 there is shown a further arrangement in which theoptical component 26 comprises a hollow cylindrical form and the phosphor is applied to the inner 40 or outer 42 curved surfaces. In such an arrangement the laser chip preferably comprises a linear array of laser chips that are arranged along the axis of the cylinder. Alternatively thelens 26 can comprise a solid cylinder (not shown). -
FIG. 7 shows an LED arrangement in which the optical component comprise a solid substantiallyspherical lens 26 and the phosphor is provided on at least a part of the spherical surface 44. In a preferred arrangement, as illustrated, the phosphor is applied to only a portion of the surface, which surface is then mounted within the volume defined by the enclosure. By mounting thelens 26 in this way this provides environmental protection of thephosphor 30. - Referring to
FIG. 8 there is shown a preferred method of fabricating lenses in accordance with the invention. An array oflenses 46 is provided in which the lenses have a commonplanar surface 48 onto which thephosphor 30 is provided. In the example illustrated thelenses 36 are substantially hemispherical in form. After the phosphor has been deposited the lenses can be separated and mounted to the LED assemblies. Such a method is found to be particularly advantageous for mass production of the optical components. - It will be appreciated that the present invention is not restricted to the specific embodiments described and that modifications can be made which are within the scope of the invention. For example although in the foregoing description reference is made to a lens the phosphor can be deposited onto other optical components such as for example a window through which light passes though is not necessarily focused or directed or a waveguide which guides, directs, light. Moreover the optical component can have many forms which will be readily apparent to those skilled in the art.
- It will be appreciated that the phosphor and LED chip can be selected depending on the intended application to provide light of a desired color. It is also envisaged to provide two or more phosphor materials to achieve the desired color, spectral content, of emitted light. The different phosphors can be provided by mixing the powdered material and incorporating them within a single layer or alternatively by providing multiple layers of different phosphors.
- Examples of preferred phosphors are:
-
- YAG-based phosphors which comprising a photoluminescent material having a formula (YA)3(AlB)5(OC)12:Ce3+ where A is a trivalent metal selected from the group comprising Gd (Gadolinium), Tb (Terbium), La (Lanthanum), Sm (Samarium) or divalent metal ions such as Sr (Strontium), Ca (Calcium), Ba (Barium), Mg (Magnesium), Zn (Zinc) and Cd (Cadmium), B comprising Si (Silicon), B (Boron), P (phosphorous), and Ga (Gadolinium) and C is a dopant selected from the group comprising F (Fluorine), Cl (Chlorine), Br (Bromine), I (Iodine), P (phosphorous), S (Sulfur) and N (Nitrogen);
- orange-red silicate-based phosphors of general formula (SrM1)3Si(OD)5:Eu where M1 is selected from the group comprising Ba, Ca, Mg, Zn . . . and D is selected from the group comprising F, Cl, S, and N (such a phosphor can be used for emitting light in a wavelength range from green to yellow (580 to 630 nm));
- red silicon nitride based phosphors of general formula of (SrM1)Si5N8 where M1 is selected from the group comprising Sr, Ca, Mg, and Zn;
-
- red sulfate based phosphors having a general formula (SrM1)S where M1 is selected from the group comprising Ca, Ba, and Mg; and
- green sulfate based phosphors having a general formula (SrM1)(GaM2)2S4:Eu where M1 is selected from the group comprising Ca, Ba, and Mg, and where M2 is selected from the group comprising Al and In.
- In addition to providing an LED lighting arrangement the invention further provides a novel optical component and method of fabrication thereof.
- In a further embodiment it is also envisaged to incorporate the phosphor within material comprising the optical component. Moreover the phosphor can be provided as a layer on the encapsulating material.
Claims (85)
1. A lighting arrangement comprising: a radiation source configured to emit radiation having a first wavelength range; a phosphor configured to absorb at least a portion of said first wavelength range radiation and emit radiation having a second wavelength range; and an optical component through which at least said first wavelength range radiation passes, characterized in that the phosphor is provided on a surface of the optical component.
2. The lighting arrangement according to claim 1 , in which the phosphor is provided as a substantially uniform thickness layer on said surface of the optical component.
3. The lighting arrangement according to claim 1 or claim 2 , in which the optical component has a substantially planar surface and the phosphor is provided on said substantially planar surface.
4. The lighting arrangement according to claim 1 or claim 2 , in which the optical component has a convex surface and the phosphor is provided on said convex surface.
5. The lighting arrangement according to claim 1 or claim 2 , in which the optical component has a concave surface and the phosphor is provided on said concave surface.
6. The lighting arrangement according to claim 1 or claim 2 , in which the optical component has a substantially hemispherical surface and the phosphor is provided on said hemispherical surface.
7. The lighting arrangement according to claim 6 , in which the optical component comprises a substantially hemispherical shell and the phosphor is provided on the inner hemispherical surface.
8. The lighting arrangement according to claim 6 , in which the optical component comprises a substantially hemispherical shell and the phosphor is provided on at least a part of the outer hemispherical surface.
9. The lighting arrangement according to claim 1 or claim 2 , in which the optical component comprises a substantially spherical shell and the phosphor is provided on at least a part of the inner spherical surface.
10. The lighting arrangement according to claim 1 or claim 2 , in which the optical component comprises a substantially spherical shell and the phosphor is provided on at least a part of the outer spherical surface.
11. The lighting arrangement according to claim 1 or claim 2 , in which the optical component comprises a hollow cylinder and the phosphor is provided on at least a part of the inner surface.
12. The lighting arrangement according to claim 1 or claim 2 , in which the optical component comprises a hollow cylinder and the phosphor is provided on at least a part of the outer surface.
13. The lighting arrangement according to claim 1 to 2, in which the optical component is made from one of a plastics material, glass.
14. The lighting arrangement according to claim 1 , in which the phosphor comprises a powder which is incorporated within one of an epoxy resin, a silicone material and a polymer material to form a mixture and in which the phosphor mixture is applied to the optical component to form a layer of phosphor on the optical component surface.
15. The lighting arrangement according to claim 14 , and further comprising incorporating a light diffusing material with the phosphor powder.
16. The lighting arrangement according to any of claims 1 , 2 , 14 or 15 , in which the phosphor comprises a photoluminescent material having a formula A2SiO4:Eu2+D where A is a divalent metal selected from the group consisting of Sr, Ca, Ba, Mg, Zn and Cd and D is a dopant selected from the group consisting of F, Cl, Br, I, P, S and N.
17. The lighting arrangement according to any one of claims 1 , 2 , 14 or 15 , in which the phosphor comprises a photoluminescent material having a formula (YA)3(AlB)5(OC)12:Ce3+ where A is a trivalent metal selected from the group consisting of Gd, Tb, La, Sm or divalent metal ions such as Sr, Ca, Ba, Mg, Zn and Cd; B is selected from the group consisting of Si, B, P, and Ga; and C is a dopant selected from the group consisting of F, Cl, Br, I, P, S and N.
18. The lighting arrangement according to any one of claims 1 , 2 , 14 or 15 , in which the phosphor comprises an orange-red silicate-based phosphor having a formula (SrM1)3Si(OD)5:Eu where M1 is selected from the group consisting of Ba, Ca, Mg, Zn . . . ; and D is selected from the group consisting of F, Cl, S, and N.
19. The lighting arrangement according to any one of claims 1 , 2 14 or 15, in which the phosphor comprises a red silicon nitride based phosphor having a formula (SrM1)Si5N8 where M1 is selected from the group consisting Sr, Ca, Mg, and Zn.
20. The lighting arrangement according to any one of claims 1 , 2 , 14 or 15 , in which the phosphor comprises a red sulfate based phosphor having a formula (SrM1)S where M1 is selected from the group consisting of Ca, Ba, and Mg.
21. The lighting arrangement according to any one of claims 1 , 2 14 or 15, in which the phosphor comprises a green sulfate based phosphor having a formula (SrM1)(GaM2)2S4:Eu where M1 is selected from the group consisting of Ca, Ba, and Mg, and M2 is selected from the group consisting of Al and In.
22. The lighting arrangement according to claim 1 , in which the radiation source comprises a light emitting diode.
23. The lighting arrangement according to claim 1 , in which said LED chip comprises a Gallium Nitride LED.
24. The lighting arrangement according to claim 1 , in which said radiation source is operable to emit radiation having a wavelength range of 300 to 500 nm.
25. The lighting arrangement according to claim 1 , in which the phosphor is configured to emit radiation having a wavelength ranging from 450 to 700 nm.
26. An optical component for a lighting arrangement of a type comprising a radiation source configured to emit radiation having a first wavelength range; a phosphor configured to absorb at least a portion of said first wavelength range radiation and emit radiation having a second wavelength range; and said optical component being configured such that at least said first wavelength range radiation passes though the optical component, and characterized in that said phosphor is provided on a surface of said optical component.
27. The optical component according to claim 26 , in which the phosphor is provided as a substantially uniform thickness layer on said surface of the optical component.
28. The optical component according to claim 26 or claim 27 , in which the optical component has a substantially planar surface and the phosphor is provided on said substantially planar surface.
29. The optical component according to claim 26 or claim 27 , in which the optical component has a convex surface and the phosphor is provided on said convex surface.
30. The optical component according to claim 26 or claim 27 , in which the optical component has a concave surface and the phosphor is provided on said concave surface.
31. The optical component according to claim 26 or claim 27 , in which the optical component has a substantially hemispherical surface and the phosphor is provided on said hemispherical surface.
32. The optical component according to claim 31 , in which the optical component comprises a substantially hemispherical shell and the phosphor is provided on the inner hemispherical surface.
33. The optical component according to claim 31 , in which the optical component comprises a substantially hemispherical shell and the phosphor is provided on at least a part of the outer hemispherical surface.
34. The optical component according to claim 26 or claim 27 , in which the optical component comprises a substantially spherical shell and the phosphor is provided on at least a part of the inner spherical surface.
35. The optical component according to claim 26 or claim 27 , in which the optical component comprises a substantially spherical shell and the phosphor is provided on at least a part of the outer spherical surface.
36. The optical component according to claim 26 or claim 27 , in which the optical component comprises a hollow cylinder and the phosphor is provided on at least a part of the inner surface.
37. The optical component according to claim 26 or claim 27 in which the optical component comprises a hollow cylinder and the phosphor is provided on at least a part of the outer surface.
38. The optical component according to claim 26 or 27 , in which the phosphor comprises a powder which is incorporated within one of an epoxy resin, a silicone material and a polymer material to form a mixture and in which the phosphor mixture is applied to the optical component to form a layer of phosphor on the optical component surface.
39. The optical component according to claim 38 , and further comprising a light diffusing material with the phosphor powder.
40. The optical component according to claim 26 or 27 , in which the optical component is fabricated from one of a plastics material, a glass.
41. The optical component according to claim 26 or 27 in which the phosphor comprises a photoluminescent material having a formula A2SiO4:Eu2+D where A is a divalent metal selected from the group consisting of Sr, Ca, Ba, Mg, Zn and Cd and D is a dopant selected from the group consisting of F, Cl, Br, I, P, S and N.
42. The optical component according to claim 26 or 27 , in which the phosphor comprises a photoluminescent material having a formula (YA)3(AlB)5(OC)12:Ce3+ where A is a trivalent metal selected from the group consisting of Gd, Tb, La, Sm or divalent metal ions such as Sr, Ca, Ba, Mg, Zn and Cd; B is selected from the group Si, B, P, and Ga; and C is a dopant selected from the group consisting of F, Cl, Br, I, P, S and N.
43. The optical component according to claim 26 or 27 , in which the phosphor comprises an orange-red silicate-based phosphor having a formula (SrM1)3Si(OD)5:Eu where M1 is selected from the group consisting of Ba, Ca, Mg, and Zn, and D is selected from the group consisting of F, Cl, S, and N.
44. The lighting arrangement according to claim 26 or 27 , in which the phosphor comprises a red silicon nitride based phosphor having a formula (SrM1)Si5N8 where M1 is selected from the group consisting of Sr, Ca, Mg, and Zn.
45. The lighting arrangement according to claim 26 or 27 , in which the phosphor comprises a red sulfate based phosphor having a formula (SrM1)S where M1 is selected from the group consisting of Ca, Ba, and Mg.
46. The lighting arrangement according to claim 26 or 27 , in which the phosphor comprises a green sulfate based phosphor having a formula (SrM1)(GaM2)2S4:Eu where M1 is selected from the group consisting of Ca, Ba, and Mg, and M2 is selected from the group consisting of Al and In.
47. A method of fabricating a lighting arrangement comprising: providing a radiation source configured to emit radiation having a first wavelength range and an optical component through which said radiation passes; and providing on a surface of the optical component a phosphor configured to absorb at least a portion of said first wavelength range radiation and emit radiation having a second wavelength range.
48. The method according to claim 47 , and comprising providing the phosphor as a substantially uniform thickness layer on said surface of the optical component.
49. The method according to claim 47 or claim 48 , in which the optical component has a substantially planar surface and comprising providing the phosphor on said substantially planar surface.
50. The method according to claim 47 or claim 48 , in which the optical component has a convex surface and comprising providing the phosphor on said convex surface.
51. The method according to claim 47 or claim 48 , in which the optical component has a concave surface and comprising providing the phosphor on said concave surface.
52. The method according to claim 47 or claim 48 , in which the optical component has a substantially hemispherical surface and comprising providing the phosphor on said hemispherical surface.
53. The method according to claim 52 , in which the optical component comprises a substantially hemispherical shell and comprising providing the phosphor on the inner hemispherical surface.
54. The method according to claim 52 , in which the optical component comprises a substantially hemispherical shell and comprising providing the phosphor on at least a part of the outer hemispherical surface.
55. The method according to claim 47 or claim 48 , in which the optical component comprises a substantially spherical shell and comprising providing the phosphor on at least a part of the inner spherical surface.
56. The method according to claim 47 or claim 48 , in which the optical component comprises a substantially spherical shell and comprising providing the phosphor on at least a part of the outer spherical surface.
57. The method according to claim 47 or claim 48 , in which the optical component comprises a hollow cylinder and comprising providing the phosphor on at least a part of the inner surface.
58. The method according to claim 47 or claim 48 , in which the optical component comprises a hollow cylinder and comprising providing the phosphor on at least a part of the outer surface.
59. The method according to claim 47 or 48 in which the optical component is fabricated from one of a plastics material, a glass.
60. A method of fabricating an optical component for a lighting arrangement of a type comprising a radiation source configured to emit radiation having a first wavelength range; a phosphor configured to absorb at least a portion of said first wavelength range radiation and emit radiation having a second wavelength range; and said optical component being configured such that at least said first wavelength range radiation passes through said optical component, the method comprising providing said phosphor on a surface of the optical component.
61. The method according to claim 60 , and comprising providing the phosphor as a substantially uniform thickness layer.
62. The method according to claim 60 or claim 61 , in which the optical component has a substantially planar surface and comprising providing the phosphor on said substantially planar surface.
63. The method according to claim 60 or claim 61 , in which the optical component has a convex surface and comprising providing the phosphor on said convex surface.
64. The method according to claim 60 or claim 61 , in which the optical component has a concave surface and comprising providing the phosphor on said concave surface.
65. The method according to claim 60 or claim 61 , in which the optical component has a substantially hemispherical surface and comprising providing the phosphor on said hemispherical surface.
66. The method according to claim 65 , in which the optical component comprises a substantially hemispherical shell and comprising providing the phosphor on the inner hemispherical surface.
67. The method according to claim 65 , in which the optical component comprises a substantially hemispherical shell and comprising providing the phosphor on at least a part of the outer hemispherical surface.
68. The method according to claim 60 or 61 , in which the optical component comprises a substantially spherical shell and comprising providing the phosphor on at least a part of the inner spherical surface.
69. The method according to claim 60 or 61 , in which the optical component comprises a substantially spherical shell and comprising providing the phosphor on at least a part of the outer spherical surface.
70. The method according to claim 60 or 61 , in which the optical component comprises a hollow cylinder and comprising providing the phosphor on at least a part of the inner surface.
71. The method according to claim 60 or 61 , in which the optical component comprises a hollow cylinder and comprising providing the phosphor on at least a part of the outer surface.
72. The method according to claim 60 or 61 , in which the phosphor comprises a powder and comprising incorporating the phosphor within one of a epoxy resin, silicone material, polymer material to form a mixture and applying the phosphor mixture to the optical component to form a layer of phosphor on the optical component surface.
73. The method according to claim 60 , and further comprising incorporating a light diffusing material with the phosphor powder.
74. The method according to any one of claims 60 , 61 or 73 , in which the phosphor comprises a photoluminescent materials have a formula A2SiO4:Eu2+D where A is a divalent metal selected from the group consisting of Sr, Ca, Ba, Mg, Zn and Cd and D is a dopant selected from the group consisting of F, Cl, Br, I, P, S and N.
75. The lighting arrangement according to any one of claims 60 , 61 or 73 , in which the phosphor comprises a photoluminescent material having a formula (YA)3(AlB)5(OC)12:Ce3+ where A is a trivalent metal selected from the group consisting of Gd, Tb, La, Sm or divalent metal ions such as Sr, Ca, Ba, Mg, Zn and Cd; B is selected from the group consisting of Si, B, P, and Ga; and C is a dopant selected from the group consisting of F, Cl, Br, I, P, S and N.
76. The lighting arrangement according to any one of claims 60 , 61 or 73 , in which the phosphor comprises an orange-red silicate-based phosphor having a formula (SrM1)3Si(OD)5:Eu where M1 is selected from the group consisting of Ba, Ca, Mg, and Zn, and D is selected from the group consisting of F, Cl, S, and N.
77. The lighting arrangement according to any one of claims 60 , 61 or 73 , in which the phosphor comprises a red silicon nitride based phosphor having a formula (SrM1)Si5N8 where M1 is selected from the group consisting of Sr, Ca, Mg, and Zn.
78. The lighting arrangement according to any one of claims 60 , 61 or 73 , in which the phosphor comprises a red sulfate based phosphor having a formula (SrM1)S where M1 is selected from the group consisting of Ca, Ba, and Mg.
79. The lighting arrangement according to any one of claim 60 , 61 or 73 , in which the phosphor comprises a green sulfate based phosphor having a formula (SrM1)(GaM2)2S4:Eu where M1 is selected from the group consisting of Ca, Ba, and Mg, and M2 is selected from the group consisting of Al, and In.
80. The method according to any one of claims 60 , 61 or 73 , and comprising fabricating the optical component from one of a plastics material, glass.
81. The method according to claim 60 and further comprising providing a plurality of optical components in the form of an array said array of optical components having a common planar surface and depositing said phosphor on the planar surface.
82. The method according to claim 81 , and comprising providing the phosphor as a substantially uniform thickness layer on said planar surface of the array of optical components.
83. A phosphor material for coating an optical component of an LED lighting arrangement comprising a phosphor powder incorporated within one of an epoxy resin, a silicone material and a polymer material.
84. The phosphor material according to claim 83 and further comprising a light diffusing material.
85. An optical component for a lighting arrangement of a type comprising a radiation source configured to emit radiation having a first wavelength range; a phosphor configured to absorb at least a portion of said first wavelength range radiation and emit radiation having a second wavelength range; and said optical component being configured such that at least said first wavelength range radiation passes through said optical component, and characterized in that said phosphor is incorporated in said optical component.
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US11/640,533 US20080029720A1 (en) | 2006-08-03 | 2006-12-15 | LED lighting arrangement including light emitting phosphor |
KR1020097004371A KR20090040360A (en) | 2006-08-03 | 2007-08-02 | Led lighting arrangement including light emitting phosphor |
PCT/US2007/017299 WO2008019041A2 (en) | 2006-08-03 | 2007-08-02 | Led lighting arrangement including light emitting phosphor |
JP2009522877A JP2009545888A (en) | 2006-08-03 | 2007-08-02 | LED lighting arrangement including light emitting phosphor |
EP07811039A EP2055147A4 (en) | 2006-08-03 | 2007-08-02 | LED LIGHTING DEVICE COMPRISING A LUMINESCENT PHOSPHOR |
CN2010105254928A CN102062359A (en) | 2006-08-03 | 2007-08-02 | Led lighting arrangement including light emitting phosphor |
TW102100038A TW201316543A (en) | 2006-08-03 | 2007-08-03 | LED lighting arrangement including light emitting phosphor |
TW096128666A TWI392112B (en) | 2006-08-03 | 2007-08-03 | Light-emitting diode (LED) illumination configuration with luminescent phosphor |
US12/624,900 US20100067217A1 (en) | 2006-08-03 | 2009-11-24 | Led lighting arrangement including light emitting phosphor |
US12/624,839 US8067884B2 (en) | 2006-08-03 | 2009-11-24 | LED lighting arrangement including a substantially spherical optical component having a surface partially coated with a light emitting phosphor |
US13/087,615 US20110187262A1 (en) | 2006-08-03 | 2011-04-15 | Led lighting arrangement including light emitting phosphor |
US13/436,507 US20120182715A1 (en) | 2006-08-03 | 2012-03-30 | Led lighting arrangement including light emitting phosphor and method of manufacture |
US13/436,329 US20120187823A1 (en) | 2006-08-03 | 2012-03-30 | Led lighting arrangement including light emitting phosphor |
US13/436,471 US20120187822A1 (en) | 2006-08-03 | 2012-03-30 | Led lighting arrangement including light emitting phosphor |
US13/441,714 US9045688B2 (en) | 2006-08-03 | 2012-04-06 | LED lighting arrangement including light emitting phosphor |
US13/931,669 US20130293098A1 (en) | 2006-08-03 | 2013-06-28 | Solid-state linear lighting arrangements including light emitting phosphor |
JP2013154964A JP2013254972A (en) | 2006-08-03 | 2013-07-25 | LED lighting device including light emitting phosphor |
US14/157,501 US20140306599A1 (en) | 2006-08-03 | 2014-01-16 | Solid-state linear lighting arrangements including light emitting phosphor |
US14/727,814 US9595644B2 (en) | 2006-08-03 | 2015-06-01 | LED lighting arrangement including light emitting phosphor |
US15/653,071 US10274166B2 (en) | 2006-08-03 | 2017-07-18 | Solid-state linear lighting arrangements including light emitting phosphor |
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US13/087,615 Division US20110187262A1 (en) | 2006-08-03 | 2011-04-15 | Led lighting arrangement including light emitting phosphor |
US13/436,329 Continuation US20120187823A1 (en) | 2006-08-03 | 2012-03-30 | Led lighting arrangement including light emitting phosphor |
US13/436,507 Continuation US20120182715A1 (en) | 2006-08-03 | 2012-03-30 | Led lighting arrangement including light emitting phosphor and method of manufacture |
US13/436,471 Continuation US20120187822A1 (en) | 2006-08-03 | 2012-03-30 | Led lighting arrangement including light emitting phosphor |
US13/441,714 Continuation US9045688B2 (en) | 2006-08-03 | 2012-04-06 | LED lighting arrangement including light emitting phosphor |
US13/931,669 Continuation-In-Part US20130293098A1 (en) | 2006-08-03 | 2013-06-28 | Solid-state linear lighting arrangements including light emitting phosphor |
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US13/087,615 Abandoned US20110187262A1 (en) | 2006-08-03 | 2011-04-15 | Led lighting arrangement including light emitting phosphor |
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US14/727,814 Active 2027-03-11 US9595644B2 (en) | 2006-08-03 | 2015-06-01 | LED lighting arrangement including light emitting phosphor |
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US13/087,615 Abandoned US20110187262A1 (en) | 2006-08-03 | 2011-04-15 | Led lighting arrangement including light emitting phosphor |
US13/436,507 Abandoned US20120182715A1 (en) | 2006-08-03 | 2012-03-30 | Led lighting arrangement including light emitting phosphor and method of manufacture |
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US (9) | US20080029720A1 (en) |
EP (1) | EP2055147A4 (en) |
JP (2) | JP2009545888A (en) |
KR (1) | KR20090040360A (en) |
CN (1) | CN102062359A (en) |
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WO (1) | WO2008019041A2 (en) |
Cited By (81)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080027200A1 (en) * | 2006-07-26 | 2008-01-31 | Shin -Etsu Chemical Co., Ltd. | Phosphor-containing curable silicone composition for led and led light-emitting device using the composition |
US20080214896A1 (en) * | 2007-01-10 | 2008-09-04 | Krupa Robert J | Endoscope with detachable elongation portion |
US20090066218A1 (en) * | 2007-09-06 | 2009-03-12 | Ben Fan | Method for generating low color temperature light and light emitting device adopting the same |
US20090141476A1 (en) * | 2005-06-07 | 2009-06-04 | Noam Meir | Illumination Apparatus and Methods of Forming the Same |
US20090161341A1 (en) * | 2007-12-19 | 2009-06-25 | Noam Meir | Planar White Illumination Apparatus |
US20090161361A1 (en) * | 2007-12-19 | 2009-06-25 | Noam Meir | Discrete lighting elements and planar assembly thereof |
US20090185392A1 (en) * | 2003-03-26 | 2009-07-23 | Optim, Inc. | Detachable illumination system |
US20090190371A1 (en) * | 2008-01-24 | 2009-07-30 | Optim, Inc. | Monolithic illumination device |
US20090225565A1 (en) * | 2008-03-05 | 2009-09-10 | Micha Zimmermann | Sub-assembly and methods for forming the same |
US20100002414A1 (en) * | 2005-06-07 | 2010-01-07 | Noam Meir | Illumination Apparatus and Methods of Forming the Same |
US20100008628A1 (en) * | 2008-07-10 | 2010-01-14 | Yosi Shani | Slim waveguide coupling apparatus and method |
US20100033964A1 (en) * | 2008-08-08 | 2010-02-11 | Photonics & Co., Limited | Light emitting diode (led) lighting device |
US20100098377A1 (en) * | 2008-10-16 | 2010-04-22 | Noam Meir | Light confinement using diffusers |
US20100208469A1 (en) * | 2009-02-10 | 2010-08-19 | Yosi Shani | Illumination surfaces with reduced linear artifacts |
US20100220484A1 (en) * | 2008-07-10 | 2010-09-02 | Oree Inc. | Slim waveguide coupling apparatus and method |
US20100296309A1 (en) * | 2009-05-20 | 2010-11-25 | Foxsemicon Integrated Technology, Inc. | Illumination device |
US20100315817A1 (en) * | 2009-05-13 | 2010-12-16 | Oree Inc. | Low-profile illumination device |
US20100314996A1 (en) * | 2009-06-11 | 2010-12-16 | Van De Ven Antony P | Hot light emitting diode (led) lighting systems and methods |
US20110084297A1 (en) * | 2008-03-28 | 2011-04-14 | Toshifumi Ogata | Molded resin product, semiconductor light-emitting source, lighting device, and method for manufacturing molded resin product |
US20110182055A1 (en) * | 2008-03-19 | 2011-07-28 | I2Ic Corporation | Photoluminescent Light Source |
US20110187262A1 (en) * | 2006-08-03 | 2011-08-04 | Intematix Corporation | Led lighting arrangement including light emitting phosphor |
CN102185082A (en) * | 2011-04-08 | 2011-09-14 | 深圳市华星光电技术有限公司 | Light-emitting diode structure and light-emitting diode structure manufacturing method |
WO2012015726A1 (en) * | 2010-07-28 | 2012-02-02 | GE Lighting Solutions, LLC | Phosphor suspended in silicone, molded/formed and used in a remote phosphor configuration |
US8128272B2 (en) | 2005-06-07 | 2012-03-06 | Oree, Inc. | Illumination apparatus |
EP2446190A2 (en) * | 2009-06-23 | 2012-05-02 | Altair Engineering, Inc. | Led lamp with a wavelength converting layer |
EP2491296A2 (en) * | 2009-10-22 | 2012-08-29 | Light Prescriptions Innovators, LLC. | Solid-state light bulb |
US20130050979A1 (en) * | 2011-08-26 | 2013-02-28 | Antony P. Van de Ven | Reduced phosphor lighting devices |
US20130092965A1 (en) * | 2010-03-30 | 2013-04-18 | Naoto Kijima | Light emitting device |
US20130094180A1 (en) * | 2011-10-18 | 2013-04-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Coated diffuser cap for led illumination device |
US8491140B2 (en) | 2010-11-05 | 2013-07-23 | Cree, Inc. | Lighting device with multiple emitters and remote lumiphor |
WO2013116697A1 (en) * | 2012-02-03 | 2013-08-08 | Sabic Innovative Plastics Ip B.V. | Light emitting diode device and method for production thereof containing conversion material chemistry |
US8513872B2 (en) | 2010-08-05 | 2013-08-20 | Sharp Kabushiki Kaisha | Light emitting apparatus and method for manufacturing thereof |
US8534901B2 (en) | 2010-09-13 | 2013-09-17 | Teledyne Reynolds, Inc. | Collimating waveguide apparatus and method |
US8591072B2 (en) | 2011-11-16 | 2013-11-26 | Oree, Inc. | Illumination apparatus confining light by total internal reflection and methods of forming the same |
WO2013182950A1 (en) * | 2012-06-05 | 2013-12-12 | Koninklijke Philips N.V. | Lighting device having a remote wave length converting layer |
US8608328B2 (en) | 2011-05-06 | 2013-12-17 | Teledyne Technologies Incorporated | Light source with secondary emitter conversion element |
US8624527B1 (en) | 2009-03-27 | 2014-01-07 | Oree, Inc. | Independently controllable illumination device |
US20140009959A1 (en) * | 2011-03-22 | 2014-01-09 | Lg Innotek Co., Ltd. | Display device and light conversion member |
US20140117393A1 (en) * | 2012-10-25 | 2014-05-01 | Sabic Innovative Plastics Ip B.V. | Light emitting diode devices, method of manufacture, uses thereof |
US8727597B2 (en) | 2009-06-24 | 2014-05-20 | Oree, Inc. | Illumination apparatus with high conversion efficiency and methods of forming the same |
US8801253B2 (en) | 2003-03-26 | 2014-08-12 | Optim Llc | Illumination device |
US8807785B2 (en) | 2008-05-23 | 2014-08-19 | Ilumisys, Inc. | Electric shock resistant L.E.D. based light |
US8840282B2 (en) | 2010-03-26 | 2014-09-23 | Ilumisys, Inc. | LED bulb with internal heat dissipating structures |
US8894430B2 (en) | 2010-10-29 | 2014-11-25 | Ilumisys, Inc. | Mechanisms for reducing risk of shock during installation of light tube |
US8901823B2 (en) | 2008-10-24 | 2014-12-02 | Ilumisys, Inc. | Light and light sensor |
US8928025B2 (en) | 2007-12-20 | 2015-01-06 | Ilumisys, Inc. | LED lighting apparatus with swivel connection |
US8946996B2 (en) | 2008-10-24 | 2015-02-03 | Ilumisys, Inc. | Light and light sensor |
US8962117B2 (en) | 2011-10-27 | 2015-02-24 | Sabic Global Technologies B.V. | Process for producing bisphenol A with reduced sulfur content, polycarbonate made from the bisphenol A, and containers formed from the polycarbonate |
US9006378B2 (en) | 2013-05-29 | 2015-04-14 | Sabic Global Technologies B.V. | Color stable thermoplastic composition |
US9013119B2 (en) | 2010-03-26 | 2015-04-21 | Ilumisys, Inc. | LED light with thermoelectric generator |
US20150198319A1 (en) * | 2013-11-21 | 2015-07-16 | Ford Glaobal Technologies, LLC | Photoluminescent dynamic lighting |
US9101026B2 (en) | 2008-10-24 | 2015-08-04 | Ilumisys, Inc. | Integration of LED lighting with building controls |
US20150252965A1 (en) * | 2014-03-07 | 2015-09-10 | Intematix Corporation | Solid-state linear lighting arrangements including light emitting phosphor |
US9140429B2 (en) | 2010-10-14 | 2015-09-22 | Cree, Inc. | Optical element edge treatment for lighting device |
US20160049561A1 (en) * | 2013-03-13 | 2016-02-18 | Koninklijke Philips N.V. | Encapsulated led lens with bottom reflectors |
US9267650B2 (en) | 2013-10-09 | 2016-02-23 | Ilumisys, Inc. | Lens for an LED-based light |
US9287471B2 (en) | 2012-02-29 | 2016-03-15 | Sabic Global Technologies B.V. | Polycarbonate compositions containing conversion material chemistry and having enhanced optical properties, methods of making and articles comprising the same |
US9285084B2 (en) | 2013-03-14 | 2016-03-15 | Ilumisys, Inc. | Diffusers for LED-based lights |
US9290618B2 (en) | 2011-08-05 | 2016-03-22 | Sabic Global Technologies B.V. | Polycarbonate compositions having enhanced optical properties, methods of making and articles comprising the polycarbonate compositions |
CN105526541A (en) * | 2014-10-20 | 2016-04-27 | 福特全球技术公司 | Photoluminescence dynamic illumination |
US9349924B2 (en) | 2009-03-19 | 2016-05-24 | Koninklijke Phililps N.V. | Illumination device with remote luminescent material |
US9346949B2 (en) | 2013-02-12 | 2016-05-24 | Sabic Global Technologies B.V. | High reflectance polycarbonate |
US9353939B2 (en) | 2008-10-24 | 2016-05-31 | iLumisys, Inc | Lighting including integral communication apparatus |
EP2985516A4 (en) * | 2013-03-04 | 2016-11-09 | Shinetsu Chemical Co | Turn signal for vehicle |
US9510400B2 (en) | 2014-05-13 | 2016-11-29 | Ilumisys, Inc. | User input systems for an LED-based light |
CN106195917A (en) * | 2016-07-05 | 2016-12-07 | 深圳市圣诺光电科技有限公司 | A kind of line-type lamp fitting and preparation method thereof |
US9553244B2 (en) | 2013-05-16 | 2017-01-24 | Sabic Global Technologies B.V. | Branched polycarbonate compositions having conversion material chemistry and articles thereof |
US9574717B2 (en) | 2014-01-22 | 2017-02-21 | Ilumisys, Inc. | LED-based light with addressed LEDs |
US9587790B2 (en) | 2013-03-15 | 2017-03-07 | Cree, Inc. | Remote lumiphor solid state lighting devices with enhanced light extraction |
US9624427B2 (en) | 2006-11-24 | 2017-04-18 | Ge Phosphors Technology, Llc | Phosphor, method of producing the same, and light emitting apparatus |
US9772086B2 (en) | 2013-05-29 | 2017-09-26 | Sabic Innovative Plastics Ip B.V. | Illuminating devices with color stable thermoplastic light transmitting articles |
US9771452B2 (en) | 2012-02-29 | 2017-09-26 | Sabic Global Technologies B.V. | Plastic composition comprising a polycarbonate made from low sulfur bisphenol A, and articles made therefrom |
US9807842B2 (en) | 2012-07-09 | 2017-10-31 | Ilumisys, Inc. | System and method for controlling operation of an LED-based light |
US9857519B2 (en) | 2012-07-03 | 2018-01-02 | Oree Advanced Illumination Solutions Ltd. | Planar remote phosphor illumination apparatus |
US10066160B2 (en) | 2015-05-01 | 2018-09-04 | Intematix Corporation | Solid-state white light generating lighting arrangements including photoluminescence wavelength conversion components |
US10161568B2 (en) | 2015-06-01 | 2018-12-25 | Ilumisys, Inc. | LED-based light with canted outer walls |
DE102017212030A1 (en) | 2017-07-13 | 2019-01-17 | Tridonic Jennersdorf Gmbh | LED / LD lighting device with novel remote phosphor configuration and method of making such a |
US10557594B2 (en) | 2012-12-28 | 2020-02-11 | Intematix Corporation | Solid-state lamps utilizing photoluminescence wavelength conversion components |
EP2543060B1 (en) * | 2010-03-03 | 2021-06-16 | CreeLED, Inc. | Methods for application of optical materials to optical elements |
US11047747B2 (en) | 2017-03-27 | 2021-06-29 | Firouzeh Sabri | Light weight flexible temperature sensor kit |
US20230219311A1 (en) * | 2013-05-10 | 2023-07-13 | Abl Ip Holding Llc | Silicone optics |
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Publication number | Priority date | Publication date | Assignee | Title |
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US20120138874A1 (en) | 2010-12-02 | 2012-06-07 | Intematix Corporation | Solid-state light emitting devices and signage with photoluminescence wavelength conversion and photoluminescent compositions therefor |
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KR101132360B1 (en) * | 2011-05-25 | 2012-04-03 | 한국해양대학교 산학협력단 | Red light lamp for naval vessels |
US9115868B2 (en) | 2011-10-13 | 2015-08-25 | Intematix Corporation | Wavelength conversion component with improved protective characteristics for remote wavelength conversion |
US20130100641A1 (en) * | 2011-10-25 | 2013-04-25 | Marcus Zhang | LED Lamp |
RU2500715C2 (en) | 2011-11-18 | 2013-12-10 | Общество с ограниченной ответственностью "Люмен" (ООО "Люмен") | Luminescent composite material and light-emitting device based thereon |
EP3367445B1 (en) | 2011-11-23 | 2020-07-29 | Quarkstar LLC | Light-emitting devices providing asymmetrical propagation of light |
US8907362B2 (en) | 2012-01-24 | 2014-12-09 | Cooledge Lighting Inc. | Light-emitting dies incorporating wavelength-conversion materials and related methods |
WO2013112435A1 (en) | 2012-01-24 | 2013-08-01 | Cooledge Lighting Inc. | Light - emitting devices having discrete phosphor chips and fabrication methods |
US8896010B2 (en) | 2012-01-24 | 2014-11-25 | Cooledge Lighting Inc. | Wafer-level flip chip device packages and related methods |
US20160274318A1 (en) | 2012-03-05 | 2016-09-22 | Nanoprecision Products, Inc. | Optical bench subassembly having integrated photonic device |
EP2823344B1 (en) * | 2012-03-05 | 2019-02-20 | Nanoprecision Products, Inc. | Coupling device having a structured reflective surface for coupling input/output of an optical fiber |
CN103375708B (en) * | 2012-04-26 | 2015-10-28 | 展晶科技(深圳)有限公司 | Light-emitting diode lamp source device |
DE102012209172A1 (en) * | 2012-05-31 | 2013-12-05 | Osram Gmbh | Lens with internal reflecting reflection layer |
WO2014043410A1 (en) | 2012-09-13 | 2014-03-20 | Quarkstar Llc | Light-emitting devices with reflective elements |
WO2014138591A1 (en) | 2013-03-07 | 2014-09-12 | Quarkstar Llc | Illumination device with multi-color light-emitting elements |
CN104756264B (en) | 2012-09-13 | 2019-06-18 | 夸克星有限责任公司 | Light emitting device with remote scattering element and total internal reflection extractor element |
US9983414B2 (en) * | 2012-10-23 | 2018-05-29 | Nanoprecision Products, Inc. | Optoelectronic module having a stamped metal optic |
RU2628014C2 (en) * | 2012-12-06 | 2017-08-17 | Евгений Михайлович Силкин | Lighting device |
CN103090319A (en) * | 2012-12-20 | 2013-05-08 | 康佳集团股份有限公司 | Lamp bar of liquid crystal display (LCD) television and directly-down type backlight module |
US9217543B2 (en) * | 2013-01-28 | 2015-12-22 | Intematix Corporation | Solid-state lamps with omnidirectional emission patterns |
US9366396B2 (en) | 2013-01-30 | 2016-06-14 | Cree, Inc. | Optical waveguide and lamp including same |
US9291320B2 (en) | 2013-01-30 | 2016-03-22 | Cree, Inc. | Consolidated troffer |
US9442243B2 (en) | 2013-01-30 | 2016-09-13 | Cree, Inc. | Waveguide bodies including redirection features and methods of producing same |
US9690029B2 (en) | 2013-01-30 | 2017-06-27 | Cree, Inc. | Optical waveguides and luminaires incorporating same |
US9869432B2 (en) | 2013-01-30 | 2018-01-16 | Cree, Inc. | Luminaires using waveguide bodies and optical elements |
US9625638B2 (en) | 2013-03-15 | 2017-04-18 | Cree, Inc. | Optical waveguide body |
US10436969B2 (en) | 2013-01-30 | 2019-10-08 | Ideal Industries Lighting Llc | Optical waveguide and luminaire incorporating same |
JP6045470B2 (en) * | 2013-03-04 | 2016-12-14 | 信越化学工業株式会社 | Red lamp and vehicle lighting device |
US9752757B2 (en) | 2013-03-07 | 2017-09-05 | Quarkstar Llc | Light-emitting device with light guide for two way illumination |
US9366799B2 (en) | 2013-03-15 | 2016-06-14 | Cree, Inc. | Optical waveguide bodies and luminaires utilizing same |
USD738034S1 (en) * | 2013-03-15 | 2015-09-01 | Cree, Inc. | Lighting apparatus |
US10379278B2 (en) * | 2013-03-15 | 2019-08-13 | Ideal Industries Lighting Llc | Outdoor and/or enclosed structure LED luminaire outdoor and/or enclosed structure LED luminaire having outward illumination |
US10209429B2 (en) | 2013-03-15 | 2019-02-19 | Cree, Inc. | Luminaire with selectable luminous intensity pattern |
US10400984B2 (en) | 2013-03-15 | 2019-09-03 | Cree, Inc. | LED light fixture and unitary optic member therefor |
US10502899B2 (en) * | 2013-03-15 | 2019-12-10 | Ideal Industries Lighting Llc | Outdoor and/or enclosed structure LED luminaire |
TWI627371B (en) | 2013-03-15 | 2018-06-21 | 英特曼帝克司公司 | Photoluminescence wavelength conversion components |
US9920901B2 (en) | 2013-03-15 | 2018-03-20 | Cree, Inc. | LED lensing arrangement |
US9798072B2 (en) | 2013-03-15 | 2017-10-24 | Cree, Inc. | Optical element and method of forming an optical element |
USD743090S1 (en) * | 2013-03-15 | 2015-11-10 | Cree, Inc. | Lighting apparatus |
WO2014144706A2 (en) | 2013-03-15 | 2014-09-18 | Quarkstar Llc | Color tuning of light-emitting devices |
US10436970B2 (en) | 2013-03-15 | 2019-10-08 | Ideal Industries Lighting Llc | Shaped optical waveguide bodies |
US20140313741A1 (en) * | 2013-04-23 | 2014-10-23 | Tai-Yin Huang | Lamp having an annular light-guiding body |
JP2015144261A (en) * | 2013-12-26 | 2015-08-06 | インテマティックス・コーポレーションIntematix Corporation | Solid-state light emitting device with photoluminescence wavelength conversion |
WO2015119858A1 (en) | 2014-02-05 | 2015-08-13 | Cooledge Lighting Inc. | Light-emitting dies incorporating wavelength-conversion materials and related methods |
US9318670B2 (en) | 2014-05-21 | 2016-04-19 | Intematix Corporation | Materials for photoluminescence wavelength converted solid-state light emitting devices and arrangements |
USD787112S1 (en) * | 2015-07-30 | 2017-05-16 | Moda LLC | Cove lighting fixture |
DE102016121890A1 (en) * | 2015-11-23 | 2017-05-24 | Ford Global Technologies, Llc | System and method for remote activation of vehicle lighting |
WO2017189136A1 (en) * | 2016-04-29 | 2017-11-02 | Hoboy Loren P | Scanning illuminator and optical incapacitation method and apparatus |
US11719882B2 (en) | 2016-05-06 | 2023-08-08 | Ideal Industries Lighting Llc | Waveguide-based light sources with dynamic beam shaping |
US10416377B2 (en) | 2016-05-06 | 2019-09-17 | Cree, Inc. | Luminaire with controllable light emission |
CN110582848A (en) * | 2017-05-02 | 2019-12-17 | 奥斯兰姆奥普托半导体有限责任公司 | Production of chip modules |
JP2019029150A (en) * | 2017-07-28 | 2019-02-21 | パナソニックIpマネジメント株式会社 | Lighting system |
USD850700S1 (en) | 2018-05-07 | 2019-06-04 | Moda LLC | Internal lighting fixture |
US20240092088A1 (en) * | 2022-09-19 | 2024-03-21 | Toshiba Tec Kabushiki Kaisha | Printer device |
KR20240063534A (en) | 2022-11-03 | 2024-05-10 | 주식회사 에스티엘 | Charging light structure luminous package and safety light using the same |
Citations (94)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3593055A (en) * | 1969-04-16 | 1971-07-13 | Bell Telephone Labor Inc | Electro-luminescent device |
US3670193A (en) * | 1970-05-14 | 1972-06-13 | Duro Test Corp | Electric lamps producing energy in the visible and ultra-violet ranges |
US3676668A (en) * | 1969-12-29 | 1972-07-11 | Gen Electric | Solid state lamp assembly |
US3691482A (en) * | 1970-01-19 | 1972-09-12 | Bell Telephone Labor Inc | Display system |
US3709685A (en) * | 1970-02-19 | 1973-01-09 | Ilford Ltd | Photoconductive zinc oxide sensitized by substituted thiazolidene dyes |
US3743833A (en) * | 1971-07-16 | 1973-07-03 | Eastman Kodak Co | Radiographic elements and binders |
US3793046A (en) * | 1970-12-04 | 1974-02-19 | Philips Corp | Method of manufacturing a pigment |
US3819973A (en) * | 1972-11-02 | 1974-06-25 | A Hosford | Electroluminescent filament |
US3819974A (en) * | 1973-03-12 | 1974-06-25 | D Stevenson | Gallium nitride metal-semiconductor junction light emitting diode |
US3875456A (en) * | 1972-04-04 | 1975-04-01 | Hitachi Ltd | Multi-color semiconductor lamp |
US3932881A (en) * | 1972-09-05 | 1976-01-13 | Nippon Electric Co., Inc. | Electroluminescent device including dichroic and infrared reflecting components |
US3937998A (en) * | 1973-10-05 | 1976-02-10 | U.S. Philips Corporation | Luminescent coating for low-pressure mercury vapour discharge lamp |
US3972717A (en) * | 1973-03-21 | 1976-08-03 | Hoechst Aktiengesellschaft | Electrophotographic recording material |
US4047075A (en) * | 1975-03-01 | 1977-09-06 | Licentia-Patent-Verwaltungs-G.M.B.H. | Encapsulated light-emitting diode structure and array thereof |
US4104076A (en) * | 1970-03-17 | 1978-08-01 | Saint-Gobain Industries | Manufacture of novel grey and bronze glasses |
US4143394A (en) * | 1976-07-30 | 1979-03-06 | Licentia Patent-Verwaltungs-G.M.B.H. | Semiconductor luminescence device with housing |
US4191943A (en) * | 1976-10-18 | 1980-03-04 | Fairchild Camera And Instrument Corporation | Filler-in-plastic light-scattering cover |
US4211955A (en) * | 1978-03-02 | 1980-07-08 | Ray Stephen W | Solid state lamp |
US4315192A (en) * | 1979-12-31 | 1982-02-09 | Westinghouse Electric Corp. | Fluorescent lamp using high performance phosphor blend which is protected from color shifts by a very thin overcoat of stable phosphor of similar chromaticity |
US4443532A (en) * | 1981-07-29 | 1984-04-17 | Bell Telephone Laboratories, Incorporated | Induced crystallographic modification of aromatic compounds |
US4573766A (en) * | 1983-12-19 | 1986-03-04 | Cordis Corporation | LED Staggered back lighting panel for LCD module |
US4638214A (en) * | 1985-03-25 | 1987-01-20 | General Electric Company | Fluorescent lamp containing aluminate phosphor |
US4667036A (en) * | 1983-08-27 | 1987-05-19 | Basf Aktiengesellschaft | Concentration of light over a particular area, and novel perylene-3,4,9,10-tetracarboxylic acid diimides |
US4678285A (en) * | 1984-01-13 | 1987-07-07 | Ricoh Company, Ltd. | Liquid crystal color display device |
US4727003A (en) * | 1985-09-30 | 1988-02-23 | Ricoh Company, Ltd. | Electroluminescence device |
US4772885A (en) * | 1984-11-22 | 1988-09-20 | Ricoh Company, Ltd. | Liquid crystal color display device |
US4845223A (en) * | 1985-12-19 | 1989-07-04 | Basf Aktiengesellschaft | Fluorescent aryloxy-substituted perylene-3,4,9,10-tetracarboxylic acid diimides |
US4859539A (en) * | 1987-03-23 | 1989-08-22 | Eastman Kodak Company | Optically brightened polyolefin coated paper support |
US4915478A (en) * | 1988-10-05 | 1990-04-10 | The United States Of America As Represented By The Secretary Of The Navy | Low power liquid crystal display backlight |
US4918497A (en) * | 1988-12-14 | 1990-04-17 | Cree Research, Inc. | Blue light emitting diode formed in silicon carbide |
US4946621A (en) * | 1986-04-29 | 1990-08-07 | Centre National De La Recherche Scientifique (Cnrs) | Luminescent mixed borates based on rare earths |
US4992704A (en) * | 1989-04-17 | 1991-02-12 | Basic Electronics, Inc. | Variable color light emitting diode |
US5110931A (en) * | 1987-11-27 | 1992-05-05 | Hoechst Aktiengesellschaft | Process for the preparation of n,n'-dimethylperylene-3,4,9,10-tetracarboxylic diimide in high-hiding pigment form |
US5126214A (en) * | 1989-03-15 | 1992-06-30 | Idemitsu Kosan Co., Ltd. | Electroluminescent element |
US5131916A (en) * | 1990-03-01 | 1992-07-21 | Bayer Aktiengesellschaft | Colored fluorescent polymer emulsions for marker pens: graft copolymers and fluorescent dyes in aqueous phase |
US5141916A (en) * | 1988-09-22 | 1992-08-25 | Nitto Denko Corporation | Thermal transfer image reception paper |
US5143433A (en) * | 1991-11-01 | 1992-09-01 | Litton Systems Canada Limited | Night vision backlighting system for liquid crystal displays |
US5143438A (en) * | 1990-10-15 | 1992-09-01 | Thorn Emi Plc | Light sources |
US5208462A (en) * | 1991-12-19 | 1993-05-04 | Allied-Signal Inc. | Wide bandwidth solid state optical source |
US5210051A (en) * | 1990-03-27 | 1993-05-11 | Cree Research, Inc. | High efficiency light emitting diodes from bipolar gallium nitride |
US5211467A (en) * | 1992-01-07 | 1993-05-18 | Rockwell International Corporation | Fluorescent lighting system |
US5237182A (en) * | 1990-11-29 | 1993-08-17 | Sharp Kabushiki Kaisha | Electroluminescent device of compound semiconductor with buffer layer |
US5283425A (en) * | 1992-02-06 | 1994-02-01 | Rohm Co., Ltd. | Light emitting element array substrate with reflecting means |
US5405709A (en) * | 1993-09-13 | 1995-04-11 | Eastman Kodak Company | White light emitting internal junction organic electroluminescent device |
US5439971A (en) * | 1991-11-12 | 1995-08-08 | Eastman Chemical Company | Fluorescent pigment concentrates |
US5518808A (en) * | 1992-12-18 | 1996-05-21 | E. I. Du Pont De Nemours And Company | Luminescent materials prepared by coating luminescent compositions onto substrate particles |
US5535230A (en) * | 1994-04-06 | 1996-07-09 | Shogo Tzuzuki | Illuminating light source device using semiconductor laser element |
US5557168A (en) * | 1993-04-02 | 1996-09-17 | Okaya Electric Industries Co., Ltd. | Gas-discharging type display device and a method of manufacturing |
US5619356A (en) * | 1993-09-16 | 1997-04-08 | Sharp Kabushiki Kaisha | Reflective liquid crystal display device having a compensator with a retardation value between 0.15 μm and 0.38 μm and a single polarizer |
US5660461A (en) * | 1994-12-08 | 1997-08-26 | Quantum Devices, Inc. | Arrays of optoelectronic devices and method of making same |
US5763901A (en) * | 1992-12-17 | 1998-06-09 | Kabushiki Kaisha Toshiba | Semiconductor light-emitting device and method for manufacturing the device |
US5771039A (en) * | 1994-06-06 | 1998-06-23 | Ditzik; Richard J. | Direct view display device integration techniques |
US5770887A (en) * | 1993-10-08 | 1998-06-23 | Mitsubishi Cable Industries, Ltd. | GaN single crystal |
US5777350A (en) * | 1994-12-02 | 1998-07-07 | Nichia Chemical Industries, Ltd. | Nitride semiconductor light-emitting device |
US5869199A (en) * | 1993-03-26 | 1999-02-09 | Sumitomo Electric Industries, Ltd. | Organic electroluminescent elements comprising triazoles |
US5947587A (en) * | 1996-10-16 | 1999-09-07 | U.S. Philips Corporation | Signal lamp with LEDs |
US5959316A (en) * | 1998-09-01 | 1999-09-28 | Hewlett-Packard Company | Multiple encapsulation of phosphor-LED devices |
US20010000622A1 (en) * | 1996-06-26 | 2001-05-03 | Osram Opto Semiconductors Gmbh & Co., Ohg | Light-radiating semiconductor component with a luminescence conversion element |
US6255670B1 (en) * | 1998-02-06 | 2001-07-03 | General Electric Company | Phosphors for light generation from light emitting semiconductors |
US6340824B1 (en) * | 1997-09-01 | 2002-01-22 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device including a fluorescent material |
US20020047516A1 (en) * | 2000-10-24 | 2002-04-25 | Tadanobu Iwasa | Fluorescent tube |
US6504301B1 (en) * | 1999-09-03 | 2003-01-07 | Lumileds Lighting, U.S., Llc | Non-incandescent lightbulb package using light emitting diodes |
US20030038596A1 (en) * | 2001-08-21 | 2003-02-27 | Wen-Chih Ho | Light-mixing layer and method |
US20030052595A1 (en) * | 2001-09-20 | 2003-03-20 | Patent-Treuhand-Gesellschaft Fur Elektrische Gluhlampen Mbh | Illumination unit having at least one LED as light source |
US6538375B1 (en) * | 2000-08-17 | 2003-03-25 | General Electric Company | Oled fiber light source |
US6555958B1 (en) * | 2000-05-15 | 2003-04-29 | General Electric Company | Phosphor for down converting ultraviolet light of LEDs to blue-green light |
US20030102810A1 (en) * | 2001-11-30 | 2003-06-05 | Mule Lighting, Inc. | Retrofit light emitting diode tube |
US6576488B2 (en) * | 2001-06-11 | 2003-06-10 | Lumileds Lighting U.S., Llc | Using electrophoresis to produce a conformally coated phosphor-converted light emitting semiconductor |
US6580097B1 (en) * | 1998-02-06 | 2003-06-17 | General Electric Company | Light emitting device with phosphor composition |
US6600175B1 (en) * | 1996-03-26 | 2003-07-29 | Advanced Technology Materials, Inc. | Solid state white light emitter and display using same |
US6614170B2 (en) * | 2000-12-29 | 2003-09-02 | Arima Optoelectronics Corporation | Light emitting diode with light conversion using scattering optical media |
US6680569B2 (en) * | 1999-02-18 | 2004-01-20 | Lumileds Lighting U.S. Llc | Red-deficiency compensating phosphor light emitting device |
US20040016908A1 (en) * | 1996-09-20 | 2004-01-29 | Klaus Hohn | Wavelength-converting casting composition and white light-emitting semiconductor component |
US6717353B1 (en) * | 2002-10-14 | 2004-04-06 | Lumileds Lighting U.S., Llc | Phosphor converted light emitting device |
US20040104391A1 (en) * | 2001-09-03 | 2004-06-03 | Toshihide Maeda | Semiconductor light emitting device, light emitting apparatus and production method for semiconductor light emitting device |
US6860628B2 (en) * | 2002-07-17 | 2005-03-01 | Jonas J. Robertson | LED replacement for fluorescent lighting |
US20050051782A1 (en) * | 2003-09-09 | 2005-03-10 | Negley Gerald H. | Transmissive optical elements including transparent plastic shell having a phosphor dispersed therein, and methods of fabricating same |
US20050057917A1 (en) * | 2003-09-17 | 2005-03-17 | Yasushi Yatsuda | Light source and vehicle lamp |
US6869812B1 (en) * | 2003-05-13 | 2005-03-22 | Heng Liu | High power AllnGaN based multi-chip light emitting diode |
US20050093430A1 (en) * | 2003-02-26 | 2005-05-05 | Cree, Inc. | Composite white light source and method for fabricating |
US20050168127A1 (en) * | 2004-01-30 | 2005-08-04 | Shih-Chang Shei | [white light led] |
US20060028122A1 (en) * | 2004-08-04 | 2006-02-09 | Intematix Corporation | Novel silicate-based yellow-green phosphors |
US7220022B2 (en) * | 1999-02-12 | 2007-05-22 | Fiber Optic Designs, Inc. | Jacketed LED assemblies and light strings containing same |
US20080111472A1 (en) * | 2006-11-10 | 2008-05-15 | Intematix Corporation | Aluminum-silicate based orange-red phosphors with mixed divalent and trivalent cations |
US7390437B2 (en) * | 2004-08-04 | 2008-06-24 | Intematix Corporation | Aluminate-based blue phosphors |
US7479662B2 (en) * | 2002-08-30 | 2009-01-20 | Lumination Llc | Coated LED with improved efficiency |
US7575697B2 (en) * | 2004-08-04 | 2009-08-18 | Intematix Corporation | Silicate-based green phosphors |
US7655156B2 (en) * | 2005-08-03 | 2010-02-02 | Intematix Corporation | Silicate-based orange phosphors |
US7663315B1 (en) * | 2007-07-24 | 2010-02-16 | Ilight Technologies, Inc. | Spherical bulb for light-emitting diode with spherical inner cavity |
US7686478B1 (en) * | 2007-01-12 | 2010-03-30 | Ilight Technologies, Inc. | Bulb for light-emitting diode with color-converting insert |
US7943951B2 (en) * | 2005-06-17 | 2011-05-17 | Samsung Led Co., Ltd. | Light emitting device package |
US20110147778A1 (en) * | 2009-12-17 | 2011-06-23 | Nichia Corporation | Light emitting device |
US7972030B2 (en) * | 2007-03-05 | 2011-07-05 | Intematix Corporation | Light emitting diode (LED) based lighting systems |
US20120086034A1 (en) * | 2010-10-05 | 2012-04-12 | Intematix Corporation | Solid-state light emitting devices and signage with photoluminescence wavelength conversion |
Family Cites Families (177)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3290255A (en) | 1963-09-30 | 1966-12-06 | Gen Electric | White electroluminescent phosphor |
JPS5026433B1 (en) | 1970-12-21 | 1975-09-01 | ||
US4081764A (en) * | 1972-10-12 | 1978-03-28 | Minnesota Mining And Manufacturing Company | Zinc oxide light emitting diode |
US3849707A (en) | 1973-03-07 | 1974-11-19 | Ibm | PLANAR GaN ELECTROLUMINESCENT DEVICE |
JPS5079379A (en) | 1973-11-13 | 1975-06-27 | ||
JPS5079379U (en) | 1973-11-24 | 1975-07-09 | ||
US4176299A (en) | 1975-10-03 | 1979-11-27 | Westinghouse Electric Corp. | Method for efficiently generating white light with good color rendition of illuminated objects |
US4176294A (en) | 1975-10-03 | 1979-11-27 | Westinghouse Electric Corp. | Method and device for efficiently generating white light with good rendition of illuminated objects |
GB2017409A (en) | 1978-03-22 | 1979-10-03 | Bayraktaroglu B | Light-emitting diode |
US4305019A (en) | 1979-12-31 | 1981-12-08 | Westinghouse Electric Corp. | Warm-white fluorescent lamp having good efficacy and color rendering and using special phosphor blend as separate undercoat |
JPS57174847A (en) | 1981-04-22 | 1982-10-27 | Mitsubishi Electric Corp | Fluorescent discharge lamp |
JPS5966791A (en) | 1982-10-07 | 1984-04-16 | Hideo Itokawa | Automatic fair copy machine |
JPS60147743A (en) | 1984-01-11 | 1985-08-03 | Mitsubishi Chem Ind Ltd | Electrophotographic sensitive body |
JPS60170194A (en) | 1984-02-13 | 1985-09-03 | ソニー株式会社 | El element |
JPS60170194U (en) | 1984-04-20 | 1985-11-11 | 鈴木 悦三 | Roll paper holder that can be opened and closed |
JPH079998B2 (en) | 1988-01-07 | 1995-02-01 | 科学技術庁無機材質研究所長 | Cubic boron nitride P-n junction light emitting device |
JPH0324692Y2 (en) | 1987-08-06 | 1991-05-29 | ||
JPH01260707A (en) | 1988-04-11 | 1989-10-18 | Idec Izumi Corp | Device for emitting white light |
JPH0291980A (en) | 1988-09-29 | 1990-03-30 | Toshiba Lighting & Technol Corp | solid state light emitting device |
JPH0799345B2 (en) | 1988-10-31 | 1995-10-25 | 防衛庁技術研究本部長 | Method and apparatus for generating water temperature profile data |
DE3926564A1 (en) | 1989-08-11 | 1991-02-14 | Hoechst Ag | NEW PIGMENT PREPARATIONS BASED ON PERYLENE COMPOUNDS |
AU6885391A (en) | 1989-11-24 | 1991-06-26 | Innovare Limited | A display device |
US5077161A (en) | 1990-05-31 | 1991-12-31 | Xerox Corporation | Imaging members with bichromophoric bisazo perylene photoconductive materials |
JPH0794785B2 (en) | 1990-12-07 | 1995-10-11 | 斉藤 幹夫 | Bag lock |
JPH04289691A (en) | 1990-12-07 | 1992-10-14 | Mitsubishi Cable Ind Ltd | El illuminant |
US5166761A (en) | 1991-04-01 | 1992-11-24 | Midwest Research Institute | Tunnel junction multiple wavelength light-emitting diodes |
JP2791448B2 (en) | 1991-04-19 | 1998-08-27 | 日亜化学工業 株式会社 | Light emitting diode |
JP2666228B2 (en) | 1991-10-30 | 1997-10-22 | 豊田合成株式会社 | Gallium nitride based compound semiconductor light emitting device |
GB9124444D0 (en) | 1991-11-18 | 1992-01-08 | Black Box Vision Limited | Display device |
JPH05152609A (en) | 1991-11-25 | 1993-06-18 | Nichia Chem Ind Ltd | Light emitting diode |
JPH087614B2 (en) | 1992-03-27 | 1996-01-29 | 株式会社牧野フライス製作所 | Method and device for correcting tool length of machine tool |
GB9207524D0 (en) * | 1992-04-07 | 1992-05-20 | Smiths Industries Plc | Radiation-emitting devices |
US6137217A (en) | 1992-08-28 | 2000-10-24 | Gte Products Corporation | Fluorescent lamp with improved phosphor blend |
US5578839A (en) | 1992-11-20 | 1996-11-26 | Nichia Chemical Industries, Ltd. | Light-emitting gallium nitride-based compound semiconductor device |
JPH06267301A (en) | 1993-03-15 | 1994-09-22 | Olympus Optical Co Ltd | Organic photoluminescence element |
DE59403259D1 (en) | 1993-05-04 | 1997-08-07 | Max Planck Gesellschaft | Tetraaroxyperylen-3,4,9,10-tetracarbonsäurepolyimide |
JPH0794785A (en) * | 1993-09-22 | 1995-04-07 | Stanley Electric Co Ltd | Light-emitting diode |
JPH07176794A (en) | 1993-12-17 | 1995-07-14 | Nichia Chem Ind Ltd | Planar light source |
US5679152A (en) | 1994-01-27 | 1997-10-21 | Advanced Technology Materials, Inc. | Method of making a single crystals Ga*N article |
JPH07235207A (en) | 1994-02-21 | 1995-09-05 | Copal Co Ltd | Back light |
US6330017B1 (en) * | 1994-10-12 | 2001-12-11 | Ricoh Co., Ltd. | Light emitting diode array head including focusing lenses |
US5585640A (en) | 1995-01-11 | 1996-12-17 | Huston; Alan L. | Glass matrix doped with activated luminescent nanocrystalline particles |
JPH08250281A (en) | 1995-03-08 | 1996-09-27 | Olympus Optical Co Ltd | Luminescent element and displaying apparatus |
US5583349A (en) | 1995-11-02 | 1996-12-10 | Motorola | Full color light emitting diode display |
RU2114492C1 (en) * | 1996-03-19 | 1998-06-27 | Владимир Семенович Абрамов | Light-emitting diode |
TW383508B (en) * | 1996-07-29 | 2000-03-01 | Nichia Kagaku Kogyo Kk | Light emitting device and display |
US5962971A (en) | 1997-08-29 | 1999-10-05 | Chen; Hsing | LED structure with ultraviolet-light emission chip and multilayered resins to generate various colored lights |
JPH1173922A (en) | 1997-08-29 | 1999-03-16 | Matsushita Electric Works Ltd | Light-emitting device |
JP2900928B2 (en) | 1997-10-20 | 1999-06-02 | 日亜化学工業株式会社 | Light emitting diode |
US6147367A (en) * | 1997-12-10 | 2000-11-14 | Industrial Technology Research Institute | Packaging design for light emitting diode |
US6252254B1 (en) * | 1998-02-06 | 2001-06-26 | General Electric Company | Light emitting device with phosphor composition |
JP3307316B2 (en) | 1998-02-27 | 2002-07-24 | サンケン電気株式会社 | Semiconductor light emitting device |
JP2000031548A (en) * | 1998-07-09 | 2000-01-28 | Stanley Electric Co Ltd | Surface mount type light emitting diode and method of manufacturing the same |
JP4010665B2 (en) | 1998-09-08 | 2007-11-21 | 三洋電機株式会社 | Installation method of solar cell module |
JP4010666B2 (en) | 1998-09-11 | 2007-11-21 | 三洋電機株式会社 | Solar power plant |
EP1104799A1 (en) | 1999-11-30 | 2001-06-06 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Red emitting luminescent material |
JP2001177153A (en) * | 1999-12-17 | 2001-06-29 | Sharp Corp | Light emitting device |
US6777871B2 (en) * | 2000-03-31 | 2004-08-17 | General Electric Company | Organic electroluminescent devices with enhanced light extraction |
US6653765B1 (en) * | 2000-04-17 | 2003-11-25 | General Electric Company | Uniform angular light distribution from LEDs |
GB0017659D0 (en) | 2000-07-19 | 2000-09-06 | Secr Defence | Light emitting diode with lens |
US6361186B1 (en) | 2000-08-02 | 2002-03-26 | Lektron Industrial Supply, Inc. | Simulated neon light using led's |
GB2366610A (en) * | 2000-09-06 | 2002-03-13 | Mark Shaffer | Electroluminscent lamp |
JP2002133910A (en) * | 2000-10-24 | 2002-05-10 | Toyoda Gosei Co Ltd | Phosphor illumination tube |
JP2002221616A (en) * | 2000-11-21 | 2002-08-09 | Seiko Epson Corp | Color filter manufacturing method and manufacturing apparatus, liquid crystal device manufacturing method and manufacturing apparatus, EL device manufacturing method and manufacturing apparatus, inkjet head control apparatus, material discharging method and material discharging apparatus, and electronic equipment |
JP5110744B2 (en) | 2000-12-21 | 2012-12-26 | フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー | Light emitting device and manufacturing method thereof |
WO2002052524A1 (en) * | 2000-12-22 | 2002-07-04 | Osram Opto Semiconductors Gmbh | Led-signal device for traffic lights |
US6686676B2 (en) * | 2001-04-30 | 2004-02-03 | General Electric Company | UV reflectors and UV-based light sources having reduced UV radiation leakage incorporating the same |
US6642652B2 (en) | 2001-06-11 | 2003-11-04 | Lumileds Lighting U.S., Llc | Phosphor-converted light emitting device |
JP3669299B2 (en) | 2001-07-12 | 2005-07-06 | 住友化学株式会社 | Methyl methacrylate resin composition and molded article thereof |
TW552726B (en) * | 2001-07-26 | 2003-09-11 | Matsushita Electric Works Ltd | Light emitting device in use of LED |
TW567619B (en) * | 2001-08-09 | 2003-12-21 | Matsushita Electric Ind Co Ltd | LED lighting apparatus and card-type LED light source |
JP4076329B2 (en) * | 2001-08-13 | 2008-04-16 | エイテックス株式会社 | LED bulb |
JP2003101078A (en) * | 2001-09-25 | 2003-04-04 | Toyoda Gosei Co Ltd | Light-emitting device |
JP3948650B2 (en) * | 2001-10-09 | 2007-07-25 | アバゴ・テクノロジーズ・イーシービーユー・アイピー(シンガポール)プライベート・リミテッド | Light emitting diode and manufacturing method thereof |
US6834979B1 (en) * | 2001-10-18 | 2004-12-28 | Ilight Technologies, Inc. | Illumination device for simulating neon lighting with reflector |
AU2002367196A1 (en) | 2001-12-29 | 2003-07-15 | Shichao Ge | A led and led lamp |
US7153015B2 (en) | 2001-12-31 | 2006-12-26 | Innovations In Optics, Inc. | Led white light optical system |
WO2003102464A1 (en) | 2002-06-04 | 2003-12-11 | Luna Glow Pty Ltd | Phosphorescent light cover or coating |
US7005310B2 (en) * | 2002-08-14 | 2006-02-28 | Renesas Technology Corporation | Manufacturing method of solid-state image sensing device |
US7800121B2 (en) * | 2002-08-30 | 2010-09-21 | Lumination Llc | Light emitting diode component |
US7224000B2 (en) * | 2002-08-30 | 2007-05-29 | Lumination, Llc | Light emitting diode component |
DE60330892D1 (en) * | 2002-11-08 | 2010-02-25 | Nichia Corp | LIGHT EMISSION ELEMENT, FLUORESIDE AND METHOD FOR PRODUCING A FLUOR |
US6821078B2 (en) * | 2002-11-21 | 2004-11-23 | Americhair Corporation | Motor vehicle chair system for physically disabled persons |
JP3716252B2 (en) * | 2002-12-26 | 2005-11-16 | ローム株式会社 | Light emitting device and lighting device |
US20040183081A1 (en) * | 2003-03-20 | 2004-09-23 | Alexander Shishov | Light emitting diode package with self dosing feature and methods of forming same |
US6903380B2 (en) * | 2003-04-11 | 2005-06-07 | Weldon Technologies, Inc. | High power light emitting diode |
EP2264798B1 (en) | 2003-04-30 | 2020-10-14 | Cree, Inc. | High powered light emitter packages with compact optics |
WO2004100213A2 (en) | 2003-05-05 | 2004-11-18 | Gelcore Llc | Led-based light bulb |
US6982045B2 (en) * | 2003-05-17 | 2006-01-03 | Phosphortech Corporation | Light emitting device having silicate fluorescent phosphor |
JP4259198B2 (en) * | 2003-06-18 | 2009-04-30 | 豊田合成株式会社 | Method for manufacturing wavelength conversion unit for light emitting device and method for manufacturing light emitting device |
US7391153B2 (en) | 2003-07-17 | 2008-06-24 | Toyoda Gosei Co., Ltd. | Light emitting device provided with a submount assembly for improved thermal dissipation |
JP4366139B2 (en) * | 2003-07-31 | 2009-11-18 | 株式会社朝日ラバー | Lighting system design system, design method, and program thereof |
US20050052885A1 (en) * | 2003-09-04 | 2005-03-10 | Amazing International Enterprise Limited | Structure of LED decoration lighting set |
JP4691955B2 (en) | 2003-10-28 | 2011-06-01 | 日亜化学工業株式会社 | Fluorescent substance and light emitting device |
US20050110387A1 (en) | 2003-11-25 | 2005-05-26 | Luna Technologies International, Inc. | Photoluminescent sleeve for electric lamps for producing a non-electrical light emitting source |
EP1711739A4 (en) | 2004-01-28 | 2008-07-23 | Tir Technology Lp | LUMINAIRE DIRECTLY VISIBLE |
US20050242711A1 (en) | 2004-04-30 | 2005-11-03 | Joseph Bloomfield | Multi-color solid state light emitting device |
US20050243550A1 (en) * | 2004-04-30 | 2005-11-03 | Albert Stekelenburg | LED bulb |
US7315119B2 (en) * | 2004-05-07 | 2008-01-01 | Avago Technologies Ip (Singapore) Pte Ltd | Light-emitting device having a phosphor particle layer with specific thickness |
CA2466979A1 (en) * | 2004-05-18 | 2005-11-18 | Dimitar Prodanov | Stereometric superluminescent light emitting diodes (sleds) |
JP2005332951A (en) * | 2004-05-19 | 2005-12-02 | Toyoda Gosei Co Ltd | Light emitting device |
US20060007690A1 (en) | 2004-07-07 | 2006-01-12 | Tsian-Lin Cheng | LED lamp |
US7674005B2 (en) | 2004-07-29 | 2010-03-09 | Focal Point, Llc | Recessed sealed lighting fixture |
US7601276B2 (en) * | 2004-08-04 | 2009-10-13 | Intematix Corporation | Two-phase silicate-based yellow phosphor |
US7273300B2 (en) * | 2004-08-06 | 2007-09-25 | Lumination Llc | Curvilinear LED light source |
US7256057B2 (en) * | 2004-09-11 | 2007-08-14 | 3M Innovative Properties Company | Methods for producing phosphor based light sources |
KR100666265B1 (en) * | 2004-10-18 | 2007-01-09 | 엘지이노텍 주식회사 | Phosphor and light emitting device using same |
US20060092644A1 (en) | 2004-10-28 | 2006-05-04 | Mok Thye L | Small package high efficiency illuminator design |
US7858408B2 (en) | 2004-11-15 | 2010-12-28 | Koninklijke Philips Electronics N.V. | LED with phosphor tile and overmolded phosphor in lens |
US7671529B2 (en) * | 2004-12-10 | 2010-03-02 | Philips Lumileds Lighting Company, Llc | Phosphor converted light emitting device |
US7541728B2 (en) * | 2005-01-14 | 2009-06-02 | Intematix Corporation | Display device with aluminate-based green phosphors |
KR100682874B1 (en) * | 2005-05-02 | 2007-02-15 | 삼성전기주식회사 | White LED |
JP4697405B2 (en) * | 2005-05-23 | 2011-06-08 | 信越化学工業株式会社 | Silicone resin composition for lens molding and silicone lens |
US20060270808A1 (en) * | 2005-05-24 | 2006-11-30 | Shin-Etsu Chemical Co., Ltd. | Epoxy-silicone mixed resin composition, cured article thereof, and light-emitting semiconductor device |
US7357530B2 (en) * | 2005-07-15 | 2008-04-15 | Bwt Property, Inc. | Lighting apparatus for navigational aids |
KR100665222B1 (en) * | 2005-07-26 | 2007-01-09 | 삼성전기주식회사 | LED package using diffusion material and manufacturing method thereof |
KR100651550B1 (en) * | 2005-08-18 | 2006-11-29 | 삼성전기주식회사 | Lens for LED light source composed of upper, middle and lower |
US7281819B2 (en) * | 2005-10-25 | 2007-10-16 | Chip Hope Co., Ltd. | LED traffic light structure |
KR100771806B1 (en) | 2005-12-20 | 2007-10-30 | 삼성전기주식회사 | White light emitting device |
WO2007085977A1 (en) | 2006-01-24 | 2007-08-02 | Philips Intellectual Property & Standards Gmbh | Light-emitting device |
US7937865B2 (en) * | 2006-03-08 | 2011-05-10 | Intematix Corporation | Light emitting sign and display surface therefor |
US9084328B2 (en) * | 2006-12-01 | 2015-07-14 | Cree, Inc. | Lighting device and lighting method |
EP2013315A2 (en) | 2006-04-27 | 2009-01-14 | Philips Intellectual Property & Standards GmbH | Illumination system comprising a radiation source and a luminescent material |
JP2009535851A (en) | 2006-05-02 | 2009-10-01 | スーパーバルブス・インコーポレイテッド | Method of light dispersion and preferential scattering of light of a predetermined wavelength for light-emitting diodes and light bulb constituted thereby |
US20080029720A1 (en) * | 2006-08-03 | 2008-02-07 | Intematix Corporation | LED lighting arrangement including light emitting phosphor |
EP2074668B1 (en) | 2006-10-10 | 2018-02-28 | Tridonic Jennersdorf GmbH | Phosphor-converted light emitting diode |
US20080246044A1 (en) * | 2007-04-09 | 2008-10-09 | Siew It Pang | LED device with combined Reflector and Spherical Lens |
US7999283B2 (en) * | 2007-06-14 | 2011-08-16 | Cree, Inc. | Encapsulant with scatterer to tailor spatial emission pattern and color uniformity in light emitting diodes |
US7942556B2 (en) | 2007-06-18 | 2011-05-17 | Xicato, Inc. | Solid state illumination device |
US7661842B2 (en) * | 2007-07-25 | 2010-02-16 | I-Chiun Precision Industry Co., Ltd. | Structure of a supporting assembly for surface mount device LED and manufacturing method thereof |
KR101374897B1 (en) | 2007-08-14 | 2014-03-17 | 서울반도체 주식회사 | Led package with diffusion means |
US11114594B2 (en) * | 2007-08-24 | 2021-09-07 | Creeled, Inc. | Light emitting device packages using light scattering particles of different size |
US7588351B2 (en) | 2007-09-27 | 2009-09-15 | Osram Sylvania Inc. | LED lamp with heat sink optic |
US7984999B2 (en) | 2007-10-17 | 2011-07-26 | Xicato, Inc. | Illumination device with light emitting diodes and moveable light adjustment member |
TW200938768A (en) | 2008-01-22 | 2009-09-16 | Koninkl Philips Electronics Nv | Illumination device with LED and a transmissive support comprising a luminescent material |
US7815338B2 (en) | 2008-03-02 | 2010-10-19 | Altair Engineering, Inc. | LED lighting unit including elongated heat sink and elongated lens |
JP5355030B2 (en) | 2008-04-24 | 2013-11-27 | シチズンホールディングス株式会社 | LED light source and chromaticity adjustment method of LED light source |
US9287469B2 (en) * | 2008-05-02 | 2016-03-15 | Cree, Inc. | Encapsulation for phosphor-converted white light emitting diode |
US8274215B2 (en) * | 2008-12-15 | 2012-09-25 | Intematix Corporation | Nitride-based, red-emitting phosphors |
US20090283721A1 (en) * | 2008-05-19 | 2009-11-19 | Intematix Corporation | Nitride-based red phosphors |
US7618157B1 (en) | 2008-06-25 | 2009-11-17 | Osram Sylvania Inc. | Tubular blue LED lamp with remote phosphor |
WO2010014925A2 (en) * | 2008-07-31 | 2010-02-04 | Ming Solar, Inc. | Wireless autonomous solar-powered outdoor lighting and energy and information management network |
CN102159880B (en) | 2008-09-23 | 2014-07-30 | 皇家飞利浦电子股份有限公司 | Illumination device with electrical variable scattering element and use of electrical variable scattering element |
JP2012504860A (en) | 2008-10-01 | 2012-02-23 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | LED with particles in encapsulant for increased light extraction and non-yellow off-state color |
US7936802B2 (en) | 2008-10-21 | 2011-05-03 | Case Western Reserve University | Co-extruded multilayer polymers films for all-polymer lasers |
DE102008054029A1 (en) | 2008-10-30 | 2010-05-06 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor device |
US9052416B2 (en) | 2008-11-18 | 2015-06-09 | Cree, Inc. | Ultra-high efficacy semiconductor light emitting devices |
WO2010058808A1 (en) | 2008-11-19 | 2010-05-27 | ローム株式会社 | Led lamp |
JP2010129300A (en) | 2008-11-26 | 2010-06-10 | Keiji Iimura | Semiconductor light-emitting lamp and electric-bulb-shaped semiconductor light-emitting lamp |
JP2010171342A (en) | 2009-01-26 | 2010-08-05 | Sony Corp | Color conversion member, method of manufacturing the same, light-emitting device, and display |
JP2010199145A (en) | 2009-02-23 | 2010-09-09 | Ushio Inc | Light source equipment |
US8597963B2 (en) | 2009-05-19 | 2013-12-03 | Intematix Corporation | Manufacture of light emitting devices with phosphor wavelength conversion |
EP2446190A4 (en) | 2009-06-23 | 2013-02-20 | Ilumisys Inc | Led lamp with a wavelength converting layer |
US8110839B2 (en) | 2009-07-13 | 2012-02-07 | Luxingtek, Ltd. | Lighting device, display, and method for manufacturing the same |
CN101994940B (en) | 2009-08-19 | 2015-04-01 | Lg伊诺特有限公司 | Lighting device |
TW201116775A (en) | 2009-11-02 | 2011-05-16 | Ledtech Electronics Corp | LDE lighting device |
US20110149548A1 (en) * | 2009-12-22 | 2011-06-23 | Intematix Corporation | Light emitting diode based linear lamps |
CN201621505U (en) | 2010-02-04 | 2010-11-03 | 东莞市坤广光电有限公司 | LED fluorescent tube with heat dissipation function |
US8771577B2 (en) | 2010-02-16 | 2014-07-08 | Koninklijke Philips N.V. | Light emitting device with molded wavelength converting layer |
US8931933B2 (en) | 2010-03-03 | 2015-01-13 | Cree, Inc. | LED lamp with active cooling element |
US20110227102A1 (en) | 2010-03-03 | 2011-09-22 | Cree, Inc. | High efficacy led lamp with remote phosphor and diffuser configuration |
JP4792531B2 (en) | 2010-03-15 | 2011-10-12 | 兵治 新山 | Light emitting device |
CN201628127U (en) | 2010-04-15 | 2010-11-10 | 台州立发电子有限公司 | LED fluorescent lamp |
US20110280036A1 (en) | 2010-05-12 | 2011-11-17 | Aqua-Tech Optical Corporation | Light guide module and manufacturing method thereof |
CN102261577B (en) | 2010-05-31 | 2014-05-07 | 光宝电子(广州)有限公司 | Light emitting diode lamp tube |
CN101881387A (en) | 2010-06-10 | 2010-11-10 | 鸿富锦精密工业(深圳)有限公司 | LED fluorescent lamp |
US20110303940A1 (en) | 2010-06-14 | 2011-12-15 | Hyo Jin Lee | Light emitting device package using quantum dot, illumination apparatus and display apparatus |
US8506105B2 (en) | 2010-08-25 | 2013-08-13 | Generla Electric Company | Thermal management systems for solid state lighting and other electronic systems |
US20130271971A1 (en) | 2010-09-27 | 2013-10-17 | Toshiba Lighting & Technology Corporation | Light-emitting circuit and luminaire |
CN101975345B (en) | 2010-10-28 | 2013-05-08 | 鸿富锦精密工业(深圳)有限公司 | LED (Light Emitting Diode) fluorescent lamp |
KR20120137719A (en) | 2011-06-13 | 2012-12-24 | 주식회사 포스코엘이디 | Omnidirectional lamp |
EP3121507A1 (en) | 2011-07-15 | 2017-01-25 | LG Innotek Co., Ltd. | Lighting device |
US10823347B2 (en) | 2011-07-24 | 2020-11-03 | Ideal Industries Lighting Llc | Modular indirect suspended/ceiling mount fixture |
US8905575B2 (en) | 2012-02-09 | 2014-12-09 | Cree, Inc. | Troffer-style lighting fixture with specular reflector |
CN104334959B (en) | 2012-06-05 | 2019-01-22 | 飞利浦照明控股有限公司 | Lighting device with remote wavelength conversion layer |
EP3008377B1 (en) | 2013-06-03 | 2017-11-01 | Philips Lighting Holding B.V. | Tubular lighting device |
US9267650B2 (en) | 2013-10-09 | 2016-02-23 | Ilumisys, Inc. | Lens for an LED-based light |
-
2006
- 2006-12-15 US US11/640,533 patent/US20080029720A1/en not_active Abandoned
-
2007
- 2007-08-02 EP EP07811039A patent/EP2055147A4/en not_active Withdrawn
- 2007-08-02 WO PCT/US2007/017299 patent/WO2008019041A2/en active Application Filing
- 2007-08-02 CN CN2010105254928A patent/CN102062359A/en active Pending
- 2007-08-02 KR KR1020097004371A patent/KR20090040360A/en not_active Application Discontinuation
- 2007-08-02 JP JP2009522877A patent/JP2009545888A/en active Pending
- 2007-08-03 TW TW102100038A patent/TW201316543A/en unknown
- 2007-08-03 TW TW096128666A patent/TWI392112B/en active
-
2009
- 2009-11-24 US US12/624,839 patent/US8067884B2/en not_active Expired - Fee Related
- 2009-11-24 US US12/624,900 patent/US20100067217A1/en not_active Abandoned
-
2011
- 2011-04-15 US US13/087,615 patent/US20110187262A1/en not_active Abandoned
-
2012
- 2012-03-30 US US13/436,507 patent/US20120182715A1/en not_active Abandoned
- 2012-03-30 US US13/436,471 patent/US20120187822A1/en not_active Abandoned
- 2012-03-30 US US13/436,329 patent/US20120187823A1/en not_active Abandoned
- 2012-04-06 US US13/441,714 patent/US9045688B2/en active Active
-
2013
- 2013-07-25 JP JP2013154964A patent/JP2013254972A/en active Pending
-
2015
- 2015-06-01 US US14/727,814 patent/US9595644B2/en active Active
Patent Citations (99)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3593055A (en) * | 1969-04-16 | 1971-07-13 | Bell Telephone Labor Inc | Electro-luminescent device |
US3676668A (en) * | 1969-12-29 | 1972-07-11 | Gen Electric | Solid state lamp assembly |
US3691482A (en) * | 1970-01-19 | 1972-09-12 | Bell Telephone Labor Inc | Display system |
US3709685A (en) * | 1970-02-19 | 1973-01-09 | Ilford Ltd | Photoconductive zinc oxide sensitized by substituted thiazolidene dyes |
US4104076A (en) * | 1970-03-17 | 1978-08-01 | Saint-Gobain Industries | Manufacture of novel grey and bronze glasses |
US3670193A (en) * | 1970-05-14 | 1972-06-13 | Duro Test Corp | Electric lamps producing energy in the visible and ultra-violet ranges |
US3793046A (en) * | 1970-12-04 | 1974-02-19 | Philips Corp | Method of manufacturing a pigment |
US3743833A (en) * | 1971-07-16 | 1973-07-03 | Eastman Kodak Co | Radiographic elements and binders |
US3875456A (en) * | 1972-04-04 | 1975-04-01 | Hitachi Ltd | Multi-color semiconductor lamp |
US3932881A (en) * | 1972-09-05 | 1976-01-13 | Nippon Electric Co., Inc. | Electroluminescent device including dichroic and infrared reflecting components |
US3819973A (en) * | 1972-11-02 | 1974-06-25 | A Hosford | Electroluminescent filament |
US3819974A (en) * | 1973-03-12 | 1974-06-25 | D Stevenson | Gallium nitride metal-semiconductor junction light emitting diode |
US3972717A (en) * | 1973-03-21 | 1976-08-03 | Hoechst Aktiengesellschaft | Electrophotographic recording material |
US3937998A (en) * | 1973-10-05 | 1976-02-10 | U.S. Philips Corporation | Luminescent coating for low-pressure mercury vapour discharge lamp |
US4047075A (en) * | 1975-03-01 | 1977-09-06 | Licentia-Patent-Verwaltungs-G.M.B.H. | Encapsulated light-emitting diode structure and array thereof |
US4143394A (en) * | 1976-07-30 | 1979-03-06 | Licentia Patent-Verwaltungs-G.M.B.H. | Semiconductor luminescence device with housing |
US4191943A (en) * | 1976-10-18 | 1980-03-04 | Fairchild Camera And Instrument Corporation | Filler-in-plastic light-scattering cover |
US4211955A (en) * | 1978-03-02 | 1980-07-08 | Ray Stephen W | Solid state lamp |
US4315192A (en) * | 1979-12-31 | 1982-02-09 | Westinghouse Electric Corp. | Fluorescent lamp using high performance phosphor blend which is protected from color shifts by a very thin overcoat of stable phosphor of similar chromaticity |
US4443532A (en) * | 1981-07-29 | 1984-04-17 | Bell Telephone Laboratories, Incorporated | Induced crystallographic modification of aromatic compounds |
US4667036A (en) * | 1983-08-27 | 1987-05-19 | Basf Aktiengesellschaft | Concentration of light over a particular area, and novel perylene-3,4,9,10-tetracarboxylic acid diimides |
US4573766A (en) * | 1983-12-19 | 1986-03-04 | Cordis Corporation | LED Staggered back lighting panel for LCD module |
US4678285A (en) * | 1984-01-13 | 1987-07-07 | Ricoh Company, Ltd. | Liquid crystal color display device |
US4772885A (en) * | 1984-11-22 | 1988-09-20 | Ricoh Company, Ltd. | Liquid crystal color display device |
US4638214A (en) * | 1985-03-25 | 1987-01-20 | General Electric Company | Fluorescent lamp containing aluminate phosphor |
US4727003A (en) * | 1985-09-30 | 1988-02-23 | Ricoh Company, Ltd. | Electroluminescence device |
US4845223A (en) * | 1985-12-19 | 1989-07-04 | Basf Aktiengesellschaft | Fluorescent aryloxy-substituted perylene-3,4,9,10-tetracarboxylic acid diimides |
US4946621A (en) * | 1986-04-29 | 1990-08-07 | Centre National De La Recherche Scientifique (Cnrs) | Luminescent mixed borates based on rare earths |
US4859539A (en) * | 1987-03-23 | 1989-08-22 | Eastman Kodak Company | Optically brightened polyolefin coated paper support |
US5110931A (en) * | 1987-11-27 | 1992-05-05 | Hoechst Aktiengesellschaft | Process for the preparation of n,n'-dimethylperylene-3,4,9,10-tetracarboxylic diimide in high-hiding pigment form |
US5141916A (en) * | 1988-09-22 | 1992-08-25 | Nitto Denko Corporation | Thermal transfer image reception paper |
US4915478A (en) * | 1988-10-05 | 1990-04-10 | The United States Of America As Represented By The Secretary Of The Navy | Low power liquid crystal display backlight |
US4918497A (en) * | 1988-12-14 | 1990-04-17 | Cree Research, Inc. | Blue light emitting diode formed in silicon carbide |
US5126214A (en) * | 1989-03-15 | 1992-06-30 | Idemitsu Kosan Co., Ltd. | Electroluminescent element |
US4992704A (en) * | 1989-04-17 | 1991-02-12 | Basic Electronics, Inc. | Variable color light emitting diode |
US5131916A (en) * | 1990-03-01 | 1992-07-21 | Bayer Aktiengesellschaft | Colored fluorescent polymer emulsions for marker pens: graft copolymers and fluorescent dyes in aqueous phase |
US5210051A (en) * | 1990-03-27 | 1993-05-11 | Cree Research, Inc. | High efficiency light emitting diodes from bipolar gallium nitride |
US5143438A (en) * | 1990-10-15 | 1992-09-01 | Thorn Emi Plc | Light sources |
US5237182A (en) * | 1990-11-29 | 1993-08-17 | Sharp Kabushiki Kaisha | Electroluminescent device of compound semiconductor with buffer layer |
US5143433A (en) * | 1991-11-01 | 1992-09-01 | Litton Systems Canada Limited | Night vision backlighting system for liquid crystal displays |
US5439971A (en) * | 1991-11-12 | 1995-08-08 | Eastman Chemical Company | Fluorescent pigment concentrates |
US5208462A (en) * | 1991-12-19 | 1993-05-04 | Allied-Signal Inc. | Wide bandwidth solid state optical source |
US5211467A (en) * | 1992-01-07 | 1993-05-18 | Rockwell International Corporation | Fluorescent lighting system |
US5283425A (en) * | 1992-02-06 | 1994-02-01 | Rohm Co., Ltd. | Light emitting element array substrate with reflecting means |
US5763901A (en) * | 1992-12-17 | 1998-06-09 | Kabushiki Kaisha Toshiba | Semiconductor light-emitting device and method for manufacturing the device |
US5518808A (en) * | 1992-12-18 | 1996-05-21 | E. I. Du Pont De Nemours And Company | Luminescent materials prepared by coating luminescent compositions onto substrate particles |
US5869199A (en) * | 1993-03-26 | 1999-02-09 | Sumitomo Electric Industries, Ltd. | Organic electroluminescent elements comprising triazoles |
US5557168A (en) * | 1993-04-02 | 1996-09-17 | Okaya Electric Industries Co., Ltd. | Gas-discharging type display device and a method of manufacturing |
US5405709A (en) * | 1993-09-13 | 1995-04-11 | Eastman Kodak Company | White light emitting internal junction organic electroluminescent device |
US5619356A (en) * | 1993-09-16 | 1997-04-08 | Sharp Kabushiki Kaisha | Reflective liquid crystal display device having a compensator with a retardation value between 0.15 μm and 0.38 μm and a single polarizer |
US5770887A (en) * | 1993-10-08 | 1998-06-23 | Mitsubishi Cable Industries, Ltd. | GaN single crystal |
US5535230A (en) * | 1994-04-06 | 1996-07-09 | Shogo Tzuzuki | Illuminating light source device using semiconductor laser element |
US5771039A (en) * | 1994-06-06 | 1998-06-23 | Ditzik; Richard J. | Direct view display device integration techniques |
US5777350A (en) * | 1994-12-02 | 1998-07-07 | Nichia Chemical Industries, Ltd. | Nitride semiconductor light-emitting device |
US5660461A (en) * | 1994-12-08 | 1997-08-26 | Quantum Devices, Inc. | Arrays of optoelectronic devices and method of making same |
US20060049416A1 (en) * | 1996-03-26 | 2006-03-09 | Bruce Baretz | Solid state white light emitter and display using same |
US7943945B2 (en) * | 1996-03-26 | 2011-05-17 | Cree, Inc. | Solid state white light emitter and display using same |
US20040016938A1 (en) * | 1996-03-26 | 2004-01-29 | Bruce Baretz | Solid state white light emitter and display using same |
US6600175B1 (en) * | 1996-03-26 | 2003-07-29 | Advanced Technology Materials, Inc. | Solid state white light emitter and display using same |
US20010000622A1 (en) * | 1996-06-26 | 2001-05-03 | Osram Opto Semiconductors Gmbh & Co., Ohg | Light-radiating semiconductor component with a luminescence conversion element |
US6576930B2 (en) * | 1996-06-26 | 2003-06-10 | Osram Opto Semiconductors Gmbh | Light-radiating semiconductor component with a luminescence conversion element |
US20040016908A1 (en) * | 1996-09-20 | 2004-01-29 | Klaus Hohn | Wavelength-converting casting composition and white light-emitting semiconductor component |
US5947587A (en) * | 1996-10-16 | 1999-09-07 | U.S. Philips Corporation | Signal lamp with LEDs |
US6340824B1 (en) * | 1997-09-01 | 2002-01-22 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device including a fluorescent material |
US6255670B1 (en) * | 1998-02-06 | 2001-07-03 | General Electric Company | Phosphors for light generation from light emitting semiconductors |
US6580097B1 (en) * | 1998-02-06 | 2003-06-17 | General Electric Company | Light emitting device with phosphor composition |
US5959316A (en) * | 1998-09-01 | 1999-09-28 | Hewlett-Packard Company | Multiple encapsulation of phosphor-LED devices |
US7220022B2 (en) * | 1999-02-12 | 2007-05-22 | Fiber Optic Designs, Inc. | Jacketed LED assemblies and light strings containing same |
US6680569B2 (en) * | 1999-02-18 | 2004-01-20 | Lumileds Lighting U.S. Llc | Red-deficiency compensating phosphor light emitting device |
US6504301B1 (en) * | 1999-09-03 | 2003-01-07 | Lumileds Lighting, U.S., Llc | Non-incandescent lightbulb package using light emitting diodes |
US6555958B1 (en) * | 2000-05-15 | 2003-04-29 | General Electric Company | Phosphor for down converting ultraviolet light of LEDs to blue-green light |
US6538375B1 (en) * | 2000-08-17 | 2003-03-25 | General Electric Company | Oled fiber light source |
US20020047516A1 (en) * | 2000-10-24 | 2002-04-25 | Tadanobu Iwasa | Fluorescent tube |
US6614170B2 (en) * | 2000-12-29 | 2003-09-02 | Arima Optoelectronics Corporation | Light emitting diode with light conversion using scattering optical media |
US6576488B2 (en) * | 2001-06-11 | 2003-06-10 | Lumileds Lighting U.S., Llc | Using electrophoresis to produce a conformally coated phosphor-converted light emitting semiconductor |
US20030038596A1 (en) * | 2001-08-21 | 2003-02-27 | Wen-Chih Ho | Light-mixing layer and method |
US20040104391A1 (en) * | 2001-09-03 | 2004-06-03 | Toshihide Maeda | Semiconductor light emitting device, light emitting apparatus and production method for semiconductor light emitting device |
US20030052595A1 (en) * | 2001-09-20 | 2003-03-20 | Patent-Treuhand-Gesellschaft Fur Elektrische Gluhlampen Mbh | Illumination unit having at least one LED as light source |
US20030102810A1 (en) * | 2001-11-30 | 2003-06-05 | Mule Lighting, Inc. | Retrofit light emitting diode tube |
US6860628B2 (en) * | 2002-07-17 | 2005-03-01 | Jonas J. Robertson | LED replacement for fluorescent lighting |
US7479662B2 (en) * | 2002-08-30 | 2009-01-20 | Lumination Llc | Coated LED with improved efficiency |
US6717353B1 (en) * | 2002-10-14 | 2004-04-06 | Lumileds Lighting U.S., Llc | Phosphor converted light emitting device |
US20050093430A1 (en) * | 2003-02-26 | 2005-05-05 | Cree, Inc. | Composite white light source and method for fabricating |
US6869812B1 (en) * | 2003-05-13 | 2005-03-22 | Heng Liu | High power AllnGaN based multi-chip light emitting diode |
US20050051782A1 (en) * | 2003-09-09 | 2005-03-10 | Negley Gerald H. | Transmissive optical elements including transparent plastic shell having a phosphor dispersed therein, and methods of fabricating same |
US7029935B2 (en) * | 2003-09-09 | 2006-04-18 | Cree, Inc. | Transmissive optical elements including transparent plastic shell having a phosphor dispersed therein, and methods of fabricating same |
US20050057917A1 (en) * | 2003-09-17 | 2005-03-17 | Yasushi Yatsuda | Light source and vehicle lamp |
US20050168127A1 (en) * | 2004-01-30 | 2005-08-04 | Shih-Chang Shei | [white light led] |
US7575697B2 (en) * | 2004-08-04 | 2009-08-18 | Intematix Corporation | Silicate-based green phosphors |
US7390437B2 (en) * | 2004-08-04 | 2008-06-24 | Intematix Corporation | Aluminate-based blue phosphors |
US20060028122A1 (en) * | 2004-08-04 | 2006-02-09 | Intematix Corporation | Novel silicate-based yellow-green phosphors |
US7943951B2 (en) * | 2005-06-17 | 2011-05-17 | Samsung Led Co., Ltd. | Light emitting device package |
US7655156B2 (en) * | 2005-08-03 | 2010-02-02 | Intematix Corporation | Silicate-based orange phosphors |
US20080111472A1 (en) * | 2006-11-10 | 2008-05-15 | Intematix Corporation | Aluminum-silicate based orange-red phosphors with mixed divalent and trivalent cations |
US7686478B1 (en) * | 2007-01-12 | 2010-03-30 | Ilight Technologies, Inc. | Bulb for light-emitting diode with color-converting insert |
US7972030B2 (en) * | 2007-03-05 | 2011-07-05 | Intematix Corporation | Light emitting diode (LED) based lighting systems |
US7663315B1 (en) * | 2007-07-24 | 2010-02-16 | Ilight Technologies, Inc. | Spherical bulb for light-emitting diode with spherical inner cavity |
US20110147778A1 (en) * | 2009-12-17 | 2011-06-23 | Nichia Corporation | Light emitting device |
US20120086034A1 (en) * | 2010-10-05 | 2012-04-12 | Intematix Corporation | Solid-state light emitting devices and signage with photoluminescence wavelength conversion |
Cited By (153)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8801253B2 (en) | 2003-03-26 | 2014-08-12 | Optim Llc | Illumination device |
US20090185392A1 (en) * | 2003-03-26 | 2009-07-23 | Optim, Inc. | Detachable illumination system |
US20100002414A1 (en) * | 2005-06-07 | 2010-01-07 | Noam Meir | Illumination Apparatus and Methods of Forming the Same |
US8579466B2 (en) | 2005-06-07 | 2013-11-12 | Oree, Inc. | Illumination apparatus and methods of forming the same |
US20090141476A1 (en) * | 2005-06-07 | 2009-06-04 | Noam Meir | Illumination Apparatus and Methods of Forming the Same |
US8128272B2 (en) | 2005-06-07 | 2012-03-06 | Oree, Inc. | Illumination apparatus |
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US20080027200A1 (en) * | 2006-07-26 | 2008-01-31 | Shin -Etsu Chemical Co., Ltd. | Phosphor-containing curable silicone composition for led and led light-emitting device using the composition |
US20110187262A1 (en) * | 2006-08-03 | 2011-08-04 | Intematix Corporation | Led lighting arrangement including light emitting phosphor |
US9595644B2 (en) | 2006-08-03 | 2017-03-14 | Intematix Corporation | LED lighting arrangement including light emitting phosphor |
US9884990B2 (en) | 2006-11-24 | 2018-02-06 | Ge Phosphors Technology, Llc | Phosphor, method of producing the same, and light emitting apparatus |
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US10259997B2 (en) | 2006-11-24 | 2019-04-16 | Ge Phosphors Technology, Llc | Phosphor, method of producing the same, and light emitting apparatus |
US20080214896A1 (en) * | 2007-01-10 | 2008-09-04 | Krupa Robert J | Endoscope with detachable elongation portion |
US20090066218A1 (en) * | 2007-09-06 | 2009-03-12 | Ben Fan | Method for generating low color temperature light and light emitting device adopting the same |
US7851990B2 (en) * | 2007-09-06 | 2010-12-14 | He Shan Lide Electronic Enterprise Company Ltd. | Method for generating low color temperature light and light emitting device adopting the same |
US20110013415A1 (en) * | 2007-12-19 | 2011-01-20 | Oree Inc. | Discrete light guide-based planar illumination area |
US20090290380A1 (en) * | 2007-12-19 | 2009-11-26 | Noam Meir | Waveguide-based packaging structures and methods for discrete lighting elements |
US20100272392A1 (en) * | 2007-12-19 | 2010-10-28 | Oree Inc. | Elimination of stitch artifacts in a planar illumination area |
US8550684B2 (en) | 2007-12-19 | 2013-10-08 | Oree, Inc. | Waveguide-based packaging structures and methods for discrete lighting elements |
US8542964B2 (en) * | 2007-12-19 | 2013-09-24 | Oree, Inc. | Waveguide sheet containing in-coupling, propagation, and out-coupling regions |
US8182128B2 (en) | 2007-12-19 | 2012-05-22 | Oree, Inc. | Planar white illumination apparatus |
US8459856B2 (en) | 2007-12-19 | 2013-06-11 | Oree, Inc. | Planar white illumination apparatus |
US7826698B1 (en) | 2007-12-19 | 2010-11-02 | Oree, Inc. | Elimination of stitch artifacts in a planar illumination area |
US8172447B2 (en) | 2007-12-19 | 2012-05-08 | Oree, Inc. | Discrete lighting elements and planar assembly thereof |
US20090161361A1 (en) * | 2007-12-19 | 2009-06-25 | Noam Meir | Discrete lighting elements and planar assembly thereof |
US8064743B2 (en) | 2007-12-19 | 2011-11-22 | Oree, Inc. | Discrete light guide-based planar illumination area |
US8238703B2 (en) | 2007-12-19 | 2012-08-07 | Oree Inc. | Waveguide sheet containing in-coupling, propagation, and out-coupling regions |
US20090161369A1 (en) * | 2007-12-19 | 2009-06-25 | Keren Regev | Waveguide sheet and methods for manufacturing the same |
US20090161341A1 (en) * | 2007-12-19 | 2009-06-25 | Noam Meir | Planar White Illumination Apparatus |
US8928025B2 (en) | 2007-12-20 | 2015-01-06 | Ilumisys, Inc. | LED lighting apparatus with swivel connection |
US20090190371A1 (en) * | 2008-01-24 | 2009-07-30 | Optim, Inc. | Monolithic illumination device |
US8231237B2 (en) | 2008-03-05 | 2012-07-31 | Oree, Inc. | Sub-assembly and methods for forming the same |
US20090225565A1 (en) * | 2008-03-05 | 2009-09-10 | Micha Zimmermann | Sub-assembly and methods for forming the same |
US20110182055A1 (en) * | 2008-03-19 | 2011-07-28 | I2Ic Corporation | Photoluminescent Light Source |
US8890186B2 (en) | 2008-03-28 | 2014-11-18 | Panasonic Corporation | Molded resin product, semiconductor light-emitting source, lighting device, and method for manufacturing molded resin product |
US20110084297A1 (en) * | 2008-03-28 | 2011-04-14 | Toshifumi Ogata | Molded resin product, semiconductor light-emitting source, lighting device, and method for manufacturing molded resin product |
US8807785B2 (en) | 2008-05-23 | 2014-08-19 | Ilumisys, Inc. | Electric shock resistant L.E.D. based light |
US20100220484A1 (en) * | 2008-07-10 | 2010-09-02 | Oree Inc. | Slim waveguide coupling apparatus and method |
US9164218B2 (en) | 2008-07-10 | 2015-10-20 | Oree, Inc. | Slim waveguide coupling apparatus and method |
US8297786B2 (en) | 2008-07-10 | 2012-10-30 | Oree, Inc. | Slim waveguide coupling apparatus and method |
US8301002B2 (en) | 2008-07-10 | 2012-10-30 | Oree, Inc. | Slim waveguide coupling apparatus and method |
US20100008628A1 (en) * | 2008-07-10 | 2010-01-14 | Yosi Shani | Slim waveguide coupling apparatus and method |
US20100033964A1 (en) * | 2008-08-08 | 2010-02-11 | Photonics & Co., Limited | Light emitting diode (led) lighting device |
US20100098377A1 (en) * | 2008-10-16 | 2010-04-22 | Noam Meir | Light confinement using diffusers |
US10560992B2 (en) | 2008-10-24 | 2020-02-11 | Ilumisys, Inc. | Light and light sensor |
US10342086B2 (en) | 2008-10-24 | 2019-07-02 | Ilumisys, Inc. | Integration of LED lighting with building controls |
US11333308B2 (en) | 2008-10-24 | 2022-05-17 | Ilumisys, Inc. | Light and light sensor |
US9635727B2 (en) | 2008-10-24 | 2017-04-25 | Ilumisys, Inc. | Light and light sensor |
US10973094B2 (en) | 2008-10-24 | 2021-04-06 | Ilumisys, Inc. | Integration of LED lighting with building controls |
US10932339B2 (en) | 2008-10-24 | 2021-02-23 | Ilumisys, Inc. | Light and light sensor |
US9353939B2 (en) | 2008-10-24 | 2016-05-31 | iLumisys, Inc | Lighting including integral communication apparatus |
US8946996B2 (en) | 2008-10-24 | 2015-02-03 | Ilumisys, Inc. | Light and light sensor |
US10182480B2 (en) | 2008-10-24 | 2019-01-15 | Ilumisys, Inc. | Light and light sensor |
US9398661B2 (en) | 2008-10-24 | 2016-07-19 | Ilumisys, Inc. | Light and light sensor |
US10036549B2 (en) | 2008-10-24 | 2018-07-31 | Ilumisys, Inc. | Lighting including integral communication apparatus |
US8901823B2 (en) | 2008-10-24 | 2014-12-02 | Ilumisys, Inc. | Light and light sensor |
US9585216B2 (en) | 2008-10-24 | 2017-02-28 | Ilumisys, Inc. | Integration of LED lighting with building controls |
US9101026B2 (en) | 2008-10-24 | 2015-08-04 | Ilumisys, Inc. | Integration of LED lighting with building controls |
US20100208469A1 (en) * | 2009-02-10 | 2010-08-19 | Yosi Shani | Illumination surfaces with reduced linear artifacts |
US9349924B2 (en) | 2009-03-19 | 2016-05-24 | Koninklijke Phililps N.V. | Illumination device with remote luminescent material |
US8624527B1 (en) | 2009-03-27 | 2014-01-07 | Oree, Inc. | Independently controllable illumination device |
US20100315817A1 (en) * | 2009-05-13 | 2010-12-16 | Oree Inc. | Low-profile illumination device |
US20100320904A1 (en) * | 2009-05-13 | 2010-12-23 | Oree Inc. | LED-Based Replacement Lamps for Incandescent Fixtures |
US8328406B2 (en) | 2009-05-13 | 2012-12-11 | Oree, Inc. | Low-profile illumination device |
US20100296309A1 (en) * | 2009-05-20 | 2010-11-25 | Foxsemicon Integrated Technology, Inc. | Illumination device |
US8246209B2 (en) | 2009-05-20 | 2012-08-21 | Foxsemicon Integrated Technology, Inc. | Illumination device |
US20100314996A1 (en) * | 2009-06-11 | 2010-12-16 | Van De Ven Antony P | Hot light emitting diode (led) lighting systems and methods |
US9074737B2 (en) | 2009-06-11 | 2015-07-07 | Cree, Inc. | Hot light emitting diode (LED) lighting systems |
US8217567B2 (en) * | 2009-06-11 | 2012-07-10 | Cree, Inc. | Hot light emitting diode (LED) lighting systems |
EP2446190A2 (en) * | 2009-06-23 | 2012-05-02 | Altair Engineering, Inc. | Led lamp with a wavelength converting layer |
EP2446190A4 (en) * | 2009-06-23 | 2013-02-20 | Ilumisys Inc | Led lamp with a wavelength converting layer |
US8727597B2 (en) | 2009-06-24 | 2014-05-20 | Oree, Inc. | Illumination apparatus with high conversion efficiency and methods of forming the same |
EP2491296A2 (en) * | 2009-10-22 | 2012-08-29 | Light Prescriptions Innovators, LLC. | Solid-state light bulb |
EP2491296A4 (en) * | 2009-10-22 | 2013-10-09 | Light Prescriptions Innovators | SEMICONDUCTOR ELECTRIC BULB |
EP2543060B1 (en) * | 2010-03-03 | 2021-06-16 | CreeLED, Inc. | Methods for application of optical materials to optical elements |
US9013119B2 (en) | 2010-03-26 | 2015-04-21 | Ilumisys, Inc. | LED light with thermoelectric generator |
US8840282B2 (en) | 2010-03-26 | 2014-09-23 | Ilumisys, Inc. | LED bulb with internal heat dissipating structures |
US20130092965A1 (en) * | 2010-03-30 | 2013-04-18 | Naoto Kijima | Light emitting device |
US8835199B2 (en) | 2010-07-28 | 2014-09-16 | GE Lighting Solutions, LLC | Phosphor suspended in silicone, molded/formed and used in a remote phosphor configuration |
WO2012015726A1 (en) * | 2010-07-28 | 2012-02-02 | GE Lighting Solutions, LLC | Phosphor suspended in silicone, molded/formed and used in a remote phosphor configuration |
US8513872B2 (en) | 2010-08-05 | 2013-08-20 | Sharp Kabushiki Kaisha | Light emitting apparatus and method for manufacturing thereof |
US8534901B2 (en) | 2010-09-13 | 2013-09-17 | Teledyne Reynolds, Inc. | Collimating waveguide apparatus and method |
US9140429B2 (en) | 2010-10-14 | 2015-09-22 | Cree, Inc. | Optical element edge treatment for lighting device |
US9335029B2 (en) | 2010-10-14 | 2016-05-10 | Cree, Inc. | Lighting device with remote lumiphor and non-planar optical element |
US8894430B2 (en) | 2010-10-29 | 2014-11-25 | Ilumisys, Inc. | Mechanisms for reducing risk of shock during installation of light tube |
US8491140B2 (en) | 2010-11-05 | 2013-07-23 | Cree, Inc. | Lighting device with multiple emitters and remote lumiphor |
US20140009959A1 (en) * | 2011-03-22 | 2014-01-09 | Lg Innotek Co., Ltd. | Display device and light conversion member |
US9976722B2 (en) * | 2011-03-22 | 2018-05-22 | Lg Innotek Co., Ltd. | Display device and light conversion member |
CN102185082A (en) * | 2011-04-08 | 2011-09-14 | 深圳市华星光电技术有限公司 | Light-emitting diode structure and light-emitting diode structure manufacturing method |
US8608328B2 (en) | 2011-05-06 | 2013-12-17 | Teledyne Technologies Incorporated | Light source with secondary emitter conversion element |
US9290618B2 (en) | 2011-08-05 | 2016-03-22 | Sabic Global Technologies B.V. | Polycarbonate compositions having enhanced optical properties, methods of making and articles comprising the polycarbonate compositions |
US9957351B2 (en) | 2011-08-05 | 2018-05-01 | Sabic Global Technologies B.V. | Polycarbonate compositions having enhanced optical properties, methods of making and articles comprising the polycarbonate compositions |
US9897276B2 (en) * | 2011-08-26 | 2018-02-20 | Cree, Inc. | Reduced phosphor lighting devices |
US20130050979A1 (en) * | 2011-08-26 | 2013-02-28 | Antony P. Van de Ven | Reduced phosphor lighting devices |
US9222640B2 (en) * | 2011-10-18 | 2015-12-29 | Tsmc Solid State Lighting Ltd. | Coated diffuser cap for LED illumination device |
US20130094180A1 (en) * | 2011-10-18 | 2013-04-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Coated diffuser cap for led illumination device |
US8962117B2 (en) | 2011-10-27 | 2015-02-24 | Sabic Global Technologies B.V. | Process for producing bisphenol A with reduced sulfur content, polycarbonate made from the bisphenol A, and containers formed from the polycarbonate |
US9039244B2 (en) | 2011-11-16 | 2015-05-26 | Oree, Inc. | Illumination apparatus confining light by total internal reflection and methods of forming the same |
US8840276B2 (en) | 2011-11-16 | 2014-09-23 | Oree, Inc. | Illumination apparatus confining light by total internal reflection and methods of forming the same |
US8591072B2 (en) | 2011-11-16 | 2013-11-26 | Oree, Inc. | Illumination apparatus confining light by total internal reflection and methods of forming the same |
CN104205376A (en) * | 2012-02-03 | 2014-12-10 | 沙特基础创新塑料Ip私人有限责任公司 | Light emitting diode device and method for production thereof containing conversion material chemistry |
US9711695B2 (en) | 2012-02-03 | 2017-07-18 | Sabic Global Technologies B.V. | Light emitting diode device and method for production thereof containing conversion material chemistry |
US9490405B2 (en) * | 2012-02-03 | 2016-11-08 | Sabic Innovative Plastics Ip B.V. | Light emitting diode device and method for production thereof containing conversion material chemistry |
US20130200415A1 (en) * | 2012-02-03 | 2013-08-08 | Sabic Innovative Plastics Ip B.V. | Light emitting diode device and method for production thereof containing conversion material chemistry |
WO2013116697A1 (en) * | 2012-02-03 | 2013-08-08 | Sabic Innovative Plastics Ip B.V. | Light emitting diode device and method for production thereof containing conversion material chemistry |
US9299898B2 (en) | 2012-02-29 | 2016-03-29 | Sabic Global Technologies B.V. | Polycarbonate compositions containing conversion material chemistry and having enhanced optical properties, methods of making and articles comprising the same |
US9771452B2 (en) | 2012-02-29 | 2017-09-26 | Sabic Global Technologies B.V. | Plastic composition comprising a polycarbonate made from low sulfur bisphenol A, and articles made therefrom |
US9287471B2 (en) | 2012-02-29 | 2016-03-15 | Sabic Global Technologies B.V. | Polycarbonate compositions containing conversion material chemistry and having enhanced optical properties, methods of making and articles comprising the same |
WO2013182950A1 (en) * | 2012-06-05 | 2013-12-12 | Koninklijke Philips N.V. | Lighting device having a remote wave length converting layer |
US9482424B2 (en) | 2012-06-05 | 2016-11-01 | Koninklijke Philips Electronics N.V. | Lighting device having a remote wavelength converting layer |
US9857519B2 (en) | 2012-07-03 | 2018-01-02 | Oree Advanced Illumination Solutions Ltd. | Planar remote phosphor illumination apparatus |
US9807842B2 (en) | 2012-07-09 | 2017-10-31 | Ilumisys, Inc. | System and method for controlling operation of an LED-based light |
KR101961312B1 (en) | 2012-10-25 | 2019-03-22 | 사빅 글로벌 테크놀러지스 비.브이. | Light emitting diode devices, method of manufacture, uses thereof |
CN104918992A (en) * | 2012-10-25 | 2015-09-16 | 沙特基础全球技术有限公司 | Light emitting diode devices, method of manufacture, uses thereof |
US20140117393A1 (en) * | 2012-10-25 | 2014-05-01 | Sabic Innovative Plastics Ip B.V. | Light emitting diode devices, method of manufacture, uses thereof |
US9821523B2 (en) * | 2012-10-25 | 2017-11-21 | Sabic Global Technologies B.V. | Light emitting diode devices, method of manufacture, uses thereof |
KR20150079783A (en) * | 2012-10-25 | 2015-07-08 | 사빅 글로벌 테크놀러지스 비.브이. | Light emitting diode devices, method of manufacture, uses thereof |
US10557594B2 (en) | 2012-12-28 | 2020-02-11 | Intematix Corporation | Solid-state lamps utilizing photoluminescence wavelength conversion components |
US9346949B2 (en) | 2013-02-12 | 2016-05-24 | Sabic Global Technologies B.V. | High reflectance polycarbonate |
US10288260B2 (en) | 2013-03-04 | 2019-05-14 | Shin-Etsu Chemical Co., Ltd. | Turn signal for vehicle |
EP2985516A4 (en) * | 2013-03-04 | 2016-11-09 | Shinetsu Chemical Co | Turn signal for vehicle |
TWI620348B (en) * | 2013-03-13 | 2018-04-01 | 皇家飛利浦有限公司 | Encapsulating a light-emitting diode lens with a bottom reflector |
US20160049561A1 (en) * | 2013-03-13 | 2016-02-18 | Koninklijke Philips N.V. | Encapsulated led lens with bottom reflectors |
US10355182B2 (en) * | 2013-03-13 | 2019-07-16 | Lumileds Llc | Encapsulated LED lens with bottom reflectors |
US9285084B2 (en) | 2013-03-14 | 2016-03-15 | Ilumisys, Inc. | Diffusers for LED-based lights |
US9587790B2 (en) | 2013-03-15 | 2017-03-07 | Cree, Inc. | Remote lumiphor solid state lighting devices with enhanced light extraction |
US20230219311A1 (en) * | 2013-05-10 | 2023-07-13 | Abl Ip Holding Llc | Silicone optics |
US9553244B2 (en) | 2013-05-16 | 2017-01-24 | Sabic Global Technologies B.V. | Branched polycarbonate compositions having conversion material chemistry and articles thereof |
US9006378B2 (en) | 2013-05-29 | 2015-04-14 | Sabic Global Technologies B.V. | Color stable thermoplastic composition |
US9772086B2 (en) | 2013-05-29 | 2017-09-26 | Sabic Innovative Plastics Ip B.V. | Illuminating devices with color stable thermoplastic light transmitting articles |
US9267650B2 (en) | 2013-10-09 | 2016-02-23 | Ilumisys, Inc. | Lens for an LED-based light |
US20150198319A1 (en) * | 2013-11-21 | 2015-07-16 | Ford Glaobal Technologies, LLC | Photoluminescent dynamic lighting |
US9212809B2 (en) * | 2013-11-21 | 2015-12-15 | Ford Global Technologies, Llc | Photoluminescent dynamic lighting |
US10260686B2 (en) | 2014-01-22 | 2019-04-16 | Ilumisys, Inc. | LED-based light with addressed LEDs |
US9574717B2 (en) | 2014-01-22 | 2017-02-21 | Ilumisys, Inc. | LED-based light with addressed LEDs |
US20150252965A1 (en) * | 2014-03-07 | 2015-09-10 | Intematix Corporation | Solid-state linear lighting arrangements including light emitting phosphor |
US9510400B2 (en) | 2014-05-13 | 2016-11-29 | Ilumisys, Inc. | User input systems for an LED-based light |
RU2686587C2 (en) * | 2014-10-20 | 2019-04-29 | ФОРД ГЛОУБАЛ ТЕКНОЛОДЖИЗ, ЭлЭлСи | Photoluminescent dynamic light survey |
CN105526541A (en) * | 2014-10-20 | 2016-04-27 | 福特全球技术公司 | Photoluminescence dynamic illumination |
US10066160B2 (en) | 2015-05-01 | 2018-09-04 | Intematix Corporation | Solid-state white light generating lighting arrangements including photoluminescence wavelength conversion components |
US10690296B2 (en) | 2015-06-01 | 2020-06-23 | Ilumisys, Inc. | LED-based light with canted outer walls |
US11028972B2 (en) | 2015-06-01 | 2021-06-08 | Ilumisys, Inc. | LED-based light with canted outer walls |
US10161568B2 (en) | 2015-06-01 | 2018-12-25 | Ilumisys, Inc. | LED-based light with canted outer walls |
US11428370B2 (en) | 2015-06-01 | 2022-08-30 | Ilumisys, Inc. | LED-based light with canted outer walls |
CN106195917A (en) * | 2016-07-05 | 2016-12-07 | 深圳市圣诺光电科技有限公司 | A kind of line-type lamp fitting and preparation method thereof |
US11047747B2 (en) | 2017-03-27 | 2021-06-29 | Firouzeh Sabri | Light weight flexible temperature sensor kit |
WO2019011511A1 (en) | 2017-07-13 | 2019-01-17 | Tridonic Jennersdorf Gmbh | LED / LD LIGHTING DEVICE WITH SEPARATE FLUORESCENT CONFIGURATION AND METHOD FOR MANUFACTURING SUCH A |
DE102017212030A1 (en) | 2017-07-13 | 2019-01-17 | Tridonic Jennersdorf Gmbh | LED / LD lighting device with novel remote phosphor configuration and method of making such a |
US12027653B2 (en) | 2017-07-13 | 2024-07-02 | Tridonic Jennersdorf Gmbh | LED/LD illumination device with separate luminophore configuration, and method for producing same |
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KR20090040360A (en) | 2009-04-23 |
EP2055147A2 (en) | 2009-05-06 |
TWI392112B (en) | 2013-04-01 |
WO2008019041A2 (en) | 2008-02-14 |
US20110187262A1 (en) | 2011-08-04 |
JP2013254972A (en) | 2013-12-19 |
JP2009545888A (en) | 2009-12-24 |
TW200814377A (en) | 2008-03-16 |
US9595644B2 (en) | 2017-03-14 |
US20120187823A1 (en) | 2012-07-26 |
CN102062359A (en) | 2011-05-18 |
US20120182715A1 (en) | 2012-07-19 |
US20120187441A1 (en) | 2012-07-26 |
US20100067217A1 (en) | 2010-03-18 |
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US8067884B2 (en) | 2011-11-29 |
US20100067216A1 (en) | 2010-03-18 |
US20120187822A1 (en) | 2012-07-26 |
US20160141461A1 (en) | 2016-05-19 |
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US9045688B2 (en) | 2015-06-02 |
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