US10408545B2 - Cooling system and electronic equipment - Google Patents
Cooling system and electronic equipment Download PDFInfo
- Publication number
- US10408545B2 US10408545B2 US15/105,950 US201415105950A US10408545B2 US 10408545 B2 US10408545 B2 US 10408545B2 US 201415105950 A US201415105950 A US 201415105950A US 10408545 B2 US10408545 B2 US 10408545B2
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- Prior art keywords
- pipe
- refrigerant
- cooling system
- flexible pipe
- pipe port
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0208—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes using moving tubes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0241—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the tubes being flexible
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/06—Control arrangements therefor
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D2015/0216—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having particular orientation, e.g. slanted, or being orientation-independent
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
- F28F2265/12—Safety or protection arrangements; Arrangements for preventing malfunction for preventing overpressure
Definitions
- the present invention relates to an art for cooling equipment which generates heat, and particularly relates to a cooling system and electronic equipment.
- a cooling system described by PTL (Patent Literature) 1 absorbs heat discharged from a server by evaporating refrigerant liquid which flows in an evaporator.
- the cooling system discharges the heat absorbed by condensing heated refrigerant vapor in a cooling tower placed higher than the evaporator.
- a main object of the present invention is to provide an art for solving the above-mentioned problem.
- a cooling system includes a heat absorbing device which has a first pipe port and absorbs heat discharged from equipment by using refrigerant; a radiator which has a second pipe port placed higher than the first pipe port and cools the refrigerant; a first flexible pipe that is bendable and serves as a flow path of the refrigerant, the first flexible pipe being connected to the first pipe port at one end and the second pipe port at another end; and a loading table having a surface that rises in a vertical direction as a corresponding position onto the surface approaches from one end of the surface to another end, the surface supporting the first flexible pipe placed thereon in such a way that the first flexible pipe rises in the vertical direction as a corresponding position on the first flexible pipe approaches from a side connected to the first pipe port to a side connected to the second pipe port.
- electronic equipment includes the above cooling system.
- FIG. 1 is a side view showing structure of a cooling system according to a first exemplary embodiment of the present invention.
- FIG. 2 is a top view showing the structure of the cooling system according to the first exemplary embodiment of the present invention.
- FIG. 3 is a top view showing a state that a back door 2 is open.
- FIG. 4 is a top view showing a range in which the back door 2 moves in the event of an earthquake.
- FIG. 5 is a side view showing structure of a cooling system according to a second exemplary embodiment of the present invention.
- FIG. 6 is a side view showing structure of a cooling system according to a third exemplary embodiment of the present invention.
- FIG. 1 is a side view showing structure of a cooling system according to a first exemplary embodiment of the present invention.
- FIG. 2 is a top view showing the structure of the cooling system according to the first exemplary embodiment of the present invention.
- a cooling system S 1 according to the first exemplary embodiment of the present invention includes an evaporator 3 , refrigerant vapor pipes 5 and 15 , refrigerant liquid pipes 6 and 16 , flexible pipes 10 and 11 , a tilting table 12 , a heat exchanger 13 , a pressure gauge 21 and a pressure regulator 22 .
- a server rack 1 which can store, for example, a rack mount type server computer (not described in the figure) is placed on a base-isolated floor 4 .
- a back door 2 of the server rack 1 is fitted to the server rack 1 so as to be openable with a metal fitting 23 which has a rotation axis 24 .
- the back door 2 stores the evaporator 3 and has a wheel 14 .
- the cooling system S 1 carries out cooling with refrigerant.
- the evaporator 3 absorbs heat which the server rack 1 discharges by evaporating the refrigerant.
- the refrigerant (refrigerant vapor) which has become vapor by absorbing the heat moves to the heat exchanger 13 through the refrigerant vapor pipe 5 , the flexible pipe 10 and the refrigerant vapor pipe 15 .
- the heat exchanger 13 condenses the refrigerant vapor by cooling the refrigerant vapor.
- the refrigerant (refrigerant liquid) which has become liquid by the condensation moves to the evaporator 3 through the refrigerant liquid pipe 16 , the flexible pipe 11 and the refrigerant liquid pipe 6 . Then, the evaporator 3 recursively absorbs the heat which the server rack 1 discharges.
- One end of the refrigerant vapor pipe 5 is connected with a pipe port 17 which is placed at an upper part of the evaporator 3 , and part close to another end is fixed to a cart 7 .
- one end of the refrigerant liquid pipe 6 is connected with a pipe port 18 which is placed at an upper part of the evaporator 3 , and part close to another end thereof is fixed to the cart 7 .
- the cart 7 has wheels 8 which make it possible that the cart 7 moves in every direction on a ceiling 9 that is not base-isolated.
- the tilting table 12 is placed on the ceiling 9 .
- the tilting table 12 has a tilting surface which becomes higher as approaching from one end of the tilting surface to another end as an upper surface of the tilting table 12 .
- One end of the refrigerant vapor pipe 15 is connected with a pipe port 19 which the heat exchanger 13 has, and one end of the refrigerant liquid pipe 16 is connected with a pipe port 20 which the heat exchanger 13 has.
- One end of the flexible pipe 10 is connected with the refrigerant vapor pipe 5 , and another end is connected with the refrigerant vapor pipe 15 .
- one end of the flexible pipe 11 is connected with the refrigerant liquid pipe 6 , and another end is connected with the refrigerant liquid pipe 16 .
- the flexible pipe 10 which can bend freely connects the refrigerant vapor pipe 5 and the refrigerant vapor pipe 15 not through the shortest path but with having an excess length so as to have a bent portion
- the flexible pipe 11 which can bend freely connects the refrigerant liquid pipe 6 and the refrigerant liquid pipe 16 not through the shortest path but with having an excess length so as to have a bent portion.
- the flexible pipe 10 is placed on the tilting table 12 so as to become higher as approaching from a side of the flexible pipe 10 which is connected with the refrigerant vapor pipe 5 to a side which is connected with the refrigerant vapor pipe 15 .
- the flexible pipe 11 is placed on the tilting table 12 so as to become higher as approaching from a side of the flexible pipe 11 which is connected with the refrigerant liquid pipe 6 to a side which is connected with the refrigerant liquid pipe 16 .
- the pipe ports 19 and 20 of the heat exchanger 13 are placed higher than the pipe ports 17 and 18 respectively.
- the flow path of the refrigerant vapor from the evaporator 3 to the heat exchanger 13 through the refrigerant vapor pipe 5 , the flexible pipe 10 and the refrigerant vapor pipe 15 is kept at a normal inclination (ascending inclination) and includes no reverse inclination part along the way.
- the flow path of the refrigerant liquid from the heat exchanger 13 to the evaporator 3 through the refrigerant liquid pipe 16 , the flexible pipe 11 and the refrigerant liquid pipe 6 is kept at a normal inclination (descending inclination) and includes no reverse inclination part along the way.
- the pressure gauge 21 measures pressure (air pressure) inside the pipe. That is, the pressure gauge 21 measures pressure of the refrigerant vapor.
- the pressure gauge 21 may be a mechanical type or an electronic type.
- the pressure gauge 21 may have a function of outputting a measured value of the pressure as an electric signal.
- the pressure regulator 22 regulates the pressure inside the pipe so as to be within a prescribed range.
- the pressure regulator 22 may be a vacuum pump or an on-off valve.
- the prescribed range may be, for example, the saturated vapor pressure and its vicinity.
- the pressure regulator 22 may automatically regulate the pressure inside the pipe based on the pressure value which is indicated by the pressure gauge 21 . For example, in the case that the pressure gauge 21 indicates that the pressure inside the pipe is higher than a prescribed pressure, the pressure regulator 22 may lower the pressure inside the pipe.
- FIG. 3 is a top view showing a state that the back door 2 is open.
- an operation which is carried out at a time when the back door 2 is opened and shut will be explained with reference to FIGS. 2 and 3 .
- the refrigerant vapor pipe 5 and the refrigerant liquid pipe 6 are fixed to the cart 7 which has the wheel 8 , the refrigerant vapor pipe 5 and the refrigerant liquid pipe 6 can rotate and move with no distortion even when he refrigerant vapor pipe 5 and the refrigerant liquid pipe 6 are moved in connection with opening and shutting the back door 2
- the flexible pipes 10 and 11 are placed on the tilting table 12 , the flexible pipes 10 and 11 can keep the normal inclination even when moving according to opening and shutting the back door 2 .
- FIG. 4 is a top view showing a range in which the back door 2 moves in the event of an earthquake.
- an operation which is carried out the event of an earthquake will be explained with reference to FIG. 4 .
- the base-isolated floor 4 eases a shock of the earthquake by a relative movement generated in response to vibration of the earthquake. Accordingly, in the event of the earthquake, the movement of the base-isolated floor 4 causes a displacement between the base-isolated floor 4 and the ceiling 9 which is not base-isolated.
- a movable range 30 described in FIG. 4 indicates a movable range of the base-isolated floor 4 which is relative to a position of the ceiling 9 and which is caused at the time when the earthquake occurs.
- the cart 7 to which the refrigerant vapor pipe 5 and the refrigerant liquid pipe 6 are fixed can smoothly move on the ceiling 9 by the action of the wheels 8 .
- the cooling system S 1 can prevent degradation of the cooling efficiency.
- the reason is that the flexible pipes 10 and 11 are placed on the tilting table 12 and consequently the flow path of the refrigerant is kept the normal inclination. In other words, it is because the absence of the reverse inclination in the refrigerant flow path prevents stagnation in the movement of the refrigerant.
- the cooling system S 1 makes it possible to open and shut the back door 2 in the state that the connection between the evaporator 3 and the heat exchanger 13 through the pipe is maintained.
- the reason is that the flexible pipes 10 and 11 can be curved and stretched due to the excess lengths and flexibility of the flexible pipes 10 and 11 , respectively, and consequently the position change of the pipe which is caused at the time of opening or closing the back door 2 is absorbed while maintain the pipe connection.
- the cooling system S 1 can maintain the connection between the evaporator 3 and the heat exchanger 13 through the pipe by absorbing the change in distance between the base-isolated floor 4 and the ceiling 9 .
- FIG. 5 is a side view showing structure of a cooling system according to the second exemplary embodiment of the present invention.
- a cooling system S 2 according to the second exemplary embodiment of the present includes a tilting board 42 and supports 40 and 41 in place of the tilting table 12 described in FIG. 1 .
- the tilting board 42 is hung from the ceiling 9 by the supports 40 and 41 in a tilting state that the tilting board 42 becomes higher as approaching from one end of the tilting board 42 to another end.
- Structure elements corresponding to the ones in the first exemplary embodiment except for the tilting board 42 and the supports 40 and 41 are assigned the same reference codes, and redundant explanations on the same structure elements are omitted.
- each of the refrigerant vapor pipe 5 and the refrigerant liquid pipe 6 has a short length, the structure of the cooling system S 2 described in FIG. 5 is effective in the case that there is a small possibility that the pipe is distorted due to movement.
- cooling system S 2 according to the second exemplary embodiment of the present invention can bring about an advantage similar to the system S 1 according to one of the first exemplary embodiment.
- FIG. 6 is a side view showing structure of a cooling system according to the third exemplary embodiment of the present invention.
- a cooling system S 3 according to the third exemplary embodiment of the present invention includes the evaporator 3 , the flexible pipe 10 , the tilting table 12 and the heat exchanger 13 .
- the evaporator 3 is sometimes called a heat absorbing device.
- the flexible pipe 10 is sometimes called a first flexible pipe.
- the tilting table 12 is sometimes called a loading table.
- the heat exchanger 13 is sometimes called a radiator.
- the evaporator 3 absorbs heat which is discharged from the server rack 1 with refrigerant.
- the server rack 1 may be other equipment.
- the evaporator 3 has the pipe port 17 .
- the pipe port 17 is sometimes called a first pipe port.
- the heat exchanger 13 cools the refrigerant.
- the heat exchanger 13 has the pipe port 19 .
- the pipe port 19 is placed higher than the pipe port 17 .
- the pipe port 19 is sometimes called a second pipe port.
- the flexible pipe 10 is connected with the pipe port 17 and the pipe port 19 .
- the flexible pipe 10 can bend freely, and works as a path through which the refrigerant flows.
- the tilting table 12 has a surface which becomes higher as approaching from one end of the surface to another end.
- the flexible pipe 10 is placed onto the surface so as to become higher as approaching from a side of the flexible pipe 10 which is connected with the pipe port 17 to a side which is connected with the pipe port 19 .
- the cooling system S 3 can prevent degradation of the cooling efficiency.
- the reason is that the flexible pipe 10 is placed on the tilting table 12 and consequently the flow path of the refrigerant is kept the normal inclination. That is, the reason is that the flow path of the refrigerant has no reverse inclination, and consequently stagnation of the refrigerant is prevented.
- the heat exchanger 13 in the first to the third exemplary embodiments may be a cooling tower of an air cooling type or a water cooling type.
- the heat exchanger may be a heat exchanger which carries out cooling with refrigerant other than the refrigerant used in the cooling systems S 1 to S 3 .
- the server rack 1 in the exemplary embodiments 1 to 3 may be electronic equipment other than the server rack 1 .
- the first to the third exemplary embodiments describe the example that each of the two flexible pipes 10 and 11 has the normal inclination
- the present invention is not limited to the example.
- the flexible pipe 10 which is connected with the refrigerant vapor pipes 5 and 15 may have the normal inclination
- the flexible pipe 11 which is connected with the refrigerant liquid pipes 6 and 16 may be in a horizontal position.
- the number of the flexible pipes 10 and 11 is two in the first to the third exemplary embodiments, the number may be one.
- the flexible pipe has a diameter that enables the separation of the refrigerant liquid and the refrigerant vapor within the pipe due to the gravity, and it is necessary to place a joining unit, which joins the refrigerant liquid and the refrigerant vapor together, at one end of the flexible pipe, and a separation unit, which separates the refrigerant liquid and the refrigerant vapor, at another end.
- the tilting board 42 may be hung from the ceiling 9 by the supports 40 and 41 in the second exemplary embodiment, the tilting board 42 may be hung from another object. That is, the tilting board 42 may be hung from another surface, another member or another structure.
- the present invention has been explained by exemplifying the above-mentioned exemplary embodiments as an exemplary example.
- the present invention is not limited to the above-mentioned exemplary embodiments. That is, the present invention can apply in various aspects, which a person skilled in the art can understand, within the scope of the present invention.
- the present invention can apply to a cooling apparatus using the boiling and cooling method that heat transportation and radiation are carried out by a cycle of evaporation and condensation of the refrigerant.
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- Life Sciences & Earth Sciences (AREA)
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- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
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Abstract
Description
- [PTL 1] Japanese Patent Application Laid-Open Publication No. 2011-165707
Claims (8)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2013-267091 | 2013-12-25 | ||
JP2013267091A JP5986064B2 (en) | 2013-12-25 | 2013-12-25 | Cooling system and electronic equipment |
PCT/JP2014/006021 WO2015097992A1 (en) | 2013-12-25 | 2014-12-02 | Cooling system and electronic apparatus |
Publications (2)
Publication Number | Publication Date |
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US20160313069A1 US20160313069A1 (en) | 2016-10-27 |
US10408545B2 true US10408545B2 (en) | 2019-09-10 |
Family
ID=53477904
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US15/105,950 Active 2036-01-06 US10408545B2 (en) | 2013-12-25 | 2014-12-02 | Cooling system and electronic equipment |
Country Status (5)
Country | Link |
---|---|
US (1) | US10408545B2 (en) |
EP (1) | EP3089571B1 (en) |
JP (1) | JP5986064B2 (en) |
TW (1) | TWI639378B (en) |
WO (1) | WO2015097992A1 (en) |
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Citations (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02225892A (en) | 1989-02-27 | 1990-09-07 | Hitachi Plant Eng & Constr Co Ltd | Flexible pipe supporting device |
JPH05126479A (en) * | 1991-07-11 | 1993-05-21 | Conserve Resources Inc | Rotary type heat exchanger |
FR2725265A1 (en) * | 1994-09-30 | 1996-04-05 | Grandi Rene Vincent | DEVICE FOR REGULATING AND TRANSFERRING REFRIGERATED OR CALORIC FLUIDS FOR TRANSPORT CONTAINERS |
JPH08338567A (en) | 1995-06-12 | 1996-12-24 | Sumitomo Kinzoku Plantec Kk | Burying process for gas pipe line |
JPH09256612A (en) | 1996-03-19 | 1997-09-30 | Meidensha Corp | Flexible pipe supporting structure for base isolation building |
JPH10141549A (en) | 1996-11-13 | 1998-05-29 | Akagi:Kk | Multiple piping saddle and connecting base seat |
JPH10288281A (en) | 1997-04-14 | 1998-10-27 | Ishikawajima Harima Heavy Ind Co Ltd | Pipe support device |
JPH1136425A (en) | 1997-07-18 | 1999-02-09 | Toyo Tire & Rubber Co Ltd | Device for supporting flexible hose for absorbing displacement of drain piping |
US6257324B1 (en) * | 1998-06-30 | 2001-07-10 | Denso Corporation | Cooling apparatus boiling and condensing refrigerant |
JP2002134664A (en) | 2000-10-20 | 2002-05-10 | Hitachi Ltd | Semiconductor cooling device and control method thereof |
JP2002206880A (en) | 2001-01-10 | 2002-07-26 | Denso Corp | Boiling cooler |
JP2002295730A (en) | 2001-03-29 | 2002-10-09 | Mym Corp | Pipe support |
JP2003125509A (en) | 2001-10-10 | 2003-04-25 | Kansai Electric Power Co Inc:The | Pipe pillow |
JP2004172021A (en) | 2002-11-21 | 2004-06-17 | Sumitomo Wiring Syst Ltd | Wire harness inserting method into protector |
US20040163798A1 (en) * | 2003-02-25 | 2004-08-26 | Debashis Ghosh | Compact thermosiphon for dissipating heat generated by electronic components |
JP2004270751A (en) | 2003-03-06 | 2004-09-30 | Fujita Corp | Piping structure for base isolation structure |
JP2005156011A (en) | 2003-11-25 | 2005-06-16 | Twinbird Corp | Thermosiphon |
US20090122488A1 (en) | 2007-11-14 | 2009-05-14 | International Business Machines Corporation | Apparatus for facilitating cooling of an electronics rack through the use of an air-to-liquid heat exchanger |
JP2009134531A (en) | 2007-11-30 | 2009-06-18 | Sanyo Electric Co Ltd | Electronic device cooling system |
US7552759B2 (en) * | 2005-06-17 | 2009-06-30 | Foxconn Technology Co., Ltd. | Loop-type heat exchange device |
US20090260384A1 (en) * | 2008-04-21 | 2009-10-22 | International Business Machines Corporation | Coolant Distribution System For A Rack Having A Rear-Door Heat Exchanger |
US7660116B2 (en) * | 2008-04-21 | 2010-02-09 | International Business Machines Corporation | Rack with integrated rear-door heat exchanger |
US20100059201A1 (en) | 2008-09-11 | 2010-03-11 | Sun Microsystems, Inc. | Liquid cooled rack with compliant heat exchanger support structure |
JP2011007502A (en) | 2009-06-23 | 2011-01-13 | Toa Harbor Works Co Ltd | Method and system for measuring drilling position |
JP2011038734A (en) | 2009-08-17 | 2011-02-24 | Panasonic Corp | Boiling cooler |
US20110103009A1 (en) | 2008-06-02 | 2011-05-05 | Audrey Julien-Roux | Computer bay cooling device and computer equipment comprising same |
JP2011165707A (en) | 2010-02-04 | 2011-08-25 | Hitachi Plant Technologies Ltd | Cooling system for electronic apparatus |
WO2011122207A1 (en) | 2010-03-30 | 2011-10-06 | 日本電気株式会社 | Cooling apparatus and cooling system for electronic-device exhaustion |
US20110259573A1 (en) | 2010-04-26 | 2011-10-27 | Gac Corporation | Cooling system |
US8077462B2 (en) | 2009-09-02 | 2011-12-13 | International Business Machines Corporation | Stress relieved hose routing to liquid-cooled electronics rack door |
JP2012015376A (en) | 2010-07-01 | 2012-01-19 | Denso Corp | Cooling device |
WO2012166086A1 (en) | 2011-05-27 | 2012-12-06 | Aavid Thermalloy, Llc | Thermal transfer device with reduced vertical profile |
US20130091881A1 (en) * | 2011-10-18 | 2013-04-18 | Hitachi Plant Technologies, Ltd. | Cooling system and method for controlling cooling system |
US20160014933A1 (en) * | 2013-02-26 | 2016-01-14 | Nec Corporation | Electronic apparatus cooling system and electronic apparatus cooling system fabrication method |
WO2016095589A1 (en) * | 2014-12-15 | 2016-06-23 | 青岛海尔股份有限公司 | Semiconductor refrigerator |
US20160295749A1 (en) * | 2013-11-20 | 2016-10-06 | Nec Corporation | Electronic apparatus enclosure device and electronic apparatus cooling system |
JP2017075737A (en) * | 2015-10-15 | 2017-04-20 | Necプラットフォームズ株式会社 | Cooling device and cooling system |
DE102017110102A1 (en) * | 2017-05-10 | 2018-11-15 | Friedhelm Meyer | Refrigeration device with temperature detection means |
-
2013
- 2013-12-25 JP JP2013267091A patent/JP5986064B2/en active Active
-
2014
- 2014-12-02 EP EP14873921.2A patent/EP3089571B1/en active Active
- 2014-12-02 WO PCT/JP2014/006021 patent/WO2015097992A1/en active Application Filing
- 2014-12-02 US US15/105,950 patent/US10408545B2/en active Active
- 2014-12-18 TW TW103144217A patent/TWI639378B/en active
Patent Citations (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02225892A (en) | 1989-02-27 | 1990-09-07 | Hitachi Plant Eng & Constr Co Ltd | Flexible pipe supporting device |
JPH05126479A (en) * | 1991-07-11 | 1993-05-21 | Conserve Resources Inc | Rotary type heat exchanger |
FR2725265A1 (en) * | 1994-09-30 | 1996-04-05 | Grandi Rene Vincent | DEVICE FOR REGULATING AND TRANSFERRING REFRIGERATED OR CALORIC FLUIDS FOR TRANSPORT CONTAINERS |
JPH08338567A (en) | 1995-06-12 | 1996-12-24 | Sumitomo Kinzoku Plantec Kk | Burying process for gas pipe line |
JPH09256612A (en) | 1996-03-19 | 1997-09-30 | Meidensha Corp | Flexible pipe supporting structure for base isolation building |
JPH10141549A (en) | 1996-11-13 | 1998-05-29 | Akagi:Kk | Multiple piping saddle and connecting base seat |
JPH10288281A (en) | 1997-04-14 | 1998-10-27 | Ishikawajima Harima Heavy Ind Co Ltd | Pipe support device |
JPH1136425A (en) | 1997-07-18 | 1999-02-09 | Toyo Tire & Rubber Co Ltd | Device for supporting flexible hose for absorbing displacement of drain piping |
US6257324B1 (en) * | 1998-06-30 | 2001-07-10 | Denso Corporation | Cooling apparatus boiling and condensing refrigerant |
JP2002134664A (en) | 2000-10-20 | 2002-05-10 | Hitachi Ltd | Semiconductor cooling device and control method thereof |
JP2002206880A (en) | 2001-01-10 | 2002-07-26 | Denso Corp | Boiling cooler |
JP2002295730A (en) | 2001-03-29 | 2002-10-09 | Mym Corp | Pipe support |
JP2003125509A (en) | 2001-10-10 | 2003-04-25 | Kansai Electric Power Co Inc:The | Pipe pillow |
JP2004172021A (en) | 2002-11-21 | 2004-06-17 | Sumitomo Wiring Syst Ltd | Wire harness inserting method into protector |
US20040163798A1 (en) * | 2003-02-25 | 2004-08-26 | Debashis Ghosh | Compact thermosiphon for dissipating heat generated by electronic components |
JP2004270751A (en) | 2003-03-06 | 2004-09-30 | Fujita Corp | Piping structure for base isolation structure |
JP2005156011A (en) | 2003-11-25 | 2005-06-16 | Twinbird Corp | Thermosiphon |
US7552759B2 (en) * | 2005-06-17 | 2009-06-30 | Foxconn Technology Co., Ltd. | Loop-type heat exchange device |
US20090122488A1 (en) | 2007-11-14 | 2009-05-14 | International Business Machines Corporation | Apparatus for facilitating cooling of an electronics rack through the use of an air-to-liquid heat exchanger |
JP2009123212A (en) | 2007-11-14 | 2009-06-04 | Internatl Business Mach Corp <Ibm> | Apparatus for promoting cooling of an electronic equipment rack using an air / liquid heat exchanger, and an electronic equipment system and data center including the same |
US7950244B2 (en) * | 2007-11-14 | 2011-05-31 | International Business Machines Corporation | Apparatus for facilitating cooling of an electronics rack through the use of an air-to-liquid heat exchanger |
JP2009134531A (en) | 2007-11-30 | 2009-06-18 | Sanyo Electric Co Ltd | Electronic device cooling system |
US20090260384A1 (en) * | 2008-04-21 | 2009-10-22 | International Business Machines Corporation | Coolant Distribution System For A Rack Having A Rear-Door Heat Exchanger |
US7660116B2 (en) * | 2008-04-21 | 2010-02-09 | International Business Machines Corporation | Rack with integrated rear-door heat exchanger |
US8587941B2 (en) * | 2008-06-02 | 2013-11-19 | Bull Sas | Computer bay cooling device and computer equipment comprising same |
US9066452B2 (en) * | 2008-06-02 | 2015-06-23 | Bull Sas | Computer bay cooling device and computer equipment comprising same |
US20110103009A1 (en) | 2008-06-02 | 2011-05-05 | Audrey Julien-Roux | Computer bay cooling device and computer equipment comprising same |
US20100059201A1 (en) | 2008-09-11 | 2010-03-11 | Sun Microsystems, Inc. | Liquid cooled rack with compliant heat exchanger support structure |
JP2011007502A (en) | 2009-06-23 | 2011-01-13 | Toa Harbor Works Co Ltd | Method and system for measuring drilling position |
JP2011038734A (en) | 2009-08-17 | 2011-02-24 | Panasonic Corp | Boiling cooler |
US8077462B2 (en) | 2009-09-02 | 2011-12-13 | International Business Machines Corporation | Stress relieved hose routing to liquid-cooled electronics rack door |
JP2011165707A (en) | 2010-02-04 | 2011-08-25 | Hitachi Plant Technologies Ltd | Cooling system for electronic apparatus |
WO2011122207A1 (en) | 2010-03-30 | 2011-10-06 | 日本電気株式会社 | Cooling apparatus and cooling system for electronic-device exhaustion |
US20110259573A1 (en) | 2010-04-26 | 2011-10-27 | Gac Corporation | Cooling system |
JP2011247573A (en) | 2010-04-26 | 2011-12-08 | Gac Corp | Cooling system |
JP2012015376A (en) | 2010-07-01 | 2012-01-19 | Denso Corp | Cooling device |
WO2012166086A1 (en) | 2011-05-27 | 2012-12-06 | Aavid Thermalloy, Llc | Thermal transfer device with reduced vertical profile |
US20130091881A1 (en) * | 2011-10-18 | 2013-04-18 | Hitachi Plant Technologies, Ltd. | Cooling system and method for controlling cooling system |
US20160014933A1 (en) * | 2013-02-26 | 2016-01-14 | Nec Corporation | Electronic apparatus cooling system and electronic apparatus cooling system fabrication method |
US20160295749A1 (en) * | 2013-11-20 | 2016-10-06 | Nec Corporation | Electronic apparatus enclosure device and electronic apparatus cooling system |
WO2016095589A1 (en) * | 2014-12-15 | 2016-06-23 | 青岛海尔股份有限公司 | Semiconductor refrigerator |
JP2017075737A (en) * | 2015-10-15 | 2017-04-20 | Necプラットフォームズ株式会社 | Cooling device and cooling system |
DE102017110102A1 (en) * | 2017-05-10 | 2018-11-15 | Friedhelm Meyer | Refrigeration device with temperature detection means |
Non-Patent Citations (7)
Title |
---|
English translation of Written opinion for PCT Application No. PCT/JP2014/006021. |
Extended European Search Report for EP Application No. EP14873921.2 dated on Jun. 28, 2017. |
International Search Report for PCT Application No. PCT/JP2014/006021, dated Feb. 24, 2015. |
Japanese Office Action for JP Application No. 2013-267091 dated Jan. 20, 2015 with English Translation. |
Japanese Office Action for JP Application No. 2013-267091 dated Jun. 23, 2015 English Translation. |
Japanese Office Action for JP Application No. 2013-267091 dated Oct. 7, 2014 with English Translation. |
Japanese Office Action for JP Application No. 2015-186330 dated Sep. 19, 2017 with English Translation. |
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Also Published As
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JP5986064B2 (en) | 2016-09-06 |
TW201538065A (en) | 2015-10-01 |
WO2015097992A1 (en) | 2015-07-02 |
EP3089571A1 (en) | 2016-11-02 |
TWI639378B (en) | 2018-10-21 |
EP3089571A4 (en) | 2017-07-26 |
EP3089571B1 (en) | 2019-01-30 |
US20160313069A1 (en) | 2016-10-27 |
JP2015125995A (en) | 2015-07-06 |
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