TWM665949U - Cutting calibration device and electronic component cutting machine - Google Patents

Abstract

A cutting alignment device comprises a first supporting unit, a second supporting unit, a first detector, a second detector and a processor. The first supporting unit is provided with a first supporting unit along a cutting operation path, and the second supporting unit is provided with a second supporting unit along the cutting operation path. The first detector is mounted on the first supporting unit and can image a first alignment portion of a first surface of an electronic component from bottom to top to obtain first detection data. The second detector is mounted on the second supporting unit and can image a second alignment portion of a second surface of an electronic component from top to bottom to obtain second detection data. The processor can receive the first detection data and the second detection data of the first detector and the second detector to analyze the actual cutting position of the alignment electronic component, thereby improving the cutting accuracy and cutting quality.

Description

Cutting calibration device and electronic component cutting machine

This invention provides a cutting alignment device capable of improving the cutting accuracy and cutting quality of electronic components.

Nowadays, an electronic component (such as a carrier) with multiple ICs or LEDs needs to be cut by a cutting machine to cut out multiple independent IC packages or LED packages. Please refer to Figure 1. The carrier 10 is composed of multiple layers of plates (such as 12 layers of plates) stacked together. The front of the top plate defines multiple packages 11 with ICs and multiple upper targets 12. The upper targets 12 are used for alignment cutting by the cutter of the cutting machine (not shown); the back of the bottom plate of the carrier 10 is provided with multiple contacts 13 at a position relative to the package 11, and a lower target 14 is provided at a position relative to the upper target 12. During the cutting operation, the cutter of the cutting machine cuts the carrier 10 with the upper target 12 as the cutting position to cut out multiple independent packages 11 with ICs.

However, the carrier 10 is prone to misalignment due to the multi-layer stacking of multiple layers of plates, resulting in a position deviation value A between the upper target point 12 and the lower target point 14. As a result, when the cutter cuts the carrier 10 along the upper target point 12, the distance between the edge of the package 11 and the contact 13 on the front and back sides of the carrier 10 will exceed the allowable tolerance range, thereby affecting the cutting quality.

The first object of the invention is to provide a cutting alignment device, comprising a first support unit, a second support unit, at least one first detector, at least one second detector and a processor, wherein the first support unit is provided with a first support unit along a cutting operation path, and the second support unit is provided with a second support unit along a cutting operation path, wherein the first detector is mounted on the first support unit and can image a first alignment portion of a first surface of an electronic component from below toward above to obtain first detection data, and the second detector is mounted on the second support unit and can image a first alignment portion of a first surface of an electronic component from above toward above to obtain first detection data. The processor can receive the first detection data and the second detection data of the first detector and the second detector to analyze the actual cutting position of the calibrated electronic component. When the electronic component cutting operation is performed, the cutter can cut the electronic component into a plurality of components at the actual cutting position defined by the calibration, and the edges and joints of the components can meet the allowable tolerance range, thereby achieving the practical benefit of improving the cutting accuracy and cutting quality.

The second purpose of the present invention is to provide a cutting calibration device, wherein at least one first detector includes a plurality of first detectors to synchronously detect a plurality of first calibration parts of an imaged electronic component, and transmit the plurality of first detection data to a processor for analysis and determination of the actual cutting position after the calibration is defined, so as to effectively shorten the calibration operation time and allow the cutter to quickly and accurately cut the electronic component, thereby achieving the practical benefit of improving the use efficiency and cutting capacity.

The third object of the present invention is to provide an electronic component cutting machine, comprising a material placing device, a conveying device, a transfer device, a cutting device, a cutting alignment device of the present invention and a central control device; the material placing device is provided with at least one material placing device along the cutting operation path for placing at least one electronic component; the conveying device is provided with at least one conveyor along the cutting operation path for conveying at least one electronic component; the transfer device is provided with at least one transfer device along the cutting operation path for transferring at least one electronic component is transported; the cutting device is provided with at least one cutter along the cutting operation path for cutting at least one electronic component; the cutting positioning device of the invention is provided with a first supporting unit, a second supporting unit, at least one first detector, at least one second detector and a processor on the cutting operation path for detecting and positioning the actual cutting position of the electronic component to improve the cutting accuracy; the central control device is used to control and integrate the actions of each device to perform automated operations.

In order to help you, the Review Committee, to have a better understanding of this new model, we will cite a preferred embodiment and provide a detailed description with drawings as follows:

Please refer to FIG. 2 . The electronic component cutting machine of the invention includes a material placement device 20, a conveying device 30, a transfer device 40, a cutting device 50, a cutting alignment device 60 of the invention and a central control device (not shown). According to the operation requirements, it further includes a material feeding device 70, which is provided with at least one container, such as a magazine, to provide at least one electronic component to be cut.

The electronic component to be cut can be a wafer, a carrier or a lead frame, etc. In this embodiment, the electronic component is a carrier 80, and the second surface of the carrier 80 is provided with a plurality of components 81 and a plurality of second alignment parts (i.e., upper target points 82), and the first surface is provided with a plurality of contacts 83 and a first alignment part (i.e., lower target points 84). In addition, a cutting operation path L is defined between the material placement device 20 and the cutting device 50, and the carrier 80 moves along the cutting operation path L.

The material placement device 20 is provided with at least one material placement device along the cutting operation path L for holding at least one electronic component. Furthermore, the material placement device can be a track or a pulley assembly. In this embodiment, the material placement device 20 is arranged on the side of the feeding device 70, and includes a first frame 21, a material placement device and a pallet 23. The top surface of the first frame 21 is provided with a material placement device, and the material placement device includes two material placement rails 22 arranged opposite to each other in the X direction. The two material placement rails 22 are used to hold the carrier plate 80 to be cut output by the feeding device 70. A pallet 23 that can be displaced in the Z direction is provided between the two material placement rails 22 to support and move the carrier plate 80 on the material placement rails 22 for displacement in the Z direction.

The conveying device 30 is provided with at least one conveyor along the cutting operation path L for conveying at least one electronic component. In this embodiment, the conveying device 30 includes a second frame 31 , a first conveying driver 32 , a second conveying driver 33 , a first conveyor 34 and a second conveyor 35 . The second frame 31 has an arch-shaped column for assembling a first conveyor driver 32 arranged in the X direction. The first conveyor driver 32 can drive a second conveyor driver 33 arranged in the Z direction to move in the X direction. The second conveyor driver 33 is equipped with a first conveyor 34 having a plurality of suction nozzles 341 to absorb and transfer the carrier 80. One side of the first conveyor 34 is equipped with a second conveyor 35. The second conveyor 35 is an openable and closable clamping assembly to clamp the carrier 80 for displacement. The first conveyor driver 32 and the second conveyor driver 33 can drive the first conveyor 34 and the second conveyor 35 to move in the X-Z direction synchronously, and move along the cutting operation path L to the feeding device 70, the placing device 20 and the transfer device 40.

However, the first rack 21 and the second rack 31 may be the same rack or different racks, and are not limited to this embodiment.

According to the operation requirements, the first conveyor 34 and the second conveyor 35 can be configured independently or assembled with each other.

The transfer device 40 is provided with at least one transfer device along the cutting operation path L for transferring at least one electronic component. In this embodiment, the transfer device 40 is arranged on the side of the material placement device 20, and includes a first transfer driver 41, a moving platform 42, a second transfer driver 43 and a transfer device 44. The first transfer driver 41 is arranged on the second frame 31 in the Y direction to drive the moving platform 42 to move in the Y direction. The second transfer driver 43 is mounted on the moving platform 42. The second transfer driver 43 can drive the transfer device 44 to move in the Y direction. Angular rotation displacement, the conveyor 44 is used to support the carrier 80 to be cut, and is provided with a plurality of positioning parts 441 (such as suction holes) to position the carrier 80, so that the first transfer drive 41 and the second transfer drive 43 can drive the conveyor 44 to perform Y-direction displacement and angular rotation displacement to transfer the carrier 80 between the conveying device 30 and the cutting device 50, and the horizontal placement angle of the carrier 80 can be changed.

The cutting device 50 is provided with at least one cutter along the cutting operation path L for cutting electronic components. In this embodiment, the cutting device 50 comprises a first cutting driver 51, a second cutting driver 52, a first cutter 53 and a second cutter 54; the first cutting driver 51 and the second cutting driver 52 are arranged in the X direction on the arch column of the second frame 31 to drive the first cutter 53 and the second cutter 54 to move in the X-Z direction respectively, so as to cut the carrier 80 on the conveyor 44.

The cutting position calibration device 60 is disposed in the cutting operation path L and includes a first supporting unit, a second supporting unit, at least one first detector, at least one second detector and a processor (not shown) for taking images to calibrate the actual cutting position of the electronic component.

The first receiving unit is provided with at least one first receiving device along the cutting operation path L.

According to the operation requirements, the first support can be fixed or movable. For example, the first support can be fixedly arranged on the first frame 12 of the material placement device 20 or on one side of the first frame 12. For example, the first support can be displaced in the X-Y direction.

According to the operation requirements, the first support device can be an independent device or a device of a related device. For example, the first support device can be an independent bracket; for example, the first support device can be the first frame 21 of the material placement device 20 ; it is also possible.

According to the operation requirements, the first support device can be arranged on one side of the material placement device 20, below the first frame 21 or on the other side of the material placement device 20 along the cutting operation path L, which is not limited to this embodiment.

According to the operation requirements, the first supporting unit is provided with at least one first adjuster (not shown), and the first adjuster can adjust the imaging height position of the first detector.

In this embodiment, the first support is the first frame 21 of the material placement device 20 , and a plurality of through holes 61 are opened on a side of the first frame 21 close to the material feeding device 70 .

The second receiving unit is provided with at least one second receiving device along the cutting operation path L.

According to the operation requirements, the second support can be fixed or movable. For example, the second support can be fixedly configured on the arch column of the second frame 31 of the conveying device 30. For example, the second support can be configured on the side of at least one cutter of the cutting device 50, so that the second support moves in the X-Z direction with the cutter.

According to the operation requirements, the second support can be an independent device or a device of a related device. For example, the second support can be an independent bracket; for example, the second support can be the first cutter 53 of the cutting device 50; it is also possible.

According to the operation requirements, the second supporting unit is provided with at least one second adjuster (not shown), and the second adjuster can adjust the imaging height position of the second detector.

In this embodiment, the second support is the first cutter 53 of the cutting device 50 , and a connecting frame 62 is provided on the first cutter 53 .

At least one first detector is disposed on the first support for detecting at least one first alignment portion of the first surface of the electronic component to obtain first detection data.

According to the operation requirements, the at least one first detector includes a plurality of first detectors for detecting a plurality of first calibration parts of the electronic component.

In this embodiment, the cutting alignment device 60 is provided with a plurality of first detectors, namely, first CCDs 63, which are fixedly mounted below the through hole 61 of the first frame 21 of the material placement device 20 and can image the target point 84 below the carrier 80 from the bottom to the top to obtain first detection data.

At least one second detector is arranged on the second support device to detect at least one second calibration portion of the second surface of the electronic component to obtain second detection data.

In this embodiment, the cutting alignment device 60 is provided with a second detector which is a second CCD 64. The second CCD 64 is mounted on the connecting frame 62 of the first cutter 53 of the cutting device 50 and can take an image of the target point 82 on the carrier 80 from top to bottom to obtain second detection data.

The processor (not shown) can receive the first detection data from the first detector and the second detection data from the second detector, and analyze and calibrate the actual cutting position of the electronic component; that is, the processor can receive the first detection data and the second detection data transmitted by the first CCD63 and the second CCD64.

Please refer to Figures 2 to 7. During the cutting operation, the first conveyor driver 32 and the second conveyor driver 33 of the conveyor device 30 drive the first conveyor 34 and the second conveyor 35 to synchronously move in the X-Z direction along the cutting operation path L, so that the second conveyor 35 takes out the carrier 80 to be cut from the feeding device 70 and transfers it to the loading track 22 of the loading device 20. Since the two first CCDs 63 are mounted on the loading device 20 and are located on the cutting operation path L, the second conveyor 35 clamps the carrier 80 and passes over the two first CCDs 63. The two first CCDs 63 then pass through the through hole 61 located on the first frame 21 and take an image of the target point 84 below the carrier 80 from the bottom to the top, and transmit the obtained first detection data to the processor.

After the second conveyor 35 transfers the carrier 80 to be cut to the loading track 22 of the loading device 20, the carrier 80 is released, and the support plate 23 of the loading device 20 is displaced in the Z direction to lift the carrier 80. The conveying device 30 drives the first conveyor 34 to move along the cutting operation path L in the X-Z direction with the first conveyor driver 32 and the second conveyor driver 33, so that the suction nozzle 341 of the first conveyor 34 picks up the carrier 80.

The conveying device 30 uses the first conveying driver 32 and the second conveying driver 33 to drive the first conveyor 34 to move along the cutting operation path L in the X-Z direction, so that the first conveyor 34 places the carrier 80 to be cut on the transfer device 44 of the transfer device 40, and the transfer device 44 uses the positioning member 441 to absorb the carrier 80 for positioning.

The transfer device 40 uses the first transfer driver 41 and the moving platform 42 to drive the transfer device 44 and the carrier 80 to move in the Y direction along the cutting operation path L and pass under the first cutter 53. The cutting device 50 uses the first cutting driver 51 to drive the first cutter 53 and the second CCD 64 to move in the X direction, so that the second CCD 64 captures the position of the target point 82 on the carrier 80 from top to bottom, and transmits the obtained second detection data to the processor.

The processor receives the first detection data of the first CCD63 and the second detection data of the second CCD64, and analyzes and calibrates to define the actual cutting position of the first cutter 53 on the carrier 80. For example, the processor can obtain the average value of the position between the upper target point 82 and the lower target point 84 based on the first and second detection data to define the actual cutting position of the carrier 80, rather than using the upper target point 82 or the lower target point 84 as the cutting position, so that the distance between the edge of the component 81 and the contact point 83 meets the allowable tolerance range, so that the first cutter 53 can accurately cut the carrier 80.

After the actual cutting position of the carrier plate 80 is defined by calibration, the transfer device 40 drives the transfer device 44 and the carrier plate 80 to move in the Y direction along the cutting operation path L by the first transfer driver 41, and the cutting device 50 drives the first cutter 53 and the second cutter 54 to move in the X direction by the first cutting driver 51 and the second cutting driver 52 respectively, so as to accurately cut the carrier plate 80 at the actual cutting position defined by calibration on the carrier plate 80, and cut out a plurality of components 81, thereby achieving the practical benefit of improving the cutting accuracy and cutting quality.

[Learning] 10: Carrier 11: Package 12: Upper target 13: Contact 14: Lower target A: Position deviation value [Original work] 20: Loading device 21: First rack 22: Loading track 23: Pallet 30: Conveyor 31: Second rack 32: First conveyor drive 33: Second conveyor drive 34: First conveyor 341: Suction nozzle 35: Second conveyor 40: Transfer device 41: First transfer drive 42: Moving table 43: Second transfer drive 44: Transfer 441: Positioning member 50: Cutting device 51: First cutting drive 52: Second cutting drive 53: First cutter 54: Second cutter 60: Cutting calibration device 61: Through hole 62: Connecting frame 63: First CCD 64: Second CCD 70: Feeding device 80: Carrier 81: Component 82: Upper target 83: Contact 84: Lower target L: Cutting operation path

Figure 1: Schematic diagram of a known carrier board with multiple packages. Figure 2: Schematic diagram of the cutting alignment device of the present invention applied to an electronic component cutting machine. Figures 3 to 7: Schematic diagram of the use of a cutting machine to cut a carrier board.

20: Material placement device

21: First rack

22: Material placement track

23: Pallet

30: Transport device

31: Second rack

32: First conveyor drive

33: Second transport drive

34: First conveyor

341: Suction nozzle

35: Second conveyor

40:Transfer device

41: First transfer drive

42: Mobile platform

43: Second transfer drive

44:Transfer Device

441: Positioning piece

50: Cutting device

51: First cutting drive

52: Second cutting drive

53: First cutter

54: Second cutter

60: Cutting calibration device

61:Through hole

62:Connecting frame

63: First CCD

64: Second CCD

70: Feeding device

80: Carrier board

81: Components

82: On target

83: Contact

84: Target point

L: Cutting operation path

Claims (10)

A cutting calibration device comprises: A first receiving unit: at least one first receiving device is provided along the cutting operation path; A second receiving unit: at least one second receiving device is provided along the cutting operation path; At least one first detector: provided on the first receiving device, for detecting at least one first calibration portion of the first surface of the electronic component, and obtaining first detection data; At least one second detector: provided on the second receiving device, for detecting at least one second calibration portion of the second surface of the electronic component, and obtaining second detection data; A processor: capable of receiving the first detection data of the first detector and the second detection data of the second detector, and analyzing and calibrating the actual cutting position of the electronic component. In the cutting alignment device as described in claim 1, the first support of the first support unit can be configured in a fixed or movable manner. The cutting calibration device as described in claim 1, wherein the first supporting unit is provided with at least one first adjuster, and the first adjuster is capable of adjusting the imaging height position of the first detector. In the cutting alignment device as described in claim 1, the second support of the second support unit can be configured in a fixed or movable manner. The cutting calibration device as described in claim 1, wherein the second supporting unit is provided with at least one second adjuster, and the second adjuster is capable of adjusting the imaging height position of the second detector. In the cutting alignment device as described in claim 1, at least one of the first detectors includes a plurality of first detectors for detecting a plurality of first alignment parts of the electronic component. In the cutting alignment device as described in claim 1, the first detector takes an image of the first alignment portion of the electronic component from bottom to top. In the cutting alignment device as described in claim 1, the second detector takes an image of the second alignment portion of the electronic component from top to bottom. In the cutting alignment device as described in claim 1, the first detector and the second detector are CCDs. An electronic component cutting machine comprises: A material placing device: at least one material placing device is provided along the cutting operation path for placing at least one electronic component ; A conveying device: at least one conveyor is provided along the cutting operation path for conveying at least one electronic component; A transfer device: at least one transfer device is provided along the cutting operation path for transferring at least one electronic component; A cutting device: at least one cutter is provided along the cutting operation path for cutting at least one electronic component; At least one cutting calibration device as described in claim 1: provided in the cutting operation path for taking an image to calibrate the actual cutting position of the electronic component; A central control device: for controlling and integrating the actions of each device to perform an automated operation.

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