TWM659198U - Single laser repair device - Google Patents

Abstract

An operating method of a single laser repair device is used to repair a circuit of a circuit board with defects. The circuit has conductive portions and a defect portion. The operating method includes: emitting an initial laser beam from a laser light source of a single laser dual-optical path repair element of a single laser repair module to a power distribution unit to generate a first laser beam and a second laser beam different from the first laser beam; shielding the second laser beam by a switching unit and transmitting the first laser beam to the circuit board, so that the defect portion is converted into a sintered portion; and shielding the first laser beam by the switching unit and transmitting the second laser beam to the circuit board so that a sintered lateral surface of the sintered portion is flush with conductive lateral surfaces of the conductive portions.

Description

Single laser repair equipment

The present disclosure relates to a single laser repair device and an operating method of the single laser repair device, and in particular to a single laser repair device and an operating method thereof that can sinter and trim circuits of a circuit board having open circuit defects and short circuit defects.

Generally speaking, laser repair equipment can be used to repair circuits on circuit boards with short circuit defects and open circuit defects. For example, laser repair equipment uses a laser head to emit a laser beam to the defective part of the circuit. However, when laser repair equipment is repairing a circuit, the defective circuit is prone to contact with adjacent circuits due to excessive concentration of laser beam energy power or excessive divergence angle of the laser beam, causing a short circuit or other defects.

One technical aspect of the present disclosure is a single laser repair device that can prevent a repaired circuit from easily contacting an adjacent circuit and causing a circuit short.

According to an embodiment of the present disclosure, the present disclosure provides a single laser repair device, which is used to repair a defective circuit in a circuit board, wherein the defective circuit has two conductive parts and a defective part located between the two conductive parts. The single laser repair device includes a single laser repair module. The single laser repair module includes a single laser dual optical path repair component, and more specifically, the single laser dual optical path repair component is arranged in the single laser repair module. The single laser dual optical path repair component includes a laser light source, a power distribution unit, and a switching unit. The laser light source is used to emit an initial laser beam. The power distribution unit is arranged on one side of the laser light source. The initial laser beam passes through the power distribution unit to generate a first laser beam and a second laser beam different from the first laser beam. The energy power of the first laser beam is different from the energy power of the second laser beam. The switching unit is arranged on one side of the power distribution unit. The switching unit is used to shield the second laser beam and allow the first laser beam to pass through the switching unit and be transmitted to the circuit board, so that the defective part of the line is transformed into a sintered part. After the defective part of the line is transformed into the sintered part, the switching unit is used to shield the first laser beam and allow the second laser beam to pass through the switching unit and be transmitted to the circuit board to trim the sintered part, so that the sintered side of the sintered part is flush with the two conductive sides of the two conductive parts.

According to an embodiment of the present disclosure, the single laser dual optical path patch further includes a first light spot adjustment unit and a second light spot adjustment unit. The first light spot adjustment unit is located between the power distribution unit and the switching unit and is used to receive the first laser beam passing through the power distribution unit. The second light spot adjustment unit is located on one side of the first light spot adjustment unit and is used to receive the second laser beam passing through the power distribution unit. The divergence angle of the first laser beam passing through the first light spot adjustment unit is different from the divergence angle of the second laser beam passing through the second light spot adjustment unit.

According to an embodiment of the present disclosure, the energy power of the first laser beam passing through the power distribution unit is greater than the energy power of the second laser beam passing through the power distribution unit, and/or the divergence angle of the first laser beam passing through the first light spot adjustment unit is greater than the divergence angle of the second laser beam passing through the second light spot adjustment unit.

According to an embodiment of the present disclosure, the two conductive parts are two metal wires or two polysilicon fused wires. The defect of the line is a short circuit defect. The defect is sintered by the first laser beam so that a part of the defect diffuses outward and exposes a part of the substrate of the circuit board, thereby converting the defect into a sintered part. The width of each of the two conductive parts is smaller than the width of the part of the substrate exposed by the defect.

According to an embodiment of the present disclosure, the two conductive parts are two metal wires or two polysilicon fused wires. The defect of the line is an open circuit defect. The two sides of the two conductive parts facing each other are sintered by the first laser beam to diffusely cover the defective part, so that the defective part is transformed into a sintered part and the two conductive parts are conductive.

According to an embodiment of the present disclosure, the two conductive parts are two metal wires or two polysilicon fuses. The defect of the line is an open circuit defect. The single laser repair module has an inkjet head. The inkjet head is used to spray conductive glue on the defective part of the line. The conductive glue partially covers the two conductive parts. The first laser beam sinters the conductive glue located in the line to turn the defective part into a sintered part.

According to an embodiment of the present disclosure, the above-mentioned single laser repair device further includes a first displacement module, a second displacement module, a third displacement module and a detection module. The first displacement module is connected to the single laser repair module and is used to move the single laser repair module in a first direction. The second displacement module is connected to the first displacement module and is used to move the first displacement module in a second direction. The third displacement module has a carrier. The carrier is used to carry a circuit board. The third displacement module is used to move the carrier in a third direction. Each of the first direction, the second direction and the third direction is perpendicular to the other two. The detection module is arranged on opposite sides of the third displacement module. When the third displacement module moves to drive the carrier through the detection module, the detection module is used to detect the thickness of the circuit in the circuit board.

According to an embodiment of the present disclosure, the single laser repair module has a detection lens. The detection lens faces the circuit board and is used to detect the current position of the circuit board to generate a movement drive signal according to the current position. The movement drive signal is used to drive the first displacement module, the second displacement module and the third displacement module to move so that the single laser repair module and the circuit board are positioned to a specific position.

Another technical aspect of the present disclosure is an operating method of a single laser repair device, which uses the above-mentioned single laser repair device to repair defective circuits in a circuit board to prevent the repaired circuit from easily contacting its adjacent circuits and causing a circuit short circuit.

According to an embodiment of the present disclosure, the present disclosure provides an operating method of a single laser repair device, which is used to repair a defective circuit in a circuit board, wherein the defective circuit has two conductive parts and a defective part located between the two conductive parts. The operation method includes: the laser light source of the single laser dual optical path repair component of the single laser repair module emits an initial laser beam to a power distribution unit to generate a first laser beam and a second laser beam different from the first laser beam, wherein the energy power of the first laser beam is different from the energy power of the second laser beam; shielding the second laser beam by a switching unit and transmitting the first laser beam to the circuit board through the switching unit, so that the defective part of the defective line is converted into a sintered part; and shielding the first laser beam by a switching unit and transmitting the second laser beam to the circuit board through the switching unit to trim the sintered part, so that the sintered side of the sintered part is flush with the two conductive sides of the two conductive parts.

According to an embodiment of the present disclosure, the method further includes: receiving a first laser beam passing through a power distribution unit by a first light spot adjustment unit and receiving a second laser beam passing through the power distribution unit by a second light spot adjustment unit, wherein a divergence angle of the first laser beam passing through the first light spot adjustment unit is different from a divergence angle of the second laser beam passing through the second light spot adjustment unit.

According to an embodiment of the present disclosure, the above-mentioned transformation of the defective portion into the sintered portion further includes: sintering two opposite sides of the two conductive portions by a first laser beam to diffusely cover the defective portion, so that the defective portion is transformed into the sintered portion and the two conductive portions are conductive.

According to an embodiment of the present disclosure, the above-mentioned conversion of the defective portion into a sintered portion further includes: removing a portion of the circuit so that the circuit has a defective portion, wherein the defect of the circuit is an open circuit defect, and the two conductive portions are two metal wires or two polysilicon fuses; spraying conductive glue on the defective portion of the circuit by an inkjet head of a single laser repair module, wherein the conductive glue partially covers the two conductive portions; and sintering the conductive glue located in the circuit by a first laser beam, so that the defective portion is converted into a sintered portion.

According to an embodiment of the present disclosure, the above-mentioned conversion of the defective portion into a sintered portion further includes: sintering the defective portion by a first laser beam so that a portion of the defective portion diffuses outward and exposes a portion of the substrate of the circuit board, thereby converting the defective portion into a sintered portion, wherein the defect of the line is a short circuit defect, and the width of each of the two conductive portions is smaller than the width of the portion of the substrate exposed by the sintered portion.

According to an embodiment of the present disclosure, the method further includes: driving the first displacement module, the second displacement module, and the third displacement module to move along the first direction, the second direction, and the third direction respectively, so that the single laser repair module connected to the first displacement module and the circuit board on the carrier of the third displacement module move, wherein each of the first direction, the second direction, and the third direction is perpendicular to the other two; and detecting the current position of the circuit board by the detection lens of the single laser repair module to generate a movement driving signal according to the current position, wherein the movement driving signal is used to drive the first displacement module, the second displacement module, and the third displacement module to move, so that the single laser repair module and the circuit board are positioned to a specific position.

According to an embodiment of the present disclosure, the method further includes moving the carrier on the third displacement module so that the carrier passes through the detection modules disposed on both sides of the third displacement module and the thickness of the circuits in the circuit board is detected by the detection modules.

According to the above-mentioned embodiments of the present disclosure, a single laser repair device can be used to repair circuits with open circuits and short circuits on a circuit board, and the single laser dual optical path repair component can emit a first laser beam and a second laser beam with different energy powers and/or different divergence angles to the circuit board. In addition, the first laser beam emitted by the single laser dual optical path repair component can transform the defective portion of the circuit into a sintered portion between two conductive portions, and the second laser beam emitted by the single laser dual optical path repair component can trim the sintered portion so that the sintered side of the sintered portion is flush with the two conductive side surfaces of the two conductive portions. The single laser dual optical path patch of the single laser patch equipment emits the first laser beam and the second laser beam so that the side of the repaired line can avoid contact with other lines, thereby preventing the repaired line from short circuiting or other defects.

The embodiments disclosed below provide many different embodiments, or examples, for implementing the different features of the subject matter provided. Specific examples of components and arrangements are described below to simplify the present invention. Of course, these examples are only examples and are not intended to be limiting. In addition, the present invention may repeat component symbols and/or letters in each example. This repetition is for the purpose of simplicity and clarity, and does not itself specify the relationship between the various embodiments and/or configurations discussed.

Spatially relative terms such as "below," "beneath," "lower," "above," "upper," and the like may be used herein for descriptive purposes to describe the relationship of one element or feature to another element or feature as illustrated in the accompanying figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the accompanying figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

Please refer to Figures 1 to 4, Figure 1 is a three-dimensional diagram of a single laser repair device 100 according to an embodiment of the present disclosure, Figure 2 is a front view of a single laser repair module 110 of Figure 1, Figure 3 is a schematic diagram of a single laser dual optical path repair component 111 emitting a first laser beam L1 according to an embodiment of the present disclosure, and Figure 4 is a schematic diagram of a single laser dual optical path repair component 111 emitting a second laser beam L2 according to an embodiment of the present disclosure. Please refer to Figures 1 to 4, the single laser repair device can be used to repair a defective line 210 of a circuit board 200 (to be described in detail below), and the single laser repair device 100 includes a single laser repair module 110. The single laser repair module 110 includes a single laser dual optical path repair component 111 .

In some embodiments, the single laser dual optical path patch 111 includes a laser light source 112, a power distribution unit 114, and a switching unit 115. The laser light source 112 is used to emit an initial laser beam L0. The power distribution unit 114 is disposed on one side of the laser light source 112. The initial laser beam L0 passes through the power distribution unit 114 to generate a first laser beam L1 and a second laser beam L2 different from the first laser beam L1. The energy power of the first laser beam L1 is different from the energy power of the second laser beam L2. For example, the energy power of the first laser beam L1 is greater than the energy power of the second laser beam L2.

In some embodiments, the single laser dual optical path repair component 111 further includes a first light spot adjustment unit 1131 and a second light spot adjustment unit 1132. The first light spot adjustment unit 1131 is located between the power distribution unit 114 and the switching unit 115 and is used to receive the first laser beam L1 passing through the power distribution unit 114. The second light spot adjustment unit 1132 is located on one side of the first light spot adjustment unit 1131 and is used to receive the second laser beam L2 passing through the power distribution unit 114. The divergence angle of the first laser beam L1 passing through the first light spot adjustment unit 1131 is different from the divergence angle of the second laser beam L2 passing through the second light spot adjustment unit 1132. For example, the divergence angle of the first laser beam L1 is greater than the divergence angle of the second laser beam L2.

In some embodiments, the switch unit 115 is disposed at one side of the power distribution unit 114. The switch unit 115 is used to shield the second laser beam L2 and allow the first laser beam L1 to pass through the switch unit 115 and be transmitted to the circuit board 200, or shield the first laser beam L1 and allow the second laser beam L2 to pass through the switch unit 115 and be transmitted to the circuit board 200.

In some embodiments, the single laser repair device 100 further includes a first displacement module 120, a second displacement module 130, a third displacement module 140, and a detection module 150. The first displacement module 120 is connected to the single laser repair module 110 and is used to move the single laser repair module 110 in the first direction D1. The second displacement module 130 is connected to the first displacement module 120 and is used to move the first displacement module 120 in the second direction D2. The third displacement module 140 has a stage 142. The stage 142 is used to support the circuit board 200. The third displacement module 140 is used to move the stage 142 in the third direction D3. Each of the first direction D1, the second direction D2, and the third direction D3 is perpendicular to the other two. The detection module 150 is disposed on opposite sides of the third displacement module 140. When the third displacement module 140 moves to drive the carrier 142 to pass through the detection module 150 , the detection module 150 can be used to detect the thickness T of the circuit 210 in the circuit board 200 .

In addition, the single laser repair module 110 has a detection lens 116 and an inkjet head 118. The detection lens 116 faces the circuit board 200 and is used to detect the current position of the circuit board 200 to generate a moving drive signal according to the current position. The moving drive signal is used to drive the first displacement module 120, the second displacement module 130 and the third displacement module 140 to move so that the single laser repair module 110 and the circuit board 200 are positioned at a specific position.

In the following description, the operation method of the single laser repair equipment will be explained. The component connection relationship, materials and functions that have been described will not be repeated, and it is best to explain them first.

Please refer to FIG5, which is a flow chart of the operation method of the single laser repair device according to an embodiment of the present disclosure. The operation method of the single laser repair device includes the following steps. First, in step S1, the laser light source of the single laser dual optical path repair component of the single laser repair module emits an initial laser beam to the power distribution unit to generate a first laser beam and a second laser beam different from the first laser beam, wherein the energy power of the first laser beam is different from the energy power of the second laser beam.

Please note that in other embodiments, other optical elements may be used to generate the first laser beam and the second laser beam, and the energy power of the first laser beam may be designed to be the same as the energy power of the second laser beam, but the divergence angle of the first laser beam is different from the divergence angle of the second laser beam. In summary, in the present disclosure, the energy power of the first laser beam is different from the energy power of the second laser beam, and/or the divergence angle of the first laser beam is different from the divergence angle of the second laser beam.

Next, in step S2, the defective portion of the defective line is transformed into a sintered portion by shielding the second laser beam through the switching unit and transmitting the first laser beam through the switching unit to the circuit board. Afterwards, in step S3, the sintered portion is trimmed by shielding the first laser beam through the switching unit and transmitting the second laser beam through the switching unit to the circuit board, so that the sintered side of the sintered portion is flush with the two conductive sides of the two conductive portions. In the following description, each of the above steps will be described in detail.

FIG6 to FIG8 illustrate cross-sectional views of a circuit 210 of a circuit board 200 with an open circuit defect in different states during repair according to an embodiment of the present disclosure. FIG9 and FIG10 illustrate top views of a circuit board 200 with an open circuit defect in different states during repair according to an embodiment of the present disclosure. Referring to FIG1 , FIG3 , and FIG6 to FIG10 , the operating method of the single laser repair device 100 can be used to repair a circuit 210 with a defect on a circuit board 200. The defective circuit 210 has two conductive portions 214 and a defect portion 2121 located between the two conductive portions 214.

First, the first displacement module 120, the second displacement module 130, and the third displacement module 140 can be driven along the first direction D1, the second direction D2, and the third direction D3, respectively, so that the single laser repair module 110 connected to the first displacement module 120 and the circuit board 200 on the stage 142 of the third displacement module 140 are moved. For example, the current position of the circuit board 200 can be detected by the detection lens 116 of the single laser repair module 110 to generate a movement driving signal according to the current position. The movement driving signal is used to drive the first displacement module 120, the second displacement module 130, and the third displacement module 140 to move, so that the single laser repair module 110 and the circuit board 200 are positioned at a specific position. In addition, the stage 142 may be moved on the third displacement module 140 so that the stage 142 passes through the detection modules 150 disposed on both sides of the third displacement module 140 to detect the thickness T of the circuit 210 in the circuit board 200 .

In some embodiments, the laser light source 112 of the single laser dual optical path patch 111 of the single laser patch module 110 may emit an initial laser beam L0 to the power distribution unit 114 to generate a first laser beam L1 and a second laser beam L2 different from the first laser beam. Then, the first laser beam L1 passing through the power distribution unit 114 may be received by the first light spot adjustment unit 1131, and the second laser beam L2 passing through the power distribution unit 114 may be received by the second light spot adjustment unit 1132.

In some embodiments, a portion of the line 210 may be removed, so that the line 210 has a defective portion 2121, and the two conductive portions 214 are two metal wires or two polysilicon fuses, wherein the defect of the line is an open circuit defect. In some embodiments, the conductive glue C may be sprayed on the defective portion 2121 of the line 210 by the inkjet head 118 of the single laser repair module 110, and the conductive glue C partially covers the two conductive portions 214. Then, the second laser beam L2 may be shielded by the switching unit 115 and the first laser beam L1 may be transmitted to the circuit board 200 through the switching unit 115, so that the defective portion 2121 of the defective line 210 is transformed into a sintered portion 212. That is, the conductive glue C located at the line 210 is sintered by the first laser beam L1, so that the defective portion 2121 is transformed into the sintered portion 212. Afterwards, the first laser beam L1 can be shielded by the switching unit 115 and the second laser beam L2 can be transmitted to the circuit board 200 through the switching unit 115 to trim the sintered portion 212, so that the sintered side surface 211 of the sintered portion 212 is flush with the two conductive side surfaces 213 of the two conductive portions 214, as shown in FIG. 10 .

Please refer to Figures 11 to 14, Figures 11 and 12 show cross-sectional views of the line 210 of the circuit board 200 with an open circuit defect in different states during repair according to another embodiment of the present disclosure, and Figures 13 and 14 show top views of the line 210 of the circuit board 200 with an open circuit defect in different states during repair according to another embodiment of the present disclosure. The implementation method shown in Figures 11 to 14 is different from the implementation method shown in Figures 6 to 10 in that the single laser repair module 110 does not use the inkjet head 118 to spray the conductive glue C (as shown in Figure 7), but directly uses the first laser beam L1 to sinter the two opposite sides of the two conductive parts 214 to diffusely cover the defective part 2121, so that the defective part 2121 is transformed into a sintered part 212 and the two conductive parts 214 are conductive to each other.

Please refer to Figures 15 to 19, Figures 15 and 16 show cross-sectional views of a circuit board 200 with a short-circuit defect in different states when repaired, and Figures 17 to 19 show top views of a circuit board 200 with a short-circuit defect in different states when repaired. Please refer to Figures 1, 3, 15 to 19, in this embodiment, there are two circuits 210, and the defect between the two circuits 210 is a short-circuit defect. First, the defective portion 2121 may be sintered by the first laser beam L1, so that a portion of the defective portion 2121 diffuses outward and exposes a portion of the substrate 220 of the circuit board 200, thereby transforming the defective portion 2121 into a sintered portion 212, as shown in FIG18, wherein the width W1 of each of the two conductive portions 214 is smaller than the width W2 of the sintered portion 212 exposing a portion of the substrate 220. After confirming that the width W2 of the sintered portion 212 exposing the substrate 220 is greater than the width W1 of the conductive portion 214, the sintered portion 212 may then be trimmed by the second laser beam L2, so that the sintered side surface 211 of the sintered portion 212 is flush with the two conductive side surfaces 213 of the two conductive portions 214, as shown in FIG19.

In summary, the single laser repair device 100 can be used to repair the circuit 210 with open circuit and short circuit defects on the circuit board 200, and the single laser dual optical path repair component 111 can emit the first laser beam L1 and the second laser beam L2 with different energy powers and/or different divergence angles to the circuit board 200. In addition, the first laser beam L1 emitted by the single laser dual optical path repair component 111 can transform the defective portion 2121 of the circuit 210 into a sintered portion 212 between two conductive portions 214, and the second laser beam L2 emitted by the single laser dual optical path repair component 111 can trim the sintered portion 212 so that the sintered side surface 211 of the sintered portion 212 is flush with the conductive side surface 213 of the conductive portion 214. The single laser dual optical path patch 111 of the single laser patch device 100 emits the first laser beam L1 and the second laser beam L2 so that the side of the repaired circuit can avoid contact with other circuits, thereby preventing the repaired circuit from short-circuiting.

The foregoing summarizes the features of several embodiments so that those skilled in the art can better understand the aspects of the present disclosure. Those skilled in the art should understand that they can easily use the present disclosure as a basis for designing or modifying other processes and structures to achieve the same purpose and/or achieve the same advantages as the embodiments described herein. Those skilled in the art should also recognize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they can make various changes, substitutions and modifications here without departing from the spirit and scope of the present disclosure.

100: Single laser repair equipment 110: Single laser repair module 111: Single laser dual optical path repair parts 112: Laser light source 114: Power distribution unit 115: Switching unit 116: Detection lens 118: Inkjet head 120: First displacement module 130: Second displacement module 140: Third displacement module 142: Carrier 150: Detection module 200: Circuit board 210: Line 211: Sintering side 212: Sintering part 213: Conductive side 214: Conductive part 220: Substrate 1131: First light spot adjustment unit 1132: Second light spot adjustment unit 2121: Defective part C: Conductive glue D1: First direction D2: Second direction D3: Third direction L0: Initial laser beam L1: First laser beam L2: Second laser beam S1: Step S2: Step S3: Step T: Thickness W1: Width W2: Width

One embodiment of the present disclosure is best understood from the following detailed description when read in conjunction with the accompanying drawings. It should be emphasized that, in accordance with standard industry practice, the various features are not drawn to scale and are for illustrative purposes only. In fact, the sizes of the various features may be arbitrarily increased or decreased for clarity of discussion. FIG. 1 illustrates a perspective view of a single laser repair device according to one embodiment of the present disclosure. FIG. 2 illustrates a front view of the single laser repair module of FIG. 1. FIG. 3 illustrates a schematic diagram of a single laser dual optical path repair component emitting a first laser beam according to one embodiment of the present disclosure. FIG. 4 illustrates a schematic diagram of a single laser dual optical path repair component emitting a second laser beam according to one embodiment of the present disclosure. FIG. 5 is a flow chart showing an operation method of a single laser repair device according to an embodiment of the present disclosure. FIG. 6 to FIG. 8 show cross-sectional views of a circuit board with an open circuit defect in different states during repair according to an embodiment of the present disclosure. FIG. 9 and FIG. 10 show top views of a circuit board with an open circuit defect in different states during repair according to an embodiment of the present disclosure. FIG. 11 and FIG. 12 show cross-sectional views of a circuit board with an open circuit defect in different states during repair according to another embodiment of the present disclosure. FIG. 13 and FIG. 14 show top views of a circuit board with an open circuit defect in different states during repair according to another embodiment of the present disclosure. FIG. 15 and FIG. 16 illustrate cross-sectional views of a circuit board with a short circuit defect in different states when repairing according to an embodiment of the present disclosure. FIG. 17 to FIG. 19 illustrate top views of a circuit board with a short circuit defect in different states when repairing according to an embodiment of the present disclosure.

100: Single laser repair equipment

110: Single laser repair module

111: Single laser dual optical path repair parts

118: Inkjet Head

120: First displacement module

130: Second displacement module

140: Third displacement module

142: Carrier

150: Detection module

D1: First direction

D2: Second direction

D3: Third direction

Claims (8)

A single laser repair device is used to repair a circuit (210) with a defect on a circuit board (200), wherein the circuit (210) with the defect has two conductive parts (214) and a defective part (2121) located between the two conductive parts (214), and the single laser repair device comprises: A single laser repair module (110), comprising: A single laser dual optical path repair component (111), arranged in the single laser repair module (110), and comprising: A laser light source (112), used to emit an initial laser beam (L0); A power distribution unit (114) is disposed on one side of the laser light source (112), and the initial laser beam (L0) passes through the power distribution unit (114) to generate a first laser beam (L1) and a second laser beam (L2) different from the first laser beam (L1), wherein an energy power of the first laser beam (L1) is different from an energy power of the second laser beam (L2); and A switching unit (115) is arranged on one side of the power distribution unit (114), wherein the switching unit (115) is used to shield the second laser beam (L2) and allow the first laser beam (L1) to pass through the switching unit (115) and be transmitted to the circuit board (200), so that the defective portion (2121) of the line (210) is transformed into a sintered portion (212), and the defective portion (2121) of the line (210) is sintered. After the sintered portion (2121) is transformed into the sintered portion (212), the switching unit (115) is used to shield the first laser beam (L1) and allow the second laser beam (L2) to pass through the switching unit (115) and be transmitted to the circuit board (200) to trim the sintered portion (212) so that a sintered side surface (211) of the sintered portion (212) is flush with the two conductive side surfaces (213) of the two conductive portions (214). The single laser repair device as described in claim 1, wherein the single laser dual optical path repair component (111) further comprises: a first light spot adjustment unit (1131), located between the power distribution unit (114) and the switching unit (115), and used to receive the first laser beam (L1) passing through the power distribution unit (114); and a second light spot adjustment unit (1132), located on one side of the first light spot adjustment unit (1131) and used to receive the second laser beam (L2) passing through the power distribution unit (114), wherein a divergence angle of the first laser beam (L1) passing through the first light spot adjustment unit (1131) is different from a divergence angle of the second laser beam (L2) passing through the second light spot adjustment unit (1132). A single laser repair device as described in claim 2, wherein the energy power of the first laser beam (L1) passing through the power distribution unit (114) is greater than the energy power of the second laser beam (L2) passing through the power distribution unit (114), and/or the divergence angle of the first laser beam (L1) passing through the first light spot adjustment unit (1131) is greater than the divergence angle of the second laser beam (L2) passing through the second light spot adjustment unit (1132). A single laser repair device as described in claim 1, wherein the two conductive parts (214) are two metal wires or two polysilicon fuses, and the defect of the circuit (210) is a short circuit defect, and the defect part (2121) is sintered by the first laser beam (L1) so that a part of the defect part (2121) diffuses outward and exposes a part of a substrate (220) of the circuit board (200), thereby converting the defect part (2121) into the sintered part (212), wherein a width (W1) of each of the two conductive parts (214) is smaller than a width (W2) of the part of the defect part (2121) exposed on the substrate (220). A single laser repair device as described in claim 1, wherein the two conductive parts (214) are two metal wires or two polysilicon fuses, and the defect of the circuit (210) is an open circuit defect, and the two opposite sides of the two conductive parts (214) are sintered by the first laser beam (L1) to diffusely cover the defective part (2121), so that the defective part (2121) is transformed into the sintered part (212) and the two conductive parts (214) are conductive. A single laser repair device as described in claim 1, wherein the two conductive parts (214) are two metal wires or two polysilicon fuses, and the defect of the circuit (210) is an open circuit defect, and the single laser repair module (110) has an inkjet head (118), and the inkjet head (118) is used to spray a conductive glue (C) on the defective part (2121) of the circuit (210), and the conductive glue (C) partially covers the two conductive parts (214), and the first laser beam (L1) sinters the conductive glue (C) located in the circuit (210) so that the defective part (2121) becomes the sintered part (212). The single laser repair device as described in claim 1 further comprises: A first displacement module (120), connected to the single laser repair module (110) and used to move the single laser repair module (110) in a first direction (D1); A second displacement module (130), connected to the first displacement module (120) and used to move the first displacement module (120) in a second direction (D2); A third displacement module (140), having a carrier (142), wherein the carrier (142) is used to carry the circuit board (200), and the third displacement module (140) is used to move the carrier (142) in a third direction (D3), wherein each of the first direction (D1), the second direction (D2) and the third direction (D3) is perpendicular to the other two; and A detection module (150) is disposed on two opposite sides of the third displacement module (140), wherein when the third displacement module (140) moves to drive the carrier (142) to pass through the detection module (150), the detection module (150) is used to detect a thickness (T) of the circuit (210) in the circuit board (200). A single laser repair device as described in claim 7, wherein the single laser repair module (110) has a detection lens (116), the detection lens (116) faces the circuit board (200) and is used to detect a current position of the circuit board (200) to generate a movement drive signal according to the current position, wherein the movement drive signal is used to drive the first displacement module (120), the second displacement module (130) and the third displacement module (140) to move so that the single laser repair module (110) and the circuit board (200) are positioned at a specific position.

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