TWM657332U - High-temperature-resistant insulating film and battery module comprising the same - Google Patents

Abstract

The present application discloses a high-temperature-resistant insulating film comprising an upper additional layer, a mica layer, and a lower additional layer. The high-temperature-resistant insulating film not only possesses excellent high-temperature resistance, superior mechanical performance, and exceptional insulation performance but also has significantly lower costs compared to conventional plastic films.

Description

High temperature resistant insulating film and battery module containing the same

This case involves the field of thin films, and in particular, a high-temperature resistant insulating film.

Insulating films are used to isolate various electronic devices or components to avoid failures between electronic devices or components, or between electronic components in electronic devices or components due to short circuits, breakdown, etc. Some insulating films also need to be resistant to high temperatures to reduce the impact of local high temperatures on electronic devices or components, thereby ensuring the normal operation of various electronic devices or components.

The purpose of this case is to provide a high temperature resistant insulating film, which is used in electronic devices or components, and can not only meet the requirements of electronic devices or components for insulation, but also has good high temperature resistance. At the same time, this high temperature resistant insulating film also has the characteristics of good mechanical properties to meet the needs of the use environment.

In the first aspect, the present case provides a high-temperature resistant insulating film, comprising: an upper additional layer; a mica layer; and a lower additional layer; wherein the outer surface of the upper additional layer forms the first outer surface of the high-temperature resistant insulating film, and the inner surface of the upper additional layer is attached to the upper surface of the mica layer; and wherein the inner surface of the lower additional layer is attached to the lower surface of the mica layer, and the outer surface of the lower additional layer forms the second outer surface of the high-temperature resistant insulating film.

According to the first aspect above, the upper additional layer is directly attached to the upper surface of the mica layer; and the lower additional layer is directly attached to the lower surface of the mica layer.

According to the above first aspect, the upper additional layer is an upper reinforcement layer; and the lower additional layer is a lower reinforcement layer.

According to the above-mentioned first aspect, the material of the upper additional layer has an uncured state and a cured state. When the material of the upper additional layer is in the uncured state, the material of the upper additional layer is bonded to the upper surface of the mica layer. When the upper additional layer is transformed into a cured state, the material of the upper additional layer forms the upper reinforcement layer; and the material of the lower additional layer has an uncured state and a cured state. When the material of the lower additional layer is in the uncured state, the material of the lower additional layer is bonded to the lower surface of the mica layer. When the lower additional layer is transformed into a cured state, the material of the lower additional layer forms the lower reinforcement layer.

According to the above first aspect, the curing state of the upper additional layer and the lower additional layer is a chemically cross-linked cured coating.

According to the first aspect above, the upper additional layer and the lower additional layer are transformed from a non-cured state to a cured state by radiation induction.

According to the above first aspect, the upper additional layer and the lower additional layer are transformed from a non-cured state to a cured state by heating or drying.

According to the first aspect above, the material of the upper additional layer and the lower additional layer is epoxy resin coating or PU coating.

According to the above first aspect, the thickness of the mica layer is 0.1~3mm.

According to the above first aspect, the thickness of the upper additional layer and the lower additional layer is within 100 μm.

In a second aspect, the present case provides a high-temperature resistant insulating film, comprising: an upper additional layer and an upper bonding layer; a mica layer; and a lower additional layer and a lower bonding layer; wherein the outer surface of the upper additional layer forms the first outer surface of the high-temperature resistant insulating film, and the inner surface of the upper additional layer is bonded to the upper surface of the mica layer through the upper bonding layer; and wherein the inner surface of the lower additional layer is bonded to the lower surface of the mica layer through the lower bonding layer, and the outer surface of the lower additional layer forms the second outer surface of the high-temperature resistant insulating film.

According to the above second aspect, the upper additional layer and the lower additional layer are plastic films, the upper additional layer is an upper reinforcement layer; and the lower additional layer is a lower reinforcement layer.

According to the above second aspect, the upper additional layer and the lower additional layer are PET film or PP film.

According to the above second aspect, the upper bonding layer and the lower bonding layer are glue.

According to the above second aspect, through a lamination process, the upper additional layer is bonded to the upper surface of the mica layer through the upper bonding layer, and the lower additional layer is bonded to the lower surface of the mica layer through the lower bonding layer.

According to the above second aspect, the thickness of the mica layer is 0.1~3mm.

According to the above second aspect, the total thickness of the upper additional layer and the upper bonding layer and the total thickness of the lower additional layer and the lower bonding layer are both within 100 μm.

This case provides a battery module in a cooperative manufacturer, comprising: a casing; a plurality of battery cells, the plurality of battery cells being arranged side by side in the casing; and a high-temperature resistant insulating film, the high-temperature resistant insulating film being arranged between two adjacent battery cells among the plurality of battery cells, or between the plurality of battery cells and the casing; wherein the high-temperature resistant insulating film is as described in any one of the first aspect or the second aspect.

Various specific embodiments of the present invention will be described below with reference to the accompanying drawings that form part of this specification. It should be understood that although directional terms such as "front", "back", "up", "down", "left", "right", "top", "bottom", "inside", "outside" and the like are used in the present invention to describe various exemplary structural parts and components, these terms are used here only for the purpose of convenience of explanation and are determined based on the exemplary orientations shown in the accompanying drawings. Since the embodiments disclosed in the present invention can be set in different directions, these directional terms are only used as an illustration and should not be regarded as limiting.

In this case, unless otherwise specified, all equipment and raw materials can be purchased from the market or are commonly used in this industry. The methods in the following embodiments are general methods in this field unless otherwise specified.

The mica layer in this case is made of mica paper or mica powder bonded with a binder and then heated and pressed. The weight of mica accounts for about 90% and the weight of the binder accounts for about 10%. As an example, the binder is organic silicone glue. The mica paper or mica powder can be phlogopite, white mica or other synthetic mica. In some embodiments, the mica layer is a commercially available mica sheet or cloud motherboard.

1A and 1B show the specific structure of a high temperature resistant insulating film 100 according to an embodiment of the present invention. As shown in FIG1A and 1B, the high temperature resistant insulating film 100 includes a mica layer 101, an upper additional layer 102, and a lower additional layer 103. As an example, the thickness of the mica layer 101 is 0.1 to 3 mm, and the thickness of the upper additional layer 102 and the lower additional layer 103 is within 100 μm.

The inner surface of the upper additional layer 102 is attached to the upper surface of the mica layer 101, and the outer surface of the upper additional layer 102 forms the first outer surface (i.e., the upper outer surface) of the high-temperature resistant insulating film 100. In the embodiment shown in FIGS. 1A and 1B , the inner surface of the upper additional layer 102 is directly attached to the upper surface of the mica layer 101. The inner surface of the lower additional layer 103 is attached to the lower surface of the mica layer 101, and the outer surface of the lower additional layer 103 forms the second outer surface (i.e., the lower outer surface) of the high-temperature resistant insulating film 100. In this embodiment, the inner surface of the lower additional layer 103 is directly attached to the lower surface of the mica layer 101.

The upper additional layer 102 and the lower additional layer 103 are made of a material different from that of the mica layer 101. The upper additional layer 102 and the lower additional layer 103 may be made of the same material or different materials. In the present embodiment, the upper additional layer 102 and the lower additional layer 103 are made of the same material. The materials of the upper additional layer 102 and the lower additional layer 103 have a non-cured state and a cured state. When the materials of the upper additional layer 102 and the lower additional layer 103 are in a non-cured state, the upper additional layer 102 and the lower additional layer 103 are applied and bonded to the upper surface and the lower surface of the mica layer 101. When the materials of the upper additional layer 102 and the lower additional layer 103 are converted into a cured state, the upper additional layer 102 and the lower additional layer 103 form an upper reinforcement layer and a lower reinforcement layer, respectively. The upper reinforcement layer and the lower reinforcement layer refer to additional layers that can enhance the mechanical properties of the mica layer.

The curing state of the upper additional layer 102 and the lower additional layer 103 is a chemically cross-linked cured coating. In the production process, the uncured material is first coated on the upper surface and the lower surface of the mica layer 101 by a rolling coating process, a scraping coating process or a spray coating process, and then the uncured material is converted into a cured state to obtain the upper additional layer 102 and the lower additional layer 103 in a cured state. In some embodiments, the conversion of the upper additional layer 102 and the lower additional layer 103 from the uncured state to the cured state is induced by radiation. In a specific embodiment, the non-cured material that can be cured by radiation is a commercially available UV light-curing adhesive coating, the coating thickness of which is 0.02-0.05 mm, and the coating can be converted into a cured state by irradiation with ultraviolet light having a wavelength of 300-370 nm and a light source radiation intensity of 60-120 w/cm. In other embodiments, the upper additional layer 102 and the lower additional layer 103 are converted from a non-cured state to a cured state by heating or drying. In a specific embodiment, the non-cured material that can be cured by heating or drying is an epoxy resin coating, the coating thickness of the coating is 0.02-0.1 mm, and the coating can be converted into a cured state by heating to 60-120° C. In another specific embodiment, the non-cured material that can be cured by heating or drying is a PU (polyurethane) coating, and the coating can be converted into a cured state by drying in air.

1C and 1D show the specific structure of a high temperature resistant insulating film 130 according to another embodiment of the present invention. As shown in FIG1C and 1D, the high temperature resistant insulating film 130 includes a mica layer 101, an upper additional layer 102 and an upper bonding layer 122, and a lower additional layer 103 and a lower bonding layer 123. As an example, the thickness of the mica layer 101 is 0.1 to 3 mm, the total thickness of the upper additional layer 102 and the upper bonding layer 122 is within 100 μm, and the lower additional layer 103 and the lower bonding layer 123 are also within 100 μm. In this embodiment, the upper additional layer 102 and the lower additional layer 103 cannot play a bonding role, that is, the upper additional layer 102 and the lower additional layer 103 cannot directly adhere to the upper and lower surfaces of the mica layer 101. The upper bonding layer 122 and the lower bonding layer 123 cannot play a reinforcing role, that is, the upper bonding layer 122 and the lower bonding layer 123 cannot enhance the mechanical properties of the mica layer 101.

In the embodiment shown in FIG. 1C and FIG. 1D , the inner surface of the upper additional layer 102 is attached to the upper surface of the mica layer 101 through the upper adhesive layer 122, and the outer surface of the upper additional layer 102 forms the first outer surface (i.e., the upper outer surface) of the high-temperature resistant insulating film 130. The inner surface of the lower additional layer 103 is attached to the lower surface of the mica layer 101 through the lower adhesive layer 123, and the outer surface of the lower additional layer 103 forms the second outer surface (i.e., the lower outer surface) of the high-temperature resistant insulating film 130.

The upper additional layer 102 and the lower additional layer 103 are made of a material different from that of the mica layer 101. The upper additional layer 102 and the lower additional layer 103 can be made of the same material or different materials. In this embodiment, the upper additional layer 102 and the lower additional layer 103 are made of the same material. In some embodiments, the upper additional layer 102 and the lower additional layer 103 are plastic films, such as PET (polyethylene terephthalate) films or PP (polypropylene) films. The upper adhesive layer 122 and the lower adhesive layer 123 are glue, such as hot melt glue or heat-cured glue. In this embodiment, the glue is hot melt glue. The upper additional layer 102 and the lower additional layer 103 respectively form an upper reinforcement layer and a lower reinforcement layer, which play a role in enhancing the mechanical properties of the mica layer 101. The upper bonding layer 122 and the lower bonding layer 123 do not serve as reinforcement layers.

Specifically, in the production process, hot melt adhesive is first applied to the upper and lower surfaces of the mica layer 101 by a rolling process, a scraping process, or a spraying process to obtain an upper adhesive layer 122 and a lower adhesive layer 123, respectively, and then a plastic film is applied to the upper adhesive layer 122 and the lower adhesive layer 123, respectively, and finally the plastic film is bonded to the upper and lower surfaces of the mica layer 101 by a lamination process to form an upper additional layer 102 and an upper adhesive layer 122, and a lower additional layer 103 and a lower adhesive layer 123. In some embodiments, the coating thickness of the upper adhesive layer 122 and the lower adhesive layer 123 is 0.01-0.05 mm.

It is known to those skilled in the art that the materials of the upper additional layer 102 and the lower additional layer 103 are not limited to the embodiments described above.

The high temperature resistant insulating film of each embodiment of the present case has excellent high temperature resistance, and the heat resistance temperature can reach above 600~700℃. And the high temperature resistant insulating film has excellent high temperature insulation, and still maintains insulation at a high temperature of 600~700℃. The high temperature resistant insulating film also has good mechanical properties, and the tensile strength can reach above 100Mpa. Compared with the insulating film of general plastic material, the high temperature resistant insulating film of the present case not only has heat resistance at higher temperature, but also has low cost.

The applicant found that the mica sheets or cloud motherboards generally available on the market are prone to falling off debris during transportation or installation on other components because they need to be bonded and pressed with adhesives during the production process. In the application environment of some electronic products, the falling debris will affect the performance stability of the electronic products and is not conducive to environmental protection.

The surface of the high-temperature resistant insulating film in this case is no longer a mica layer, but the outer surface of each additional layer. Therefore, it can effectively prevent the mica layer from generating debris. Even if debris is generated, the debris is not easy to fall off, so it will not affect the performance stability of electronic products.

In addition, the applicant also found that although the thickness of the upper additional layer and the lower additional layer is very thin compared to the mica layer, it can have a good effect on improving the mechanical properties of the mica layer. For example, the high-temperature resistant insulating film in this case can have better bending resistance and anti-shattering ability compared to the existing mica sheets or cloud motherboards. Even when the high-temperature resistant insulating film is bent under force, it is not easy to break. As a specific example, when the existing cloud motherboard is bent at 60°, it will break and shed debris after being bent twice. The high-temperature resistant insulating film in this case can be bent repeatedly 7-9 times, and the high-temperature resistant insulating film will still not break or shed debris.

The following specifically describes the production method of the high temperature resistant insulating films 100 and 130 in conjunction with Figures 2A-2D. Figure 2A illustrates the process of the production method of the high temperature resistant insulating film 100. Figure 2B illustrates the process of the production method of the high temperature resistant insulating film 130. Figure 2C shows a schematic diagram of a spraying device for coating a non-cured material on the upper and lower surfaces of the mica layer 101. Figure 2D shows a schematic diagram of a laminating device for laminating a plastic film onto the upper adhesive layer 122 and the lower adhesive layer 123 of the high temperature resistant insulating film 130.

As shown in FIG. 2A and FIG. 2C , in step 231, the material in the uncured state is coated on the upper and lower surfaces of the mica layer 101 by a spraying process. Specifically, in the production process, a pair of nozzles 207 of the spraying equipment are respectively fixed above and below the mica layer 101. The mica layer 101 is transported from left to right between the pair of nozzles 207 to coat the upper additional layer 102 and the lower additional layer 103 in the uncured state on the upper and lower surfaces of the mica layer 101, respectively. After the spraying is completed, step 232 is entered. In step 232, the upper additional layer 102 and the lower additional layer 103 in the non-cured state are cured by radiation, heating or drying, so that the high temperature resistant insulating film 100 can be obtained.

As shown in FIG2B and FIG2D , in step 234, hot melt adhesive is applied to the upper and lower surfaces of the mica layer 101 to obtain the mica layer 101 coated with the upper adhesive layer 122 and the lower adhesive layer 123. Then in step 235, a plastic film is attached to the upper adhesive layer 122 and the lower adhesive layer 123 by a lamination process. Specifically, in the production process, the mica layer 101 coated with the upper adhesive layer 122 and the lower adhesive layer 123 is transported from left to right between a pair of rollers 206. While the mica layer 101 is transported through the pair of rollers 206, the plastic film is also transported through the pair of rollers 206 to apply the plastic film from above the upper adhesive layer 122 and below the lower adhesive layer 123. The speed of applying the plastic film is 2-20 m/min. The pair of rollers 206 rotate in opposite directions, and the plastic film is connected to the corresponding adhesive layer by heating and pressurizing, so that the plastic film is attached to the upper and lower surfaces of the mica layer 101. In this embodiment, the roller 206 above the mica layer 101 rotates counterclockwise, and the roller 206 below the mica layer 101 rotates clockwise to press the plastic film onto the upper adhesive layer 122 and the lower adhesive layer 123 respectively. The two rollers 206 apply a pressure of 3 to 25 MPa to the mica layer 101 and the plastic film passing through them, and the temperature of the mica layer 101 and the plastic film when passing between the two rollers 206 (i.e., the lamination temperature) is controlled at 95 to 125°C.

The high temperature resistant insulating film in this case can be used in various electronic products or equipment to illustrate the heat dissipation of electronic products and equipment. Such electronic products or equipment can be battery modules, heating coils, motors and other electrical equipment.

FIG. 3A and FIG. 3B are schematic structural diagrams of an embodiment of a battery module including the high-temperature resistant insulating film 100 of the present invention, wherein FIG. 3A shows the overall structure of the battery module 310, and FIG. 3B shows the exploded structure of the battery module 310. As shown in FIG. 3A and FIG. 3B, the battery module 310 includes a plurality of battery cells 312 and a housing 311. The housing 311 includes a substantially square box body 315 and an upper cover 313, wherein the box body 315 has a cavity 308, and the upper cover 313 is disposed above the box body 315 to seal the cavity 308. A plurality of battery cells 312 are accommodated in the cavity 308 of the box body 315. Each battery cell 312 has its own connection terminal 305. After the respective connection terminals 305 of these battery cells 312 are electrically connected together according to a predetermined circuit, they are then powered and/or charged externally through a main connection terminal (not shown in the figure) provided on the housing 311.

The high temperature resistant insulating film 100 is disposed between adjacent battery cells 312 and between each battery cell 312 and the box body 315. In some embodiments, the high temperature resistant insulating film 100 is connected to the adjacent battery cells 312 or between the battery cells 312 and the box body 315 by fastening members such as bolts. In some embodiments, the high temperature resistant insulating film 100 is bonded to the adjacent battery cells 312 or between the battery cells 312 and the box body 315 by glue. In addition to insulating adjacent battery cells 312, the high-temperature resistant insulating film 100 can also prevent some battery cells 312 from generating excessive heat or excessive temperature, thereby causing damage to the entire battery module 310.

In addition, during the transportation process of the battery module 310, the high temperature resistant insulating film 100 can also play a supporting role to a certain extent, preventing the battery cells 312 from being squeezed and deformed.

If a high-temperature-resistant plastic film is used between the battery cells 312, not only is the cost high, but the supporting effect is limited. In addition, even the heat-resistant plastic film has a limited heat resistance. If the temperature of the battery cell 312 is too high, the plastic film may still melt or be damaged. If a commercially available mica sheet is used between the battery cells 312, although the heat resistance is improved, the mica sheet is prone to falling into debris during transportation and installation, and the debris falls into the box body 315, which may affect the performance of the battery module 310.

The high-temperature resistant insulating film in this case uses mica sheets as the middle layer, and additional layers are set above and below the mica layer to enhance the mechanical properties of the mica layer while retaining the high-temperature resistant performance of the mica layer itself, and prevent the mica layer from falling debris, which facilitates the transportation and installation of the high-temperature resistant insulating film. It is also particularly suitable for heat dissipation and support inside battery cells.

Finally, the high temperature resistant insulating film of the present invention has many beneficial technical effects. The following lists at least some of the technical effects of the high temperature resistant insulating film of the present invention:

1. Excellent high temperature resistance, the heat resistance temperature can reach above 600~700℃, which can meet the heat resistance requirements of electronic products and equipment. 2. Excellent mechanical properties, the tensile strength can reach above 100Mpa, and it can be bent repeatedly, so that it can not be damaged during transportation, packaging and processing and molding by electronic product and equipment manufacturers. 3. Excellent insulation performance, especially the insulation performance at high temperature, can meet the insulation requirements of electronic products and equipment. 4. Simple production process. 5. Easy to use, cost saving, the cost is much lower than that of general plastic film.

Although the present invention has been described in conjunction with the examples of the embodiments summarized above, various alternatives, modifications, variations, improvements and/or substantially equivalent solutions, whether known or currently or soon foreseeable, may be apparent to those having at least ordinary skill in the art. Therefore, the examples of the embodiments of the present invention as described above are intended to be illustrative rather than restrictive. Various changes may be made without departing from the spirit or scope of the present invention. Therefore, the present invention is intended to include all known or earlier developed alternatives, modifications, variations, improvements and/or substantially equivalent solutions. The technical effects and technical problems in this specification are exemplary rather than restrictive. It should be noted that the embodiments described in this specification may have other technical effects and may solve other technical problems.

100: High temperature resistant insulating film 101: Mica layer 102: Upper additional layer 103: Lower additional layer 122: Upper bonding layer 123: Lower bonding layer 130: High temperature resistant insulating film 206: Roller 207: Nozzle 231: Step 232: Step 234: Step 235: Step 305: Connecting terminal 308: Cavity 310: Battery module 311: Housing 312: Battery unit 313: Upper cover 315: Box body A-A: Line B-B: Line

FIG. 1A is a schematic diagram of a three-dimensional structure of an embodiment of a high-temperature resistant insulating film according to the present invention;

FIG1B is a cross-sectional view of the high temperature resistant insulating film shown in FIG1A along line A-A;

FIG1C is a schematic diagram of a three-dimensional structure of another embodiment of the high-temperature resistant insulating film according to the present invention;

FIG1D is a cross-sectional view of the high temperature resistant insulating film shown in FIG1C along line B-B;

FIG. 2A is a flow chart of producing the high temperature resistant insulating film shown in FIG. 1A ;

FIG. 2B is a flow chart of producing the high temperature resistant insulating film shown in FIG. 1A ;

FIG2C is a schematic diagram of a spraying device;

FIG2D is a schematic diagram of a lamination device;

FIG3A is a schematic diagram of a three-dimensional structure of a battery module including the high-temperature resistant insulating film shown in FIG1A ;

FIG. 3B is an exploded view of the battery module shown in FIG. 3A .

100: High temperature resistant insulation film

101: Mica layer

102: Additional layer

103: Lower additional layer

A-A: Line

Claims (18)

A high temperature resistant insulating film, characterized in that it comprises: an upper additional layer (102); a mica layer (101); and a lower additional layer (103); wherein the outer surface of the upper additional layer (102) forms the first outer surface of the high temperature resistant insulating film (100), and the inner surface of the upper additional layer (102) is attached to the upper surface of the mica layer (101); and wherein the inner surface of the lower additional layer (103) is attached to the lower surface of the mica layer (101), and the outer surface of the lower additional layer (103) forms the second outer surface of the high temperature resistant insulating film (100). According to claim 1, the high temperature resistant insulating film, wherein: the upper additional layer (102) is directly attached to the upper surface of the mica layer (101); and the lower additional layer (103) is directly attached to the lower surface of the mica layer (101). According to the high temperature resistant insulating film of claim 2, wherein: the upper additional layer (102) is an upper reinforcement layer; and the lower additional layer (103) is a lower reinforcement layer. According to claim 3, the high temperature resistant insulating film, wherein: the material of the upper additional layer (102) has a non-solidified state and a solidified state. When the material of the upper additional layer (102) is in the non-solidified state, the material of the upper additional layer (102) is bonded to the upper surface of the mica layer (101). When the upper additional layer (102) is converted into a solidified state, The upper reinforcement layer is formed; and the material of the lower additional layer (103) has a non-solidified state and a solidified state. When the material of the lower additional layer (103) is in the non-solidified state, the material of the lower additional layer (103) is bonded to the lower surface of the mica layer (101). When the lower additional layer (103) is converted into a solidified state, the material of the lower additional layer (103) forms the lower reinforcement layer. According to claim 4, the high temperature resistant insulating film, wherein: the curing state of the upper additional layer (102) and the lower additional layer (103) is a chemically cross-linked cured coating. According to claim 5, the high temperature resistant insulating film, wherein: the upper additional layer (102) and the lower additional layer (103) are transformed from a non-cured state to a cured state by radiation induction. According to claim 5, the high temperature resistant insulating film, wherein: the upper additional layer (102) and the lower additional layer (103) are transformed from a non-cured state to a cured state by heating or drying. According to the high temperature resistant insulating film of claim 7, the material of the upper additional layer (102) and the lower additional layer (103) is epoxy resin coating or PU coating. According to the high temperature resistant insulating film of claim 1, the thickness of the mica layer (101) is 0.1~3mm. According to the high temperature resistant insulating film of claim 9, the thickness of the upper additional layer (102) and the lower additional layer (103) is within 100 μm. A high temperature resistant insulating film, characterized in that it comprises: an upper additional layer (102) and an upper bonding layer (122); a mica layer (101); and a lower additional layer (103) and a lower bonding layer (123); wherein the outer surface of the upper additional layer (102) forms the first outer surface of the high temperature resistant insulating film (100), and the inner surface of the upper additional layer (102) is bonded to the upper surface of the mica layer (101) through the upper bonding layer (122); and wherein the inner surface of the lower additional layer (103) is bonded to the lower surface of the mica layer (101) through the lower bonding layer (123), and the outer surface of the lower additional layer (103) forms the second outer surface of the high temperature resistant insulating film (100). According to claim 11, the high temperature resistant insulating film, wherein: the upper additional layer (102) and the lower additional layer (103) are plastic films, the upper additional layer (102) is an upper reinforcement layer; and the lower additional layer (103) is a lower reinforcement layer. According to the high temperature resistant insulating film of claim 12, wherein: the upper additional layer (102) and the lower additional layer (103) are PET film or PP film. According to the high temperature resistant insulating film of claim 11, the upper adhesive layer (122) and the lower adhesive layer (123) are hot melt adhesives. According to claim 11, the high temperature resistant insulating film, wherein: through a lamination process, the upper additional layer (102) is bonded to the upper surface of the mica layer (101) through the upper adhesive layer (122), and the lower additional layer (103) is bonded to the lower surface of the mica layer (101) through the lower adhesive layer (123). According to the high temperature resistant insulating film of claim 11, the thickness of the mica layer (101) is 0.1~3mm. According to the high temperature resistant insulating film of claim 11, the total thickness of the upper additional layer (102) and the upper bonding layer (122) and the total thickness of the lower additional layer (103) and the lower bonding layer (123) are both within 100 μm. A battery module, characterized by comprising: a housing (311); a plurality of battery cells (312), the plurality of battery cells (312) being arranged side by side in the housing (311); and a high temperature resistant insulating film (100) as described in any one of claims 1 to 17, the high temperature resistant insulating film (100) being arranged between two adjacent battery cells (312) among the plurality of battery cells (312), or between the plurality of battery cells (312) and the housing (311).

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