TWM610072U - Water cooling apparatus - Google Patents

Abstract

A water-cooled heat dissipation device includes: a carrier body, a water cooling head, a pump, a cover, a first tube body, and a second tube body; the carrier body has a first side surface and a second tube body. The side surface, an orifice, the orifice penetrates the first and second side surfaces of the carrier body; the water-cooling head has an upper part and a lower part and is arranged in the orifice, and the upper part of the water-cooling head has a water inlet and a water outlet Connected with a first space inside the water cooling head; the pump is arranged on the first side surface of the carrier body, and has a first water inlet and a first water outlet; the cover is hollow and one side is open , Correspondingly cover the first side surface of the carrier body and form a second space, the cover has a second water inlet and a second water outlet and communicates with the second space; The first and second pipes are connected in series to form the water-cooled heat dissipation device, so that it can be directly attached to the electronic unit to absorb heat and provide a bearing, and then the heat can be dissipated through water cooling.

Description

Water cooling device

This creation is related to a water-cooled heat sink, especially a water-cooled heat sink.

Press, with the increase in computer processing speed, the computer can be more effective with different functional interface cards. In order to meet the needs of users, the working clock of the chip on the interface card is as high as hundreds of millions of hertz (Hz). ), and such a high-frequency work speed, heat problems should arise. When the interface card temperature is too high, the lighter ones will cause an increase in power consumption, the more serious ones may damage the electronic components and shorten the life of the processor, which will seriously affect the efficiency, reliability and stability of the processor. Therefore, in order to remove the heat from the interface card, there is a water-cooled heat dissipation system consisting of a pump, a water block, and a radiator. The general working method is that the heat exchange element exchanges heat with the heat source of the interface card, and then cools the liquid. (For example, water) flows into the heat exchange element for heat exchange and transfers heat energy to the cooling liquid. The pump pressurizes the cooling liquid to flow into the radiator to achieve rapid heat dissipation, so that the interface card can operate normally. However, the conventional water cooling system only installs the water cooling head on the main heating element (such as the graphics processor) to dissipate the main heating element, but the main heating element is also equipped with other heating elements at the same time. The conventional water cooling The heat dissipation system is unable to dissipate heat from other heating elements, resulting in poor heat dissipation of the interface card. Therefore, how to solve the above-mentioned problems is the direction for those skilled in the art.

One purpose of this creation is to provide a water-cooled heat dissipation device that dissipates heat from a plurality of heating elements on an electronic device, thereby increasing the heat dissipation effect. In order to achieve the above-mentioned purpose, this creation provides a water-cooled heat sink, which includes: a carrier body, a water cooling head, a pump, a cover, a first tube body, and a second tube body; The carrier body has a first side surface, a second side surface, and an orifice, which penetrates through the first and second sides of the carrier body; the water cooling head has an upper part and a lower part, and the water cooling head corresponds to It is arranged in the orifice, a contact surface at the lower part of the water block selectively protrudes or is in line with the second side surface, and the upper part of the water block has a water inlet and a water outlet communicating with a first space inside the water block; The pump is arranged on the first side surface of the carrier body and has a first water inlet and a first water outlet; the cover is hollow and one side is open, corresponding to the cover of the carrier body The first side surfaces together form a second space, the cover has a second water inlet and a second water outlet and communicates with the second space; both ends of the first pipe body are respectively connected to the pump A water outlet and a water inlet of the water cooling head; the two ends of the second pipe body are respectively connected with the water outlet of the water cooling head and the second water inlet of the cover. With this design, one side of the carrier body can be associated with an electronic device, and absorb the heat generated by the plurality of heating elements on the electronic device, and then the water cooling head and the carrier body on the other side can transmit the heat The heat is dissipated in a water-cooled way, and the effect of the heat dissipation effect of the electronic device can be achieved.

The above-mentioned purpose of this creation and its structural and functional characteristics will be described based on the preferred embodiments of the accompanying drawings. Please refer to Figures 1, 2a, 2b, and 3, which are the three-dimensional exploded view and the three-dimensional assembly and the three-dimensional exploded view of the water-cooled head of the first embodiment of the water-cooled heat sink. As shown in the figure, the water-cooled heat sink is Including: a carrier body 1, a water cooling head 2, a pump 3, a cover 4, a first tube body 5, and a second tube body 6; The carrier body 1 has a first side surface 11, a second side surface 12, and an aperture 13. The first and second side surfaces 11, 12 are separately provided on two sides of the carrier body 1. The aperture 13 It penetrates the first and second side surfaces 11 and 12 of the carrier body 1. The water-cooling head 2 has an upper portion 21 and a lower portion 22. The water-cooling head 2 is disposed in the aforementioned orifice 1, and the lower portion 22 of the water-cooling head 2 is inserted into the orifice 13, and has a contact surface 23 that selectively protrudes Or the second side surface 12 of the carrier body 1 is aligned, and the upper part 21 of the water block 2 has a water inlet 211 and a water outlet 212 connected to a first space (not shown in the figure) inside the water block 2. The pump 3 is disposed on the first side surface 11 of the carrier body 1 and has a first water inlet 31 and a first water outlet 32. The cover 4 is hollow inside and one side is open, correspondingly covering the first side surface 11 of the carrier body 1 and forming a second space 41 together, and the cover 4 has a second water inlet 42 and a second water outlet 43 are communicated with the second space 41. The water-cooling head 2 further has a housing 24, a plate body 25, and a flow guide 26. The housing 24 and the plate body 25 correspondingly cover to define a heat exchange chamber (not shown), and the plate body One side of the plate 25 is a heat exchange surface 251 corresponding to the heat exchange chamber, and the other side of the plate body 25 is a heat-absorbing surface 252 contacting a first heating element (not shown), and the heat-absorbing surface 252 has a plurality of fins 2521 , A channel 2522 is formed between every two adjacent fins 2521, the guide member 26 is disposed on the fins 2521, and the guide member 26 defines a guide channel 261 to communicate with the channel 2522 and heat exchange Chamber (not shown in the figure), and the second water inlet 42 communicates with the guide channel 261 and the heat exchange chamber (not shown in the figure), and the guide member 26 is correspondingly arranged on the fin 2521 On the top surface of the free end, the housing 24 of the water cooling head 2 is a hollow structure, so when the housing 24 and the plate 25 are correspondingly covered, the closed heat exchange chamber is naturally formed. It is particularly exposed in the picture. The water inlet and outlet 211 and 212 of the water cooling head 2 are respectively provided with a second joint 7, and the second inlet and outlet 42 and 43 of the cover 4 are respectively provided with a third joint 8. The two ends of the first pipe body 5 are respectively connected to the first water outlet 32 of the pump 3 and the water inlet 211 of the water cooling head 2; the two ends of the second pipe body 6 are respectively connected to the water outlet 212 of the water cooling head 2 And the second water inlet 42 of the cover 4. The second side surface 12 is attached to a plurality of heat sources (not shown in the figure) correspondingly, and the cover 4 is just provided on the other side corresponding to the heat sources. A third pipe body c and a fourth pipe body d, the first water inlet 31 of the pump 3 is connected to one end of the third pipe body c, and the second water outlet 43 of the cover 4 is connected to the fourth pipe body One end of d and the other ends of the third and fourth pipe bodies c and d are respectively connected to a water drain f, thereby forming a water cooling circuit. Please refer to Figure 4, which is a three-dimensional assembly diagram of the second embodiment of the water-cooled heat dissipation device. As shown in the figure, part of the structure and functions of this embodiment are the same as those of the above-mentioned first embodiment, so it will not be omitted here. To repeat, the difference between this embodiment and the above-mentioned first embodiment is that this embodiment further includes a water tank 9 arranged on the first side surface 11 of the carriage body 1 with a fourth water inlet 91 and a fourth water outlet. 92. A fifth water inlet 93, a fifth water outlet 94, a first chamber 95, and a second chamber 96. The first and second chambers 95 and 96 are isolated from each other and arranged independently. The fourth inlet, The water outlets 91, 92 communicate with the first chamber 95, the fifth inlet and outlets 93, 94 communicate with the second chamber 96, one end of a third tube c communicates with the fourth inlet 91, and the fourth The water outlet 92 communicates with the first water inlet 31 of the pump 3, the fifth water inlet 93 communicates with the first water outlet 32 of the pump 3, one end of the first pipe body 5 passes through the fifth water outlet 94, the The fourth water inlet 92 and the fifth water outlet 93 of the water tank 9 are respectively provided with a fourth joint 10. The first inlet and outlet 31, 32 of the pump 3 are respectively provided with a third joint 8 protruding outward and inserted into the fourth outlet 92 and the fifth inlet 93 of the water tank 9, and the carrying body The second side surface 12 of 1 is attached to an interface card e, and the second side surface 12 absorbs the heat generated by the interface card e. With this design, it can be improved that the conventional water block system directly allows the cooling liquid to flow from the water inlet into the channel between the cooling fins, but there is no guide element to guide the flow direction of the cooling liquid, causing the cooling liquid to flow in The passage between the radiating fins was turbulent without direction before, only when the cooling liquid inlet and the radiating pillars or fins near the entrance had complete heat exchange, and for the radiating pillars or the radiating pillars far away from the middle or far of the inlet. The heat dissipation fins have a poor heat exchange rate or even no heat exchange, which leads to the problem of poor heat exchange efficiency of the conventional water block. The deflector 26 in this case can restrict the flow direction of the cooling liquid, so as to achieve the effect of increasing the heat exchange efficiency. This creation has been described in detail above, but what is described above is only a preferred embodiment of this creation, and should not limit the scope of implementation of this creation. That is to say, all equal changes and modifications made in accordance with the scope of the application for this creation shall still fall within the scope of the patent for this creation.

1: Carry the body 11: First side 12: second side 13: Orifice 2: water block 21: Upper 211: water inlet 212: water outlet 22: lower part 23: contact surface 24: shell 25: Board body 251: Heat Exchange Surface 252: Endothermic 2521: Fins 2522: Channel 26: deflector 261: diversion channel 3: pump 31: The first inlet 32: The first water outlet 4: cover 41: second space 42: The second inlet 43: The second outlet 5: The first tube body 6: The second tube body 7: Second connector 8: Third connector 9: water tank 91: The fourth inlet 92: Fourth Outlet 93: Fifth inlet 94: Fifth Outlet 95: first chamber 96: second chamber 10: Fourth connector c: third tube body d: The fourth tube body e: interface card f: water drain

Figure 1 is a three-dimensional exploded view of the first embodiment of the creative water-cooling heat sink; Figure 2a is a three-dimensional assembly diagram of the first embodiment of the creation of a water-cooled heat sink; Figure 2b is a three-dimensional partial cross-sectional view of the first embodiment of the creative water-cooling heat dissipation device; Figure 3 is a three-dimensional exploded view of the water-cooled head of the water-cooled heat sink; Figure 4 is a three-dimensional assembly diagram of the second embodiment of the creative water cooling device;

1: Carry the body

11: First side

12: second side

13: Orifice

2: water block

21: Upper

211: water inlet

212: water outlet

22: lower part

23: contact surface

3: pump

31: The first inlet

32: The first water outlet

4: cover

42: The second inlet

43: The second outlet

Claims (10)

A water-cooled heat dissipation device, which contains: A carrier body having a first side surface, a second side surface, and an aperture, the aperture penetrating the first and second side surfaces of the carrier body; A water-cooling head has an upper part and a lower part, the water-cooling head is arranged in the orifice, a contact surface of the lower part of the water-cooling head selectively protrudes or is in line with the second side surface, and the upper part of the water-cooling head has a water inlet and a The water outlet is connected to a first space inside the water cooling head; A pump, arranged on the first side surface of the carrying body, with a first water inlet and a first water outlet; A cover with a hollow inside and open on one side, correspondingly covering the first side surface of the carrier body and forming a second space together, the cover having a second water inlet and a second water outlet And communicate with the second space; A first pipe body, both ends of which are respectively connected to the first water outlet of the pump and the water inlet of the water cooling head; A second pipe body, both ends of which are respectively connected with the water outlet of the water cooling head and the second water inlet of the cover. In the water-cooled heat dissipation device described in item 1 of the scope of patent application, the second side surface is correspondingly attached to a plurality of heat sources. The water-cooled heat dissipation device described in item 1 of the scope of patent application further includes a third tube body and a fourth tube body. The first water inlet of the pump is connected to one end of the third tube body, and the cover member The second water outlet is connected to one end of the fourth pipe body, and the other ends of the third and fourth pipe bodies are respectively connected to a water drain, thereby forming a water cooling circuit. For example, the water-cooling heat dissipation device described in item 1 of the scope of patent application further includes a water tank, which is arranged on the first side of the carrier body, and has a fourth water inlet, a fourth water outlet, a fifth water inlet, and a water tank. A fifth water outlet, a first chamber and a second chamber, the first and second chambers are isolated and independently arranged from each other, the fourth inlet and outlet are connected to the first chamber, and the fifth inlet and outlet Connected to the second chamber, one end of a third pipe body is connected to the fourth water inlet, the fourth water outlet is connected to the first water inlet of the pump, and the fifth water inlet is connected to the first water outlet of the pump . For example, in the water-cooling heat dissipation device described in item 1 of the scope of patent application, the water-cooling head further has a shell, a plate and a flow guide. The shell and the plate are correspondingly covered to define a heat exchange chamber, One side of the plate body is a heat exchange surface corresponding to the heat exchange chamber, and the other side of the plate body is a heat-absorbing surface contacting a first heating element. The heat-absorbing surface has a plurality of fins. A channel is formed between the guide piece, the guide piece is arranged on the fins, and the guide piece defines a guide passage to communicate with the channel and the heat exchange chamber, and the second water inlet communicates with the guide passage and the heat exchange chamber. Exchange chamber. According to the water-cooled heat dissipation device described in item 5 of the scope of patent application, the air guide is correspondingly arranged on the top surface of the free end of the fin. According to the water-cooled heat dissipation device described in item 1 of the scope of patent application, the carrier body further has a plurality of supporting columns extending from the second side surface of the carrier body to an interface card to abut against a first side surface of the interface card, and Each of the supporting posts has a first screw hole, the interface card has a plurality of second screw holes corresponding to the supporting posts, and the plurality of locking members are screwed together with the first and second screw holes. For the water-cooled heat dissipation device described in item 4 of the scope of patent application, the first inlet and outlet of the pump are respectively provided with a first joint protruding outward and inserted into the fourth outlet and fifth inlet of the water tank . For the water-cooled heat dissipation device described in item 1 of the scope of patent application, the inlet and outlet of the water-cooled head are respectively provided with a second joint, and the third inlet and outlet of the cover are respectively provided with a third joint. For the water-cooled heat dissipation device described in item 4 of the scope of patent application, the fourth water inlet and the fifth water outlet of the water tank are respectively provided with a fourth joint.

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