TWM604487U - Bonding and releasing device for wireless electrostatic chuck and automatic bonding and releasing system thereof - Google Patents

Abstract

This creation relates to a sticking and releasing device for wireless electrostatic chuck and its automatic sticking and releasing system, which is used to automatically bond and automatically dissociate a wireless electrostatic carrier plate and a thinned substrate after bonding. The system includes a The body, at least one transmission device, at least one baking device, at least one pre-aligning device, and at least one sticking-off device, wherein the sticking-off device includes a carrier electrostatic generation group for adsorbing a wireless electrostatic carrier, and a A substrate transfer group for adsorbing a thinned substrate, and the substrate transfer group can be linearly displaced relative to the carrier electrostatic generation group, so that the substrate transfer group can drive the thinned substrate to be pressed onto the carrier electrostatic generation group The surface of the wireless electrostatic carrier plate can be actuated to actuate the carrier plate’s electrostatic generation group to make the wireless electrostatic carrier plate generate an electrostatic electric field to bond the thinned substrate, thereby improving the bonding efficiency and coping with high-precision manufacturing processes Demand to meet the needs of automated production of thinned substrates.

Description

Adhesion and release equipment for wireless electrostatic chuck and its automatic adhesion and release system

This creation is a kind of automatic bonding technology of electrostatic chuck, specifically refers to a sticking and releasing device for wireless electrostatic chuck and its automatic sticking and releasing system, so that the electrostatic chuck and thin substrate such as wafer can be automated The bonding and dissociation work can improve work efficiency, and reduce adhesion failure and substrate damage, thereby improving the automation of the thinning of the substrate.

According to, in recent years, due to the miniaturization of semiconductor manufacturing processes, such as memory and power devices, their miniaturization is moving towards smaller size, higher performance and lower cost, and in order to make the chip area smaller , The design scheme adopted by the semiconductor industry is to change the original chip design with horizontal chip deployment to a vertical stacking method, which is the so-called 3D IC stacked package. Since the 3D IC stack package is stacked in a vertical direction, it is necessary to use Through-Silicon Via (TSV) technology to physically and electrically connect the functional chips in the IC package, so the thickness of the silicon wafer will be compressed to 100 microns the following. In addition, the camera quality of smartphones is comparable to that of professional single-lens cameras recently. One of the keys to the significant improvement in the imaging quality of smartphone camera lenses is the introduction of ultra-thin blue glass filters into the camera lens of smartphones to absorb excess infrared light. , Restore the true color of the object.

Whether these thinned substrates are thinned wafers for 3D ICs or ultra-thin filters for lenses, when the thickness is less than 200μm, 100μm or even less than 50μm, and the surface area is larger, such as 8-inch, 12-inch semi-conductive process Or above. Thinned substrates will become very soft and elastic, which will cause warping. However, the production of thinned substrates such as silicon wafers or glass sheets requires polishing, grinding, cleaning, multilayer coating, etching and cutting. Since the ultra-thin substrate will produce unevenness and stress due to warping during the manufacturing process, it will cause process defects such as uneven thickness during coating, and even thinned substrates will be detected due to the warpage problem and the ineffective focus during inspection Errors or delays in the inspection time directly affect the detection of defective products. Moreover, the thinned substrates have problems such as low storage, fragility and fragility during the transportation and assembly process. Therefore, the warpage of the thinned substrates affects the manufacturing process. Reliability has a major adverse effect, which leads to problems of increasing process costs and defect rates.

In order to keep the thinned substrate flat and enter the process, the current thinned substrate adopts a temporary bonding process [Temporary bonding] to strengthen the tension of the thinned substrate, and the temporary bonding process mainly uses the bonding material of multilayer polymer The thinned substrate is reversibly mounted on a carrier, but it needs to be peeled off after the process. In this way, the yield of the thinned substrate itself must be maintained between bonding and peeling, and the bonding material used after bonding must also be adapted The thermal expansion coefficient [CTE] of the bonding material and the material to be bonded are not matched, maintaining the internal stress of the thinned wafer, while maintaining the smooth surface of the front/back surface of the wafer, and the acid and alkali problems of the bonding material in the process environment. It is a problem faced by the temporary bonding process.

The latest improvement is to use a wireless electrostatic carrier [E-Chuck or Supporter] After bonding the thinned substrates, the thinned substrates can be processed. However, at present, the wireless electrostatic carrier is performed manually when bonding thinned substrates. The manual sticking-off device is pivoted on one side of an electrostatic force generating seat with a substrate carrier that can be selectively covered. The worker first places the thinned substrate on the electrostatic force generating seat, and then manually rotates the upper substrate carrier downward to cover the electrostatic force generating seat, so as to use the substrate carrier to adsorb the thin film. After that, the staff puts the wireless electrostatic carrier on the electrostatic force generator, and rotates and covers the substrate carrier again, so that the thinned substrate is pressed on the opposite surface of the wireless electrostatic carrier, and finally The activation of conduction causes the wireless electrostatic carrier to generate a static electric field relative to the thinned substrate, so that the thinned substrate can be adhered to the wireless electrostatic carrier. And when the wireless electrostatic carrier plate and the thinned substrate are dissociated, the reverse operation is performed, and the wireless electrostatic carrier plate bonded with the thinned substrate is placed on the electrostatic force generating seat, and then the substrate carrier is covered on the thinned substrate Above the substrate, when the electrostatic force generating seat starts to dissociate to release the electric field of the wireless electrostatic carrier, the upper substrate carrier can adsorb the thinned substrate and lift it upward to separate the wireless electrostatic carrier from the thinned substrate.

However, this manual operation method is not only extremely slow, but also due to the fact that the relative bonding surface of the wireless electrostatic carrier and the thinned substrate cannot ensure that they are clean and dry under the operation of the personnel environment, which causes the phenomenon of bonding failure. Re-adhesive work, and may even cause cracks or fragments due to misalignment, slippage or uneven pressing, so the adhesion efficiency is extremely poor. Furthermore, since the manual operation is performed manually, it is difficult to accurately align the wireless electrostatic carrier plate and the thinned substrate during bonding. For the semiconductor manufacturing process that requires miniaturization and high precision, it is difficult to be directly aligned. It is applied to high-precision manufacturing process, but can only be used for transmission, storage and other occasions that do not require high precision.

In other words, because the existing wireless electrostatic carrier is manually bonded and thinned substrates, it not only has the problems of poor efficiency and high failure rate, but may even cause cracks or fragments, and it cannot meet the high-precision process requirements. Solving the aforementioned problems is what the industry expects, and it is also a technical problem that this creation wants to solve.

The reason is that this creator has made in-depth discussions on the problems faced by the existing wireless electrostatic carrier discs when bonding thin substrates. Based on the needs of technological development in recent years, after continuous efforts to improve and trial, finally successfully developed a The stick-off equipment and its automatic stick-off system for wireless electrostatic chucks can overcome the shortcomings and inconveniences caused by the existing manual operation.

Therefore, the main purpose of this creation is to provide a sticking and detaching device for wireless electrostatic chucks, which can improve the bonding efficiency, greatly reduce the bonding failure rate, and reduce the occurrence of cracks or fragments.

In addition, the second main purpose of this creation is to provide an automatic adhesion and release system for wireless electrostatic chucks, which can meet high-precision process requirements after automatic cleaning, baking and pre-alignment, and automate Bonding to meet the needs of automated production of thinned substrates.

Furthermore, another main purpose of this creation is to provide an automatic sticking and releasing system for wireless electrostatic chucks, which can quickly and accurately automatically bond wireless electrostatic chucks and thin substrates so that the wireless electrostatic chucks can be Bonding thinned substrates can be applied In the subsequent process, the process yield of the thinned substrate can be greatly improved, and the cost can be reduced and the profit can be increased.

Based on this, this creation is mainly through the following technical means to specifically achieve the aforementioned purposes and effects: It is used for the automatic bonding of a wireless electrostatic carrier plate and a thinned substrate and the automatic dissociation after bonding. The bottom surface of the electrostatic carrier plate has a conductive electrode that generates or discharges an electrostatic electric field, and the wireless electrostatic carrier plate and the periphery of the thinned substrate have a positioning cut for determining the orientation. The automatic adhesion and release system includes:

A body including at least one substrate inlet port and at least one tray inlet port;

At least one baking device, which is arranged on the body, and the baking devices include at least one substrate baking group for baking thinned substrates and at least one carrier plate for baking wireless electrostatic carrier plates Baking group

At least one pre-alignment device, which is arranged on the body, for the wireless electrostatic carrier and the thinned substrate to pre-determine a designated position by using positioning cuts;

At least one sticking and releasing device, the sticking and releasing device includes a carrier electrostatic generation group for adsorbing a wireless electrostatic carrier plate and a substrate transfer group for adsorbing a thinned substrate, wherein the substrate transfer group can be opposite to the carrier The electrostatic generation group is linearly displaced, so that the substrate transfer group can drive the thinned substrate to be pressed onto the surface of the wireless electrostatic carrier of the carrier electrostatic generation group to actuate or release the wireless electrostatic carrier to generate an electrostatic power field, so that the The wireless electrostatic carrier and the thinned substrate can be bonded or dissociated in the same designated orientation; and

At least one transmission device is arranged on the body, and the transmission devices Place the substrate baking group and the carrier baking group of the baking device that can clamp the thinned substrate or the wireless electrostatic carrier at the substrate inlet port and the carrier inlet port. Move between.

In this way, through the specific realization of the above-mentioned technical means, the present invention uses the sticking and detaching device to automatically bond and thin the substrate with the wireless electrostatic carrier, which can greatly reduce the bonding failure rate and reduce the occurrence of cracks or fragments. After automatic cleaning, baking and pre-alignment, it can meet the requirements of high-precision manufacturing process, and perform automatic bonding to meet the needs of automatic production of thinned substrates, so that the wireless electrostatic carrier can bond thinned substrates It can be used in subsequent manufacturing processes, which can greatly improve the process yield of thinned substrates, reduce costs and increase profits, so as to increase its added value and further improve its economic benefits.

In order to enable your reviewer to further understand the composition, features and other purposes of this creation, the following are some preferred embodiments, which will be described in detail with the drawings, and at the same time allow those familiar with the technical field to implement them in detail.

10: body

100: wireless electrostatic carrier

101: Positioning the incision

105: Lead

200: Thinned substrate

201: Positioning incision

10: body

15: Slide rail mechanism

16: Substrate inlet and outlet ports

18: loading and unloading port

20: Transmission device

30: Baking device

31: substrate baking group

35: tray baking group

38: Cleaning device

40: Pre-alignment device

45: Temporary storage port

50: Adhesion equipment

51: lower frame

52: upper frame

60: Carrier board electrostatic generation group

61: main frame board

62: ejector

620: detection component

63: Lead

64: adsorption parts

65: side flap

66: guide post

660: fixed guide post

661: inclined guide surface

665: movable guide post

666: inclined guide surface

67: Touch the detection group

670: Touch the boss

675: Guiding convex column

68: Optical Inspection Group

680: Optoelectronics

69: blowing unit

690: Jet nozzle

70: drive

80: substrate transfer group

81: frame seat

810: detection component

82: Lifting mechanism

83: Adsorption parts

830: Surface adsorption parts

835: Edge suction parts

85: Optical Inspection Group

850: Optoelectronics

86: Anti-dropping parts

Figure 1: The schematic diagram of the automatic sticking-off system for wireless electrostatic chuck.

Figure 2: The action diagram of this creation for the automatic sticking and releasing system of the wireless electrostatic chuck.

Figure 3: A schematic diagram of the appearance of the sticking-off device used in this creation for wireless electrostatic chucks.

The fourth picture: the side of the sticking and detaching device used in this creation for wireless electrostatic chuck Schematic view of the plane.

Figure 5: A schematic diagram of the appearance of the electrostatic generation group of the carrier in the sticking and detaching device used for the wireless electrostatic chuck.

Figure 6: A partial top plan view of the electrostatic generation group of the carrier in the sticking and detaching device used for the wireless electrostatic chuck.

Figure 7: A schematic side plan view of the electrostatic generation group of the carrier in the sticking and detaching device used for the wireless electrostatic chuck.

Figure 8: A schematic diagram of the side view action of the electrostatic generation group of the carrier in the sticking and detaching device used for the wireless electrostatic chuck.

Figure 9: Another side view of the action of the electrostatic generation group of the carrier in the sticking and detaching device used for the wireless electrostatic chuck.

Figure 10: Schematic diagram of the appearance of the substrate transfer group in the adhesion and release equipment for the wireless electrostatic chuck.

Figure 11: The partial bottom plan view of the substrate transfer group in the adhesion and release equipment used for the wireless electrostatic chuck.

Figure 12: A schematic diagram of the flow structure of this creation for the sticking and detaching method of the wireless electrostatic chuck.

This creation is a sticking and detaching device for wireless electrostatic chuck and its automatic sticking and detaching system. The attached figure illustrates the specific embodiments and components of this creation, all about front and back, left and right, top and bottom, and upper part. The reference to the lower part, and the horizontal and vertical are only used for the convenience of description, not to limit this creation, nor to The component is restricted to any position or spatial direction. The drawings and the size specified in the specification can be changed according to the design and requirements of the specific embodiment of the creation without departing from the scope of the patent application of the creation.

This creation is used for the automatic adhesion and release system of the wireless electrostatic chuck. As shown in the first figure, it is used to automatically bond and bond a wireless electrostatic carrier (100) and a thinned substrate (200). The automatic dissociation, wherein the thinned substrate (200) can be a semiconductor wafer or a glass sheet or a plastic sheet, and the automatic adhesion and release system includes a body (10), at least one transmission device (20), and at least one baking device ( 30). It is composed of at least one pre-alignment device (40) and at least one stick-off device (50);

For the detailed structure of the preferred embodiment of the automatic sticking and release system, please refer to the first and second drawings for further cooperation, wherein the body (10) is provided with at least one substrate inlet and outlet port (16) and at least one carrier plate The inlet and outlet ports (18). In some embodiments, the substrate inlet and outlet ports (16) and the carrier tray inlet and outlet ports (18) can be the inlet and outlet ports of a typical SEMI standard wafer transfer box (FOUP). It is used for the automatic loading and unloading of the wireless electrostatic carrier (100) and the thinned substrate (200), and the aforementioned transmission device (20) can be used to grab the wireless electrostatic carrier (100) or the thinned substrate (200) in The body (10) is moved and placed between the substrate inlet and outlet ports (16) or the tray inlet and outlet ports (18), the baking device (30), the pre-alignment device (40) and the adhesion-off equipment (50), and The transmission devices (20) can be linear, six-axis or seven-axis robotic arms to increase the degree of freedom and flexibility for grabbing and moving the wireless electrostatic carrier (100) or thinned substrate (200). In some embodiments, a sliding rail mechanism (15) is provided on the body (10), and the transmission devices (20) can be slidably installed on the sliding rail mechanism (15), The transmission device (20) can be selectively slid on the slide rail mechanism (15), which can increase the range of movement of the transmission devices (20); in addition, the baking devices (30) are arranged on the body (10) The internal and transmission device (20) can move the wireless electrostatic carrier (100) or the thinned substrate (200) into the position, and the baking device (30) may include at least one piece or more than one piece A substrate baking group (31) for baking thinned substrates (200) and at least one carrier baking group (35) for accommodating one or more wireless electrostatic carrier plates (100) for drying respectively Thinning the moisture on the surface of the substrate (200) and the wireless electrostatic carrier (100). In some embodiments, the body (10) may be provided with a cleaning device (38) on the side corresponding to the loading and unloading port (18) of the tray, so that the wireless electrostatic tray (100) can be cleaned before baking. In order to ensure the cleanliness of the surface of the wireless electrostatic carrier plate (100), the cleaning device (38) can be washing, wiping or non-contact particle removal technology. The pre-alignment devices (40) are arranged in the body (10) and the transmission device (20) can move the wireless electrostatic carrier plate (100) or the thinned substrate (200) into the position, the pre-alignment device ( 40) The wireless electrostatic carrier (100) or the thinned substrate (200) can be placed and rotated, and the detection unit on the pre-alignment device (40) can be used such as an optical detector such as a CCD module (not shown in the figure) ], look for the positioning cuts (101, 201) of the wireless electrostatic carrier (100) or thinned substrate (200) (such as the Notch of the wafer, the V-shaped positioning cut or the flat cut edge), so that the wireless electrostatic carrier (100) ) And the thinned substrate (200) can enter the adhesion and release devices (50) in a designated orientation, and the wireless electrostatic carrier (100) and the thinned substrate (200) can be bonded to each other in the same designated orientation. According to some embodiments, the body (10) is provided with at least one temporary storage The material port (45) is used to temporarily store the wireless electrostatic carrier plate (100) or thinned substrate (200) for pre-bonding operation to improve the efficiency of automatic operation;

As for the adhesion and release equipment (50) is set in the body (10) and the transmission device (20) can move the wireless electrostatic carrier plate (100) or the thinned substrate (200) into the position, such as the third and fourth As shown in the figure, and the adhesion and release equipment (50) includes one of the relative displacements for the electrostatic generation group (60) of the wireless electrostatic carrier (100) and a substrate movement for the adsorption of the thinned substrate (200) The carrier group (80), and the sticking device (50) has a frame that can be fixed to the body (10), and the frame includes a lower frame (51) and an upper frame (52), wherein the carrier plate static electricity generation group (60) is arranged on the top of the lower frame (51), and the substrate transfer group (80) is arranged on the upper frame (52) by a lifting mechanism (82) corresponding to the carrier plate static electricity generation group (60) Above, so that the substrate transfer group (80) can absorb the thinned substrate (200) relative to the carrier electrostatic generation group (60), or drive the thinned substrate (200) to press and fit the carrier electrostatic generation group ( 60) The surface of the wireless electrostatic carrier plate (100) on the top surface;

The aforementioned carrier board static electricity generation group (60) is shown in Figures 5, 6 and 7, which has a main frame plate (61) and side wing plates (60) pivoted on both sides of the main frame plate (61). 65), and the main frame plate (61) and the side wing plates (65) on both sides have a working plane for the wireless electrostatic carrier (100) to be flat, and the main frame plate (61) of the working plane is provided with a check The component (610) is used to check whether the wireless electrostatic carrier plate (100) or the thinned substrate (200) exists, and the main frame plate (61) is provided with an ejector (62), and the ejector ( 62) It can be displaced between the working plane and a higher receiving plane (as shown in the eighth figure), which can facilitate the transfer device (20) such as the grip of a robot arm The claw penetrates to place or remove the wireless electrostatic carrier plate (100) or the thinned substrate (200). The ejector member (62) may be composed of at least three jacks that can be raised and lowered simultaneously, or by a liftable A telescopic cylinder (70) is provided between the center of the outer bottom edge of the outer bottom edge of the main frame plate (61) and the lower frame (51) to selectively actuate the side wing plates (65). The outer edge is inclined downward. The different outer edges of the side wing plates (65) on both sides can be selectively actuated downwardly (as shown in the ninth figure), which is used to drive the wireless electrostatic carrier (100) and the bonded thin plate. The base plate (200) is relatively peeled off from the outer edge, and the main frame plate (61) and the side wing plate (65) are separately provided with a series of suction parts (64) corresponding to the bottom surface of the wireless electrostatic carrier plate (100) (such as vacuum Sucker] for selectively fixing the wireless electrostatic carrier plate (100) on the working plane of the main frame plate (61) and the side wing plate (65), and the main frame plate (61) has two or multiple guides The pole (63) is for the positive and negative conductors (105) corresponding to the bottom surface of the wireless electrostatic carrier (100) to provide power so that the surface of the wireless electrostatic carrier (100) can generate or dissociate the electrostatic electric field from the relatively thin substrate (200), It is used to allow the wireless electrostatic carrier plate (100) and the thinned substrate (200) to bond or dissociate each other, and the side wing plates (65) on both sides have a guide group (66), the guide group (66) It includes at least two fixed guide posts (660) and at least one movable guide post (665) surrounding the outer periphery of the wireless electrostatic carrier plate (100). This creation is based on two fixed guide posts (660) and two movable guides Pillars (665) are the main embodiment, wherein the movable guide pillars (665) can push the wireless electrostatic carrier plate (100) to the correct horizontal position of the fixed guide pillars (660), and the fixed guide pillars (660) An oblique guide edge (661, 666) is formed with the top peripheral edge of the movable guide posts (665), so that the wireless electrostatic carrier plate (100) may be thinned when the ejector (62) is lowered The substrate (200) can be guided to the correct range of the working plane, and the carrier plate static electricity generation group (60) is provided with a touch detection group (67) and an optical sensor at the outer periphery of the corresponding wireless electrostatic carrier plate (100). The detection group (68), wherein the touch detection group (67) includes at least two touch protrusions (670) that can be retracted and surround the outer periphery of the wireless electrostatic carrier (100) and at least one movable back and forth The guiding protrusion (675), wherein the guiding protrusion (675) can correspond to the positioning notch (101, 201) of the wireless electrostatic carrier (100) or the thinned substrate (200), so that the guiding protrusion ( 675) The positioning slits (101, 201) of the wireless electrostatic carrier (100) or the thinned substrate (200) can be used to make it rotate and correct around the axis, and further used as a wireless electrostatic carrier (100) or An alarm can be triggered when the thinned substrate (200) is not aligned and touches any of the touching protrusions (670). As for the optical detection group (68), there are at least three surrounding the outer periphery of the wireless electrostatic carrier (100) The photoelectric component (680) of the edge is used to trigger an alarm when the wireless electrostatic carrier (100) or the thinned substrate (200) is not aligned and shield any photoelectric component (680) to ensure that the wireless electrostatic carrier (100) ) And the thinned substrate (200) are accurately aligned. As shown in the ninth figure, the carrier plate static electricity generation group (60) is provided with a blowing unit (69) at the corresponding side wing plates (65) on both sides of the lower frame. , The blowing unit (69) has a jet nozzle (690) corresponding to the outer periphery of the wireless electrostatic carrier (100) extending in the axial direction, which is used when the wireless electrostatic carrier (100) is dissociated at startup and is When the side wing plate (65) is driven to peel off the thinned substrate (200), high-speed gas can be blown into the wireless electrostatic carrier (100) and the thinned substrate (200) to be effectively separated;

The aforementioned substrate transfer group (80) is shown in Figures 10 and 11. It is composed of a frame (81) that can selectively adsorb the thinned substrate (200). The frame (81) can be linearly moved up and down by the lifting mechanism (82) to drive the thinned substrate (200) to be relatively lower The wireless electrostatic carrier plate (100) is selectively pressed, and a detecting element (810) is provided on the surface of the frame (81) for detecting whether the thinned substrate (200) exists, and the frame (81) has A suction surface. The suction surface of the frame (81) has a plurality of suction members (83), which may include surface suction members (830) within the range of the thinned substrate (200) or adjacent edges of the thinned substrate (200) The edge adsorption member (835), wherein the surface adsorption member (830) can be the adsorption technology of Bernoulli's law [Bernoulli] to reduce the damage that may be caused to the thinned substrate (200) during the adsorption process, and the substrate is moved The carrier group (80) is provided with an optical detection group (85) corresponding to the outer periphery of the thinned substrate (200), and the optical detection group (85) includes at least three surrounding edges of the thinned substrate (200). The photoelectric element (850) is used to trigger an alarm when the thinned substrate (200) is not aligned to shield any photoelectric element (850) to ensure the accurate alignment of the thinned substrate (200). According to some embodiments, the peripheral edge of the substrate transfer group (80) may be provided with a selectively retractable anti-dropping member (86), which extends out to be smaller than the outer diameter of the thinned substrate (200) for When the thinned substrate (200) enters the adsorption surface of the substrate transfer group (80), the anti-dropping piece (86) can be extended to prevent the thinned substrate (200) from falling due to ineffective adsorption, which can confirm the thinning The substrate (200) is effectively sucked by the substrate transfer group (80) and then retracted. According to some embodiments, the substrate transfer group (80) may be a robotic arm that can grip the thinned substrate (200) relative to the carrier static electricity generation group (60);

In this way, the assembly constitutes a wireless electrostatic carrier (100) and thin The substrate (200) can be automatically bonded and automatically dissociated with an automatic adhesion system.

As shown in Figure 12, it is a flow chart of the automatic bonding method for wireless electrostatic chuck, which is used for automatic bonding and bonding of a wireless electrostatic chuck (100) and a thinned substrate (200). The automatic dissociation, wherein the thinned substrate (200) can be a semiconductor wafer or a glass sheet or a plastic sheet, and the bottom surface of the wireless electrostatic carrier (100) has a conductive electrode (105) that generates an electrostatic electric field, and the wireless The electrostatic carrier plate (100) and the periphery of the thinned substrate (200) are provided with a positioning cutout (101, 201) for determining the orientation. The process steps of the adhesion and release method include a wireless electrostatic carrier and a thinned substrate; one baking the wireless electrostatic carrier and the thinned substrate to keep the surface dry; one making the wireless electrostatic carrier and the above The thinned substrates are respectively pre-aligned in designated positions; one is to fix the non-static carrier and the thinned substrate to two opposite surfaces in the same designated position; one to place the wireless electrostatic carrier on the two surfaces separately And the above-mentioned thinned substrates are bonded by linear relative displacement; one for causing the wireless electrostatic carrier to generate an electrostatic electric field that can be bonded to the thinned substrate; and one for bonding the above-mentioned wireless electrostatic carrier to the thinned substrate Steps such as disk removal. Please refer to the first, second and third figures for the preferred embodiment of this creative sticking method;

A step of supplying a wireless electrostatic carrier plate and a thinned substrate: it obtains a wireless electrostatic carrier plate from the carrier tray inlet and outlet port (18) through one of the transmission devices (20) on the body (10) of the automatic sticking system (100), and another transmission device (20) obtains a wireless electrostatic carrier plate (100) from the substrate inlet and outlet port (16);

1. Bake the above wireless electrostatic carrier plate and the above thinned substrate separately The step of keeping the surface dry: After obtaining the wireless electrostatic carrier (100) and the thinned substrate (200) separately, one of the transmission devices (20) can place the wireless electrostatic carrier (100) into the corresponding The tray baking group (35) of the baking device (30), and the other conveying device (20) can put the thinned substrate (200) into the substrate baking group (30) of the corresponding baking device (30). 31), respectively bake to keep the surface dry;

A step of pre-aligning the wireless electrostatic carrier plate and the thinned substrate in a designated position: after the baking and drying of the wireless electrostatic carrier plate (100) and the thinned substrate (200), The transmission device (20) respectively transfers the wireless electrostatic carrier (100) and the thinned substrate (200) to the corresponding pre-alignment device (40), so that the wireless electrostatic carrier (100) and the thinned substrate (200) can use its positioning cuts (101, 201) to be positioned in the same designated position, so that the wireless electrostatic carrier plate (100) and the thinned substrate (200) can be completely overlapped and attached in the same designated position to facilitate subsequent Process processing;

A step of fixing the non-static carrier plate and the thinned substrate to two opposite surfaces in the same designated orientation respectively: and after completing the pre-alignment, as shown in the fifth figure, the transmission device (20) is First place the thinned substrate (200) on the working plane of the main frame plate (61) and the side wing plate (65) of the carrier plate static electricity generation group (60), and use the guide group (66) to guide the thin The substrate (200) is in the correct position on the working plane of the carrier electrostatic generation group (60), and the touch detection group (67) and the optical detection group (68) ensure that the wireless electrostatic carrier (100) is After the specified position is accurately positioned, the substrate transfer group (80) can be lowered and used The suction member (83) of the substrate transfer group (80) sucks the thinned substrate (200) at the correct position on the suction plane, and then raises the substrate transfer group (80) to synchronize the thinned substrate (200) ) Away from the working plane of the carrier electrostatic generation group (60), and then the transmission device (20) then places the wireless electrostatic carrier plate (100) on the main frame plate (61) of the carrier electrostatic generation group (60) ) And the working plane of the side wing board (65), and use its guide group (66) to guide the wireless electrostatic carrier plate (100) to the correct position of the working plane of the carrier board electrostatic generating group (60), and through the touch After the detection group (67) and the optical detection group (68) ensure that the wireless electrostatic carrier (100) is accurately positioned in the specified position, the carrier electrostatic generation group (60) can use the suction member (64) to fix the The wireless electrostatic carrier (100), so that the thinned substrate (200) and the wireless electrostatic carrier (100) can face each other in the same designated orientation;

A step of attaching the wireless electrostatic carrier and the thinned substrate separated on the two surfaces in a linear relative displacement manner: when the wireless electrostatic carrier (100) and the thinned substrate (200) are fixed in the same designated orientation After the opposite surface, as shown in the third and fourth figures, the substrate transfer group (80) drives the thinned substrate (200) to linearly shift relative to the wireless electrostatic carrier (100) of the carrier electrostatic generation group (60) , So that the thinned substrate (200) can be attached to the surface of the wireless electrostatic carrier (100) in the same designated orientation, and the outer peripheries of the two are completely overlapped;

A step of causing the wireless electrostatic carrier to generate an electrostatic electric field that can be adhered to the thinned substrate: after the wireless electrostatic carrier (100) and the thinned substrate (200) are bonded together, the carrier The electrostatic generation group (60) can be electrically connected to the wireless electrostatic carrier (100) so that the wireless electrostatic carrier (100) can be Generate an electrostatic power field with respect to the thinned substrate (200), and complete the work of the wireless electrostatic carrier (100) to electrostatically bond the thinned substrate (200); and

A step of taking out the wireless electrostatic carrier plate with the above-mentioned thinned substrate: Finally, after the wireless electrostatic carrier plate (100) and the thinned substrate (200) are bonded, the substrate can be transferred to the assembly (80) The electrostatic generation group (60) of the carrier board is relatively separated by linear displacement, and the wireless electrostatic carrier (100) bonded with the thinned substrate (200) is taken out by using one of the transmission devices (20), They are stored in the corresponding substrate inlet/outlet port (16) or the tray inlet/outlet port (18) in order to complete the entire bonding operation for subsequent process applications.

According to some embodiments, the wireless electrostatic carrier (100) and the thinned substrate (200) can be added with a step of cleaning the surface of the wireless electrostatic carrier before baking. Washing or wiping, or non-contact method to remove particles on the surface of the wireless electrostatic carrier (100) to improve the effectiveness of adhesion.

Furthermore, the bonded thinned substrate (200) and the wireless electrostatic carrier (100) can also be dissociated, which is the wireless electrostatic carrier bonded with the thinned substrate (200) through the transmission device (20) (100) Put the carrier plate static electricity generation group (60) into the suction and fix, and the substrate transfer group (80) linear displacement suction and fix on the thinned substrate (200) different from the wireless electrostatic carrier plate (100) On one side surface, the carrier static electricity generation group (60) is then allowed to release the electrostatic power field of the wireless electrostatic carrier (100), so that the static electricity of the wireless electrostatic carrier (100) is discharged, and the thinned substrate ( 200) can be dissociated, and the reverse displacement of the substrate transfer group (80) drives the The thinned substrate (200) is relatively separated from the wireless electrostatic carrier (100), and finally the wireless electrostatic carrier (100) and the thinned substrate (200) are placed in the corresponding corresponding transmission device (20) In the loading and unloading port (18) and substrate loading and unloading port (16) of the carrier plate. According to some embodiments, as shown in the ninth figure, after the electrostatic discharge of the wireless electrostatic carrier (100), the outer periphery of the wireless electrostatic carrier (100) can be moved downwards, so that the wireless electrostatic carrier (100) ) The outer periphery of the thinned substrate (200) can be peeled off in advance to generate an opening, and the high-speed gas is blown in from the outer periphery of the wireless electrostatic carrier (100) through the jet nozzle (690) of a jet unit (69), so that The wireless electrostatic carrier plate (100) and the thinned substrate (200) can be effectively separated.

From the above, it can be seen that the adhesion and release equipment for wireless electrostatic chuck and its automatic adhesion and release system can improve the efficiency of adhesion, and can greatly reduce the failure rate of adhesion, and reduce the occurrence of cracks or fragments. After automatic cleaning, baking and pre-alignment, it can meet the requirements of high-precision manufacturing process and perform automatic bonding to meet the needs of automated production of thinned substrates, so that the wireless electrostatic carrier can bond thinned substrates. When applied to subsequent processes, the process yield of thinned substrates can be greatly improved, and costs can be reduced and profits can be increased.

In summary, it can be understood that this creation is a new type of creation with excellent creativity. In addition to effectively solving the problems faced by habitants, it also greatly improves the efficiency. There is no identical or similar product creation in the same technical field. Or it can be used publicly, and at the same time it has enhanced efficacy. Therefore, this creation has met the "novelty" and "progressive" requirements of a new model patent, and an application for a new model patent is filed in accordance with the law.

10: body

15: Slide rail mechanism

16: Substrate inlet and outlet ports

18: loading and unloading port

20: Transmission device

30: Baking device

31: substrate baking group

35: tray baking group

38: Cleaning device

40: Pre-alignment device

45: Temporary storage port

50: Adhesion equipment

Claims (8)

A sticking and detaching device for wireless electrostatic chuck is used for bonding or dissociating a wireless electrostatic carrier plate and a thinned substrate. The bottom surface of the wireless electrostatic carrier plate has a conductive electrode that generates or releases an electrostatic electric field. The adhesion and release equipment includes; a frame; a carrier plate electrostatic generation group, which is set on the frame, the carrier plate electrostatic generation group has a working plane for the wireless electrostatic carrier plate to be selectively fixed, and the working plane has a corresponding Contact the conductors of the positive and negative conductors of the wireless electrostatic carrier, and the working plane can position the wireless electrostatic carrier or the thinned substrate in a correct position; a substrate transfer group, which is arranged on the frame and is connected to the carrier The plate electrostatic generation group is opposite, so that the substrate transfer group can absorb a thinned substrate with the correct position and is displaced relative to the carrier plate electrostatic generation group; thereby, the substrate transfer group can drive the thinned substrate and the wireless electrostatic carrier After the discs are pressed together, the electrostatic generating group of the carrier can be actuated to make the wireless electrostatic carrier generate an electrostatic electric field to bond the thinned substrate. The sticking and detaching device for wireless electrostatic chuck as described in claim 1, wherein the working plane has a guide post group, and the guide post group includes at least two restricted carrier lateral positions around the outer periphery of the wireless electrostatic carrier The fixed guide post and at least one movable guide post that can push the carrier plate to engage with the fixed guide post enables the wireless electrostatic carrier plate or the thinned substrate to be positioned at a correct position on the working plane. The sticking device for wireless electrostatic chuck as described in claim 1, wherein the working plane is composed of a main frame plate and side wing plates pivoted on both sides of the main frame plate, and the side wing plates are different It can selectively move downwards at one end of the main frame plate. The sticking and detaching device for a wireless electrostatic chuck as described in claim 3, wherein the electrostatic generation group of the carrier plate is provided with a blowing unit at the corresponding side wing plates on both sides, and the blowing unit has a corresponding outer periphery of the wireless electrostatic carrier plate The jet nozzle extending from the edge to the axis is for blowing high-speed gas so that the wireless electrostatic carrier and the thinned substrate can be effectively separated. The sticking and detaching device for wireless electrostatic chuck as described in claim 1, wherein the substrate transfer group has a frame base, and the frame base has a plurality of adsorption elements on the surface, which may include surface adsorption within the range of the corresponding thinned substrate The surface adsorption member can be the adsorption technology of Bernoulli’s law. An automatic adhesion and release system for wireless electrostatic chucks, which is used for automatic bonding and automatic dissociation of a wireless electrostatic carrier and a thinned substrate. The bottom surface of the wireless electrostatic carrier has a conductive and generated electrostatic electric field The guide pole of the wireless electrostatic carrier and the periphery of the thinned substrate have a positioning cut for determining the orientation, and the automatic sticking system includes: a body including at least one substrate inlet and at least one carrier Feed port At least one baking device, which is arranged on the body, and the baking devices include at least one substrate baking group for baking thinned substrates and at least one carrier plate for baking wireless electrostatic carrier plates Baking group; at least one pre-alignment device, which is set on the body, for the wireless electrostatic carrier and the thinned substrate to use positioning cuts to pre-determine the designated orientation; at least one sticking and removing device as described in claim 1 , To actuate or release the wireless electrostatic carrier to generate an electrostatic electric field, so that the wireless electrostatic carrier and the thinned substrate can be bonded or dissociated in the same designated orientation; and at least one transmission device, which is arranged on the body, These transmission devices can clamp thinned substrates or wireless electrostatic carrier plates in the substrate baking group and carrier baking group of the baking device corresponding to the substrate inlet port and the carrier inlet port, pre-alignment device and adhesive Move between devices. The automatic adhesion and release system for wireless electrostatic chucks as described in claim 6, wherein a cleaning device is provided on the body, and the cleaning device is used for selectively cleaning the wireless electrostatic carrier or The bonding surface of the thinned substrate. The automatic sticking and releasing system for wireless electrostatic chuck as described in claim 6, wherein the body is provided with a sliding rail mechanism, and the transmission devices can be slidably arranged on the sliding rail mechanism, which can increase the movement of the transmission devices range.

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