TWM543876U - Linear vapor deposition device - Google Patents

Description

Linear evaporation device

This creation is related to the field of evaporation, especially a linear vapor deposition device that prevents vapor condensation of the plating material and improves the uniformity of the film.

At present, industries such as organic light-emitting diodes (OLEDs) and thin film solar cells are often produced by an evaporation process. Generally, the vapor deposition process is applied to a vacuum system, such as placing a material to be placed in a reaction chamber. In the body, a vacuum pump is used to maintain the internal pressure, and then the vapor deposition material is placed in the vapor deposition container, and the vapor deposition material is heated by the heater to vaporize and evaporate the vapor deposition material to reach the material to be plated. The purpose of forming a film on it.

The basic structure of the OLED includes a transparent anode, a hole transport layer, a light emitting layer, an electron transport layer, and a metal cathode. OLEDs are currently mainly produced by evaporation, such as spot evaporation or linear evaporation, among which linear evaporation is used. The vapor deposition process is mass-produced, and is often carried out by linear evaporation to obtain a large-area film, as listed in the following U.S. Patent Nos. 7,194,197, US 2008/0247738, US2008/0247737, US2008/0226270, US2010/0173440 , US2010/0087016, US2009/0258476, US2009/0258444, US2009/0255469, US2009/0255467, US8,202,368, US2010/0159132, and US2010/0285218, etc., however, in the evaporation process, in the OLED linear In the evaporation process, it is common for the plating material to cause condensation of some of the vapor in the colder region due to the heat distribution problem, so that the reaction steam which actually participates in the reaction in the plating zone is limited, thereby greatly reducing the utilization rate of the vapor deposition material. In the case of no uniform temperature heating, the vapor of the vapor deposition material is more likely to cause an unstable reaction when the film is deposited, and the uniformity of the produced film is greatly reduced. The foregoing various conditions are more likely to occur particularly when preparing an OLED metal cathode layer.

In order to solve the shortcomings of the prior art, the present invention provides a linear vapor deposition device which can prevent the condensation of the vapor of the plating material to improve the utilization rate of the plating material, and can further provide a stable reaction vapor of the plating material and prepare the high. Uniform film.

The present invention is an evaporation device for coating a substrate in a vacuum environment, having at least one crucible and a heating chamber, the heating chamber being disposed on one side of the crucible and having a a cavity heater for accommodating a plate material, wherein the crucible has a mouth and a body, and the mouth is formed by an open end edge of the body, and the mouth is formed The mouth is pressed against the inside of the heating chamber, wherein the mouth side and the body side of the crucible are both heated, and two-stage heating is formed, thereby eliminating the vapor condensation of the plating material, and The use rate of the plating material is increased to prepare a uniform high quality film, and preferably the plating material is one of aluminum, magnesium or calcium.

In an embodiment of the present invention, the linear evaporation device further has a crucible carrier and at least one crucible heater, wherein the crucible carrier is configured to a body, the crucible heater is disposed in the crucible holder to heat the plating material, wherein the crucible heater can effectively isolate the external environment by using the crucible holder to prevent heat loss during heating Affect its heating efficiency.

In an embodiment of the present invention, the cavity heater may be disposed inside the heating cavity, and the thermal energy may be maintained inside the heating cavity to improve the heating efficiency of the cavity heater.

In one embodiment of the present invention, the material of the heating cavity is a titanium zirconium-molybdenum alloy, so that the heating cavity has the advantages of high temperature resistance and low thermal expansion.

In one embodiment of the present invention, the saturated vapor pressure in the heating chamber is greater than the background pressure in the vacuum environment, so that the vapor of the plating material can be stably and continuously flowed from the heating chamber to the vacuum environment. The material is coated and the uniformity of the prepared film is improved.

In one embodiment of the present invention, the crucible is located in the inner surface area of the heating chamber, and the ratio of the total internal surface area of the crucible is between 1:10 and 1:6, so that the crucible can have the best heating. status.

In one embodiment of the present invention, the crucible carrying base has a plurality of insulating panels, and the insulating panels are connected to each other to form a space for accommodating the main body and the crucible heater, and the material of the thermal insulation board is adopted. It can more effectively block the heat energy of the crucible heater and prevent the loss of power consumption.

In summary, the linear vapor deposition device of the present invention is configured to form a two-stage heating by the structure of the nozzle against the inside of the heating chamber, thereby eliminating the steam generated by the heat of the plating material. Condensation, causing the plating The problem of reduced material usage and the stability of the vapor of the plating material to produce a film with high uniformity. In addition, by placing the crucible heater inside the crucible holder and setting the cavity heater to the heating chamber, the heat of the crucible heater and the cavity heater can be reduced. The work loss can increase the heating performance of both.

The above summary and the following detailed description and drawings are intended to further illustrate the manner, means and effects of the present invention in achieving its intended purpose. Other purposes and advantages of this creation will be set forth in the following description and illustration.

1‧‧‧Linear evaporation device

10‧‧‧ Shabu Shabu

101‧‧‧ mouth

102‧‧‧Ontology

11‧‧‧heating chamber

111‧‧‧ cavity heater

112‧‧‧Linear evaporation port

12‧‧‧坩锅座

121‧‧‧Insulation board

122‧‧‧ accommodating space

13‧‧‧坩heater heater

2‧‧‧vacuum environment

3‧‧‧ plating materials

Figure 1 is a schematic view of the apparatus of the preferred embodiment of the present invention.

Figure 2 is a schematic diagram of the application of the preferred embodiment of the present invention.

The embodiments of the present invention are described below by way of specific specific examples, and those skilled in the art can readily appreciate the other advantages and effects of the present invention from the disclosure herein.

Please refer to FIGS. 1 and 2, which are schematic diagrams and application diagrams of the device according to the preferred embodiment of the present invention. The present invention discloses a linear vapor deposition apparatus 1 for performing a coating process for a substrate in a vacuum environment 2, having at least one crucible 10 and a heating chamber 11, the heating chamber 11 is disposed on one side of the crucible 10 and has a cavity heater 111, and the crucible 10 A plating plate 3 is accommodated, and the heating chamber 11 defines a linear vapor deposition port 112.

The linear vapor deposition device 1 is characterized in that the crucible 10 has a mouth 101 and a body 102. The mouth 101 is formed by an open end edge of the body 102, and the mouth 101 is fast against the mouth 101. The inside of the cavity 11 is heated, wherein the mouth 101 side of the crucible 10 and the body 102 side are both heated, and a two-stage heating is formed, thereby eliminating the vapor condensation phenomenon of the plating material 3. In the prior art, when the crucible 10 is heated to cause the plating material 3 to be vaporized therein, the vapor of the plating material 3 is easily condensed due to the temperature difference, and the structure disclosed by the present invention is The heating chamber 11 is provided with the cavity heater 111 to heat the heating chamber 11, and the nozzle 101 is abutted against the heating chamber 11, so that the nozzle 101 side can be heated by the heating chamber The body 11 is heated to a state in which the body 102 is heated by the heating of the crucible 10, and is heated by the two sides of the mouth 101 side and the body 102 side. In the state, the vapor formed by the plating material 3 flows into the heating chamber 11 from the crucible 10, and even if the temperature of a part of the region is low, the vapor temporarily condenses, but the condensed droplets are affected by the capillary phenomenon. By moving toward the mouth 101 side or the body 102 side and being heated to form a vapor, it is possible to completely avoid the occurrence of condensation and at the same time to make the formed vapor have a more stable state. The number of the crucibles 10 is increased or decreased according to the amount of materials required for the evaporation process. Here, a single crucible 10 is taken as an example. In this embodiment, the plating material 3 can be a high activity gold such as aluminum, magnesium or calcium. One of the materials is a material for preparing a metal layer film of an OLED.

In one embodiment of the present invention, the linear vapor deposition device 1 further has a crucible carrier 12 and at least one crucible heater 13 for placing the body 102, the crucible heater 13 The crucible holder 12 is placed in the crucible holder 12 to heat the plating material 3. Since the crucible heater 13 is disposed in the crucible holder 12 to heat the body 102, the heat transfer of the crucible heater 13 can be prevented by the crucible holder 2 from causing external influences. Heat loss of work to improve heating efficiency. In addition, the crucible carrier 12 can have a plurality of thermal insulation plates 121, and the thermal insulation plates 121 are connected to each other to form an accommodation space 122 for placing the main body 102 and the crucible heater 13 through the heat insulation. The plate 121 can further achieve the heat insulating performance and improve the heating efficiency of the crucible heater 13. Similarly, the cavity heater 111 can also be disposed inside the heating cavity 11 to achieve the heat insulation as described above and prevent the heat loss of the work, so as to have better heating efficiency.

In one embodiment of the present invention, the heating chamber 11 is made of a material having high temperature resistance and low thermal expansion characteristics. In the embodiment, the heating chamber 11 is made of titanium zirconium-molybdenum (TZM) alloy. As an example, it has the advantage of carrying a higher temperature and being less prone to expansion deformation when heated by the cavity heater 111.

In an embodiment of the present invention, in order to allow the vapor generated by the plating material 3 to stably and continuously flow to the vacuum environment 2, and to allow the flow of the vapor of the plating material 3 to have high directivity and maintain the stability of the coating process, The heating chamber The saturated vapor pressure in the 11 is greater than the background pressure in the vacuum environment 2, and the vapor of the plating material is flowed from the heating chamber 11 to the vacuum environment 2 by the pressure difference, thereby further improving the subsequently prepared film. Uniformity.

In one embodiment of the present invention, the crucible 10 is located in the inner surface area of the heating chamber 11, and the ratio of the total internal surface area of the crucible 10 is between 1:10 and 1:6. The internal surface area refers to the area of the inner surface of the crucible 10 for accommodating the plating material 3. When the nozzle 101 abuts against the inside of the heating chamber 11, the space for accommodating the plating material 3 is A portion is then fixed in the heating chamber 11. Referring to FIG. 1 , in order to surely prevent the vapor of the plating material 3 from being condensed, the surface area ratio can directly define the crucible 10 to penetrate the heating chamber. The depth of the body 11. When the ratio of the inner side surface area of the heating chamber 11 to the total surface area of the inner side of the crucible 10 is in the range of 1:10 to 1:6, the mouth 101 side of the crucible 10 can be prevented from being unsmooth. The heating chamber 11 forms a heated state and affects the fact that the body 102 side is not easily heated.

In the actual application, the plating material 3 located in the crucible 10 is heated by the crucible heater 13 to form a vapor, and flows into the heating chamber 11, since the mouth 101 is against The heating chamber 11 is configured to form the two-stage heating of the crucible 10, so that the vapor does not cause the condensation phenomenon due to the low temperature section of the crucible 10 during the flow to the heating chamber 11. The use rate of the plating material 3 is increased, and the vapor of the plating material 3 is made more stable to prepare a film having high uniformity. And then flowing into the vapor of the heating chamber 11 Then, the linear vapor deposition port 112 flows to the vacuum environment 2 to coat the substrate, and the saturated vapor pressure of the heating chamber 11 can be controlled to be greater than the vacuum background pressure of the vacuum environment 2 to enable the plating. The vapor of material 3 is stably coated on the substrate, and the uniformity of the subsequent film can be improved.

In summary, the linear vapor deposition device of the present invention is configured to form a two-stage heating by the structure of the nozzle against the inside of the heating chamber, thereby eliminating the steam generated by the heat of the plating material. Condensation, causing the problem of the use of the plating material. In addition, by setting the crucible heater inside the crucible holder and setting the cavity heater to the heating chamber, the crucible heater and the cavity heater can be reduced The heat loss of the work can increase the heating efficiency of the two.

The above-described embodiments are merely illustrative of the features and functions of the present invention, and are not intended to limit the scope of the technical content of the present invention. Any person skilled in the art can modify and change the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of this creation should be as listed in the scope of the patent application described later.

1‧‧‧Linear evaporation device

10‧‧‧ Shabu Shabu

101‧‧‧ mouth

102‧‧‧Ontology

11‧‧‧heating chamber

111‧‧‧ cavity heater

112‧‧‧Linear evaporation port

12‧‧‧坩锅座

121‧‧‧Insulation board

122‧‧‧ accommodating space

13‧‧‧ plating heater

Claims (8)

A linear vapor deposition device for coating a substrate in a vacuum environment, comprising at least one crucible and a heating chamber, the heating chamber being disposed on one side of the crucible and having a cavity heating The crucible is provided with a plating material, wherein the crucible has a mouth and a body, and the mouth is formed by an open end edge of the body, and the mouth is fastened Corresponding to the inside of the heating chamber, wherein the mouth side and the body side of the crucible are both heated, and two-stage heating is formed, thereby eliminating the vapor condensation phenomenon of the plating material. The linear vapor deposition device of claim 1, further comprising a crucible holder and at least one crucible heater, wherein the crucible holder is provided for placing the body, and the crucible heater is disposed on the crucible holder The plated material is heated. The linear vapor deposition device of claim 1 or 2, wherein the cavity heater is disposed inside the heating chamber. The linear vapor deposition device of claim 3, wherein the material of the heating chamber is a titanium zirconium-molybdenum alloy. The linear vapor deposition device of claim 3, wherein the saturated vapor pressure in the heating chamber is greater than the background pressure in the vacuum environment. The linear vapor deposition device of claim 3, wherein the plating material is one of aluminum, magnesium or calcium. The linear vapor deposition device of claim 3, wherein the crucible is located in the inner surface area of the heating chamber, and the ratio of the total internal surface area of the crucible is 1:10 ~1:6. The linear vapor deposition device of claim 2, wherein the crucible carrying base has a plurality of insulating panels, each of the insulating panels being connected to each other to form a space for accommodating the body and the crucible heater .