TWM543742U - Welding fastener and structure of its welding on circuit board - Google Patents

Description

Welded fastener and its structure welded on the circuit board

The invention provides a welding fastener and a structure welded on the circuit board, so that the welding fastener and the first circuit board form a module component, and the second panel is fastened by the welding fastener.

The technology of combining the two circuit boards with each other is screwed together, for example, a plurality of screw holes are machined on a first circuit board, and a connecting post having an externally threaded column at one end and an internally threaded hole at the other end is attached. In the screw hole of the first circuit board, a plurality of corresponding optical holes are processed on the second plate member for bonding, so that the second plate member is placed on the connecting post, and then a plurality of screws are inserted The light holes of the second plate are locked to the screw holes of the connecting post, thereby combining the two circuit boards with each other.

However, the above-mentioned connecting post is locked to the combined structure of the first circuit board, and it is necessary to lock the connecting post into the screw hole of the first circuit board one by one, which causes the process efficiency to be too slow, and the second plate member is also locked one by one. Attaching screws is obviously not conducive to improving production efficiency. Moreover, if the two circuit boards are required to be frequently disassembled, the screw-locking technology will not meet the need for disassembly and assembly.

In view of the shortcomings of the above-mentioned prior art, the creator feels that he has not perfected it, exhausted his mind and researched and overcome it, and based on his accumulated experience in the industry for many years, he developed a welded fastener and welded it in the circuit. The structure of the board, in order to achieve the purpose of streamlining the combined structure and improving production efficiency.

In order to achieve the above and other objects, the present invention provides a solder fastener for soldering to a first circuit board, thereby fastening a second board member, the solder fastener comprising: one for soldering a body of the first solder layer of the first circuit board, a head for holding the second board member, and a neck portion connected to the body portion and the head portion.

In the above welding fastener, the body portion has a mating surface corresponding to the surface of the first circuit board, and a second solder layer for providing solder adhesion.

In the above welding fastener, the body has a convex portion for inserting through an opening of the first circuit board, and a second solder layer for providing solder adhesion.

In the above welding fastener, the body has a shoulder for abutting against the surface of the first circuit board, and a second solder layer for providing solder adhesion.

In the above welding fastener, the second solder layer is a plating layer, and the plating layer is tin, copper, nickel or zinc.

In the above welding fastener, the body portion, the head portion and the neck portion are integrally formed or assembled.

The solder fastener includes a carrier having an receiving space and an opening of the receiving space, and the soldering fastener is disposed in the receiving space from the opening.

In the above welded fastener, the carrier has a cover that covers the opening and can be opened.

To achieve the above and other objects, the present invention provides a structure in which a solder fastener is soldered to a circuit board, comprising: a first circuit board having a first solder layer; and a second board having a buckle And the welding fastener is welded on the welding layer of the first circuit board, the head of the welding fastener is fastened to the fastening portion of the second plate member, and the neck of the welding fastener is disposed at the neck portion The buckle.

In the above structure, the first solder layer of the first circuit board has a solder layer, and the solder layer is soldered to the second solder layer of the solder fastener.

In the above structure in which the solder fastener is soldered on the circuit board, the first solder layer of the first circuit board has a surface copper layer, and the second solder layer of the solder clip is soldered to the surface copper layer.

In the structure in which the soldering fastener is soldered on the circuit board, the first solder layer of the first circuit board has a surface copper layer, and the solder layer is soldered to the second solder layer of the soldering fastener and the surface copper layer .

In the structure in which the soldering fastener is soldered on the circuit board, the soldering fastener and the first circuit board form a module member.

In the structure in which the soldering fastener is soldered on the circuit board, the fastening portion of the second plate member has a through hole having a diameter larger than the head portion, and a fastening groove that communicates with the through hole and has a width smaller than the head portion; The head passes through the perforation to allow the neck to pass through the fastening groove.

In the structure in which the soldering fastener is soldered on the circuit board, the fastening portion of the second panel has a through hole having a diameter larger than the head, a fastening hole having a diameter smaller than the head, and a communication hole and a through hole The fastening hole has a width smaller than a fastening groove of the head; and the head passes through the through hole to pass the neck portion to the fastening groove or the fastening hole.

In order to achieve the above and other objects, the present invention provides a method of soldering a soldering member to a circuit board, wherein the soldering fastener is disposed in a receiving space of the carrier, and the soldering buckle is contacted by a tool contacting the head. The device is taken out from the accommodating space of the carrier, and transferred to the first solder layer of the first circuit board, and then heated to melt a solder layer on the first solder layer into liquid solder, waiting for the liquid solder to cool down. A solid welded structure is then formed to weld the solder fastener to the first circuit board.

1‧‧‧welding fasteners

11‧‧‧ Body

111‧‧‧ docking surface

112‧‧‧Second welding layer

113‧‧‧ convex

114‧‧‧ shoulder

12‧‧‧ head

13‧‧‧ neck

2‧‧‧First board

21‧‧‧First solder layer

211‧‧‧ solder layer

212‧‧‧Surface copper layer

22‧‧‧Opening

3‧‧‧Second board

31‧‧‧Deduction Department

311‧‧‧Perforation

312‧‧‧Snap slot

313‧‧‧Snap holes

4‧‧‧ Carrier

41‧‧‧ accommodating space

42‧‧‧ openings

43‧‧‧ Cover

5‧‧‧ Tools

[Fig. 1] Fig. 1 is a perspective view showing a specific embodiment of a welded fastener integrally formed by the present invention.

[Fig. 2] A front view showing a specific embodiment of a welded fastener integrally formed by the present invention.

[Fig. 3] is a schematic cross-sectional view showing a specific embodiment of a combination of a head and a neck of the present welding fastener.

Fig. 4 is a cross-sectional view showing a specific embodiment of a body and a neck combination of the present welding fastener.

Fig. 5 is a schematic cross-sectional view showing a specific embodiment of a combination of a head body and a neck of the present welding fastener.

Fig. 6 is a schematic cross-sectional view showing a specific embodiment of the screw body of the present invention.

Fig. 7 is a schematic cross-sectional view showing a specific embodiment of the present invention in which a welding fastener is disposed on a carrier.

[Fig. 8A] is a schematic view showing the action of the present welding fastener being taken out of the carrier by the tool.

[Fig. 8B] is a schematic view showing the action of the present welding fastener being placed on the surface of the circuit board by the tool.

[Fig. 8C] is a schematic view showing the welding of the welding fastener and the surface of the circuit board by heating.

[Fig. 9A] is a schematic view showing the action of the present welding fastener being moved by the tool to the opening of the circuit board.

[Fig. 9B] is a schematic view showing the welding of the welding fastener and the circuit board opening heating.

[Fig. 10] is a perspective view showing the welding of the welding fastener to the first circuit board and fastening the second circuit.

[Fig. 11] is a schematic cross-sectional view showing the welding of the welding fastener to the first circuit board and fastening the second circuit.

FIG. 12 is a perspective view showing another embodiment of the fastening portion of the second circuit of the present invention.

Fig. 13 is a schematic cross-sectional view showing another embodiment of the fastening portion of the second circuit of the present invention.

Fig. 14 is a perspective view showing a specific embodiment in which the present invention is embodied in a disk shape.

Fig. 15 is a schematic view showing a specific embodiment in which the present invention is embodied as a wound strip.

In order to fully understand the purpose, features and effects of the present work, the following detailed description of the present invention, together with the accompanying drawings, provides a detailed description of the creation, as illustrated below: Referring to Figures 1 and 2, The present invention is a perspective view and a front view of a specific embodiment of a welded fastener, which is used for welding on a first circuit board 2 (Fig. 8C, 11 and FIG. 13 , and further, a second plate member 3 can be fastened (as shown in FIG. 11 and FIG. 13 ). The preferred embodiment of the welded fastener 1 can adopt an integrated processing technology. A body portion 11 for welding the first solder layer 21 of the first circuit board 2, a head portion 12 for holding the second board member 3, and a body 11 and the head portion 12 are attached. a neck portion 13 between: the body portion 11 and the head portion 12 may be circular, polygonal or other geometric shape or different shape, and the neck portion 13 is a cylinder having a diameter smaller than the body portion 11 and the head portion 12. Or a polygonal column.

The welded fastener 1 of the present invention is not limited to the above-mentioned integrally formed structure, and the welded fastener 1 can also be configured as a combined molding; as shown in FIG. 3, the welded fastener 1 integrates the body 11 with the neck 13 Forming, and then combining the other end of the neck 13 with the head 12; or as shown in Fig. 4, the welded fastener 1 integrally forms the head 12 with the neck 13, and then the other end of the neck 13 is combined with the body The welding fastener 1 has the body portion 11, the head portion 12 and the neck portion 13 as separate components, and the neck portion 13 is combined with the body portion 11 and the other end is combined. In the head portion 12; the configuration and manner of the above combination are not limited, and may be riveting, pressing combination or screwing (as shown in Fig. 6) or any other combination of construction and method.

As shown in FIG. 1 and FIG. 2, the body portion 11 of the welded fastener 1 can be implemented with a mating surface 111 correspondingly bonded to the surface of the first circuit board 2, and can be implemented around the body portion 11 or the mating surface 111. There is a second solder layer 112 for providing solder adhesion. As shown in FIG. 3, FIG. 4, FIG. 5 and FIG. 6, the body portion 11 can be implemented with a convex portion 113 for inserting into an opening 22 of the first circuit board 2, the body portion. 11 can also be implemented with a shoulder 114 for abutting against the surface of the first circuit board 2, so that a second solder layer 112 for providing solder adhesion can be implemented around the protrusion 113 and/or around the shoulder 114. The second solder layer 112 may be implemented as a tin, copper, nickel or zinc plating layer, so that the solder fastener 1 is more suitable for soldering combination with the first circuit board 2.

As shown in FIG. 7, the welded fastener of the present invention may be further filled in a carrier 4 after being manufactured or combined according to the above features. The carrier 4 may be made of plastic, so that the carrier 4 is formed with a plurality of The accommodating space 41 and an opening 42 in each accommodating space 41 can be implemented with a cover 43 or a film covering the opening 42 and can be opened (or the cover 43 or the film is not required); The welding fastener 1 is disposed in the accommodating space 41 from the opening 42 so that the body portion 11 faces the accommodating space 41, and the head portion 12 faces the opening 42, thereby aligning the welding fasteners 1 neatly. It is housed in the carrier 4 for easy access to the storage, handling and use tool 5 (as shown in Figure 8A). As shown in FIG. 14, the carrier 4 can be implemented as a rigid disk body, and a receiving space 41 is formed in the disk body for receiving the soldering fastener 1; or as shown in FIG. It can also be implemented as a rollable strip, and the elongated strip forms an accommodating space 41 for accommodating the welded fastener 1 described above.

By the technical features of the above-mentioned welding fastener 1 and carrier 4, the present invention further proposes a structure and a method for welding a welding fastener on a circuit board. Referring to FIG. 8A, the structure of the welding fastener 1 welded on the circuit board is shown. And the method, the head 12 of the welded fastener 1 can be contacted by a tool 5, and the welded fastener 1 is taken out from the accommodating space 41 of the carrier 4; thereafter, as shown in FIG. 8B, the tool 5 is taken out. After the fastener 1 is welded, it can be transferred onto the first solder layer 21 of a first circuit board 2, so that the body 11 abuts against the first solder layer 21, and then heated by hot return air welding or other heating technology. a solder layer 211 on the first solder layer 21 is melted into a liquid solder, and then waits for the liquid solder to cool down at a normal temperature to form a solid welded structure for soldering the solder fastener 1 and the first circuit board 2, so that The welding fastener 1 and the first circuit board 2 constitute a module member, and thereafter the second plate member 3 can be fastened by the welding fastener 1. The tool 5 is preferably a vacuum suction device that can be attracted to the top end of the head 12 of the welded fastener 1 and then removed from the receiving space 41 of the carrier 4 for transfer to the first Welding is performed on a circuit board 2.

As shown in FIG. 9A and FIG. 9B, the first circuit board 2 can be provided with an opening 22, and a first solder layer 21 is disposed around the opening 22, thereby enabling the soldering fastener 1 by using the above method. Transferred to the first circuit board 2, the convex portion 113 of the welded fastener 1 is inserted into the opening 22, and the shoulder 114 is abutted against the opening 22. Surrounding, such a solder layer 211 on the first solder layer 21 is melted into liquid solder by hot return air welding or other heating technology, and then the liquid solder is cooled at a normal temperature to form a soldered fastener 1 With the solid-state welding structure of the first circuit board 2, the welding fastener 1 and the first circuit board 2 form a module member, and then the second plate member 3 can be fastened by the welding fastener 1.

As shown in FIG. 8B or FIG. 9A, the first solder layer 21 of the first circuit board 2 is preferably pre-implemented with a solder layer 211, so that the solder is soldered by hot return air welding or other heating technology. After the layer 211 is melted and solidified, the second solder layer 112 attached to the solder fastener 1 can be soldered. The first solder layer 21 of the first circuit board 2 is specifically provided with a surface copper layer 212, and then the solder layer 112 is melted and solidified, and then soldered to the second solder layer 112 of the solder fastener 1 and the surface copper. Layer 212. The solder layer 211 is a soft solder such as a solder paste, and is disposed in advance on the surface copper layer 212 or the opening 22 to be welded to the solder fastener 1 .

After the soldering fastener 1 and the first circuit board 2 form a module component, the second fastening component 1 can be used to fasten a second panel 3 by using the soldering fastener 1 and the first circuit board 2 to form a module component. As shown in FIG. 10 and FIG. 11 , the second plate member 3 can be configured with a fastening portion 31 matching the head portion 12 of the welding fastener 1 and the neck portion, so that the neck portion 13 of the welding fastener 1 is passed through. At the fastening portion 31, the head portion 12 is fastened to the fastening portion 31. As shown in FIG. 10 and FIG. 11 , the fastening portion 31 can implement a through hole 311 having a diameter larger than the head portion 12 , and a fastening groove 312 that communicates with the through hole 311 and has a smaller width than the head portion 12 , thereby After the head 12 of the welded fastener 1 passes through the through hole 311, the second plate member 3 is moved to pass the neck portion 13 to the fastening groove 312 to form a structure for holding the second plate member 3. As shown in FIG. 12 and FIG. 13 , the fastening portion 31 can also have a through hole 311 having a diameter larger than that of the head portion 12 , a fastening hole 313 having a diameter smaller than the head portion 12 , and a connection between the through hole 311 and the fastening hole 311 . The hole 313 has a width smaller than the fastening groove 312 of the head portion 12, thereby moving the head portion 12 of the welded fastener 1 through the through hole 311, and then moving the second plate member 3 so that the neck portion 13 is passed through the buckle. Slot 312 or the snap The hole 313 is formed to form a structure for holding the second plate member 3, and conversely, the second plate member 3 can be reversely disengaged from the welded fastener member 1.

The present invention has been disclosed in the above preferred embodiments, and it should be understood by those skilled in the art that the present invention is only intended to depict the present invention and should not be construed as limiting the scope of the present invention. It should be noted that variations and permutations equivalent to those of the embodiments are intended to be included within the scope of the present invention. Therefore, the scope of protection of this creation is subject to the definition of the scope of patent application.

1‧‧‧welding fasteners

11‧‧‧ Body

111‧‧‧ docking surface

112‧‧‧Second welding layer

12‧‧‧ head

13‧‧‧ neck

Claims (17)

A welding fastener for welding to a first circuit board, thereby fastening a second board member, the soldering fastener comprising: a body for soldering the first solder layer of the first circuit board a portion for holding the head of the second panel and a neck connected to the body and the head. The solder fastener of claim 1, wherein the body has a mating face that is coupled to the surface of the first circuit board, and a second solder layer that provides solder adhesion. The solder fastener of claim 1, wherein the body has a protrusion for receiving an opening in the first circuit board, and a second solder layer for providing solder adhesion. The solder fastener of claim 1, wherein the body has a shoulder for abutting against the surface of the first circuit board and a second solder layer for providing solder adhesion. The solder fastener of any one of claims 2 to 4, wherein the second solder layer is a plating layer, the plating layer being tin, copper, nickel or zinc. The welded fastener of any one of claims 1 to 4, wherein the body, the head and the neck are integrally formed or assembled. The welding fastener according to any one of claims 1 to 4, further comprising a carrier having an accommodating space and an opening of the accommodating space, and the welding fastener is disposed in the accommodating space from the opening Set the space. The welded fastener of claim 7, wherein the carrier has a cover that covers the opening and can be opened. A structure for soldering a soldering member to a circuit board according to any one of claims 1 to 6, comprising: a first circuit board having a first solder layer; and a second board member; The welding fastener is welded to the welding layer of the first circuit board, and the head of the welding fastener is fastened to the fastening portion of the second plate member, and the neck of the welding fastener The portion is worn in the fastening portion. The structure of claim 9, wherein the first solder layer of the first circuit board has a solder layer, and the solder layer is soldered to the second solder layer of the solder fastener. A structure for soldering a soldering member to a circuit board according to claim 9, wherein the first solder layer of the first circuit board has a surface copper layer, and the second solder layer of the solder clip is soldered to the surface copper layer. The structure as claimed in claim 10, wherein the first solder layer of the first circuit board has a surface copper layer, and the solder layer is soldered to the second solder layer of the solder fastener; The surface copper layer. A structure for soldering a soldering member to a circuit board according to claim 9, wherein the soldering member and the first circuit board form a module member. The structure of claim 9, wherein the fastening portion of the second plate has a through hole having a diameter larger than the head, and a buckle connecting the through hole and having a width smaller than the head. a groove; and the head passes through the perforation to allow the neck to pass through the fastening groove. The structure of claim 9, wherein the fastening portion of the second plate has a through hole having a diameter larger than the head, a fastening hole having a diameter smaller than the head, and a connection. The through hole and the fastening hole are wider than the fastening groove of the head; and the head passes through the through hole to pass the neck through the fastening groove or the fastening hole. The structure of the welding fastener according to any one of claims 9 to 15, wherein the welding fastener is disposed in a receiving space of the carrier, and the welding is performed by contacting the head with a tool. The fastener is taken out from the accommodating space of the carrier, and transferred to the first solder layer of the first circuit board, and then heated to melt a solder layer on the first solder layer into liquid solder, waiting for the liquid solder After cooling, a solid welded structure that welds the welded fastener to the first circuit board is formed. A structure in which the solder fastener of claim 16 is soldered to a circuit board, wherein the solder layer is a soft solder.