TWM499587U - Electronic device - Google Patents

Abstract

The invention discloses an all in one electrical device comprises a housing element, a board element and a panel element, wherein the board element and the panel element are in the housing element, wherein the housing element comprises an outer casing and a transparent substrate on a opening of the outer casing, wherein the outer casing comprises a first metal block and the transparent substrate comprises a second metal block, and wherein the transparent substrate is engaged with the outer casing through a magnetic adsorption between the first and second metal blocks. The all in one electrical device of the invention is very easy dismantling for hardware upgraded, to make the upgraded process is convenient and fast, so that significantly reduce the difficult for hardware upgrade.

Description

Electronic device

The present invention relates to an electronic device, and more particularly to an all in one computer device that is easy to disassemble and has good heat dissipation.

The All-in-One PC (AIO) is a desktop computer that integrates a microprocessor, motherboard, hard drive, screen, speaker, video lens and display. Originally developed for Apple, Apple first introduced several all-in-ones to the market, such as the original Macintosh in the 1980s and the iMac in the 1990s and 2000s, but the market was low due to high prices. In 2009, Intel introduced the low-cost CPU Intel Atom, which prompted computer manufacturers to increase the design and mass production of AIO models. Compared with the traditional computer, the integrated computer has the advantages of small size, beautiful appearance and easy to match the indoor display. Compared with the notebook computer, the integrated machine has excellent performance and maintains a certain degree of portability. However, AIO also makes it difficult to upgrade the computer because of the hardware integration of various parts of the computer.

The present invention is an integrated electronic device comprising a housing component, a motherboard component and a display panel component, wherein the motherboard component and the display panel component are located within the housing component, the housing component comprising a housing and a housing a transparent substrate disposed on one of the openings of the housing, wherein the housing is provided with a first metal block, and the transparent substrate is provided with a second metal block via the first metal block The magnetic force of the second metal block is attracted to engage the transparent substrate with the housing. Therefore, the outer casing component of the integrated electronic device of the present invention can be easily disassembled as long as the transparent substrate is separated from the casing.

The present invention is an integrated electronic device including a housing component, a support base, a motherboard component, and a display panel component, wherein the motherboard component and the display panel component are located in the housing component, and the support base Pivot to the housing element, the housing element being rotatable relative to the support base, the housing element The invention comprises an integrally formed housing and a transparent substrate disposed on an opening of the housing, wherein the transparent substrate is separable from the housing.

An integrated electronic device includes a housing component, a support base, a motherboard component, and a display panel component, wherein the motherboard component and the display panel component are located in an internal space of the housing component, and the support The base is pivotally connected to the outer casing member, and the outer casing member is rotatable relative to the support base, wherein the outer casing member comprises a casing and a transparent substrate, wherein the casing is an integrally formed single component, wherein a recess is located therein In the housing, the transparent substrate is adapted to engage the housing and is located on an opening of the recess to thereby define the internal space of the housing element, and the transparent substrate is adapted to be separated from the housing in a direction away from the recess.

These and other components, steps, features, advantages and advantages of the present invention will become apparent from the following detailed description of the accompanying drawings.

10‧‧‧Electronic devices

20‧‧‧Support base

100‧‧‧Shell components

200‧‧‧ display panel components

300‧‧‧ motherboard components

400‧‧‧Storage components

500‧‧‧Heat components

600‧‧‧Remote signal receiving interface card

700‧‧‧Image Sensing Interface Card

800‧‧‧Common Sequence Bus Expansion Interface Card

900‧‧‧Extension components

102‧‧‧ Back shell

104‧‧‧Transparent substrate

106‧‧‧ openings

108‧‧‧ side wall

110‧‧‧shell

112‧‧‧First screw hole

114‧‧‧Second screw hole

116‧‧‧ Third screw hole

118‧‧‧First accommodating slot

120‧‧‧Second accommodating slot

122‧‧‧protrusion

132‧‧‧The third accommodating slot

124‧‧‧ vents

1181‧‧‧ side wall

1182‧‧‧ side wall

1183‧‧‧ side wall

1184‧‧‧ side wall

1185‧‧‧ openings

1186‧‧‧ openings

126‧‧‧ holes

134‧‧‧Perforation

133‧‧‧Perforation

138‧‧‧Fixed tablets

140‧‧‧Metal rod

1381‧‧‧connection hole

1382‧‧‧ screw holes

1401‧‧‧ concave

1402‧‧‧Threaded Department

1403‧‧‧Care Department

1404‧‧‧ screw holes

22‧‧‧Connecting Department

1405‧‧‧ screws

24‧‧‧Support subject

26‧‧‧ bottom

310‧‧‧Perforation

302‧‧‧Central Processing Unit

304‧‧‧Dynamic memory

308‧‧‧ Hard disk expansion slot

401‧‧‧Frame

402‧‧‧Storage hard drive

601‧‧‧Signal Sensor

701‧‧‧Image sensor

40‧‧‧ horn components

50‧‧‧Display panel driver interface card

312‧‧‧ expansion slot

502‧‧‧heating metal fins

50‧‧‧fan

506‧‧‧ cover

508‧‧‧thermal metal tube

510‧‧‧heat conduction device

5101‧‧‧Lock metal plate

5104‧‧‧ screws

5105‧‧‧ screw hole

201‧‧‧Frame

202‧‧‧ display panel

2013‧‧‧Fixed components

128‧‧‧ screws

1282‧‧ holes

1041‧‧‧First transparent area

1042‧‧‧Second transparent area

1043‧‧‧ Third transparent area

1044‧‧‧opaque area

111‧‧‧ openings

109‧‧‧ Track

902‧‧‧Fixed tablets

Fig. 1 is a perspective view showing the appearance of an electronic device integrated with the creation.

Fig. 2 is a perspective view showing the back of the electronic device integrated with the creation.

Figure 3 is an exploded perspective view of the electronic device integrated with the creation.

Figure 4 is a schematic view of the housing of the electronic device integrated with the creation of the integrated motherboard.

Figure 5 is a perspective view of the electronic device housing integrated with the creation.

6A to 6C are perspective views of the electronic device housing combined with the connecting rod member of the creative integration.

Fig. 7 is a perspective view showing the mounting of the motherboard of the electronic device integrated with the creation to the casing.

Figure 8 is a perspective view of the electronic device in which the integrated device is integrated with the motherboard and other devices.

9A to 9B are perspective views of the heat dissipating component of the electronic device integrated with the creation.

10A to 10B are perspective views of the display panel components of the electronic device integrated with the creation.

Figure 11 is a perspective view of the flat head screw of the electronic device integrated with the creation.

FIG. 12A is a perspective view showing a transparent substrate provided by the electronic device integrated with the creation.

FIG. 12B is a schematic perspective view of a transparent substrate of the electronic device integrated with the creation.

13A to 13B are perspective views of another type of motherboard of the electronic device integrated with the creation.

Figure 14 is a perspective view of another type of housing component of the electronic device integrated with the creation.

Although certain embodiments have been shown in the drawings, the embodiments of the embodiments of the present invention And other embodiments described herein.

The drawings reveal illustrative embodiments of the present work. It does not describe all of the embodiments. Other embodiments may be used in addition or instead. In order to save space or more effectively explain, obvious or unnecessary details may be omitted. Instead, some embodiments may be implemented without revealing all the details. When the same number appears in different figures, it refers to the same or similar components or steps.

The present invention may be more fully understood from the following description, which is considered to be illustrative and not restrictive. These drawings are not necessarily drawn to scale, but rather emphasize the principles of the present invention.

Illustrative embodiments are now described. Other embodiments may be used in addition or instead. In order to save space or render more efficiently, obvious or unnecessary details may be omitted. Instead, some embodiments may be implemented without revealing all the details.

First embodiment:

The present invention is an all-in-one electronic device. As shown in FIGS. 1 to 4 , an electronic device 10 includes a support base 20 , a housing component 100 , a display panel component 200 , and a motherboard . The component 300, a storage component 400, a heat dissipation component 500, a remote control signal receiving interface card 600, an image sensing interface card 700, a universal serial bus (USB) expansion interface card 800, and an expansion component 900, wherein the housing component 100 includes a back shell 102 and a transparent substrate 104, and the electronic device 10 includes an integrated computer, a notebook computer, and a tablet computer, wherein the motherboard component 300, the storage component 400, the heat dissipation component 500, The remote control signal receiving interface card 600, the image sensing interface card 700, the universal serial bus (USB) expansion interface card 800, and an expansion component 900 are coplanar on the back shell 102.

As shown in FIGS. 5 and 6, the back shell 102 has an opening 106, four side walls 108 and a shell. The body 110 is formed integrally with the housing 110, and the material of the housing 110 and the sidewall 108 includes a plastic material, a metal material, and an alloy material (for example, an aluminum-magnesium alloy) on the surface of the housing 110. And having a plurality of first screw holes 112, second screw holes 114, a plurality of third screw holes 116, a first receiving groove 118, two second receiving grooves 120, and a protruding portion 122 in the opening 106. a third accommodating groove 132, wherein the first screw hole 112 is disposed along the four side walls 108 and adjacent to the boundary of the four sides of the housing 110, wherein the plurality of second screw holes 114 are along the four side walls 108 and close to the housing 110. The two sides of the housing 110 are disposed on the left and right sides of the housing 110, and the plurality of third screw holes 116 are located in the middle of the housing 110. The first accommodating groove 118 has a plurality of heat dissipation holes 124 in the housing 110, and has a plurality of third screw holes 116 at the periphery of the first accommodating groove 118. The first accommodating groove 118 has a side wall. 1181, a side wall 1182, a side wall 1183 and a side wall 1184. The side wall 1181 corresponds to the side wall 1183, wherein the side wall 1183 has An opening 1185, the side wall 1182 corresponding to the side wall 1184, wherein the side wall 1184 has an opening 1186 for exposing the space in the first accommodating groove 118, and the other two accommodating grooves 120 are disposed below the housing 110. The protrusions 122 are disposed between the two second accommodating grooves 120, and the protrusions 122 have a plurality of holes 126. In addition, the third accommodating groove 132 is located below the second accommodating groove 120, and a plurality of third screw holes 116 are disposed at the periphery of the third accommodating groove 132, and are in the third accommodating groove 132 and on the housing 110. There is a perforation 134. In addition, the housing 110 has a plurality of through holes 133 located on the left side below the housing 110 and between the second receiving groove 120 and the side of the housing 110, and additionally on the back side of the back shell 102, that is, in the back shell 102. The corresponding other surface of the opening 106 is a smooth surface without any screw holes on the back surface of the back shell 102.

As shown in FIG. 6A, FIG. 6B, FIG. 6C and FIG. 2, the third accommodating groove 132 can provide a connecting rod member, and the connecting rod member includes two fixing pieces 138, a metal rod 140 and two fixings. a nut (not shown), wherein the fixing piece 138 has two connecting holes 1381 and a plurality of screw holes 1382, and the metal rod 140 has a concave surface 1401 and two threaded portions 1402, and the two threaded portions 1402 are located on the metal rod 140. The two ends have a latching portion 1403 in the two threaded portions 1402 and the recessed surface 1401, and a plurality of screw holes 1404 are formed in the concave surface 1401. The connecting holes 1381 of the two fixing pieces 138 respectively pass through the threaded portions of the two ends of the metal rod 140. The two fastening nuts are respectively locked on the two threaded portions 1402, and the two fixing pieces 138 are respectively fixed between the nut and the engaging portion 1403, and one of the supporting bases 20 is connected. The portion 22 passes through the through hole 134 of the third accommodating groove 132, and is inserted into the plurality of screw holes 1404 on the concave surface 1401 through the plurality of screws 1405 through the through holes (not shown) on the connecting portion 22, and then passes through the plurality of screw holes 1404 on the concave surface 1401. Screw 1405 is fixed through The screw hole 1382 of the piece 138 is locked to the fixing screw hole 1382, so that the integral connecting rod member is fixed on the housing 110, and the connecting rod member can be rotated in the third receiving groove 132, so that the supporting base 20 and the housing 110 are pivoted. The housing 110 can be rotated relative to the support base 20, and the support base 20 further includes a support body 24 and a bottom portion 26 engaged with the connecting portion 22, and the housing 110 of the electronic device 10 can be suspended via the support base 20. It leaves the plane of the bottom 26 and is suspended from the connecting portion 22 of the support base 20.

Referring to FIG. 7 , the motherboard component 300 has a plurality of through holes 310 . The plurality of through holes 310 are respectively fixed to the plurality of second screw holes 116 through the plurality of through holes 310 to fix the motherboard component 300 to the housing 110 . The motherboard component 300 is provided with a central processing unit (CPU) 302, a dynamic memory (DRAM) 304, a plurality of interface expansion slots, a plurality of output input connections (I/O), a plurality of internal connectors, a chipset (Chipset), and The other control component, wherein the processor 302 is mounted in a processor socket on the surface of the motherboard component 300. The processor socket has an opening to expose the back of the processor 302, and the dynamic memory (DRAM) 304 is in the implementation. In the example, it is installed in a memory slot, but the dynamic memory 304 can also be directly mounted on the motherboard component 300. A plurality of through holes 310 are formed on the motherboard component 300, and the plurality of through holes 310 are respectively fixedly coupled to the plurality of second screw holes 116 via the plurality of screws 130 to fix the motherboard component 300 to the housing 110. The motherboard component 300 includes ATX type motherboard (size about 31.5 cm, width 24.5 cm), Micro ATX type motherboard (size about 24.5 cm, width 24.5 cm) or Mini-ITX type motherboard (size about 17.5 cm, width 17.5 cm). In addition, the plurality of output input ports (I/O) on the motherboard component 300 include a high definition multimedia interface (HDMI), a video graphics array input interface (Video Graphics Array, VGA), Composite video connector (AV terminal), Low-Voltage Differential Signaling (LVDS), voice input port, voice output port, network route port (for example, a connection that can receive RJ45 connectors) ), a power connection port, a television signal port, and a memory card external socket. When the motherboard component 300 is fixed on the housing 110, the plurality of output input ports (I/O) of the motherboard component 300 are exposed to the housing 110. The hole 126 of the projection 122 is inside. In addition, the chipset on the motherboard component 300 includes a wireless communication chipset (a WiFi chip or/and a Bluetooth chipset), an audio processing chip, a power management chip, and an image display chip.

Please refer to FIG. 8 , the other interface expansion slot includes a USB expansion slot 306 via a signal connection line. The USB expansion interface card 800 is connected to the USB expansion interface card 800. The USB expansion interface card 800 is fixed to the housing through the plurality of screws of the USB expansion interface card and the plurality of second screw holes 116. 110, wherein the USB expansion interface card 800 has two USB jacks respectively located in the plurality of through holes 133 of the housing 110 and exposed on the back surface of the housing 110. The interface expansion slot 308 further includes a plurality of hard disk expansion slots 308 connected to the storage component 400 via a signal connection cable. The storage component 400 includes a frame 401 and a storage hard disk 402 for storing hard The disc 402 is mounted in the frame 401, and the frame 401 has a plurality of perforations, and the plurality of through holes 130 respectively pass through the plurality of through holes of the frame 401 and the plurality of second screw holes 116 are locked and fixed, so that the storage element 400 is fixed to the housing 110. The hard disk 402 includes a SATA (Serial Advanced Technology Attachment) interface hard disk, a small computer system (SCSI) interface hard disk, a SAS (Serial Attached SCSI) interface hard disk, and Fibre Channel (FC) interface hard disk. One of the plurality of internal connectors on the motherboard component 300 can be connected to the remote control signal receiving interface card 600. The remote control signal receiving interface card 600 has a signal sensor 601 that can receive one of the external remote controllers. The signal is transmitted back to the motherboard component 300 via the remote control signal receiving interface card 600. One of the plurality of internal connectors on the motherboard component 300 can be connected to the image sensing interface card 700. The image sensing interface card 700 has an image sensor 701 that can receive an image of the outside world and convert it into a digital signal transmission. Return to the motherboard component 300. One of the plurality of internal connectors on the motherboard component 300 can be connected to the two horn components 40. The two horn components 40 are respectively disposed in the second accommodating slot 120 and connected to the motherboard component 300 via a signal connection line. One of the plurality of internal connectors on the motherboard component 300 can be connected to a display panel driving interface card 50, and the plurality of through holes 130 respectively pass through the display panel driving interface card 50 and the plurality of second screw holes 116 are locked. The display panel driving interface card 50 is fixed to the housing 110, wherein the display panel driving interface card 50 is respectively connected to the display panel component 200 and the motherboard component 300 via a second signal connection line. The display panel driving interface card 50 is used for The image signal is transmitted to the display panel element 200. The expansion slot 312 includes an expansion slot 312 connected to the expansion component 900 via a signal connection cable (for example, a bus bar connection line), wherein the expansion component 900 can include a separate image display interface card, an independent sound interface card, and a television signal. An expansion interface card that displays an interface card or other function. The expansion component 900 is fixedly coupled to the plurality of second screw holes 116 through a plurality of through holes 130 of the expansion member 900, so that the expansion device 900 is fixed to the housing 110. In addition, the expansion component 900 is not connected through the signal. In the case where the wiring is connected to the motherboard component 300, the motherboard component 300 can still operate independently.

As shown in FIG. 9A and FIG. 9B, the heat dissipating component 500 can be fixedly coupled to the housing 110 via a plurality of screws 130 and located on the first receiving slot 118. On the side of the motherboard component 300, the heat dissipating component 500 includes a heat dissipating metal fin 502, a fan 504, a cover 506, a plurality of thermally conductive metal tubes 508, and a heat conducting device 510, wherein the heat dissipating metal fins 502 are disposed at The fan 504 is located at the side of the opening 1186 of the first accommodating groove 118, and the air outlet of the fan 504 is located at the opening 1185 side of the first accommodating groove 118, and the fan 504 is sucked. The air vents are located on the surface of the fan 504. The heat conducting metal tubes 508 are disposed in the heat dissipating metal fins 502 through the openings 1185 of the side walls 1183 and extend into the heat conducting device 510. The heat conducting device 510 is located on the motherboard component 300. The heat conducting device 510 includes a locking metal plate 5101 and a heat conducting metal plate (not shown) fixed on the surface of the heat conducting metal plate and positioned under the locking metal plate 5101, wherein the heat conducting metal plate is under The surface can contact one of the motherboard components 300 The surface of the processor 302 in the processor socket can conduct heat generated by the operation of the processor 302 to the heat dissipating metal fins 502 via the heat conducting metal tubes 50, and the wind generated by the fan 504 will dissipate the metal fins 502. The heat energy is guided to the outside through a plurality of heat dissipation holes 124 in the first accommodating groove 118, and a thermal conductive paste may be applied on the lower surface of the heat conductive metal plate to increase the contact area between the heat conductive metal plate and the processor 302 to increase the heat conduction performance. The locking metal plate 5101 is perforated through the plurality of locking screws 5104 through the plurality of screws 5104 and is locked on the motherboard component 300, and the locking metal plate 5101 is located on the heat conducting metal plate and the heat conducting metal pipes 508. The locking metal plate 5101 has a plurality of screw holes 5105, and the locking metal plate 5101 is respectively locked to the main plate component 300 through the plurality of screw holes 5105 via the plurality of screw holes 5105, and the heat-conductive metal pipe 508 is pressed by the pressure generated by the locking. The heat conductive metal plate brings the heat conductive metal plate into closer contact with the surface of the processor 302 to increase the heat conduction performance, and the material of the heat dissipation metal fin 502 and the heat conductive metal plate includes iron, aluminum, copper or the like Gold, and the conductive metal tube 50 made of aluminum, copper, or their alloys.

As shown in FIG. 10A and FIG. 10B , the display panel component 200 can be fixed to the housing 110 via a plurality of screws 130 , and the display panel component 200 includes a frame 201 and a display panel 202 . Two fixing elements 2013 are respectively disposed on the frame of the frame 201, and each of the fixing elements 2013 has a perforation, and the display panel 202 is installed in the frame 201. The four frames of the frame 201 will display the panel 202. The four sides are fixed by the cover, and the display panel component 200 can be locked to the second screw through the perforation via the plurality of screws 130 respectively. On the hole 114, the display panel component 200 is bonded to the housing 110, and a signal connection port is disposed on the back of the frame 201, and is connected to the display panel driving interface card 50 via the signal connection line 2016.

As shown in FIG. 11 and FIG. 4, the plurality of screw holes 112 can respectively be locked with a metal material screw 128, wherein the type of the screw 128 is, for example, a flat head screw, and the screw 128 has a circular flat head in a plane. The center of the head surface has a hole 1282, and the hole 1282 can be one of a cross, a word, a cross, a hexagonal hole, a plum hole or an inner square hole, and the material of the screw 128 includes stainless steel and carbon. Steel or alloy, and the diameter of the flat head surface is between 0.3 cm and 2 cm, between 0.5 cm and 3 cm, or between 0.7 cm and 4 cm.

As shown in FIG. 12A, FIG. 12B and FIG. 3, the transparent substrate 104 can be bonded to the surface of the housing 110 and located on the opening 106. The transparent substrate 104 has a first transparent area 1041 and a second surface. a transparent area 1042, a third transparent area 1043 and an opaque area 1044. The opaque area 1044 is located on the four sides of the transparent substrate 104 and surrounds the transparent area 1041 located in the middle of the transparent substrate 104, and has a surface on the surface of the opaque area 1044. a light transmissive film for blocking light from passing through the opaque region 1042, and the second transparent region 1042 is positioned in the opaque region 1042 above the transparent substrate 104 and positioned in front of the image sensor 701 of the image sensing interface card 700. The image sensor 701 can receive the external image signal through the second transparent area 1042, and the third transparent area 1043 is located in the opaque area 1042 below the transparent substrate 104 and is located in the signal of the remote control signal receiving interface card 600. The sensor 601 is used to enable the signal sensor 601 to receive the remote control signal transmitted by one of the remote controllers through the third transparent area 1043. Then, on the surface of the opaque region 1044, a plurality of magnetic metal blocks 1045 are disposed along the four sides of the transparent substrate 104 and adjacent to the four sides of the transparent substrate 104, and the positions of each of the magnetic metal blocks 1045 are respectively corresponding to the screws on the housing 110. The position of 128 is magnetically attracted to the corresponding screw 128 by the magnetic metal block 1045 to fix the transparent substrate 104 and the housing 110, that is, the housing 110 is a single unit integrally formed, and the housing 110 is The opening 106 has a concave shape, and the transparent substrate 104 can be separated from the housing 110 away from the recess. The diameter of the magnetic metal block 1045 is between 0.3 cm and 2 cm, and between 0.5 cm and 3 cm. The diameter of the magnetic metal block 1045 can be the same as the diameter of the flat head surface of the screw 128 at 0.7 cm 4 cm, and the material of the magnetic metal block 1045 includes a lanthanum alloy (TbFe), a cobalt ruthenium alloy (GdCo), Nickel bismuth alloy (DyNi), neodymium iron boron alloy (NdFeB), cobalt nickel chrome alloy (Co-Ni-Cr), cobalt chrome Gold (Co-Cr-Ta), cobalt-chromium-platinum alloy (Co-Cr-Pt), cobalt-chromium-platinum-boron alloy (Co-Cr-Pt-B), and the like.

In addition, the transparent substrate 104 can also be a substrate having a touch function. When the transparent substrate 104 is a touch function substrate, the transparent substrate 104 can be connected to a touch control chip and the motherboard component 300 by connecting a signal connection line.

The outer casing component 100 of the integrated electronic device of the present invention can be easily disassembled, as long as the transparent substrate 104 is separated from the casing 110, and the device can be disassembled by using a device having a magnet (for example, a rod or a pen). The transparent metal substrate 10 is attached to the magnetic metal block 1045 on the other surface of the transparent substrate 104, and the transparent substrate 104 is separated from the casing 110 by the magnetic force and the urging force of the detacher. Alternatively, the opening 110 may be formed under the housing 110. The detacher's finger may abut the transparent substrate 104 via the opening 111 and push it away to separate the transparent substrate 104 from the housing 110.

Further, the transparent substrate 104 may be bonded to the casing 110, and the magnetic metal block 1045 on the four sides of the transparent substrate 104 may be replaced by four rectangular magnetic metal blocks. Alternatively, the screw 128 on the housing 110 may be replaced with another magnetic metal block, and may be adsorbed to the plurality of magnetic metal blocks 1045 on the transparent substrate 104 to bond the transparent substrate 104 to the housing 110. Alternatively, the plurality of magnetic metal blocks 1045 on the transparent substrate 104 may be replaced with non-magnetic metal blocks, and a corresponding one of the magnetic metal blocks may be disposed on the housing 110 to magnetically adsorb the transparent substrate 104 and the housing 110 via the two. The joint is fixed.

In addition, the transparent substrate 104 is coupled to the housing 110, and a track may be formed on the four side walls 108 of the housing 110. The width of the track is slightly larger than the width of the transparent substrate 104. One side wall 108 of the body 110 is temporarily removed to expose the track, the transparent substrate 104 is pushed into the track, and the previously removed side wall 108 is attached to the housing 110.

Further, the transparent substrate 104 may be bonded to the casing 110, and the transparent substrate 104 may be fixed to the opening 106 of the casing 110 by providing an engaging portion on each of the four side walls 108 of the casing 110.

The processor 302 of the electronic device 10 of the first embodiment may include a high-performance processor, such as an Intel x86 architecture processor. When the user uses the electronic device 10 of the embodiment, high heat is generated, so The heat dissipating component 500 described above reduces the temperature of the processor 302.

Second embodiment:

The second embodiment is similar to the tenth embodiment, as shown in FIG. 13A and FIG. 13B, and the difference is (1) The second embodiment of the motherboard component 300 has an appearance of an inverted L-shaped motherboard and is arranged in parallel with an L-shaped expansion component 900, and the motherboard component 300 and the expansion component are replaced by three fixing pieces 902. The 900 is fixed in one piece, wherein the L-shaped expansion component 900 is a television signal display interface card. (2) The processor 302 mounted on the motherboard component 300 of the second embodiment does not generate high heat during operation, so that it is not necessary to mount the heat dissipation component 500 in the first embodiment. (3) The second embodiment of the motherboard component 300 is provided with a storage unit wafer (not shown) instead of the storage component 400 of the first embodiment. The storage unit wafer includes an embedded multimedia storage card (Embedded Multi). -Media Card, eMMC) and storage flash memory (NAND Flash).

In addition, as shown in FIG. 14, the back shell 102 of the present invention can use a circular arc-shaped outer casing, so that the overall appearance of the electronic device 10 is more aesthetically pleasing.

The housing component 100 of the electronic device 10 integrated in the present invention is very easy to disassemble, and is very convenient and fast for the user to replace the hardware specification, and the appearance of the electronic device 10 does not have any screw holes, which is very attractive.

While the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art The scope of applicability of the present invention is defined by the scope of the appended claims and their equivalents. The scope of the present invention is defined by the scope of the claimed patent application. It should be noted that the word "comprising" does not exclude other elements, and the word "a" does not exclude a plurality.

All metrics, values, grades, positions, magnitudes, dimensions and other specifications set forth in this specification (including the scope of the claims) are approximation rather than precise. The above is intended to have a reasonable range of functionality associated therewith and which is consistent with the skill of the art.

20‧‧‧Support base

200‧‧‧ display panel components

300‧‧‧ motherboard components

400‧‧‧Storage components

500‧‧‧Heat components

600‧‧‧Remote signal receiving interface card

700‧‧‧Image Sensing Interface Card

800‧‧‧Common Sequence Bus Expansion Interface Card

900‧‧‧Extension components

102‧‧‧ Back shell

104‧‧‧Transparent substrate

108‧‧‧ side wall

110‧‧‧shell

114‧‧‧Second screw hole

122‧‧‧protrusion

Claims (20)

An integrated electronic device includes a housing component, a motherboard component, and a display panel component, wherein the motherboard component and the display panel component are located in the housing component, the housing component including a housing and a transparent substrate The transparent substrate is disposed on one of the openings of the housing, wherein the housing is provided with a first metal block, and the transparent substrate is provided with a second metal block via the first metal block and the The magnetic attraction of the second metal block engages the transparent substrate with the housing. The electronic device of claim 1, wherein the first metal block is a metal screw. The electronic device of claim 1, wherein the first metal block is a magnetic metal block. The electronic device of claim 1, wherein the second metal block is a magnetic metal block. The electronic device of claim 1, wherein the transparent substrate comprises a substrate having a touch function. The electronic device of claim 1, further comprising a heat dissipating component disposed in the internal space, the heat dissipating component comprising a plurality of heat dissipating metal fins, a heat conducting metal tube and a fan, the motherboard component, the motherboard component The heat dissipating metal fins and the fan are coplanarly disposed on an inner wall of the housing, and the heat conducting metal tube is disposed between the heat dissipating metal fins and spans one side of the main board member. The electronic device of claim 1, wherein the transparent substrate is provided with an opaque region and a transparent region, wherein the opaque region surrounds the transparent region, and the display panel component is adapted to emit light. Passing through the transparent region of the transparent substrate. The electronic device of claim 1, wherein the motherboard component comprises a first substrate, a second substrate, and a connecting line, wherein the first substrate and the second substrate are disposed coplanarly An inner wall of one of the housings, and the second substrate is connected to the first substrate through the connecting line. The electronic device of claim 8, wherein the expansion component comprises a television signal display interface card. The electronic device of claim 8, wherein the first substrate is independently operable if the second substrate is not connected to the first substrate through the connection line. The electronic device of claim 1, further comprising a remote control signal receiving interface card and a connecting line, wherein the remote control signal receiving interface card and the motherboard component are coplanarly disposed in one of the housings On the wall, the remote control signal receiving interface card is connected to the motherboard component via the connection line. The electronic device of claim 1, further comprising an image sensing interface card and a connecting line, the image sensing interface card and the motherboard component being coplanarly disposed on an inner wall of the housing The image sensing interface card is connected to the motherboard component via the connection line. The electronic device of claim 8, wherein the motherboard component comprises a fixing piece, and the first substrate is bonded to the second substrate. The electronic device of claim 1, wherein the material of the housing comprises an aluminum-magnesium alloy material. The electronic device of claim 1, wherein the housing is a unitary unitary member, and the transparent substrate is adapted to be separated from the housing in a direction away from the recess. The electronic device of claim 1, further comprising a universal serial bus expansion interface card disposed in the housing component and connected to the motherboard component via a signal connection cable. An integrated electronic device includes a housing component, a support base, a motherboard component, and a display panel component, wherein the motherboard component and the display panel component are located in an internal space of the housing component, and the support The base is pivotally connected to the outer casing member, and the outer casing member is rotatable relative to the support base, wherein the outer casing member comprises a casing and a transparent substrate, wherein the casing is an integrally formed single element a recessed portion is disposed in the housing, the transparent substrate is adapted to engage the housing and is located on an opening of the recess, thereby forming the internal space of the housing component, and the transparent substrate is adapted to be coupled to the housing Separate away from the direction of the depression. The electronic device of claim 17, wherein a magnetic metal block is disposed on the transparent substrate to engage with one of the metal blocks of the housing to engage the transparent substrate. The electronic device of claim 17, further comprising a heat dissipating component disposed on the housing, the heat dissipating component comprising a heat dissipating metal fin, a heat conducting metal tube and a fan, the heat dissipating metal fin and the The fan is located at a side of the motherboard component, and the fan is located at a side of the heat dissipation metal fin. The heat conductive metal tube is disposed in the heat dissipation metal fin and passes through a side boundary of the motherboard component. A thermal energy generated when the electronic device is operated is conducted into the heat dissipating metal fin via the thermally conductive metal tube. The electronic device of claim 17, wherein the motherboard component comprises a first motherboard and a television signal display interface card, and the motherboard is integrated with the television signal display interface card via a fixing piece. It is placed on the housing.