TWM491658U - Buffering pad and panel stack assembly having the buffering pad - Google Patents

Description

Cushion and cushioned panel stack combination

The present invention relates to a cushion, and more particularly to a cushion for a material having a difference in thickness and a panel stack combination with a cushion.

When the finished or semi-finished products of the liquid crystal display panel are stored and transported, the liquid crystal display panels and the isolation film are generally stacked in a package to save space for storing and transporting the finished or semi-finished products and to protect the finished products or semi-finished products. Free from damage during storage or transportation.

However, if the finished product or the semi-finished product of the liquid crystal display panel is a non-uniform product, that is, the height difference between the components of the finished or semi-finished product of the liquid crystal display panel, the liquid crystal display panels cannot be flattened and skewed. This skewed condition causes a waste of space in the package, which in turn leads to a significant drop in the number of packages.

In order to improve the skew condition, it is conventional practice to open a through-channel at a thicker portion of the corresponding product of the separator, so that a component having a higher height can be accommodated in the through-channel to reduce the skew condition. However, since the components located in the through-grooves collide with the products of the upper and lower layers when the package is subjected to impact or shaking, the product is damaged. Therefore, it is particularly important to improve the number of packages in the package and the product collision.

The present invention relates to a cushion pad and a cushioned panel stack combination, so as to solve the problem that when a conventional cushion is used for a product having a difference in thickness, a conventional cushion cannot improve the skew caused by a product having a difference in thickness. The situation, the problem of the number of packages being loaded, and When the package is subjected to impact or sloshing, adjacent products may collide with each other to cause damage to the product.

The cushion disclosed in the present invention comprises a buffer body and at least one isolation film. The thickness of the separator is less than the thickness of the buffer body, and the separator has at least one bonding side and at least one free side. The free side is connected to the bonding side, and the bonding side is stacked and fixed to the buffer body, and the isolation film at least partially does not overlap with the buffer body to form a receiving space. The free side is not fixed to the buffer body.

The panel stacking assembly disclosed in the present invention comprises a panel module and a cushion as described above. The panel module includes a panel body and a circuit driving component. The circuit driving component includes a circuit board and at least one electronic component. The circuit board is electrically connected to the panel body. The electronic components are stacked and electrically connected to the circuit board. The thickness of the circuit drive assembly is greater than the thickness of the panel. The buffer pad is stacked on the panel module, and the circuit driving component is located in the receiving space, so that the buffer body is stacked on the panel body, and the isolation film is stacked on at least one electronic component of the circuit driving component.

According to the buffer pad and the cushioned panel stack combination disclosed in the above embodiments, the cushioning body is attached to the buffer body through the isolation film to form a cushion having a receiving space, and the receiving space can eliminate the thickness difference of the panel module, so that the panel The stacking combination can be stacked more flatly, and the total thickness of the panel stacking combination can be reduced. In this way, it is possible to slow down the sway of the panel stacking package in the package and to increase the number of packages in the package.

In addition, the isolation film is sandwiched between the upper and lower circuit driving components to avoid collision of the lower electronic component with the upper circuit board, thereby reducing the probability of damage of the electronic component or the circuit board.

Moreover, since the free side of the isolation film is not fixed to the buffer body, the height of the accommodation space is not limited by the thickness of the buffer body. Therefore, the thickness of the buffer body can be appropriately thinned to further reduce the overall cost of the cushion.

The above description of the present invention and the following description of the embodiments are intended to illustrate and explain the principles of the present invention and to provide a further explanation of the scope of the invention.

10‧‧‧ panel stacking

100‧‧‧ panel module

110‧‧‧ Panel body

120‧‧‧Circuit Drive Components

121‧‧‧Circuit board

122‧‧‧Electronic components

200‧‧‧ cushion

210‧‧‧ buffer body

211‧‧‧ top surface

212‧‧‧ bottom

213‧‧‧ side

214‧‧‧through slot

215‧‧ ‧ bisector

220‧‧‧First barrier film

221‧‧‧ joint side

221a‧‧‧ first joint side

221b‧‧‧second joint side

221c‧‧‧ third joint side

222‧‧‧Free side

222a‧‧‧First free side

222b‧‧‧Second free side

223‧‧‧ Coverage

224‧‧‧bend section

225‧‧‧ trench

225a‧‧‧first trench

225b‧‧‧second trench

226‧‧‧Perforation

230‧‧‧ Included space

240‧‧‧Second isolation film

241‧‧‧ joint side

242‧‧‧Free side

300‧‧‧Adhesive layer

1 is a schematic cross-sectional view of a panel stack assembly according to a first embodiment of the present invention.

Figure 2 is a schematic cross-sectional view of the cushion of Figure 1.

Figure 3 is a top plan view of Figure 2.

4A is a top plan view of a cushion according to a second embodiment of the present invention.

Figure 4B is a top plan view of the buffer body of Figure 4A.

FIG. 5A is a schematic top view of a cushion according to a third embodiment of the present invention.

Figure 5B is a top plan view of the buffer body of Figure 5A.

FIG. 6A is a schematic top view of a cushion according to a fourth embodiment of the present invention.

Fig. 6B is a schematic cross-sectional view taken along line 6B-6B of Fig. 6A.

Figure 6C is a top plan view of the buffer body of Figure 6A.

Figure 7 is a top plan view of a cushion according to a fifth embodiment of the present invention.

FIG. 8 is a top plan view of a cushion according to a sixth embodiment of the present invention.

FIG. 9 is a top plan view of a cushion according to a seventh embodiment of the present invention.

Figure 10 is a cross-sectional view of a cushion according to an eighth embodiment of the present invention.

11 is a schematic cross-sectional view of a cushion according to a ninth embodiment of the present invention.

Figure 12 is a cross-sectional view of a cushion according to a ninth embodiment of the present invention.

Please refer to Figures 1 to 3. Figure 1 is a view of the first embodiment of the present invention A schematic cross-sectional view of the stacked stack of panels. Figure 2 is a schematic cross-sectional view of the cushion of Figure 1. Figure 3 is a top plan view of Figure 2.

The panel stack assembly 10 of the present embodiment includes a plurality of panel modules 100 that are alternately stacked. And a plurality of cushions 200. Each of the panel modules 100 and each of the cushions 200 are alternately stacked to refer to the stacking panel module 100, the cushion 200, the panel module 100, the cushion 200, and the like.

The panel module 100 includes a panel body 110 and a circuit driving component 120. panel The body 110 is, for example, a glass substrate. The panel body 110 has a first thickness D1.

The circuit driving component 120 includes a circuit board 121 and at least one electronic component 122. Electricity The road board 121 is connected to the panel body 110 by, for example, a soft discharge. Electronic component 122 is, for example, a wafer, a resistor, a pole, or a capacitor. The electronic component 122 is stacked and electrically connected to the circuit board 121. The circuit driving assembly 120 has a second thickness D2 that is greater than the first thickness D1 and has a thickness difference (D2-D1).

The cushion 200 includes a buffer body 210 and a first isolation film 220. Buffer body 210 is, for example, a foamed material. The buffer body 210 has a top surface 211, a bottom surface 212 and a side surface 213. The top surface 211 and the bottom surface 212 are connected to opposite sides of the side surface 213. The buffer body 210 has a third thickness D3 and 0.5 (D2-D1) ≦ D3 ≦ (D2-D1). The buffer body 210 is sandwiched between the upper and lower panel bodies 110 to fill the thickness difference (D2-D1) between the panel body 110 and the circuit driving unit 120.

The first isolation film 220 is, for example, a soft film, and the thickness of the first isolation film 220 is too small. The thickness D3 of the buffer body 210 is such that the thickness of the first isolation film 220 can be ignored. The first isolation film 220 of the embodiment has a quadrangular shape as an example, and each side of the first isolation film 220 has a combined side 221, a first free side 222a, a second free side 222b, and a first side. Three free sides 222c. The joint side 221 is opposite the second free side 222b, and the first free side 222a is opposite the third free side 222c. The bonding side 221 is attached to the top surface 211 of the buffer body 210 through an adhesive layer 300, and the first isolation film 220 extends outwardly of the buffer body 210, that is, a portion of the first isolation film 220 protrudes from the side surface 213 such that the first free side 222a, the second free side 222b, and the third free side 222c are not fixed to the buffer body 210. The term "unfixed" as used herein refers to the first free side 222a, the second free side 222b and the third free side when the first isolating film 220 is applied to the buffer body 210 such that the first isolating film 220 is subjected to an external force. 222c can move relative to the binding side 221. A portion of the first isolation film 220 protruding from the side surface 213 has a covering surface 223, and the covering surface 223 and the side surface 213 together form a receiving space 230.

When the cushion 200 is sandwiched between the two panel modules 100 and the lower layer of the drive assembly 120 When the capacitor body 210 is placed in the housing space 230, the buffer body 210 is sandwiched between the upper and lower panel bodies 110, and the first isolation film 220 is sandwiched between the upper and lower circuit driving components 120 (ie, the lower layer electronic component 122 and the upper layer circuit are isolated). The plate 121) is such that the first isolation film 220 isolates each of the lower electronic components 122 from the upper circuit board 121, thereby preventing collision of each of the lower electronic components 122 with the upper circuit board 121.

The difference in thickness between the buffer body 210 and the first isolation film 220 (about equal to the buffer body 210) The thickness D3) can fill the thickness difference (D2-D1) between the panel body 110 and the circuit driving component 120, so that each panel module 100 is relatively flatly stacked in a package (not shown).

The flat stacked panel stack of this embodiment is compared to the conventional skewed panel stack group Since the gap between the combination 10 and the package is small, the panel stacking assembly 10 is less swayed in the package, thereby reducing the probability that the panel module 100 is damaged by shaking during transportation.

The composite cushion 200 of the embodiment can effectively reduce the total of the panel stack assembly 10 The thickness, in turn, greatly increases the number of packages in the package. In detail, if each panel module 100 is stacked with a conventional non-composite cushion 200, the maximum thickness of the panel stack assembly 10 will be equal to the thickness of each circuit driving component 120 (N*D2, N means each circuit) The number of the driving components 120) plus the thickness of each of the cushions 200 (ie, the thickness of the buffer body 210 (N*D3, N means the number of each cushion 200). However, The buffer pad 200 of the embodiment is formed by combining the buffer body 210 and the first isolation film 220. The space between the buffer body 210 and the first isolation film 220 forms a receiving space 230 for the electronic component 122 to be accommodated. The maximum thickness of the panel stack assembly 10 can be reduced to about the thickness of each circuit drive assembly 120 (N*D2, N is the number of each circuit drive assembly 120). In this way, the use of the cushion 200 of the embodiment to isolate the panel modules 100 can greatly increase the number of packages in the package.

The conventional cushion is stacked on the panel with the same size. In the package, the number of packages in the package can be measured as 11. If the conventional cushion is replaced with the cushion 200 of the embodiment, the number of packages can be measured from 11 to 17 .

In addition, the first isolation film 220 is sandwiched between the upper and lower circuit driving components 120, and is avoidable. The lower layer electronic component 122 is prevented from colliding with the upper circuit board 121, thereby reducing the probability of damage of the electronic component 122 or the circuit board 121.

Furthermore, the first isolation film 220 has at least one free side 222, since the free side 222 It is not fixed to the buffer body 210, so the height of the accommodation space 230 is not limited by the thickness of the buffer body 210. When the difference in thickness (D2-D1) between the panel body 110 and the circuit driving component 120 is greater than the third thickness D3 of the buffer body 210, the free side 222 of the first isolation film 220 may also flex upward to increase the height of the receiving space 230. For larger size electronic components 122. As a result, the thickness of the buffer body 210 can be appropriately thinned to further reduce the overall cost of the cushion 200.

The form of the cushion 200 is not limited to the embodiment of Fig. 1 described above, please refer to Figs. 4A and 4B. 4A is a top plan view of a cushion according to a second embodiment of the present invention. Figure 4B is a top plan view of the buffer body of Figure 4A.

The cushion 200 of the embodiment includes a buffer body 210 and a first isolation film 220. The buffer body 210 has a top surface 211, a bottom surface 212, a side surface 213 and a through slot 214 (eg Figure 4B shows). The top surface 211 and the bottom surface 212 are connected to opposite sides of the side surface 213. The slot 214 is recessed inwardly from the side surface 213 and extends through the top surface 211 and the bottom surface 212.

The shape of the first isolation film 220 is also exemplified by a quadrangle. Each of the first isolation films 220 The sides respectively have a first joint side 221a, a second joint side 221b, a third joint side 221c and a free side 222. The first joint side 221a is opposed to the third joint side 221c, and the second joint side 221b is opposed to the free side 222. The first bonding side 221a, the second bonding side 221b, and the third bonding side 221c are respectively attached to the top surface 211 of the buffer body 210 through the adhesive layer 300. The first isolation film 220 has a cover surface 223, and the cover surface 223 covers the through groove 214 so that the cover surface 223 and the wall surface forming the through groove 214 surround the receiving space 230 (as shown in FIG. 4A). The difference between the buffer body 210 of the present embodiment and the embodiment of the first embodiment is that the buffer body 210 of the embodiment has a through slot 214 for the position of the electronic component 122, and the remaining positions of the panel module 100 cover the buffer body 210. To enhance the cushioning effect of the cushion 200.

Please refer to Figures 5A and 5B. Figure 5A is a third embodiment of the present invention A top view of the disclosed cushion. Figure 5B is a top plan view of the buffer body of Figure 5A.

The cushion 200 of the embodiment includes a buffer body 210 and a first isolation film. 220. The buffer body 210 has a top surface 211, a bottom surface 212, a side surface 213 and a plurality of through grooves 214 (as shown in FIG. 5B). The top surface 211 and the bottom surface 212 are connected to opposite sides of the side surface 213. The through slot 214 extends through the top surface 211 and the bottom surface 212 and is spaced from the side surface 213. The first isolation film 220 has a first bonding side 221a, a second bonding side 221b, a first free side 222a and a second free side 222b. The first joint side 221a is opposite to the second joint side 221b, and the first free side 222a is opposite to the second free side 222b. The first bonding side 221a and the second bonding side 221b are respectively attached to the top surface 211 of the buffer body 210 through the adhesive layer 300, and the through slots 214 are located on the first bonding side 221a and the second bonding side 221b. between. The cover film has a cover surface 223, and the cover surface 223 covers the respective through grooves 214 so that the cover surface 223 and the wall surface forming the respective through grooves 214 surround the plurality of accommodation spaces 230 (as shown in FIG. 5A).

The buffer body 210 of the present embodiment is similar to the embodiment of FIG. 4A in that the slot 214 is defined for the position of the electronic component 122. The remaining positions of the panel module 100 cover the buffer body 210 to improve the buffering effect of the cushion 200. .

It should be noted that the number of the through slots 214 in this embodiment is exemplified by a plurality of, but not limited thereto. In other embodiments, the number of the through slots 214 may also be one.

Please refer to Figures 6A to 6C. FIG. 6A is a schematic top view of a cushion according to a fourth embodiment of the present invention. Fig. 6B is a schematic cross-sectional view taken along line 6B-6B of Fig. 6A. Figure 6C is a top plan view of the buffer body of Figure 6A.

The cushion 200 of the embodiment includes a buffer body 210 and a first isolation film 220. The buffer body 210 has a top surface 211, a bottom surface 212, a side surface 213 and a through slot 214 (as shown in FIG. 6C). The top surface 211 and the bottom surface 212 are connected to opposite sides of the side surface 213. The slot 214 is recessed inwardly from the side surface 213 and extends through the top surface 211 and the bottom surface 212.

The first isolation film 220 has a first bonding side 221a, a second bonding side 221b, a first free side 222a, and a second free side 222b. The first joint side 221a is opposite to the second joint side 221b, and the first free side 222a is opposite to the second free side 222b. The first bonding side 221a and the second bonding side 221b respectively pass through the adhesive layer 300 on the top surface 211 of the buffer body 210, and the distance between the first bonding side 221a and the second bonding side 221 is smaller than the first bonding side 221a and the second bonding side. The length of the first isolation film 220 between the 221b is such that a curved section 224 is formed between the first bonding side 221a and the second bonding side 221b of the first isolation film 220 (as shown in FIG. 6B). The curved section 224 covers the through slot 214. Furthermore, the curved section 224 of the embodiment is arched away from the buffer body 210 for further addition. The large capacity space 230 (as shown in FIG. 6B) allows the housing space 230 to accommodate the electronic component 122 having a higher height.

Please refer to Figure 7. Figure 7 is a cushion according to a fifth embodiment of the present invention. A schematic view of the top. This embodiment is similar to the embodiment of Fig. 4 described above, and therefore only the differences will be described.

The first isolation film 220 of the embodiment may further have a plurality of trenches 225. These grooves 225 Side by side with each other, and the long sides of the grooves 225 are parallel to the side faces 213. The grooves 225 can enhance the flexibility of the first isolation film 220, and the free side 222 of the first isolation film 220 has a larger displacement amount to expand the accommodation space 230. As such, the first isolation film 220 having the trenches 225 can be applied to the electronic component 122 having a higher height.

Please refer to Figure 8. Figure 8 is a cushion according to a sixth embodiment of the present invention. A schematic view of the top.

The first isolation film 220 of the embodiment may further have a plurality of through holes 226, and the perforations 226 are, for example but not limited to, side by side in an array. These through holes 226 can enhance the flexibility of the first isolation film 220, and the first isolation film 220 has a larger displacement amount to expand the accommodation space 230. As such, the first isolation film 220 having the perforations 226 can be applied to the higher height electronic component 122.

Please refer to Figure 9. FIG. 9 is a top plan view of a cushion according to a seventh embodiment of the present invention.

The first isolation film 220 of the embodiment may further have a plurality of first trenches 225a and a plurality of second trenches 225b. The first trenches 225a and the second trenches 225b respectively extend inward from opposite end edges of the first isolation film 220, and the first trenches 225a are alternately arranged with the second trenches 225b. The first trenches 225a and the second trenches 225b can enhance the flexibility of the first isolation film 220. The capability is such that the first isolation film 220 has a large displacement amount to expand the accommodation space 230. As such, the first isolation film 220 having the first trenches 225a and the second trenches 225b can be applied to the higher-level electronic component 122.

Please refer to Figure 10. Figure 10 is a buffer according to the eighth embodiment of the present invention. A schematic view of the cross section of the mat.

The cushion 200 includes a buffer body 210, a first isolation film 220 and a second partition. Off film 240. The buffer body 210 has a top surface 211, a bottom surface 212 and a side surface 213. The top surface 211 and the bottom surface 212 are connected to opposite sides of the side surface 213. And define a bisector 215. The distance from the bisector 215 to the top surface 211 is equal to the distance from the flat face 215 to the bottom face 212.

The first isolation film 220 and the second isolation film 240 each have a bonding side 221 and a free Side 222. The bonding side 221 of the first isolation film 220 and the bonding side 221 of the second isolation film 240 are respectively attached to the top surface 211 and the bottom surface 212 of the buffer body 210. The free side 222 of the first isolation film 220 and the free side 222 of the second isolation film 240 protrude from the side surface 213 and are attached to each other, and the free side 222 of the first isolation film 220 and the free side 222 of the second isolation film 240 Located on the bisector 215. In other words, the length of the first isolation film 220 protruding from the side surface 213 is equal to the length of the second isolation film 240 protruding from the side surface 213, so that the first isolation film 220 and the second isolation film 240 are symmetric with each other with the bisecting surface 215 as a reference surface. .

In this embodiment, the free side 222 of the first isolation film 220 and the second isolation film 240 The attachment of the free sides 242 to each other increases the structural strength, thereby enhancing the protective effect of the electronic component 122.

Please refer to Figure 11. Figure 11 is a buffer according to a ninth embodiment of the present invention. A schematic view of the cross section of the mat.

The cushion 200 includes a buffer body 210, a first isolation film 220 and a second partition. Off film 240. The buffer body 210 has a top surface 211, a bottom surface 212 and a side surface 213. Top surface 211 The bottom surface 212 is connected to opposite sides of the side surface 213. And define a bisector 215. The distance from the bisector 215 to the top surface 211 is equal to the distance from the flat face 215 to the bottom face 212.

The first isolation film 220 and the second isolation film 240 each have a bonding side 221 and a free Side 222. The bonding side 221 of the first isolation film 220 and the bonding side 221 of the second isolation film 240 are respectively attached to the top surface 211 and the bottom surface 212 of the buffer body 210. The free side 222 of the first isolation film 220 and the free side 222 of the second isolation film 240 protrude from the side surface 213 and are attached to each other, and the free side 222 of the first isolation film 220 and the free side 222 of the second isolation film 240 Located between the top surface 211 and the bisector 215. In other words, the length of the second isolation film 240 protruding from the side surface 213 is greater than the length of the second isolation film 240 protruding from the side surface 213 such that the degree of bending of the second isolation film 240 is greater than the degree of bending of the first isolation film 220. Among them, the smaller the radius of curvature of the separator, the greater the degree of curvature.

In this embodiment, the free side 222 of the first isolation film 220 and the second isolation film 240 The free sides 242 are attached to each other except that the structural strength can be increased, and the free side 222 of the first isolation film 220 and the free side 242 of the second isolation film 240 are located between the top surface 111 and the bisector 115, so that the surface 242 can be enlarged. The space is accommodated for the electronic component 112 having a higher height.

Please refer to Figure 12. Figure 12 is a buffer according to a ninth embodiment of the present invention. A schematic view of the cross section of the mat.

The cushion 200 includes a buffer body 210, a first isolation film 220 and a second partition. Off film 240. The buffer body 210 has a top surface 211, a bottom surface 212 and a side surface 213. The top surface 211 and the bottom surface 212 are connected to opposite sides of the side surface 213.

The first isolation film 220 and the second isolation film 240 each have a bonding side 221 and a free Side 222. The bonding side 221 of the first isolation film 220 and the bonding side 221 of the second isolation film 240 are respectively attached to the top surface 211 and the bottom surface 212 of the buffer body 210. The free side 222 and the second partition of the first isolation film 220 The free side 222 of the off-film 240 protrudes from the side 213 and is separated from each other. Thereby, the protection effect on the circuit driving assembly 120 can be improved through the double-layer isolation film.

In this embodiment, the electronic component 120 is separated from the second spacer by the first isolation film 220. In addition to the double layer protection of the film 240, the air layer between the first isolation film 220 and the second isolation film 240 further provides a better buffering effect.

According to the cushion pad and the cushion stacking panel stack disclosed in the above embodiments, The spacer film is attached to the buffer body to form a cushion having a receiving space. The space can eliminate the difference in thickness of the panel module, so that the panel stack combination can be stacked flat, and the total thickness of the panel stack combination can be reduced. . In this way, it is possible to slow down the sway of the panel stacking package in the package and to increase the number of packages in the package.

In addition, the isolation film is sandwiched between the upper and lower circuit drive components to avoid the lower layer of electronic components. The component collides with the upper circuit board, thereby reducing the probability of damage to the electronic component or board.

Furthermore, since the free side of the separator is not fixed to the buffer body, the space is high. The degree is not limited by the thickness of the buffer body. Therefore, the thickness of the buffer body can be appropriately thinned to further reduce the overall cost of the cushion.

Although the embodiments of the present invention are disclosed as described above, it is not intended to limit the present invention, and those skilled in the art can, without departing from the spirit and scope of the present invention, the shapes, structures, and features described in the scope of the present application. And the spirit of the invention is subject to change. Therefore, the scope of patent protection of the present invention is subject to the definition of the scope of the patent application attached to this specification.

200‧‧‧ cushion

210‧‧‧ buffer body

211‧‧‧ top surface

212‧‧‧ bottom

213‧‧‧ side

220‧‧‧First barrier film

221‧‧‧ joint side

222‧‧‧Free side

223‧‧‧ Coverage

230‧‧‧ Included space

Claims (16)

a cushion comprising: a buffer body; and at least one separator, the separator having a thickness smaller than a thickness of the buffer body, and the separator has at least one joint side and at least one free side, the free side being coupled to the joint On the side, the bonding side is stacked and fixed to the buffer body, and the isolation film at least partially does not overlap with the buffer body to form a receiving space, and the free side is not fixed to the buffer body. The cushion of claim 1 , wherein the buffer body has a top surface and a side surface, the bonding side of the isolation film is attached to the top surface of the buffer body, and the free side protrudes from the top surface The side surface of the partition film has a covering surface, and the covering surface and the side surface together form the receiving space. The cushion of claim 1 , wherein the buffer body has a top surface, a bottom surface, a side surface and a through slot, the top surface and the bottom surface are connected to opposite sides of the side surface, the through slot is from the side surface Inwardly recessed, and extending through the top surface and the bottom surface, the separator has a covering surface, the bonding side of the separator is attached to the top surface of the buffer body, and the covering surface covers the through groove to make the covering surface The receiving space is surrounded by a wall surface forming the through groove. The cushion of claim 3, wherein the separator further has at least one groove. The cushion of claim 4, wherein a long side of the at least one groove is parallel to the side. The buffer of claim 4, wherein the at least one trench comprises a plurality of first trenches and a plurality of second trenches, the first trenches and the second trenches respectively from the isolation film The opposite ends extend inwardly, and the first trenches are alternately arranged with the second trenches. The cushion of claim 3, wherein the separator further has a plurality of perforations. The cushion of claim 3, wherein the at least one bonding side comprises a first bonding side and a second bonding side, the at least one free side comprising a first free side and a second free side, the first The bonding side and the second bonding side are respectively located on opposite sides of the isolation film, and the first free side and the second free side are respectively located on opposite sides of the isolation film, the first bonding side and the second combination The side surface is stacked and fixed on the top surface of the buffer body. The separator has a curved section between the first joint side and the second joint side and covers the through groove. The cushion body of claim 1, wherein the buffer body has a top surface, a bottom surface, a side surface and at least one through slot, the top surface and the bottom surface are connected to opposite sides of the side surface, the through slot is extending through the slot The top surface and the bottom surface are spaced apart from the side surface, the at least one bonding side includes a first bonding side and a second bonding side, and the first bonding side and the second bonding side are respectively located at the opposite sides of the isolation film On both sides, the isolation film has a cover surface, and the first joint side and the second joint side are respectively attached to the top surface of the buffer body, and the cover surface covers the through groove to make the cover surface and the through groove The wall faces together to surround the accommodation space. The cushion of claim 1, wherein the buffer body has a top surface, a bottom surface and a side surface, the top surface and the bottom surface are connected to opposite sides of the side surface, and the at least one isolation film comprises a first isolation a film and a second isolation film, the bonding side of the first isolation film and the bonding side of the second isolation film are respectively attached to the top surface and the bottom surface of the buffer body, and the first isolation film is free The sides and the free side of the second separator are separated from each other. The cushion of claim 1, wherein the buffer body has a top surface, a bottom surface and a side surface, the top surface and the bottom surface are connected to opposite sides of the side surface, and the at least one isolation film comprises a first isolation The number of the second isolation film is two, and the bonding side of the first isolation film and the bonding side of the second isolation film are respectively attached to the top surface and the bottom surface of the buffer body, and the first isolation The freedom of the membrane The free side of the side and the second barrier film protrudes from the side and are attached to each other. The cushion of claim 11, wherein a bisector is defined, the distance from the bisector to the top is equal to a distance from the bisector to the bottom, and the free side of the first isolation membrane and the second The free side of the separator is between the top surface and the bisector. The cushion of claim 12, wherein the length of the second isolation film protruding from the side is greater than the length of the first isolation film protruding from the side. The cushion of claim 11, wherein a bisector is defined, the distance from the bisector to the top is equal to a distance from the bisector to the bottom, and the free side of the first isolation membrane and the second The free side of the separator is located on the bisector. A panel stack assembly comprising: a panel module comprising: a panel body; and a circuit driving component comprising a circuit board and at least one electronic component, the circuit board being electrically connected to the panel body, the electronic component stacking And electrically connected to the circuit board, the circuit driving component has a thickness greater than a thickness of the panel body; and a cushion of one of the claims 1 to 13, the cushion is stacked on the panel module, and the The circuit driving component is disposed in the receiving space, so that the buffer body is stacked on the panel body, and the isolation film is stacked on the at least one electronic component of the circuit driving component. The panel stacking combination of claim 15, wherein the panel body has a first thickness D1, the circuit driving component has a second thickness D2, the buffer body has a third thickness D3, and 0.5 (D2-D1) ≦D3≦(D2-D1).