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TWM483546U - LED lamp tube - Google Patents

LED lamp tube Download PDF

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Publication number
TWM483546U
TWM483546U TW103203337U TW103203337U TWM483546U TW M483546 U TWM483546 U TW M483546U TW 103203337 U TW103203337 U TW 103203337U TW 103203337 U TW103203337 U TW 103203337U TW M483546 U TWM483546 U TW M483546U
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TW
Taiwan
Prior art keywords
led
cover
led lamp
group
layer
Prior art date
Application number
TW103203337U
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Chinese (zh)
Inventor
Tsan-Jung Chen
Original Assignee
Kocam Int Co Ltd
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Publication date
Application filed by Kocam Int Co Ltd filed Critical Kocam Int Co Ltd
Priority to TW103203337U priority Critical patent/TWM483546U/en
Publication of TWM483546U publication Critical patent/TWM483546U/en

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Description

LED燈管LED tube

本創作係關於一種燈具,尤指一種LED燈管。This creation is about a luminaire, especially an LED tube.

近年來,發光二極體(Light-Emitting Diode,LED)係廣泛地被應用於日常生活之照明裝置上。請參閱第一圖,係一種習用的LED日光燈具之立體透視圖。如第一圖所示,習用的LED日光燈具1’係包括:一燈罩11’、一基板12’、一電路板13’、複數個LED元件14’、以及二端蓋15’,其中,該基板12’係容置於該燈罩11’之內,且設置有該LED元件14’的該電路板13’係置於基板12’之上。如圖所示,將該端蓋15’內部之一連接導線151’係連接於電路板13’後,即可以端蓋15’套住該燈罩11’之端口,藉此方式密封該燈罩11’。並且,端蓋15’之外部具有導接端子152’,用以耦接外部輸入電源。In recent years, Light-Emitting Diode (LED) has been widely used in lighting devices for everyday life. Please refer to the first figure, which is a perspective view of a conventional LED daylight fixture. As shown in the first figure, a conventional LED daylight lamp 1' includes: a lamp cover 11', a substrate 12', a circuit board 13', a plurality of LED elements 14', and a two-end cover 15', wherein The substrate 12' is housed within the lampshade 11', and the circuit board 13' provided with the LED element 14' is placed over the substrate 12'. As shown in the figure, after one of the connecting wires 151' of the end cap 15' is connected to the circuit board 13', the end cap 15' can be sleeved around the port of the lampshade 11', thereby sealing the lampshade 11'. . Further, the outer end of the end cover 15' has a lead terminal 152' for coupling to an external input power source.

第一圖所示之LED日光燈具1’之優點在於構成結構最為簡單;但,其最為令人詬病的缺點是:光發射角度嚴重不足。如第一圖所示,該LED日光燈具1’之光發射角度最多只有1600左右,甚至連1800都不到。The LED daylight lamp 1' shown in the first figure has the advantage that the structure is the simplest; however, its most criticized disadvantage is that the light emission angle is seriously insufficient. As shown in the first figure, the light emission angle of the LED daylight lamp 1' is at most about 1600, and even the 1800 does not.

有鑑於習用的LED日光燈具1’具有光發射角度嚴重不足之缺點,LED燈具廠商係提出一種改良的LED日光燈具。請參閱第二圖,係改良的LED日光燈具的爆炸圖圖。如第二圖所示,該改良的LED日光燈具1”係包括:一容置體11”、一電路板13”、複數個LED元件14”、以及二端蓋15”,其中,該容置體11”包括一承載部111”與一罩部112’,設置有該複數各LED元件14”的電路板13”係設置於該承載部111”之上。特別地,於該改良的LED日光燈具1”之中,該承載部111”係由具有良好散熱特性之一金屬材料所製成,並且承載部111”之外表面更形成有鰭式散熱結構,藉此方式來將LED元件14”所產生的熱加以排除。In view of the shortcomings of the conventional LED daylight lamps 1' having a serious lack of light emission angle, LED lamp manufacturers have proposed an improved LED daylight lamp. Please refer to the second figure for an exploded view of the improved LED daylight fixture. As shown in the second figure, the improved LED daylight lamp 1" includes: a receiving body 11", a circuit board 13", a plurality of LED elements 14", and a two-end cover 15", wherein the receiving The body 11" includes a carrying portion 111" and a cover portion 112', and the circuit board 13" provided with the plurality of LED elements 14" is disposed above the carrying portion 111". In particular, in the improved LED daylight lamp 1", the bearing portion 111" is made of a metal material having good heat dissipation characteristics, and the outer surface of the bearing portion 111" is further formed with a fin heat dissipation structure. In this way, the heat generated by the LED element 14" is excluded.

經由上述之說明,吾人可以得知的是,相較於習用的LED日光燈具1’,第二圖所示的改良的LED日光燈具1”可能相對於該第一圖所示之LED日光燈具1’而具有較為良好的散熱性質。然而,於實作上,吾人卻發現第二圖所示的改良的LED日光燈具1”仍然具有以下的缺點:Through the above description, we can know that compared with the conventional LED daylight lamp 1', the improved LED daylight lamp 1" shown in the second figure may be relative to the LED daylight lamp 1 shown in the first figure. 'There is a relatively good heat dissipation property. However, in practice, we have found that the improved LED daylight lamp 1" shown in the second figure still has the following disadvantages:

1.該改良的LED日光燈具1”之組裝結構包括容置體11”、承載部111”、一罩部112’、電路板13”、複數個LED元件14”、以及二端蓋15”,係顯示了其結構複雜、組裝不便等缺點。1. The assembled structure of the improved LED daylight lamp 1" includes a receiving body 11", a carrying portion 111", a cover portion 112', a circuit board 13", a plurality of LED elements 14", and a two-end cover 15", The system shows its shortcomings such as complicated structure and inconvenient assembly.

2.此外,承載部111”之增設係提高了LED元件14”於容置體11”內之高度,反而降低了LED日光燈具1”整體之光發射角度,導致光照區域銳減。2. In addition, the addition of the bearing portion 111" increases the height of the LED element 14" in the receiving body 11", and reduces the light emission angle of the LED daylight lamp 1" as a whole, resulting in a sharp decrease in the illumination area.

因此,綜合上述對於兩種習用的日光燈具的說明,可以得知習用之日光燈具係仍具有許多缺點與不足;有鑑於此,本案之創作人係極力加以研究創作,而終於研發完成本創作之一種LED燈管。Therefore, combining the above descriptions of the two conventional daylight lamps, it can be known that the conventional daylight lamps still have many shortcomings and shortcomings; in view of this, the creators of the case tried to research and create, and finally developed and completed the creation. An LED tube.

本創作之主要目的,係特別地該反射片12設置於該罩體11之內,係可增加LED光線的使用效率;並且,還可透過該反射片控制發光角度,進而調整LED燈管之出光面。The main purpose of the present invention is that the reflective sheet 12 is disposed in the cover 11 to increase the efficiency of use of the LED light. Moreover, the illumination angle can be controlled through the reflective sheet to adjust the light output of the LED tube. surface.

因此,為了達成本創作上述之目的,本案之創作人提出一種LED燈管,係包括:一罩體;一銅線路層,係藉由一絕緣導熱膠而設置於該罩體之內壁底部,並具有複數個焊接墊,且該些焊接墊與一驅動與控制電路模組相互耦接;一防焊層,係覆蓋於該銅線路層之上,並具有複數個焊接 窗,用以露出該些焊接墊;一反射片,係設置於該罩體之內;複數個LED元件,係設置於該防焊層之上,並透過該些焊接窗而與該些焊接墊相互焊接;以及二端蓋,係分別結合至該罩體之兩端側,並具有二電性端子用以電性連接一外部電源。Therefore, in order to achieve the above object of the present invention, the creator of the present invention proposes an LED lamp tube comprising: a cover body; a copper circuit layer disposed on the bottom of the inner wall of the cover body by an insulating thermal conductive adhesive. And having a plurality of solder pads, and the solder pads are coupled to a driving and control circuit module; a solder resist layer covering the copper circuit layer and having a plurality of soldering layers a window for exposing the solder pads; a reflective sheet disposed within the cover; a plurality of LED elements disposed on the solder resist layer and through the solder windows and the solder pads The two end caps are respectively coupled to the two ends of the cover body, and have two electrical terminals for electrically connecting an external power source.

<本創作><this creation>

1‧‧‧LED燈管1‧‧‧LED tube

10‧‧‧交流電纜線10‧‧‧AC cable

11‧‧‧罩體11‧‧‧ Cover

12‧‧‧反射片12‧‧‧reflector

13‧‧‧基層13‧‧‧ grassroots

14‧‧‧銅線路層14‧‧‧ copper circuit layer

15‧‧‧防焊層15‧‧‧ solder mask

16‧‧‧LED元件16‧‧‧LED components

16a‧‧‧LED固定膠16a‧‧‧LED fixing glue

17‧‧‧端蓋17‧‧‧End cover

141‧‧‧絕緣導熱膠141‧‧‧insulating thermal adhesive

142‧‧‧焊接墊142‧‧‧ solder pad

151‧‧‧焊接窗151‧‧‧ welding window

101‧‧‧第一軟質膠帶101‧‧‧First soft tape

111‧‧‧結合孔111‧‧‧Contact hole

121‧‧‧開口121‧‧‧ openings

122‧‧‧端子122‧‧‧terminal

171‧‧‧電性端子171‧‧‧Electrical terminal

172‧‧‧容置空間172‧‧‧ accommodating space

173‧‧‧結合凸件173‧‧‧Combined convex parts

174‧‧‧結合部174‧‧‧Combination Department

18‧‧‧端子連接件組18‧‧‧Terminal Connector Set

180‧‧‧端子固定塊組180‧‧‧Terminal block group

181‧‧‧接點組181‧‧‧Contact Group

2‧‧‧驅動與控制電路模組2‧‧‧Drive and Control Circuit Module

20‧‧‧彈片組20‧‧‧Shrap group

21‧‧‧LED晶片21‧‧‧LED chip

21a‧‧‧透明膠體21a‧‧‧Transparent colloid

22‧‧‧基板22‧‧‧Substrate

23‧‧‧螢光材料23‧‧‧Fluorescent materials

23a‧‧‧具有螢光材料的膠體23a‧‧‧Colloids with fluorescent materials

24‧‧‧端子組24‧‧‧Terminal group

<習知><知知>

1’‧‧‧LED日光燈具1'‧‧‧LED daylights

11’‧‧‧燈罩11’‧‧‧shade

12’‧‧‧基板12'‧‧‧Substrate

13’‧‧‧電路板13’‧‧‧ boards

14’‧‧‧LED元件14'‧‧‧LED components

15’‧‧‧端蓋15’‧‧‧End cover

151’‧‧‧連接導線151’‧‧‧Connecting wires

152’‧‧‧導接端子152'‧‧‧ lead terminal

1”‧‧‧改良的LED日光燈具1”‧‧‧Modified LED daylight fixtures

11”‧‧‧容置體11"‧‧‧容容

13”‧‧‧電路板13”‧‧‧ boards

14”‧‧‧LED元件14”‧‧‧LED components

15”‧‧‧端蓋15"‧‧‧End cover

111”‧‧‧承載部111"‧‧‧ Carrying Department

112”‧‧‧罩部112" ‧ ‧ hood

第一圖係一種習用的LED燈具之立體透視圖;第二圖係一種改良的LED燈管的爆炸圖;第三A圖係本創作之一種LED燈管的立體圖;第三B圖係LED燈管之部分元件爆炸圖;第三C圖係端蓋之側面視圖;第四圖係LED燈管之端蓋的側面視圖;第五A圖係本創作之一種LED燈管的第二實施例的立體圖;第五B圖係LED燈管的第二實施例的基層、銅線路層、交流電纜線、防焊層、及LED元件的爆炸圖;第六圖係本創作之一種LED燈管之分解透視示意圖;第七A圖與、第七B圖係本創作之LED燈管的端子細部結構圖; 第八A圖係LED元件之側面視圖;第八B圖係LED元件之側面視圖;第八C圖係LED元件之側面視圖;以及第八D係LED元件之側面視圖。The first figure is a perspective view of a conventional LED lamp; the second picture is an exploded view of an improved LED tube; the third A picture is a perspective view of an LED tube of the present invention; the third picture B is an LED lamp An exploded view of a part of the tube; a third side view of the end cap of the LED; a fourth side view of the end cap of the LED tube; a fifth embodiment of the second embodiment of the LED lamp of the present invention A perspective view; a fifth embodiment is an exploded view of a base layer, a copper circuit layer, an AC cable, a solder resist layer, and an LED component of the second embodiment of the LED lamp; and the sixth figure is an exploded view of the LED lamp of the present invention. Schematic diagram of the perspective; the seventh A diagram and the seventh B diagram are the detailed structure diagrams of the terminal of the LED tube of the present invention; Figure 8A is a side view of the LED element; Figure 8B is a side view of the LED element; Figure 8C is a side view of the LED element; and a side view of the eighth D-Series LED element.

為了能夠更清楚地描述本創作所提出之一種LED燈管,以下將配合圖式,詳盡說明本創作之較佳實施例。In order to more clearly describe an LED lamp tube proposed by the present invention, a preferred embodiment of the present invention will be described in detail below with reference to the drawings.

請同時參閱第三A圖與第三B圖,係本創作之一種LED燈管的立體圖與部分元件爆炸圖。如圖所示,本創作之LED燈管1係包括:一罩體11、一銅線路層14、一防焊層15、一反射片12、複數個LED元件16、以及二端蓋17,其中,該反射片12,係設置於該罩體11之內,並位於防焊層15之上;並且,該銅線路層14係具有複數個焊接墊142,並藉由一絕緣導熱膠141而貼附於該罩體11之內壁之底部上,並且該銅線路層14係藉由至少一導線而與位於該罩體11之外的一驅動與控制電路模組相互耦接;此外,於本創作之LED燈管之中,更具有一交流電纜線10係藉由一第一軟質膠帶101而貼附於該罩體11之內壁最底部,且位於該銅線路層14之下,並耦接於該驅動與控制電路模組。再者,該防焊層15為一具反射與散熱功效的白漆,且其係覆蓋於該銅線路層14;其中,防焊層15具有複數 個焊接窗151,用以露出該些焊接墊142。Please also refer to the third A picture and the third B picture, which is a perspective view of an LED tube and an exploded view of some components. As shown in the figure, the LED tube 1 of the present invention comprises: a cover 11, a copper circuit layer 14, a solder mask 15, a reflective sheet 12, a plurality of LED elements 16, and a two-end cover 17, wherein The reflective sheet 12 is disposed in the cover 11 and located on the solder resist layer 15; and the copper circuit layer 14 has a plurality of solder pads 142 and is attached by an insulating thermal conductive adhesive 141. Attached to the bottom of the inner wall of the cover 11, and the copper circuit layer 14 is coupled to a driving and control circuit module located outside the cover 11 by at least one wire; Among the created LED tubes, an AC cable 10 is attached to the bottom of the inner wall of the cover 11 by a first flexible tape 101, and is located under the copper circuit layer 14, and coupled. Connected to the drive and control circuit module. Moreover, the solder resist layer 15 is a white paint with reflection and heat dissipation effects, and is covered on the copper circuit layer 14; wherein the solder resist layer 15 has a plurality of A soldering window 151 is used to expose the solder pads 142.

繼續地說明本創作之LED燈管1。該複數個LED元件16則設置於該防焊層15之上,並透過該些焊接窗151而與該些焊接墊142相互焊接。並且,至少一LED固定膠16a係設置於該複數個LED元件16之底部,用以固定該些LED元件16於該防焊層之上。最後,該二端蓋17係分別結合至該罩體11之兩端側,且該交流電纜線10之兩端係分別耦接於該二端蓋17。如第三A圖所示,罩體11之兩端側的內部表面係分別挖設有複數個結合孔111,且該端蓋17之內部表面係形成有複數個結合凸件173;如此,該些結合凸件173可於端蓋17結合至罩體11之端側時嵌入該些結合孔111之內,藉此方式穩固端蓋17與罩體11之相互結合。然,該端蓋17與該罩體11係不僅限於上述之結合方式,請參閱第三C圖,係為端蓋之側面視圖。如第三C圖所示,該端蓋17係具有一結合部174,可結合至該罩體11之兩端側,並且,該結合部174上設置有一導光反射環,用以反射光源以避免減少出光面。Continue to explain the LED tube 1 of this creation. The plurality of LED elements 16 are disposed on the solder resist layer 15 and are soldered to the solder pads 142 through the solder windows 151. Moreover, at least one LED fixing glue 16a is disposed at the bottom of the plurality of LED elements 16 for fixing the LED elements 16 on the solder resist layer. Finally, the two end caps 17 are respectively coupled to the two ends of the cover body 11, and the two ends of the AC cable 10 are respectively coupled to the two end caps 17. As shown in FIG. 3A, the inner surfaces of the two ends of the cover 11 are respectively provided with a plurality of coupling holes 111, and the inner surface of the end cover 17 is formed with a plurality of coupling protrusions 173; The coupling protrusions 173 can be embedded in the coupling holes 111 when the end cover 17 is coupled to the end side of the cover body 11, thereby securing the end cover 17 and the cover body 11 to be coupled to each other. However, the end cap 17 and the cover 11 are not limited to the above-described combination, please refer to the third C diagram, which is a side view of the end cap. As shown in FIG. 3C, the end cover 17 has a joint portion 174 that can be coupled to both end sides of the cover body 11, and the joint portion 174 is provided with a light-guiding reflection ring for reflecting the light source. Avoid reducing the glazed surface.

請繼續參閱第四圖,係反射片之設置示意圖。如第四圖所示,該反射片12係具有複數個開口121,用以使該些LED元件16的出光面露出於該些開口121,其中,該些LED元件16所發出的光會通過開些開口121射出,並於該 反射片12之上反射,增加LED光線的使用效率。此外,本創作所使用的罩體11可以是玻璃罩體與塑膠罩體;並且,該罩體11亦可為全透明罩體或霧面罩體,其中,若以全透明玻璃罩體或全透明塑膠罩體作為該罩體11,則必須於罩體之內壁面設置一擴散膜片,以增進LED燈管1的光散射率;再者,該塑膠罩體更可為一上半部之材質為塑膠,而下半部之材質為玻璃纖維與塑膠雙料共押的罩體。Please continue to refer to the fourth figure, which is a schematic diagram of the setting of the reflection sheet. As shown in the fourth figure, the reflective sheet 12 has a plurality of openings 121 for exposing the light-emitting surfaces of the LED elements 16 to the openings 121, wherein the light emitted by the LED elements 16 passes through. The openings 121 are emitted, and Reflecting on the reflective sheet 12 increases the efficiency of use of the LED light. In addition, the cover 11 used in the present invention may be a glass cover and a plastic cover; and the cover 11 may also be a full transparent cover or a matte cover, wherein if the transparent glass cover is completely transparent or transparent As the cover body 11, the plastic cover body must be provided with a diffusion film on the inner wall surface of the cover body to improve the light scattering rate of the LED lamp tube 1. Further, the plastic cover body can be a material of the upper half. It is plastic, and the lower part is made of glass fiber and plastic material.

於此,必須特別說明的是,雖然上述係說明銅線路層14藉由一絕緣導熱膠141而貼附於罩體11之內,但並非以此限定本創作之實施例。請參閱第五A圖,係為本創作之一種LED燈管的第二實施例的立體圖,如圖所示,第二實施例係包括:一罩體11、一基層13、一銅線路層14、一防焊層15、一反射片12、複數個LED元件16、以及二端蓋17。繼續地參閱第五A圖,並請同時參閱第五B圖,係基層、銅線路層、交流電纜線、防焊層、及LED元件爆炸圖。如圖所示,第二實施例之罩體11、反射片12、交流電纜線10、防焊層15、LED元件16、以及二端蓋17皆相同於上述之實施例的罩體11、反射片12、交流電纜線10、防焊層15、LED元件16、以及二端蓋17,故於此便不再重複說明。Here, it should be particularly noted that although the above description shows that the copper wiring layer 14 is attached to the inside of the cover 11 by an insulating thermally conductive adhesive 141, the present embodiment is not limited thereto. Please refer to FIG. 5A, which is a perspective view of a second embodiment of an LED tube according to the present invention. As shown in the figure, the second embodiment includes a cover 11, a base layer 13, and a copper circuit layer 14. A solder mask 15, a reflective sheet 12, a plurality of LED elements 16, and a two-end cover 17. Continue to refer to Figure 5A, and also refer to Figure 5B, which is the base layer, copper circuit layer, AC cable, solder mask, and LED component explosion diagram. As shown in the figure, the cover 11, the reflection sheet 12, the AC cable 10, the solder resist 15, the LED element 16, and the two end caps 17 of the second embodiment are the same as those of the cover 11 of the above embodiment. The sheet 12, the AC cable 10, the solder resist layer 15, the LED element 16, and the two end caps 17 are not repeated here.

然而,不同的是,於第二實施例之中,該LED燈管1更包括一基層13,而該基層13係藉由一導熱膠貼附於該 罩體11之上,該銅線路層14則藉由該絕緣導熱膠141而貼附於該基層13之上;實際上,導熱膠-基層13-絕緣導熱膠141這種三明治結構係可由一金屬基印刷電路板(Metal Core PCB,MCPCB)取代。另,基於製作上的不同材料之應用,基層13係可為軟質基層也可為硬質基層,其中,基層13可為下列任一種:鋁金屬層、鋁擠型基板、聚丙烯層(Polypropylene,PP)、聚亞醯胺層(Polyimide,PI)、聚乙烯層(polyethylene,PE)、聚碳酸酯(Polycarbonate,PC)、與玻璃纖維電路板(FR-4)請參閱第六圖,係本創作之LED燈管之分解透視示意圖。於製作上,基層13可以是具有一定厚度的鋁擠型金屬基板,係設置於該罩體11之最底部,而該銅線路層14則藉由絕緣導熱膠141而貼附於該鋁擠型金屬基板之上。However, in the second embodiment, the LED tube 1 further includes a base layer 13 attached to the base layer 13 by a thermal adhesive tape. Above the cover 11, the copper circuit layer 14 is attached to the base layer 13 by the insulating thermal conductive adhesive 141; in fact, the thermal conductive adhesive-base layer 13-insulating thermal conductive adhesive 141 can be made of a metal Substitute printed circuit board (Metal Core PCB, MCPCB). In addition, the base layer 13 may be a soft base layer or a hard base layer, and the base layer 13 may be any of the following: aluminum metal layer, aluminum extruded substrate, polypropylene layer (Polypropylene, PP). ), Polyimide (PI), Polyethylene (PE), Polycarbonate (PC), and Fiberglass Board (FR-4), please refer to the sixth picture. An exploded perspective view of the LED tube. In the fabrication, the base layer 13 may be an aluminum extruded metal substrate having a certain thickness, which is disposed at the bottom of the cover 11 , and the copper circuit layer 14 is attached to the aluminum extruded type by insulating the thermal conductive adhesive 141 . Above the metal substrate.

雖然上述係說明該銅線路層14係藉由至少一導線而與該驅動與控制電路模組相互耦接,但也並非以此限定本創作之實施例;如第七圖A所示的該LED燈管的端子細部結構圖,於製作本創作之LED燈管時,該驅動與控制電路模組2也可以直接地設置於該二端蓋17之一容置空間172內,且該驅動與控制電路模組2係自該容置空間172伸出一端子組24;並且,對應於該驅動與控制電路模組2之該端子組24,銅線路層14則具有一端子連接件組18。如此,當端蓋17組合至罩體11時,端蓋17內的驅動與控 制電路模組2之端子組24便會嵌入該端子連接件組18之內,藉此方式達成銅線路層14與驅動與控制電路模組2之電性連接。此外,銅線路層14之上更設有一端子固定塊組180,用以固定該端子連接件組18,以避免該端子組24與該端子連接件組18連接時,該端子組24受到該端子連接件組18之推擠而向後傾斜。另,該端蓋17之外部則設有二電性端子171,用以電性連接一外部電源。Although the above description indicates that the copper circuit layer 14 is coupled to the driving and control circuit module by at least one wire, the embodiment of the present invention is not limited thereto; the LED as shown in FIG. 7A The driving and control circuit module 2 can also be directly disposed in the accommodating space 172 of the two end cover 17 when the LED tube of the present invention is fabricated, and the driving and controlling The circuit module 2 extends from the accommodating space 172 to a terminal group 24; and, corresponding to the terminal group 24 of the driving and control circuit module 2, the copper circuit layer 14 has a terminal connector group 18. Thus, when the end cover 17 is assembled to the cover 11, the driving and control in the end cover 17 The terminal group 24 of the circuit module 2 is embedded in the terminal connector group 18, thereby electrically connecting the copper circuit layer 14 and the driving and control circuit module 2. In addition, a terminal fixing block group 180 is further disposed on the copper circuit layer 14 for fixing the terminal connector group 18, so that when the terminal group 24 is connected to the terminal connector group 18, the terminal group 24 receives the terminal. The connector group 18 is pushed and tilted rearward. In addition, the outer cover 17 is provided with two electrical terminals 171 for electrically connecting an external power source.

除此之外,如第七圖B所示的該LED燈管的端子細部結構圖,於製作本創作之LED燈管時,可以一彈片組20取代如第七A圖所示的端子組24,並以一接點組181取代如第七A圖所示的端子連接件組18;如此,當端蓋17組合至罩體11之時,驅動與控制電路模組2之彈片組20便能夠卡接該接點組181,藉以方式達成銅線路層14與驅動與控制電路模組2之電性連接。In addition, as shown in FIG. 7B, the terminal detailed structure diagram of the LED tube can replace the terminal group 24 as shown in FIG. 7A in the creation of the LED tube of the present invention. And replacing the terminal connector group 18 as shown in FIG. 7A with a contact group 181; thus, when the end cover 17 is assembled to the cover 11, the shrapnel group 20 of the drive and control circuit module 2 can The contact group 181 is connected to the electrical connection between the copper circuit layer 14 and the driving and control circuit module 2.

如此,上述係已清楚地說明本創作之LED燈管的架構以及可能實施例;另外,請繼續參閱第八A圖、第八B圖、第八C圖、與第八D圖,係LED元件之側面視圖。如第八A圖所示,本創作所使用的LED元件16,其可以是水平封裝式LED元件,例如:PCB板型LED元件、金屬支架型LED元件、或者側光LED元件。另外,如第八B圖所示,本創作所使用的LED元件16,其也可以是晶片直接封裝型(chip on board,COB)LED元件;該晶片直接 封裝型LED元件係藉由將至少一個LED晶片21設置於一基板22之上,並覆以一螢光材料23而製成,其中,LED晶片21係透過金線而焊接於該基板22之上。並且,由於LED晶片21係透過金線而焊接於該基板22之上,再以一透明膠體21a覆蓋該LED晶片21,接著再以螢光材料23覆蓋該LED晶片21與該透明膠體21a。Thus, the above-mentioned system has clearly explained the architecture and possible embodiments of the LED tube of the present invention; in addition, please continue to refer to the eighth panel, the eighth panel B, the eighth panel C, and the eighth panel, as shown in FIG. Side view. As shown in FIG. 8A, the LED element 16 used in the present creation may be a horizontally packaged LED element such as a PCB type LED element, a metal holder type LED element, or a side light LED element. In addition, as shown in FIG. 8B, the LED component 16 used in the present invention may also be a chip on board (COB) LED component; the wafer is directly The packaged LED device is fabricated by disposing at least one LED chip 21 on a substrate 22 and coating a phosphor material 23, wherein the LED chip 21 is soldered to the substrate 22 through a gold wire. . Further, since the LED chip 21 is soldered to the substrate 22 through the gold wire, the LED chip 21 is covered with a transparent colloid 21a, and then the LED chip 21 and the transparent colloid 21a are covered with the fluorescent material 23.

再者,如第八C圖所示,本創作所使用的LED元件16,其也可以是覆晶封裝型(Flip Chip,F/C)LED元件;其中,該覆晶封裝型LED元件係藉由將至少一個LED晶片21直接焊接於一基板22之上,並以具有螢光材料的膠體23a覆蓋而製成。於實際應用COB技術於本創作時,基板22指的是其上方設有該銅線路層14的基層13。此外,如第八D圖所示,覆晶封裝型LED元件的結構也可以由基板22、LED晶片21、具有螢光材料的膠體23a、與複數個端子122所構成;其中,該複數個端子122係透過低溫焊錫而焊接至基板22表面的銅線路層14之上,而LED晶片21的P端子與N端子則透過高溫焊錫焊接至該複數個端子122之上;最後,再以具有螢光材料的膠體23a覆蓋該LED晶片21。Furthermore, as shown in FIG. C, the LED element 16 used in the present invention may also be a flip chip package type (F/C) LED element; wherein the flip chip package type LED element is borrowed The at least one LED wafer 21 is directly soldered on a substrate 22 and covered with a colloid 23a having a fluorescent material. In the actual application of the COB technology in the present creation, the substrate 22 refers to the base layer 13 on which the copper wiring layer 14 is disposed. In addition, as shown in FIG. 8D, the structure of the flip chip type LED element may also be composed of a substrate 22, an LED chip 21, a colloid 23a having a fluorescent material, and a plurality of terminals 122; wherein the plurality of terminals The 122 series is soldered to the copper wiring layer 14 on the surface of the substrate 22 by low temperature soldering, and the P terminal and the N terminal of the LED chip 21 are soldered to the plurality of terminals 122 by high temperature soldering; finally, the phosphor is further irradiated A colloid 23a of material covers the LED wafer 21.

如此,上述係已完整且清楚地說明本創作之LED燈管,並且,經由上述,吾人可以得知本創作係具有下列之優點:Thus, the above-mentioned system has completely and clearly explained the LED tube of the present invention, and, through the above, we can know that the creation department has the following advantages:

1.於本創作中,係特別地將該反射片12設置於該罩體11內,且該反射片12係具有複數個開口121,其中,該些LED元件16所發出的光會通過開些開口121射出,並於該反射片12之上反射,係可增加LED光線的使用效率;並且,還可透過該反射片來控制發光角度,進而調整LED燈管之出光面。1. In the present invention, the reflective sheet 12 is disposed in the cover 11 in particular, and the reflective sheet 12 has a plurality of openings 121, wherein the light emitted by the LED elements 16 is opened. The opening 121 is emitted and reflected on the reflective sheet 12 to increase the efficiency of use of the LED light. Moreover, the light-emitting angle can be controlled through the reflective sheet to adjust the light-emitting surface of the LED tube.

2.另外,本創作所使用的LED元件16,其可以是水平封裝式LED元件、晶片直接封裝型(chip on board,COB)LED元件與覆晶封裝型(Flip Chip,F/C)LED元件。2. In addition, the LED component 16 used in the present invention may be a horizontal package type LED element, a chip on board (COB) LED element, and a flip chip package (Flip chip, F/C) LED element. .

3.此外,本創作所使用最簡單的罩體11與端蓋17之組合方式,可於罩體11與端蓋17組合之時,使得銅線路層14與驅動與控制電路模組2同時達成電性耦接。3. In addition, the simplest combination of the cover 11 and the end cover 17 used in the present invention can simultaneously achieve the copper circuit layer 14 and the driving and control circuit module 2 when the cover 11 and the end cover 17 are combined. Electrically coupled.

必須加以強調的是,上述之詳細說明係針對本創作可行實施例之具體說明,惟該實施例並非用以限制本創作之專利範圍,凡未脫離本創作技藝精神所為之等效實施或變更,均應包含於本案之專利範圍中。It is to be understood that the foregoing detailed description of the embodiments of the present invention is not intended to limit the scope of the present invention. Both should be included in the scope of the patent in this case.

1‧‧‧LED燈管1‧‧‧LED tube

11‧‧‧罩體11‧‧‧ Cover

12‧‧‧反射片12‧‧‧reflector

111‧‧‧結合孔111‧‧‧Contact hole

17‧‧‧端蓋17‧‧‧End cover

171‧‧‧電性端子171‧‧‧Electrical terminal

173‧‧‧結合凸件173‧‧‧Combined convex parts

Claims (20)

一種LED燈管,係包括:一罩體;一銅線路層,係藉由一絕緣導熱膠而貼附於該罩體之內壁底部之上,並具有複數個焊接墊,且該些焊接墊與一驅動與控制電路模組互耦接;一防焊層,係覆蓋該銅線路層之上,並具有複數個焊接窗,用以露出該些焊接墊;一反射片,係設置於該罩體之內,位於防焊層之上,並具有複數個開口;複數個LED元件,係設置於該防焊層之上,透過該些焊接窗而與該些焊接墊相互焊接,並且該些LED元件的出光面係露出於該些開口;以及二端蓋,係分別結合至該罩體之兩端側,並具有二電性端子,用以電性連接一外部電源。An LED lamp tube comprises: a cover body; a copper circuit layer attached to the bottom of the inner wall of the cover body by an insulating thermal conductive adhesive, and having a plurality of solder pads, and the solder pads And a driving and controlling circuit module coupled to each other; a solder resist layer covering the copper circuit layer and having a plurality of soldering windows for exposing the solder pads; a reflective sheet disposed on the cover a plurality of openings are disposed on the solder resist layer, and a plurality of LED elements are disposed on the solder resist layer, and the solder pads are soldered to each other through the soldering windows, and the LEDs are soldered to the solder pads The light emitting surface of the component is exposed to the openings; and the two end caps are respectively coupled to the two ends of the cover body, and have two electrical terminals for electrically connecting an external power source. 如申請專利範圍第1項所述之LED燈管,其中,該LED燈管更可包括一交流電纜線,係藉由一第一軟質膠帶而貼附於該罩體之內壁底部,並耦接於該驅動與控制電路模組以及該端蓋之二電性端子。The LED tube of claim 1, wherein the LED tube further comprises an AC cable attached to the bottom of the inner wall of the cover by a first flexible tape and coupled Connected to the driving and control circuit module and the two electrical terminals of the end cover. 如申請專利範圍第1項所述之LED燈管,其中,該銅線路層係藉由至少一導線而與位於該罩體之外的該驅動與控制電路模組互耦接。The LED lamp of claim 1, wherein the copper circuit layer is coupled to the driving and control circuit module located outside the cover by at least one wire. 如申請專利範圍第3項所述之LED燈管,其中,該銅線路層係具有一端子連接件組與一端子固定塊組,其中,該端子連接件組係用以連接該端蓋內的該驅動與控制電路模組之一端子組,且,該端子固定塊組則用以抵住該端子連接件組,以避免該端子組與端子連接件組連接時,該端子組受到該端子連接件組之推擠而向後傾斜。The LED lamp tube of claim 3, wherein the copper circuit layer has a terminal connector group and a terminal fixing block group, wherein the terminal connector group is used for connecting the end cap a terminal group of the driving and control circuit module, wherein the terminal fixing block group is used to abut the terminal connector group to prevent the terminal group from being connected to the terminal when the terminal group is connected to the terminal connector group The group is pushed and tilted backwards. 如申請專利範圍第3項所述之LED燈管,其中,該銅線路層係具有一接點組,且該驅動與控制電路模組係具有一彈片組,如此,當該端蓋組合至該罩體時,該彈片組會與該接點組緊密接觸。The LED lamp of claim 3, wherein the copper circuit layer has a contact set, and the drive and control circuit module has a shrapnel group, such that when the end cap is assembled to the In the case of the cover, the shrapnel group will be in close contact with the contact set. 如申請專利範圍第1項所述之LED燈管,其中,該端蓋係具有一結合部,可結合至該罩體之兩端側,並且,該結合部上設置有一導光反射環,用以反射光源。The LED lamp tube of claim 1, wherein the end cap has a joint portion that can be coupled to both end sides of the cover body, and a light guiding reflection ring is disposed on the joint portion. To reflect the light source. 如申請專利範圍第1項所述之LED燈管,其中,該防焊層係為一具反射與散熱功效的白漆。The LED lamp of claim 1, wherein the solder resist layer is a white paint with reflection and heat dissipation effects. 如申請專利範圍第1項所述之LED燈管,其中,該LED元件可為下列任一種:水平封裝式LED元件、晶片直接封裝型(chip on board,COB)LED元件與覆晶封裝型(Flip Chip,F/C)LED元件。The LED lamp of claim 1, wherein the LED component can be any of the following: a horizontally packaged LED component, a chip on board (COB) LED component, and a flip chip package type ( Flip Chip, F/C) LED components. 如申請專利範圍第8項所述之LED燈管,其中,所述的覆晶封裝型LED元件係藉由將至少一個LED晶片設置於一基板之上,並覆以一具有螢光材料的膠體而製成。The LED lamp of claim 8, wherein the flip chip type LED component is formed by disposing at least one LED chip on a substrate and coating a colloid having a fluorescent material. And made. 如申請專利範圍第8項所述之LED燈管,其中,所述的晶片直接封裝型LED元件,係包括:一基板;至少一個LED晶片,係設置於該基板之上;一透明膠體,係覆蓋該LED晶片;以及一螢光材料,係設置於該基板之上,用以覆蓋該LED晶片與該透明膠體。The LED lamp tube of claim 8, wherein the wafer direct package type LED component comprises: a substrate; at least one LED chip is disposed on the substrate; a transparent colloid Covering the LED chip; and a phosphor material disposed on the substrate to cover the LED chip and the transparent colloid. 如申請專利範圍第8項所述之LED燈管,其中,所述的覆晶封裝型LED元件係包括:一基板,其表面設有該銅線路層;至少一個LED晶片,係藉由至少二端子而焊接於銅線路 層之上;以及一具有螢光材料的膠體,係覆蓋該LED晶片。The LED lamp tube of claim 8, wherein the flip chip package type LED component comprises: a substrate having a surface of the copper circuit layer; at least one LED chip is at least two Terminal and soldered to copper wiring Above the layer; and a colloid having a fluorescent material covering the LED wafer. 如申請專利範圍第1項所述之LED燈管,其中,該罩體係選自於下列群組之任一者:玻璃罩體與塑膠罩體。The LED lamp of claim 1, wherein the cover system is selected from any one of the group consisting of a glass cover and a plastic cover. 如申請專利範圍第1項所述之LED燈管,其中,該罩體係選自於下列群組之任一者:全透明罩體與霧面罩體。The LED lamp of claim 1, wherein the cover system is selected from any one of the group consisting of a full transparent cover and a matte face. 如申請專利範圍第12項所述之LED燈管,其中,該塑膠罩體更可為一上半部之材質為塑膠,而下半部之材質為玻璃纖維與塑膠雙料共押的罩體。The LED lamp tube of claim 12, wherein the plastic cover body is made of a plastic material, and the lower half is made of a glass fiber and a plastic material. 如申請專利範圍第13項所述之LED燈管,其中,所述的全透明罩體之內壁面係更設置有一擴散膜片。The LED tube of claim 13, wherein the inner wall of the full transparent cover is further provided with a diffusion film. 如申請專利範圍第1項所述之LED燈管,其中,該罩體之兩端側的內部表面係分別挖設有複數個結合孔,且該端蓋之內部表面係形成有複數個結合凸件,該些結合凸件可於該端蓋結合至該罩體之端側時嵌入該些結合孔之內。The LED tube according to claim 1, wherein the inner surface of the two ends of the cover is respectively provided with a plurality of bonding holes, and the inner surface of the end cover is formed with a plurality of bonding convexities. The coupling protrusions may be embedded in the coupling holes when the end cover is coupled to the end side of the cover. 如申請專利範圍第1項所述之LED燈管,更包括至少一LED固定膠置於該複數個LED元件之底部,用以固定該些LED元件於該防焊層之上。The LED tube of claim 1, further comprising at least one LED fixing glue disposed on the bottom of the plurality of LED elements for fixing the LED elements on the solder resist layer. 如申請專利範圍第1項所述之LED燈管,其中,該端蓋係具有一容置空間,且該驅動與控制電路模組容置於該容置空間之內。The LED lamp of claim 1, wherein the end cap has an accommodating space, and the driving and control circuit module is accommodated in the accommodating space. 如申請專利範圍第1項所述之LED燈管,其中,該LED燈具更可包括一基層,且該基層係設置於該罩體內壁底部之上,而該銅線路層則藉由該絕緣導熱膠而貼附於該基層之上。The LED lamp of claim 1, wherein the LED lamp further comprises a base layer, and the base layer is disposed on a bottom of the inner wall of the cover, and the copper circuit layer is thermally conductive by the insulation Glue is attached to the substrate. 如申請專利範圍第19項所述之LED燈管,其中,該基層係選自於下列群組之任一者:、鋁金屬層、鋁擠型基板、聚丙烯層(Polypropylene,PP)、聚亞醯胺層(Polyimide,PI)、聚乙烯層(polyethylene,PE)、聚碳酸酯(Polycarbonate,PC)、與玻璃纖維電路板。The LED tube of claim 19, wherein the substrate is selected from any one of the group consisting of: an aluminum metal layer, an aluminum extruded substrate, a polypropylene layer (PP), a poly Polyimide (PI), polyethylene (PE), polycarbonate (Polycarbonate, PC), and fiberglass circuit boards.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI563682B (en) * 2014-10-23 2016-12-21 Edison Opto Corp

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI563682B (en) * 2014-10-23 2016-12-21 Edison Opto Corp

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