TWM451366U - Article with hydrophobic layer - Google Patents

Description

Hydrophobic layer

The present invention relates to a hydrophobic layer, and in particular to a hydrophobic layer which is excellent in chemical resistance and high temperature resistance.

The hydrophilicity or hydrophobicity of the article can be controlled by adjusting the roughness or surface energy of the surface of the article. For example, the Republic of China Certificate No. I334879 patent proposes a hydrophobic layer and a method for preparing the same, which can be formed on the surface of an article by a surface effect, and can exhibit a hydrophobic effect by an increase in surface roughness and a reduction in surface energy.

However, general articles are often processed by acid, alkali, organic solution or high-temperature process during processing, so a hydrophobic layer that is resistant to acids, alkalis, and organic solutions and can withstand high temperature heating is required. To enhance the stability of the hydrophobic layer in the production process or use of the article.

Therefore, the object of the present invention is to provide an article having a hydrophobic layer having excellent hydrophobicity, chemical resistance and temperature resistance.

Thus, the novel article having a hydrophobic layer comprises a substrate and at least one hydrophobic layer formed by plasma treatment of alkyl decane molecules, the hydrophobic layer being formed on the surface of the substrate and having a thickness of 300 nm to 500 μm And the surface roughness is not less than 240 nm.

Preferably, the substrate is a metal pin of an integrated circuit chip, and the hydrophobic layer is formed between the bottom end and the top end of the metal pin.

Alternatively, the substrate can be a screen or machine for a mobile phone. a shell, and the hydrophobic layer is formed on the surface of the screen or the casing of the mobile phone.

Further, the number of the hydrophobic layers may be plural, and the hydrophobic layers form the surface of the substrate at intervals by semiconductor technology.

The effect of the novel is that the hydrophobic layer enhances the hydrophobicity of the surface of the article, and the hydrophobic layer has excellent chemical resistance and temperature resistance, and enhances the stability during the production process or use of the article.

The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments.

1 to 2 show a preferred embodiment of the novel hydrophobic layer 12 and a method of fabricating the same.

Step S1: Prepare an item 1, which may be a mobile phone, an integrated circuit chip, a glass bottle, etc., but is not limited thereto. The article 1 has a substrate 11 made of a semiconductor material, glass, metal, plastic, rubber, polymer, ceramic material, fiber material, rock (such as marble, granite), earth material ( Groups of bricks, tiles, clay, cementitious materials (such as cement, concrete, asphalt, and gypsum) and coatings (such as paints and varnishes).

The substrate 11 may be surface cleaned as needed before performing the next step. For example, if the material of the substrate 11 is 矽, unclean substances such as organic substances, oxides, and metal ions on the surface of the substrate 11 can be removed by RCA (Radio Corporation of America) cleaning technology. However, the cleaning step of the above substrate 11 is not an essential step.

Step S2: generating a reaction gas 3 in which a main component is a volatile alkyl decane molecule. The reaction gas 3 is formed by introducing a precursor gas and mixing it with a volatile gas of a reaction solution. Here, the precursor gas is nitrogen, and the main component of the reaction solution is a liquid alkyl decane molecule.

Specifically, the reaction solution containing the liquid alkyl decane molecule is contained in a closed container (not shown), and nitrogen gas is introduced into the closed container, and the volatilized gaseous alkyl decane molecule is mixed with nitrogen gas to be used. To form the reaction gas 3 of the hydrophobic layer 12.

It should be particularly noted that the precursor gas used in the present embodiment is nitrogen gas, but not limited thereto, and may be a gas such as argon gas or atmosphere, as long as it does not chemically react with the gaseous alkyl decane molecule.

Step S3: applying the reactive gas 3 to a surface of the substrate 11 through an air guiding tube 22, and applying a plasma 5 corresponding to the contact of the reactive gas 3 with the substrate 11, thereby dissociating and modifying the reactive gas 3 A film is deposited on the surface of the substrate 11 to form a hydrophobic layer 12.

Here, the plasma 5 is produced by a plasma unit 21. The plasma unit 21 includes a cavity 211 and a nozzle 212 connected to the cavity 211. After a process gas 4 for generating the plasma 5 is introduced into the cavity 211, a voltage is applied to the nozzle 212 to dissociate the process gas 4 flowing through the nozzle 212 to generate a plasma 5, which is sprayed from the plasma 5 The tube 212 is led away from a nozzle 213 of the cavity 211 and applied to the contact of the reaction gas 3 with the substrate 11.

In the above process, the process gas 4 is a dry clean air (CDA) having a pressure of at least 5 kg/cm 2 , and the distance between the nozzle 212 and the substrate 11 is 5 to 30 cm, and the specific value is determined as needed.

It should be particularly noted that the above-mentioned reaction gas 3 can also be directly introduced into the cavity 211 of the plasma unit 21, mixed with the process gas 4, and then dissociated by high voltage to generate the plasma 5, and a hydrophobic layer 12 is formed on the surface of the substrate 11.

Step S4: The hydrophobic layer 12 is formed on the surface of the substrate 11 via the step S3. The thickness of the hydrophobic layer 12 is determined by the time during which the reactive gas 3 and the plasma 5 are applied, and the thickness is preferably from 300 nm to 500 μm, but not limited thereto.

Refer to Table 1 for the characteristic test results of the hydrophobic layer 12. It can be seen from Table 1 that the hydrophobic layer 12 is mainly composed of niobium and oxygen, and the surface roughness and the hydrophobic group thereof effectively increase the hydrophobicity, and still have excellent hydrophobicity after acid, alkali, organic solution and high temperature treatment, and can Enhancing the surface of the substrate 11 Hydrophobic.

Refer to Figure 3. For example, the article 1 can be an integrated circuit chip including a package case 13 and a plurality of pins 14. Generally, the integrated circuit chip is fixed to a circuit board by soldering (not shown). During the solder reflow heating process, the surface tension of the solder at the bottom end of the pin 14 is reduced, and by capillary phenomenon. As the pin 14 climbs up to the package casing 13, the solder risks damage the package casing 13, which is a phenomenon of "climbing". If the hydrophobic layer 12 is separately formed between the bottom end of the pin 14 and the package case 13 by the foregoing method, since the hydrophobic layer 12 has high temperature resistance and the solder cannot adhere to the surface of the hydrophobic layer 12, Avoid soldering during the heating process of solder reflow to improve process yield.

Refer to Figure 4. In addition, item 1 can also be a mobile phone. The hydrophobic layer 12 is formed on the surface of the glass or the casing of the mobile phone, and its hydrophobicity enhances the waterproofness of the mobile phone and keeps it clean.

It should be particularly noted that the above-described integrated circuit chip and mobile phone are for illustrative purposes only, and the application field of the hydrophobic layer 12 cannot be limited thereto, as long as the material of the substrate 11 of the article 1 is matched to the hydrophobic layer 12.

1 , 5 and 6 are referred to. The difference between the second preferred embodiment of the present invention and the first preferred embodiment is that the hydrophobic layer 12 is further defined by a semiconductor technology, and the details are as follows.

Step F1: Referring to FIG. 5a, a portion of the pattern layer 15 covering the surface is formed on the surface of the substrate 11 by photolithography. Here, the material of the pattern layer 15 is a photosensitive photoresist.

Step F2: Referring to FIG. 5b, a portion of the surface of the pattern layer 15 and the substrate 11 not covered by the pattern layer 15 is covered with a hydrophobic layer 12 by the method of producing the hydrophobic layer 12 as described above.

Step F3: The pattern layer 15 is removed by an organic solvent and the hydrophobic layer 12 on the pattern layer 15 is simultaneously peeled off. Here, the organic solvent is acetone, but it is not limited thereto as long as the pattern layer 15 can be removed.

Step F4: Referring to Figure 5c, a patterned hydrophobic layer 12 of a particular shape is defined by the pattern layer 15.

As described above, the hydrophobic layer 12 having good chemical resistance and temperature resistance can be produced according to the steps S1 to S3, and the patterned hydrophobic layer 12 can be further formed by the semiconductor process technology from the steps F1 to F4, and the hydrophobic layer 12 is enhanced. The scope of application.

In addition, referring to Figs. 7 to 8, since the hydrophobic layer 12 has a rough surface to enhance its hydrophobicity, the present invention also proposes a mold 6 for replicating the surface topography of the hydrophobic layer 12. By embossing the surface of the mold 6 on a curable plastic material (such as polydimethyl siloxane, PDMS), the surface topography of the hydrophobic layer 12 can be transferred to the surface of the plastic material to enhance the plasticity. The hydrophobicity of the material.

The following is the step of making the mold 6.

Step M1: Referring to FIG. 9a, a hydrophobic layer 12 is prepared by the aforementioned steps S1 to S3 or steps F1 to F4.

Step M2: Forming a mold 6 on the surface of the hydrophobic layer 12 (Fig. 9b).

This step is to make the mold 6 by precision electroforming. Specifically, the surface of the hydrophobic layer 12 is first made of physical gas. Phase deposition techniques (such as evaporation or sputtering) or other metallization techniques cover a layer of metal seed layer. For example, the metal starting layer may be a double-layer metal such as chromium/copper or titanium/copper, but is not limited thereto.

Next, a thick metal layer is deposited on the metal starting layer by Electrochemical Deposition to form the mold 6. The material of the mold 6 may be nickel, nickel cobalt alloy or copper, but not limited thereto.

In the process of electrochemical deposition, the mold 6 is formed by gradually depositing metal from the surface 121 of the hydrophobic layer 12, so that the surface 61 of the mold 6 is complementary in appearance to the surface 121 of the hydrophobic layer 12, and the transfer function can be performed.

Step M3: The mold 6 is separated from the surface 121 of the hydrophobic layer 12 to produce a mold 6 (Fig. 9c).

After the surface 61 of the mold 6 is embossed and solidified on the surface of the plastic material, the surface of the plastic material forms a topography complementary to the surface 61 of the mold 6. The effect of this method is equivalent to the appearance of the surface 121 of the hydrophobic layer 12. Transfer to the surface of the plastic material to increase the hydrophobicity of the plastic material by increasing the surface roughness.

In summary, the hydrophobic layer 12 formed by treating the alkyl decane molecules in a volatile state by the plasma 5 has excellent hydrophobicity, chemical resistance and high temperature tolerance, and can enhance the hydrophobic layer 12 in various articles. The stability of the manufacturing process of 1 and enhance its durability. In addition, since the hydrophobic layer 12 has excellent chemical resistance, the patterned hydrophobic layer 12 can be fabricated by semiconductor technology to enhance its application range. Furthermore, the hydrophobic layer 12 corresponds to The produced mold 6 can transfer the rough surface topography of the hydrophobic layer 12 to the surface of the curable plastic material to further enhance the hydrophobicity of the plastic material.

However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention cannot be limited thereto, that is, the simple equivalent change and modification made by the novel patent application scope and the novel description content, All remain within the scope of this new patent.

1‧‧‧ Items

11‧‧‧Substrate

12‧‧‧hydrophobic layer

121‧‧‧ surface

13‧‧‧Packing

14‧‧‧ pins

15‧‧‧pattern layer

21‧‧‧Plastic unit

211‧‧‧ cavity

212‧‧‧ nozzle

213‧‧‧ mouth

22‧‧‧ air duct

3‧‧‧Reactive gas

4‧‧‧Process Gas

5‧‧‧ Plasma

6‧‧‧Mold

61‧‧‧ surface

S1~S4‧‧‧ Process steps

F1~F4‧‧‧ process steps

M1~M3‧‧‧ process steps

1 is a schematic view showing a preferred embodiment of the method for fabricating the novel hydrophobic layer; FIG. 2 is a flow chart of the hydrophobic layer; FIG. 3 and FIG. 4 are schematic diagrams of the application of the hydrophobic layer; Schematic diagram of the patterned hydrophobic layer; FIG. 6 is a flow chart for fabricating the patterned hydrophobic layer; FIG. 7 is a flow chart for fabricating a mold from the hydrophobic layer; and FIG. 8 is a schematic view of the mold.

1‧‧‧ Items

12‧‧‧hydrophobic layer

13‧‧‧Packing

14‧‧‧ pins

Claims (4)

An article having a hydrophobic layer comprising: a substrate; and at least one hydrophobic layer formed by plasma treatment of alkyl decane molecules, the hydrophobic layer being formed on the surface of the substrate and having a thickness of 300 nm to 500 μm, and The surface roughness is not less than 240 nm. The article of claim 1, wherein the substrate is a metal pin of an integrated circuit chip, and the hydrophobic layer is formed between the bottom end and the top end of the metal pin. . The article having a hydrophobic layer according to claim 1, wherein the substrate is a screen or a casing of a mobile phone, and the hydrophobic layer is formed on a screen or a casing surface of the mobile phone. The article having a water repellent layer according to claim 1, wherein the number of the water repellent layers is plural, and the hydrophobic layers form the surface of the substrate at intervals by a semiconductor technique.