五、新型說明： 【新型所屬之技術領域】 本創作有關於一種散熱裝置，尤指一種能用於協助發 熱元件散熱，使發熱元件能維持在正常工作溫度以發揮應 有之功能的散熱裝置。 【先前技術】 由於現今科技工業的產品發展趨於精密化，如積體電 路或個人電知荨，除了體積設計小型化外，相對所衍生的 熱量也大幅地增加，尤其是在日常生活所常見的電腦系統 中曰由於電腦系統運算效能不斷地提升，使得電腦整體發 …、量亦Ik之增加，因此為使電腦系統在容許的工作溫度範 圍内正¥運作’散熱裝置的設置成為目前電腦系統中必要 近年來水冷技術㈤倾廣泛的制在個人電腦上， 2散^統㈣-種常_散熱手段，水冷散熱系統係 22冷頭_於發熱元件上，由—馬達自水箱將冷卻 液抽出導入水冷射，料诚與 ==換作用後，冷卻液再由上r 助^敎似工/7^7後再运回水箱’藉此冷卻液循環來幫 政，、、、，降低發熱元件的溫度。 惟’習知的散熱裝置（水冷） 無法均勾地傳遞熱量，使在貫際使用時’往往 其散埶效率;‘、、fe …里⑴、/有效地被冷卻液帶走， t羊有限，無法提供更佳的散熱效果。 、、彖疋，本創作人有感上述缺 究並配合學理之運用，終於提出一二:2 ’乃特潛心研 上述缺失之本創作。 出種故计合理且有效改善 【新型内容】 本碧)作之主要目的在於 一 熱效率，，到更佳的散熱效果「散熱装置，能提升散 .為了貫現上述目的’本創作提供 :二均溫极’其具有-受熱面及凝面熱裝置’包括 :、兩端分別形成有—第—接頭及:及-輸送管 /、该均溫板的冷凝面熱性結合。 〜項，該輸送管 本創作具有以下有益的效果： 、本創作係以均溫板及輪送管 溫板傳導發熱元件的熱量，使發孰元件可透過均 ^輸运管。均溫板將熱量均勾地傳遞至輸二均2傳遞 ;=將熱量帶走，可有效地降 二：二 ，用均溫板及輸送管的配合，能提升散埶m 2 率’達到更佳的散熱效果。 ’、、、#置的政熱效 開π的一側與均溫板的:J二:成:::。輸送管設有 散，f達到更隹的散熱效果，且輪送管高降ί， ，可達到薄型化的效果。 又吧』以降低 為^更進-步瞭解本創作的特徵及技術内容，請來 閱以下有關本創作的詳細朗與關，然 财考舰_，歸絲對本_加錢财 【貫施方式】 請參閱圖1及圖2’本創作提供一種散熱裝置，包括一 均溫板（VaP〇r chamber) i及―輸送管2，其中之均溫板卜 呈一爲平板狀，均溫板1内部形成有真空的腔室並填充有 4/1〇 M436858 工作流體（圖略），且真空腔室内設有毛細結構（圖略）。 該均溫板1具有一受熱面11及一冷凝面12。均溫板1可透 過受熱面11與熱源（發熱元件）貼設，均溫板1的冷凝面 12則與輸送管2結合。工作流體於受熱面11處吸附熱量產 生蒸發轉換成氣態的工作流體，氣態工作流體於冷凝面12 處產生冷凝，轉換為液態，液態的工作流體透過腔室内部 的毛細結構回流至受熱面11，使工作流體於腔室内形成氣 液循環傳導熱量；因上述均溫板1的構造及運作屬於習知 技術，故不再加以贅述。 輸送管2係以銅等導熱性良好的材質製成，但其材質 並不限制。輸送管2為一具有適當長度的中空體，輸送管2 可為封閉狀的管體，亦即輸送管2本身即形成完整的管體 ，如圓形管、方形管、扁形管或其他形狀的管體。輸送管2 也可為開放狀的管體，亦即為剖半的管體，必需與均溫板1 結合後，才能形成封閉狀的管體，如半圓形管、门形管或 其他形狀的管體。在本實施例中輸送管2為開放狀（剖半 )的管體，該輸送管2 —侧形成有一開口 21，該開口 21沿 著輸送管2的長度方向延伸。輸送管2呈曲折狀（如蛇管 般）的延伸，輸送管2可彎折呈S型、W型等各種形狀， 並不予以限制。輸送管2的管殼内壁可以設有溝槽、燒結 金屬或銅網24等結構（如圖5所示），藉以增加接觸面積 〇 輸送管2與均溫板丨的争凝面12熱性結合，亦即輸送 管2設有開口 21的一側與均溫板1的冷凝面12以焊接等 方式熱性結合，使輸送管2得以結合於均溫板1的冷凝面 12上，且可利用均溫板1的冷凝面12封閉輸送管2的開口 5/10V. New description: [New technical field] This creation relates to a heat sink, especially a heat sink that can be used to assist the heat dissipation of the heat-generating component so that the heat-generating component can maintain its normal operating temperature to perform its intended function. [Prior Art] As the development of products in today's technology industry tends to be more sophisticated, such as integrated circuits or personal electrical know-how, in addition to the miniaturization of volume design, the relative heat generated is also greatly increased, especially in daily life. In the computer system, due to the continuous improvement of the computing power of the computer system, the overall computer output and the amount of Ik have increased. Therefore, in order to make the computer system operate within the allowable operating temperature range, the setting of the 'heat sink device becomes the current computer system. In recent years, it is necessary to use water-cooling technology (5) in a wide range of systems on personal computers, 2 scattered system (four) - kind of constant _ heat dissipation means, water cooling system 22 cold head _ on the heating element, by - motor from the water tank to extract the coolant Introduce water cooling shot, after the material and the == change, the coolant will be transported back to the water tank by the r-assisting / 7^7, and then the coolant circulation will help the government, and, and, reduce the heating element. temperature. However, the conventional heat sink (water-cooled) cannot transfer heat evenly, so that when it is used continuously, it tends to have its efficiency; ', , ... (1), / is effectively carried away by the coolant, t sheep is limited Can not provide better heat dissipation.彖疋, 彖疋, the creator feels the above-mentioned deficiencies and cooperates with the use of academics, and finally proposes one or two: 2 ‘Nat’s painstaking research on the above-mentioned missing creations. Reasonable and effective improvement of the new method [New content] The main purpose of this book is to achieve a thermal efficiency, to a better heat dissipation effect. "The heat sink can enhance the dispersion. In order to achieve the above objectives," the creation provides: The temperature pole 'having a heat receiving surface and a surface heating device' includes: a two-part joint and a - joint pipe and a heat transfer surface of the temperature equalizing plate. The creation has the following beneficial effects: The creation of the heat transfer element of the heating plate by the temperature equalizing plate and the circulating tube temperature plate enables the hairpin component to pass through the transport tube. The temperature equalizing plate transfers the heat to the heat transfer board. Transfer 2 and 2 pass; = Take away the heat, can effectively reduce 2: 2, with the combination of the uniform temperature plate and the conveying pipe, can improve the m 2 rate of the divergence to achieve better heat dissipation effect. ', ,,# Set the political heat effect to open the side of π and the uniform temperature plate: J 2: Cheng:::. The conveying pipe is provided with scattered, f to achieve a more sturdy heat dissipation effect, and the wheel feeding tube is lowered, which can reach a thin shape. The effect of the transformation. Let's take a step down to further understand the characteristics and technical content of this creation. Please read the following details about the creation of this creation, and the financial test ship _, return to the _ add money [through the way] See Figure 1 and Figure 2' This design provides a heat sink, including a temperature equalization Plate (VaP〇r chamber) i and “transport tube 2”, wherein the uniform temperature plate is in the form of a flat plate, and the chamber of the temperature equalizing plate 1 is formed with a vacuum chamber and filled with 4/1〇M436858 working fluid (not shown) And a capillary structure (not shown) is provided in the vacuum chamber. The temperature equalizing plate 1 has a heating surface 11 and a condensation surface 12. The temperature equalizing plate 1 can be attached to the heat source 11 (heat generating component) through the heating surface 11 The condensing surface 12 of the warming plate 1 is combined with the conveying pipe 2. The working fluid adsorbs heat at the heating surface 11 to generate a working fluid which is vaporized and converted into a gaseous state, and the gaseous working fluid is condensed at the condensing surface 12 to be converted into a liquid state, a liquid working operation. The fluid passes through the capillary structure inside the chamber to the heating surface 11, so that the working fluid forms a gas-liquid circulation to conduct heat in the chamber; since the structure and operation of the above-mentioned temperature equalizing plate 1 are conventional techniques, they will not be described again. 2 series with thermal conductivity such as copper It is made of a good material, but its material is not limited. The conveying pipe 2 is a hollow body having a proper length, and the conveying pipe 2 can be a closed pipe body, that is, the conveying pipe 2 itself forms a complete pipe body, such as A circular tube, a square tube, a flat tube or a tube of other shapes. The conveying tube 2 can also be an open tube body, that is, a tube body that is half-sectioned, and must be combined with the temperature equalizing plate 1 to form a closed shape. The pipe body, such as a semicircular pipe, a gate pipe or a pipe body of other shapes. In the embodiment, the conveying pipe 2 is an open (half-cut) pipe body, and an opening 21 is formed on the side of the conveying pipe 2, The opening 21 extends along the longitudinal direction of the conveying pipe 2. The conveying pipe 2 has a meandering shape (like a serpentine), and the conveying pipe 2 can be bent into various shapes such as an S-shape and a W-shape, and is not limited. The inner wall of the casing of the conveying pipe 2 may be provided with a structure such as a groove, a sintered metal or a copper mesh 24 (as shown in FIG. 5), thereby increasing the contact area, and the conveying pipe 2 is thermally combined with the converging surface 12 of the temperature equalizing plate. That is, the side of the conveying pipe 2 provided with the opening 21 and the condensation surface 12 of the temperature equalizing plate 1 are thermally coupled by welding or the like, so that the conveying pipe 2 can be coupled to the condensing surface 12 of the temperature equalizing plate 1, and the uniform temperature can be utilized. The condensation surface 12 of the plate 1 closes the opening of the delivery tube 2 5/10
I 21。上述熱性結合的 各種熱性結合。輸限制’可為錫焊或擴散焊等 區域也不限制 J因應需要適當的變化。 - 另，本創作均溫板！的冷凝 有數賴片(如圖6 ，=2上方2進^步的設 、擴散焊接或㈣等方式13可以利用锡焊 可以被佈局成輪送管2的 > 凝面12上。所述韓片13 與路徑料的位f’也相㈣被布局在路徑 方沿著輸送面積°又’均溫板1的冷;疑面12上 14 佈局的路徑上也可以設有燒結的金屬粉末 Η (如圖7所示），前沭厶厘从本 ^丈蜀物禾 的路徑，也可以同時被佈局錄送管2 輸送管2係蓋合在該路2在燒路^路^^外的位置，而 於增加散熱面積。 l的金屬私末14的效果在 輸送管2的兩齡卿成有—第—接頭以及 頭23,以便利用第-接頭22及第二接頭㈣入及輸j 部液二通常第一接頭22及第二接頭23係以管路連接“ =水:（圖略）等裝置，由馬達自水箱將冷卻液抽出導 輸达官2中’冷卻液與散熱裝置從發熱元件所吸附的敎旦 經由熱交換作用後，冷卻液再由散鮮置流出，再送回= 箱，藉此冷卻液循環來幫助散熱，降低發熱元件的溫度。 第一接頭22及第二接頭23可位於均溫板】的 兩側，第-接頭22及第二_ 23可沿著水平方向或^ 方向延伸，在本實施例中，第—接頭22及第二接頭^位 於=溫板H側，絲著水平方向延伸，使第―接頭^ 及弟二接頭23凸出於均溫板i的邊緣，但第—接頭^及 6/1〇 第二接頭23設置的位置及方向並祕制，可因應需要適當 的變化。另，在本實施例中，第一接頭22及第二接頭23 平行於輸送管2，使冷卻液在輸入及輸出時阻力較小。 請參閱圖3及圖4，本實關主要係針對輸送管2a的 構造加以變化，輸送管厶係彎折呈不同的形狀，且第一接 頭22a及第二接頭23a位於均溫板1的—側（頂側），且沿 著錯垂方向延伸，使第一接頭22a及第二接頭23a凸出於 均溫板1的頂側。 本創作係以均溫板1及輸送管2構成一水冷頭，可透 過均溫板1料發熱元件賴量，使發熱元件的熱量均句 地傳遞至輸送管2’，不會有胃知水冷賴量傳遞不均句 、無法有魏帶走熱f等問題。本創作均溫板i將熱量均 勻地傳遞至輸送管2 ’藉冷卻液循環來將鮮帶走，可有效 地降低發航件的溫度。本創制帛均溫板丨及輸送管2 2a的配合，忐提升散熱裝置的散熱效率，達到更佳的散 熱效果。 •再者，本創作輸送管2 —側可進一步形成有開口 21 , 輪送ΐ 2 有開口 21的一側與均溫板丨的冷凝面12結合 ，因此輸送管2内的冷卻液可以直接地接觸均溫板1，以具 有更佳㈣交換效果，使散減置達到更佳的散熱效果。 且輸迗管2為開放狀（剖半）的管體，高度也可以降低， 可達到薄型化的效果。 I1 隹以上所述僅為本創彳乍义轉佳實施例，非意欲侷限本 ^作的專利保護範圍，故舉凡運用本創作說明書及圖式内 奋所為的Κ變化’均同理皆包含於本創作的權利保護範 圍内’合予陳明。 M436858 【圖式簡單說明】 圖1為本創作第一實施例散熱裝置之立體分解圖。 圖2為本創作第一實施例散熱裝置之立體圖。 圖3為本創作第二實施例散熱裝置之立體分解圖。 圖4為本創作第二實施例散熱裝置之立體圖。 圖5為本創作第三實施例散熱裝置之立體分解圖。 圖6為本創作第四實施例散熱裝置之立體分解圖。 圖7為本創作第五實施例散熱裝置之立體分解圖。 【主要元件符號說明】 1均溫板 11受熱面 12冷凝面 13鰭片 14金屬粉末 2輸送管 21開口 22第一接頭 23第二接頭 24銅網 2a輸送管 22a第一接頭 23a第二接頭 8/10I 21. The various thermal combinations of the above thermal combinations. The transmission limit can be either soldered or diffused, and the J is not limited to J. - In addition, this creation is warm! The condensing has a number of sheets (as shown in Fig. 6, = 2 above, 2 steps, diffusion welding or (4), etc. 13 can be laid out by the soldering of the tube 2 by the soldering. The sheet 13 and the bit f' of the path material are also phased (four) are arranged on the path side along the conveying area ° and the cooling of the uniform temperature plate 1; the path of the 14 layout of the suspect surface 12 may also be provided with sintered metal powder Η ( As shown in Fig. 7), the front 沭厶 从 from the path of the 蜀 蜀 禾 , , , , , , , , 布局 布局 布局 布局 布局 布局 布局 布局 布局 布局 布局 布局 布局 布局 布局 布局 布局 布局 布局 布局 布局 布局 布局 路径 路径In order to increase the heat dissipation area, the effect of the metal whistle 14 is the same as that of the second joint of the duct 2, and the head and the head 23 are used to enter and lose the liquid with the first joint 22 and the second joint (four). Secondly, the first joint 22 and the second joint 23 are connected by a pipe such as "= water: (not shown), and the motor is taken out from the water tank by the motor." The coolant and the heat sink are from the heating element. After the adsorbed heat exchanger is subjected to heat exchange, the coolant is discharged from the fresh air and sent back to the tank, thereby circulating the coolant to help dissipate heat. The temperature of the low heat generating component. The first joint 22 and the second joint 23 may be located on both sides of the temperature equalizing plate, and the first joint 22 and the second joint 23 may extend in the horizontal direction or the ^ direction, in this embodiment, The first joint 22 and the second joint ^ are located on the side of the temperature plate H, and extend in the horizontal direction so that the first joint and the second joint 23 protrude from the edge of the temperature equalizing plate i, but the first joint and the 6/ 1) The position and direction of the second joint 23 are secreted and can be appropriately changed according to the need. In addition, in the present embodiment, the first joint 22 and the second joint 23 are parallel to the conveying pipe 2, so that the coolant is input. The resistance is small when the output is small. Referring to FIG. 3 and FIG. 4, the actual control mainly changes the structure of the conveying pipe 2a, the conveying pipe is bent and has different shapes, and the first joint 22a and the second joint 23a are Located on the side (top side) of the temperature equalizing plate 1 and extending along the wrong direction, the first joint 22a and the second joint 23a protrude from the top side of the temperature equalizing plate 1. The present invention is a temperature equalizing plate 1 And the conveying pipe 2 constitutes a water-cooling head, which can pass through the heating element of the uniform temperature plate, so that the heat of the heating element is uniform The ground is transferred to the conveying pipe 2', there is no problem that the stomach knows that the water and water are not evenly transferred, and there is no problem that the heat can be taken away. The creation of the uniform temperature plate i transfers the heat evenly to the conveying pipe 2 'by the cooling liquid Circulating to take away fresh, can effectively reduce the temperature of the starting parts. The creation of the uniform temperature plate and the cooperation of the conveying pipe 22a, improve the heat dissipation efficiency of the heat sink and achieve better heat dissipation. The side of the creation duct 2 can be further formed with an opening 21, and the side of the wheel ΐ 2 having the opening 21 is combined with the condensing surface 12 of the temperature equalizing plate, so that the coolant in the conveying pipe 2 can directly contact the temperature. Board 1 has a better (four) switching effect to achieve a better heat dissipation effect. Moreover, the tube 2 is an open (half-section) tube body, and the height can be lowered, so that the effect of thinning can be achieved. I1 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Within the scope of the rights protection of this creation, 'combined with Chen Ming. M436858 [Simple Description of the Drawings] Fig. 1 is an exploded perspective view of the heat dissipating device of the first embodiment of the present invention. 2 is a perspective view of the heat sink of the first embodiment of the present invention. 3 is an exploded perspective view of the heat sink of the second embodiment of the present invention. 4 is a perspective view of a heat sink according to a second embodiment of the present invention. Fig. 5 is an exploded perspective view showing the heat dissipating device of the third embodiment of the present invention. Fig. 6 is an exploded perspective view showing the heat dissipating device of the fourth embodiment of the present invention. Fig. 7 is an exploded perspective view showing the heat dissipating device of the fifth embodiment of the present invention. [Main component symbol description] 1 temperature plate 11 heat surface 12 condensation surface 13 fin 14 metal powder 2 delivery pipe 21 opening 22 first joint 23 second joint 24 copper mesh 2a delivery pipe 22a first joint 23a second joint 8 /10