M435713 五、新型說明： 【新型所屬之技術領域】 [0001] 本創作係有關於一種半導體製程設備，尤指一種晶圓黏 膜組分離設備及其離膜裝置。 【先前技術】M435713 V. New Description: [New Technology Field] [0001] This creation is about a semiconductor process equipment, especially a wafer bonding machine separation device and its film separation device. [Prior Art]
[0002] 在半導體製程中，因薄如紙張的晶圓本身強度不足，為 了避免晶圓在製程或運送過程中搬動不易甚至因扭曲造 成脆裂，通常會暫時性的貼上特殊材質黏膜或者貼上一 層玻璃或矽材質的承載材料作為固定與強化薄晶圓之解 決方法。 [0003] 然而，傳統將晶圓黏膜組（即黏接方式連接的晶圓及黏 膜）與框架剝離的方式通常採用人工進行，其需要小心 翼翼的將晶圓黏膜組於金屬框架上取下，以維持黏膜的 平整性，並避免因黏膜皺摺導致遭客戶退貨之情形發生 :故，上述方法容易因人工疲勞及施力不均勻而影響剝 除效率，且需要耗費較多的人力，造成人力浪費，成本 也較高。 [0004] 有鑑於此，本創作人遂針對上述現有技術，特潛心研究 並配合學理的運用，盡力解決上述之問題點，即成為本 創作人改良之目標。 【新型内容】 [0005] 本創作之一目的，在於提供一種晶圓黏膜組分離設備及 其離膜裝置，其係利用載具安置於承放框時，吹氣機構 會將氣體吹入框架及晶圓黏膜組之間，使框架及晶圓黏 1012祕#單編號A_ 第.3頁/共24頁 1012022448-0 M435713 膜組產生分離，以達到製程自動化，進而節省人力、降 低製造成本及提高生產效率。[0002] In the semiconductor manufacturing process, due to the insufficient strength of the thin film itself, in order to avoid the wafer being difficult to move during the process or transportation, or even brittle due to distortion, the special material mucus is usually temporarily attached or A layer of glass or tantalum carrier material is applied as a solution for fixing and strengthening thin wafers. [0003] However, the conventional method of peeling the wafer adhesive layer (ie, the bonded wafer and the mucous membrane) from the frame is usually performed manually, and it is necessary to carefully remove the wafer adhesive film on the metal frame to remove Maintain the smoothness of the mucosa and avoid the return of the customer due to the wrinkles of the mucosa: therefore, the above method is easy to affect the stripping efficiency due to artificial fatigue and uneven application, and it requires more manpower and waste of labor. The cost is also higher. [0004] In view of this, the present creator has focused on the above-mentioned prior art, and has devoted himself to researching and using the theory to solve the above problems, which is the goal of the creator's improvement. [New Content] [0005] One of the aims of the present invention is to provide a wafer mucilage group separation device and a film separation device thereof, which are used to blow a gas into a frame when a carrier is placed in a receiving frame. Between the wafer mucosa group, the frame and the wafer are bonded to each other. The single film number is A1. Page 3/24 pages 1012022448-0 M435713 The film group is separated to achieve process automation, thereby saving manpower, reducing manufacturing costs and improving Productivity.
[0006] 為了達成上述之目的，本創作係提供一種晶圓黏膜組分 離設備，用於一載具，所述載具包含相互黏接的一框架 及一晶圓黏膜組，該晶圓黏膜組分離設備包括：一離膜 裝置，包含一架體及設置在該架體内部的一承放框、一 吹氣機構和一吸附機構，該吹氣機構配置在該承放框的 上方，該吸附機構配置在該承放框的下方；一進料架； 一回收架，和該進料架分別配置在該承放框的兩側；以 及一移動裝置，固持所述框架並移動於該進料架、該承 放框及該回收架之間；其中，所述載具安置於該承放框 時，該吹氣機構將氣體吹入所述框架及所述晶圓黏膜組 之間，使所述框架及所述晶圓黏膜組產生分離。 [0007] 為了達成上述之目的，本創作係提供一種晶圓黏膜組分 離設備的離膜裝置，包括：一架體；一承放框，設置在 該架體内部；一吹氣機構，配置在該承放框的上方；以 及一吸附機構，配置在該承放框的下方。 [0008] 本創作還具有以下功效： [0009] 載具安置於承放框時，吹氣機構及吸附機構同步朝載具 接近，且吹氣機構下降之同時，吹氣機構會將氣體吹入 框架及晶圓黏膜組之間，使框架及晶圓黏膜組產生分離 ，再將分離後的晶圓黏膜組吸附在吸附機構上，分離後 的框架經由移動裝置收納至回收架，以使框架與晶圓黏 膜組剝離的方式達到自動化製程，進而節省人力、降低 製造成本及提高生產效率。 1()12()686#單编號A0101 第4頁/共24頁 1012022448-0 [0010]M435713 [0011] [0012] [0013][0006] In order to achieve the above object, the present invention provides a wafer mucosa separation device for a carrier, the carrier includes a frame and a wafer mucosa group bonded to each other, the wafer mucosa group The separating device comprises: a film separating device comprising a frame body and a receiving frame disposed inside the frame body, an air blowing mechanism and an adsorption mechanism, wherein the air blowing mechanism is disposed above the receiving frame, the adsorption The mechanism is disposed under the receiving frame; a feeding frame; a recycling frame, and the feeding frame are respectively disposed at two sides of the receiving frame; and a moving device for holding the frame and moving to the feeding Between the rack, the receiving frame and the recycling rack; wherein, when the carrier is placed in the receiving frame, the blowing mechanism blows gas between the frame and the wafer mucilage group The frame and the wafer mucilage group are separated. [0007] In order to achieve the above object, the present invention provides a film separating device for a wafer mucilage group separating device, comprising: a frame; a receiving frame disposed inside the frame; and an air blowing mechanism disposed at Above the receiving frame; and a suction mechanism disposed below the receiving frame. [0008] The creation also has the following effects: [0009] When the carrier is placed in the receiving frame, the blowing mechanism and the adsorption mechanism are synchronously approached toward the carrier, and the blowing mechanism is lowered, and the blowing mechanism blows the gas into the air. Between the frame and the wafer mucilage group, the frame and the wafer mucilage group are separated, and the separated wafer mucosa group is adsorbed on the adsorption mechanism, and the separated frame is stored into the recovery frame via the mobile device to make the frame and the frame The way in which the wafer mucosa is peeled off reaches an automated process, which saves manpower, reduces manufacturing costs, and increases production efficiency. 1()12()686#单单A0101 Page 4 of 24 1012022448-0 [0010] M435713 [0011] [0013]
[0014] [0015] 另外，出風器經由吹氣口導引吹至框架及晶圓黏膜組之 間的接缝處，使框架及晶圓黏膜組的分離係利用氣體均 勻充滿在兩者之間，進而讓黏膜·^受力也均勻分佈，避 免剝離下黏膜產生皺摺或變形，使本創作離膜裝置於剝 離過程中，其可有效地維持黏膜的平整性。 再者，吹氣機構下降之同時，吹氣機構會持續將氣體吹 入框架及晶圓黏膜組之間，使氣體分布在基體及晶圓黏 膜組之間，讓基體及黏膜之間皆具有一間隔空間，故可 避免基體碰觸到黏膜，更加強維持黏膜的平整性。 又，基體的凹陷部和黏膜共同圍設成容置空間，使晶圓 容置在容置空間内，讓框架與晶圓黏膜組剝離的自動化 製程中，晶圓被基體所保護，以避免晶圓於製程中受到 損壞。 【實施方式】 有關本創作之詳細說明及技術内容，將配合圖式說明如 下，然而所附圖式僅作為說明用途，並非用於侷限本創 作。 請參考第一至八圖所示，本創作係提供一種晶圓黏膜組 分離設備及其離膜裝置，用於一載具100，載具100包含 相互黏接的一框架101及一晶圓黏膜組102，晶圓黏膜組 102包含一黏膜1021及黏設在黏膜1021上的晶圓1022， 此晶圓黏膜組分離設備10主要包括一離膜裝置1、一進料 架2、一回收架3及一移動裝置4。 離膜裝置1包含一架體11、一承放框12、一吹氣機構13及 丽薩#單編號A0101 第5頁/共24頁 1012022448-0 M435713 一吸附機構14，承放框12設置在架體11内部，此承放框 12可為一中空板或如第一圖所示由兩支架所構成，且承 放框12具有定位槽可供框架ιοί定位；吹氣機構13固定在 架體11並配置在承放框12的上方；吸附機構14，配置在 承放框12的下方。 [0016]詳細說明如下，吹氣機構13包含一基體131及裝設在基體 131的一出風器132和一升降器133，基體131的外周緣尺 寸小於框架101的内周緣尺寸並設有複數風道1311，每一 風道1311的兩側開口分別朝出風器丨32及承放框12方向 配置，且每一風道1311於基體131上形成有一吹氣口 1312，各吹氣口 131 2朝框架101及晶圓黏膜組1〇2的接縫 處配置，又基體131設有一凹陷部1313，凹陷部1313和 晶圓黏膜組1 02之形成一容置空間134，使晶圓1 〇22容置 在容置空間134内；另外，吸附機構14包括一真空吸盤器 141及連接真空吸盤器141的一升降器142，此吸附機構 14亦可為陶瓷材質所構成。 [0017] 進料架2和回收架3分別配置在承放框12的左右兩侧，且 進料架2設有複數放置槽以供載具1〇〇收納，回收架3設有 複數放置槽以供框架101收納。 1012022448-0 [0018]移動裝置4固持框架101並移動於進料架2、承放框12及回 收架3之間；此移動裝置4包含一滑軌41及滑接於滑轨的 一固持器42，滑軌41的局部對應進料架2、承放框12及回 收架3配置，使固持器42可將載具100由進料架2放置在承 放框12上’或者，固持器42可將框架101由承放框12放 置在回收架3上；另外，固持器42可為一機械手臂或一伺 1012〇686产單編號A01〇l 第6頁/共24頁 M435713 服轴，此機械手臂或伺服轴上裝設有一夾持件或一吸附 件。 [0019]本創作晶圓黏膜組分離設備之組合，其係利用離膜裝置1 包含架體11及設置在架體Π内部的承放框12、吹氣機構 13和吸附機構14，吹氣機構13配置在承放框12的上方， 吸附機構14配置在承放框12的下方；進料架2和回收架3 分別配置在承放框12的兩側；移動裝置4固持框架1〇1並 移動於進料架2、承放框12及回收架3之間。 # [0020]本創作離膜裝置之組合，其係利用承放框12設置在架體 11内4 ,吹氣機構13配置在承放框12的上方；吸附機構 14配置在承放框12的下方。 [0021]本創作晶圓黏膜組分離設備及其離膜裝置之使用狀態如 下，首先如第四圖所示，移動裝置4將載具1〇〇由進料架2 放置在承放框12上；再如第五圖所示，吹氣機構13的升. 降器133帶動基體131朝載具1〇〇方向接近，吸附機構η 的升降器142也同步帶動真空吸盤器}41朝載具丨00方向 接近，且基體131下降之同時’出風器132產生氣體吹入 風道1311，並經由吹氣口 131 2導引吹至框架1〇1及晶圓 黏膜組102之間的接縫處’使框架ιοί及晶圓黏膜組1〇2 之間的接縫處產生縫隙，又因氣體分布在基體131及晶圓 黏膜組102之間，故可避免基體131碰觸到黏膜1〇21 ;又 如第六圖所示’吹氣口 1312吹出的氣體逐漸佈滿框架ιοί 及黏膜1021之間’導致框架1〇1及晶圓黏膜組1〇2分離； 最後’如第七至八圖所示，分離後的晶圓黏膜組1〇2吸附 在吸附機構14上，另外分離後的框架ιοί則經由移動裝置 10120686#單編號 A0101 第7頁/共24頁 1012022448-0 [0022]M435713 4收納至回收架3。 藉此，載具100安置於承放框12時，吹氣機構13及吸附機 構14同步朝載具100接近，且吹氣機構13下降之同時，吹 氣機構13會將氣體吹入框架1〇1及晶圓黏膜組1〇2之間， 使框架101及晶圓黏膜組102產生分離，再將分離後的晶 圓黏膜組102吸附在吸附機構14上，分離後的框架1〇1經 由移動裝置4收納至回收架3，以使框架1〇1與晶圓黏膜組 10 2剝離的方式達到自動化製程，進而節省人力、降低製 造成本及提1¾生產效率。 [0023] 另外’出風器132經由吹氣口1312導引吹至框架101及晶 圓黏膜組102之間的接縫處，使框架ιοί及晶圓黏膜組 102的分離係利用氣體均勻充滿在兩者之間，進而讓黏膜 1021之受力也均勻分佈’避免剝離下黏膜1〇2丨產生皺摺 或變形，使本創作離膜裝置於剝離過程中，其可有效地 維持黏膜1021的平整性。 [0024] 再者，吹氣機構13下降之同時，吹氣機構13會持續將氣 體吹入框架101及晶圓黏膜組1〇2之間，使氣體分布在基 體131及晶圓黏膜組1〇2之間，讓基體131及黏膜1〇21之 間皆具有一間隔空間，故可避免基體j 3丨碰觸到黏膜丨〇 2 j ，更加強維持黏膜1021的平整性。 [0025] 又，基體131的凹陷部1313和黏膜1〇21之間形成容置空 間134，使晶圓1〇22容置在容置空間134内，讓框架1〇1 與晶圓黏膜組102剝離的自動化製程中，晶圓1〇22被基體 131所保護，以避免晶圓1〇22於製程申受到損壞。 10120686^^^^ A0101 第8頁/共24頁 1012022448-0 M435713 [0026] 請參考第九至十圖所示，係本創作離膜裝置另一實施例 ，本創作離膜裝置更包括一貼保護貼裝置5、一貼離形纸 裝置6及一貼標籤裝置7,又移動裝置4包含一轉盤41’及 對應轉盤41’移動的固持器42,此轉盤41’對應承放框 12、貼保護貼裝置5、貼離形紙裝置6及貼標籤裝置7配置 ，固持器42固持框架101並移動於承放框12、貼保護貼裝 置5、貼離形紙裝置6及貼標籤裝置7之間。其中，貼保護 貼裝置5用以將保護貼貼於晶圓1022上，進而保護晶圓 1 022 ;貼離形紙裝置6用以將離形紙對應黏膜1021膠合 ，進而封裝晶圓1 022 ;貼標籤裝置7用以將標籤貼於離形 紙上，進而可標示晶圓1022的型號及料號。 [0027] 综上所述，本創作之晶圓黏膜組分離設備及其離膜裝置 ，確可達到預期之使用目的，而解決習知之缺失，並具 有產業利用性、新穎性與進步性，完全符合新型專利申 請要件，菱依專利法提出申請，敬請詳查並賜准本案專 利，以保障創作人之權利。 【圖式簡單說明】 [0028] 第一圖係本創作晶圓黏膜組分離設備之組合示意圖。 [0029] 第二圖係本創作離膜裝置之組合示意圖。 [0030] 第三圖係本創作離膜裝置之立體組合圖。 [0031] 第四圖係本創作離膜裝置之第一使用狀態示意圖。 [0032] 第五圖係本創作離膜裝置之第二使用狀態示意圖。 [0033] 第六圖係本創作離膜裝置之第三使用狀態示意圖。 10120686#單編號 A〇101 第9頁/共24頁 1012022448-0 M435713 [0034] 第七圖係本創作離膜裝置之第四使用狀態示意圖。 [0035] 第八圖係本創作離膜裝置之第五使用狀態示意圖。 [0036] 第九圖係本創作離膜裝置另一實施例之組合示意圖。 [0037] 第十圖係本創作離膜裝置另一實施例之另一組合示意圖 【主要元件符號說明】 [0038] 100…載具 [0039] 101…框架 [0040] 102…晶圓黏膜組 [0041] 1021…黏膜 [0042] 1 022…晶圓 [0043] 10…晶圓黏膜組分離設備 [0044] 1…離膜裝置 [0045] 11…架體 [0046] 12…承放框 [0047] 13…吹氣機構 [0048] 131…基體 [0049] 1311…風道 [0050] 1312…吹氣口 [0051] 131 3…凹陷部[0015] In addition, the air blower is blown to the joint between the frame and the wafer mucus group through the air blowing port, so that the separation of the frame and the wafer mucilage group is uniformly filled with gas between the two. In addition, the mucosa and the force are evenly distributed, so as to avoid wrinkles or deformation of the mucosa under the peeling, so that the separation device of the present invention can effectively maintain the smoothness of the mucosa during the stripping process. Furthermore, while the blowing mechanism is lowered, the blowing mechanism continuously blows the gas between the frame and the wafer mucilage group, so that the gas is distributed between the substrate and the wafer mucilage group, so that there is a between the substrate and the mucus. The space is separated, so that the substrate can be prevented from touching the mucosa, and the flatness of the mucosa can be maintained. Moreover, the recessed portion and the mucous membrane of the base body are enclosed together as an accommodating space, so that the wafer is accommodated in the accommodating space, and the wafer is protected by the substrate in an automated process for peeling off the frame and the wafer adhesive layer to avoid crystals. The circle was damaged during the process. [Embodiment] The detailed description and technical contents of the present invention will be described below with reference to the drawings, but the drawings are for illustrative purposes only and are not intended to limit the present invention. Please refer to the first to eighth figures. The present invention provides a wafer mucosa separation device and a film separation device thereof for a carrier 100. The carrier 100 includes a frame 101 and a wafer mucosa adhered to each other. The group 102, the wafer mucilage group 102 comprises a film 1021 and a wafer 1022 adhered to the film 1021. The wafer group separation device 10 mainly comprises a film separation device 1, a feeding frame 2, and a recycling frame 3. And a mobile device 4. The film separating device 1 comprises a frame body 11, a receiving frame 12, an air blowing mechanism 13 and a Lisa #单号A0101 page 5/24 pages 1012022448-0 M435713 an adsorption mechanism 14, the receiving frame 12 is arranged at The inside of the frame body 11, the receiving frame 12 can be a hollow plate or two brackets as shown in the first figure, and the receiving frame 12 has a positioning groove for positioning the frame ιοί; the air blowing mechanism 13 is fixed to the frame body. 11 is disposed above the receiving frame 12; the suction mechanism 14 is disposed below the receiving frame 12. [0016] In detail, the air blowing mechanism 13 includes a base body 131 and an air blower 132 and a lifter 133 installed in the base body 131. The outer peripheral edge of the base body 131 has a smaller outer diameter than the inner peripheral edge of the frame 101 and is provided with plural numbers. In the air duct 1311, the air inlets 1311 are formed on the base 131, and the air inlets 1312 are formed on the base 131. The frame 101 and the bonding layer of the wafer adhesive layer 1〇2 are disposed, and the base 131 is provided with a recessed portion 1313. The recessed portion 1313 and the wafer adhesive layer 102 form an accommodating space 134, so that the wafer 1 〇 22 is accommodated. The adsorption mechanism 14 includes a vacuum chuck 141 and a lifter 142 connected to the vacuum chuck 141. The adsorption mechanism 14 can also be made of a ceramic material. [0017] The feeding frame 2 and the recovery frame 3 are respectively disposed on the left and right sides of the receiving frame 12, and the feeding frame 2 is provided with a plurality of placing grooves for the storage of the carrier, and the recovery frame 3 is provided with a plurality of placing grooves. It is stored in the frame 101. 1012022448-0 [0018] The mobile device 4 holds the frame 101 and moves between the feeding frame 2, the receiving frame 12 and the recycling rack 3; the moving device 4 comprises a sliding rail 41 and a holder slidingly connected to the sliding rail 42. The portion of the slide rail 41 corresponds to the feeding frame 2, the receiving frame 12 and the recovery frame 3, so that the holder 42 can place the carrier 100 from the feeding frame 2 on the receiving frame 12' or the holder 42 The frame 101 can be placed on the recovery rack 3 by the receiving frame 12; in addition, the holder 42 can be a robot arm or a servo 1012〇686 production order number A01〇l page 6 / 24 pages M435713 clothes shaft, this A clamping member or an adsorbing member is mounted on the robot arm or the servo shaft. [0019] The combination of the creation of the wafer mucilage group separation device utilizes the film separation device 1 including the frame body 11 and the receiving frame 12 disposed inside the frame body, the air blowing mechanism 13, and the adsorption mechanism 14, the air blowing mechanism 13 is disposed above the receiving frame 12, the adsorption mechanism 14 is disposed below the receiving frame 12; the feeding frame 2 and the recovery frame 3 are respectively disposed on both sides of the receiving frame 12; and the moving device 4 holds the frame 1〇1 and The movement is between the feeding frame 2, the receiving frame 12 and the recycling frame 3. # [0020] The combination of the creation of the film separating device is disposed in the frame 11 by the receiving frame 12, the blowing mechanism 13 is disposed above the receiving frame 12, and the suction mechanism 14 is disposed in the receiving frame 12. Below. [0021] The use state of the present wafer mucilage group separation device and the film separation device thereof is as follows. First, as shown in the fourth figure, the mobile device 4 places the carrier 1 by the feeding frame 2 on the receiving frame 12. As shown in the fifth figure, the lifter 133 of the air blowing mechanism 13 drives the base body 131 toward the carrier 1 , direction, and the lifter 142 of the suction mechanism η also drives the vacuum chuck device 41 toward the carrier 丨When the direction of 00 is close and the substrate 131 is lowered, the air blower 132 generates a gas blowing air passage 1311, and is guided to the joint between the frame 1〇1 and the wafer mucus group 102 via the air blowing port 131 2 ' The gap between the frame ιοί and the wafer mucosa group 1〇2 is generated, and the gas is distributed between the substrate 131 and the wafer mucilage group 102, so that the substrate 131 can be prevented from touching the mucous membrane 1〇21; As shown in the sixth figure, the gas blown out by the blowing port 1312 gradually fills the frame between the frame ιοί and the mucous membrane 1021, causing the frame 1〇1 and the wafer mucosa group 1〇2 to separate; finally, as shown in the seventh to eighth figures, The separated wafer mucosa group 1〇2 is adsorbed on the adsorption mechanism 14, and the separated frame ιοί Receiving by the mobile device # 10120686 single A0101 Page number 7/24 p 1012022448-0 [0022] M435713 4 to the recovery frame 3. Thereby, when the carrier 100 is placed on the receiving frame 12, the blowing mechanism 13 and the suction mechanism 14 are simultaneously approached toward the carrier 100, and the blowing mechanism 13 is lowered, and the blowing mechanism 13 blows the gas into the frame 1〇. 1 and between the wafer mucosa group 1〇2, the frame 101 and the wafer mucilage group 102 are separated, and the separated wafer mucosa group 102 is adsorbed on the adsorption mechanism 14, and the separated frame 1〇1 is moved. The device 4 is housed in the recovery rack 3 to achieve an automated process in which the frame 1〇1 and the wafer adhesive film group 102 are peeled off, thereby saving labor, reducing manufacturing costs, and improving production efficiency. [0023] In addition, the air blower 132 is guided to the joint between the frame 101 and the wafer mucilage group 102 via the air blowing port 1312, so that the frame ιοί and the wafer mucilage group 102 are uniformly filled with gas by the gas. Between the two, the force of the mucous membrane 1021 is evenly distributed to avoid wrinkles or deformation of the mucosa 1 〇 2 剥离, so that the separation device of the present invention can effectively maintain the smoothness of the mucosa 1021. . [0024] Furthermore, while the air blowing mechanism 13 is lowered, the air blowing mechanism 13 continues to blow the gas between the frame 101 and the wafer mucosa group 1〇2, so that the gas is distributed in the substrate 131 and the wafer mucosa group. Between the two, the substrate 131 and the mucosa 1 〇 21 have a space between them, so that the substrate j 3 丨 can be prevented from touching the mucous membrane 丨〇 2 j , and the flatness of the mucosa 10 1 can be maintained. [0025] Further, an accommodating space 134 is formed between the recessed portion 1313 of the base 131 and the mucous membrane 1 , 21, so that the wafer 1 〇 22 is received in the accommodating space 134, and the frame 1 〇 1 and the wafer mucosa group 102 are disposed. In the automated process of stripping, the wafers 1 22 are protected by the substrate 131 to avoid damage to the wafers 1 22 in the process. 10120686^^^^ A0101 Page 8/24 pages 1012022448-0 M435713 [0026] Please refer to the ninth to tenth drawings, which is another embodiment of the present membrane separation device, and the creation of the film separation device further includes a sticker. a protective device 5, a sticker release device 6 and a labeling device 7, and the mobile device 4 includes a turntable 41' and a holder 42 corresponding to the movement of the turntable 41', the turntable 41' corresponding to the receiving frame 12, the sticker protection The attaching device 5, the detaching paper device 6 and the labeling device 7 are disposed, and the holder 42 holds the frame 101 and moves between the receiving frame 12, the affixing device 5, the detaching paper device 6, and the labeling device 7. Wherein, the sticker protection device 5 is used for attaching the protection to the wafer 1022, thereby protecting the wafer 1 022; the release paper device 6 is used for bonding the corresponding adhesive film 1021 of the release paper, thereby packaging the wafer 1 022; The labeling device 7 is used to attach the label to the release paper, thereby indicating the type and material number of the wafer 1022. [0027] In summary, the wafer mucilage separation device and the film separation device of the invention can achieve the intended use purpose, and solve the lack of the prior art, and have industrial utilization, novelty and progress, completely In accordance with the requirements for new patent applications, Ling applied for the patent law, please check and grant the patent in this case to protect the rights of the creator. [Simple Description of the Drawings] [0028] The first figure is a combination diagram of the separation device of the wafer mucilage group. [0029] The second figure is a schematic diagram of the combination of the present membrane separation device. [0030] The third figure is a three-dimensional combination diagram of the present invention. [0031] The fourth figure is a schematic diagram of the first use state of the present membrane separation device. [0032] The fifth figure is a schematic diagram of the second state of use of the present membrane separation device. [0033] The sixth figure is a schematic diagram of the third use state of the present membrane separation device. 10120686#单号 A〇101 Page 9 of 24 1012022448-0 M435713 [0034] The seventh figure is a schematic diagram of the fourth state of use of the present membrane separation device. [0035] The eighth figure is a schematic diagram of the fifth use state of the present membrane separation device. [0036] The ninth drawing is a schematic diagram of a combination of another embodiment of the present invention. [0037] FIG. 10 is another schematic diagram of another combination of the present embodiment of the film separation device [main element symbol description] [0038] 100... vehicle [0039] 101... frame [0040] 102... wafer mucosa group [ 0041] 1021...mucosa [0042] 1 022...wafer [0043] 10...wafer mucosa separation device [0044] 1...off film device [0045] 11...frame [0046] 12... receiving frame [0047] 13...blowing mechanism [0048] 131...substrate [0049] 1311...air duct [0050] 1312...blowing port [0051] 131 3...recessed portion
10120686^^^ A〇101 第10頁/共24頁 1012022448-0 M435713 [0052] 132…出風器 [0053] 133…升降器 [0054] 134…容置空間 [0055] 14…吸附機構 [0056] 141…真空吸盤器 [0057] 142…升降器 [0058] • • [0059] 2…進料架 3…回收架 [0060] 4…移動裝置 [0061] 41…滑轨 [0062] 41’…轉盤 [0063] 42···固持器 [0064] 5…貼保護貼裝置 • [0065] 6…貼離形紙裝置 [0066] 7…貼標籤裝置 10120686#單編號 A〇101 ^ 11 1 / ^ 24 I 1012022448-010120686^^^ A〇101 Page 10/24 pages 1012022448-0 M435713 [0052] 132...air blower [0053] 133...lifter [0054] 134...accommodation space [0055] 14...adsorption mechanism [0056] 141...vacuum suction cup [0057] 142...lifter [0058] • [0059] 2...feed rack 3...recycling rack [0060] 4...moving device [0061] 41...slide rail [0062] 41'... Turntable [0063] 42···Retainer [0064] 5...Paste protection device • [0065] 6...Paste release paper device [0066] 7...Tag labeling device 10120686#单号A〇101 ^ 11 1 / ^ 24 I 1012022448-0