M427767 五、新型說明： f新型所屬之技術領域j 本創作係一種散熱模組之固定結構，其尤指組裝在一起之各散熱鰭片 與熱導管之組接結構，而使熱導管與熱導管孔可緊密結合在一起而無介面 熱阻，進而能增加熱傳導效率者。 【先前技術】 按，習知散熱裝置已多有利用熱導管作為將電滕及電子設備上所產生 之熱源有效向外界導出之技術，其熱導管内部係設有適當之毛細组織(wick • structure) ’藉由毛細組織之毛細管作用，可將熱導管連接於電腦主機内 部微處理器(CPU)或其高溫晶片等發熱元件上，以便利用熱導管將發熱元件 上之熱傳導出’可用以協助散熱，俾能有效使發熱元件能正常工作。 而一般習用散熱鰭片與熱導管之固定結構’包括有散熱鰭片及熱導 管，其t該散熱鰭片上設有貫穿之熱導管孔，使用時，係將該熱導管依序 穿套於該散熱鰭片上之熱導管孔中，由於該等熱導管孔係以緊配合方式套 在熱導管上，如此一來，如果該散熱鰭片之熱導管孔與熱導管之外徑有誤 差時，容易造成密合度差’且會增加介面熱阻，所以熱傳導效率甚為不佳。 鲁 為了改進上述之缺點，即有一種藉由熔焊方式，使散熱鰭片及熱導管 結合在一起之固定結構’請參照第1圖所示，該結構包含有： 一以銅製成之熱導管100 ; 以及複數個金屬製成之鰭片200’該錄片200上係設有貫通之熱導管孔 210，熱導管孔210上之一側延伸出接合部211，並於熱導管孔21〇上緣設 有一口徑較小之細孔220，該等鰭片200係藉熱導管孔21〇套接於該熱導管 100上，並將由銀、錫或銅絲所構成之金屬絲3〇〇置入於散熱鰭片2〇〇上緣 之細孔220中，再以熱熔方式將金屬絲300熔融，使金屬絲3〇〇流入熱導 管孔210中，而使熱導管100與散熱鰭片200接合成為一體。 如此，雖可透過金屬絲300之熔融，使熱導管1〇〇與散熱鰭片2〇〇接 3 M427767 合成為一體’且金屬絲300中含有銅，與由銅製成之熱導管100與散熱鰭 片200可因材質相同，所以能較快速將熱傳導出去，不會因連接之間之介 質不同而有介面阻質產生，惟在使用時，因細孔220及熱導管孔210相連 通’所以當熱導管1〇〇穿套在熱導管孔21〇中時，散熱鰭片200與熱導管 100會有一段缺口’如此會造成熱導管孔210與熱導管1〇〇並無法緊配合， 而且熱導管100與散熱鰭片200之接觸面積減少，會直接影響熱傳導時之 效率。 再者，請參照第2圖所示，其為另一種習用結構，其設有一片以上金 屬製成之散熱鰭片400 ’該等散熱鰭片400上分別設有貫通之熱導管孔 410,該等熱導管孔410邊緣分別設有透過沖壓該散熱鰭片400而向外翻折 之接合部420，該接合部420上設有缺槽421，使其接合部420具有彈性， 且該熱導管孔410中分別穿設有熱導管500，如此，雖可藉由該接合部420 之缺槽421解決與熱導管500之外徑圍公差之緊配合不週問題，但卻造成 緊配合之壓力不足。 【新型内容】 為改進上述習用裝置構造之各種缺點，創作人經過長久努力研究與實 驗，終於開發設計出一種散熱模組之固定結構》 本創作之一目的，在提供一種散熱模組之固定結構，該結構上設有複 數個組接在一起之散熱鰭片’该等散熱鰭片上分別設有貫通之熱導管孔， 該等熱導管孔邊緣分別設有透過沖壓該散熱錄而向外翻折之接合部，該 接合部上設有缺槽，且熱導管孔中分別穿設有熱導管；另，該等散熱錄片 在鄰近熱導管孔處開設有壓口’藉由將該麼口之裂縫擴大而形成向熱導管 孔方向緊壓，對在熱導管孔中之熱導管形成緊配合之第二道壓力，使散熱 鰭片及熱導管緊密結合在一起’使散熱鰭片及熱導管結合在一起之熱傳導 效率更佳》 【實施方式】 M427767 本創作係一種散熱模組之固定結構，請參閱第3、3a圈所示，其為本 創作第一實施例’該結構上設有複數個散熱鰭片1〇,該等散熱鰭片1〇上分 別設有貫通之熱導管孔12,該等熱導管孔12邊緣分別設有透過沖壓該散熱 鰭片10而向外翻折之接合部13，該接合部13上設有缺槽14(於本實施例 該缺槽與熱導管孔相連通），且該熱導管孔12中分別穿設有熱導管20;另， 該等散熱鰭片10在鄰近該熱導管孔12處開設有壓口 15(於本實施例為一裂 縫）(於本實施例係鄰近於該接合部設有缺槽之一側），該壓口 15並與熱導 管孔12保持一定間距。 請參閱第3b、3c圖所示，當熱導管2〇穿設在熱導管孔12中時，除透 過熱導管孔12及接合部13給予該熱導管2〇適當緊配合壓力外，再將該壓 口 15之裂縫擴大而形成向熱導管孔12方向緊壓，對在該熱導管孔12中之 熱導管20形成緊配合之第二道壓力，而減少該熱導管2〇與散熱錄片間 之介面阻質產生，以增加熱傳導效率者。 請參照第4、4a圈所示，其為本創作第二實施例，其設有複數個之散 熱鰭片10,該等散熱鰭片1〇邊緣分別設有向内弩折之折片u(圖中未示” 該等折片11分別設有組接結構，該等組接結構與現今一般組接結構相同， 且非為本創作之改進重點，故在此不另贅述，藉由該等組接結構之組接， 而連結在一起。 另，該等散熱鰭片10上分別設有貫通之熱導管孔12，該等熱導管孔 12邊緣分別設有透過沖壓該散熱鰭片1〇而向外翻折之接合部13，該接合 部13上設有缺槽14(於本實施例該缺槽與熱導管孔相連通），且該熱導管孔 12中勿別穿設有熱導管2〇 ;另該等散熱館片在鄰近於該熱導管孔〗2之 至少-邊緣職有.⑸於本實闕為—凹人）（於本實補係鄰近於該 接合部設有缺槽之一側），該壓口 15並與熱導管孔12保持一定間距。 當熱導管20穿設在熱導管孔12令時，除透過熱導管孔12及接合部13 給予該熱導管20適當緊配合壓力外，再將該壓口 15之向熱導管孔12方向 緊屋變形’對在該熱導管孔12甲之熱導管2〇形成緊配合之第二道屋力， 5 M427767 而減少該熱導管20與散熱鰭片10間之介面阻質產生，以增加熱傳導效率 者。 ’’ 請參照第5圖所示，將熱導管20與該等散熱鰭片1〇穿套在一起後， 將其與發熱元件30(於本實施例為微處理器）接觸，並將發熱元件3〇所產生 的熱藉由熱導管2〇導引至他處，以增加熱傳導效率者。 請參照第6圖所示，將熱導管20與該等散熱鰭片1〇穿套在一起後， 將其與發熱元件30直接接觸，以增加熱傳導效率者。 综上所述，本創作在物品、形狀、構造、裝置上眉首先創作，且可改 良習用技術之各種缺點，在使用上能增進功效，合於實用，充分符合新型 專利要件，實為一理想之創作。 【圖式簡單說明】 第1圓··為習用裝置之示意圊。 第2圖：為另一習用裝置之示意圖。 第3圓：為本創作第一實施例之立體示意圊。 第3a囷：為第3a圖之部分放大示意圖。 第3b圓：為本創作第一實施例之斷面示意囷。 第3c圖：為本創作第一贲施例之作動示意圖。 第4圖：為本創作第二實施例之斷面示意圓。 第4a圖：為本創作第二實施例之作動示意圓。 第5圖：為本創作第二實施例實施時之立體示意圖。 第6圖：為本創作第二實施例實施時之又一立體示意圊。 【主要元件符號說明】 散熱錯片 10 折片 11 熱導管孔 接合部 13 M427767 缺槽 14 壓口 15 熱導管 20 發熱元件 30M427767 V. New description: f New technology field belongs to this article j This is a fixed structure of a heat dissipation module, especially the assembled structure of the heat dissipation fins and heat pipes assembled together, and the heat pipe and heat pipe The holes can be tightly bonded together without the interface thermal resistance, which in turn increases the heat transfer efficiency. [Prior Art] According to the conventional heat dissipating device, a heat pipe has been frequently used as a technology for efficiently radiating heat generated from electric and electronic devices to the outside, and the inside of the heat pipe is provided with appropriate capillary structure (wick • Structure) 'By capillary action of capillary structure, the heat pipe can be connected to a heating element such as a microprocessor (CPU) or a high-temperature chip of the host computer, so that heat can be conducted from the heat-generating component by means of a heat pipe. Heat dissipation, 俾 can effectively make the heating element work properly. The fixed structure of the conventional heat sink fin and the heat pipe includes a heat sink fin and a heat pipe, and the heat sink fin is provided with a heat pipe hole penetrating therein. In the heat pipe hole on the heat dissipation fin, since the heat pipe holes are tightly fitted on the heat pipe, if the heat pipe hole of the heat dissipation fin has an error with the outer diameter of the heat pipe, it is easy The difference in the degree of adhesion is 'and the interface thermal resistance is increased, so the heat transfer efficiency is very poor. In order to improve the above shortcomings, Lu has a fixed structure in which the heat dissipating fins and the heat pipe are combined by welding. Please refer to FIG. 1 , the structure includes: a heat pipe made of copper And a plurality of fins 200 made of metal; the recording sheet 200 is provided with a through-hole heat pipe hole 210, and one side of the heat pipe hole 210 extends from the joint portion 211 and is disposed on the heat pipe hole 21 The edge is provided with a small diameter hole 220, and the fins 200 are sleeved on the heat pipe 100 by a heat pipe hole 21, and the wire 3 made of silver, tin or copper wire is placed. In the fine hole 220 of the upper edge of the heat dissipation fin 2, the wire 300 is melted by hot melt, and the wire 3 flows into the heat pipe hole 210 to bond the heat pipe 100 and the heat dissipation fin 200. Be one. In this way, although the heat of the wire 300 is fused, the heat pipe 1 〇〇 is connected to the heat sink fin 2 3 M427767, and the wire 300 contains copper, and the heat pipe 100 and the heat sink fin made of copper. Because the material of the sheet 200 is the same, the heat can be conducted out quickly, and the interface is not generated due to the difference of the medium between the joints. However, when used, the pores 220 and the heat pipe holes 210 are connected. When the heat pipe 1 is inserted into the heat pipe hole 21, the heat sink fin 200 and the heat pipe 100 may have a gap. This may cause the heat pipe hole 210 and the heat pipe 1 to not fit tightly, and the heat pipe The reduced contact area between the 100 and the heat sink fins 200 directly affects the efficiency of heat conduction. Furthermore, please refer to FIG. 2 , which is another conventional structure, which is provided with a heat dissipation fin 400 made of more than one metal. The heat dissipation fins 400 are respectively provided with through heat pipe holes 410. The edge of the equal heat pipe hole 410 is respectively provided with a joint portion 420 which is folded outward by punching the heat radiating fin 400. The joint portion 420 is provided with a notch 421, so that the joint portion 420 has elasticity, and the heat pipe hole is The heat pipe 500 is respectively disposed in the 410. Therefore, the problem of the tight fit of the outer diameter tolerance of the heat pipe 500 can be solved by the notch 421 of the joint portion 420, but the pressure of the tight fit is insufficient. [New content] In order to improve the various shortcomings of the above-mentioned conventional device construction, the creator has been working hard to study and experiment, and finally developed a fixed structure of a heat dissipation module. One of the purposes of this creation is to provide a fixed structure of a heat dissipation module. The structure is provided with a plurality of heat-dissipating fins that are connected together. The heat-dissipating fins are respectively provided with through-hole heat-conducting holes, and the edges of the heat-conducting tube holes are respectively folded outward by punching the heat-dissipating recording a joint portion, the joint portion is provided with a notch, and a heat pipe is respectively disposed in the heat pipe hole; and the heat-dissipating film is opened at a position adjacent to the heat pipe hole by using the pressure port The crack is enlarged to form a pressure in the direction of the heat pipe hole, and the second pressure of the heat pipe in the heat pipe hole is tightly fitted, so that the heat sink fin and the heat pipe are tightly combined together to make the heat sink fin and the heat pipe joint The heat transfer efficiency is better together [Embodiment] M427767 This is a fixed structure of a heat dissipation module, please refer to the circle of 3, 3a, which is the first embodiment of the creation. The structure is provided with a plurality of heat-dissipating fins 1 , and the heat-dissipating fins 1 are respectively provided with through-hole heat pipe holes 12 , and the edges of the heat pipe holes 12 are respectively provided through the punching of the heat-dissipating fins 10 a flanged joint portion 13 having a notch 14 (in the embodiment, the notch is in communication with the heat pipe hole), and the heat pipe hole 12 is respectively provided with a heat pipe 20; The heat dissipation fins 10 are provided with a pressure port 15 (in the embodiment, a crack) adjacent to the heat pipe hole 12 (in this embodiment, a side of the gap is provided adjacent to the joint portion), the pressure is The port 15 is spaced from the heat pipe aperture 12 by a distance. Referring to FIGS. 3b and 3c, when the heat pipe 2 is bored in the heat pipe hole 12, in addition to the heat pipe hole 12 and the joint portion 13, the heat pipe 2 is appropriately tightly fitted to the pressure. The crack of the pressure port 15 is enlarged to form a pressing force in the direction of the heat pipe hole 12, and a second pressure is formed to the heat pipe 20 in the heat pipe hole 12, and the heat pipe 2〇 and the heat-dissipating film are reduced. The interface is produced to increase the heat transfer efficiency. Please refer to the fourth and fourth circle, which is a second embodiment of the present invention, which is provided with a plurality of heat dissipating fins 10, and the fins of the fins are respectively provided with flaps u which are folded inwardly ( The flaps 11 are respectively provided with an assembly structure, and the assembly structures are the same as the current general assembly structure, and are not the focus of the improvement of the creation, so no further details are provided herein. The heat dissipating fins 10 are respectively provided with through heat pipe holes 12, and the edges of the heat pipe holes 12 are respectively provided by punching the heat dissipating fins An outwardly folded joint portion 13 is provided with a notch 14 (in the embodiment, the notch is in communication with the heat pipe hole), and the heat pipe hole 12 is not provided with a heat pipe 2另; the other heat dissipation panels are adjacent to at least the edge of the heat pipe hole 〖2. (5) in the present embodiment is a concave person (the ridge is provided adjacent to the joint portion with a vacant groove) One side), the pressure port 15 is kept at a certain distance from the heat pipe hole 12. When the heat pipe 20 is disposed in the heat pipe hole 12, except for the heat transmission hole 12 And the joint portion 13 is given a proper tight fitting pressure to the heat pipe 20, and then the pressure port 15 is deformed in the direction of the heat pipe hole 12 to form a tight fit to the heat pipe 2 of the heat pipe hole 12 Two-way house force, 5 M427767, reduces the interface resistance between the heat pipe 20 and the heat-dissipating fins 10 to increase the heat transfer efficiency. '' Please refer to Figure 5, the heat pipe 20 and the heat-dissipating fins After the sheet 1 is put together, it is brought into contact with the heat generating component 30 (microprocessor in this embodiment), and the heat generated by the heat generating component 3〇 is guided to the other by the heat pipe 2〇, If the heat transfer efficiency is increased, please refer to Fig. 6, after the heat pipe 20 and the heat radiating fins 1 are put together, and then directly contacted with the heat generating component 30 to increase the heat transfer efficiency. This creation first creates the eyebrows on the object, shape, structure and device, and can improve various shortcomings of the conventional technology. It can enhance the effect in use, is practical, and fully conforms to the new patent requirements, which is an ideal creation. Simple description of the schema] The first circle·· is Schematic diagram of a conventional device. Fig. 2 is a schematic view of another conventional device. Third circle: a three-dimensional representation of the first embodiment of the creation. Section 3a: an enlarged view of a portion of the 3a figure. The schematic diagram of the first embodiment of the present invention is shown in Fig. 3c: a schematic diagram of the operation of the first embodiment of the creation. Fig. 4 is a schematic cross-sectional view of the second embodiment of the creation. It is a schematic diagram of the second embodiment of the present invention. Fig. 5 is a perspective view of the second embodiment of the present invention. Fig. 6 is another perspective view of the second embodiment of the present invention. [Description of main component symbols] Heat-dissipating chip 10 Folding 11 Heat pipe hole joint 13 M427767 Notch 14 Pressure port 15 Heat pipe 20 Heating element 30