五、新型說明： 【新型所屬之技術領域】 本創作有[種表面具壓應力層_的玻璃基板，尤指一種 5金化玻璃在其板體上具有料化面局部區域，藉此便於對該強化 破璃進行切割或分裂的加工。 【先前技術】 強化玻璃是-種職力玻璃。習知的玻翻化方式主要有兩 種’-種是熱強化方式，另-種是化學離子強化方式；其中，熱 強化方式是將賴>{加細A於賴應魏但在賴軟化點以下 的溫度迅速冷㈣璃應的溫度，在賴表面產生壓應力 層，以增加玻魏性；至於化學離子強化，係將待強化的玻璃片（例 如鈉玻璃)浸浴在熔融的玻璃強化液(例如鉀鹽）中，使強化液中的 大型離子(例如κ+，鉀離子)取代玻璃片上小型離子(例如Na+，鈉 離子）’由於這種置換作用，將其抵抗拉應力的壓應力層預先置入 玻璃表面，實現了玻璃強化的目的。目前無論是哪一種玻璃強化 方式’都疋對玻璃板的”全部表面’’進行強化加工，甚包含無實益 或不需要的玻璃板表面部分。但因強化玻璃板體内的壓應力會使 切割或为裂的加工更加困難，尤其使用機械刀具來切割強化層深 度超過約20微米、壓縮應力大於約4〇〇MPa的強化玻璃時，通常 會造成無法控制的裂隙傳播，導致玻璃的碎裂，而且即使玻璃板 體被順利分割，也可能會產生很差的邊緣品質，特別是在較厚玻 璃片。誠如前述，經強化後的玻璃會使加工性變差，所以對玻璃 M427383 板的切割、鑽孔或打磨等相關的加工大多必須在強化處理前事先 進行，否則經強化後的玻璃板將難以再進行加工，這結果已嚴重 限縮了強化玻璃板在各式面板製程方面的應用，例如在面板製作 時只能採賴解元逐-生產方式，亦即，縣將玻璃基板切割 成個別單元所S財規格的小料，織再分別職等已分割的 小片料各別實航置所㈣電路等面板生產製程；但因面板製程 具有精密性及繁複性，所以前述個別單元逐—生產面板的方式其 生產效率低^，且因玻璃基板被分割成小尺寸的片料，導致在面 板製程巾賴位祕_，魏果不伽缝產技術上的瓶 頸，更造成使產品不良率高居不下的缺失。 【新型内容】 本創作提供-種表面具麼應力層圖案的玻璃基板，可在玻璃 基板表面形成預設的強化面及非強化面之局部區域，因此在該玻 璃基板表面_化面局规域可增加玻璃抗性，促進抵擋碎裂和 刮痕之效能，而在非強化面之局部區域财保持加工性，使玻璃 基板便於進行切割、分裂或研磨等加工。 為達上述創作目的，本創作所提供之表面具璧應力層圖案的 玻璃基板，其於玻璃基板上的至少—表面具錢應力層圖案，該 ___可在該表面界定出複數具備不同愿應力的局部區 域:在-可行實施财’雜應力層_具有若干個高麵力區 域係由健應力區域予分隔開來，而高_力區域與低虔應力區 域之間的麵力差異值在励购以上，或是顧力層深度差異 M427383 值在5μιη以上；其中，該低壓應力區域的壓應力值在400 MPa以 下’最好是等於或趨近0 MPa，該高壓應力區域的壓應力值範圍 約在lOOMPa到800Mpa，或是令該低壓應力區域的壓應力層深度 範圍約0到20μιτι，而該高壓應力區域的壓應力層深度範圍約5μηι 到90μηι;因此本創作之玻璃基板在高壓應力區域形成高強度的局 部區域可供製作各式面板的透明基板或蓋板，而在該等低壓應力 區域則仍可保持優良的加工性，使玻璃基板即使經強化處理後， • 仍可藉由對玻璃基板的低壓應力區域進行切割、分裂或研磨等加 工，據此可克服習知強化玻璃板應用在面板製程方面的限制，達 提升生產效率及品質良率之目的。 月ίΐ述玻璃基板的上、下表面至少之一為平坦面，而該平坦面 的另一對應表面可為平坦面或非平坦面，例如是凸面、凹面或凸 凹面等，理想的玻璃基板是選用一平板玻璃，且其板體厚度小於 5mm ’该玻璃基板材料是選自於納|弓;g夕酸鹽玻璃、紹石夕酸鹽玻璃… 鲁等’但實施的材料範圍不以.前述材料為限。 在通常的實施態樣中，該玻璃基板於設有壓應力層圖案之表 面的相對應表面上設有一均勻壓應力層，以避免玻璃基板的二表 面之間的壓應力差異過大產生鍾曲變形，而該均勾壓應力層約略 與前述低壓應力區域相同，其壓應力層深度範圍約〇到2〇μπι以 下’壓應力值在400 MPa以下。 在本創作的另一可行實施例中，該玻璃基板的上、下表面可 分別設有壓應力層_，其中，在該上、下表_壓應力層圖案 5 M427383 係可選擇的呈彼此對應或不對應地設置。 此將於下文中進一步闡明本創作的其他功能及技術特徵，熟 習本技術者熟讀文巾的軸後即可據以實現本創作。 【實施方式】 如第一至二圖所示’本創作之玻璃基板在其上表面上藉由化 學強化玻璃手段以形成壓ϋ力層®案f，在該應力層si案中包含 若干高壓應力區域12與低壓應力區域13，藉由低壓應力區域13 而將該等高壓應力區域12彼此之p粉隔設置，因此在該玻璃基板 的表面上界定出具備可抵擋碎裂和刮痕的高壓應力區域12(即，強 化區域）’以及具備切割、分裂和研磨加工性的低壓應力區域 13(即’非強化或低強化區域）。 在一較佳實施例中’該玻璃基板選用一板體厚度約為1 mm(毫米)的平板型鈉玻璃，利用化學強化玻璃手段，將玻璃基板 次潰在熔態的鉀鹽浴池中，以在玻璃基板表面形成預設的壓應力 層圖案’使設置壓應力層圖案的局部區域表面增加玻璃抗性，而 其他的局部區域表面則仍保持優良的切割加工性。其中，在該玻 璃基板表面的低壓應力區域13，其壓應力層深度範圍約〇到 20μηι(微米)以下，壓應力值在棚MPa以下，而該高壓應力區域 12的壓應力層深度範圍從約5微米到9〇微米，壓應力範圍約在 lOOMPa到800MPa。在上述實施例中，該玻璃基板表面被區分成 向、低壓應力區域12、13，但在表面上任意二相鄰的區域之間的 壓應力差異值在lOOMPa以上，或是壓應力層深度差異值在5^m M427383 以上。 不同於習知強化玻璃的應用方式，本創作的玻璃基板可以預 先進行玻璃強化製程，也不會減損其切割、分裂和研磨等加工性； 例如本創作的玻璃基板可應用在各式面板的生產製造，將面板結 構的相關電路及元件製作在該等高壓應力區域12内的表面上，然 後利用對低壓應力區域13進行切割、分裂和研磨等後加工，以克 服習知強化玻璃板應用在面板製程方面的限制，並達提升生產效 _ 率及品質良率之目的。 可理解的’在前述實施例中，該玻璃基板的上表面具有壓應 力層圖案F ’而與其相對應的下表面亦可設置一均勻壓應力層14 (詳如第三圖所示）’以防玻璃板體表面壓應力差異過大產生翹曲變 形’通常該均勻壓應力層14約略與前述低壓應力區域13相同， 其壓應力層深度範圍約〇到20μηι以下，壓應力值在400 MPa以 下。 第四、五圖中顯示本創作的另一實施例，該玻璃基板在上、 下表面均設有壓應力層圖案F、F，，且該等上、下表面的壓應力層 圖案係呈彼此對應設置’亦即在玻璃基板上表面的高壓應力區域 12係與下表面的高壓應力區域12’位置對應’而在玻璃基板上表面 的低壓應力區域13係與下表面的低壓應力區域13,位置對應；因 此除可保持玻璃板體上下表面的壓應力平衡、避免產生輕曲變形 之外’在s亥玻璃基板的高壓應力區域表面可倍增玻璃抗性，而其 他的低壓應力區域表面則仍可保持優良的切割加工性。 7 M427383 本創作並非侷限於以上所述形式，很明顯參考上述說明後， 能有更多技術均等性的改良與變化’是以，凡有在相同之創作精 神下所作有關本創作之任何修飾或變更，皆仍應包括在本創作意 圖保護之範疇。 【圖式簡單說明】 第一圖為本創作實施例之立體圖； 第二圖為本創作實施例之側視剖面圖； 第二圖為本創作另一實施例之側視剖面圖； 第四圖為本創作再一實施例之立體圖；以及 第五圖為本創作再—實施例之側視剖面圖。 【主要元件符號說明】 壓應力層圖案F、p 高壓應力區域12、12， 低壓應力區域13、13， 均勻壓應力層14V. New description: [New technical field] This creation has [a glass substrate with a compressive stress layer on the surface, especially a kind of 5 gold glass with a localized area on the plate body, which is convenient for The reinforced glass is cut or split. [Prior Art] The tempered glass is a kind of glass. There are two main types of glass doubling methods: the one is a heat-enhanced method, and the other is a chemical ion-enhanced method. Among them, the heat-enhanced method is to reinforce the </ br> The temperature below the point is rapidly cooled (four), the temperature of the glass should be, and the compressive stress layer is generated on the surface to increase the glassy property; as for the chemical ion strengthening, the glass piece to be strengthened (for example, soda glass) is bathed in the molten glass fortification. In a liquid (such as a potassium salt), a large ion (for example, κ+, potassium ion) in the strengthening solution is substituted for a small ion (for example, Na+, sodium ion) on the glass sheet, and the compressive stress against tensile stress is caused by this displacement. The layer is placed on the glass surface in advance to achieve the purpose of glass reinforcement. At present, no matter which kind of glass strengthening method is used, it will strengthen the entire surface of the glass sheet, and it will contain the surface part of the glass sheet which is not beneficial or unnecessary. However, it will cut due to the compressive stress in the strengthened glass sheet. Or more difficult to process cracks, especially when using mechanical cutters to cut tempered glass with a depth of more than about 20 microns and a compressive stress greater than about 4 MPa, which often causes uncontrolled crack propagation, resulting in cracking of the glass. Moreover, even if the glass plate is smoothly divided, it may produce poor edge quality, especially in thick glass sheets. As mentioned above, the strengthened glass may deteriorate the workability, so the glass M427383 plate is cut. Most of the related processing such as drilling or grinding must be carried out before the strengthening treatment. Otherwise, the strengthened glass sheet will be difficult to process, which has severely limited the application of the tempered glass sheet in various panel processes. For example, in the production of panels, only the production method can be adopted, that is, the county cuts the glass substrate into individual units. The small materials, weaving and separate grades of separate small pieces of material, each of the actual space (4) circuit and other panel production processes; but because of the precision and complexity of the panel process, the above-mentioned individual units are produced in a production-by-panel manner The efficiency is low, and because the glass substrate is divided into small-sized sheets, the bottleneck in the panel manufacturing process, the bottleneck of the Weiguo non-gauge production technology, and the lack of product defect rate are high. The new content] This creation provides a glass substrate with a stress layer pattern on the surface, which can form a predetermined strengthening surface and a partial area of the non-reinforced surface on the surface of the glass substrate, so that the surface of the glass substrate can be defined. Increase the glass resistance, promote the resistance to chipping and scratching, and maintain the processability in the local area of the non-reinforced surface, making the glass substrate easy to cut, split or grind. For the above purpose, the creative office Providing a glass substrate having a surface with a stress layer pattern, wherein at least a surface of the glass substrate has a pattern of a stress stress layer, wherein the ___ can define a plurality of Local areas of different stresses: in the feasible implementation of the 'complex stress layer _ with several high-potential areas separated by the healthy stress area, and the surface force between the high-force area and the low-lying stress area The difference value is above the ex-sale, or the depth difference M427383 is above 5μιη; wherein the compressive stress value of the low-pressure stress region is below 400 MPa', preferably equal to or close to 0 MPa, the high-pressure stress region The compressive stress value ranges from about 100 MPa to 800 MPa, or the compressive stress layer depth of the low pressure stress region ranges from about 0 to 20 μm τι, and the compressive stress layer depth of the high pressure stress region ranges from about 5 μηι to 90 μηι; therefore, the glass substrate of the present invention Forming a high-strength localized region in the high-pressure stress region can be used to fabricate transparent substrates or cover plates of various types of panels, and in such low-pressure stress regions, excellent processability can be maintained, so that even after the glass substrate is strengthened, By cutting, splitting or grinding the low-pressure stress region of the glass substrate, it is possible to overcome the limitation of the conventional tempered glass plate application in the panel process. System, to improve production efficiency and quality yield. At least one of the upper and lower surfaces of the glass substrate is a flat surface, and the other corresponding surface of the flat surface may be a flat surface or a non-flat surface, such as a convex surface, a concave surface or a convex and concave surface, etc., and an ideal glass substrate is A flat glass is selected, and the thickness of the plate body is less than 5 mm. The material of the glass substrate is selected from the group consisting of nano-bow; g-salt glass, shoal acid glass, etc. but the material range of the implementation is not The material is limited. In a typical embodiment, the glass substrate is provided with a uniform compressive stress layer on a corresponding surface provided with a surface of the compressive stress layer pattern to avoid excessive bending stress difference between the two surfaces of the glass substrate to generate a bell-shaped deformation. The pressure stress layer is approximately the same as the low pressure stress region, and the compressive stress layer has a depth ranging from about 2 〇μπι to less than 400 MPa. In another possible embodiment of the present invention, the upper and lower surfaces of the glass substrate may be respectively provided with a compressive stress layer _, wherein the upper and lower _ compressive stress layer patterns 5 M427383 are selectively corresponding to each other. Or not set accordingly. This will further clarify other functions and technical features of the present work, which can be achieved by those skilled in the art after reading the axis of the towel. [Embodiment] As shown in the first to second drawings, the glass substrate of the present invention is formed on the upper surface thereof by chemically strengthened glass to form a pressure layer® f, and the stress layer si includes a plurality of high-pressure stresses. The region 12 and the low-pressure stress region 13 are disposed apart from each other by the low-pressure stress region 13 so that high-pressure stresses capable of resisting chipping and scratches are defined on the surface of the glass substrate. Region 12 (i.e., strengthening region)' and low pressure stress region 13 (i.e., 'non-reinforced or low strengthening region') having cutting, splitting, and grinding processability. In a preferred embodiment, the glass substrate is a flat-type soda glass having a thickness of about 1 mm (millimeter), and the glass substrate is crushed in a molten potassium salt bath by chemically strengthened glass. Forming a predetermined compressive stress layer pattern on the surface of the glass substrate increases the glass resistance of the localized surface of the pattern of the compressive stress layer, while the other partial area still maintains excellent cutting processability. Wherein, in the low-pressure stress region 13 on the surface of the glass substrate, the compressive stress layer has a depth ranging from about μ20 μm (micrometer), the compressive stress value is below the shed MPa, and the compressive stress layer depth of the high-pressure stress region 12 is from about From 5 microns to 9 microns, the compressive stress ranges from about 100 MPa to 800 MPa. In the above embodiment, the surface of the glass substrate is divided into the direct and low-pressure stress regions 12, 13, but the difference in compressive stress between any two adjacent regions on the surface is above 100 MPa, or the difference in compressive stress layer depth The value is above 5^m M427383. Different from the application method of the conventional tempered glass, the glass substrate of the creation can be pre-processed in the glass, and the processability such as cutting, splitting and grinding can be not degraded; for example, the glass substrate of the present invention can be applied to the production of various panels. Manufacturing, the related circuits and components of the panel structure are fabricated on the surfaces in the high-voltage stress regions 12, and then the post-processing of the low-pressure stress regions 13 by cutting, splitting, and grinding is performed to overcome the conventional tempered glass plate application in the panel. Restrictions on process and the purpose of improving production efficiency and quality. It can be understood that in the foregoing embodiment, the upper surface of the glass substrate has a compressive stress layer pattern F′ and the lower surface corresponding thereto may also be provided with a uniform compressive stress layer 14 (as shown in the third figure). The surface pressure stress difference of the glass plate body is excessively large to cause warpage deformation. Generally, the uniform compressive stress layer 14 is approximately the same as the low pressure stress region 13 described above, and the compressive stress layer has a depth range of about 20 μm or less and a compressive stress value of 400 MPa or less. Another embodiment of the present invention is shown in the fourth and fifth figures. The glass substrate is provided with compressive stress layer patterns F and F on the upper and lower surfaces, and the compressive stress layer patterns of the upper and lower surfaces are in a mutual Corresponding to the setting 'that is, the high-pressure stress region 12 on the upper surface of the glass substrate corresponds to the position of the high-pressure stress region 12' of the lower surface', and the low-pressure stress region 13 on the upper surface of the glass substrate and the low-pressure stress region 13 on the lower surface, the position Corresponding; therefore, in addition to maintaining the balance of compressive stress on the upper and lower surfaces of the glass plate, avoiding the occurrence of light bending deformation, the surface of the high-pressure stress region of the glass substrate can be multiplied by glass, while the surface of other low-pressure stress regions can still be Maintain excellent cutting processability. 7 M427383 This creation is not limited to the above-mentioned forms. It is obvious that with reference to the above description, there can be more improvements and changes in the technical equivalence'. Therefore, any modification of the creation made under the same creative spirit or Changes should still be included in the scope of this creative intent. BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is a perspective view of an embodiment of the present invention; the second drawing is a side sectional view of the present embodiment; the second drawing is a side sectional view of another embodiment of the creation; A perspective view of still another embodiment of the present invention; and a fifth drawing is a side cross-sectional view of the present embodiment. [Description of main component symbols] Compression stress layer pattern F, p High-pressure stress regions 12, 12, low-pressure stress regions 13, 13, uniform compressive stress layer 14