M4U9583 五、新型說明： 【新型所屬之技彳，好領域】 新型領域 本新型係關於一線對板高電壓連接器，且更特別地， 關於一可藉增加在焊接位置間之一間隙或距離有效地防止 由—高電壓產生之一電短路同時減少其整個尺寸，且亦可 選擇性地連接一殼體至形成在一頭座殼體兩側上之任一開 σ的線對板高電壓連接器。 ί先前技4好3 才目關技術之說明 —液晶顯示器（LCD)裝置是最廣泛使用之平板顯示器 之其中一種，且係由兩片顯示器面板構成，該等顯示器面 板形成有設置在該等顯示器面板間之一電場產生電極及一 液晶層。該LCD裝置利用藉施加於該等電極之一電壓重排分 該液晶層之分子來調整通過該液晶層之光透射率。 該液晶顯示裝置應用於一桌上型電腦、一筆記型電 腦、一TV、一行動電話等且傾向於在一主框架尺寸之可容 許範圍内加大一液晶螢幕以得到高效能。依據該液晶榮幕 增加之尺寸，一作為一光源之背光需要一大約l，00〇V至 l，4〇〇v之高電壓。因此’一為一電連接裝置之連接器亦必 須應付這高電壓同時減少尺寸。 第1至3圖是說明一相關技術之一線對板高電壓連接 及其使用的圖。 請參閱第1至3圖，該相關技術之線對板高電壓連接器 3 M409583 10被用於一側邊緣型發光二極體(LED)L，該連接器10設置 在一框架20之四個角落且焊接至一印刷電路板(PCB)P。 但是，在該相關技術之線對板高電壓連接器10中，一 殼體1(V由一後側插入。因此，該殼體10'之插入方向會依據 該PCB P之位置改變。因此，需要用以對齊及焊接該連接器 10至該PCB P之另一程序。 換言之，在該相關技術之線對板高電壓連接器10中， 由於一安裝在一框架20之一下部之PCB P及一安裝在該框 架20之一上部之PCB P互為鏡像，所以焊接至該PCB P之位 置必須轉動大約180°。即，必須將兩種PCB P分別安裝至該 框架20之下部及該框架20之上部。該相關技術之線對板高 電壓連接器之殼體插入方向被限制於一前後方向，而不是 在方向上可兼容的。因此，製造程序之數目增加且產率減 少〇M4U9583 V. New description: [New technology, good field] New field This new type is about one-to-board high voltage connector, and more specifically, it can be effectively increased by one gap or distance between welding positions. Preventing an electrical short circuit caused by a high voltage while reducing its overall size, and optionally connecting a casing to any of the open σ line-to-board high voltage connectors formed on both sides of a header housing .先前Previous technique 4 is a description of the technology - a liquid crystal display (LCD) device is one of the most widely used flat panel displays, and is composed of two display panels, which are formed with the display An electric field generating electrode between the panels and a liquid crystal layer. The LCD device adjusts the light transmittance through the liquid crystal layer by rearranging molecules of the liquid crystal layer by a voltage applied to one of the electrodes. The liquid crystal display device is applied to a desktop computer, a notebook computer, a TV, a mobile phone, etc. and tends to increase a liquid crystal screen for a high performance within a tolerance of a main frame size. According to the increased size of the liquid crystal glory, a backlight as a light source requires a high voltage of about 1,100 〇V to 1,4 〇〇V. Therefore, the connector of an electrical connection device must also cope with this high voltage while reducing the size. Figures 1 to 3 are diagrams illustrating a wire-to-board high voltage connection and its use in a related art. Referring to Figures 1 to 3, the related art wire-to-board high voltage connector 3 M409583 10 is used for a side edge type light emitting diode (LED) L, which is disposed in one of the frames 20 Corner and soldered to a printed circuit board (PCB) P. However, in the related art line-to-board high voltage connector 10, a casing 1 (V is inserted by a rear side. Therefore, the insertion direction of the casing 10' changes depending on the position of the PCB P. Therefore, There is a need for another procedure for aligning and soldering the connector 10 to the PCB P. In other words, in the related art line-to-board high voltage connector 10, a PCB P mounted on a lower portion of a frame 20 and A PCB P mounted on an upper portion of the frame 20 is mirror images of each other, so the position to be soldered to the PCB P must be rotated by about 180. That is, two types of PCB P must be mounted to the lower portion of the frame 20 and the frame 20, respectively. In the upper part of the related art, the housing insertion direction of the wire-to-board high voltage connector is limited to a front-rear direction, and is not compatible in the direction. Therefore, the number of manufacturing processes is increased and the yield is reduced.
C新型内容J 新型概要 因此，本新型係有關於一實質避免由於相關技術之限 制及缺點所產生之一或多個問題的線對板高電壓連接器。 本新型係作成用以解決上述限制。本新型之一方面是 提供一可藉增加在焊接位置間之一間隙或距離有效地應付 由一高電壓產生之一電短路同時減少其整個尺寸的線對板 高電壓連接器。 本新型之另一方面是提供/可藉被構造成使得一殼體 被插入其中之一頭座殼體在其兩側上具有多數開口且該殼 4 體可被選擇性地插人該祕殼體之任―開口巾以便組裝 成—最终產品。 、 圖式簡單說明 第1至3圖是說明一相關技術之一線對板高電壓連接器 及其使用的圖； 第4圖是—立體圖，顯示本新型之一實施例之一線對板 高電壓連接器； 第5圖是—平面圖，顯示本新型之實施例之線對板高電 壓連接器； 第6圖是一分割立體圖，顯示本新型之實施例之線對板 咼電壓連接器之一内側；及 第7圖是一立體圖’顯示本新型之實施例之線對板高電 壓連接器之一頭座殼體端子的焊接。 【實施方式3 新型之詳細說明 以下將對本新型之較佳實施例進行詳細說明’其例子 係顯示在添附圖式中。在任何可能的地方，在整個圖式中 均將使用相同符號來表示相同或相似部件。 以下，一示範性實施例之一線對板高電壓連接器將參 照添附圖式詳細地說明。 第4圖是一立體圖，顯示本新型之一實施例之一線對板 高電壓連接器。第5圖是一平面圖，顯示本新型之實施例之 線對板高電壓連接器。第6圖是一分割立體圖，顯示本新型 之實施例之線對板高電壓連接器之一内側。第7圖是一立體 M409583 圖，顯示本新型之實施例之線對板高電壓連接器之一頭座 殼體端子的焊接。 請參閱第4至6圖，一線對板高電壓連接器100由一其中 耦合多數殼體端子111之殼體110，一包括形成在該殼體110 兩側上之一開口 121以選擇性地收納該殼體110的頭座殼體 120 ’多數與該頭座殼體π〇之一下部份耦合且與該等殼體 端子111接觸之頭座殼體端子130，及一配置成將該頭座殼 體120固定在一印刷電路板(PCB)上之嵌合釘14〇構成。 該實施例之線對板高電壓連接器的結構將更詳細地說 明如下。 四個端子插入空間S由在該殼體110中之隔板界定，該 等殼體端子111固定地安裝在該等端子插入空間S中，一導 執112形成在該殼體11〇之兩側上。 該頭座殼體120包括形成該殼體丨1〇之兩側上之開口 121，使得該殼體11〇可選擇性地被插入任一開口 121 ^ 一引導溝槽120a形成在該頭座殼體120之一底面上，使 得該殼體110可以一滑動方式被插入該頭座殼體12〇。又， 一引導突起110a形成在對應該引導溝槽12〇3之該殼體ι10 的一下部。 該等頭座殼體端子130具有—倒τ形（請參見第7圖）且 耦合於該頭座殼體120之下部並且接觸該等殼體端子丨丨1。 該頭座殼體120包括多數設置在其下部之插入孔122及 形成在各插入孔122之兩側上的耦合孔123。 對應於該等耦合孔123’多數接觸部131形成在該頭座 6 喊體端子13G之巾間以便獅人該料口 121巾。此外，多 數耦合突起部133形成在該頭座殼體端子130之兩側上，且 °玄等耗合突起部133焊接於該PCB Ρ之一焊接墊Ρ'且被插入 該等耦合孔123中。 一鎖固孔120b形成在該頭座殼體120之一上表面上，使 得該殼體110耦合於該頭座殼體120同時被插入該頭座殼體 120中。此外，一鎖固突起113形成在該殼體11〇之—上表面 上’對應於該鎖固孔120b。 依據具上述構造之線對板高電壓連接器100,該等殼體 端子111固定地安裝在形成在該殼體110令之各個端子插入 空間S中。 具有該倒T形之頭座殼體端子13〇固定地安裝於該頭座 殼體120之下部且透過與該等殼體端子lu接觸而電連接。 如上所述，該等插入孔122形成在該頭座殼體12〇之下 部且該等耦合孔123形成在各插入孔122之兩侧上，該等接 觸部131破插入該等插入孔122中且該等耦合突起部133被 插入該軸合孔⑶巾。此外，料耗合突起部133焊接至 該PCB P之焊接墊p’。在此形成在兩側上之耦合突起部133 可以-鑛齒形方式交替地焊接在關上，如第7圖所示。在 這情形中m緣輯增加，可有效防止由—電短路 所產生之短處。換言之，雖然該連接器尺寸減少，在各個 焊接位置之或距離增加，藉此有效地防止由一 高電壓產生之電短路。 在此實施例之線對板高電壓連接器⑽中，由於該等開 口 121形成在該頭座殼體120之兩側上，使得該殼體iiο可被 選擇性地插入任一開口 121中，所以當該連接器1 〇〇應用於 —側邊緣型LED時，雖然該PCBP如參照第1圖說明般地旋轉 大約180° ’殼體110亦可被輕易地插入該頭座殼體12〇之開 口 121 中。 此外，當該殼體110被插入該頭座殼體12〇中時，由於 該殼體110之引導突起UOa受到形成在該頭座殼體120之底 面上的引導溝槽120a引導，所以該殼體11〇可平順地滑入。 如上所述，此實施例之線對板高電壓連接器可藉增加 在接觸部間之一間隙或距離有效地應付一高電壓，同時達 成其尺寸之減少。此外，由於開口形成在一頭座殼體之兩 側上，所以一殼體可被選擇性地插入兩開口之任一者中。 因此，可達成組裝相容性。又，由於該連接器由一前側及 —後側輕易地連接，可改善組裝性。 新型所屬技術領域中具有通常知識者將可了解的是在 本新型中可進行各種修改與變化，因此，意圖是如果本新 型之該等修改與變化在以下申請專利範圍及其等效物内， 則本新型涵蓋它們。 ί：圖式簡單説明3 第1至3圖是說明一相關技術之一線對板高電壓連接器 及其使用的圖； 第4圖是一立體圖，顯示本新型之一實施例之一線對板 高電壓連接器； 第5圖是一平面圖，顯示本新型之實施例之線對板高電C Novel Content J Novel Summary Therefore, the present invention relates to a wire-to-board high voltage connector that substantially avoids one or more problems due to limitations and disadvantages of the related art. The present invention is made to address the above limitations. One aspect of the present invention is to provide a wire-to-board high voltage connector that can effectively cope with an electrical short circuit generated by a high voltage while reducing its overall size by increasing a gap or distance between the soldering locations. Another aspect of the present invention provides/can be configured such that a housing is inserted into one of the header housings having a plurality of openings on both sides thereof and the housing 4 can be selectively inserted into the housing The "opening towel" to assemble into the final product. BRIEF DESCRIPTION OF THE DRAWINGS FIGS. 1 to 3 are diagrams showing a wire-to-board high voltage connector of a related art and its use; FIG. 4 is a perspective view showing a line-to-board high voltage connection of one embodiment of the present invention. Figure 5 is a plan view showing the wire-to-board high voltage connector of the embodiment of the present invention; Figure 6 is a fragmentary perspective view showing one of the wire-to-board voltage connectors of the embodiment of the present invention; And Fig. 7 is a perspective view showing the welding of the headstock housing terminals of the wire-to-board high voltage connector of the embodiment of the present invention. [Embodiment 3] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail, and examples thereof are shown in the accompanying drawings. Wherever possible, the same reference numerals will be used to refer to the Hereinafter, a wire-to-board high voltage connector of an exemplary embodiment will be described in detail with reference to the accompanying drawings. Figure 4 is a perspective view showing a wire-to-board high voltage connector of one embodiment of the present invention. Figure 5 is a plan view showing the wire-to-board high voltage connector of the embodiment of the present invention. Figure 6 is a fragmentary perspective view showing one of the inner sides of the wire-to-board high voltage connector of the embodiment of the present invention. Figure 7 is a perspective view of a M409 583 showing the soldering of the header housing of one of the wire-to-board high voltage connectors of the present embodiment. Referring to FIGS. 4-6, a wire-to-board high voltage connector 100 is comprised of a housing 110 in which a plurality of housing terminals 111 are coupled, and an opening 121 formed on both sides of the housing 110 for selective storage. The headstock housing 120' of the housing 110 is mostly coupled to a lower portion of the header housing π, and the header housing terminal 130 is in contact with the housing terminals 111, and is configured to seat the header The housing 120 is formed by a fitting pin 14 that is fixed to a printed circuit board (PCB). The structure of the wire-to-board high voltage connector of this embodiment will be described in more detail below. The four terminal insertion spaces S are defined by the partitions in the housing 110, the housing terminals 111 are fixedly mounted in the terminal insertion spaces S, and a guide 112 is formed on both sides of the housing 11 on. The headstock housing 120 includes openings 121 formed on both sides of the housing 丨1〇 such that the housing 11〇 can be selectively inserted into any of the openings 121. A guiding groove 120a is formed in the head housing The bottom surface of one of the bodies 120 allows the housing 110 to be inserted into the headstock housing 12A in a sliding manner. Further, a guide projection 110a is formed at a lower portion of the casing ι10 corresponding to the guide groove 12〇3. The header housing terminals 130 have an inverted-chat shape (see Fig. 7) and are coupled to the lower portion of the header housing 120 and contact the housing terminals 丨丨1. The headstock housing 120 includes a plurality of insertion holes 122 disposed at a lower portion thereof and coupling holes 123 formed on both sides of each of the insertion holes 122. Corresponding to the coupling holes 123', a plurality of contact portions 131 are formed between the head portions of the head holder 6 and the mouth portion of the head portion of the head portion of the head portion of the head portion. In addition, a plurality of coupling protrusions 133 are formed on both sides of the header housing terminal 130, and the protrusions 133 are soldered to one of the PCB pads and inserted into the coupling holes 123. . A locking hole 120b is formed on an upper surface of the headstock housing 120 such that the housing 110 is coupled to the headstock housing 120 while being inserted into the header housing 120. Further, a locking projection 113 is formed on the upper surface of the casing 11 corresponding to the locking hole 120b. According to the wire-to-board high voltage connector 100 having the above configuration, the casing terminals 111 are fixedly mounted in the respective terminal insertion spaces S formed in the casing 110. The head holder housing terminal 13 having the inverted T shape is fixedly attached to the lower portion of the headstock housing 120 and is electrically connected to be in contact with the housing terminals lu. As described above, the insertion holes 122 are formed in the lower portion of the headstock housing 12 and the coupling holes 123 are formed on both sides of the insertion holes 122. The contact portions 131 are inserted into the insertion holes 122. And the coupling protrusions 133 are inserted into the shaft hole (3). Further, the material absorbing protrusion 133 is soldered to the pad p' of the PCB P. The coupling protrusions 133 formed on both sides here may be alternately welded to the top in a spar-like manner as shown in Fig. 7. In this case, the m-edge is increased to effectively prevent the shortcomings caused by the short-circuit. In other words, although the size of the connector is reduced, the distance between the respective soldering positions is increased, thereby effectively preventing an electrical short circuit caused by a high voltage. In the wire-to-board high voltage connector (10) of this embodiment, since the openings 121 are formed on both sides of the header housing 120, the housing ii can be selectively inserted into any of the openings 121, Therefore, when the connector 1 is applied to the side edge type LED, the PCBP can be easily inserted into the headstock housing 12 even though the PCBP is rotated by about 180° as described with reference to FIG. In the opening 121. Further, when the housing 110 is inserted into the headstock housing 12, since the guiding protrusion UOa of the housing 110 is guided by the guiding groove 120a formed on the bottom surface of the head housing 120, the housing The body 11〇 slides smoothly into the body. As described above, the wire-to-board high voltage connector of this embodiment can effectively cope with a high voltage by increasing a gap or distance between the contacts while achieving a reduction in its size. Further, since the openings are formed on both sides of the head housing, a housing can be selectively inserted into either of the openings. Therefore, assembly compatibility can be achieved. Further, since the connector is easily connected by a front side and a rear side, the assemblability can be improved. It will be apparent to those skilled in the art that the present invention is susceptible to various modifications and changes in the present invention. Then the new model covers them. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 to FIG. 3 are diagrams showing a wire-to-board high voltage connector of a related art and its use; FIG. 4 is a perspective view showing a line-to-plate height of one embodiment of the present invention. Voltage connector; Figure 5 is a plan view showing the wire-to-board high power of the embodiment of the present invention