M378480 五、新型說明： 【新型所屬之技術領域] 本新型是有關於一種載盤，且特別是有關於一種對電 路板進行預熱之載盤。 【先前技術】 ^電路板上，往往設置有許多的電子元件。電子元件係 藉由焊接製程而將接腳固著於電路板上的焊接孔。在近代 的技術中’常常在電路板的兩面上都可以承載電子元件。 較大型的插件型電子元件如電容，由於體積之限制，均設 ^於其中-面，而其他小型的電子元件則可固著在兩面。 谭，製程中’常須藉由載盤與電路板相接後，先經過預熱 過程’使咖度提升以利焊接。然而在較大型的插件型電子 焊接製程預熱之溫度不足，將容易使焊接製 鲁 *恭般，融鎔峨難附著於料處。如果藉由擴 ·»上焊接孔的面積或是使載盤近焊接孔處的厚度變 支撐強度減低。而如果藉由增加= 二：導致電路板上’實施谭接製程 電子疋件各易因過高的溫度而損壞。 機制=更η 一個新的载盤，使焊接製程中的預熱 路板上其他元件之運作，乃為此一業界^解題響電 【新型内容;j 因此，本新型之一離;1¾ e ‘ 路板進行賴仙，其ΐ電=提供—種健，用以對電 型電子元件，各插件型電子 7 —面承載至少一插件 用以承接電路板之第二面之本:包含複數接腳，載盤包含 以及複數個預熱孔。焊接孔分本體包含複數個焊接孔 接腳自電路板之第-面延伸至用以使插件型電子元件之 預熱孔環設於烊接孔旁並貫穿^後，曝露於焊接孔。 路板進行波峰焊焊接過程中，^盤之本體°其中’在電 進行預熱，插㈣電子元由賴錢對電路板 相接觸而崎於電路板，各預由焊接孔與焊接金屬 使用之金屬自載盤渗透至電路板:第更=^ 供預由預熱孔之設置，可在提 易自載盤渗透至電路板之第二面，而輕 【實施方式】 1 ”、、第1圖。第1 ®係為本新型之—實施例之載盤 :視圖。载盤丨制以對__電路板進行預熱作用。請 、>…、第2圖。第2圖係為本新型之一實施例之電路板 於俯視圖。電路板2包含第一面2〇及第二面22(未繪示 2、 2圖）。第一面20承載插件型電子元件（未繪示於第 )，如大型的電容、電陴或電感。第2阖中繪示出插件 電子70件的承載區200。而電路板2之第一面20及第二 均了用以承接表面黏著（Surface mount technology ; M378480 SMT)式電子元件，如第2圖上所示之各方塊220。 載盤1包含本體100。本體100包含複數個焊接孔1〇2 以及複數個預熱孔104。第1圖中所繪示之焊接孔1〇2係 分別對應插件型電子元件之承載區20(^請同時參照第3 圖。第3圖係為第1圖之载盤1承接第2圖之電路板2之 第二面20後，沿A方向之侧剖面圖。須注意的是，於第3 圖中更進一步繪示一插件型電子元件3置於插件型電子元 件之承載區200的孔洞200a及200b内。插件型電子元件 眷 3包含接腳30及32。接腳30及32自電路板2之第一面 20藉由孔洞200a及200b延伸至第二面22後，曝露於焊 接孔102。預熱孔1〇4環設於焊接孔1〇2旁並貫穿於載盤1 之本體100。 由於焊接製程，如波峰焊焊接過程時’須要預熱以使 焊接製程所用的金屬在適當的溫度熔融以填滿孔洞200a 及200b來固定接腳30、32，如預熱溫度較低，則熔融的 金屬量無法達到標準，容易使接腳30、32無法完全與孔洞 • 200a及2〇〇b固著。而將整體的預熱溫度提升過高，將容 -易對鄰近的其他電子元件造成損壞。因此藉由環設於焊接 孔102旁的預熱孔1〇4，熱源（未繪示）可以在不對鄰近 的其他電子元件造成威脅的情形下，使焊接孔102的溫度 均勻提升’而使熔融的焊接金屬能夠與接腳3〇、32將接觸 並固著接腳30、32於孔洞200a及200b。於一實施例中， 焊接製程可為波鋒焊焊接製程，且焊接製程所使用的熔接 金屬為錫。 然而，如果預熱孔104之尺寸過大，將容易使焊接金 6 M378480 層炼融為液態時，由載盤1滲透至電路板2之第二面20， ' 對第一面20上的元件造成損壞。因此，針對前述使用錫做 為焊接金屬之實施例，各預熱孔係具有可防止焊接製程使 用之金屬自載盤滲透至電路板之第二面之直徑。於一實施 例中’各預熱孔之直徑係小於lmm。於另一實施例中，預 ”’、孔之直彳至係為〇.8mm。如此的設計，將可使焊接金屬在 張力的作用下不能通過預熱孔，進而避免電路板2之第二 面 上所焊接的表面黏著式電子元件因與焊接金屬相接 •觸而脫離於電路板2的情況發生。載盤1在焊接製程結束 後’係不再承接電路板2。 、明參照第4圖，係為本新型之一實施例之載盤丨之俯 視圖。本實施例之載盤1之烊接孔1〇2以及預熱孔1〇4實 質上與第1圖所繪示的相同。本實施例之載盤丨與第i圖 之不同處係在於本體1〇〇更包含第一凹面4〇，用以俾承接 電路板2之第一面22。其中第一凹面40之厚度係不小於 電路板2之厚度。第一凹面40更包含第二凹面400，用以 承接電路板2上的表面黏著式電子元件220。 - 本體100更包含卡合片42,環設於第一凹面40周圍， 用以卡合固定電路板2之邊緣部份，其中各卡合片42係樞 接於本體100上。在電路板2未置於載盤1時，卡合片42 係可旋轉至與電路板2之邊緣部份平行的方向，以供電路 板2置入。在電路板2置於載盤}後，卡合片42係可旋轉 至一角度，以與電路板2之邊緣部份卡合而固定住電路板 1 〇 本體100進一步更可包含螺孔44。電路板2實質上具 7 有複數開孔（未哈一、 置，以使電路柄、，會不），螺孔44係根據這些開孔的位置設 穿過開孔以將曾2置於载盤1時，可以藉由螺絲（未繪示） 本實施例電路板鎖固於本體100的螺孔44上。 方式，以使載盤係提供與電路板間更緊密的結合鎖固 力而位移，淮〜與電路板在預熱及焊接過程中不易由於外 於其他實if使焊接的良率提升。 形成一個整體，列中，部份鄰設之焊接孔係可相互連通， 立之實施方式所=並非為上述實施例中，焊接孔均各自獨 、’工 之數目、焊接^插件型電子元件承接區之位置、焊接ί 方式等等，係之形狀、預熱孔環設於焊接孔周圍之排夕 整，任何本領域:=以:二=:之需求_ 本新型之傷 又a耆均可輕易地做更動。 熱作用以避免執由預熱孔之設置，可在提卿 製程使用之金;1 焊錫過少之情況的同時，防止焊接 達到上述之2電路板第二面滲透至第-面，而輕易地 雖然本新型已以實施方 圍當視後料職^者=本㈣之保護」 【圖式簡單說明】 、特徵、優點與實施例 為讓本新型之上述和其他目的 M378480 能更明顯易懂，所附圖式之說明如下： 第1圖係為本新型之一實施例之載盤之俯視圖； 第2圖係為本新型之一實施例之電路板之俯視圖； 第3圖係為第1圖之載盤承接第2圖之電路板之第二 面後，沿A方向之侧剖面圖；以及 第4圖係為本新型之一實施例之載盤之俯視圖。 【主要元件符號說明】 1 :載盤 102 :焊接孔 2 :電路板 200 :承载區 22 :第二面 30、32 :接腳 400 :第二凹面 44 :螺孔 100 :本體 104 :預熱孔 20 :第一面 200a、200b :孔洞 3:插件型電子元件 40 :第一凹面 42 :卡合片M378480 V. New description: [New technical field] The present invention relates to a carrier, and in particular to a carrier for preheating a circuit board. [Prior Art] ^ On the circuit board, many electronic components are often provided. The electronic component is a soldering hole that is fixed to the board by a soldering process. In modern technology, electronic components are often carried on both sides of a circuit board. Larger plug-in electronic components, such as capacitors, are placed in the midplane due to volume limitations, while other small electronic components can be attached to both sides. Tan, in the process, 'often through the pre-heating process after the carrier and the board are connected, the coffee is upgraded to facilitate welding. However, in the case of a large type of plug-in type electronic soldering process, the preheating temperature is insufficient, and it is easy to make the soldering process ruthless, and it is difficult to adhere to the material. If the area of the welding hole is expanded or the thickness of the carrier near the welding hole is changed, the supporting strength is reduced. However, if the increase is equal to two: the implementation of the tandem process electronic components on the board is easily damaged due to excessive temperature. Mechanism = more η A new carrier, so that the operation of other components on the preheating circuit board in the welding process is a problem for the industry. [New content; j, therefore, one of the new models; 13⁄4 e ' The board is used for Lai Xian, and its power supply is provided for the electric type electronic components. Each plug-in type electronic 7 carries at least one plug-in for receiving the second side of the circuit board: including a plurality of pins. The carrier contains a plurality of preheating holes. The soldering hole sub-body comprises a plurality of soldering holes. The pins extend from the first surface of the circuit board to the preheating hole ring of the plug-in type electronic component disposed on the side of the boring hole and penetrated through the soldering hole. During the wave soldering process of the road board, the body of the disk is in which the 'electrical preheating, inserting (four) electronic elements are connected to the circuit board by Lai Qian, and each is prefabricated by the welding hole and the welding metal. The metal self-loading disk penetrates into the circuit board: the first =^ is provided by the preheating hole, which can penetrate the second surface of the circuit board in the easy-to-load disk, and is light [embodiment] 1", 1st Fig. 1® is a new type of carrier: a view of the embodiment. The carrier is clamped to preheat the __ board. Please, >..., Fig. 2. Fig. 2 is The circuit board 2 includes a first surface 2 〇 and a second surface 22 (not shown in Figures 2 and 2). The first surface 20 carries the plug-in type electronic component (not shown in the For example, a large capacitor, an electric pole or an inductor. The load bearing area 200 of the plug-in electronics 70 is shown in the second drawing, and the first surface 20 and the second surface of the circuit board 2 are used to receive the surface adhesion (Surface mount) Technology; M378480 SMT) electronic component, such as the block 220 shown on Figure 2. The carrier 1 includes a body 100. The body 100 includes A plurality of welding holes 1〇2 and a plurality of preheating holes 104. The welding holes 1〇2 shown in Fig. 1 correspond to the bearing area 20 of the plug-in type electronic component respectively (^Please refer to Fig. 3 at the same time. The figure is a side cross-sectional view along the A direction after the carrier 1 of FIG. 1 receives the second surface 20 of the circuit board 2 of FIG. 2. It should be noted that a plug-in type is further illustrated in FIG. The electronic component 3 is placed in the holes 200a and 200b of the carrying area 200 of the plug-in type electronic component. The plug-in type electronic component 眷3 includes pins 30 and 32. The pins 30 and 32 are formed from the first face 20 of the circuit board 2 by holes 200a and 200b extend to the second surface 22 and are exposed to the welding hole 102. The preheating hole 1〇4 is disposed beside the welding hole 1〇2 and penetrates through the body 100 of the carrier 1. Due to the welding process, such as wave soldering During the process, it is necessary to preheat so that the metal used in the welding process is melted at a suitable temperature to fill the holes 200a and 200b to fix the pins 30, 32. If the preheating temperature is low, the amount of molten metal cannot reach the standard, and it is easy. The pins 30, 32 cannot be completely fixed with the holes 200a and 2〇〇b, and the overall preheating temperature is raised. If it is too high, it will damage the other electronic components in the vicinity. Therefore, by the preheating holes 1〇4 disposed beside the soldering holes 102, the heat source (not shown) can pose no threat to other adjacent electronic components. In this case, the temperature of the soldering hole 102 is uniformly increased, so that the molten solder metal can contact the pins 3, 32 and fix the pins 30, 32 to the holes 200a and 200b. In one embodiment, the soldering The process can be a wave front welding process, and the welding metal used in the welding process is tin. However, if the size of the preheating hole 104 is too large, it will be easy to make the welding gold 6 M378480 layer into a liquid state, and the carrier 1 penetrates. To the second face 20 of the board 2, 'damages the components on the first face 20. Therefore, with respect to the foregoing embodiment in which tin is used as the weld metal, each of the preheating holes has a diameter which prevents the metal used for the soldering process from penetrating into the second side of the board. In one embodiment, the diameter of each preheating hole is less than 1 mm. In another embodiment, the pre-", the straight hole of the hole is 〇.8mm. Such a design, the welding metal can not pass the preheating hole under the tension, thereby avoiding the second of the circuit board 2. The surface-adhesive electronic component soldered on the surface is separated from the soldering metal by contact with the solder metal. The carrier 1 is no longer supported by the circuit board 2 after the soldering process is completed. The figure is a plan view of the carrier cartridge of one embodiment of the present invention. The boring hole 1〇2 and the preheating hole 〇4 of the carrier 1 of the present embodiment are substantially the same as those illustrated in FIG. The difference between the carrier and the first embodiment of the present embodiment is that the body 1 further includes a first concave surface 〇 for receiving the first surface 22 of the circuit board 2. The thickness of the first concave surface 40 is not The first concave surface 40 further includes a second concave surface 400 for receiving the surface-adhesive electronic component 220 on the circuit board 2. The body 100 further includes a clamping piece 42 disposed on the first concave surface 40. Surrounding, for engaging an edge portion of the fixed circuit board 2, wherein each of the engaging pieces 42 is pivotally connected to On the body 100. When the circuit board 2 is not placed on the carrier 1, the engaging piece 42 is rotatable to a direction parallel to the edge portion of the circuit board 2 for the board 2 to be placed. After the carrier}, the engaging piece 42 is rotatable to an angle to engage with the edge portion of the circuit board 2 to fix the circuit board 1. The body 100 further includes a screw hole 44. The circuit board 2 has substantially 7 There are a plurality of openings (not set, so that the circuit handles, will not), the screw holes 44 are arranged according to the positions of the openings through the openings to place the former 2 on the carrier 1 The circuit board of the embodiment is locked on the screw hole 44 of the body 100 by means of a screw, so that the carrier system provides a tighter combined locking force between the carrier and the circuit board, and the circuit board is displaced. In the preheating and welding process, it is not easy to improve the welding yield due to other external if. Forming a whole, some adjacent welding holes can be connected to each other in the column, and the implementation method is not the above implementation. In the example, the welding holes are each unique, the number of work, the position of the soldering-type electronic component receiving area Welding ί, etc., the shape of the system, the preheating hole ring is arranged around the welding hole, any field: = to: two =: the demand _ this new type of injury and a 耆 can easily be changed The heat is used to avoid the setting of the preheating hole, and the gold can be used in the cleaning process; 1 the soldering is too small, and the welding is prevented from reaching the first surface of the second board, and the second surface is easily penetrated. Although the present invention has been implemented by the implementation party, it is the protection of the user (the fourth). [Simplified description of the drawings], features, advantages and embodiments for making the above and other purposes of the present invention M378480 more obvious and easy to understand, BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view of a carrier of one embodiment of the present invention; FIG. 2 is a plan view of a circuit board according to an embodiment of the present invention; FIG. 3 is a first view A side view of the carrier in the A direction after receiving the second side of the circuit board of FIG. 2; and FIG. 4 is a plan view of the carrier of one embodiment of the present invention. [Main component symbol description] 1 : Carrier 102: soldering hole 2: circuit board 200: carrying area 22: second surface 30, 32: pin 400: second concave surface 44: screw hole 100: body 104: preheating hole 20: first side 200a, 200b: hole 3: insert type electronic component 40: first concave surface 42: engaging piece