M360454 五、新型說明： 【新型所屬之技術領域】 置有寄生電容$之㈣特別是«於一種配 電谷器之微型天線模組 整電容值’以達到較佳之耦合效果。 寄生電4來調 【先月U技術】 隨著製造技術的進步，幾乎所有的可攜帶式 3C產品均走 ;^ !化（Miniaturize) ’特別是在天線也同時達到微型化之 使得一些具有無線通訊功能的可攜帶式3C產品大量產 例如.行動電話（m〇bile ph〇ne)、個人數位助理（pDA) 或是衛星導航系統（GPS)等。 第2圖所示’係中華民國公告專利第1293819號所揭露之 微小型天線裝置-Chip Antenna」’其係描述一種在介電材料 板20上形成不同方向彎折之金屬線200，以形成天線裝置。 微小型天線裝置之介電材料板20可以是一種絕緣材料、印刷 電路板或是陶瓷材料等；而金屬線200線寬為mm，並且 可藉由調整上述不同彎折金屬線2〇〇的線寬、間距、曲折數量 來調整微小型天線裝置的頻寬以及頻率響應點。此外，也可以 不门考折金屬線200的兩端上’各形成一個金屬接點21〇、 220。 ’’ 射頻天線除了必須要微型化之外，其為了克服外來雜訊之 干擾，因此傳統上均需要使用π型電路來調整天線之阻抗或用 來調整頻率。同時，也由於3C產品的種類非常多，使得微型 天線無法標準化，而必須隨著不同產品做些頻率上的調整，因 而有非常多的天線類型。為了解決此一問題，以目前之現有技 3 M360454 術而言，大都使用寄生電容器的方式來調整頻率，例如：平面 天線、L型單極天線、E型天線或是反相F型天線等；其中， 美國專利7012570，即揭露一種具印刷寄生電容器之天線，請 ' 參考第1圖。如第1圖所示，其主要是藉由外加之調整單元 ' 410形成寄生電容器來調整頻率。很明顯地，其無法只在一塊 印刷電路板上形成寄生電容器，而必須將一部份的天線延伸至 印刷電路板外側，使得3C產品需要增加多餘的空間來容納天 線。 _ 有鑒於微型天線在先前技術上的限制，本創作提供一種在 印刷電路板上形成寄生電容器之微型天線模組，使得微型天線 模組可以在不增加天線面積之情況下，依據不同的3C產品進 行頻率的調整。 【新型内容】 為了解決上述問題，本創作之主要目的在於提供一種微型 天線模組，其可以在不增加微型天線模組面積狀況下，配置寄 > 生電容器，藉此寄生電容器來調整振盪頻率。 本創作之另一主要目的在於提供一種微型天線模組，其可 以在不增加微型天線模組面積狀況下，藉由寄生電容器的圖案 化配置，使得寄生電容器具之電容值具有調整之功能。 本創作之又一主要目的在於提供一種微型天線模組，其可 以在不增加微型天線模組面積狀況下，配置寄生電容器以及一 電容器，藉此寄生電容器以及電容器來調整振盪頻率。 ' 依據上述目的，本創作提供一種微型天線模組，包括：一 - 基板，其上分割為一第一區域，一與第一區域一側邊相鄰之第 二區域，以及一與第一區域及第二區域同一側邊相鄰之第三區 4 M360454 域’一接地平面’係將第一金屬層形成於基板之第三區域上； -絕緣層’係平整地覆蓋於接地平面上微塑天線板，係於 ”電材料板上形成一圖案化之金屬線且在兩端點上配置第 一金屬接點及第二金屬接點，同時，微型天線板固接於基板之 第一區域上，且微型天線板與接地平面相鄰之一側邊上，進一 步配置一第二金屬層，而第二金屬層與微型天線板中的第一金 屬接點電性連接；及一第三金屬層，係形成於基板之該第二區 域上，其中微型天線模組之特徵在於：第三金屬層之一端延伸 至微型天線之第二金屬接點上並與第二金屬接點電性連接，其 另一端延伸至絕緣層上，並形成圖案化之金屬層。 本創作接著提供一種微型天線模組，包括：一基板，其上 分割為第一區域，一與第一區域一側邊相鄰之第二區域，以及 一與第一區域及第二區域同一側邊相鄰之第三區域；一接地平 面’係將第一金屬層形成於基板之第三區域上；一絕緣層，係 平整地覆蓋於接地平面上；一微型天線板，係於一介電材料板 上形成一圖案化之金屬線且在兩端點上配置第一金屬接點及 第二金屬接點’而微型天線板固接於基板之該第一區域上，且 微型天線板與該接地平面相鄰之一側邊上，進一步配置第二金 屬層’而第二金屬層與微型天線板中的第一金屬接點電性連 接；及一第三金屬層’係形成於基板之該第二區域上，其一端 延伸至微型天線之另一側邊上且與第二金屬接點電性連接，其 另一端延伸至絕緣層上’並形成一圖案化之金屬層，其中微型 天線模組之特徵在於：圖案化之金屬層係以複數個不連續之金 屬層所形成。 本創作接著提供一種無線通訊裝置，包含一本體、一顯示 單元、一觸控單元、一觸控筆、一撥發鍵盤以及一天線裝置， 5 M360454 天線裝置係經由一饋入元件與一微型天線模組電性連接，其中 微型天線权組包括：一基板，其上分割為一第—區域，一與第 一區域一側邊相鄰之第二區域，以及一與第一區域及第二區域 ' 同一側邊相鄰之第三區域；一接地平面，係將一第一金屬層形 - 成於基板之該第三區域上；一絕緣層，係平整地覆蓋於接地平 面上，一微型天線板，係於一介電材料板上形成一圖案化之金 屬線且圖案化之金屬線之兩端點上配置第一金屬接點及第二 金屬接點，而微型天線板固接於基板之該第一區域上，且微型 齡 天線板與接地平面相鄰之一側邊上，進一步配置一第二金屬 層’而第二金屬層與該微型天線板中的該第一金屬接點電性連 接；及一第三金屬層，係形成於基板之該第二區域上，其一端 延伸至微型天線之另一侧邊上且與第二金屬接點電性連接，其 另一端延伸至絕緣層上，並形成一圖案化之金屬層，其中無線 通訊裝置之特徵在於：微型天線模組中之圖案化之金屬層係以 複數個不連續之金屬層所形成。 【實施方式】 由於本創作係揭露一種微型天線模組’特別是一種具有調 整振盪頻率之微型天線模組，用以確保微型天線模組與通訊裝 置間之最佳匹配值。由於，本創作所利用到的一些微型天線咬 在電路基板上形成金屬層等之詳細製造或處理過程，係利用現 有技術來達成，故在下述說明中，並不作完整描述。而且下述 内文中之圖式，亦並未依據實際之相關尺寸完整繪製，其作用 僅在表達與本創作特徵有關之示意圖。 首先’睛參考第3圖’係本創作之微型天線模、纟且之基板示 意圖。如第3圖所示，基板10，其上分割為第—區域12、第 6 M360454 二區域14與第三區域16，其中第一區域與第一區域一側邊相 鄰，而第三區域則與第一區域及第二區域同一側邊相鄰，其 中’第三區域與第二區域不連接在一起。此外，基板1〇可以. ' 是一種印刷電路板（Printed Circuit Board ; PCB)，特別是單 、 層印刷電路板或是多層印刷電路板。 . 接著，請參考第4圖，係本創作之微型天線模組之一實施 例之示意圖。如第4圖所示，將一個微型天線板20配置於基 板10之第一區域12上，例如使用表面黏著技術（Surface Mount • TeChn〇l〇gy;SMT)將微型天線板20焊接於基板l〇之第一區域 12上。其中’微型天線板2〇如第2圖所示’係在介電材料板 20上形成不同方向彎折之金屬線2〇〇，以形成天線裝置，且在 不同彎折金屬線200的兩端上，形成第一金屬接點21〇及第二 今晨接點220。再接著，於基板1〇之第三區域16上形成一金 屬層30 ;例如：使用電鍍製程（plating)，將金屬層％覆蓋 在基板10之第三區域16上’用以作為微型天線模組之接地面 (Grounding Plane)。由於，第三區域16與第二區域14不連 接在一起’因此’金屬層3〇與微型天線板20之間形成一間隔 1 18。然後，再於金屬層3〇上形成一平整之絕緣層（未顯示於 圖中）’此絕緣層可以是—種介電材料；例如：絕緣層為一 p yimide材料層。在此要說明，使用在本創作之絕緣層，可 以依據所要形成之電容值來選擇具有不同介電值之介電材料 以及選擇絕緣層之厚薄度。 再接著，於金屬層30與微型天線板20之間的間隔18上， 另外再形成一金屬層22，藉由此金屬層22與微型天線板2〇 《第一金屬接點210電性連接，用以作為微型天線板20之饋 入點然後，再於基板20之第二區域14上，形成一金屬層 7 M360454 40，同時，金屬層42連接著金屬層40之一端延伸至微型天線 20之第二金屬接點220上，並與第二金屬接點220電性連接； 而金屬層40之另一端延伸至絕緣層上，並且在絕緣層上形成 ' 圖案化之金屬層44。此圖案化之金屬層44可以是幾何形狀 - 者，例如：同心圓或是如第4圖所示之同心矩形或是不規則之 環繞金屬層。 很明顯地，本創作係將圖案化金屬層44延伸至絕緣層 上，使得圖案化金屬層44與位於絕緣層下的金屬層30可以形 ^ 成寄生電容之結構；因此，本創作可藉由圖案化金屬層44所 形成之面積之大小來決定寄生電容之電容值。故當寄生電容之 一端與微型天線板20之第二金屬接點220電性連接後，即可 藉由此寄生電容來達到調整頻率之目的。因此，當本創作之微 型天線模組1經由一個饋入元件50 (例如：同軸電纜）配置 於3C產品中時，即可在不增加微型天線模組1面積之前提下， 達到調整頻率之目的；其中，饋入元件50之訊號端點52與金 屬層22電性連接，而其接地端點54則與接地平面電性連接； 藉由此饋入元件50將天線訊號傳送至3C產品中。此外，當基 • 板10為一 PCB時，其上的接地平面可以進一步延伸至基板10 之另一面（未顯示於圖中），因此，在基板10之側邊上也會有 金屬層30;而當基板10為一 PCB為一種多層電路板時，由於 層與層之間的接地連接在一起，因此，在層與層之間的側邊上 也會有金屬層30。很明顯地，這些在基板10側邊上的金屬層 30也會與圖案化金屬層44形成寄生電容的效應。 接下來，請參考第5圖，係本創作之微型天線模組之另一 實施例之示意圖。第5圖所示之微型天線模組2，其在結構上 與第4圖所示之微型天線模組1完全相同，僅有在圖案化金屬 8 M360454 層44的結構上不相同，故本實施例之微型天線模組2之結構 不再重複贅述。如第5圖所示，圖案化金屬層44係由複數個 不相連接之金屬線段所組成，其中，不相連接之金屬線段係由 至少一個區段46來隔離；此不連續之圖案化金屬層44其組成 之結構是近似幾何形狀，例如：同心圓或是如第4圖所示之同 心矩形或是不規則之環繞金屬層。因此，可以藉由將部份金屬 線段以焊接方式電性連接後；例如：將第5圖中之區段46電 性連接在一起後，可使金屬線段形成不同之面積，故可以依據 需求來決定焊接區段46之數量，進而來決定寄生電容之電容 值。 故當本實施例之微型天線模組2經由饋入元件5〇配置於 無線通訊之產品中時，即可在不增加微型天線模組2面積之前 k下’達到s周整頻率之目的。在此要強調’本實施例之寄生電 容可以經由焊接方式來決定電容值，因此，本實施例中之微型 天線模組2可以具有較高範圍的頻率調整。因此，經由微型天 線模組2適當之設計，可以使微型天線模組2能夠使用在不同 頻率的產品；例如：配置有無線通訊（如IEEE802.1 la/b/g、 Bluetooth等）裝置之產品，包括無線通訊手機（cellular Phone)、全球衛星定位系統（Global Positioning System,GPS)、 個人數位助理（Personal Digital Assistant ; PDA )、筆記型電腦 (NB)及具有接受訊號功能之MP3等。 接下來，請參考第6圖，係本創作之微型天線模組之另一 實施例之示意圖。第6圖所示之微型天線模組3，其除了未在 金屬層30上形成圖案化金屬層44之外，在結構上與第5圖所 示之微型天線模組2相同，故本實施例之微型天線模組3之結 構不再重複贅述。如第6圖所示，係在微型天線模組3中的金 9 M360454 屬層30(接地面）與金屬層40之間連接一電容元件6〇，此電 容元件60可以是可變電容器。因此，當本創作之微型天線模 組3經由一個饋入元件50配置於無線通訊之產品中時，即可 藉由對電谷元件60的調整，來達到調整頻率之目的。此外， 當電谷元件60完成連接後，也可以選擇性地在金屬層％形成 一絕緣層。 再接下來，請參考第7圖，係本創作之微型天線模組之再 一實施例之示意圖。很明顯地，第7圖所示之微型天線模組4, 係在第5圖之微型天線模組2之結構中，再加上一個電容元件 60，此電容元件60也可以是一個可變電容器，故本實施例在 微型天線模組4之結構即不再重複贅述。如第7圖所示，係在 微型天線模組4中的金屬層30 (接地面）與金屬層4〇之間連 接一電容元件60，此電容元件60可以是可變電容器。因此， 當本創作之微型天線模組4經由一個饋入元件5〇配置於無線 通訊之產品中時，即可以藉由將至少一個區段46電性連接在 一起後，可使金屬線段形成不同之面積，來達到調整頻率之目 的之外，還可以再藉由對電容元件6〇的調整，同時來調整頻 率。很明顯地，本實施例可以具有較大的頻率調整功能。同樣 地，經由本實施例之微型天線模組4適當之設計，可以使微型 天線模組4使用在不同頻率的產品；例如配置有無線通訊（如 IEEE802.Ua/b/g、Bluetooth等）裝置之產品，包括無線通訊手 機（Cellular Phone)、全球衛星定位系統（Global Positioning System,GPS)、個人數位助理（pers〇nai Digital Assistant ; PDA)、筆記型電腦（NB)及具有接受訊號功能之MP3等。 接著，以一種無線通訊裝置來說明本創作之應用。請參考 第8圖’係本創作之無線通訊裝置之示意圖。如第8圖所示， M360454 此無線通訊裝置8可以是一種觸控式手機，其也可以是一種個 人數位助理（PDA)。無線通訊裝置8包含一本體81、一顯示 單元82、一觸控單元83、一觸控筆84、一撥發鍵盤85以及 一天線裝置86，其中天線裝置86係經由饋入元件50將本創 作之微型天線模組（1、2、3及4)與無線通訊裝置8電性連 接在一起。很明顯地，由於本創作之微型天線模組（1、2、3 及4)可以微型化，且可以使用相同之微型天線模組來配置在 觸控式手機或是個人數位助理（PDA)之上，然後藉由本創作 之寄生電容值之設計，使得微型天線模組（1、2、3及4)可 以在不增加天線面積下，進行頻率的調整。 最後，還要進一步說明，本創作中的微型天線板20可以 是任何形式者，第2圖所述之微型天線板20僅為說明本創作 之一範例，並非用以限制本創作。 以上所述僅為本創作之較佳實施例，並非用以限定本創作 之權利範圍；同時以上的描述，對於熟知本技術領域之專門人 士應可明瞭及實施，因此其他未脫離本創作所揭示之精神下所 完成的等效改變或修飾，均應包含在本創作之申請專利範圍M360454 V. New description: [New technical field] The parasitic capacitance is set to $4 (especially the "micro-antenna module integral capacitance value" in a matching grid to achieve better coupling effect. Parasitic power 4 to adjust [first month U technology] With the advancement of manufacturing technology, almost all portable 3C products are gone; ^ ... (Miniaturize) 'In particular, the antenna is also miniaturized at the same time, so some have wireless communication Functional portable 3C products are produced in large quantities such as mobile phones (m〇bile ph〇ne), personal digital assistants (pDA) or satellite navigation systems (GPS). FIG. 2 shows a "micro-miniature antenna device disclosed in Japanese Patent Publication No. 1293819 - Chip Antenna", which describes a metal wire 200 formed in a different direction on a dielectric material plate 20 to form an antenna. Device. The dielectric material board 20 of the micro antenna device may be an insulating material, a printed circuit board or a ceramic material, etc.; and the metal line 200 has a line width of mm, and can be adjusted by adjusting the lines of the different bent metal lines 2〇〇 The width, the pitch, and the number of zigzags are used to adjust the bandwidth and frequency response point of the micro antenna device. Further, it is also possible to form a metal contact 21 〇, 220 on each of both ends of the metal wire 200. In addition to miniaturization, the RF antenna has traditionally required the use of a π-type circuit to adjust the impedance of the antenna or to adjust the frequency in order to overcome the interference of external noise. At the same time, due to the wide variety of 3C products, micro antennas cannot be standardized, and some frequency adjustments must be made with different products, so there are many antenna types. In order to solve this problem, in the current prior art 3 M360454, most of them use parasitic capacitors to adjust the frequency, such as: planar antenna, L-type monopole antenna, E-type antenna or inverted F-type antenna; Among them, U.S. Patent No. 7,012,570 discloses an antenna with a printed parasitic capacitor, please refer to Figure 1. As shown in Fig. 1, it is mainly to adjust the frequency by adding a parasitic capacitor by the adjustment unit '410. Obviously, it is not possible to form a parasitic capacitor on only one printed circuit board, but a part of the antenna must be extended to the outside of the printed circuit board, so that the 3C product needs to add extra space to accommodate the antenna. _ In view of the prior art limitations of micro antennas, the present invention provides a miniature antenna module for forming parasitic capacitors on a printed circuit board, so that the micro antenna module can be based on different 3C products without increasing the antenna area. Make frequency adjustments. [New content] In order to solve the above problems, the main purpose of the present invention is to provide a miniature antenna module capable of arranging a capacitor without increasing the area of the micro antenna module, thereby adjusting the oscillation frequency by using a parasitic capacitor. . Another main object of the present invention is to provide a miniature antenna module which can adjust the capacitance value of the parasitic capacitor by the patterning configuration of the parasitic capacitor without increasing the area of the micro antenna module. Another main object of the present invention is to provide a miniature antenna module which can configure a parasitic capacitor and a capacitor without increasing the area of the micro antenna module, thereby adjusting the oscillation frequency by the parasitic capacitor and the capacitor. According to the above object, the present invention provides a miniature antenna module, comprising: a substrate, which is divided into a first region, a second region adjacent to one side of the first region, and a first region And the third region adjacent to the same side of the second region 4 M360454 domain 'a ground plane' is formed on the third region of the substrate; the insulating layer is flatly covered on the ground plane The antenna board is formed on the "electric material board to form a patterned metal line and the first metal contact and the second metal contact are disposed at the two ends, and the micro antenna board is fixed on the first area of the substrate And a second metal layer is further disposed on a side of the micro antenna board adjacent to the ground plane, and the second metal layer is electrically connected to the first metal contact in the micro antenna board; and a third metal layer Formed on the second region of the substrate, wherein the micro antenna module is characterized in that one end of the third metal layer extends to the second metal contact of the micro antenna and is electrically connected to the second metal contact. The other end extends to absolute Layered on and forming a patterned metal layer. The present invention further provides a miniature antenna module comprising: a substrate divided into a first region, a second region adjacent to one side of the first region, and a third region adjacent to the same side of the first region and the second region; a ground plane 'forming a first metal layer on the third region of the substrate; an insulating layer covering the ground plane flatly a miniature antenna board is formed by forming a patterned metal wire on a dielectric material plate and arranging a first metal contact and a second metal contact at a point of the both ends, and the micro antenna plate is fixed to the substrate a second metal layer ′ is further disposed on the first region and a side of the micro antenna plate adjacent to the ground plane, and the second metal layer is electrically connected to the first metal contact in the micro antenna plate; and The third metal layer is formed on the second region of the substrate, one end of which extends to the other side of the micro antenna and is electrically connected to the second metal contact, and the other end of which extends to the insulating layer and forms a patterned metal The micro antenna module is characterized in that the patterned metal layer is formed by a plurality of discontinuous metal layers. The present invention further provides a wireless communication device including a body, a display unit, a touch unit, and a a stylus, a dialing keyboard, and an antenna device, the 5 M360454 antenna device is electrically connected to a micro antenna module via a feeding component, wherein the micro antenna weight group comprises: a substrate, which is divided into a first region a second region adjacent to one side of the first region, and a third region adjacent to the same side of the first region and the second region; a ground plane having a first metal layer shape - Formed on the third region of the substrate; an insulating layer is flatly covered on the ground plane, and a miniature antenna plate is formed on a dielectric material plate to form a patterned metal wire and patterned metal wire A first metal contact and a second metal contact are disposed on the two ends, and the micro antenna plate is fixed on the first region of the substrate, and the micro-age antenna plate is adjacent to one side of the ground plane, Stepping a second metal layer' and the second metal layer is electrically connected to the first metal contact in the micro antenna plate; and a third metal layer is formed on the second region of the substrate Extending to the other side of the micro antenna and electrically connecting with the second metal contact, the other end of the micro antenna is extended to the insulating layer and forming a patterned metal layer, wherein the wireless communication device is characterized by: a miniature antenna module The patterned metal layer in the set is formed from a plurality of discrete metal layers. [Embodiment] Since the present invention discloses a miniature antenna module', in particular, a miniature antenna module having an adjusted oscillation frequency for ensuring the best matching value between the micro antenna module and the communication device. Since the detailed manufacturing or processing of forming a metal layer or the like on the circuit substrate by some of the micro antennas used in the present invention is achieved by the prior art, it will not be fully described in the following description. Moreover, the drawings in the following texts are not completely drawn according to the actual relevant dimensions, and their functions are only to express the schematic diagram related to the present feature. First, the "eyes refer to Fig. 3" is the schematic of the miniature antenna module of the present invention. As shown in FIG. 3, the substrate 10 is divided into a first region 12, a sixth M360454 second region 14 and a third region 16, wherein the first region is adjacent to one side of the first region, and the third region is Adjacent to the same side of the first area and the second area, wherein the 'third area and the second area are not connected together. In addition, the substrate 1 can be 'printed circuit board (PCB), especially a single layer, a printed circuit board or a multilayer printed circuit board. Next, please refer to Figure 4, which is a schematic diagram of one embodiment of the miniature antenna module of the present invention. As shown in FIG. 4, a micro-antenna plate 20 is disposed on the first region 12 of the substrate 10, and the micro-antenna plate 20 is soldered to the substrate 1 using, for example, a surface mount technique (Surface Mount, TeChn〇l〇gy; SMT). The first area on the 12th. Wherein the 'micro antenna board 2' is formed on the dielectric material board 20 to form a metal wire 2弯 bent in different directions to form an antenna device, and at both ends of the different bent metal wires 200, as shown in FIG. The first metal contact 21〇 and the second morning contact 220 are formed. Then, a metal layer 30 is formed on the third region 16 of the substrate 1; for example, using a plating process, the metal layer is covered on the third region 16 of the substrate 10 to serve as a micro antenna module. Grounding Plane. Since the third region 16 and the second region 14 are not connected together, a gap 1 18 is formed between the metal layer 3 and the micro-antenna plate 20. Then, a flat insulating layer (not shown) is formed on the metal layer 3'. The insulating layer may be a dielectric material; for example, the insulating layer is a p yimide material layer. It is to be noted that, in the insulating layer of the present invention, the dielectric material having different dielectric values and the thickness of the insulating layer can be selected depending on the capacitance value to be formed. Then, a metal layer 22 is further formed on the space 18 between the metal layer 30 and the micro-antenna plate 20, whereby the metal layer 22 is electrically connected to the micro-antenna plate 2 〇 "the first metal contact 210, The metal layer 7 M360454 40 is formed on the second region 14 of the substrate 20, and the metal layer 42 is connected to one end of the metal layer 40 to the micro antenna 20. The second metal contact 220 is electrically connected to the second metal contact 220; and the other end of the metal layer 40 extends to the insulating layer, and a patterned metal layer 44 is formed on the insulating layer. The patterned metal layer 44 can be geometrically shaped, for example, concentric circles or concentric rectangles as shown in Fig. 4 or irregular surrounding metal layers. Obviously, the present invention extends the patterned metal layer 44 onto the insulating layer such that the patterned metal layer 44 and the metal layer 30 under the insulating layer can be formed into a parasitic capacitance structure; therefore, the creation can be The size of the area formed by the patterned metal layer 44 determines the capacitance of the parasitic capacitance. Therefore, when one end of the parasitic capacitance is electrically connected to the second metal contact 220 of the micro-antenna board 20, the parasitic capacitance can be used to adjust the frequency. Therefore, when the micro antenna module 1 of the present invention is disposed in the 3C product via a feed element 50 (for example, a coaxial cable), it can be lifted without increasing the area of the micro antenna module 1 to achieve the purpose of adjusting the frequency. The signal terminal 52 of the feed component 50 is electrically connected to the metal layer 22, and the ground terminal 54 is electrically connected to the ground plane. The antenna signal is transmitted to the 3C product by the feed component 50. In addition, when the base plate 10 is a PCB, the ground plane on the substrate 10 can further extend to the other side of the substrate 10 (not shown), and therefore, there is also a metal layer 30 on the side of the substrate 10; When the substrate 10 is a multilayer circuit board, since the grounding between the layers is connected, the metal layer 30 may also be present on the side between the layers. It will be apparent that these metal layers 30 on the sides of the substrate 10 also form a parasitic capacitance effect with the patterned metal layer 44. Next, please refer to FIG. 5, which is a schematic diagram of another embodiment of the micro antenna module of the present invention. The micro antenna module 2 shown in FIG. 5 is identical in structure to the micro antenna module 1 shown in FIG. 4, and only the structure of the patterned metal 8 M360454 layer 44 is different. The structure of the miniature antenna module 2 will not be repeated here. As shown in FIG. 5, the patterned metal layer 44 is composed of a plurality of non-connected metal segments, wherein the unconnected metal segments are separated by at least one segment 46; the discontinuous patterned metal The structure of layer 44 is of an approximate geometric shape, such as a concentric circle or a concentric rectangle as shown in Fig. 4 or an irregular surrounding metal layer. Therefore, after a part of the metal line segments are electrically connected by soldering; for example, the sections 46 in FIG. 5 are electrically connected together, so that the metal line segments can be formed into different areas, so that the requirements can be made according to requirements. The number of solder segments 46 is determined to determine the capacitance of the parasitic capacitance. Therefore, when the micro antenna module 2 of the present embodiment is disposed in the wireless communication product via the feeding component 5, the frequency of the s weekly frequency can be achieved without increasing the area of the micro antenna module 2. It is to be noted here that the parasitic capacitance of the present embodiment can be determined by soldering. Therefore, the micro antenna module 2 of the present embodiment can have a higher range of frequency adjustment. Therefore, the micro antenna module 2 can be appropriately designed by using the micro antenna module 2, and the product can be used at different frequencies; for example, a product equipped with wireless communication (such as IEEE802.1 la/b/g, Bluetooth, etc.) Including wireless cell phone (cellular phone), Global Positioning System (GPS), Personal Digital Assistant (PDA), notebook computer (NB) and MP3 with signal receiving function. Next, please refer to Fig. 6, which is a schematic diagram of another embodiment of the miniature antenna module of the present invention. The micro antenna module 3 shown in FIG. 6 is identical in structure to the micro antenna module 2 shown in FIG. 5 except that the patterned metal layer 44 is not formed on the metal layer 30. Therefore, this embodiment The structure of the micro antenna module 3 will not be described again. As shown in Fig. 6, a capacitor element 6 is connected between the gold layer 9 (ground plane) and the metal layer 40 in the micro antenna module 3, and the capacitor element 60 can be a variable capacitor. Therefore, when the miniature antenna module 3 of the present invention is disposed in a wireless communication product via a feed element 50, the frequency adjustment can be achieved by adjusting the battery element 60. Further, when the cell element 60 is completed, it is also possible to selectively form an insulating layer in the metal layer %. Next, please refer to Fig. 7, which is a schematic diagram of still another embodiment of the micro antenna module of the present invention. Obviously, the micro antenna module 4 shown in FIG. 7 is in the structure of the micro antenna module 2 of FIG. 5, and a capacitive element 60, which may also be a variable capacitor. Therefore, the structure of the micro antenna module 4 in this embodiment is not repeated. As shown in Fig. 7, a capacitor element 60 is connected between the metal layer 30 (ground plane) and the metal layer 4A in the micro antenna module 4, and the capacitor element 60 may be a variable capacitor. Therefore, when the micro antenna module 4 of the present invention is disposed in a wireless communication product via a feeding element 5, the metal segments can be formed differently by electrically connecting at least one segment 46 together. In addition to the purpose of adjusting the frequency, the frequency can be adjusted by adjusting the capacitance element 6〇 at the same time. Obviously, this embodiment can have a large frequency adjustment function. Similarly, the micro antenna module 4 of the present embodiment can be appropriately designed to use the micro antenna module 4 at different frequencies; for example, a device equipped with wireless communication (such as IEEE802.Ua/b/g, Bluetooth, etc.) Products, including Cellular Phone, Global Positioning System (GPS), Personal Digital Assistant (PDA), Notebook (NB) and MP3 with signal reception Wait. Next, the application of the present creation will be described in a wireless communication device. Please refer to Figure 8 for a schematic diagram of the wireless communication device of the present invention. As shown in Fig. 8, the M360454 wireless communication device 8 can be a touch-sensitive mobile phone, which can also be a personal PDA. The wireless communication device 8 includes a body 81, a display unit 82, a touch unit 83, a stylus pen 84, a dialing keyboard 85, and an antenna device 86. The antenna device 86 is based on the feeding component 50. The miniature antenna modules (1, 2, 3, and 4) are electrically connected to the wireless communication device 8. Obviously, the miniature antenna modules (1, 2, 3, and 4) of the present invention can be miniaturized, and can be configured in a touch mobile phone or a personal digital assistant (PDA) using the same miniature antenna module. Then, by the design of the parasitic capacitance value of the present invention, the micro antenna module (1, 2, 3, and 4) can adjust the frequency without increasing the antenna area. Finally, it is further explained that the miniature antenna board 20 in this creation can be of any form, and the miniature antenna board 20 described in FIG. 2 is merely an example of the present invention and is not intended to limit the creation. The above description is only the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention; the above description should be understood and implemented by those skilled in the art, and thus the other disclosures are not disclosed. The equivalent changes or modifications made under the spirit of the spirit shall be included in the scope of the patent application for this creation.
【圖式簡單說明】 第1圖 係一種在天線模組中使用電容構造來調整頻率之一 先前技術示意圖。 第2圖 係一種微型天線板之先前技術示意圖。 第3圖 係本創作之微型天線模組之基板示意圖。 第4圖 係本創作之微型天線模組之第一實施例之示意圖。 第5圖 係本創作之微型天線模組之第二實施例之示意圖。 11 M360454 第6圖 係本創作之微型天線模組之第三實施例之示意圖 第7圖 係本創作之微型天線模組之第四實施例之示专圖 第8圖係本創作之無線通訊裝置之示意圖。 【主要元件符號說明】 1、2、 10 3、4 微型天線模組 基板 12 >14 16 第一區域 第二區域 第三區域 18 間隔 20 22 30 40 42 ， 44 46 50 51 52 8 81 82 83 84 微型天線板 金屬層 金屬層 金屬層 金屬層 金屬層 間隔 饋入元件 訊號端點 接地端點 無線通訊裝置 本體 _示單元 觸控單元 觸控筆 12 M360454 85 撥發鍵盤 天線裝置 86[Simple diagram of the diagram] Fig. 1 is a schematic diagram of a prior art technique in which a capacitor structure is used to adjust the frequency in an antenna module. Figure 2 is a prior art schematic of a miniature antenna board. Figure 3 is a schematic diagram of the substrate of the miniature antenna module of the present invention. Figure 4 is a schematic view of a first embodiment of the miniature antenna module of the present invention. Figure 5 is a schematic view of a second embodiment of the miniature antenna module of the present invention. 11 M360454 Fig. 6 is a schematic diagram of a third embodiment of the micro antenna module of the present invention. Fig. 7 is a diagram showing a fourth embodiment of the micro antenna module of the present invention. Fig. 8 is a wireless communication device of the present invention. Schematic diagram. [Description of main component symbols] 1, 2, 10 3, 4 Miniature antenna module substrate 12 > 14 16 First area Second area Third area 18 Interval 20 22 30 40 42 , 44 46 50 51 52 8 81 82 83 84 Mini Antenna Board Metal Layer Metal Layer Metal Layer Metal Layer Metal Layer Interval Feed Element Signal End End Ground Terminal Wireless Communication Device Body _ Display Unit Touch Unit Stylus 12 M360454 85 Dial Keyboard Antenna Unit 86