M353465 . · - .... . ... .... .... . ... ... .... .. 八、新型說明： 【新型所屬之技術領域】 -種撕金機，尤射自軸除 【先前技街j 屬之撕金機。M353465 . · -.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . , especially shot from the axis of the [previous technical street j belongs to the tearing machine.
按，在晶圓的製造過程尹主 Au)，作為晶圓切割為晶粒如㈤會電鑛―層貝重金屬（一般W 會有多餘的背> _但魏時為·表面電鍍’ _ ^用制，且多餘的部侧_力錢，所以，Λ t-多彻人工在aagj表面無 · 金屬可隨獅纏a 雜得▼’贿乡麵分的貴重 金屬了以膠帶剝離晶圓表面， 田缺二, 妒上所黏者的貝重金屬可再回收利 上^，此種_人工無膠帶財式，不但#畴力，且使成本 欲改概取嶋缺㈣她_業者所亟 【新型内容】 作叫㈣繼，频金賴嶋面自動黏貼膠 帶及剝離，以制自槪健，並降低成本。 、為達成上述目的，本創作之撕金機係設置有承置，而承載裝 置為具有，座’且機絲面設置有軌道，並於軌道上設置有可旋轉 及可依軌道鶴之林座，且承健為可承載魏晶圓，而轨道一端 之上方處②置有姆裝置’而撕雜£制設有軸輪，踢膜輪一 侧設置有收膜輪’並於膠雜與收_之間設置有，可上下移動並抵 持於承載座表面之抵壓輪。 M353465 ：.....…........... ...... . .. ... . - - . · .. 【實施方式】 /閱t 11至第二圖所示’係為本創作之侧視示意圖、承載座 _卜觀圖及承載座部分放大立體外觀圖，由圖中可清楚看出，本 創作之撕金機係設置有承錄置1及讎裝置2，其中： 载農置1為具有—機座11，*機座11表面設置有執道1 、、1 2上^又置有承載座1 3，並於承載座1 3表面設置有複 片 01而各吸盤131設置有可吸氣之氣孔13 i i，且 私孔1311四周圍設置有與氣孔丄3 i丄相連通之凹槽m 2。 % i撕轉置2為位於軌道丨2—端之上方處，而撕黏裝置2為固 又有膠膜輪2 1 ’且賴輪2 1-侧設置有收膜輪2 2，並於膠膜輪 21與收膜輪2 2之間設置有抵壓輪2 3，且膠膜輪2丄與抵壓輪2 3之間叹置有撕膠導引輪2 5，而抵壓輪2 3與收膜輪2 2之間設置 有收膠導引輪2 6，並於膠膜輪2 i上裝設膠帶2 4，且膠帶2 4為 依序繞經撕膠導引輪2 5、抵壓輪2 3及收膠導引輪2 收 膜輪2 2。 月同寺H®至第七圖所示’係為本解承載座部分放大立 體外觀圖，本創作之動作示意圖㈠、動作示意圖㈡、動作示意 圖㈤及承魅旋轉示中可得知，#複數關3分別置 放於承載座13之各吸射31表面時，晶圓3為會覆蓋整個凹槽丄 312，此時吸盤131之氣孔13!i為會持續吸氣，俾使凹槽工 3 1 2内產生負壓’進而讓晶議定於承載座丄3表面，而當晶圓 3固疋後，承載座13會依軌道χ 2而朝向撕黏裝置2移動，而當承 M353465 載座13移動靠近撕黏裝置2之抵壓輪2 3時，抵壓輪2 3會下降至 一定高度，使承載座13經過抵壓輪2 3下方時，抵壓輪2 3可將膠 ▼2 4抵壓於晶圓3表面’而當抵壓輪2 3之膠帶2 4抵壓至晶圓3 -表面時，該收膜輪22會開始捲收膠帶2 4，迫使膠膜輪2工之膠帶 2轉續由抵壓輪2 3捲收至收膜輪2 2，且收·2 2的捲收速度 約等於承載座13的移動速度，進而讓經過抵壓輪2 3的晶圓3其表 -面的貴重金屬郷帶2 4黏住，並由晶圓3表面剝離，使獅的貴重 鲁金屬會隨著膠帶2 4捲收於收膜輪2 2，而當承載座1 3通過抵壓輪 2 3後’收膜輪2 2為會停止捲收並向上升起，使承載座丄3可依執 道12退回至原來位置，並將承載座i 3旋轉i 8 〇度，並重複上述 使晶[表面再次經由膠帶24而將表面所殘留的貴重金屬剝 、’黏貼至膠帶2 4 1當完成二次雜_動 ;原位時，該氣孔1311會停止吸氣，使凹槽13^ 天，進而讓晶圓3可脫離承载座丄3。 【圖式簡單說明】 第一圖係為本創作之側視示意圖。 第二_為本創作承触之立體外觀圖。 •第三圖係為本創作承載座之部分放大立體外觀圖。 -第四職為本創作之動作*意圖（一）。 苐五圖係為本創作之動作示意圖（二）。 第"、圖係為本創作之動作示意圖（三）。 第七圖係為本創作之承載座旋轉示意圖。 M353465 【主要元件符號說明】 1、承載裝置 1 1、機座 1 3 1、吸盤 1 2、執道 1 3 1 1、氣孔 13、承載座 1 3 1 2、凹槽 2、撕黏裝置 21、膠膜輪 2 2、收膜輪 2 3、抵壓輪 2 4、膠帶 2 5、撕膠導引輪 2 6、收膠導引輪Press, in the wafer manufacturing process Yin main Au), as the wafer is cut into grains such as (five) electricity mine - layer shell heavy metal (generally W will have excess back > _ but Wei Shi is · surface plating ' _ ^ The system is used, and the excess side is _power, so, Λ t-multi-manually on the surface of aagj, the metal can be ridden with the lion, and the precious metal of the bribe is peeled off. The lack of the second, the sticky metal of the sticky on the sputum can be recycled on the ^, this _ artificial non-adhesive financial, not only #域力, and the cost is intended to change the lack of (four) her _ business owner 亟 [new Contents] Calling (4) Following the frequency, the tape is peeled off automatically and the cost is reduced. In order to achieve the above objectives, the tearing machine of this creation is provided with a bearing, and the carrying device is The utility model has a seat and a track provided with a track, and a rotatable and orbitable crane seat is arranged on the track, and the bearing is capable of carrying the Wei wafer, and the upper end of the track is provided with a device. The torn wheel system is provided with a shaft wheel, and the filming wheel is provided with a film collecting wheel on one side and is disposed between the glue and the receiving _ It has a pressing wheel that can move up and down and resist the surface of the carrier. M353465 :............................... - - . . . . [Embodiment] / Read t 11 to the second figure is a side view of the creation, the carrier _ _ view and the magnified three-dimensional appearance of the carrier part, as can be seen from the figure It can be seen that the tearing machine of the present invention is provided with a record setting device 1 and a device 2, wherein: the carrier 1 is provided with a base 11, and the surface of the base 11 is provided with a road 1 and a 1 2 Further, a carrier 13 is disposed, and a multi-layer 01 is disposed on the surface of the carrier 13 and each of the suction cups 131 is provided with an air venting hole 13 ii, and the private hole 1311 is disposed around the air hole 丄 3 i 丄The groove m 2 . % i tear transposition 2 is located above the end of the track 丨 2, while the tearing device 2 is solid and has a film wheel 2 1 ' and the rim 2 1 side is provided with a film collecting wheel 2 2, and a pressing wheel 23 is disposed between the film wheel 21 and the film collecting wheel 2 2 , and a tearing guide wheel 25 is interspersed between the film wheel 2 丄 and the pressing wheel 2 3 , A rubber receiving guide wheel 2 6 is disposed between the pressing wheel 2 3 and the film collecting wheel 2 2 , and is disposed on the film wheel 2 i The tape 2 4 is installed, and the tape 2 4 is sequentially wound around the tearing guide wheel 2 5 , the pressing wheel 2 3 and the glue guiding wheel 2 to take up the film wheel 2 2 . Yuetong Temple H® to the seventh figure The figure shown in the figure is a magnified three-dimensional appearance of the solution carrier. The schematic diagram (1) of the creation, the schematic diagram of the action (2), the schematic diagram of the action (5) and the rotation of the enchantment are known, and #复关关3 is placed on the carrier 13 respectively. When each of the surfaces of the 31 is sucked, the wafer 3 covers the entire groove 312, and at this time, the air holes 13!i of the suction cup 131 are continuously inhaled, so that the negative pressure is generated in the groove 3' 2 The crystal is fixed on the surface of the carrier 3, and when the wafer 3 is fixed, the carrier 13 will move toward the tearing device 2 according to the track χ 2, and the bearing of the M353465 carrier 13 moves closer to the tearing device 2 When the wheel 2 3, the pressing wheel 2 3 will drop to a certain height, so that when the bearing seat 13 passes under the pressing wheel 23, the pressing wheel 23 can press the glue ▼2 4 against the surface of the wafer 3' When the tape 2 4 of the pressing wheel 2 3 is pressed against the surface of the wafer 3 - the film winding wheel 22 starts to wind up the tape 2 4 , forcing the tape 2 of the film wheel 2 to be continuously rotated by the pressing wheel 2 3 Received The winding speed of the film wheel 22 is about equal to the moving speed of the carrier 13, and the surface of the wafer 3 passing through the pressing wheel 23 is adhered to the precious metal tape 2 4 of the surface. The surface of the wafer 3 is peeled off, so that the precious metal of the lion will be wound on the film take-up wheel 2 2 with the tape 2 4 , and the film take-up wheel 2 2 will stop when the bearing block 13 passes the pressing wheel 2 3 . Roll up and lift up, so that the carrier seat 3 can be retracted to the original position according to the way of way 12, and the carrier i 3 is rotated by i 8 degrees, and the above-mentioned crystal is repeated [the surface is again passed through the tape 24 to leave the surface The precious metal is peeled off, 'sticking to the tape 2 4 1 when the second miscellaneous movement is completed; when the position is in place, the air hole 1311 stops inhaling, so that the groove 13 ^ ^, so that the wafer 3 can be detached from the carrier 丄 3 . [Simple description of the diagram] The first picture is a side view of the creation. The second _ is a three-dimensional appearance of the creation. • The third picture is a partially enlarged stereoscopic view of the creative carrier. - The fourth position is the action of the creation * intent (1). The fifth picture is the schematic diagram of the action of the creation (2). The first ", the diagram is the schematic diagram of the action of the creation (3). The seventh picture is a schematic diagram of the rotation of the carrier of the creation. M353465 [Description of main component symbols] 1. Carrying device 1 1. Base 1 3 1 , suction cup 1 2. Exercising 1 3 1 1 , air hole 13, carrier 1 3 1 2. Groove 2, tearing device 21, Film wheel 2 2, filming wheel 2 3, pressing wheel 2 4, tape 2 5, tearing guide wheel 2 6 , glue guiding wheel