TWM341249U - Heat dissipation structure - Google Patents

Abstract

A heat dissipation structure is provided to solve the problem that a traditional heat dissipation structure always needs extra heat dissipation parts to be added in small space to dissipate heat fast. The problem is solved by setting a first set of heat dissipation fins directly touched a heat source on a PCB and a second set of heat dissipation fins extended outside the PCB in the opposite direction to the first set of heat dissipation fins to receive air in different directions at the same time. According to the above-mentioned structure, a high efficiency way to dissipate heat from a heat source on a PCB without any extra added heat dissipation part can be accomplished easily.

Description

M341249 VIII. New description: [New technical field] The type has a heat dissipation structure with extended reverse arrangement. In particular, it refers to the structure of the heat sink of the _ fin. [Prior technology] = advances in technology' The effectiveness of electronic devices is increasing. However, when electronic clothes are in operation, heat is generated. If these heats are not properly dispersed, the electronic devices will be turned down, and even more. It will be the heart-burning device of the money-making device. Therefore, the previous heat-dissipating devices that have become the equipment for the age-old electricity payment are designed for the central processing unit ((5) Can Face Unit, CPU), but due to the current game software The enamel and fluency are constantly improving, and the powerful display cards are constantly updated. From the earliest monochrome display card to the witnessed 3D graphics accelerated display card, the design of the display card has passed the industry standard architecture bus (ISA bus), the video electronic engineering standards association regional bus (Video Electronic Standard Association Local bus ' VESA Local bus), Peripheral Component Interconnect (PCI bus), Advanced/Accelerated Graphics Port (AGP bus) until the current pci Express standard bus ( Peripheral Component Interconnect Express (PCI-E bus), using the various interface designs described above, to meet the demand for ijc bucket circulation in high-order display. Therefore, the display wafer must also have a corresponding design to enable the processing of the display wafer. Speed can meet the needs of high-end display for data circulation. M341249 In the display chip with lower operating frequency, the heat generated by the display chip can be controlled by the heat dissipation I. Only the heat dissipation fins are used to meet the demand for rapid heat dissipation. Take the image of the brother 1 as an example. A cross-sectional view of a conventional heat sink. In the "Fig. 1", a heat-dissipating fin 13 having a plurality of fin-shaped high heat transfer coefficient fins is attached to the printed circuit board n to increase the area of contact of the heat generating component 12 with the air, and Through the natural convection method, the high thermal conductivity fins 13 are in contact with the cold air, and the heat energy generated by the heating element 12 is dissipated, thereby achieving the effect of rapid heat dissipation. However, as the operating frequency of the display wafer increases, the display card can handle a large amount of data operations to cope with the work of high-order graphics operations, but it is accompanied by a large increase in the amount of heat generated by the display wafer, which tends to cause excessive temperature. Affects the performance of the entire system. Therefore, for a heat dissipating device using only heat dissipating fins, the display wafer applied to the high-frequency=frequency has no need for rapid heat dissipation, so in order to help the similar display crystal (4) component to be able to dissipate heat, f know The method is to use the heat sink fins on the device to dissipate the additional heat sink components to satisfy the fast heat. The heat sink includes the heat sink and the heat sink. In combination with a heat pipe, it is a combination of a heat sink fin, a heat pipe and a heat release fan. Taking "Fig. 2" as an example, "Fig. 2" is a cross-sectional view of a conventional heat sink with a heat dissipation component. In "Fig. 2", if a plurality of fin-shaped heat transfer fins 13 are provided, the heat element film attached to the printed circuit board 11 is 'missed to increase the area of the heat generating element 12 in contact with the air. And the heat-dissipating fan 14 is coupled to the heat-dissipating fan 14 to extract or blow the airflow M341249 to the high-heat-dissipation heat-dissipating fin π by the rotation of the heat-dissipating fan 14, thereby dissipating the heat energy generated by the heat-generating component I2, thereby achieving rapid heat dissipation. . However, the increased cost due to the addition of additional heat dissipating components' is also higher, and the problem of increased power consumption, noise, and vacancies is caused. , to reduce the cost of production, power consumption and noise, etc., therefore, more emphasis on the improved design of the dispersion itself, such as increasing the volume of the heat sink and the surface area of the heat dissipation, by increasing the volume of the heat sink, in anticipation The heat 'and the increased heat dissipation surface area of the filaments can increase the efficiency of the heat sink, but the way to increase the volume of the heat sink and the surface area of the heat sink, but the internal or external The space on the substrate that can be set is (PCI-EE^sionSlot) ^ ★,,, the available printed circuit board space is quite limited, so the problem of how to solve the red chip frequency display chip in a limited space will be The focus of this creation is to solve the heat demand, mute and save the space of the heat sink space ib _ , reduce power consumption, [new content] pieces exist in the limited space need to cooperate with additional heat dissipation elements (four) hot elements and The composite board is used to dissipate heat from the heating element. The M341249 includes: a bottom, a protrusion, and the bottom is _ in printing Circuit board

One side of the road plate is more convexly provided with a heat absorbing portion, and the heat absorbing portion directly contacts the heat generating component for heat absorption; the protruding portion

• The structure of the heat sink disclosed in this work is as above, and the difference from the prior art is that this _ in the limited space, through the reading section can increase the heat absorbed by the heat (1) per unit time to increase the heat of absorption; The first-scattering chip set on the 70 pieces of heat, and the second heat-dissipating fin plate extending away from the _ sharp plate of the heat-dissipating element with the first-scattering piece _, enables the smashing matter to simultaneously contact from different directions The airflow can dissipate the heat generated by the heating element in a more efficient manner to improve the heat dissipation efficiency, and increase the heat dissipation extension in the heat sink to increase the unit_(10) heat dissipation I liter heat dissipation efficiency. This creation of the political thermal device is used to pass through the ^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^ The frequency display shows the heat dissipation requirement on the wafer, and the technical effect of increasing the heat dissipation efficiency can also be achieved. Through the above technical means, the creation can achieve the technical effect that the heat sink does not need to be equipped with additional heat components and can still be used for heat dissipation. [Embodiment] Hereinafter, the implementation of the present invention, M341249, will be described in detail with reference to the drawings and the embodiments. The implementation process of how to apply the technical means to solve the technical problem and achieve the technical effect can be fully understood and implemented. _ First introduce the structure of the creation of the weaving structure, please refer to the "3rd picture", and the "3rd picture" is the structure of the creation of the weaving structure. The heat sink structure of the present invention comprises a bottom portion 2, a protruding portion 30, a first heat radiating fin group 40, and a second heat radiating fin group 5A. The heat sink structure of the present invention can be applied to a printed circuit board (PCB) having an arithmetic chip and a plurality of electronic components, and the main heating element is located on the printed circuit board (PCB). The heat dissipating component can dissipate the heat generating component on the printed circuit board. The printed circuit board is an interface card, the interface card can be a display card or a drawing card, and the operation chip of the interface card is a graphic processor (GraphicPr〇cessing)

Unit, GPU), for the upper processing chip, it is possible to heat the heating element of the heat sink structure. The bottom portion 20 is mainly fixed on the printed circuit board, and a heat absorbing portion 21 is further protruded on the surface fixed on the printing board, and the heat absorbing portion 21 is used for directly contacting the heat generating component of the printed circuit board for heat absorption. . • The protrusion 30 extends from the bottom 20 side toward the leading edge of the printed circuit board and protrudes beyond the printed circuit board. On the PCI_E expansion slot, the printed circuit board space is quite limited. The heat absorption volume and the heat dissipation area can be increased by the protrusion 30 to increase the heat absorption amount and heat dissipation amount per unit time. The first heat dissipation fin set 40 is disposed on the other side of the bottom portion 2 and includes a plurality of heat dissipation fins 41. The second heat dissipation fin group 5 is disposed on the opposite side of the first heat dissipation fin group 4〇9 M341249. The protruding portion 30 includes a plurality of heat dissipating fins 51. The reverse design of the first heat sealing tab group 40 and the first heat dissipating tab group 50 enables the heat dissipating device to simultaneously contact the airflow from different directions. A more efficient way to dissipate the heat generated by the heating element. In addition to the protrusion 30 extending from the bottom 20 side to the front edge of the printed circuit board, a heat dissipation extension 60 extends toward the rear edge of the printed circuit board on the other side of the bottom portion 20, and is formed in the printed circuit board, the heat dissipation extension portion The extension of the 6〇 is inside the printed circuit board, which is limited by the space factor, but can increase the heat absorption volume and heat dissipation area in the limited space of the PCI-E expansion slot specification printed circuit board. Increasing the amount of heat absorbed per unit time and the amount of heat dissipated helps to dissipate heat from the heat sink. The protruding portion 30 and the heat dissipation extending portion 60 and the plurality of electronic components designed on the printed circuit board can extend from the bottom portion 2 to the leading edge or the trailing edge of the printed circuit board at a height higher than the height of the electronic component to avoid the electronic component. Please refer to "Figure 4" for details. Next, through "5th to 7th", the technical features of the shape and arrangement of the fins and the structure of the heat sink are further explained. First, as shown in Figure 5, Figure 5 is a side view of the structure of the heat sink. The heat sink is blown by the first airflow 71 to the first heat sink fin. The chip group 40 dissipates the heat energy of the first heat dissipation fin group 4〇, and the first air current 71 can quickly dissipate the heat energy of the first heat radiation scale group 40. Generally, the first airflow 71 is natural convection, but not only Limited to natural convection, it also includes airflow in other different directions, such as the airflow generated by the fan in the cabinet M341249, the airflow from other interfaces, and the airflow of the employee. The parent-political fin group 50 is blown by the second airflow 72 to the second heat-dissipating two, 50, so that the second airflow 72 can dissipate the thermal energy of the second heat-dissipating fin group, and pass through the second airflow 72. The heat energy of the second scatter sheet group 50 can be quickly dissipated 'typically the second air stream 71 is _ convection, but not limited to

The strong convection system is the airflow generated by other diverting devices. Of course, the air compressor 72 also includes other airflows in different directions, and may also be natural convection. For example, the airflow generated by the fan disposed in the casing, and other components are placed in the air. The generated airflow···etc. Through the first airflow 71 and the second airflow 72, the first scatter version 4 (m and the second scatter version 5G) of the original scatter is dissipated at the same time, so that the singer is placed in a separate direction. For example, the U1 and the second airflow 72, the first heat sink fin set 40 and the second heat sink (four) (four) of the present diffusing device are disposed between the limited space of the printed circuit board of the PCI_E expansion slot specification. Cooling is performed to meet the rapid heat dissipation requirements of the high-frequency heating elements. Next, the bottom 20 is provided with a heat absorbing part 2 and a fourth set of shapes and configurations. Here, please refer to "Fig. 5 And "4th" and "6th" are partial enlarged views of the bottom of the creation and the heat-dissipating fin group. °----------------------------------------------------- The total volume of heat absorbable is subjected to _, and the created filament is placed in the heat portion 21 to absorb the heat energy of the heat generating component 81 on the printed circuit board 80, since the heat absorbing portion 21 protruding from the bottom portion M341249 20 increases the bottom portion 2 单位 in unit time The total amount of heat that can be absorbed inside, can The more heat is collected, the heat absorption heat is increased. The heat sink unit 21 absorbs the heat energy of the heating element 81 on the printed circuit board 8 and transmits it to the bottom 2 〇, the first heat sink fin group. 40, the protruding portion 3G and the second heat-dissipating fin group 5G, as shown in the "figure 5", the heat-dissipating film 41 in the first heat-dissipating die set 40 is interposed with high heat dissipation 411 and low heat dissipation 412 Setting, the first heat-dissipating Korean chip set • 40 heat-dissipating fins 41 are arranged in parallel with the high heat-dissipating fins 411 and the low-heating heat-dissipating fins 412, and the heat-dissipating fins are also arranged at equal intervals and in parallel. The heat dissipation area of the low heat dissipation fins 412 is smaller than the heat dissipation area of the high heat dissipation fins 411. Therefore, the heat dissipation of the low heat dissipation errors 412 is less than that of the heat dissipation fins 412 per unit time. The heat dissipation fin 411 has a heat dissipation amount. Therefore, the temperature of the low heat dissipation fin 412 is higher than the high heat dissipation fin 411. Since the temperature difference between the high heat dissipation film 411 and the low heat dissipation fin 412 is formed, the temperature difference is accelerated. The efficiency of the stream The natural-convection heat dissipation efficiency of the heat dissipation fins 41 in the first heat dissipation fin group 4 is increased. • And each of the heat dissipation tabs 41 of the first heat fin group 40 has a rectangular planar shape, and Each of the heat dissipation fins 41 of the first heat dissipation fin group 4 is formed in a shape of a cone, and the shape of each of the first heat dissipation fins 4 is designed to be a cone shape. The geometry of the heat dissipating fins 41 can be ~a to the amount of heat that can be taken away when the working fluid passes through. Therefore, when the shape of the heat dissipating fins 41 is tapered, the amount of air that can pass through is increased, so that the air flow When the heat sink fins are removed, the heat can be taken away. 12 M341249 7 Next, please refer to the "5th figure" and "7th figure", and the "picture" is the creative highlight and the second _ A partial enlarged view of the slice group. The Lidi-heat-dissipation fin group 50 is disposed on the opposite side of the first-side heat-dissipating fin group β 30 ′ and includes a plurality of heat-dissipating fins 51.

The arrangement of the second heat sink fin group 5G per heat sink fin 5丨 is arranged with high heat dissipation: the sheet and the low dispersion sheet 512 are interleaved, and the second heat sink Korean group is separated by a high dispersion sheet 511. In addition, the heat dissipating fins Μ, the high fins 511, and the low dispersing _ 512 are also disposed at equal intervals and in parallel, and the heat dissipation effect achieved by the same is not described herein. In addition, the shape of each of the heat dissipating Korean cymbals in the second heat-dissipating rotor group 5 呈 is a rectangular flat shape, and the shape of the scatter-type 50 towel per ray-shaped film W is presented as a cone. The heat dissipation effect achieved by the above is not described here. In addition, the protruding portion 30 can be designed to have an inclined surface design, in addition to having a more beautiful visual effect, and also protecting the Wei, can avoid the damage caused by the domain angle when the user installs the interface card. Through "8th" and "9th", "8th" is the three-dimensional touch of the structure and the _ circuit board; "9th" is the creation of the loose wire. Straight combination diagram of the circuit board. Since the heat sink device is applied to the heat dissipation of the heat generating component 81 on the printed circuit board 8, the bottom portion 2 must be fixed to the printed circuit board 80 through the fixing component %, and the fixed component 9 disclosed in the drawing is adopted. The bottom portion 20 is connected and fixed to the printed circuit board 80 by screwing, and the combined stereoscopic appearance

M341249 is shown in Figure 9. The middle fixing member 90 includes: a stud having the same height as the heat absorbing portion 21, and one of the plurality of protruding posts 91 is convexly provided with the first stud 92 and the first stud 92 and has an external thread, and the other side of the stud 91 The right side of the convex machine - the outer convex body has a first convex column 93 and the second convex column 93 and has an internal thread. The bottom portion 20 is in the reading portion 21 _ recessed money number tilting - the inner column of the column "phase", the text, or the 底部 'bottom 2 凸 around the heat absorbing portion 21 is convexly provided with a plurality of "two pillars 93" Corresponding external threads, so that the stud 91 can be screwed to the bottom π printed circuit board 8G, according to the relative position of the second stud 93 of the stud 91, there is a hole 83, the through hole 83 uses a screw 94 and elasticity The element 95 is screwed with the second stud 93 of the stud 91 so that the bottom portion 20 is fixed to the printed circuit board 8 through the fixing member 9 。. The above-mentioned fixing member is described by only one embodiment, but the limitation is not limited thereto. According to the invention, any fixing method capable of achieving a fixed effect, such as a fastening method such as a snapping or a snapping 1, can be protected by the patent. In summary, it can be seen that the difference between the present creation and the prior art lies in In the limited space, the heat absorption part can increase the heat absorbed by the self-heating component per unit time to enhance the heat absorption heat; through the hot fin group attached to the heating element' and the first heat dissipation Fin set opposite Extending to the second heat sink fin group outside the printed circuit board where the heat generating component is located, the heat sink device can simultaneously contact the airflow from different directions, and the heat energy generated by the heat generating component is fully dissipated in a more efficient manner to improve heat dissipation. Efficiency, and increase the heat dissipation protrusion on the heat-dissipating body can increase the heat dissipation in a unit of time and improve the thermal efficiency of the 14 M341249. The Japanese H-wire set-up gives a wealth of means and is short in the short == heat energy Go, you can increase the heat dissipation group = in the limited space to meet the heat dissipation requirements of the current high operating frequency display chip, and also achieve the technical effect of increasing the heat dissipation efficiency.

By means of this technology, it can be transferred to the prior art that there is a need to cooperate with additional components in a limited space. _ Heat dissipation needs to be solved, and further, the heat dissipation device needs to be combined with additional heat dissipation components to achieve the technical effect of heat dissipation. . Although the implementation method disclosed in the present application is as above, the content described above is not intended to directly limit the supplement of Wei Nawei. Anyone who is a member of the technical field who has the usual knowledge can make some changes in the real money and details without departing from the spirit and scope disclosed in this work. The patent protection Fan® of this creation, which is defined by Lai Qishe's towel material. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing a conventional heat sink. Figure 2 is a cross-sectional view of a conventional heat sink with additional heat sink components. Figure 3 is a perspective view of the structure of the heat sink. Figure 4 is a perspective view of the structure of the heat sink. Figure 5 is a side view of the structure of the heat sink device. Figure 6 is a partial enlarged view of the bottom of the creation and the first heat dissipation fin set. ^ Figure 7 is a partial enlarged view of the creation protrusion and the second heat dissipation fin set. Figure 8 is an exploded perspective view of the structure of the heat sink and the printed circuit board. Figure 9 is a three-dimensional combination of the structure of the heat sink and the printed circuit board. 15 M341249 [Main component symbol description]

11 Printed circuit board 12 Heating element 13 Heat sink fin 14 Cooling fan 20 Bottom 21 Heat absorbing part 30 Projection 40 First heat sink fin group 41 Heat sink fin 411 South heat sink 412 Low heat sink fin 50 Second heat sink group 51 Heat sink fin 511 South heat sinking strip 512 Low heat sink fin 60 Heat sink extension 71 First air stream 72 Second air stream 80 Printed circuit board 81 Heating element 82 Electronic component 83 Hole 90 Fixing element 16 M341249 91 Stud 92 First convex Column 93 second stud 94 screw 95 elastic element

Claims (1)

M341249 Nine, the scope of application for patents: Ten = heat-dissipating clothing structure 'Using Qing on the Hp brush circuit board with - heating element and a plurality of 7C pieces, the heat sink dissipates heat to the heat element, which includes: The bottom portion is fixed on one side of the printed circuit board, and a portion of the heat absorbing portion is directly protruded from the heat generating component; the dog outlet portion ' extends from the bottom portion to the front edge of the printed circuit board, and protrudes from the bottom portion Formed outside the printed circuit board; the first heat dissipation group is disposed on the other surface of the bottom portion and includes a plurality of heat dissipation fins; and - the second heat dissipation fin group is disposed opposite to the first group of heat dissipation fins The protrusion on one side and includes a plurality of fins. 2. The application of the Lai Jian structure as described in the patent specification, wherein the printed circuit board is an interface card. 3. The heat sink structure of claim 2, wherein the interface card is a display card or a border card. 4. The dislocation structure according to the above-mentioned item (4), wherein the heat dissipating pieces of the first heat-dissipating set are disposed at equal intervals. The heat dissipating device structure according to the first aspect of the invention, wherein the heat dissipating pieces of the first heat dissipating film set are arranged in a high and low heat dissipation manner. 6. The heat dissipation structure according to claim 4, wherein the heat dissipation reading of each of the first heat dissipation fin sets is tapered. 7. The structure of the heat dissipating device described in claim 1 of the patent application, wherein the first 18 M341249 fins of the heat sink fins are equally spaced between each other. 8. As claimed in the patent scope! The heat-dissipating structure described in the item, and the heat dissipation fins of the heat-dissipating fins are set between the high-level and low-heat-dissipation modes. The heat dissipating device structure of the second heat dissipating fin group is tapered like the heat dissipating device structure according to claim 7 or 8. 10. The heat sink structure of claim 1, further comprising a heat dissipating extension extending from the other side of the bottom to the trailing edge of the printed circuit board and formed within the printed circuit board. 11. The heat sink structure of claim 10, wherein the protrusion or heat dissipation extension extends from the bottom toward the leading or trailing edge of the printed circuit board at a height above the electronic components. The heat sink structure of claim 1, wherein the first fins or the fins included in the second fin group are disposed in parallel. The heat sink structure according to claim 1, wherein the bottom portion is provided with a plurality of fixing members around the heat absorbing portion for attaching and fixing the heat absorbing portion to the heat generating member. 19