M340042 八、新型說明： 【新型所屬之技術領域】 本創作係.-種冷熱兩用裝置’特糊於—種使用微熱管之冷 熱兩用褒置。 【先前技術】 目刖市賴易式之冷/熱二雜置’—般財見的主要是以凝膠或 化學溶液作為内容物之裝置。以凝膠（如：纖維素凝膠）作為内 容物之裝置，於使时必縣將裝置置於冷料冷;東，或是於熱 源中加熱，不但使用上非常麻煩，且僅具有短時間（洲分鐘左右） 之保冷、保溫絲。而賴化學㈣作為内容物進行化學反應之 裝置’例如__輕置，魏型職置雜在錄時僅需 扣壓啟動金屬片’即可啟動金屬片與醋酸水溶液形成化學反應而 放熱’但於個過後仍需以水煮還原；岭冷麟，同樣需將冷 ’、、、敷片置於^東庫冷;東，方具冰敷作用。雖然使用化學液體作為 内谷物之冷熱敷片’其保冷、保溫效果較凝膠冷熱敷片稍長，約 1〜2小時，但所能持續之時間亦有限。 致冷晶片（Thenn〇electric c〇〇ler，ΤΕ〇是一個半導體ρ_Ν材料組 口凡件’利用塞貝克（peltier)效應來致冷或加熱 。在TEC兩端 力1上-個直流電會產生—個錢電流，這會使致冷晶片的一 端發熱’另外一端致冷。發熱的一端我們稱之為“熱端”，致冷 M340042 的一端我們稱之為“冷端”。把致冷晶片兩端的電壓反向，也會 導致相反的熱流向一熱端變為冷端，冷端變成熱端。致冷晶片 不但具有體積小、不易損壞、只需轉換極性即可達到致冷或致熱 效果之特點，且較一般熱電阻的加熱器省電，因此，致冷晶片被 應用於多種冷熱敷產品上，以達到長時間之保冷或保溫效果。由 於致冷晶片之熱面部份溫度上升快速，因此，這類使用致冷晶片 之冷熱敷片產品通常會加設一散熱系統，主要以風扇及散熱鰭片 為主，例如中華民國專利公告第361249號及第273931號專利案 所揭露者。然而，利用風扇及散熱鰭片進行熱面之散熱，其所能 達到之熱傳導效果較差。此外，目前利用致冷晶片所設計出之冷 熱敷片’整體構造較龐大’無法針對定闕位進行冷、熱敷。 【新型内容】 根據前述所揭露之習知技術’冷錄片因使職膠或化學液體作 =容物’會造成使用不便及持續時間短等缺點。而制風扇及 二熱鰭片讀繼之⑽晶⑽熱輸，會造成整體之 =複雜、祕導絲較差及無法針對定點部倾 ::上:::此’本創作—一裝置，以 微熱兩!二致::：熱管之結構輕巧、使_的 針射身體定點部位進行長時間之保冷、 6 M340042 保溫作用。本創作可以克服市售冷熱敷㈣使贿膠或化學液體 作為内容物’而造成使用不便及持續_短等缺點。啊，由於 微熱管具祕阻小、熱反顧速、傳歸纽溫度分布均勾等特 性，本創作亦可改善先前技術中使用致冷晶片之冷熱敷片，由於 採用風扇及賴鰭片為散熱錢所造成之構造獅及熱傳導效果 較差之缺點。此外’由於微熱管具有f量輕、體積小、構造簡單、 無磨耗壽命長的優點，因此，與致冷晶片結合後，便可製得一輕 =、使用壽命長且方便使用者攜帶之冷熱敷片產品。此外，微熱 管之可撓雜，使冷絲片更服貼於敷處，亦能滿足針對定點部 位冷、熱敷之需求。 為達上述之目的，本創作係提供—種微鮮冷熱·裝置，其包 括·一致冷晶片，該致冷晶片通以直流電源後，構成一吸熱之冷 面部份及-放熱之熱面部份，且#電壓反向時，該冷面部位改為 放熱，而雜面部侧改為吸熱；—微鮮，係_於該致冷晶 片之…、面邛伤，用以與該致冷晶片進行熱交換；及一電源控制結 構私連接於戎致冷晶片，用以提供一輸入電力予該致冷晶片， 並調整輸入電力之正負極性。 本創作之微熱管冷熱兩用裝置，更可進—步包括—冷熱敷片、冷 熱傳導念體或相關具有包覆及傳導冷熱功能之包裝。 M340042 本創作之微熱管冷熱兩用裝置中該電源控制結構係包括一電源及 -切換開關。於較佳具體實施例中，該電源係提供—輸入電力予 該致冷晶片；而該切換開關係調整輪入電力之正負極性，以使該 致冷晶片可根制輸人電力之紐賤舰冷或致熱之效果。 本創作之微熱管冷熱兩膽置，更可進—步包括—溫控裝置，該 溫控裝置射難致冷晶狀致冷魏力。練佳频實施例， 該溫控裝置係可為—可變電阻。該溫找置可包括—直流電源開 關及一感測器。 再者’本創作之微熱管冷熱兩用裝置，亦可進—步包括一固定裳 置，該固定裝置係可將冷錄片固定於欲冷敷或絲之部位。、 /熱敷時所承受之重量 本創作之微熱管冷熱_錢，其進—步料鋪結構 冷裂置設置料同之基版，使縣顯置冷裝置分㈣放於使用 著所需冷/絲之雜，並以電_兩麵接，以難朗者於冷 為了使任何熟習相關技藝者，了解本創作之技姻容並據以實 M340042 ι根據本销書所揭露之内容、帽專利範圍及圖式，輕 易地理解本創作_之目的及優點。因此，將在實施減中詳細 敘述本創作之特徵及優點。本創作内容及若干具體實施例請參考 附圖且岸述如下。事實上，本創作可能以不同的形式來實施，且 不應該被麵為僅限於文中所提及的實例。 【實施方式】 徵及其功能有進一步的暸解，茲 為使對本創作的目的、構造、特 配合實施例詳細說明如下。 ^本創作微熱管冷熱_裝置之第—實施例之系統架構 “圖，圖―」係根據本創作微熱管冷熱兩職置之第一實施例 =體架騎「圖三」係根據本創作微歸冷熱兩用裝置之 第實&例之木構7F忍圖，「圖四」係根據本創作微熱管冷熱兩用 裝置之第三實補之_轉圖。町將朗摘作實施例中之 各元件。 請翏閱圖-所示，為達到微小化，以便於針對局部部位進行冷/熱 敷之目的，本猶之微熱管冷熱兩㈣置，祕包括有一致冷晶 片20、-微熱管30及一電源控制系統9〇。如圖所示，本創作之 冷/熱冷熱敷片H)内置-致冷晶片2〇，在致冷晶片的一側貼附一 微熱管30，以及-可提供致冷晶片2〇電力之小型電力源4〇。該 M340042 致冷晶片20係一半導體P-N材料組合元件，利用塞貝克(Pel t丨er ) 效應來致冷或加熱。该致冷晶片20通以直流電源後，會使致冷晶 片20的一端發熱，另外一端致冷，構成一吸熱之冷面部份21及 一放熱之熱面部份22，且當致冷晶片2〇兩端的電壓反向時，也會 導致相反的熱流向，致該冷面部位21改為放熱，而該熱面部位22 則改為吸熱。因此，該致冷晶片20有其體積小、不易損壞、只需 轉換極性即可達到致冷或致熱效果之特點，且較一般熱電阻的加 熱斋省電，因此，可以達到長時間之保冷或保溫效果。 本創作所採用之微熱管30可以是圓管式或平板式微熱管，其係貼 附在致冷晶片20朝外界的那一侧面（熱面部份22)上，用以與該致 冷晶片進行熱交換。當致冷晶片20之熱面部份22產生高溫時， 可藉由微熱管30快速散熱；而當熱面部份22的溫度降低時，與 其相鄰的微熱管30則吸收外界之熱能與熱面部份22之冷源進行 熱平衡，以避免熱面部份結冰。 :源控制結構90(如圖二所示），係電連接於該致冷晶片2〇，其係 η ’、輪入電力予該致冷晶片，且調整輸入電力之正負極性，以 使极冷晶片20可根據該輸人電力之極性以達到致冷或致熱之效 果因此，可於使用前，根據冷敷或熱敷之需求，變換電池4〇之 、極^放方向，進而改變冷熱敷片W之冷熱面。電源40係採 M340042 用鐘電池，但不以此為限 又如上述之構造，本創作之冷熱敷片i㈣可以進一 2==^爾賴麵糊者欲2: 例如·由其兩侧各延伸出一束帶，赤H 該冷轨敷片之背面#署 或疋於 , 又置—可_布料之魔纽、可重複黏貼之背 膠或是其他可貼附皮膚之材質。 、月 請參閱圖二所示，其係為本創作第—實施例（圖―）之立體 結構不賴。如騎心於本解之電源控槪㈣係 源40及-切換開關50。其中，該電源4 ◦係提供—輪入電力予: 致冷晶片20 ·’而該切換開關5()係調整輸人電力之正負極性，: 該致冷晶片20可根據簡人電力之極性以達到致冷歧熱之效 果。 使用時’將該冷熱敷片1Q未與平板式微熱管3()相接觸的那一面 貼於欲進行冷/熱敷之部位。開啟電源4〇後，即可藉由操作極向 切換開關5G，改變所供應電源4()之正、負電極的流向，對使用者 進行冷敷纖。t電輪向辦，冷爾21 (與皮膚相鄰 面’如圖—獅)產生吸熱作用，得以急速將低皮縣面溫度；而 熱面部份22所產生的高溫可藉由微熱管30快速散熱，此時，該 冷熱敷片丨G作為冷敷使用者。反之，#電流為負向位時，冷面部 M340042 份21 (與皮膚相鄰面）產生放熱作用，得以產生高溫；而熱面部 份22的溫度降低，與其相鄰的微熱管3〇吸收外界之熱能與熱面 部份22之冷源進行熱平衡，以避免熱面部份22結冰，此時，該 冷熱敷片10作為熱敷使用。 又如上述之構造，本創作之冷熱敷片1〇還可進一步設置一溫控裝 置60，讓使用者可依個人需求設定冷、熱敷溫度，以增進該產品 之實用性及經濟效益。其中，該溫控裝置6〇可以是使用設有可調 轉可變電阻大小之調整旋鈕62之可變電阻61，藉由改變供給致冷 晶片20直流電壓大小來調整冷/熱敷溫度；也可以是採用直流電 源on/off的方式來調整致冷晶片2〇之致冷熱能力，即設置一感 測邱^/JEL度低於感溫态下限，就開始加熱，當溫度超過感溫器 上限，就開始致冷。 睛茶閱圖三所示，其係為本創作第二實施例之系統架構示意圖。 如圖所示，其係針對本創作第-實施例之冷熱敷片1〇架構進行改 良，以減輕該系統施加於敷處之重量，其系統架構與第一實施例 之主要差異在於·該電源控制結構9Q (可進—步包括該溫控裝置 60)與電源4〇裝设於该糸統架構之一侧基板上，置冷裝置（其包 含致冷晶片20、微熱管30及冷熱敷片1G)則架設於該系統架構 之另一基板上，電源結構90及置冷裝置之間連結有電線;使用 12 M340042 4爹閱圖四所示’其係為本創作第三實施例之系統架構示意 圖。如圖所示’該電源控制結構9G與致冷以2g設置在同一基 板上’再利用微熱管3G導熱’進行患部之冷/熱敷。於冷/敎敷時 不僅可減_祕杨錄紅重量，更刊贿鮮％之可挽 特性，使其更服貼於敷處，並可於微熱管3〇與冷熱敷塾ι〇之間 增設一絕熱護套，以增加使用之安全性。 雖然本創作已讀佳實_聽如上，財並_職定本創 作。任何熟習此技藝者，在不脫離本創作之精神和範圍内，所為 之更動與潤飾，均屬本㈣之專利保魏圍。關於本創作之保護 範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 圖-係本創作微熱管冷熱兩用裝置之第—實施例之祕架構示 意圖。 圖二係根據本創作微熱管冷熱兩用裝置之第一實施例之立體架 構示意圖。 圖三係根據本創作微熱管冷熱兩用裝置之第二實施例之架構示 意圖。 13 M340042 圖四係根據本創作微熱管冷熱兩用裝置之第三實施例之架構示 意圖。 【主要元件符號說明】 10 ·•冷熱敷片 20 :致冷晶片 21 :致冷晶片之冷面部分 22 :致冷晶片之熱面部分 30 :微熱管 40 :電源 50 :切換開關 60 :溫控裝置 61 :可變電阻 62 :調整旋鈕 70 :電線 80 :絕熱護套 90 :電源控制結構 14M340042 VIII. New description: [New technical field] This creation department is a kind of hot and cold dual-purpose device. [Prior Art] The cold/hot two-mixed type of the 赖 式 式 — — — — — — — — — — — — — — — — — — — — — — — — — A device using a gel (such as cellulose gel) as a content, so that the device is placed in a cold material; the east is heated in a heat source, which is not only very troublesome to use, but also has a short time. (Approximately a few minutes in the continent) cold, insulated wire. Lai Chemical (4) as a device for chemical reaction of the contents 'for example, __ lightly placed, Wei type job is only required to press the starting metal sheet when the recording is started, then the metal sheet and the aqueous acetic acid solution can be activated to form a chemical reaction and exotherm. After that, it still needs to be boiled and reduced; Ling Lenglin, also need to put the cold ',, and the film on the east bank cold; east, the side has ice effect. Although the chemical liquid is used as the cold and hot sheet of the inner grain, the cold-keeping and heat-insulating effect is slightly longer than that of the gel-cold hot-rolled sheet, which is about 1 to 2 hours, but the duration of the operation is limited. The cryogenic wafer (Thenn〇electric c〇〇ler, which is a semiconductor ρ_Ν material group) uses the peltier effect to cool or heat. At the TEC's force 1 - a DC current is generated - The current of the money will cause one end of the cooled wafer to heat up. The other end is cooled. The end of the heat is called the "hot end", and the end of the cooled M340042 is called the "cold end". Reverse voltage will also cause the opposite heat flow to become a cold end and a cold end, and the cold end will become a hot end. The cooled wafer not only has small volume, is not easy to be damaged, and only needs to change polarity to achieve cooling or heating effect. Features, and more than the general thermal resistance of the heater to save power, therefore, the cooling chip is applied to a variety of cold and hot products to achieve long-term cold preservation or insulation effect. Because the temperature of the hot surface of the cooled wafer rises rapidly, Therefore, such cold and cold sheet products using cryogenic wafers usually have a heat dissipation system, mainly based on fans and fins, such as the Patent Publication No. 361249 and No. 273931 of the Republic of China. However, the use of fans and heat sink fins for heat dissipation of the hot surface can achieve a poor heat transfer effect. In addition, the cold and hot sheets designed by using the cold wafers are generally bulky. Cold and hot compressing in the niche. [New content] According to the above-mentioned prior art, 'cold recording film can cause inconvenience in use and short duration due to the use of adhesive or chemical liquid as the content of the container. The second heat fin read followed by (10) crystal (10) heat transfer, which will cause the whole = complex, secret guide wire is poor and can not be tilted for the fixed point::::: This 'this creation - a device, to the micro heat two! :::The structure of the heat pipe is light and compact, so that the needle is placed on the fixed part of the body for a long time to keep cold, 6 M340042 insulation effect. This creation can overcome the commercial cold and hot compress (4) make bribe or chemical liquid as the content' and cause inconvenience And the shortcomings of _ short, etc. ah, due to the micro-heat pipe with small secret resistance, heat reversal speed, and the temperature distribution of the returning temperature, the creation can also improve the cold-hot slabs of the prior art using the chilled wafer. The use of fans and fins is a disadvantage of the construction lion and the heat conduction effect caused by the heat dissipation. In addition, because the micro heat pipe has the advantages of light weight, small volume, simple structure and long wear life, it is cooled. After the wafer is combined, a cold and hot sheet product with a light weight, long service life and convenient for the user can be obtained. In addition, the micro heat pipe can be used to make the cold wire sheet more suitable for the application, and can also meet the requirements. In order to achieve the above purpose, the present invention provides a micro-fresh heat and cold device, which comprises a uniform cold wafer, which is connected to a DC power source to form an endothermic cold face. And the hot side of the exothermic heat, and when the voltage is reversed, the cold surface is changed to exothermic, and the side of the miscellaneous surface is changed to endothermic; the micro-fresh is _ in the cold wafer... And the power control structure is privately connected to the 戎-cooled wafer for providing an input power to the chilled wafer and adjusting the positive and negative polarity of the input power. The micro-heat pipe dual-purpose device of the present invention can further include a hot and cold slab, a cold heat conduction nucleus or a related package with a coating and conduction heat and cold function. M340042 The power control structure of the micro heat pipe dual-purpose device of the present invention includes a power supply and a - switch. In a preferred embodiment, the power source provides input power to the refrigerating wafer; and the switching relationship adjusts the positive and negative polarity of the wheeled electric power so that the refrigerating chip can be used to generate a power source. Cold or hot effect. The micro-heat pipe of the present invention is provided with hot and cold bile, and the step further includes a temperature control device, and the temperature control device is difficult to produce cold crystal-like cold. In a preferred embodiment, the temperature control device can be a variable resistor. The temperature finding can include a DC power switch and a sensor. Furthermore, the micro-heat pipe dual-heating device of the present invention may further include a fixing device for fixing the cold recording sheet to a portion to be cold-applied or silk. / / The weight of the heat-bearing heat of the creation of the micro-heat pipe hot and cold _ money, its in-step material structure cold cracking set the same material as the base plate, so that the county display cold device points (four) placed in the use of the required cold / Silk is mixed, and it is connected with electricity. It is difficult for the people to be familiar with the cold. In order to make any skilled person familiar with the art, understand the skill of this creation and according to the content of M340042 ι according to this sales book, the cap patent Scope and schema, easy to understand the purpose and advantages of this creation. Therefore, the features and advantages of this creation will be described in detail in the implementation of the reduction. Please refer to the attached drawings and some specific embodiments for the following content. In fact, this work may be implemented in different forms and should not be limited to the examples mentioned in the text. [Embodiment] Further understanding of the features and functions of the present invention will be described in detail below for the purpose, structure, and specific embodiments of the present invention. ^ The creation of the micro-heat pipe hot and cold _ device - the system architecture of the embodiment - "picture, map -" according to the creation of the micro-heat pipe hot and cold two positions of the first embodiment = body frame riding "Figure 3" is based on this creation According to the third embodiment of the thermal and thermal device, the "Four Figure 4" is based on the third actual compensation of the micro-heat pipe dual-use device. The town will be selected as the components in the examples. Please refer to the figure - as shown in the figure, in order to achieve miniaturization, in order to carry out cold/hot heat application for local parts, the heat and heat of the micro-heat pipe are two (four), including a uniform cold chip 20, a micro heat pipe 30 and a power source. Control system 9〇. As shown in the figure, the cold/hot cold heat sheet of the present invention H) has a built-in cooling chip 2, a micro heat pipe 30 is attached to one side of the cooling chip, and - a small size of the cooling chip 2 can be provided. The power source is 4〇. The M340042 chilled wafer 20 is a semiconductor P-N material composite component that is cooled or heated using a Pel t丨er effect. After the DC chip 20 is powered by a DC power source, one end of the cooled wafer 20 is heated, and the other end is cooled to form an endothermic cold surface portion 21 and a heat releasing hot surface portion 22, and when the cold wafer is cooled When the voltages at both ends are reversed, the opposite heat flow direction is also caused, so that the cold surface portion 21 is changed to heat release, and the hot surface portion 22 is changed to absorb heat. Therefore, the refrigerating wafer 20 has the characteristics of small volume, non-damage, and only needs to change polarity to achieve cooling or heating effect, and is more efficient than conventional thermal resistance heating, thereby achieving long-term cold preservation. Or insulation effect. The micro heat pipe 30 used in the present invention may be a round tube type or a flat type micro heat pipe attached to the side of the cooling chip 20 facing the outside (the hot surface portion 22) for performing with the refrigerant chip. Heat exchange. When the hot surface portion 22 of the cold wafer 20 generates a high temperature, it can be quickly dissipated by the micro heat pipe 30; and when the temperature of the hot surface portion 22 is lowered, the adjacent micro heat pipe 30 absorbs the external heat and heat. The cold source of the face portion 22 is thermally balanced to prevent the hot face from freezing. The source control structure 90 (shown in FIG. 2) is electrically connected to the refrigerating chip 2, which is η ', turns in power to the refrigerating wafer, and adjusts the positive and negative polarity of the input power to make it extremely cold. The wafer 20 can be cooled or heated according to the polarity of the input power. Therefore, before use, the battery can be changed according to the requirements of cold or hot application, and the cold and hot sheet W can be changed. Hot and cold noodles. The power supply 40 adopts the clock battery of M340042, but it is not limited to this and the structure is as described above. The cold and hot compressing piece i (4) of this creation can enter a 2==^尔赖面糊欲2: For example, extending from both sides A belt, red H The back of the cold rail patch #署或疋, 设置 - _ fabric magic button, re-adhesive adhesive or other material that can be attached to the skin. Month, please refer to Figure 2, which is based on the three-dimensional structure of the first embodiment (Fig.). For example, the power supply control (4) of the solution is source 40 and the switch 50. Wherein, the power source 4 provides - wheeling power to: the cooling chip 20 · ' and the switch 5 () adjusts the positive and negative polarity of the input power, the cooling chip 20 can be based on the polarity of the simplified power Achieve the effect of cold and heat. At the time of use, the side where the cold heat sheet 1Q is not in contact with the flat micro heat pipe 3 () is attached to a portion to be subjected to cold/hot application. After the power is turned on 4, the direction of the positive and negative electrodes of the supplied power source 4() can be changed by operating the pole switch 5G, and the user can be cold-applied. t electric wheel to the office, cold 21 (with the skin adjacent to the 'picture - lion) to produce endothermic effect, can quickly reduce the low surface temperature; and the hot surface 22 can generate high temperature through the micro heat pipe 30 The heat is quickly dissipated, and at this time, the hot and cold sheet G is used as a user of the cold pack. On the other hand, when the #current is in the negative direction, the cold face M340042 part 21 (adjacent to the skin) generates an exothermic effect to generate a high temperature; and the temperature of the hot face portion 22 is lowered, and the adjacent micro heat pipe 3〇 absorbs the outside world. The heat energy is thermally balanced with the cold source of the hot face portion 22 to prevent the hot face portion 22 from freezing. At this time, the cold heat sheet 10 is used as a heat pack. According to the above configuration, the cold heat pack 1 of the present invention can further be provided with a temperature control device 60, so that the user can set the cold and hot temperature according to individual needs, so as to improve the practicability and economic benefit of the product. Wherein, the temperature control device 6〇 may be a variable resistor 61 provided with an adjustment knob 62 of a variable-rotation variable resistance, and the cold/hot temperature is adjusted by changing the magnitude of the DC voltage supplied to the cooling wafer 20; The direct current power supply on/off method is used to adjust the cooling heat capacity of the cold-rolled wafer 2, that is, when a sensing Qiu/JEL degree is lower than the lower limit of the temperature sensing state, heating is started, and when the temperature exceeds the upper limit of the temperature sensor, Start to get cold. The eye tea is shown in Figure 3, which is a schematic diagram of the system architecture of the second embodiment of the present invention. As shown in the figure, it is an improvement of the cold heat sheet 1〇 structure of the present invention to reduce the weight of the system applied to the application, and the main difference between the system architecture and the first embodiment is that the power source The control structure 9Q (which can include the temperature control device 60) and the power source 4 are mounted on one side substrate of the system, and the cooling device (which includes the cooling chip 20, the micro heat pipe 30, and the hot and cold sheet) 1G) is erected on another substrate of the system architecture, and a power line is connected between the power structure 90 and the cooling device; using 12 M340042 4 see FIG. 4, which is the system architecture of the third embodiment of the creation schematic diagram. As shown in the figure, the power supply control structure 9G and the cooling are disposed on the same substrate at 2 g, and the micro heat pipe 3G is thermally conducted to perform cold/hot application of the affected portion. In the cold / simmering, not only can you reduce the weight of _ secret Yang recorded red, but also the brittle characteristics of the bribe, so that it is more suitable for the application, and can be added between the micro heat pipe 3 〇 and the hot and cold 塾 〇 〇 Insulation jacket to increase the safety of use. Although this creation has been read by Jiashi _ listen to the above, Caihe _ job book creation. Anyone who is familiar with this art, within the spirit and scope of this creation, is the patent protection Wei Wei of this (4). The scope of protection of this creation is subject to the definition of the scope of the patent application attached. [Simple description of the drawing] Fig. - The schematic structure of the first embodiment of the micro heat pipe dual-purpose device. Fig. 2 is a perspective view showing the three-dimensional structure of the first embodiment of the micro heat pipe cooling and heating device according to the present invention. Fig. 3 is a schematic view showing the structure of the second embodiment of the micro heat pipe heat and cold device according to the present invention. 13 M340042 Fig. 4 is a schematic view showing the structure of the third embodiment of the micro heat pipe heat and cold device according to the present invention. [Main component symbol description] 10 ·•Cold and cold sheet 20: Cooling wafer 21: Cold surface portion of the cold chip 22: Hot surface portion of the cold chip 30: Micro heat pipe 40: Power supply 50: Switch 60: Temperature control Device 61: Variable Resistor 62: Adjustment Knob 70: Wire 80: Insulation Jacket 90: Power Control Structure 14