TWM252044U - Heat generating device - Google Patents

Description

M252044 V. Creation Instructions (1) [Technical Field to which the New Type belongs] This creation relates to a heat flow generating device, particularly a heat flow generating device having a heat flow compensation function. ^ ^ [Previous technology] During the development of new materials, especially thermally conductive materials, it is often necessary to measure the thermal conductivity of the material. In the process of designing the heat sink of electronic equipment, it is necessary to calculate and simulate its heat dissipation performance in advance. Accurate measurement of the thermal conductivity of thermally conductive materials has become the key to successful design. At present, the thermal conductivity of materials is mainly measured by a method called the temperature gradient method. This method places the sample to be measured between a heat source and a low temperature, and measures the temperature gradient formed during the measurement. Q = K 氺 ΔΤ / Δχ… to calculate the thermal conductivity of the material. Among them, represents the temperature difference between the two samples to be measured, i.e., the temperature gradient between the heat source and the low / solar heat >, which can be obtained through field and field; △ X represents the distance between the formation of this temperature gradient, and °. The length along the direction of heat flow is a known parameter; Q represents the heat flow of the heat source flowing through the sample. It is usually assumed that the heat flow generated by the heat source itself flows through the sample, and K represents the thermal conductivity. The previously known or measured value book ·· 1 The above heat conduction equation can be obtained. This method is relatively simple and easy to implement, so it is widely used. Early easy work, physical condition Γ W li / ¾ Wen Nan Fu, ^ low temperature heat sink, one of the practices in practice is to pass to the world gate dou I to _ ”7, surrounded by 埶 1¾ Μ only one side Let the heat flow pass through 'called the heat flow wheel out M,' Ding Yibei unloading, so that the heat A, all through the uninsulated heat flow output surface, when Xi 敎 A. 疋 ..., flow cooked k wheel out of the surface and to be measured

M2 ^ 2U44 V. Creation Instructions (2) The samples are closely connected to the samples. However, the performance is limited. At this time, the flow will cause another kind of power generation to generate difficult to control compensation. [New content, original creative device. The original creative heat flow compensation can be done after touch ', it can be assumed that all the heat from the heat source flows through the test. Due to thermal insulation materials, such as oxidized ceramics, a part of the heat flow in heat insulation is always radiated from other directions. The heat flow of the sample to be measured is not equal to the error of the thermal conductivity K of the heat source itself. The method is to use a thermal resistance type heat flow compensation body, and use the heat flow outside the thermal resistance to make up for the lost heat flow, but this method is usually very uniform in temperature, so the compensation effect is limited. The purpose is to surely output the heat flow generating body. The thermal energization generates a preset known flat surface. The heat flow output heat flow is compensated for providing a predetermined heat and a predetermined known thermoelectric output surface. Each is used to control the flow output surface. With this creation, the uniform effect is good, and [the first embodiment of the heat flow supplementary electric heat generation corresponds to a uniform heat and heat flow generation plane and electricity consumption device, the current generation surface, the body compensation body and the current compensation flow compensation device The temperature control is also relatively hot, including the flat surface attached to a compensating body in addition to a heat flow. Advantages: manufacturing, effective resistance type, low flow generation, heat generation, polyhedron, thermal resistance, non-surface The heat flow generating circuit is connected to the heat, and the surface temperature reaches the temperature at which the thermoelectric resistance is used to set the heat flow to produce the heat flow. The body and the complex thermoelectricity presuppose the multi-faceted heat-flux transmission body, and the compensation circuit allows each of the balanced heat-flow type warm soil to be displayed. The heat-flow non-heat compensation body compensation is as follows. Heat flow generating device for further details

M252044

V. Creation Instructions (3) Description. Please read the first picture, the structure part of this creative heat flow generating device is eight spoons, one heat flow generator 1 Q and five thermoelectric heat flow compensation bodies 2 Q. Under the control of the compensation circuit, the compensation body 20 generates a compensation heat flow: ^ The heat flow lost by the generator 10. ^ ... k The heat flow generator 10 is a regular hexahedron. In fact, it can be other polyhedrons, and is not limited to regular polyhedrons. In this embodiment, only a regular ^ hedron is used as an example. Let one of the regular hexahedrons be the heat flow output surface G, and the remaining five surfaces be the non-heat flow output surfaces. The five heat flow compensation bodies 20 are attached to the five non-heat flow output surfaces 14 respectively. A thermal resistance is embedded in the heat flow generator (not visible). The thermal resistance is driven by a certain current source to generate a preset heat flow Q of a known size. The heat flow Q is calculated as follows:

Q II aI2R, where 'I represents the constant current value of the thermal resistance provided by the power supply, R represents the resistance value of the thermal resistance, and a represents the constant of the electrical resistance of the thermal resistance converted to thermal energy. Output, it is necessary to ensure that the heat flow Q will not be lost from the non-heat flow output surface 14. The scheme of this creation is to attach a thermoelectric heat flow compensation body 20 to each of the five non-heat-flow output surfaces 14 to prevent the heat flow Q from being lost from the five non-heat-flow output surfaces 丨 4. The thermoelectric heat compensator 20 in this creation refers to a heat generating device driven by direct current using the Peltier effect (Pei tier ef feet). The principle used in this creation is the thermal conductivity equation mentioned earlier: Q = K 氺 ΔΤ / Δχ

Page 7 M252044 V. Creation Instructions (4) When the temperature difference △ T between two points is zero, that is, when the temperature at the two points is equal, the heat flow passing through is 0, indicating that no heat flow is flowing. In this creation, when the surface temperature of any non-heat-flow output surface 14 of the heat-flow generator 10 and the corresponding heat-flow compensation body 20 is the same, there is no heat flow between the non-heat-flow output surface 14 and the heat-flow compensation body 2 〇 Flowing through, equivalently, all the heat flow generated by the heat flow generating body 10 will flow through the heat flow output surface 12.

Each non-heat-flow output surface 14 and the corresponding surface of the heat-flow compensating body 20 are respectively attached with thermistors 16 and 26. In this way, a total of five pairs of thermistors 16 and 26 are provided in this creation. With each pair of thermistors 16, 26, the temperature signals TM, I of the respective surfaces can be detected. In the first figure, only a pair of thermistors j 6 and 26 appear in the day.

Please refer to the second figure. This creative heat flow compensation circuit mainly includes two temperature detection circuits and a temperature feedback compensation circuit. First, the two temperature detection circuits detect the corresponding temperature signals L and ^ (actually voltage signals), and input the two temperature signals TH into the temperature feedback compensation circuit. 'The temperature feedback compensation circuit is comparing the two temperature signals. 1. After U, when the two temperature signals TM and L are not equal, a control signal is output to change the driving current of the thermoelectric heat flow compensation body 20, so as to adjust the heat generation of the heat flow compensation body 20 through the feedback circuit Finally, the temperatures of the non-heat-flow output surface 14 and the surface of the heat-flow compensation body 20 are balanced. As mentioned earlier, when the two temperatures are equal, no heat flow passes between the two surfaces. The other non-heat-flow output surfaces 14 are also set as described above, and no heat flow passes between each # heat-flow wheel output surface 14 and the corresponding heat-flow compensation body 20. Equivalently, all of the heat flow q generated by the heat flow generating body 10 flows out of the heat flow output surface 丄 2.

M252044 V. Creative Instructions (5) As an example of this creative application, it is used as a heat source for measuring thermal conductivity. Attach the sample to be tested to the heat flow output surface 12 and calculate the thermal conductivity easily according to the temperature gradient method mentioned earlier. It should be noted that this creation is not limited to measuring the thermal conductivity of the material. This creation can be applied to any occasion that needs to provide a preset heat flux of a known size. To sum up, this creation complies with the requirements for new patents, and a patent application was filed in accordance with the law. However, the above embodiments are merely preferred embodiments of the present writing, the case that whenever person familiar with the art, modifications or variations made equivalent Yuan Yi creative spirit of the present, are intended to be included within the scope of the patent.

Page 9 M252044 Simple illustration of the drawing [Simple illustration of the drawing] The first drawing is an exploded view of the heat flow generating device of this creation. The second picture shows the working process of the compensation circuit of the heat-flow generating device. [Simple description of the element representative symbols] Heat flow generator 10 Heat flow output surface 12 Non-heat flow output surface 14 Thermistor 16 > 26 Heat flow compensation body 20

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Claims (1)

M252044 6. Scope of patent application 1. A heat flow generating device, comprising: a heat flow generator, the heat flow generator is a polyhedron, and a thermal resistance which can be energized to generate a preset heat flow of a known size is embedded in the One of the flat surfaces of the polyhedron is a heat flow output surface, and the other flat surfaces are non-heat flow output surfaces; a plurality of thermoelectric heat flow compensation bodies are respectively attached to the non-heat flow output surfaces of the heat flow generator; and a plurality of heat flow compensation circuits are respectively connected with these The heat flow compensating body is connected to control the heat generation of the corresponding thermoelectric heat flow compensating body, so that each non-heat flow output surface and the surface temperature of the corresponding heat flow compensating body reach equilibrium. 2. The heat flow generating device as described in item 1 of the scope of patent application, wherein each non-heat flow output surface and the corresponding surface of the heat flow compensator are respectively attached with a thermistor that can sense the respective surface temperature. The thermistor and the The heat flow compensation circuit is connected. 3. The heat flow generating device according to item 1 of the scope of patent application, wherein the polyhedral system is a hexahedron. Page 11