M246690 五、創作說明（1) 【新型所屬之技術領域】 本創作係關於一種散熱裝置，特別係關於一種運用相 變化原理散發電子元件所產生熱量之散熱裝置。 【先前技術】 隨著電子產業的迅速發展，如中央處理器（CPU )等 電子元件之運算速度大幅度提高，其產生之熱量亦隨之劇 增’如何將電子元件之熱量散發出去，以保證其正常運作 ，一直係業寻奔研究之問題。 傳統之散熱方式係於發熱電子元件上方設置一金屬材 質之散熱器，該散熱器具有基座，基座下表面與電子元件 接觸，而其上表面則設有複數鰭片，基座吸收電子元件產 生之熱量，藉由鰭片將熱量散發至周圍空氣中，為加強鰭 片與周圍空氣之熱交換速度，通常進一步於鰭片上方加置 一風扇，以加強氣體對流。上述散熱裝置固然能散發電子 元件產生之部分熱量，惟，其單純藉由金屬材質之散熱器 傳導熱量，金屬之熱傳導係數有限，導致散熱器在單位時 間、單位體積下之熱傳導量亦有限。傳統之純金屬散熱器 月欠熱方式已不能滿足南發熱量 目前，業界藉由熱管傳導 熱管係於金屬管體内密封裝入 結物、溝槽結構、絲網結構等 等）後抽至真空狀態，藉由工 變化之過程吸收及釋放熱量。 散熱器具有上下設置且相互平 電子元件之散熱需求。 熱量之散熱裝置日益增多， 毛細結構物（如金屬粉末燒 )及工作液體（如水、酒精 作液體雙熱後進行液氣兩相 常用的一種熱管散熱裝置其 行之兩金屬平板，其中一平M246690 V. Creation Instructions (1) [Technical Field of New Type] This creation is about a heat sink, especially a heat sink that uses the phase change principle to dissipate heat generated by electronic components. [Previous technology] With the rapid development of the electronics industry, the computing speed of electronic components such as central processing units (CPUs) has greatly increased, and the heat generated by them has also increased dramatically. How to radiate the heat of electronic components to ensure Its normal operation has always been a problem for industry research. The traditional heat dissipation method is to set a heat sink made of metal material above the heating electronic component. The heat sink has a base, the lower surface of the base is in contact with the electronic components, and the upper surface is provided with a plurality of fins, and the base absorbs the electronic components. The generated heat is radiated to the surrounding air through the fins. To enhance the heat exchange speed between the fins and the surrounding air, a fan is usually added above the fins to enhance gas convection. Although the above-mentioned heat dissipation device can dissipate part of the heat generated by the electronic components, it simply conducts heat through a metal heat sink, and the thermal conductivity of the metal is limited, which results in a limited heat conduction amount of the heat sink per unit time and unit volume. The traditional pure metal radiator underheating method can no longer meet the south heat generation. At present, the industry uses heat pipe conduction heat pipes to seal the metal pipe with knots, groove structures, wire mesh structures, etc.) and evacuate to vacuum. The state absorbs and releases heat through the process of industrial changes. The heat sink has the heat dissipation requirements of electronic components which are arranged on top of each other and are flat to each other. There are more and more heat dissipation devices. Capillary structures (such as metal powders) and working liquids (such as water and alcohol) are used as liquids to perform liquid-gas two-phase heating. Commonly used heat pipe cooling devices include two metal flat plates, one of which is flat.
M246690 五、創作說明（2) 板與發熱電子元 管大致呈” Un形； 内’並藉由锡焊 平板皆係由純金 至其中一平板上 分熱量集 離電子元 導熱量， 使電子元 一方面， 熱性能較 熱管時存 一種散熱 子元件產 【内容】 本創 產生熱量 中於平 件處溫 但電于 件之熱 由於熱 金屬平 在較大 裝置， 生之熱 作之目 之相變 本創作相變 少一管 每一 内壁設有毛細結 體兩端 流道與 至少一管 流道，該 細結構物 由於 件貼設’該兩平板間設置有複數鰭片，熱 其兩平行段分別插設於散熱器之兩平板 方式固定於散熱器上。由於該散熱器之兩 屬材質製成，電子元件產生之熱量雖傳導 ’但由於金屬之導熱性能有限，導致大部 板中央與電子元件相接觸處，而該平板遠 度較低’雖藉由具有高導熱性能之熱管傳 元件傳導至平板之熱量分佈不均勻，未能 ，迅速散發出去，從而影響散熱效果；另 官係與平板採用錫焊方式連接，錫膏之導 板之‘熱性此差’致使熱量從平板傳導致 的熱阻’進一步影響散熱效果。如何提供 f能運用相變化原理，快速有效地散發電 ΐ ’即為本創作所欲解決之問題。 的在於提供一種能快速有效散發電子元件 化散熱裝置。 化散熱裝置，包括兩相互平行之板體及至 板體呈中空，其内設有空腔，於該板體之 構物’且空腔内盛裝有適量工作介質。該 刀別與兩板體相連，該管體呈中空，具有 兩板體之空腔連通，管體之内壁亦設有毛 本創作之板體内設有空腔，且於板體内壁設有毛M246690 V. Creation instructions (2) The board and the heating electron tube are roughly “Un” shape; the inner side of the plate is soldered from pure gold to one of the plates. In terms of thermal performance, there is a kind of heat dissipation sub-element when the heat pipe is produced. [Content] The heat generated by the invention is warmer at the flat part, but the heat of the electric part is changed due to the hot metal level in the larger device. In this creative phase change, there is one tube. Each inner wall is provided with a capillary tube flow channel at both ends and at least one tube flow channel. The thin structure is attached to the pieces. The two flat plates are provided with a plurality of fins to heat the two parallel sections. The two flat plates of the heat sink are respectively inserted and fixed to the heat sink. Because the heat sink is made of two materials, although the heat generated by the electronic components is conducted, but due to the limited thermal conductivity of the metal, most of the center of the board and the electronics Where the components are in contact, and the plate has a low distance, although the heat distribution to the plate is not uniformly distributed through the heat pipe with a high thermal conductivity, the heat distribution is not uniform, and it is quickly dissipated, which affects Thermal effect; the other is to connect the panel and the board by soldering. The 'different thermal property' of the solder paste guide plate causes the thermal resistance caused by the heat transfer from the panel to further affect the heat dissipation effect. How to provide f can use the phase change principle to quickly Efficiently dissipating electricity ΐ is the problem to be solved by the author. The purpose is to provide a heat dissipation device that can quickly and effectively dissipate electronic components. The heat dissipation device includes two parallel plates and the plate is hollow. There is a cavity, and a proper amount of working medium is contained in the structure of the plate. The knife is connected to the two plates, the tube is hollow, the cavity with the two plates communicates, and the inner wall of the tube There is also a cavity in the board body created by Mao Ben, and hair is provided in the inner wall of the board.
M246690 五、創作說明（3) " ' 細結構物，因此，工作介質可在毛細結構物之作用下分佈 於整個板體’有效避免熱量分佈不均；另外，本創作之管 體之流道係與板體之空腔相連通，熱量由板體傳至管體時 不需經過錫貧，有效降低熱傳導過程中的熱阻。 【實施方式】 清爹閱第一圖，係本創作相變化散熱裝置之第一實施 例。該散熱裝置包括兩相互平行之板體1〇、2〇，於板體10 、20間設置有嗥數鰭片30，該兩板體1〇、20之同側藉由兩 管體4 0相連接。 板體10、2〇截面呈方形，其皆具有下表面及上表面， 板體1 0之下表面與發熱電子元件接觸，板體丨〇、2 0皆係中 空，其内皆具有一空腔，於板體1〇、2〇之内壁設有毛細結 構物’如於内壁上開設溝槽、於内壁貼設絲網結構、於内 壁貼設燒結金屬粉末等，於板體1 0之空腔内盛裝有適量沸 點較低之工作介質，如水、酒精等，該工作介質在毛細結 構物之作用下分佈於整個板體10之内壁。每〆鰭片30之上 下兩端分別與板體20之下表面及板體1〇之上表面相接。每 一管體4 0呈中空狀，其内具有一流道，該流道之兩端分別 與板體10、20之空腔相連通，且於管體40内璧亦設有毛細 結構物，該毛細結構物之形式可為板體1 〇、2〇内之毛細結 構物形式，板體、2〇之空腔及管體40之流道皆抽至真空 狀態。 當該散熱裝置裝設於電子元件上時，電子元件產生之 熱量傳導至板體1〇，板體1〇内之工作介質吸熱後發生相變M246690 V. Creation Instructions (3) " 'Fine structure, therefore, the working medium can be distributed throughout the board under the action of the capillary structure' to effectively avoid uneven heat distribution; in addition, the flow channel of the tube of this creation It is in communication with the cavity of the plate body. When the heat is transferred from the plate body to the pipe body, it does not need to pass through the tin lean, which effectively reduces the thermal resistance in the heat conduction process. [Embodiment] The first picture of Qing Daddy is the first embodiment of the phase change heat dissipation device in this creative work. The heat dissipating device includes two parallel plates 10 and 20, and a plurality of fins 30 are arranged between the plates 10 and 20. The same sides of the two plates 10 and 20 pass through two tubes 40 and 40. connection. The plates 10 and 20 have a square cross-section, and both of them have a lower surface and an upper surface. The lower surface of the plate 10 is in contact with the heating electronic components. The plates 10 and 20 are hollow and each has a cavity. Capillary structures are provided on the inner walls of the board body 10 and 20, such as opening grooves on the inner wall, attaching a wire mesh structure to the inner wall, and sintered metal powder on the inner wall, etc., in the cavity of the board body 10 It contains an appropriate amount of a low-boiling working medium, such as water and alcohol, which is distributed on the inner wall of the entire plate body 10 under the action of the capillary structure. The upper and lower ends of each fin 30 are in contact with the lower surface of the plate body 20 and the upper surface of the plate body 10, respectively. Each of the tube bodies 40 is hollow, and has a first-class channel therein. Both ends of the flow channel communicate with the cavities of the plates 10 and 20, respectively, and a capillary structure is also provided inside the tube body 40. The form of the capillary structure may be the form of the capillary structure within the plate body 10, 20, and the plate body, the cavity of the body 20, and the flow channel of the tube 40 are all evacuated to a vacuum state. When the heat dissipating device is installed on the electronic component, the heat generated by the electronic component is conducted to the board 10, and the working medium in the board 10 absorbs heat and undergoes a phase change.
M246690 五、創作說明（4) 化’由液悲轉變為氣恶’氣態工作介質向上運動，流經管 體40之流道後上升至板體20中，在板體20内之毛細結構物 作用下，該氣態工作介質分佈於整個板體2〇之内壁，鰭片 30與外界進行熱交換使板體2〇内之氣態工作介質釋放熱量 後溫度降低，從而由氣態轉變為液態，液態工作介質在管 體40内毛細結構物之作用下返回至板體1〇中，進行下一次 相變循環。 上述板體10、2 0之形狀不限於方形，亦可為其它形狀 ，如第二圖所示，係本創作之第二實施例，圖中省略鰭片 ，該實施例與第一實施例之不同之處僅在於板體1 〇，、2 〇， 概呈三棱柱狀。 請參閱第三圖，係本創作之第三實施例，其與第一實 施例之不同之處在於：板體5 0、6 0之另一側接設有另兩管 體42，該兩管體42係中空，其内具有流道，流道之兩端分 別與板體50、60之空腔相連通。 當該散熱裝置裝設於電子元件上時，電子元件產生之 熱置傳導至板體50 ’板體50内之工作介質吸熱後發生相變 化，由液態轉變為氣態，氣態工作介質向上運動，流經管 體42之流道後上升至板體6〇中，在板體60内之毛細結構物 作用下，該氣態工作介質分佈於整個板體6〇之内壁，鰭片 30與外界進行熱交換使板體6〇内之氣態工作介質釋放熱量 後溫度降低’從而由氣態轉變為液態，液態工作介質在管 體4 0内毛細結構物之作用下返回至板體5 〇中，進行下一次 相變循環。M246690 V. Creation instructions (4) The transformation of the gaseous working medium from 'liquid sorrow to wickedness' moves upward, flows through the channel of the pipe body 40 and rises into the plate body 20, under the action of the capillary structure in the plate body 20, The gaseous working medium is distributed on the inner wall of the entire plate body 20, and the fins 30 exchange heat with the outside world to release the heat from the gaseous working medium inside the plate body 20, which causes the temperature to change from a gaseous state to a liquid state. The capillary structure in the body 40 returns to the plate body 10 and performs the next phase change cycle. The shapes of the above plates 10 and 20 are not limited to square shapes, but may be other shapes. As shown in the second figure, this is the second embodiment of this creation. The fins are omitted in this figure. The only difference is that the plates 10, 20 are triangular prisms. Please refer to the third figure, which is the third embodiment of this creation. The difference from the first embodiment is that the other sides of the plate bodies 50 and 60 are provided with two other pipe bodies 42. The two pipes The body 42 is hollow, and has a flow channel therein, and both ends of the flow channel communicate with the cavities of the plate bodies 50 and 60, respectively. When the heat dissipating device is installed on the electronic component, the heat generated by the electronic component is conducted to the plate body 50. The working medium in the plate body 50 absorbs heat and undergoes a phase change, changes from a liquid state to a gaseous state, and the gaseous working medium moves upward. After passing through the channel of the pipe body 42, it rises to the plate body 60. Under the action of the capillary structure in the plate body 60, the gaseous working medium is distributed on the inner wall of the whole plate body 60. The fins 30 exchange heat with the outside to make the plate The temperature of the gaseous working medium in the body 60 decreases after the heat is released, thereby changing from the gaseous state to the liquid state. The liquid working medium is returned to the plate 50 by the capillary structure in the tube 40, and the next phase change cycle is performed. .
M246690 五、創作說明（5) 可為其它形 圖中省略鰭 板體5 0 ’ 、 限於一根、 ;另外，本 亦可處於同 意彎折。 依法提出專 施例，舉凡 之等效修錦 上述板體50、60之形狀亦不限於方形，亦 狀，如第四圖所示，係本創作之第四實施 二與第三實施例之不同之處僅在於 6 0概呈二棱柱狀。 可以理解，本創作之管體4〇、42之 :丨；’亦可為兩根以上’可根據實際需要；置 =::;體：限於處於相互平行之狀ϊ ΐ ::以：根據實際需要而將管體4。任 利申請。惟，以上所述者 ，利要件，爰 熟悉本案技藝之人士，在;^創作之較佳實 或變化，皆應涵蓋於以下之；作 第9頁 M246690 圖式簡單說明 【圖式簡單說明】 第一圖係本創作相變化散熱裝置第一實施例之立體圖 〇 第二圖係本創作相變化散熱裝置第二實施例之部分元 件立體圖。 第三圖係本創作相變化散熱裝置第三實施例之立體圖 〇 第四圖谗丰創作相變化散熱裝置第四實施例之部分元 件立體圖。M246690 V. Creation instructions (5) can be omitted in other figures. The fin plate body 50 'is limited to one; in addition, the book can also be bent in agreement. Proposed specific examples according to law. The equivalent of the above-mentioned plate 50, 60 is not limited to the square shape, as shown in the fourth figure. This is the difference between the second embodiment and the third embodiment of this creation. The only difference is that 60 is almost prismatic. It can be understood that the tube body 40 and 42 of this creation: 丨; 'may also be two or more' can be based on actual needs; set = ::; body: limited to being in a parallel state ϊ 以 :: to: according to the actual The tube body 4 is needed. Application for appointment. However, those mentioned above are of advantage, and those who are familiar with the skills of this case, the best practice or changes of the creation should be covered in the following; make a simple explanation of the M246690 diagram on page 9 [simple explanation of the diagram] The first figure is a perspective view of the first embodiment of the phase-change heat-dissipating device of the present invention. The second figure is a perspective view of some elements of the second embodiment of the phase-change-type heat-dissipating device of the present invention. The third figure is a perspective view of the third embodiment of the phase change heat dissipation device of the present invention. The fourth figure is a perspective view of some elements of the fourth embodiment of the phase change heat dissipation device of the Feng Feng creation.
【元件代表符號簡單說明】 板體 1 0 \ 2 0 > 1 0 ’ \ 2 0 ’ > 50 > 60 ^ 50J > 60? 鰭片 30 管體 40、42[A brief description of the symbol of the component] Plate 1 0 \ 2 0 > 1 0 ’\ 2 0’ > 50 > 60 ^ 50J > 60? Fins 30 tube 40, 42
第10頁Page 10