TWI890448B - High pressure substrate processing apparatus - Google Patents

Abstract

The present invention provides a high pressure substrate processing apparatus, including: an inner cavity formed to accommodate a substrate to be processed and a reaction gas supplied at a first pressure higher than atmospheric pressure; and an outer cavity provided with an outer shell for accommodating the inner cavity; and an outer door movable between a closed state closing the housing and an open state opening the housing, the outer cavity is formed to contain shielding gas supplied at a second pressure set relative to the first pressure; and a fastening module is provided with: a support protrusion is disposed at the outer shell; a rotating member rotatably provided on the outer door; and a locking protrusion is protrudingly formed on the rotating member, and is arranged on the supporting protrusion as the rotating member rotates in the closed state.

Description

High-pressure substrate processing equipment

The present invention relates to a processing device for processing a substrate in a high-pressure environment.

Typically, semiconductor substrates undergo various treatments during the semiconductor device manufacturing process. These treatments include oxidation, nitridation, silicidation, ion implantation, and deposition processes. Hydrogen or deuterium thermal treatments are also used to improve the interface properties of semiconductor devices.

Gases used to process substrates are supplied into the chamber at high pressure and act upon the semiconductor substrates. To maintain the high pressure within the chamber, the chamber housing must be securely closed by a door.

When a chamber is closed and loosened by high-pressure gas, gaps may form between the housing and the door. These gaps can serve as pathways for the gas inside the chamber to escape to the outside.

The above-mentioned background technology refers to the technology possessed by the inventor in order to derive the embodiments of the present invention or the technical information obtained in the derivation process. Therefore, it is not necessarily the public known technology disclosed to the public before the filing of this application.

One object of the present invention is to provide a high-pressure substrate processing apparatus that can firmly maintain the closed state between the housing and the gate even when the chamber is under high pressure.

Another object of the present invention is to provide a high-pressure substrate processing apparatus that can minimize the power required for coupling between a housing and a door.

To achieve the aforementioned objectives, a high-pressure substrate processing apparatus according to one aspect of the present invention may include: an inner chamber configured to contain a substrate to be processed and a reaction gas supplied at a first pressure higher than atmospheric pressure; an outer chamber comprising: an outer housing configured to contain the inner chamber; and an outer door movable between a closed state for closing the outer housing and an open state for opening the outer housing, the outer chamber configured to contain a protective gas supplied at a second pressure set relative to the first pressure; and a fastening module comprising: a supporting protrusion disposed on the outer housing; a rotating member rotatably disposed on the outer door; and a locking protrusion protruding from the rotating member and disposed on the supporting protrusion as the rotating member rotates in the closed state.

Here, the rotating member may be located within an area defined by the outer shell.

Here, the rotating member may include a rotating ring having a ring shape.

According to another aspect of the present invention, a high-pressure substrate processing apparatus may include: an inner chamber formed to accommodate a substrate to be processed and a reaction gas supplied at a first pressure higher than atmospheric pressure; an outer chamber having: an outer shell for accommodating the inner chamber; and an outer door movable between a closed state for closing the outer shell and an open state for opening the outer shell, wherein the outer chamber is formed to accommodate the substrate to be processed and a reaction gas supplied at a first pressure higher than atmospheric pressure. A shielding gas is supplied at a second pressure set at the first pressure; and a fastening module comprising: a supporting protrusion disposed on the outer housing; and a locking protrusion disposed on the supporting protrusion so as to move and connect to the outer door in the closed state. The outer door includes an upper plate that contacts the outer housing in the closed state, and the locking protrusion is disposed on a lower side of the upper plate.

Here, the outer door may further include a lower plate disposed at a different level from the upper plate, and the locking protrusion may be disposed between the upper plate and the lower plate.

Here, the locking protrusion may include one of an upper portion and a lower portion, wherein the upper portion is configured to correspond to the side surface of the upper plate; and the lower portion is configured to correspond to the side surface of the lower plate.

Here, the outer door may further include a sealing material that contacts the outer housing in the closed state, and the locking protrusion may be formed to rotate independently of the contact between the sealing material and the outer housing.

Here, the fastening module may further include a driving unit configured to rotate and drive the locking protrusion.

Here, the fastening module may further include a rotating member having the locking protrusion formed thereon, and the driving unit may be configured to rotate the rotating member about a rotation axis arranged along the opening and closing direction of the outer door.

Here, the driving unit may include: a driven gear formed on the rotating member; a driving gear engaged with the driven gear; and a motor for rotating the driving gear.

According to another aspect of the present invention, a high-pressure substrate processing apparatus may include: a chamber having a housing configured to accommodate a substrate to be processed and a process gas supplied at a pressure higher than atmospheric pressure; a door configured to move between a closed state for closing the housing and an open state for opening the housing; and a fastening module having a supporting protrusion provided on the housing; and a locking protrusion disposed on the supporting protrusion so as to move to connect to the door in the closed state. The door includes an upper plate that contacts the housing in the closed state, and the locking protrusion is disposed on a lower side of the upper plate.

Here, the door may further include a lower plate disposed at a different level from the upper plate, with the locking protrusion disposed between the upper plate and the lower plate.

Here, the fastening module may further include a rotating member rotatably disposed on the door and having the locking protrusion protruding therefrom, wherein the locking protrusion may be supported by the supporting protrusion as the rotating member rotates.

Here, the door may further include a sealing material provided on the upper plate, and the locking protrusion may be formed to move independently of the contact between the housing and the sealing material in the closed state.

Here, the process gas may include a reactive gas containing an active gas and a protective gas that is an inert gas. The housing may include: an inner housing configured to contain the substrate to be processed and the reactive gas; and an outer housing configured to contain the inner housing and connected to the inner housing to form an enclosed space for containing the protective gas. The door may be configured to seal the inner housing.

Invention Effect

According to the high-pressure substrate processing apparatus of the present invention constructed as described above, the housing and door for accommodating substrates and high-pressure gas are held in a secure state by a securing module. The securing module is configured such that a locking projection is positioned relative to a supporting projection provided on the housing, and is disposed on the supporting projection so as to move relative to the outer door. The securement between the locking projection and the supporting projection ensures that the housing and door remain securely closed even under high pressure within the chamber.

Furthermore, since the latching protrusion and the gate move independently, only the latching protrusion needs to be moved to couple the housing and door. This minimizes the power required to couple the housing and door.

100, 100’, 100”, 200: High-pressure substrate processing equipment

110: Inner cavity

113:Wafer boat

115: Inner Gate

119: Supporting member

120, 220: External cavity

121, 121’, 121”, 221: Outer shell

125, 125’, 125’, 125”: Exterior door

126, 126’, 126”, 226: upper plate

127, 127’, 127”, 227: Lower plate

128, 128’, 128”, 228: Spacers

129, 229: Sealing materials

130: Air supply module

131: Gas Supply

133: Reaction gas pipeline

135: Protect gas pipelines

140: Exhaust Module

141, 145: Exhaust pipe

150, 150’, 150”, 250: Fastening modules

151, 251: Support protrusions

155, 155’, 155”, 255: Locking protrusions

155a: upper part

155b:lower part

157, 157’, 157”, 257: Rotating member (or rotating ring)

159, 259: Bearings

161: Drive unit

163: Driven gear

164: Drive gear

165: Motor

211: Inner shell

225: Door

CS: Closed Space

E:Opening and closing direction

R: Rotation direction

W: substrate

FIG1 is a conceptual diagram of a high-pressure substrate processing apparatus 100 according to one embodiment of the present invention.

FIG2 is an exploded perspective view showing the high-pressure substrate processing apparatus 100 of FIG1 in an open state.

FIG3 is a cross-sectional view showing the high-pressure substrate processing apparatus 100 of FIG2 in a closed state.

FIG4 is a cross-sectional perspective view used to illustrate the structure of the rotating ring 157 of FIG3 .

FIG5 is a cross-sectional view showing the main parts of a high-pressure substrate processing apparatus 100′ according to a modified example of the high-pressure substrate processing apparatus 100 of FIG3.

FIG6 is a cross-sectional view of the main parts of a high-pressure substrate processing apparatus 100 ″ showing another modified example of the high-pressure substrate processing apparatus 100 of FIG3 .

FIG7 is a cross-sectional view showing a high-pressure substrate processing apparatus 200 according to another embodiment of the present invention in a closed state.

Below, the preferred embodiments of the present invention are described in detail with reference to the accompanying drawings.

The present invention is not limited to the embodiments disclosed below; various modifications may be made and it may be implemented in various different forms. These embodiments are provided solely to complete the disclosure of the present invention and fully explain the scope of the invention to those of ordinary skill. Therefore, it should be understood that the present invention is not limited to the embodiments disclosed below, but includes not only substitutions for or additions to embodiments that differ from any one embodiment, but also all modifications, equivalents, and even substitutes within the technical concept and scope of the present invention.

It should be understood that the accompanying figures are intended only to facilitate understanding of the embodiments disclosed in this specification and are not intended to limit the technical concepts disclosed in this specification. Instead, the drawings are intended to encompass the concepts and all modifications, equivalents, and even substitutes within the technical scope of the present invention. Components in the figures may be exaggerated or reduced in size or thickness for ease of understanding, but this does not limit the scope of protection of the present invention.

The terms used in this specification are intended solely to describe specific implementations or embodiments and are not intended to limit the present invention. However, unless the context clearly indicates otherwise, the singular includes the plural. Terms such as "including" and "consisting of" in this specification are intended to specify the presence of the features, numbers, steps, actions, constituent elements, components, or combinations thereof described in the specification. In other words, the use of terms such as "including" and "consisting of" in this specification should be understood as not excluding the presence or possibility of additional one or more other features, numbers, steps, actions, constituent elements, components, or combinations thereof.

Terms including ordinal numbers such as "first" and "second" can be used to describe various components, but the components are not limited to these terms. These terms are used only to distinguish one component from other components.

When a component is referred to as being "connected" or "in communication" with another component, it may be directly connected or in communication with the other component, but it should be understood that other components may exist in between. Conversely, when a component is referred to as being "directly connected" or "directly in communication" with another component, it should be understood that no other components exist in between.

When a component is mentioned as being "above" or "below" another component, it should be understood that it is not only disposed directly above the other component, but also that other components may be present in between.

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meanings as generally understood by persons having ordinary knowledge in the art to which this invention belongs. Terms defined in commonly used dictionaries should be interpreted as having meanings consistent with the context of the relevant art and should not be construed as having ideal or overly formal meanings unless expressly defined in this application.

FIG1 is a conceptual diagram of a high-pressure substrate processing apparatus 100 according to one embodiment of the present invention.

Referring to FIG. 1 , a high-pressure substrate processing apparatus 100 may include an inner chamber 110 , an outer chamber 120 , an air supply module 130 , and an air exhaust module 140 .

The inner chamber 110 forms a processing space for accommodating objects to be processed. The inner chamber 110 can be made of a non-metallic material, such as quartz, to reduce contamination in the high-temperature and high-pressure operating environment. A heater (not shown) located outside the inner chamber 110 can be operated to raise the temperature of the inner chamber 110 to several hundred to several thousand degrees Celsius. The objects can be semiconductor substrates W mounted on a holder (see Figure 2). The holder can be a wafer boat 113 (see Figure 2) capable of stacking the substrates W to be processed in multiple layers.

The outer cavity 120 forms an internal space for accommodating the inner cavity 110. The outer cavity 120 is disposed outside the inner cavity 110. Unlike the inner cavity 110, the outer cavity 120 can be made of a metal material because it does not contaminate the objects.

The gas supply module 130 is a structure for supplying gas to the inner chamber 110 and the outer chamber 120. The gas supply module 130 includes a gas supply 131 as a gas source. The gas supply 131 can selectively supply reactant gases used in heat treatment processes, such as hydrogen ( _H2 ), deuterium ( _D2 ), fluorine ( _F2 ), ammonia ( _NH3 ), chlorine ( _Cl2 ), and nitrogen ( _N2 ), to the inner chamber 110. The gas supply 131 can also supply a shielding gas, such as nitrogen or argon (Ar), which serves as an inert gas, to the outer chamber 120. These reactant and shielding gases can be simply referred to as process gases. The process gas and the shielding gas are supplied to the inner chamber 110 or the outer chamber 120 respectively through the reaction gas line 133 or the shielding gas line 135. The shielding gas supplied to the outer chamber 120 is specifically supplied to the space (shielding space) between the outer chamber 120 and the inner chamber 110.

The process gas is supplied at a pressure higher than atmospheric pressure (high pressure), for example, reaching several to tens of atmospheres. When the pressure of the reaction gas is a first pressure and the pressure of the shield gas is a second pressure, these can be maintained at a predetermined relationship. For example, the second pressure can be set slightly higher than the first pressure. This pressure difference provides the advantage of preventing the reaction gas from leaking from the inner chamber 110.

The exhaust module 140 is used to exhaust the process gases. To exhaust the reaction gases from the inner chamber 110, an exhaust pipe 141 is connected to the upper portion of the inner chamber 110. Similarly, to exhaust the shielding gas from the outer chamber 120, an exhaust pipe 145 is provided, connected to the outer chamber 120. Because these exhaust pipes 141 are interconnected, the reaction gases are diluted by the shielding gas during the exhaust process, reducing their concentration.

The fastening structure of the outer chamber 120 is described with reference to Figures 2 and 3. Figure 2 is an exploded perspective view showing the high-pressure substrate processing apparatus 100 of Figure 1 in an open state, and Figure 3 is a cross-sectional view showing the high-pressure substrate processing apparatus 100 of Figure 2 in a closed state.

Referring to these figures, the inner chamber 110 includes an inner housing (not shown) and an inner door 115. The inner housing forms the processing space for accommodating substrates W to be processed, and its lower portion may be open. The inner door 115 is shaped to close the open lower portion of the inner housing. The inner door 115 may have a generally downwardly opening trough shape.

When the inner door 115 is lowered, the processing space is opened (open state, see Figure 2). In the open state, the substrates to be processed are unloaded from the wafer boat 113, and new substrates to be processed are loaded into the wafer boat 113. When the inner door 115 is raised, the processing space is closed (closed state, see Figure 3). In the closed state, the substrates to be processed W undergo processes such as thermal treatment and deposition.

The outer cavity 120 also includes an outer shell 121 and an outer door 125. The outer shell 121 has a size that accommodates the inner cavity 110. An inner shell (not shown) is mounted on the outer shell 121. When the outer door 125 moves, the outer shell 121 can also be opened and closed. The outer door 125 can be connected to the inner door 115 via a supporting member 119. The supporting member 119 can have a spring support structure that elastically extends and contracts along the opening and closing direction E. The opening and closing direction E is the direction in which the outer door 125 switches between the closed state and the open state. When the outer shell 121 is upright, the opening and closing direction E can be a direction that is substantially the same as the lifting or vertical direction. During the transition from the open state to the closed state, the support member 119 allows the outer door 125 to move toward the inner door 115. In an alternative embodiment, the support member 119 may be, for example, an O-ring. In another embodiment, the inner door 115 and the outer door 125 may be integrated together to form a single member.

The outer door 125 moves up and down together with the inner door 115 to open and close the outer housing 121. Unlike the above, the inner door 115 and the outer door 125 can be opened and closed independently without being connected.

The high-pressure substrate processing apparatus 100 may further include a tightening module 150 for tightening the outer housing 121 and outer door 125 in the closed state. Because the inner door 115 is supported on the outer door 125 via the support member 119, the tightening module 150 ensures that the inner door 115 is tightly attached to the inner housing. The tightening module 150 maintains the protective gas within the outer chamber 120 at the second pressure. The tightening module 150 also applies a tightening force to maintain the reactive gas within the inner chamber 110 at the first pressure.

The fastening module 150 may specifically include a supporting protrusion 151 and a locking protrusion 155.

The supporting protrusion 151 is a protrusion provided on the outer housing 121. As in this embodiment, the supporting protrusion 151 can be mounted on the inner circumferential surface of the outer housing 121. Multiple supporting protrusions 151 can be arranged along the circumference of the inner circumferential surface. The multiple supporting protrusions 151 can be arranged on the same level or plane along the opening and closing direction E.

The latching protrusion 155 is sized to pass between a pair of adjacent support protrusions 151 when the outer door 125 moves in the opening and closing direction E. Like the support protrusions 151, multiple latching protrusions 155 may be provided. The latching protrusion 155 is configured to move relative to the outer door 125 in the closed state and is disposed on the support protrusion 151.

According to this embodiment, the locking protrusion 155 can move while being connected to the outer door 125. For example, the locking protrusion 155 can be rotatably provided on the outer door 125.

Unlike the above, the latching protrusion 155 can be movably provided on the outer housing 121. The latching protrusion 155 moves on the outer housing 121 toward the outer door 125 and is connected to the outer door 125. To this end, the outer door 125 can have a groove-like structure (not shown) to accommodate the latching protrusion 155.

When the locking protrusion 155 is positioned on the supporting protrusion 151 as it moves, it is supported by the supporting protrusion 151 (fastened state). This allows the outer door 125 to remain firmly fastened to the outer housing 121 even under the high pressure of the process gas.

When multiple latching protrusions 155 are provided, each latching protrusion 155 can rotate independently. Alternatively, the latching protrusion 155 can be integrally formed with the rotating member 157 and rotate together with the rotating member 157. The rotating member 157 can have a ring shape as shown. In this embodiment, the rotating member 157 can be referred to as a rotating ring. The latching protrusion 155 can be formed to protrude outward from the outer circumference of the rotating ring 157. The rotating ring 157 can be configured to rotate in a rotation direction R (centered around a rotation axis in the opening and closing direction E).

The swivel ring 157 can be rotatably coupled to the outer door 125. The outer door 125 has an upper plate 126, and the swivel ring 157 (and the latching protrusion 155) can be located on the lower side of the upper plate 126. If the outer door 125 also has a lower plate 127, the swivel ring 157 can be disposed between the upper and lower plates 126, 127. A bearing 159 can be disposed between each of the upper and lower plates 126, 127, and the swivel ring 157. A thrust bearing can be used as the bearing 159. The swivel ring 157 can also be located within the area defined by the outer housing 121 (and the support protrusion 151).

In the closed state, the upper plate 126 is arranged in contact with the outer housing 121. The upper plate 126 and the lower plate 127 may be connected by a spacer 128. This allows the lower plate 127 to be positioned at a different height than the upper plate 126. The spacer 128 may have a smaller diameter or width than the upper plate 126 and/or the lower plate 127. The spacer 128 may be formed as a separate component from the upper plate 126 and the lower plate 127, or may be formed as a single component with one of the two. A swivel ring 157 and a locking protrusion 155 are disposed within the space defined by the spacer 128. The swivel ring 157 may be positioned substantially parallel to the outer door 125 when the spacer 128 is inserted into the hollow portion of the spacer 128.

When rotating ring 157 rotates in the closed state, outer door 125 may not be linked to the rotation of rotating ring 157. Specifically, while upper plate 126 remains in contact with outer housing 121 via sealing material 129, rotating ring 157 can rotate independently of this contact. Sealing material 129 may be an O-ring mounted on upper plate 126.

Referring to FIG4 , the structure for driving the rotating ring 157 for rotation is described. FIG4 is a cross-sectional perspective view illustrating the structure for driving the rotating ring 157 of FIG3 .

Further referring to FIG4 , the rotating ring 157 can be driven to rotate by the driving unit 161.

The drive unit 161 may include a driven gear 163, a drive gear 164, and a motor 165. The driven gear 163 may be formed on the inner circumference of the rotating ring 157. The drive gear 164 may be a gear that engages with the driven gear 163. The drive gear 164 may be located between the rotating ring 157 and the spacer 128.

With this structure, the rotational force of motor 165 is transmitted to drive gear 164. The output shaft connecting motor 165 and drive gear 164 can be configured to pass through lower plate 127. When drive gear 164 rotates, driven gear 163, which engages with drive gear 164, also rotates. Rotating driven gear 163 also rotates rotating ring 157, causing locking protrusion 155 to rotate in rotation direction R (see Figure 2). Consequently, locking protrusion 155 moves on support protrusion 151 or to a position offset from support protrusion 151.

During the rotation of the locking protrusion 155, the outer door 125 does not rotate with the locking protrusion 155. The power output from the motor 165 is sufficient to rotate the locking protrusion 155, not including the outer door 125.

Although the drive unit 161 is described as being composed of gears 163 and 164 and a motor 165, the present invention is not limited thereto. The drive unit may also be composed of other actuators such as a cylinder.

Other forms of the high-pressure substrate processing apparatus 100 will be described with reference to Figures 5 and 6. Figure 5 is a cross-sectional view of the main components of a high-pressure substrate processing apparatus 100' according to a modified example of the high-pressure substrate processing apparatus 100 of Figure 3. Figure 6 is a cross-sectional view of the main components of a high-pressure substrate processing apparatus 100" according to another modified example of the high-pressure substrate processing apparatus 100 of Figure 3. In these figures, components identical to those in Figure 3 are labeled with the same reference numerals, and the bearing 159 is omitted for simplicity.

Referring to FIG. 5 , unlike the previous latching protrusion 155, the latching protrusion 155′ further includes an upper portion 155a. The upper portion 155a may be configured to correspond to the side surface of the upper plate 126′.

The upper surface of the upper portion 155a can be approximately level with the upper surface of the upper plate 126'. This allows the upper surface of the latching protrusion 155' to contact the outer housing 121', while the lower surface of the latching protrusion 155' can contact the supporting protrusion 151.

Referring to FIG. 6 , unlike the previous latching protrusion 155, the latching protrusion 155" further includes an upper portion 155a and a lower portion 155b. The upper portion 155a may be configured to correspond to the side surface of the upper plate 126'. The lower portion 155b may be configured to correspond to the side surface of the lower plate 127'.

The upper surface of upper portion 155a can be approximately level with the upper surface of upper plate 126'. The lower surface of lower portion 155b can be approximately level with the lower surface of lower plate 127'. This allows the upper surface of locking protrusion 155" to contact housing 121", while the lower surface of locking protrusion 155" can contact support protrusion 151.

As described above, the drive unit 161 previously described with reference to FIG. 4 for rotationally driving the rotating rings 157′ and 157″ can also be applied to this variation.

In an alternative embodiment, a rotating disc (not shown) can be used as the rotating member in place of the rotating ring 157, 157', 157". The rotating disc is a solid disc that can be rotatably connected to the upper plate 126, 126', 126" and the bottom surface. To facilitate the connection, a recess can be formed in one of the rotating disc and the upper plate 126, 126', 126" to accommodate a protrusion of the other. A bearing can be disposed between the protrusion and the recess. A ring gear can be provided on the bottom surface of the rotating disc, which can be rotationally driven by a motor and a pinion.

The aforementioned fastening modules 150, 150', and 150" can also be applied to a semi-dual chamber, which is different from the aforementioned dual chamber. An example of the fastening module being applied to the semi-dual chamber will be described with reference to FIG7 . FIG7 is a cross-sectional view of a high-pressure substrate processing apparatus 200 in a closed state according to another embodiment of the present invention. Components identical to those in the previous embodiment are labeled with similar reference numerals, and detailed descriptions thereof will be omitted.

Referring to Figure 7 , the semi-dual chamber can have two shells (an inner shell 211 and an outer shell 221) and a door 225. The two shells (211, 221) can correspond to the inner shell and outer shell 121 of the aforementioned embodiment. The two shells (211, 221) can be combined to form a closed space CS (corresponding to the protective space) through their own shapes or through the interposition of other components. Similar to the aforementioned embodiment, the substrate and the reaction gas can be placed in the inner shell 211. The inner shell 211 can also be protected by the protective gas injected into the closed space CS. Unlike the aforementioned embodiment, the door 225 is not protected by the protective gas.

The door 225 corresponds to the outer door 125 in the above-described embodiment. The door 225 can open and close the inner housing 211. The fastening module 250 is applied to the outer housing 221 and the door 225. The specific structure of the fastening module 250 can be substantially the same as the fastening modules 150, 150', and 150" described above.

This specification describes high-pressure substrate processing apparatuses 100, 100', 100", and 200 as examples of processing apparatuses with dual chambers and semi-dual chambers, but the present invention is not limited thereto. Processing apparatuses with a single chamber also fall within the scope of the present invention. The single chamber comprises a housing and a door. Wafer substrates are positioned within the chamber, and process gases, specifically reactive gases, for processing the wafer substrates are supplied. Fastening modules 150, 150', 150", and 250 are also applicable to the single chambers. Fastening modules 150, 150', 150", and 250 ensure that the door is securely fastened to the housing regardless of gas pressure.

This specification illustrates a batch-type processing apparatus, but the present invention is not limited thereto. The present invention can also be applied to a single-wafer-type processing apparatus.

The above description is for illustrative purposes only and is not intended to be limiting. Any equivalent modifications or variations that do not depart from the spirit and scope of this invention shall be included in the scope of the patent application attached hereto.

100: High-pressure substrate processing equipment

121: Shell

125: Outer Gate

126:On the board

127: Lower the board

128: Spacer

129: Sealing material

150: Fastening module

151: Support protrusion

155: Locking protrusion

157: Rotating member (or rotating ring)

159: Bearings

E:Opening and closing direction

R: Rotation direction

Claims (15)

A high-pressure substrate processing apparatus comprises: an inner chamber configured to contain a substrate to be processed and a reaction gas supplied at a first pressure higher than atmospheric pressure; an outer chamber comprising: an outer housing configured to contain the inner chamber; and an outer door movable between a closed state for closing the outer housing and an open state for opening the outer housing, the outer chamber configured to contain a protective gas supplied at a second pressure set relative to the first pressure; and a fastening module comprising: a supporting protrusion provided on the outer housing; a rotating member rotatably provided on the outer door; and a locking protrusion protruding from the rotating member and disposed on the supporting protrusion as the rotating member rotates in the closed state. The high-pressure substrate processing apparatus according to claim 1, wherein the rotating member is located within an area defined by the housing. The high-pressure substrate processing apparatus according to claim 1, wherein the rotating member includes a rotating ring having an annular shape. A high-pressure substrate processing apparatus comprises: an inner chamber configured to accommodate a substrate to be processed and a reaction gas supplied at a first pressure higher than atmospheric pressure; an outer chamber comprising: an outer housing configured to accommodate the inner chamber; and an outer door movable between a closed state for closing the outer housing and an open state for opening the outer housing, wherein the outer chamber is configured to accommodate the reaction gas at a first pressure higher than atmospheric pressure. A protective gas is supplied at a second pressure set at a first pressure; and a fastening module comprising: a supporting protrusion disposed on the outer housing; and a locking protrusion disposed on the supporting protrusion so as to move and connect to the outer door in the closed state. The outer door includes an upper plate that contacts the outer housing in the closed state, and the locking protrusion is disposed on the lower side of the upper plate. The high-pressure substrate processing apparatus according to claim 4, wherein the outer door further includes a lower plate disposed at a different level from the upper plate, and wherein the locking protrusion is disposed between the upper plate and the lower plate. The high-pressure substrate processing apparatus according to claim 5, wherein the latching protrusion includes one of an upper portion and a lower portion, wherein the upper portion is configured to correspond to a side surface of the upper plate, and the lower portion is configured to correspond to a side surface of the lower plate. The high-pressure substrate processing apparatus according to claim 1, wherein the outer door further includes a sealing material that contacts the outer housing in the closed state, and the locking protrusion is formed to rotate independently of the contact between the sealing material and the outer housing. The high-voltage substrate processing apparatus according to claim 1, wherein the fastening module further includes a driving unit configured to rotate and drive the locking protrusion. The high-voltage substrate processing apparatus according to claim 8, wherein the fastening module further includes a rotating member having the locking protrusion formed thereon, and the driving unit is configured to rotate the rotating member about a rotation axis disposed along the opening and closing direction of the outer door. The high-pressure substrate processing apparatus of claim 9, wherein the drive unit comprises: a driven gear formed on the rotating member; a drive gear engaged with the driven gear; and a motor for rotating the drive gear. A high-pressure substrate processing apparatus includes a chamber having a housing configured to accommodate substrates to be processed and a process gas supplied at a pressure higher than atmospheric pressure; a door configured to move between a closed state, closing the housing, and an open state, opening the housing; and a fastening module having a supporting protrusion provided on the housing; and a locking protrusion disposed on the supporting protrusion so as to move to connect to the door in the closed state. The door includes an upper plate that contacts the housing in the closed state, and the locking protrusion is disposed on a lower side of the upper plate. The high-pressure substrate processing apparatus according to claim 11, wherein the door further includes a lower plate disposed at a different level from the upper plate, and the locking protrusion is disposed between the upper plate and the lower plate. The high-voltage substrate processing apparatus according to claim 11, wherein the fastening module further includes a rotating member rotatably mounted on the door and having the locking protrusion protruding therefrom, wherein the locking protrusion is supported by the supporting protrusion as the rotating member rotates. The high-pressure substrate processing apparatus of claim 11, wherein the door further includes a sealing material provided on the upper plate, and the locking protrusion is formed to move independently of the contact between the housing and the sealing material in the closed state. The high-pressure substrate processing apparatus according to claim 11, wherein the process gas comprises a reactive gas containing an active gas and a shielding gas which is an inert gas, and the housing comprises: an inner housing formed to contain the substrate to be processed and the reactive gas; and an outer housing for containing the inner housing and connected to the inner housing to form an enclosed space for containing the shielding gas, and the door is formed to close the inner housing.