TWI876316B - Electronic component processing device and electronic component testing device - Google Patents

Abstract

[Topic] Provide an electronic component processing device that can easily cope with the change of the type of device to be tested and can adopt a structure that can adjust the temperature or parallelism of multiple devices to be tested separately. [Solution] The electronic component processing device 20 includes: a plurality of retaining blocks 40, which are configured to correspond to the probe 17 and hold the device to be tested 200; a retaining plate 50, which has a plurality of openings 51 for inserting the retaining blocks and can float and hold the plurality of retaining blocks; an alignment unit 70, which is independently provided with the retaining block, moves the retaining block relative to the retaining plate, and positions the device to be tested relative to the probe; and a pressing device 60, which presses the device to be tested against the probe by moving the retaining plate that holds the retaining block relative to the probe.

Description

Electronic component processing device and electronic component testing device

The present invention relates to an electronic component processing device for processing electronic components under test (DUT: Device Under Test) such as semiconductor integrated circuit elements, and an electronic component testing device including the electronic component processing device.

An electronic component processing device is known, comprising a thermal head for holding a plurality of bare chips, a moving device for moving the thermal head, and an alignment unit for simultaneously pressing the plurality of bare chips to the contact portion after positioning the plurality of bare chips to the contact portion respectively. (For example: refer to patent document 1)

[Prior technical literature] [Patent Literature]

[Patent Document 1] Japanese Patent Publication No. 2016-85203

In the electronic component processing device, the thermal head is fixed to the moving device. Therefore, when the pitch or arrangement of the contact parts on the test head changes with the type of the device under test (DUT), the entire alignment unit must be replaced, which makes it difficult to cope with the change of the type of the device under test.

In addition, in the above-mentioned electronic component processing device, a plurality of bare crystals are held on the same holding surface of the thermal head. Therefore, there is a problem that it is difficult to adopt a structure that can adjust the temperature or parallelism of the above-mentioned plurality of bare crystals separately.

The problem that the present invention aims to solve is to provide an electronic component processing device and an electronic component testing device that can easily respond to changes in the type of device to be tested, and can also adopt a structure that can adjust the temperature or parallelism of multiple devices to be tested separately.

[1] Type 1 of the present invention is an electronic component processing device that moves a device to be tested to a contact portion. The electronic component processing device includes: a plurality of retaining bodies, each configured to correspond to the contact portion and each retaining the device to be tested; a retaining plate having a plurality of first openings, each of which is inserted into the first openings and retains the retaining bodies in a floating manner; a positioning device, which is independently provided with the retaining bodies and determines the position of the device to be tested relative to the contact portion by moving the retaining bodies relative to the retaining plate; and a pressing device, which presses the device to be tested against the contact portion by moving the retaining plate that retains the retaining bodies relative to the contact portion. After the positioning device abuts against the retaining bodies, it moves the retaining bodies in a planar direction relative to the retaining plate.

[2] Type 2 of the present invention may also be an electronic component processing device. In the electronic component processing device of type 1, the pressing device includes: a holding frame that detachably holds the holding plate; and a first moving device that is used to move the holding frame that holds the holding plate.

[3] Type 3 of the present invention may also be an electronic component processing device. In the electronic component processing device of Type 1 or Type 2, the retaining bodies each include a parallelism adjustment device to adjust the parallelism of the device to be tested relative to the contact portion.

[4] Type 4 of the present invention may also be an electronic component processing device. In the electronic component processing device of type 3, the parallelism adjustment device includes: a first adjustment part, which tilts the device to be tested with a first axis as the center; and a second adjustment part, which tilts the device to be tested with a second axis as the center. The first axis is an axis substantially parallel to the plane direction of the contact part. The second axis is substantially parallel to the plane direction of the contact part, and when the second axis is projected in the normal direction of the contact part, the second axis is an axis substantially orthogonal to the first axis.

[5] Type 5 of the present invention may also be an electronic component processing device. In the electronic component processing device of type 3 or type 4, the electronic component processing device further comprises: a parallelism detection device for detecting the parallelism of the device to be tested relative to the contact portion; and a first control device for controlling the parallelism adjustment device based on the parallelism detected by the parallelism detection device.

[6] Type 6 of the present invention may also be an electronic component processing device. In the electronic component processing device of type 5, the parallelism detection device includes: a first sensor for detecting the height of a predetermined position in the device to be tested; a second sensor for detecting the height of a predetermined position in the contact portion; and a calculation unit for calculating the parallelism of the device to be tested relative to the contact portion based on the detection results of the first sensor and the second sensor.

[7] Type 7 of the present invention may also be an electronic component processing device. In the electronic component processing device of type 6, the electronic component processing device further includes: a second moving device for moving the first sensor and the second sensor. The second moving device includes: a first parallel moving part for moving the first sensor and the second sensor along a direction substantially parallel to the arrangement direction of the holding bodies. The first parallel moving part has a range of motion that allows the first sensor and the second sensor to face the holding bodies.

[8] Type 8 of the present invention may also be an electronic component processing device. In any of the electronic component processing devices of types 3 to 7, the retaining bodies each include a height adjustment device for adjusting the height of the device to be tested relative to the contact portion.

[9] Type 9 of the present invention may also be an electronic component processing device. In the electronic component processing device of type 6 or type 7, the retaining bodies respectively include height adjustment devices for adjusting the height of the device to be tested relative to the contact portion. The electronic component processing device further includes: a second control device for controlling the height adjustment devices based on the detection results of the first sensor and the second sensor.

[10] Type 10 of the present invention may also be an electronic component processing device. In any electronic component processing device of types 1 to 9, the retaining bodies each include a heat exchanger to perform heat exchange with the device to be tested.

[11] The type 11 of the present invention may also be an electronic component processing device. In the electronic component processing device of type 10, the retaining bodies respectively include parallelism adjustment devices for adjusting the parallelism of the device to be tested relative to the contact portion. The heat exchanger contacts and holds the device to be tested. The parallelism adjustment device adjusts the parallelism of the device to be tested through the heat exchanger.

[12] The type 12 of the present invention may also be an electronic component processing device. In any electronic component processing device of type 1 to type 11, the positioning device includes: an abutting body abutting the holding bodies; and a third moving device moving the abutting body. The third moving device includes a second parallel moving part moving the abutting body along a direction substantially parallel to the arrangement direction of the holding bodies. The second parallel moving part has a range of motion that allows the abutting body to face the holding bodies.

[13] Type 13 of the present invention may also be an electronic component processing device. In any one of types 1 to 12, the electronic component processing device further comprises: a position detection device for detecting the relative position of the device to be tested relative to the contact portion; and a third control device for controlling the positioning device based on the relative position detected by the position detection device.

[14] The type 14 of the present invention may also be an electronic component processing device. In the electronic component processing device of type 13, the third control device controls the positioning device to determine the sequential positions of the plurality of devices to be tested, each held on the holding bodies, relative to the contact portion.

[15] Type 15 of the present invention may also be an electronic component processing device, in which in any of types 1 to 14, the device under test comprises: a bare die unit; a 2.5D device intermediate, which is configured with a plurality of bare dies arranged side by side on a silicon medium; or a 3D device intermediate, which is formed by a plurality of bare dies stacked on top of each other.

[16] Type 16 of the present invention is an electronic component testing device for testing the electrical characteristics of a device under test, comprising: an electronic component processing device of any one of Types 1 to 15; and a test piece electrically connected to the contact portion.

According to the present invention, since the positioning device is independent of the holding body, by changing the holding body and the holding plate holding the holding body, it is easy to correspond to the change of the type of the device to be tested.

In addition, according to the present invention, since a plurality of retaining bodies are respectively retained on the retaining plate, and a plurality of devices to be tested are retained on the same retaining surface, a structure that can adjust the temperature or parallelism of a plurality of devices to be tested separately can be adopted.

1: Electronic component testing equipment

10: Test piece

11: Main frame

12: Test head

15: Probe card

16: Circuit board

17: Probe head

18: Contactor

19: Shell

20: Processor

21: Upper base

22: Lower base

30: Contact unit

40: Keep block

41: Thermal head

42: Parallelism adjustment device

43: Height adjustment device

44: Main body

50: Holding board

51: Open mouth

60: Pressing device

61: Keep the frame

62: Mobile device

63: Support components

64:Z direction track

65:Actuator

70: Alignment unit

71: Butt block

72: Mobile device

73: Support components

80: Camera unit

81: First Camera

82: Second camera

83: Prism

84: Prism

85: Support components

90:Sensor unit

91: First sensor

92: Second sensor

93: Prism

94: Prism

95: Support components

100: Control device

110: Image processing department

120: First calculation unit

130: Second calculation unit

140: The third calculation unit

150: Drive control unit

200: Device under test

210: Terminal

211: Open mouth

411: Upper surface

412: Suction nozzle

413: Channel

414: Channel

415: Fins

421: First Adjustment Department

422: Second Adjustment Department

423: First actuator

424: Second actuator

431:Actuator

441: flange

442: Lower part

611: Open your mouth

631: Open mouth

711: Rotary drive unit

721:X direction track

722: X-direction platform

723:Y direction track

724:Y direction platform

725:Z direction track

726:Z-direction actuator

II-II: Line segment

Part III:

IX: Part

IVB-IVB: Line segment

IVC-IVC: Line segment

OA ₁ : Optical axis

OA ₂ : Optical axis

OA ₃ : Optical axis

OA ₄ : Optical axis

S10: Step

S20: Step

S30: Step

S40: Step

S50: Step

S60: Step

S70: Step

S80: Step

Figure 1 is a schematic cross-sectional view of the internal structure of the electronic component testing device in an embodiment of the present invention.

Figure 2 is a cross-sectional view along line II-II in Figure 1.

Figure 3 is a cross-sectional view of the retaining block in an embodiment of the present invention, which is an enlarged view of part III of Figure 1.

FIG4(a) is a plan view of the camera unit and the sensor unit in an embodiment of the present invention, FIG4(b) is a cross-sectional view along the IVB-IVB line segment of FIG4(a), and FIG4(c) is a cross-sectional view along the IVC-IVC line segment of FIG4(a).

Figure 5 is a schematic block diagram of the control system of the electronic component processing device in an embodiment of the present invention.

Figure 6 is a schematic flow chart of a method for positioning an electronic component testing device in an embodiment of the present invention.

Figure 7 (a) and Figure 7 (b) are schematic cross-sectional views of the operation of the electronic component testing device in an embodiment of the present invention, and are schematic views of step S10 of Figure 6.

Figures 8(a) and 8(b) are schematic cross-sectional views of the operation of the electronic component testing device in an embodiment of the present invention, and are schematic views of step S20 of Figure 6.

FIG. 9 is a schematic cross-sectional view of the operation of the electronic component testing device in an embodiment of the present invention, which is a schematic view of step S30 of FIG. 6 and an enlarged view corresponding to part IX of FIG. 8.

Figures 10(a) and 10(b) are schematic cross-sectional views of the operation of the electronic component testing device in an embodiment of the present invention, and are schematic views of step S40 of Figure 6.

Figures 11(a) and 11(b) are schematic cross-sectional views of the operation of the electronic component testing device in an embodiment of the present invention, and are schematic views of step S50 of Figure 6.

Figures 12(a) and 12(b) are schematic cross-sectional views of the operation of the electronic component testing device in an embodiment of the present invention, and are schematic views of step S60 of Figure 6.

Figures 13(a) and 13(b) are schematic cross-sectional views of the operation of the electronic component testing device in an embodiment of the present invention, and are schematic views of step S10 of Figure 6.

Figures 14 (a) and 14 (b) are schematic cross-sectional views of the operation of the electronic component testing device in an embodiment of the present invention, and are schematic views of step S80 of Figure 6.

The following is an explanation of the embodiments of the present invention based on the drawings.

Figure 1 is a schematic cross-sectional view of the internal structure of the electronic component testing device 1 in an embodiment of the present invention. Figure 2 is a cross-sectional view along the II-II line segment of Figure 1.

The electronic component testing device 1 of this embodiment is a device for testing the electrical characteristics of the device under test 200. As shown in Figures 1 and 2, this electronic component testing device 1 includes a test piece 10 for testing the device under test 200, and a processor 20 for transporting the device under test 200 and pressing the device under test 200 onto the probe card 15. This processor 20 is equivalent to an example of an "electronic component processing device" in the form of the present invention.

As a specific example of the device under test 200 as a test object, for example, it can be illustrated as a bare crystal (bare chip) after cutting a semiconductor wafer. In addition, the device under test 200 is not limited to a bare crystal unit. For example, the device under test 200 can also be a 2.5D component intermediate or a 3D component intermediate.

Here, a 2.5D device intermediate is a device intermediate including a silicon interposer and a plurality of bare chips arranged in parallel on the silicon interposer. For example, such a 2.5D device intermediate is mounted on a circuit substrate and packaged by a resin material to form a final product (i.e., a 2.5D device).

On the other hand, a 3D device intermediate is a device intermediate that includes a plurality of bare chips stacked on top of each other and electrically connected via through-silicon vias (TSVs). For example, this 3D device intermediate is mounted on a circuit substrate and packaged with a resin material to form a final product (i.e., a 3D device) like the above-mentioned 2.5D device intermediate.

As shown in Figures 1 and 2, the test piece 10 includes a main frame (test piece body) 11 and a test head 12. The main frame 11 is connected to the test head 12 via a cable (not shown). The probe card 15 is electrically connected to the test head 12. This probe card 15 enters the interior of the processor 20 through an opening 211 formed at the upper base 21 of the processor 20.

The probe card 15 includes a circuit board 16 and four probe heads 17 mounted on the circuit board 16. One probe head 17 corresponds to one device under test 200, so that four devices under test 200 can be tested simultaneously in this embodiment. The four devices under test 200 are arranged in a row on the circuit board 16 at equal intervals along the X direction in the figure. This probe head 17 is equivalent to an example of a "contact part" in the type of the present invention.

Furthermore, the number of probe heads 17 including the probe card 15 is not particularly limited to the above-mentioned number, but can be determined according to the number of devices to be tested 200 (simultaneous measurement number) tested simultaneously in the electronic component testing device 1. Furthermore, the number of probe heads 17 including the probe card 15 is not particularly limited to the above-mentioned arrangement.

Each probe head 17 includes a contactor 18 that contacts the terminal of the device under test 200 and a housing 19 that holds the contactor 18. The contactor 18 is not particularly limited, and examples thereof include a single needle spring connector, a vertical probe, a cantilever probe, an anisotropic conductive rubber sheet, a bump disposed on a film, or a contactor made using micro-electromechanical system (MEMS) technology. For example, the probe heads 17 are each fixed to the circuit board 16 by bolting the housing 19 to the circuit board 16.

As shown in FIG. 1 and FIG. 2, the processor 20 includes a contact unit 30, an alignment unit 70, a camera unit 80, a sensor unit 90, and a control device 100 (see FIG. 5).

The contact unit 30 is a unit that presses the device under test 200 to the probe head 17. The alignment unit 70 is a positioning device that determines the position of the device under test 200 relative to the probe head 17 by horizontally moving the holding block 40 (described below) of the contact unit 30 that holds the device under test 200.

The camera unit 80 is a photographing unit that photographs the probe head 17 and the device to be tested 200 held in the holding block 40. The sensor unit 90 is a detection unit that detects the height of each predetermined position in the probe head 17 and the device to be tested 200.

The control device 100 is a control device that controls various actuators including the contact unit 30 and the alignment unit 70. In addition, the control device 100 includes a function of processing the image information obtained by the camera unit 80 and identifying the relative position of the device to be tested 200 relative to the probe head 17. Further, the control device 100 includes a function of detecting the relative parallelism of the device to be tested 200 relative to the probe head 17 and detecting the relative height of the device to be tested 200 relative to the probe head 17 based on the detection result of the sensor unit 90.

In this embodiment, although not specifically illustrated, the transport device takes the device to be tested 200 before testing from a tray or a plate and transports the device to be tested 200 to the holding block 40 of the contact unit 30.

As a specific example of the above-mentioned transport device, although not particularly limited, a pick-and-place device including a suction cup can be exemplified. In addition, as a specific example of the above-mentioned tray, although not particularly limited, for example, a customized tray that complies with the JEDEC (Joint Electron Device Engineering Council) specification can be exemplified. In addition, as a specific example of the above-mentioned board, although not particularly limited, for example, a buffer board that can hold the device under test 200 can be exemplified. In addition, the device under test 200 before testing can also be held on a ring frame (wafer ring) instead of the above-mentioned tray or board.

Next, after the device under test 200 is held in the holding block 40, the position of the holding block 40 is adjusted by the alignment unit 70, thereby determining the position of the device under test 200 relative to the probe head 17. Then, the pressing device 60 of the contact unit 30 presses the device under test 200 to the probe head 17, electrically connecting the device under test 200 to the probe head 17. In this state, the test piece 10 tests the electrical characteristics of the device under test 200.

After the test of the device to be tested 200 is completed, the transport device takes the tested device to be tested 200 from the holding block 40 and transports it to a tray or a plate. In addition, the transport device can also transport the tested device to be tested 200 to a ring frame (wafer ring) to replace the tray or plate.

In the following, in addition to Figures 1 and 2, Figures 3 to 5 are referred to for a detailed description of the structures of the contact unit 30, the alignment unit 70, the camera unit 80, the sensor unit 90, and the control device 100.

FIG. 3 is a cross-sectional view of the retaining block 40 in an embodiment of the present invention, and is an enlarged view of part III of FIG. 1. FIG. 4 (a) is a plan view of the camera unit and the sensor unit in an embodiment of the present invention, FIG. 4 (b) is a cross-sectional view along the IVB-IVB line segment of FIG. 4 (a), and FIG. 4 (c) is a cross-sectional view along the IVC-IVC line segment of FIG. 4 (a). FIG. 5 is a schematic block diagram of the control system of the processor 20 in an embodiment of the present invention.

As shown in FIG. 1 and FIG. 2, the contact unit 30 includes a retaining block 40, a retaining plate 50, and a pressing device 60. In this embodiment, in order to correspond to the number of probe heads 17 with the probe card 15, the contact unit 30 includes four retaining blocks 40. Such retaining blocks 40 are equivalent to an example of a "retaining body" in the form of the present invention. In addition, the retaining blocks 40 of the contact unit 30 are not particularly limited to the above-mentioned number, and can be set to the number of probe heads 17 possessed by the probe card 15.

In this embodiment, the abutment block 71 (described below) of the alignment unit 70 can abut against the retaining block 40. Since the retaining block 40 is independent of the alignment unit 70, by changing the retaining block 40 to a retaining block 40 suitable for the device under test 200 after the type change, it becomes easy to correspond to the type change of the device under test 200.

In addition, in this embodiment, since the four retaining blocks 40 are respectively retained on the retaining plate 50, a structure that can adjust the temperature or parallelism of the four devices to be tested 200 separately can be adopted.

Specifically, as shown in FIG. 3, each retaining block 40 includes a thermal head 41, a parallelism adjustment device 42, a height adjustment device 43, and a main body 44. This thermal head 41 is equivalent to an example of a "heat exchanger" in the form of the present invention.

The thermal head 41 is a component for heat exchange, and while holding the device to be tested 200, it exchanges heat with the device to be tested 200. The device to be tested 200 transported by the above-mentioned transport device (not shown) is carried on the upper surface 411 of the thermal head 41. An adsorption nozzle 412 is opened on the upper surface 411 of the thermal head 41. The adsorption nozzle 412 is connected to a vacuum pump (not shown) through a channel 413 formed in the thermal head 41, and can adsorb and hold the device to be tested 200.

In addition, a channel 414 is formed inside the thermal head 41 through which the temperature adjustment liquid can flow. For example, in the channel 414, a plurality of fins 415 are provided to efficiently exchange heat with the liquid. Furthermore, the shape of the channel 414 is not particularly limited to the above shape as long as it can efficiently exchange heat.

Although not specifically shown, such a channel 414 is connected to a temperature adjustment device that can supply two liquids, a coolant and a warm medium. For example, when the temperature of the device to be tested 200 is higher than the target temperature, a liquid having a temperature that cools the device to be tested 200 is supplied to the channel 414. On the other hand, when the temperature of the device to be tested 200 is lower than the target temperature, a liquid having a temperature that heats the device to be tested 200 is supplied to the channel 414.

Furthermore, the temperature adjustment device connected to the channel 414 may also be a device that can only supply one of the refrigerant or the warm medium. When the temperature adjustment device only supplies the refrigerant to the channel 414, the thermal head 41 may also include a heating device such as a heater. Alternatively, when the temperature adjustment device only supplies the warm medium to the channel 414, the channel 414 may also include a cooling device such as a Peltier element. Alternatively, the thermal head 41 may also include a heating device and a cooling device to replace the above-mentioned channel 414.

The parallelism adjustment device 42 is disposed at the lower side of the thermal head 41, and the thermal head 41 is fixed to the parallelism adjustment device 42. This parallelism adjustment device 42 is an adjustment device that adjusts the roll and pitch of the device to be measured 200 held at the thermal head 41, for example, a two-axis angle measuring table including a first adjustment part 421 and a second adjustment part 422. Although not particularly limited, in this embodiment, the second adjustment part 422 is disposed below the first adjustment part 421, and the first adjustment part 421 and the second adjustment part 422 are fixed to each other.

The first adjustment part 421 is a measuring platform for rotating (tilting) the thermal head 41 with the first axis as the center, and is a device for adjusting the rolling of the device to be tested 200. Here, the first axis is an axis substantially parallel to the plane direction of the probe head 17 (XY direction in the figure), and in the figure, it is an axis substantially parallel to the Y axis.

The first adjustment unit 421 is driven by the first actuator 423. Although not particularly limited, as a specific example of the first actuator 423, for example, it can be illustrated as an electric motor including a turbine mechanism.

In contrast, the second adjustment section 422 is a goniometer for rotating (tilting) the thermal head 41 around the second axis, and is a device for adjusting the pitch of the device to be tested 200. Here, the second axis is substantially parallel to the plane direction of the probe head 17 (the XY direction in the figure), and when the second axis is projected on the normal direction of the probe head 17 (the Z direction in the figure) (the pressing direction of the device to be tested 200 toward the probe head 17), the second axis is substantially orthogonal to the first axis, and is substantially parallel to the X axis in the figure.

This second adjustment unit 422 is driven by a second actuator 424. As a specific example of this second actuator 424, although not particularly limited, it can be exemplified as an electric motor including a turbine mechanism, similarly to the first actuator 423 described above.

By rotating the thermal head 41 around the first axis by the first adjustment part 421 and rotating the thermal head 41 around the second axis by the second adjustment part 422, the device to be tested 200 held on the thermal head 41 can be tilted arbitrarily, and the parallelism of the device to be tested 200 relative to the probe head 17 can be adjusted. Moreover, if the mechanism including the parallelism adjustment device 42 is a mechanism that can tilt the device to be tested 200 arbitrarily, it is not limited to the above-mentioned angle measuring stage.

The height adjustment device 43 is provided at the lower side of the parallelism adjustment device 42, and the parallelism adjustment device 42 is fixed to the height adjustment device 43. Such a height adjustment device 43 can move the thermal head 41 and the parallelism adjustment device 42 in the vertical direction (Z-axis direction in the figure) by means of an actuator 431. Such a height adjustment device 43 can be used to offset the displacement in the height direction of the device to be tested 200 generated by adjusting the parallelism of the device to be tested 200 by means of the parallelism adjustment device 42. As a specific example of the actuator 431 of such a height adjustment device 43, although not particularly limited, for example, it can be exemplified as an electric motor connected to a ball screw mechanism.

Furthermore, when the first axis and the second axis of the parallelism adjustment device 42 coincide with the center of gravity of the device to be tested 200 held in the holding block 40, the height adjustment device 43 can be omitted.

The body part 44 is provided at the lower side of the height adjustment device 43, and the height adjustment device 43 is fixed to the body part 44. The body part 44 includes a flange 441 protruding in the horizontal direction (the XY plane direction in the figure) at its upper part. The flange 441 has a larger outer diameter than the lower side part 442 of the body part 44 below the flange 441. The first actuator 423, the second actuator 424 and the actuator 431 can also be accommodated inside the body part 44.

As shown in FIG. 1 and FIG. 2, the retaining plate 50 of the contact unit 30 is a plate-shaped component including four openings 51. The four openings 51 are arranged in a row at equal intervals along the X direction in the figure to correspond to the arrangement of the probe heads 17 in the probe card 15. The retaining plate 50 may also include an adsorption and retention mechanism to adsorb and retain the retaining block 40 inserted into the opening 51.

Furthermore, the openings 51 of the retaining plate 50 are not particularly limited to the above-mentioned number, but can be set to correspond to the number of probe heads 17 of the probe card 15. Similarly, the openings 51 in the retaining plate 50 are not particularly limited to the above-mentioned arrangement, but can be set to correspond to the arrangement of the probe heads 17 in the probe card 15.

Each opening 51 has an inner diameter that is smaller than the outer diameter of the flange 441 of the main body portion 44 of the retaining block 40 and larger than the outer diameter of the lower side portion 442 of the main body portion 44. This opening 51 is equivalent to an example of a "first opening" in the present invention.

Next, the four retaining blocks 40 are each inserted from above into the opening 51 of the retaining plate 50. At this time, as shown in FIG. 3, because the inner diameter of the opening 51 is larger than the outer diameter of the lower side portion 442 of the main body portion 44, the lower side portion 442 enters the opening 51. Conversely, because the inner diameter of the opening 51 is smaller than the outer diameter of the flange 441 of the main body portion 44, the flange 441 is engaged with the periphery of the opening 51.

Therefore, the retaining block 40 can be held in a floating manner on the retaining plate 50. In other words, by horizontally moving the retaining block 40 while the retaining block 40 is pushed up, the retaining block 40 can be horizontally moved relative to the retaining plate 50 within the range of the opening 51.

The pressing device 60 of the contact unit 30 is a moving device that moves the holding plate 50 holding the holding block 40 in the up-down direction (Z-axis direction in the figure) relative to the probe card 15, and presses the device to be tested 200 held on the holding block 40 to the probe head 17. As shown in Figures 1 and 2, the pressing device 60 includes a holding frame 61 holding the holding plate 50 and a moving device 62 moving the holding frame 61. The moving device 62 is equivalent to an example of a "first moving device" in the present invention.

The retaining frame 61 is a frame-shaped component having an opening 611. Such an opening 611 has an inner diameter, and the inner diameter includes all the openings 51 of the retaining plate 50 in a planar view. When the retaining plate 50 is retained in the retaining frame 61, such an opening 611 is configured to face all the openings 51 of the retaining plate 50.

Furthermore, the retaining frame 61 is not particularly limited to the above-mentioned shape. For example, the retaining frame 61 may also be provided with the same number of openings 611 as the openings 51 of the retaining plate 50, and the plurality of openings 611 of the retaining frame 61 respectively correspond to the plurality of openings 51 of the retaining plate 50. Alternatively, for example, instead of the above-mentioned frame-shaped component, the retaining frame 61 may also be constructed as a pair of components that only retain the short sides of the retaining plate 50 that are opposite to each other.

This type of holding frame 61 can detachably hold the holding plate 50. Therefore, as the type of the device to be tested 200 changes, in addition to the above-mentioned holding block 40, by changing the holding plate 50 suitable for the device to be tested 200 after the type change, it is easy to correspond to the type change of the device to be tested 200.

Regarding the retaining block 40, for example, it is changed to a retaining block 40 having a retaining surface (upper surface 411 of the thermal head 41), the size of which corresponds to the size of the device to be tested 200 after the type change. In addition, regarding the retaining plate 50, for example, it is changed to a retaining plate 50 having an opening 51, and the opening 51 corresponds to the pitch or arrangement of the probe head 17 used to test the device to be tested 200 after the type change.

The moving device 62 includes a supporting member 63, a Z-direction track 64, and an actuator 65. Although not specifically illustrated, for example, the supporting member 63 is fixed to the lower base 22 of the processor 20. Moreover, as described below, such a supporting member 63 can also move horizontally relative to the lower base 22.

This support member 63 supports the holding frame 61 via the Z-direction track 64. The holding frame 61 can slide in the up and down direction (Z-axis direction in the figure) via the Z-direction track 64. This holding frame 61 is driven by an actuator 65. As an example of an embodiment of this actuator 65, although not particularly limited, for example, an electric motor including a ball screw mechanism can be exemplified.

An opening 631 may also be formed in this support member 63. Like the opening 611 of the retaining frame 61, this opening 631 has an inner diameter that includes all openings 51 of the retaining plate 50 in a planar view. When the retaining frame 61 is retained on the support member 63, this opening 631 is configured to face the opening 611 of the retaining frame 61.

As shown in Figures 1 and 2, the alignment unit 70 includes an abutment block 71 and a moving device 72. Such an alignment unit 70 is equivalent to an example of a "positioning device" in the form of the present invention. The abutment block 71 is equivalent to an example of an "abutment body" in the form of the present invention. The moving device 72 is equivalent to an example of a "third moving device" in the form of the present invention.

The abutment block 71 is an abutment component that abuts against the retaining block 40 of the contact unit 30. Such abutment block 71 may also include a rotation drive portion 711 (refer to FIG. 3 ) that rotates the retaining block 40 around the Z axis. Moreover, in the present embodiment, although such abutment block 71 contacts the bottom surface of the lower side portion 442 of the body portion 44 of the retaining block 40, it is not particularly limited thereto, and the abutment block 71 may also contact the flange 441 of the body portion 44. In addition, the abutment block 71 may also include an adsorption and holding mechanism for adsorbing and holding the retaining block 40 that contacts the abutment block 71.

The moving device 72 is a device for moving the abutment block 71. The moving device 72 includes an X-direction track 721, an X-direction platform 722, a Y-direction track 723, a Y-direction platform 724, a Z-direction track 725, and a Z-direction actuator 726. The X-direction track 721 and the X-direction platform 722 are equivalent to an example of a "second parallel moving part" in the present invention.

The X-direction track 721 is disposed on the base 22 below the processor 20 and extends along the X-direction. The X-direction platform 722 can be slidably held on the X-direction track 721 and can be moved along the X-direction by an actuator (not shown). In this embodiment, the X-direction track 721 is disposed in a range including all retaining blocks 40 retained on the retaining plate 50 in a plane view. The moving device 72 has a range of motion that allows the abutment block 71 to face all retaining blocks 40.

The Y-direction track 723 is disposed on the X-direction platform 722 and extends along the Y-direction. The Y-direction platform 724 can be slidably held on the Y-direction track 723 and can be moved along the Y-direction by an actuator (not shown).

The Z-direction track 725 is provided on the Y-direction platform 724 and extends along the Z-direction. The abutment block 71 can be slidably held on the Z-direction track 725 and can be moved in the Z-direction by the Z-direction actuator 726. As a specific example of the Z-direction actuator 726, although not particularly limited, for example, an electric motor including a ball screw mechanism can be exemplified. As a result, the moving device 72 can move the abutment block 71 in the XYZ directions.

In addition, in this embodiment, as shown in FIG. 2, the support component 73 is disposed on the Y-direction platform 724, and the camera unit 80 and the sensor unit 90 are supported on the upper end of the support component 73. The support component 73 is disposed at the end of the Y-direction platform 724, and when the abutment block 71 is located directly below the retaining block 40, the camera unit 80 and the sensor unit 90 can be avoided from between the probe head 17 and the retaining block 40.

As shown in Figure 4 (a) and Figure 4 (b), the camera unit 80 includes a first camera 81, a second camera 82, a prism 83, a prism 84, and a supporting component 85.

The prism 83 is supported on the support member 85 so as to be located on the optical axis _OA1 of the first camera 81. The first camera 81 photographs the probe head 17 of the probe card 15 in the processor 20 through the prism 83. The first camera 81 is connected to the control device 100 described below, and can transmit the image information of the probe head 17 photographed to the control device 100.

The prism 84 is also supported on the support member 85 so that it is located on the optical axis _OA2 of the second camera 82. The second camera 82 photographs the device under test 200 held in the holding block 40 through the prism 84. The second camera 82 is also connected to the control device 100 described below, and can transmit the photographed image information of the device under test 200 to the control device 100.

As shown in Figure 4 (a) and Figure 4 (c), the sensor unit 90 includes a first sensor 91, a second sensor 92, a prism 93, a prism 94, and a supporting component 95.

The first sensor 91 is a sensor that detects the height of a predetermined position of the probe head 17 of the probe card 15 in the processor 20. As a specific example of such a first sensor 91, although not particularly limited, for example, a laser displacement meter can be exemplified.

The prism 93 is supported on the support member 95 so as to be located on the optical axis _OA3 of the first sensor 91. The first sensor 91 detects the height of the predetermined position of the probe head 17 through the prism 93. The first sensor 91 is connected to the control device 100 described below, and can transmit the detected height of the predetermined position of the probe head 17 to the control device 100.

Here, as a specific example of the predetermined position of the probe head 17 detected by the first sensor 91, the four corners of the probe head 17 can be illustrated. Furthermore, if the predetermined position of the probe head 17 is three or more mutually different positions in the probe head 17, it is not particularly limited to the above positions.

The second sensor 92 is a sensor that detects the height of the predetermined position of the device to be tested 200 held in the holding block 40. Although not specifically limited, as a specific example of such a second sensor 92, it can be exemplified as a laser displacement meter, similar to the first sensor 91 mentioned above.

The prism 94 is supported on the support member 95 so as to be located on the optical axis OA ₄ of the second sensor 92. The second sensor 92 detects the height of the predetermined position of the device under test 200 through the prism 94. Similar to the first sensor 91 described above, the second sensor 92 is also connected to the control device 100 described below, and can transmit the detected height of the predetermined position of the device under test 200 to the control device 100.

Here, as a specific example of the predetermined position of the device under test 200 detected by the second sensor 92, the four corners of the device under test 200 can be illustrated. Moreover, if the predetermined position of the device under test 200 is three or more mutually different positions in the device under test 200, it is not particularly limited to the above positions.

In this embodiment, the camera unit 80 and the sensor unit 90 are fixed to the moving device 72 of the alignment unit 70 through the support member 73, so that the camera unit 80 and the sensor unit 90 can be moved in the XY direction by the moving device 72. In other words, in this embodiment, the moving device 72 of the alignment unit 70 can be used as the moving device of the camera unit 80 and the sensor unit 90.

Therefore, this moving device 72 is equivalent to an example of the "third moving device" in the present invention, and is also equivalent to an example of the "second moving device" in the present invention. In addition, the X-direction track 721 and the X-direction platform 722 of the moving device 72 are equivalent to an example of the "second parallel moving part" in the present invention, and are also equivalent to an example of the "first parallel moving part" in the present invention.

Furthermore, although not specifically illustrated, the moving device of the moving camera unit 80 and the moving device of the sensor unit 90 may also be another moving device independent of the moving device 72 of the alignment unit 70. In this case, the moving device of the moving camera unit 80 may also be independent of the moving device of the moving sensor unit 90.

For example, the control device 100 is composed of a computer including a processor. As shown in FIG. 5 , the control device 100 functionally includes an image processing unit 110, a first calculation unit 120, a second calculation unit 130, a third calculation unit 140, and a drive control unit 150. These functions 110 to 150 are implemented by the processor executing software installed on the above-mentioned computer constituting the control device 100. In addition, such a control device 100 can also be composed of a circuit substrate to replace the computer.

The image processing unit 110 detects the position and posture of the contactor 18 (see Figures 1 and 2) of the probe head 17 by performing image processing on the image information output from the first camera 81. In addition, the image processing unit 110 detects the position and posture of the terminal 210 (see Figure 3) of the device to be tested 200 by performing image processing on the image information output from the second camera 82. The image processing unit 110 and the first camera 81 and the second camera 82 are equivalent to an example of a "position detection device" in the form of the present invention.

The first calculation unit 120 calculates the position correction amount of the device under test 200 relative to the probe head 17 based on the detection result of the image processing unit 110.

Specifically, the first calculation unit 120 calculates the displacement of the terminal 210 of the device under test 200 relative to the position of the contactor 18 of the probe head 17 from the detection result of the image processing unit 110, and calculates the position correction amount to offset the displacement. In other words, the first calculation unit 120 calculates the position correction amount from the detection result of the image processing unit 110 so that the position of the contactor 18 of the probe head 17 is relatively consistent with the position of the terminal 210 of the device under test 200.

The second calculation unit 130 detects the parallelism of the device under test 200 relative to the probe head 17 based on the detection results of the first sensor 91 and the second sensor 92. This second calculation unit 130 is equivalent to an example of a "calculation unit" in the type of the present invention.

Specifically, the second calculation unit 130 first obtains the height of the predetermined position of the probe head 17 from the first sensor 91, and calculates the tilt of the probe head 17 from the height of the predetermined position of the probe head 17. In addition, the second calculation unit 130 obtains the height of the predetermined position of the device to be tested 200 from the second sensor 92, and calculates the tilt of the device to be tested 200 from the height of the predetermined position of the device to be tested 200. Then, the second calculation unit 130 calculates the relative tilt (parallelism) of the device to be tested 200 relative to the probe head 17 from the tilt of the probe head 17 and the tilt of the device to be tested 200, and further calculates the tilt compensation amount of the device to be tested 200 to offset the relative tilt.

The third calculation unit 140 detects the height of the device under test 200 relative to the probe head 17 based on the detection results of the first sensor 91 and the second sensor 92.

Specifically, the third calculation unit 140 first obtains the height of the predetermined position of the probe head 17 from the first sensor 91. In addition, after the parallelism adjustment device 42 corrects the tilt of the device to be tested 200 based on the above tilt compensation amount, the third calculation unit 140 obtains the height of the predetermined position of the device to be tested 200 from the second sensor 92. Then, the third calculation unit 140 calculates the relative height of the device to be tested 200 relative to the probe head 17 from the height of the predetermined position of the probe head 17 and the height of the predetermined position of the device to be tested 200. Then, the third calculation unit 140 calculates the difference between this relative height and the predetermined value, and calculates the height compensation amount of the device to be tested 200 to offset this difference.

The drive control unit 150 controls the driving of the parallelism adjustment device 42, the height adjustment device 43, the pressing device 60 and the alignment unit 70 of the contact unit 30.

For example, the drive control unit 150 controls the drive of the alignment unit 70 based on the position compensation amount calculated by the first calculation unit 120. In addition, the drive control unit 150 controls the drive of the parallelism adjustment device 42 based on the tilt compensation amount calculated by the second calculation unit 130. In addition, the drive control unit 150 controls the drive of the height adjustment device 43 based on the height compensation amount calculated by the third calculation unit 140. Further, the drive control unit 150 controls the drive of the pressing device 60 to press the device under test 200 to the probe head 17.

This drive control unit 150 is equivalent to an example of a "first control device" and a "third control device" in the present invention. In addition, this drive control unit 150 and the third calculation unit 140 are equivalent to an example of a "second control device" in the present invention.

In the following, the operation of positioning the device to be tested 200 by the electronic component testing device 1 in this embodiment is described with reference to FIG. 6 and FIG. 7 (a) to FIG. 14 (b). FIG. 6 is a schematic flow chart of the method of positioning by the electronic component testing device 1 in an embodiment of the present invention. FIG. 7 (a) to FIG. 14 (b) are each schematic cross-sectional views of the operation of the electronic component testing device 1 in an embodiment of the present invention.

First, in step S10 of FIG. 6, as shown in FIG. 7(b), the Y-direction platform 724 of the moving device 72 of the alignment unit 70 is moved in the -Y direction to place the camera unit 80 and the sensor unit 90 between the probe head 17 and the retaining block 40. Then, as shown in FIG. 7(a), the moving device 72 moves the abutment block 71 in the +X direction to the retaining block 40 on the right side of the figure.

During the movement in the +X direction, the second camera 82 takes pictures of the device to be tested 200 held in the holding block 40. Then, the image processing unit 110 of the control device 100 processes the image information output from the second camera 82 to detect the position of the terminal 210 of the device to be tested 200. At the beginning of a batch or when the probe card 15 is replaced, the first camera 81 is used to pre-detect the position of the contactor 18 of the probe head 17. The first calculation unit 120 of the control device 100 calculates the position correction amount of the device to be tested 200 from these detection results. The position correction amount of all the devices to be tested 200 held in the four holding blocks 40 is calculated.

In addition, during the movement process in the +X direction, the Y-direction platform 724 of the moving device 72 is appropriately moved in the Y direction, and the height of the four corners of the device to be tested 200 is detected by the second sensor 92. At the beginning of a batch or when the probe card 15 is changed, the height of the four corners of the probe head 17 is pre-detected by the first sensor 91. The second calculation unit 130 of the control device 100 calculates the tilt correction amount of the device to be tested 200 from these detection results. The tilt correction amount of all the devices to be tested 200 held in the four holding blocks 40 is calculated. In addition, when the second calculation unit 130 calculates the tilt correction amount of the device to be tested 200, the position correction amount calculated in the above step S10 can also be taken into consideration.

Furthermore, if the height of the four corners of the device under test 200 is detected by the second sensor 92 before step S50, it is not particularly limited to the above-mentioned execution timing. For example, after step S40 in Figure 6, the height of the four corners of the device under test 200 can also be detected by the second sensor 92.

Then, in step S20 of FIG. 6, as shown in FIG. 8 (b), the Y-direction platform 724 of the moving device 72 is moved in the +Y direction to avoid the camera unit 80 and the sensor unit 90 from between the probe head 17 and the retaining block 40, and at the same time, the abutment block 71 faces the retaining block 40.

Next, as shown in FIG. 8 (a) and FIG. 8 (b), the moving device 72 lifts the abutment block 71. Thereby, the abutment block 71 contacts the retaining block 40, and the abutment block 71 further pushes up the retaining block 40, so that the retaining block 40 is separated from the retaining plate 50.

Then, in step S30 of FIG. 6, the moving device 72 of the alignment unit 70 moves the abutment block 71 in the XY plane direction by the above position compensation amount to offset the relative position displacement of the device under test 200 relative to the probe head 17. For example, in the example shown in FIG. 9, the moving device 72 moves the abutment block 71 a small amount in the -X direction, so that the retaining block 40 retained on the abutment block 71 moves relative to the retaining plate 50.

Then, in step S40 of FIG. 6, as shown in FIG. 10(a) and FIG. 10(b), the moving device 72 lowers the abutment block 71. Thereby, the retaining block 40 is retained on the retaining plate 50, and the abutment block 71 is separated from the retaining block 40.

Then, in step S50 of FIG. 6, as shown in FIG. 11 (a) and FIG. 11 (b), the parallelism adjustment device 42 of the holding block 40 is driven to tilt the device to be tested 200 according to the above tilt compensation amount. In this way, the relative tilt of the device to be tested 200 relative to the probe head 17 is offset, so that the device to be tested 200 becomes parallel to the probe head 17.

Then, in step S60 of FIG. 6, as shown in FIG. 12 (b), the Y-direction platform 724 of the moving device 72 of the alignment unit 70 is moved in the -Y direction. Then, the camera unit 80 and the sensor unit 90 are again placed between the probe head 17 and the retaining block 40, and the height of the four corners of the device to be tested 200 is detected by the second sensor 92. As described above, at the beginning of a batch or when the probe card 15 is replaced, the height of the four corners of the probe head 17 is pre-detected by the first sensor 91. The second calculation unit 130 of the control device 100 calculates the height correction amount of the device to be tested 200 from these detection results.

Here, in this embodiment, because the position of the device under test 200 detected by the second sensor 92 in this step S60 is the same as the position of the device under test 200 detected by the second sensor 92 in the above step S10, the detection result of the second sensor 92 in step S60 can also be used to confirm whether the relative tilt of the device under test 200 relative to the probe head 17 is appropriately offset.

Furthermore, the position of the device to be tested 200 detected by the second sensor 92 in this step S60 may be different from the position of the device to be tested 200 detected by the second sensor 92 in the above step S10. For example, in the above step S10, the height of the four corners of the device to be tested 200 may be detected by the second sensor 92, while in this step S60, the second sensor 92 may only detect the height of the central part of the device to be tested 200. In this case, at the beginning of a batch or when the probe card 15 is changed, in addition to the height of the four corners of the probe head 17, the height of the central part of the probe head 17 is also pre-detected by the first sensor 91.

Next, as shown in FIG. 12 (a) and FIG. 12 (b), the height adjustment device 43 of the holding block 40 is driven according to the height compensation amount to adjust the height of the device under test 200 and offset the displacement of the device under test 200 in the height direction caused by the parallelism adjustment of the device under test 200 in the above step S50.

Then, in step S70 of FIG. 6, the control device 100 determines whether the positioning of all the devices to be tested 200 is completed.

If the positioning of all the devices under test 200 is not completed (No in step S70), return to step S10. As shown in Figures 13(a) and 13(b), the moving device 72 of the alignment unit 70 moves the abutment block 71 to the holding block 40 that holds the next device under test 200 (for example, the second holding block from the right in the figure). Then, the positioning of the next device under test 200 is performed in the same manner as the above steps S20 to S60.

In contrast, when the positioning of all the devices under test 200 has been completed (Yes in step S70), in step S80 of Figure 6, as shown in Figures 14(a) and 14(b), the moving device 62 of the pressing device 60 lifts the holding frame 61 and presses the device under test 200 to the probe head 17. Thereby, the terminal 210 of the device under test 200 is electrically connected to the contactor 18 of the probe head 17. In this state, the test piece 10 tests the electrical characteristics of the device under test 200.

As described above, in this embodiment, since the alignment unit 70 is independent of the retaining block 40, by changing the retaining block 40 and the retaining plate 50, it is easy to correspond to the type change of the device under test 200.

In addition, in this embodiment, since a plurality of retaining blocks 40 are respectively retained on the retaining plate 50, and a plurality of devices to be tested 200 are retained on the same retaining surface, a structure that can adjust the temperature or parallelism of a plurality of devices to be tested 200 separately can be adopted.

In addition, in this embodiment, because the holding block 40 of the contact unit 30 includes a parallelism adjustment device 42, the relative tilt of the device under test 200 relative to the probe head 17 can be offset, and the contact error between the probe head 17 and the device under test 200 can be suppressed. In particular, in a 2.5D device intermediate or a 3D device intermediate having a stacked structure, the above-mentioned effect of suppressing the contact error is significant.

In addition, in this embodiment, since the holding block 40 of the contact unit 30 includes a height adjustment device 43, the displacement of the device to be tested 200 in the height direction caused by adjusting the parallelism of the device to be tested 200 by the parallelism adjustment device 42 can be offset, and the contact error between the probe head 17 and the device to be tested 200 can be further suppressed.

Furthermore, the embodiments described above are intended to facilitate the understanding of the present invention, rather than to limit the present invention. Therefore, the components disclosed in the above embodiments are intended to include all design changes or equivalents belonging to the technical field of the present invention.

For example, the processor 20 may also include two contact units 30, and the support components 63 of the pressing devices 60 of the contact units 30 may also be supported on the lower base 22 in a horizontally movable manner. Thus, when one of the contact units 30 performs a test on the device under test 200, the other contact unit 30 may perform a positioning operation on the device under test 200, thereby improving the efficiency of the test process.

1: Electronic component testing equipment

10: Test piece

11: Main frame

12: Test head

15: Probe card

16: Circuit board

17: Probe head

18: Contactor

19: Shell

20: Processor

21: Upper base

22: Lower base

30: Contact unit

40: Keep block

41: Thermal head

42: Parallelism adjustment device

43: Height adjustment device

44: Main body

50: Holding board

51: Open mouth

60: Pressing device

61: Keep the frame

62: Mobile device

63: Support components

64:Z direction track

65:Actuator

70: Alignment unit

71: Butt block

72: Mobile device

200: Device under test

211: Open mouth

611: Open your mouth

631: Open mouth

721:X direction track

722: X-direction platform

723:Y direction track

724:Y direction platform

725:Z direction track

726:Z-direction actuator

II-II: Line segment

Part III:

Claims (16)

An electronic component processing device moves a device to be tested to a contact portion, comprising: A plurality of holding bodies, each configured to correspond to the contact portion and each holding the device to be tested; A holding plate, having a plurality of first openings, each of which is inserted into the first openings and holds the holding bodies in a floating manner; A positioning device, which is independently provided with the holding bodies, and determines the position of the device to be tested relative to the contact portion by moving the holding bodies relative to the holding plate; and A pressing device, which presses the device to be tested against the contact portion by moving the holding plate holding the holding bodies relative to the contact portion; wherein the positioning device moves the holding bodies in a planar direction relative to the holding plate after abutting against the holding bodies. The electronic component processing device of claim 1, wherein the pressing device comprises: a holding frame that detachably holds the holding plate; and a first moving device that moves the holding frame that holds the holding plate. As in claim 1, the electronic component processing device, wherein the retaining bodies respectively include parallelism adjustment devices to adjust the parallelism of the device to be tested relative to the contact portion. The electronic component processing device of claim 3, wherein the parallelism adjustment device comprises: A first adjustment part, which tilts the device to be tested with the first axis as the center; and A second adjustment part, which tilts the device to be tested with the second axis as the center; wherein the first axis is an axis parallel to the planar direction of the contact portion; wherein the second axis is parallel to the planar direction of the contact portion, and when the second axis is projected in the normal direction of the contact portion, the second axis is an axis orthogonal to the first axis. The electronic component processing device of claim 3 further includes: a parallelism detection device for detecting the parallelism of the device to be tested relative to the contact portion; and a first control device for controlling the parallelism adjustment device based on the parallelism detected by the parallelism detection device. The electronic component processing device of claim 5, wherein the parallelism detection device comprises: a first sensor for detecting the height of a predetermined position in the device to be tested; a second sensor for detecting the height of a predetermined position in the contact portion; and a calculation portion for calculating the parallelism of the device to be tested relative to the contact portion based on the detection results of the first sensor and the second sensor. The electronic component processing device of claim 6 further includes: A second moving device for moving the first sensor and the second sensor; Wherein the second moving device includes: A first parallel moving portion for moving the first sensor and the second sensor in a direction parallel to the arrangement direction of the holding bodies; Wherein the first parallel moving portion has a range of motion that allows the first sensor and the second sensor to face the holding bodies. As in claim 3, the electronic component processing device, wherein the retaining bodies respectively include height adjustment devices for adjusting the height of the device to be tested relative to the contact portion. As in claim 6, the electronic component processing device, wherein the retaining bodies respectively include height adjustment devices for adjusting the height of the device to be tested relative to the contact portion; The electronic component processing device further includes: A second control device for controlling the height adjustment devices based on the detection results of the first sensor and the second sensor. As in claim 1, the electronic component processing device, wherein the retaining bodies respectively include heat exchangers for performing heat exchange with the device to be tested. As in claim 10, the electronic component processing device, wherein the retaining bodies respectively include parallelism adjustment devices for adjusting the parallelism of the device to be tested relative to the contact portion; wherein the heat exchanger contacts and holds the device to be tested; wherein the parallelism adjustment device adjusts the parallelism of the device to be tested through the heat exchanger. The electronic component processing device of claim 1, wherein the positioning device comprises: an abutting body abutting the holding bodies; and a third moving device moving the abutting body; wherein the third moving device comprises a second parallel moving part moving the abutting body in a direction parallel to the arrangement direction of the holding bodies; wherein the second parallel moving part has a range of motion that allows the abutting body to face the holding bodies. The electronic component processing device of claim 1 further includes: a position detection device for detecting the relative position of the device to be tested relative to the contact portion; and a third control device for controlling the positioning device based on the relative position detected by the position detection device. An electronic component processing device as claimed in claim 13, wherein the third control device controls the positioning device to determine the sequential positions of the plurality of devices to be tested, each of which is held on the holding bodies, relative to the contact portion. An electronic component processing device as claimed in claim 1, wherein the device under test comprises: a bare die unit; a 2.5D component intermediate, which is configured with a plurality of bare dies arranged side by side on a silicon medium; or a 3D component intermediate, which is formed by a plurality of bare dies stacked on top of each other. An electronic component testing device for testing the electrical characteristics of a device under test, comprising: an electronic component processing device as in any one of claim 1 to claim 15; and a test piece electrically connected to the contact portion.