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TWI872401B - Film bonding module and semiconductor strip sawing and sorting equipment including the same - Google Patents

Film bonding module and semiconductor strip sawing and sorting equipment including the same Download PDF

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Publication number
TWI872401B
TWI872401B TW111146442A TW111146442A TWI872401B TW I872401 B TWI872401 B TW I872401B TW 111146442 A TW111146442 A TW 111146442A TW 111146442 A TW111146442 A TW 111146442A TW I872401 B TWI872401 B TW I872401B
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release film
tray
film
module
lifting
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TW111146442A
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Chinese (zh)
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TW202324575A (en
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金鎭洙
李在卿
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韓商细美事有限公司
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Publication of TWI872401B publication Critical patent/TWI872401B/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Intermediate Stations On Conveyors (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

Embodiments of the present invention provide a film combining module for combining and separating a release film to which a semiconductor package is attached to a fixture tray, and semiconductor strip sawing and sorting equipment including the same. The semiconductor strip sawing and sorting equipment according to the present invention includes: a loading unit for supplying semiconductor strips; a sawing unit for sawing the semiconductor strips supplied from the loading unit and individualizing them into a plurality of semiconductor packages; a sorting unit that inspects and classifies the semiconductor packages according to the inspection results and adheres them to the release film; and a film combining module, installed adjacent to the sorting unit, that combines the fixture tray and the release film, supplies them to the sorting unit, and separates the fixture tray and the release film collected from the sorting unit.

Description

膜結合模組以及包括其的半導體條帶切割以及分類裝備Film bonding module and semiconductor strip cutting and sorting equipment including the same

本發明係關於一種用於將離型膜和夾具托盤進行結合以及分離的膜結合模組以及包括其的半導體條帶切割以及分類裝備。The present invention relates to a film bonding module for bonding and separating a release film and a clamp tray, and a semiconductor strip cutting and sorting device comprising the same.

半導體製造過程作為用於在晶圓上製造半導體元件的過程，例如包括曝光、蒸鍍、蝕刻、離子注入、清洗等。半導體條帶切割以及分類裝備將配置有複數個封裝體的條帶以封裝體單位進行切割而單個化，通過針對各封裝體的清洗、乾燥、檢查來區分正常或者不良狀態，從而分別分類並裝載於最終的收納容器即托盤。The semiconductor manufacturing process is a process for manufacturing semiconductor components on a wafer, including exposure, evaporation, etching, ion implantation, cleaning, etc. Semiconductor strip cutting and sorting equipment cuts a strip with multiple packages into individual packages, and separates the normal or defective states by cleaning, drying, and inspecting each package, and then sorts and loads them into the final storage container, i.e., tray.

另一方面，最近為了防止在電子裝置中的晶片受到外部的電磁波的影響，正在應用將阻斷電磁波的物質塗布於半導體封裝體的外觀的EMI（Electromagnetic Interference；電磁干擾）屏蔽過程。針對通過切削單個化的半導體封裝體執行EMI屏蔽過程。在EMI屏蔽處理過程中，由於需要電接觸的面（例：球面）不能沾上塗布物質，因此各半導體封裝體以附著於粘合用離型膜的狀態輸送至處理EMI屏蔽過程的設備。需要一種用於在EMI屏蔽過程之前在半導體條帶切割以及分類裝備中將各半導體封裝體附著於離型膜之後進行排出的方法。On the other hand, in order to prevent chips in electronic devices from being affected by external electromagnetic waves, an EMI (Electromagnetic Interference) shielding process is being applied in which a substance that blocks electromagnetic waves is applied to the surface of a semiconductor package. The EMI shielding process is performed on semiconductor packages that are singulated by cutting. In the EMI shielding process, since the surface that requires electrical contact (e.g., spherical surface) cannot be stained with the coating substance, each semiconductor package is transported to the equipment for processing the EMI shielding process in a state of being attached to an adhesive release film. A method is required for attaching each semiconductor package to a release film in a semiconductor strip cutting and sorting equipment before the EMI shielding process and then discharging it.

本發明的實施例提供一種用於將附著半導體封裝體的離型膜與夾具托盤進行結合以及分離的膜結合模組以及包括其的半導體條帶切割以及分類裝備。Embodiments of the present invention provide a film bonding module for bonding and separating a release film attached to a semiconductor package body and a clamp tray, and a semiconductor strip cutting and sorting equipment including the same.

本發明的解決課題不限於以上提及的解決課題，本領域技術人員可以從下面的記載明確地理解未提及的其它解決課題。The problems to be solved by the present invention are not limited to the problems to be solved mentioned above, and those skilled in the art can clearly understand other problems to be solved that are not mentioned from the following description.

根據本發明的半導體條帶切割以及分類裝備包括：裝載單元，供應半導體條帶；切割單元，切割從該裝載單元供應的該半導體條帶而將該半導體條帶單個化為複數個半導體封裝體；分類單元，檢查單個化的該等半導體封裝體，並根據檢查結果將該等半導體封裝體分類而粘合於離型膜；以及膜結合模組，與該分類單元相鄰設置，並將夾具托盤和該離型膜結合而供應於該分類單元，並且分離從該分類單元回收的該夾具托盤和該離型膜。The semiconductor strip cutting and sorting equipment according to the present invention includes: a loading unit, which supplies semiconductor strips; a cutting unit, which cuts the semiconductor strips supplied from the loading unit and singulates the semiconductor strips into a plurality of semiconductor packages; a sorting unit, which inspects the singulated semiconductor packages and classifies the semiconductor packages according to the inspection results and bonds them to release films; and a film bonding module, which is arranged adjacent to the sorting unit and combines a clamp tray and the release film and supplies them to the sorting unit, and separates the clamp tray and the release film recovered from the sorting unit.

根據本發明的實施例，可以是，該膜結合模組收取裝載有該離型膜的料盒，從而將該離型膜結合於該夾具托盤並供應於該分類單元，該膜結合模組從該夾具托盤分離粘合有該等半導體封裝體的該離型膜而裝載於該料盒，該膜結合模組排出裝載有粘合有該等半導體封裝體的該離型膜的該料盒。According to an embodiment of the present invention, the film bonding module may receive a material box loaded with the release film, thereby bonding the release film to the clamp tray and supplying it to the classification unit, the film bonding module separates the release film bonded with the semiconductor packages from the clamp tray and loads it into the material box, and the film bonding module discharges the material box loaded with the release film bonded with the semiconductor packages.

根據本發明的實施例，可以是，具有磁性的框架附著於該離型膜的外圍部，該框架和該夾具托盤構成為通過磁力結合。According to an embodiment of the present invention, a magnetic frame may be attached to the outer periphery of the release film, and the frame and the clamp tray may be combined by magnetic force.

根據本發明的實施例，可以是，該分類單元包括：晶片拾取器，沿著第一水平方向移動，並從托盤台拾取半導體封裝體，並根據檢查結果將該等半導體封裝體附著於該離型膜；托盤輸送部，沿著與該第一水平方向垂直的第二水平方向移動，並輸送結合有該離型膜的夾具托盤；托盤拾取器，在上方拾取該夾具托盤並輸送該夾具托盤；以及托盤裝載器，保管該夾具托盤。According to an embodiment of the present invention, the classification unit may include: a chip picker, which moves along a first horizontal direction, picks up semiconductor packages from a tray table, and attaches the semiconductor packages to the release film based on inspection results; a tray conveyor, which moves along a second horizontal direction perpendicular to the first horizontal direction, and conveys a fixture tray combined with the release film; a tray picker, which picks up the fixture tray from above and conveys the fixture tray; and a tray loader, which keeps the fixture tray.

根據本發明的實施例，可以是，該膜結合模組設置於該托盤拾取器的移動路徑。According to an embodiment of the present invention, the membrane bonding module may be arranged in the moving path of the tray picker.

根據本發明的實施例，可以是，該托盤拾取器將與附著有該等半導體封裝體的該離型膜結合的該夾具托盤從該托盤輸送部輸送到該托盤裝載器，該托盤拾取器在該膜結合模組中將其它夾具托盤從該膜結合模組輸送到該托盤輸送部，該托盤拾取器將該夾具托盤從該托盤裝載器輸送到該膜結合模組。According to an embodiment of the present invention, the tray picker may transport the fixture tray bonded to the release film to which the semiconductor packages are attached from the tray conveying section to the tray loader, the tray picker may transport other fixture trays from the film bonding module to the tray conveying section in the film bonding module, and the tray picker may transport the fixture tray from the tray loader to the film bonding module.

本發明的實施例提供一種設置於半導體條帶切割以及分類裝備的分類單元，並將夾具托盤和離型膜結合而供應於該分類單元，並且分離從該分類單元回收的該夾具托盤和該離型膜的膜結合模組。該膜結合模組包括：料盒裝載器模組，被投入容納該離型膜的料盒；膜搬動模組，從該料盒取出該離型膜並將該離型膜投入到該料盒；膜升降模組，通過以吸附該離型膜的狀態進行升降而使該離型膜和該夾具托盤附著或者分離；以及輸送器模組，搬送附著有該離型膜的該夾具托盤。An embodiment of the present invention provides a sorting unit provided in a semiconductor strip cutting and sorting device, and a film-binding module for combining a clamp tray and a release film and supplying them to the sorting unit, and for separating the clamp tray and the release film recovered from the sorting unit. The film-binding module includes: a material box loader module, into which a material box containing the release film is put; a film moving module, which takes out the release film from the material box and puts the release film into the material box; a film lifting module, which attaches or separates the release film and the clamp tray by lifting in a state of adsorbing the release film; and a conveyor module, which transports the clamp tray with the release film attached.

根據本發明的實施例，可以是，具有磁性的框架附著於該離型膜的外圍部，該框架和該夾具托盤構成為通過磁力結合。According to an embodiment of the present invention, a magnetic frame may be attached to the outer periphery of the release film, and the frame and the clamp tray may be combined by magnetic force.

根據本發明的實施例，可以是，該料盒裝載器模組包括：料盒裝載單元，投入以及排出容納該離型膜的料盒；料盒升降單元，夾持該料盒而使該料盒上升或者下降；以及推動器單元，從該料盒推出該離型膜。According to an embodiment of the present invention, the material box loader module may include: a material box loading unit for inputting and discharging a material box containing the release film; a material box lifting unit for clamping the material box to raise or lower the material box; and a pusher unit for pushing the release film out of the material box.

根據本發明的實施例，可以是，該膜搬動模組包括：膜導向單元，引導該離型膜的移動路徑；以及膜輸送單元，夾持該離型膜並使該離型膜沿著該移動路徑移動。According to an embodiment of the present invention, the film moving module may include: a film guide unit for guiding the moving path of the release film; and a film transport unit for clamping the release film and moving the release film along the moving path.

根據本發明的實施例，可以是，該膜導向單元包括：一對導軌部件，構成為能夠在彼此相反方向上移動。According to an embodiment of the present invention, the film guide unit may include: a pair of guide rail components, which are configured to be able to move in opposite directions to each other.

根據本發明的實施例，可以是，該一對導軌部件構成為：當沿著水平方向輸送該離型膜時，該一對導軌部件在彼此接近的方向上移動而引導該離型膜的移動，當該離型膜上升或者下降時，該一對導軌部件在彼此遠離的方向上移動而避免與該離型膜的干擾。According to an embodiment of the present invention, the pair of guide rail components may be configured such that when the release film is transported in a horizontal direction, the pair of guide rail components move in directions approaching each other to guide the movement of the release film, and when the release film rises or falls, the pair of guide rail components move in directions away from each other to avoid interference with the release film.

根據本發明的實施例，可以是，該膜輸送單元從該料盒夾持該離型膜並將該離型膜沿著該導軌部件輸送到膜升降區域，並且將附著有半導體封裝體的該離型膜從該膜升降區域輸送到該料盒。According to an embodiment of the present invention, the film transport unit may clamp the release film from the material box and transport the release film along the guide rail component to the film lifting area, and transport the release film with the semiconductor package attached thereto from the film lifting area to the material box.

根據本發明的實施例，可以是，該膜升降模組包括：升降主體，具有一定的面積並構成為在膜升降區域的下升降位置和上升降位置之間進行升降；以及複數個真空吸附單元，形成在該升降主體的上方。According to an embodiment of the present invention, the membrane lifting module may include: a lifting body having a certain area and configured to be lifted between a lower lifting position and an upper lifting position in the membrane lifting area; and a plurality of vacuum adsorption units formed above the lifting body.

根據本發明的實施例，可以是，該等真空吸附單元在該升降主體中設置於與形成於該夾具托盤的複數個貫通孔相對應的位置而構成為穿過該夾具托盤的該等貫通孔。According to an embodiment of the present invention, the vacuum adsorption units may be arranged in the lifting body at positions corresponding to the plurality of through holes formed on the clamp tray to form the through holes passing through the clamp tray.

根據本發明的實施例，可以是，若該離型膜位於該上升降位置，則該膜升降模組上升到該膜升降區域的該上升降位置而吸附該離型膜，並在吸附該離型膜的狀態下從該上升降位置下降到該下升降位置而使該離型膜和該夾具托盤結合。According to an embodiment of the present invention, if the release film is located at the upper lifting position, the film lifting module rises to the upper lifting position of the film lifting area to adsorb the release film, and descends from the upper lifting position to the lower lifting position while adsorbing the release film to combine the release film and the clamp tray.

根據本發明的實施例，可以是，若與附著有半導體封裝體的該離型膜結合的該夾具托盤位於該下升降位置，則該膜升降模組上升到該上升降位置而從該夾具托盤分離該離型膜，若該離型膜在該上升降位置定位，則該膜升降模組解除真空吸附並下降到該下升降位置。According to an embodiment of the present invention, if the clamp tray combined with the release film attached with the semiconductor package body is located at the lower lifting position, the film lifting module rises to the upper lifting position to separate the release film from the clamp tray; if the release film is positioned at the upper lifting position, the film lifting module releases the vacuum adsorption and descends to the lower lifting position.

根據本發明的實施例，可以是，該輸送器模組將附著有該離型膜的該夾具托盤從膜升降區域輸送到托盤拾取區域，並將與位於該托盤拾取區域的粘合有半導體封裝體的該離型膜結合的該夾具托盤輸送到該膜升降區域。According to an embodiment of the present invention, the conveyor module may transport the clamp tray with the release film attached thereto from the film lifting area to the tray picking area, and transport the clamp tray combined with the release film bonded with the semiconductor package body located in the tray picking area to the film lifting area.

根據本發明的實施例的半導體條帶切割以及分類裝備包括：裝載單元，用於供應半導體條帶；切割單元，切割從該裝載單元供應的該半導體條帶而將該半導體條帶單個化為複數個半導體封裝體；分類單元，檢查單個化的該等半導體封裝體，並根據檢查結果將該等半導體封裝體分類而粘合於離型膜；以及膜結合模組，能夠拆裝地設置於該分類單元，並將夾具托盤和該離型膜結合而供應於該分類單元，並且分離從該分類單元回收的該夾具托盤和該離型膜。According to an embodiment of the present invention, the semiconductor strip cutting and sorting equipment includes: a loading unit for supplying semiconductor strips; a cutting unit for cutting the semiconductor strips supplied from the loading unit to singulate the semiconductor strips into a plurality of semiconductor packages; a sorting unit for inspecting the singulated semiconductor packages and classifying the semiconductor packages according to the inspection results and bonding them to release films; and a film bonding module that can be detachably arranged in the sorting unit, and combines a clamp tray and the release film to supply the sorting unit, and separates the clamp tray and the release film recovered from the sorting unit.

該膜結合模組包括：料盒裝載器模組，被投入容納該離型膜的料盒；膜搬動模組，從該料盒取出該離型膜；膜升降模組，通過以吸附該離型膜的狀態進行升降而使該離型膜和該夾具托盤附著或者分離；以及輸送器模組，搬送附著有該離型膜的該夾具托盤。The film bonding module includes: a material box loader module, into which a material box containing the release film is placed; a film moving module, which takes out the release film from the material box; a film lifting module, which attaches or separates the release film and the clamp tray by lifting and lowering in a state of adsorbing the release film; and a conveyor module, which transports the clamp tray with the release film attached.

根據本發明的實施例，可以是，該分類單元包括：晶片拾取器，沿著第一水平方向移動，並從托盤台拾取半導體封裝體，並根據檢查結果將該等半導體封裝體附著於該離型膜；托盤輸送部，沿著導向部件移動，並輸送結合有該離型膜的夾具托盤，該導向部件沿著與該第一水平方向垂直的第二水平方向延伸；托盤拾取器，在上方拾取該夾具托盤並輸送該夾具托盤；以及托盤裝載器，保管該夾具托盤。According to an embodiment of the present invention, the classification unit may include: a chip picker, which moves along a first horizontal direction, picks up semiconductor packages from a tray table, and attaches the semiconductor packages to the release film based on inspection results; a tray conveyor, which moves along a guide component, and conveys a fixture tray combined with the release film, wherein the guide component extends along a second horizontal direction perpendicular to the first horizontal direction; a tray picker, which picks up the fixture tray from above and conveys the fixture tray; and a tray loader, which keeps the fixture tray.

根據本發明，通過構成為能夠將可以對離型膜和夾具托盤進行結合或者分離的膜結合模組拆裝於分類單元，從而在封裝體切割以及檢查之後且在EMI（Electromagnetic interference）屏蔽過程之前，能夠使將半導體封裝體附著於離型膜並排出離型膜的過程自動化。According to the present invention, by configuring a film bonding module that can bond or separate a release film and a clamp tray to be detachable from a classification unit, the process of attaching a semiconductor package to a release film and discharging the release film can be automated after the package is cut and inspected and before the EMI (Electromagnetic interference) shielding process.

本發明的效果不限於以上提及的效果，本領域技術人員可以從下面的記載明確地理解未提及的其它效果。The effects of the present invention are not limited to the above-mentioned effects, and those skilled in the art can clearly understand other effects not mentioned from the following description.

以下，參照圖式來詳細說明本發明的實施例，以使得本發明所屬技術領域中具有通常知識者可以容易地實施。本發明可以以各種不同的方式實現，不限於在此說明的實施例。Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings so that a person having ordinary knowledge in the technical field to which the present invention belongs can easily implement the present invention. The present invention can be implemented in various different ways, not limited to the embodiments described herein.

為了清楚地說明本發明，省略了與說明無關的部分，貫穿說明書整體對相同或者類似的構成要件標注相同的符號。In order to clearly illustrate the present invention, parts not related to the description are omitted, and the same or similar constituent elements are marked with the same symbols throughout the entire specification.

另外，在多個實施例中，對具有相同的構成的構成要件使用相同的符號來僅說明代表性實施例，在其餘的其它實施例中僅說明與代表性實施例不同的構成。In addition, in a plurality of embodiments, the same symbols are used for components having the same configuration to describe only a representative embodiment, and in the remaining embodiments, only the configuration different from the representative embodiment is described.

在說明書整體中，當表述某部分與其它部分“連接（或者結合）”時，其不僅是“直接連接（或者結合）”的情況，也包括將其它部件置於中間“間接連接（或者結合）”的情況。另外，當表述某部分“包括”某構成要件時，只要沒有特別相反的記載，其意指可以還包括其它構成要件而不是排除其它構成要件。Throughout the specification, when it is stated that a part is "connected (or coupled)" to other parts, it includes not only the case of "direct connection (or coupling)" but also the case of "indirect connection (or coupling)" with other parts placed in between. In addition, when it is stated that a part "includes" a certain constituent element, unless there is a special description to the contrary, it means that other constituent elements may also be included rather than excluded.

只要沒有不同地定義，包括技術或者科學術語在內在此使用的所有術語具有與本發明所屬技術領域中具有通常知識者一般所理解的含義相同的含義。在通常使用的詞典中定義的術語之類的術語應解釋為具有與相關技術脈絡上具有的含義一致的含義，只要在本申請中沒有明確定義，不會理想性或過度地解釋為形式性含義。Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as those generally understood by persons of ordinary skill in the art to which the present invention belongs. Terms such as terms defined in commonly used dictionaries should be interpreted as having meanings consistent with the meanings in the context of the relevant technology, and will not be ideally or excessively interpreted as formal meanings unless they are clearly defined in this application.

以下，針對在半導體條帶切割以及分類裝備1中在封裝體切割以及檢查之後且在EMI（Electromagnetic interference）屏蔽過程之前可以使將半導體封裝體SP附著於離型膜400並排出離型膜400的過程自動化的膜結合模組30進行說明。Hereinafter, a film bonding module 30 is described that can automate the process of attaching the semiconductor package SP to the release film 400 and discharging the release film 400 after the package cutting and inspection and before the EMI (Electromagnetic interference) shielding process in the semiconductor strip cutting and sorting equipment 1.

首先，針對可以適用本發明的半導體條帶切割以及分類裝備1的概要構成進行說明。First, the general structure of the semiconductor strip cutting and sorting equipment 1 to which the present invention can be applied is explained.

圖1示出了可以適用本發明的半導體條帶切割以及分類裝備1的概要構成。FIG. 1 shows a schematic structure of a semiconductor strip cutting and sorting apparatus 1 to which the present invention is applicable.

根據本發明的半導體條帶切割以及分類裝備1包括：裝載單元5，供應半導體條帶S；切割單元10，切割從裝載單元5供應的半導體條帶S而將半導體條帶S單個化為複數個半導體封裝體SP；分類單元20，檢查單個化的半導體封裝體SP，並根據檢查結果將半導體封裝體SP分類而粘合於離型膜400；膜結合模組30，與分類單元20相鄰設置，並將夾具托盤500和離型膜400結合而供應於分類單元20，並且分離從分類單元20回收的夾具托盤500和離型膜400。The semiconductor strip cutting and sorting equipment 1 according to the present invention includes: a loading unit 5, which supplies a semiconductor strip S; a cutting unit 10, which cuts the semiconductor strip S supplied from the loading unit 5 and singulates the semiconductor strip S into a plurality of semiconductor packages SP; a sorting unit 20, which inspects the singulated semiconductor packages SP, and classifies the semiconductor packages SP according to the inspection results and bonds them to the release film 400; a film bonding module 30, which is arranged adjacent to the sorting unit 20, and combines a clamp tray 500 and a release film 400 and supplies them to the sorting unit 20, and separates the clamp tray 500 and the release film 400 recovered from the sorting unit 20.

裝載單元5收取裝載有完成成型的狀態的PCB（Printed Circuit Board；印刷電路板）之類半導體條帶S的條帶料盒MZ1，並將半導體條帶S從條帶料盒MZ1供應到切割單元10。將半導體條帶S從由料盒裝載器102夾持的條帶料盒MZ1通過推動器（未示出）供應到切割單元10。The loading unit 5 receives a strip magazine MZ1 loaded with a semiconductor strip S such as a PCB (Printed Circuit Board) in a completed state, and supplies the semiconductor strip S from the strip magazine MZ1 to the cutting unit 10. The semiconductor strip S is supplied from the strip magazine MZ1 clamped by the magazine loader 102 to the cutting unit 10 through a pusher (not shown).

切割單元10執行針對半導體條帶S的切削過程，並將通過切削過程單個化的半導體封裝體SP提供到分類單元20。通過入口軌道104輸送的半導體條帶S通過條帶拾取器106被輸送到卡盤台108。條帶拾取器106可以沿著水平導向部件120移動。The cutting unit 10 performs a cutting process for the semiconductor strip S and provides the semiconductor package SP singulated by the cutting process to the sorting unit 20. The semiconductor strip S transported through the inlet rail 104 is transported to the chuck table 108 through the strip picker 106. The strip picker 106 can move along the horizontal guide member 120.

安放於卡盤台108的半導體條帶S在y方向上移動而被切削模組110切割。可以是，半導體條帶S被切削模組110切割而單個化的半導體封裝體SP通過單元拾取器112從卡盤台108輸送到緩衝台116。另一方面，半導體封裝體SP可以通過清洗單元114清洗。緩衝拾取器118可以從緩衝台116拾取半導體封裝體SP並將其輸送到翻轉台202或者輸送到托盤台204。The semiconductor strip S placed on the chuck table 108 moves in the y direction and is cut by the cutting module 110. The semiconductor strip S is cut by the cutting module 110, and the semiconductor package SP singulated therefrom is transported from the chuck table 108 to the buffer table 116 by the unit picker 112. On the other hand, the semiconductor package SP may be cleaned by the cleaning unit 114. The buffer picker 118 may pick up the semiconductor package SP from the buffer table 116 and transport it to the turning table 202 or to the tray table 204.

翻轉台202可以翻轉半導體封裝體SP並將其安放到托盤台204，從而使得球面朝向上方，可以通過用於球面檢查的球體視覺檢查部208執行球面檢查。另一方面，可以省略通過翻轉台202進行的翻轉以及球面檢查。The inversion table 202 can invert the semiconductor package SP and place it on the tray table 204 so that the spherical surface faces upward, and the spherical surface inspection can be performed by the spherical visual inspection unit 208 for spherical surface inspection. On the other hand, the inversion and spherical surface inspection by the inversion table 202 can be omitted.

另一方面，托盤台204能夠沿著工作台驅動部206在y方向上移動，托盤台204在y方向上移動，同時通過標記視覺檢查部210以及球體視覺檢查部208執行針對半導體封裝體SP的檢查。標記視覺檢查部210以及球體視覺檢查部208可以設置於上門架212。晶片拾取器218可以沿著水平導向部件216移動，並從托盤台204拾取半導體封裝體SP而輸送到用於後續過程的托盤。可以通過對準視覺檢查部214執行半導體封裝體SP的對準檢查。On the other hand, the tray table 204 can move in the y direction along the workbench driving part 206, and the tray table 204 moves in the y direction, and at the same time, performs inspection on the semiconductor package SP through the mark visual inspection part 210 and the spherical visual inspection part 208. The mark visual inspection part 210 and the spherical visual inspection part 208 can be set on the upper gantry 212. The wafer picker 218 can move along the horizontal guide part 216, and pick up the semiconductor package SP from the tray table 204 and transport it to the tray for the subsequent process. The alignment inspection of the semiconductor package SP can be performed by the alignment visual inspection part 214.

晶片拾取器218可以根據針對半導體封裝體SP的檢查結果來將半導體封裝體進行分類並將其裝載於托盤。裝載有半導體封裝體SP的托盤可以在托盤輸送部220中在水平方向（-y方向）上移動而被排出到外部。正常的半導體封裝體SP可以被輸送到良品托盤保管部228，非正常的半導體封裝體SP可以被輸送到重工托盤保管部230，並可以從托盤裝載器232供應托盤。The wafer picker 218 can classify the semiconductor packages according to the inspection results of the semiconductor packages SP and load them on the tray. The tray loaded with the semiconductor packages SP can be moved in the horizontal direction (-y direction) in the tray conveyor 220 and discharged to the outside. Normal semiconductor packages SP can be transported to the good product tray storage unit 228, and abnormal semiconductor packages SP can be transported to the rework tray storage unit 230, and the tray can be supplied from the tray loader 232.

另一方面，在本發明的情況下，為了針對半導體封裝體SP進行EMI屏蔽過程，半導體封裝體SP不以保管在托盤的狀態從良品托盤保管部228以及重工托盤保管部230排出，而以附著於離型膜400的狀態從膜結合模組30排出。在膜結合模組30中，離型膜400以結合於夾具托盤500的狀態供應，並通過托盤拾取器226被供應到托盤輸送部220。托盤拾取器226通過第一水平導向部件222和第二水平導向部件224在第一水平方向（x方向）以及第二水平方向（y方向）上移動的同時輸送夾具托盤500。On the other hand, in the case of the present invention, in order to perform the EMI shielding process for the semiconductor package SP, the semiconductor package SP is not discharged from the good product tray storage unit 228 and the rework tray storage unit 230 in a state of being stored on a tray, but discharged from the film bonding module 30 in a state of being attached to the release film 400. In the film bonding module 30, the release film 400 is supplied in a state of being bonded to the jig tray 500, and is supplied to the tray conveying unit 220 by the tray picker 226. The tray picker 226 conveys the jig tray 500 while moving in the first horizontal direction (x direction) and the second horizontal direction (y direction) through the first horizontal guide member 222 and the second horizontal guide member 224.

根據本發明，膜結合模組30收取裝載有離型膜400的料盒MZ而將離型膜400結合於夾具托盤500並供應到分類單元20，並從夾具托盤500分離粘合有半導體封裝體SP的離型膜400並將其裝載於料盒MZ，並且可以排出裝載有粘合有半導體封裝體SP的離型膜400的料盒MZ。According to the present invention, the film bonding module 30 receives the material box MZ loaded with the release film 400 and bonds the release film 400 to the clamp tray 500 and supplies it to the sorting unit 20, and separates the release film 400 bonded with the semiconductor package SP from the clamp tray 500 and loads it into the material box MZ, and can discharge the material box MZ loaded with the release film 400 bonded with the semiconductor package SP.

圖2A以及圖2B示出了根據本發明的離型膜400以及收納離型膜400的料盒MZ。圖2A示出了離型膜400結合於框架410的狀態，圖2B示出了離型膜400收納於料盒MZ的狀態。2A and 2B show a release film 400 according to the present invention and a magazine MZ storing the release film 400. FIG2A shows a state where the release film 400 is combined with a frame 410, and FIG2B shows a state where the release film 400 is stored in the magazine MZ.

根據本發明的實施例，可以是，具有磁性的框架410附著於離型膜400的外圍部，框架410和夾具托盤500構成為通過磁力結合。另外，離型膜400由於可以容易地變形，因此通過將框架410附著於外圍部，可以防止在離型膜400的處理過程中產生變形。附著有框架410的狀態的離型膜400可以以收納於料盒MZ的狀態被供應到膜結合模組30。According to an embodiment of the present invention, a magnetic frame 410 may be attached to the outer periphery of the release film 400, and the frame 410 and the clamp tray 500 may be combined by magnetic force. In addition, since the release film 400 can be easily deformed, by attaching the frame 410 to the outer periphery, deformation during the handling of the release film 400 can be prevented. The release film 400 with the frame 410 attached may be supplied to the film bonding module 30 in a state of being stored in the material box MZ.

圖3A以及圖3B示出了根據本發明的夾具托盤500以及附著有離型膜400的夾具托盤500。圖3A示出了沒有結合離型膜400的狀態的夾具托盤500，圖3B示出了結合有離型膜400的狀態的夾具托盤500。3A and 3B show a clamp tray 500 according to the present invention and a clamp tray 500 attached with a release film 400. FIG3A shows the clamp tray 500 without the release film 400, and FIG3B shows the clamp tray 500 with the release film 400 attached.

根據本發明的實施例，夾具托盤500可以包括以一定的形狀提供的托盤主體510、從托盤主體510引入並能夠插入離型膜400的托盤槽部520。在這裡，可以在托盤槽部520形成用於對夾具托盤500和離型膜400進行結合或者分離的複數個貫通孔530。另外，為了夾具托盤500的輸送，能夠與托盤拾取器226結合的夾持部515可以形成在托盤主體510的側壁。According to an embodiment of the present invention, the jig tray 500 may include a tray body 510 provided in a certain shape, and a tray groove portion 520 introduced from the tray body 510 and capable of inserting the release film 400. Here, a plurality of through holes 530 for combining or separating the jig tray 500 and the release film 400 may be formed in the tray groove portion 520. In addition, for the transportation of the jig tray 500, a clamping portion 515 capable of combining with the tray picker 226 may be formed on the side wall of the tray body 510.

圖4示出了在根據本發明的半導體條帶切割以及分類裝備1中膜結合模組30結合於分類單元20的過程。如圖4所示，膜結合模組30可以能夠拆裝地結合於半導體條帶切割以及分類裝備1。在半導體條帶切割以及分類裝備1的分類單元20的側壁可以形成能夠結合膜結合模組30的部位，膜結合模組30通過結合於相應部位，可以為了EMI屏蔽過程供應離型膜400並排出附著有半導體封裝體SP的離型膜400。FIG4 shows a process of bonding the film bonding module 30 to the classification unit 20 in the semiconductor strip cutting and classification device 1 according to the present invention. As shown in FIG4, the film bonding module 30 can be detachably bonded to the semiconductor strip cutting and classification device 1. A portion to which the film bonding module 30 can be bonded can be formed on the side wall of the classification unit 20 of the semiconductor strip cutting and classification device 1. By bonding the film bonding module 30 to the corresponding portion, the release film 400 can be supplied for the EMI shielding process and the release film 400 with the semiconductor package body SP attached can be discharged.

圖5示出了在根據本發明的半導體條帶切割以及分類裝備1中結合於分類單元20的膜結合模組30的概要結構。FIG. 5 shows a schematic structure of a film bonding module 30 coupled to a sorting unit 20 in the semiconductor strip cutting and sorting apparatus 1 according to the present invention.

如圖5所示，膜結合模組30結合於半導體條帶切割以及分類裝備1的分類單元20。As shown in FIG5 , the film bonding module 30 is bonded to the sorting unit 20 of the semiconductor strip cutting and sorting apparatus 1.

根據本發明的實施例，可以是，分類單元20包括：晶片拾取器218，沿著第一水平方向（x方向）移動，並從托盤台204拾取半導體封裝體SP，並且根據檢查結果將半導體封裝體SP附著於離型膜400；托盤輸送部220，沿著與第一水平方向（x方向）垂直的第二水平方向（y方向）移動，並輸送結合有離型膜400的夾具托盤500；托盤拾取器226，在上方拾取夾具托盤500並輸送夾具托盤500；以及托盤裝載器232，保管夾具托盤500。According to an embodiment of the present invention, the classification unit 20 may include: a chip picker 218, which moves along a first horizontal direction (x direction) and picks up a semiconductor package SP from a tray table 204, and attaches the semiconductor package SP to a release film 400 according to an inspection result; a tray conveying unit 220, which moves along a second horizontal direction (y direction) perpendicular to the first horizontal direction (x direction) and conveys a fixture tray 500 coupled with a release film 400; a tray picker 226, which picks up the fixture tray 500 from above and conveys the fixture tray 500; and a tray loader 232, which stores the fixture tray 500.

根據本發明的實施例，膜結合模組30可以設置於托盤拾取器226的移動路徑。According to an embodiment of the present invention, the film bonding module 30 can be arranged in the moving path of the tray picker 226.

當為了EMI屏蔽過程而將半導體封裝體SP附著於離型膜400時，通過托盤裝載器232供應夾具托盤500，托盤拾取器226從托盤裝載器232拾取夾具托盤500之後將其供應到膜結合模組30。良品托盤保管部228以及重工托盤保管部230可以用作用於臨時保管夾具托盤500的緩衝件。When the semiconductor package SP is attached to the release film 400 for the EMI shielding process, the jig tray 500 is supplied through the tray loader 232, and the tray picker 226 picks up the jig tray 500 from the tray loader 232 and supplies it to the film bonding module 30. The good tray storage unit 228 and the rework tray storage unit 230 can be used as a buffer for temporarily storing the jig tray 500.

在膜結合模組30中，若將離型膜400結合於夾具托盤500並將其提供到分類單元20，則托盤拾取器226拾取結合有離型膜400的夾具托盤500並將其設置於托盤輸送部220。In the film bonding module 30 , if the release film 400 is bonded to the clamp tray 500 and provided to the sorting unit 20 , the tray picker 226 picks up the clamp tray 500 bonded with the release film 400 and places it on the tray conveying part 220 .

托盤拾取器226可以將與附著有半導體封裝體SP的離型膜400結合的夾具托盤500從托盤輸送部220輸送到托盤裝載器232，在膜結合模組30中將其它夾具托盤500從膜結合模組30輸送到托盤輸送部220，並將夾具托盤500從托盤裝載器232輸送到膜結合模組30。The tray picker 226 can transport the clamp tray 500 combined with the release film 400 attached with the semiconductor package body SP from the tray conveying part 220 to the tray loader 232, transport other clamp trays 500 from the membrane bonding module 30 to the tray conveying part 220 in the membrane bonding module 30, and transport the clamp tray 500 from the tray loader 232 to the membrane bonding module 30.

複數個半導體封裝體SP通過晶片拾取器218附著於結合有離型膜400的夾具托盤500。若完成了半導體封裝體SP在離型膜400的附著，則夾具托盤500通過托盤輸送部220移動到膜結合模組30的周邊，托盤拾取器226拾取夾具托盤500並將其供應到膜結合模組30。A plurality of semiconductor packages SP are attached to the jig tray 500 bonded with the release film 400 by the wafer picker 218. When the semiconductor package SP is attached to the release film 400, the jig tray 500 is moved to the periphery of the film bonding module 30 by the tray conveyor 220, and the tray picker 226 picks up the jig tray 500 and supplies it to the film bonding module 30.

另一方面，托盤拾取器226可以通過第一水平導向部件222和第二水平導向部件224移動，可以通過升降驅動拾取並放置夾具托盤500。第二水平導向部件224可以構成為沿著第一水平導向部件222在x方向上移動。On the other hand, the tray picker 226 can move through the first horizontal guide member 222 and the second horizontal guide member 224, and can pick up and place the fixture tray 500 by lifting and driving. The second horizontal guide member 224 can be configured to move along the first horizontal guide member 222 in the x direction.

本發明的實施例提供膜結合模組30，其能夠拆裝於半導體條帶切割以及分類裝備1的分類單元20，並對夾具托盤500和離型膜400進行結合而供應於分類單元20，並且分離從分類單元20回收的夾具托盤500和離型膜400。An embodiment of the present invention provides a film bonding module 30, which can be detached from the classification unit 20 of the semiconductor strip cutting and classification equipment 1, and combines the clamp tray 500 and the release film 400 to supply them to the classification unit 20, and separates the clamp tray 500 and the release film 400 recovered from the classification unit 20.

膜結合模組30可以包括被投入容納離型膜400的料盒MZ的料盒裝載器模組310、從料盒MZ取出離型膜400並將離型膜400投入到料盒MZ的膜搬動模組320、通過以吸附離型膜400的狀態進行升降而使離型膜400和夾具托盤500附著或者分離的膜升降模組330以及搬送附著有離型膜400的夾具托盤500的輸送器模組340。The film bonding module 30 may include a material box loader module 310 into which a material box MZ containing a release film 400 is placed, a film moving module 320 that takes out the release film 400 from the material box MZ and places the release film 400 into the material box MZ, a film lifting module 330 that attaches or separates the release film 400 and the clamp tray 500 by lifting and lowering in a state of adsorbing the release film 400, and a conveyor module 340 that transports the clamp tray 500 to which the release film 400 is attached.

圖6示出了根據本發明的膜結合模組30的料盒裝載器模組310。裝載有離型膜400的料盒MZ可以通過搬送裝備（未示出）供應於料盒裝載器模組310，料盒裝載器模組310可以將所保管的料盒MZ依次提供到膜搬動模組320。6 shows a cartridge loader module 310 of the film bonding module 30 according to the present invention. The cartridge MZ loaded with the release film 400 can be supplied to the cartridge loader module 310 by a conveying device (not shown), and the cartridge loader module 310 can sequentially provide the stored cartridges MZ to the film moving module 320.

根據本發明的實施例，料盒裝載器模組310包括投入以及排出容納離型膜400的料盒MZ的料盒裝載單元312、夾持料盒MZ而使其上升或者下降的料盒升降單元314以及從料盒MZ推出離型膜400的推動器單元316。According to an embodiment of the present invention, the material box loader module 310 includes a material box loading unit 312 for inputting and discharging a material box MZ containing a release film 400, a material box lifting unit 314 for clamping the material box MZ to raise or lower it, and a pusher unit 316 for pushing the release film 400 out of the material box MZ.

收納有離型膜400的料盒MZ包括設置在底板311的上方的裝載板3121以及設置於裝載板的上方的卸載板3127，輸送器3123可以通過設置結構物3125設置於裝載板3121。位於裝載板3121的上方的料盒MZ通過輸送器3123在水平方向（-x方向）上移動而被輸送到料盒升降單元314。在卸載板3127中形成有切開部3127A，該切開部3127A用於使料盒升降單元314的上夾具3145A以及下夾具3145B穿過而避免干擾。The material box MZ containing the release film 400 includes a loading plate 3121 disposed above the bottom plate 311 and an unloading plate 3127 disposed above the loading plate, and a conveyor 3123 can be disposed on the loading plate 3121 by disposing a structure 3125. The material box MZ located above the loading plate 3121 is transported to the material box lifting unit 314 by moving in the horizontal direction (-x direction) by the conveyor 3123. A cutout 3127A is formed in the unloading plate 3127, and the cutout 3127A is used to allow the upper clamp 3145A and the lower clamp 3145B of the material box lifting unit 314 to pass through to avoid interference.

料盒升降單元314在夾持料盒MZ之後上升，以使得離型膜400被供應到膜搬動模組320。另外，料盒升降單元314可以將裝載有附著有半導體封裝體SP的離型膜400的料盒MZ輸送到料盒裝載器模組310的卸載板3127。The material box lifting unit 314 rises after clamping the material box MZ so that the release film 400 is supplied to the film moving module 320. In addition, the material box lifting unit 314 can transport the material box MZ loaded with the release film 400 attached with the semiconductor package body SP to the unloading plate 3127 of the material box loader module 310.

料盒升降單元314包括用於升降驅動的升降驅動部3141、通過升降驅動部3141上升或者下降的手持單元3143以及結合於手持單元3143而夾持料盒MZ的上部和下部的上夾具3145A和下夾具3145B。為了夾持料盒MZ，上夾具3145A可以相對於下夾具3145B上升或者下降。另外，料盒升降單元314包括使升降驅動部3141沿著水平方向（x方向）移動的水平驅動部3147。The material box lifting unit 314 includes a lifting drive part 3141 for lifting and lowering, a handheld unit 3143 that rises or falls through the lifting drive part 3141, and an upper clamp 3145A and a lower clamp 3145B that are combined with the handheld unit 3143 to clamp the upper and lower parts of the material box MZ. In order to clamp the material box MZ, the upper clamp 3145A can rise or fall relative to the lower clamp 3145B. In addition, the material box lifting unit 314 includes a horizontal drive part 3147 that moves the lifting drive part 3141 along the horizontal direction (x direction).

推動器單元316將裝載於料盒MZ的離型膜400推出到膜搬動模組320，以從料盒MZ取出離型膜400。推動器單元316包括用於升降驅動的升降驅動部3161、推出離型膜400的推動桿3165以及使推動桿3165沿著水平方向（y方向）移動的水平驅動部3163。The pusher unit 316 pushes the release film 400 loaded in the magazine MZ to the film moving module 320 to remove the release film 400 from the magazine MZ. The pusher unit 316 includes a lifting drive part 3161 for lifting and lowering, a push rod 3165 for pushing out the release film 400, and a horizontal drive part 3163 for moving the push rod 3165 in the horizontal direction (y direction).

圖7至圖9示出了從料盒MZ投入離型膜400的過程。7 to 9 show the process of feeding the release film 400 from the material box MZ.

裝載有離型膜400的料盒MZ通過輸送器3123朝向料盒升降單元314移動（圖7）。若通過料盒升降單元314的上夾具3145A以及下夾具3145B夾持到料盒MZ（圖8），則手持單元3143上升至膜搬動模組320的周邊高度（圖9）。然後，通過推動器單元316和膜搬動模組320從料盒MZ取出離型膜400而離型膜400被供應到膜搬動模組320。若取出了料盒MZ的所有離型膜400，接著附著有半導體封裝體SP的離型膜400被投入到料盒MZ。The material box MZ loaded with the release film 400 moves toward the material box lifting unit 314 through the conveyor 3123 (Figure 7). If the material box MZ is clamped by the upper clamp 3145A and the lower clamp 3145B of the material box lifting unit 314 (Figure 8), the hand-held unit 3143 rises to the peripheral height of the film moving module 320 (Figure 9). Then, the release film 400 is taken out from the material box MZ through the pusher unit 316 and the film moving module 320 and the release film 400 is supplied to the film moving module 320. If all the release films 400 of the material box MZ are taken out, the release film 400 attached with the semiconductor package SP is then put into the material box MZ.

圖10至圖13示出了將完成了附著有半導體封裝體SP的離型膜400的裝載的料盒MZ排出的過程。10 to 13 show a process of discharging the material box MZ to which the release film 400 to which the semiconductor package SP is attached is loaded.

若離型膜400全部收納於通過上夾具3145A以及下夾具3145B夾持的料盒MZ（圖10），則料盒升降單元314的升降驅動部3141通過水平驅動部3147朝向卸載板3127移動而將料盒MZ安放於卸載板3127（圖11）。然後，可以是，為了針對下一個料盒MZ進行工作，升降驅動部3141在水平方向（-x方向）上後退（圖12），手持單元3143下降到裝載板3121周邊（圖13）。If the release film 400 is completely contained in the material box MZ clamped by the upper clamp 3145A and the lower clamp 3145B (FIG. 10), the lifting drive 3141 of the material box lifting unit 314 moves toward the unloading plate 3127 through the horizontal drive 3147 to place the material box MZ on the unloading plate 3127 (FIG. 11). Then, in order to work on the next material box MZ, the lifting drive 3141 retreats in the horizontal direction (-x direction) (FIG. 12), and the handheld unit 3143 descends to the periphery of the loading plate 3121 (FIG. 13).

圖14示出了根據本發明的膜結合模組30的膜搬動模組320。FIG. 14 shows a membrane moving module 320 of the membrane bonding module 30 according to the present invention.

根據本發明的實施例，膜搬動模組320包括引導離型膜400的移動路徑的膜導向單元324以及夾持離型膜400並使其沿著移動路徑移動的膜輸送單元322。According to an embodiment of the present invention, the film moving module 320 includes a film guide unit 324 that guides a moving path of the release film 400 and a film transport unit 322 that clamps the release film 400 and moves it along the moving path.

根據本發明的實施例，膜導向單元324可以包括構成為能夠在彼此相反方向上移動的一對導軌部件3241。導軌部件3241可以通過導軌驅動單元3243沿著x方向移動。在導軌部件3241中構成有掛台3242，從而可以在下方支承離型膜400的側部並提供用於離型膜400的水平方向移動的路徑。According to an embodiment of the present invention, the film guide unit 324 may include a pair of rail members 3241 configured to be movable in opposite directions to each other. The rail member 3241 may be movable along the x-direction via a rail drive unit 3243. A hanging platform 3242 is configured in the rail member 3241, so that the side of the release film 400 may be supported below and a path for the release film 400 to move in the horizontal direction may be provided.

根據本發明的實施例，可以是，當沿著水平方向輸送離型膜400時，一對導軌部件3241在彼此接近的方向上移動而位於導向位置，當離型膜400上升或者下降時，一對導軌部件3241在彼此遠離的方向上移動而位於避讓位置。According to an embodiment of the present invention, when the release film 400 is transported in the horizontal direction, the pair of guide rail components 3241 move in directions approaching each other and are located at the guiding position, and when the release film 400 rises or falls, the pair of guide rail components 3241 move in directions away from each other and are located at the avoiding position.

根據本發明的實施例，可以是，膜輸送單元322從料盒MZ夾持離型膜400並將其沿著導軌部件3241輸送到上升降位置H1（圖23），膜輸送單元322將附著有半導體封裝體SP的離型膜400從上升降位置H1輸送到料盒MZ。According to an embodiment of the present invention, the film transport unit 322 clamps the release film 400 from the material box MZ and transports it to the upper lifting position H1 along the guide rail component 3241 (Figure 23), and the film transport unit 322 transports the release film 400 attached with the semiconductor package body SP from the upper lifting position H1 to the material box MZ.

參照圖14，膜輸送單元322包括可以夾持離型膜400的夾具3221、設置夾具3221的輸送塊3223、使輸送塊3223沿著水平方向（y方向）移動的輸送塊水平驅動部3225以及引導輸送塊3223的移動的輸送塊導向部件3227。14 , the film transport unit 322 includes a clamp 3221 that can clamp the release film 400 , a transport block 3223 on which the clamp 3221 is provided, a transport block horizontal driving portion 3225 that moves the transport block 3223 in a horizontal direction (y direction), and a transport block guide member 3227 that guides the movement of the transport block 3223 .

圖15至圖20示出了離型膜400從料盒MZ被輸送到膜升降區域P1的過程。15 to 20 show a process in which the release film 400 is transported from the magazine MZ to the film lifting area P1.

首先，若料盒MZ通過料盒升降單元314位於膜搬動模組320的周邊（圖15），則離型膜400通過推動器單元316被推出到膜搬動模組320的周邊（圖16）。膜輸送單元322的夾具3221夾持離型膜400（圖17），膜輸送單元322沿著導軌部件3241使離型膜400移動到膜升降區域P1（圖18）。若離型膜400位於膜升降區域P1，並通過膜升降模組330吸附離型膜400，則膜輸送單元322的夾具3221放置離型膜400並移動到初始位置（圖19），一對導軌部件3241可以在彼此遠離的方向上移動而防止離型膜400升降時的干擾（圖20）。First, if the material box MZ is located at the periphery of the film moving module 320 through the material box lifting unit 314 (Figure 15), the release film 400 is pushed out to the periphery of the film moving module 320 through the pusher unit 316 (Figure 16). The clamp 3221 of the film conveying unit 322 clamps the release film 400 (Figure 17), and the film conveying unit 322 moves the release film 400 to the film lifting area P1 along the guide rail part 3241 (Figure 18). If the release film 400 is located in the film lifting area P1 and is adsorbed by the film lifting module 330, the clamp 3221 of the film transport unit 322 places the release film 400 and moves to the initial position (Figure 19), and a pair of guide rail components 3241 can move in directions away from each other to prevent interference when the release film 400 is lifted or lowered (Figure 20).

圖21以及圖22示出了根據本發明的膜結合模組30的膜升降模組330。Figures 21 and 22 show the membrane lifting module 330 of the membrane bonding module 30 according to the present invention.

根據本發明的實施例，膜升降模組330可以包括具有一定的面積並構成為在膜升降區域P1的下升降位置H2和上升降位置H1之間進行升降的升降主體332以及形成在升降主體332的上方的複數個真空吸附單元334。可以是，升降主體332構成為通過升降驅動部336上升或者下降，真空吸附單元334吸附固定離型膜400。According to an embodiment of the present invention, the film lifting module 330 may include a lifting body 332 having a certain area and configured to be lifted and lowered between a lower lifting position H2 and an upper lifting position H1 of the film lifting area P1, and a plurality of vacuum adsorption units 334 formed above the lifting body 332. The lifting body 332 may be configured to be lifted or lowered by a lifting driving unit 336, and the vacuum adsorption units 334 adsorb and fix the release film 400.

根據本發明的實施例，真空吸附單元334可以在升降主體332中設置於與形成於夾具托盤500的貫通孔530相對應的位置而構成為穿過夾具托盤500的貫通孔530。According to an embodiment of the present invention, the vacuum adsorption unit 334 may be disposed in the lifting body 332 at a position corresponding to the through hole 530 formed in the clamp tray 500 and configured to pass through the through hole 530 of the clamp tray 500 .

根據本發明的實施例，可以是，若離型膜400位於膜升降區域P1，則膜升降模組330上升到膜升降區域P1的上升降位置H1而吸附離型膜400，並在吸附離型膜400的狀態下從上升降位置H1下降到下升降位置H2而使離型膜400和夾具托盤500結合。According to an embodiment of the present invention, if the release film 400 is located in the film lifting area P1, the film lifting module 330 rises to the upper lifting position H1 of the film lifting area P1 to adsorb the release film 400, and descends from the upper lifting position H1 to the lower lifting position H2 while adsorbing the release film 400 to combine the release film 400 and the clamp tray 500.

圖23至圖27示出了在膜升降區域P1中將離型膜400結合於夾具托盤500的過程。23 to 27 illustrate a process of bonding the release film 400 to the jig tray 500 in the film lifting area P1.

離型膜400通過膜搬動模組320的膜輸送單元322從料盒MZ被輸送到膜升降區域P1，此時，上方離型膜400通過導軌部件3241支承而位於上升降位置H1（圖23的（a）以及（b））。然後，膜升降模組330的升降主體332上升而真空吸附單元334吸附離型膜400（圖24的（a）以及（b）），升降主體332進一步上升而使離型膜400上升到高於上升降位置H1的位置（圖25的（a）以及（b））。然後，導軌部件3241在彼此遠離的方向上移動，以使得離型膜400下降時不發生干擾，升降主體332下降而使離型膜400位於下升降位置H2（圖26的（a）以及（b））。此時，離型膜400可以結合於夾具托盤500的托盤槽部520，並通過升降主體332的進一步下降而避免夾具托盤500水平移動時的干擾（圖27的（a）以及（b））。The release film 400 is transported from the material box MZ to the film lifting area P1 by the film transport unit 322 of the film moving module 320. At this time, the upper release film 400 is supported by the guide rail component 3241 and is located at the upper lifting position H1 ((a) and (b) of Figure 23). Then, the lifting body 332 of the film lifting module 330 rises and the vacuum adsorption unit 334 adsorbs the release film 400 ((a) and (b) of Figure 24), and the lifting body 332 further rises to raise the release film 400 to a position higher than the upper lifting position H1 ((a) and (b) of Figure 25). Then, the guide rail members 3241 move in directions away from each other so that the release film 400 does not interfere when it is lowered, and the lifting body 332 is lowered to position the release film 400 at the lower lifting position H2 ((a) and (b) of FIG. 26). At this time, the release film 400 can be coupled to the tray groove 520 of the clamp tray 500, and the further lowering of the lifting body 332 can avoid interference when the clamp tray 500 moves horizontally ((a) and (b) of FIG. 27).

圖28示出了根據本發明的膜結合模組30的輸送器模組340。Figure 28 shows a conveyor module 340 of the membrane bonding module 30 according to the present invention.

可以是，輸送器模組340將夾具托盤500沿著水平方向（x方向）輸送，並將結合有離型膜400的夾具托盤500從膜升降區域P1輸送到托盤拾取區域P2或者將夾具托盤500從托盤拾取區域P2輸送到膜升降區域P1。The conveyor module 340 may convey the clamp tray 500 in the horizontal direction (x direction) and convey the clamp tray 500 coupled with the release film 400 from the film lifting area P1 to the tray picking area P2 or convey the clamp tray 500 from the tray picking area P2 to the film lifting area P1.

輸送器模組340可以包括沿著水平方向（x方向）延伸的輸送器本體342以及使夾具托盤500沿著水平方向（x方向）移動的輸送器皮帶344。The conveyor module 340 may include a conveyor body 342 extending in a horizontal direction (x direction) and a conveyor belt 344 that moves the jig tray 500 in the horizontal direction (x direction).

圖29至圖30示出了夾具托盤500在膜結合模組30的輸送器模組340中從膜升降區域P1輸送到托盤拾取區域P2的過程。29 to 30 illustrate a process in which the gripper tray 500 is transported from the film lifting area P1 to the tray picking area P2 in the conveyor module 340 of the film bonding module 30. As shown in FIG.

若離型膜400通過膜升降模組330位於膜升降區域P1的下升降位置H2，則離型膜400結合於夾具托盤500（圖29），結合有離型膜400的夾具托盤500通過輸送器模組340移動到托盤拾取區域P2（圖30）。然後，托盤拾取器226在拾取結合有離型膜400的夾具托盤500之後將其輸送到托盤輸送部220，以使得半導體封裝體SP被附著於離型膜400。If the release film 400 is located at the lower lifting position H2 of the film lifting area P1 through the film lifting module 330, the release film 400 is coupled to the clamp tray 500 (FIG. 29), and the clamp tray 500 coupled with the release film 400 is moved to the tray picking area P2 (FIG. 30) through the conveyor module 340. Then, the tray picker 226 picks up the clamp tray 500 coupled with the release film 400 and then transports it to the tray conveying unit 220, so that the semiconductor package SP is attached to the release film 400.

若完成了半導體封裝體SP在離型膜400的附著，則托盤拾取器226拾取結合有離型膜400的夾具托盤500並將其輸送到托盤拾取區域P2。If the semiconductor package SP is attached to the release film 400, the tray picker 226 picks up the jig tray 500 combined with the release film 400 and transports it to the tray pick-up area P2.

圖31至圖32示出了在膜結合模組30的輸送器模組340中夾具托盤500輸送到膜升降區域P1的過程。夾具托盤500通過托盤拾取器226輸送到托盤拾取區域P2（圖31），夾具托盤500通過輸送器模組340從托盤拾取區域P2輸送到膜升降區域P1（圖32）。在這裡，離型膜400通過膜升降模組330從夾具托盤500分離。31 to 32 show the process of conveying the clamp tray 500 to the film lifting area P1 in the conveyor module 340 of the film bonding module 30. The clamp tray 500 is conveyed to the tray picking area P2 (FIG. 31) by the tray picker 226, and the clamp tray 500 is conveyed from the tray picking area P2 to the film lifting area P1 (FIG. 32) by the conveyor module 340. Here, the release film 400 is separated from the clamp tray 500 by the film lifting module 330.

根據本發明的實施例，可以是，若結合有附著有半導體封裝體SP的離型膜400的夾具托盤500位於膜升降區域P1的下升降位置H2，則膜升降模組330上升到上升降位置H1而從夾具托盤500分離離型膜400，若在上升降位置H1通過導軌部件3241支承離型膜400，則膜升降模組330解除真空吸附並下降到下升降位置H2。According to an embodiment of the present invention, if the clamp tray 500 combined with the release film 400 attached with the semiconductor package body SP is located at the lower lifting position H2 of the film lifting area P1, the film lifting module 330 rises to the upper lifting position H1 and separates the release film 400 from the clamp tray 500. If the release film 400 is supported by the guide rail component 3241 at the upper lifting position H1, the film lifting module 330 releases the vacuum adsorption and descends to the lower lifting position H2.

圖33至圖37示出了在膜結合模組30的膜升降模組330中從夾具托盤500分離離型膜400的過程。夾具托盤500通過輸送器模組340位於膜升降區域P1的下升降位置H2（圖33），膜升降模組330的升降主體332上升而真空吸附單元334接觸於離型膜400的下方（圖34）。若通過真空吸附單元334吸附離型膜400，則升降主體332上升而離型膜400從夾具托盤500分離（圖35）。在這裡，離型膜400位於高於上升降位置H1的位置，一對導軌部件3241移動到彼此接近的位置，然後升降主體332下降，以使得離型膜400被安放於導軌部件3241的上方（圖36）。此時，離型膜400位於上升降位置H1。若離型膜400被安放於導軌部件3241的上方，則真空吸附單元334解除針對離型膜400的吸附，升降主體332下降（圖37）。33 to 37 show the process of separating the release film 400 from the clamp tray 500 in the film lifting module 330 of the film bonding module 30. The clamp tray 500 is located at the lower lifting position H2 of the film lifting area P1 through the conveyor module 340 (FIG. 33), and the lifting body 332 of the film lifting module 330 rises and the vacuum adsorption unit 334 contacts the lower part of the release film 400 (FIG. 34). If the release film 400 is adsorbed by the vacuum adsorption unit 334, the lifting body 332 rises and the release film 400 is separated from the clamp tray 500 (FIG. 35). Here, the release film 400 is located at a position higher than the upper lifting position H1, the pair of guide rails 3241 move to a position close to each other, and then the lifting body 332 descends so that the release film 400 is placed above the guide rails 3241 (Figure 36). At this time, the release film 400 is located at the upper lifting position H1. If the release film 400 is placed above the guide rails 3241, the vacuum adsorption unit 334 releases the adsorption of the release film 400, and the lifting body 332 descends (Figure 37).

圖38至圖42示出了在膜結合模組30的膜搬動模組320中離型膜400被裝載於料盒MZ的過程。38 to 42 show a process in which the release film 400 is loaded into the material box MZ in the film moving module 320 of the film bonding module 30. As shown in FIG.

若離型膜400通過膜升降模組330位於膜升降區域P1的上升降位置H1（圖38），則一對導軌部件3241移動到彼此接近的位置而在下方支承離型膜400（圖39）。然後，膜搬動模組320的夾具3221可以夾持離型膜400（圖40），並將離型膜400插入於料盒MZ（圖41、圖42）。If the release film 400 is located at the upper lifting position H1 of the film lifting area P1 through the film lifting module 330 (Figure 38), the pair of guide rail components 3241 moves to a position close to each other and supports the release film 400 below (Figure 39). Then, the clamp 3221 of the film moving module 320 can clamp the release film 400 (Figure 40) and insert the release film 400 into the material box MZ (Figures 41 and 42).

圖43至圖44示出了裝載有離型膜400的料盒MZ被輸送到料盒裝載單元312的過程。43 to 44 show a process in which a material box MZ loaded with a release film 400 is transported to the material box loading unit 312. As shown in FIG.

若離型膜400全部被裝載於料盒MZ的各槽，則料盒升降單元314在水平方向（x方向）上移動而使料盒MZ位於料盒裝載單元312的卸載板3127（圖43）。並且，料盒升降單元314可以後退，為了針對下一個料盒MZ進行工作，從裝載板3121收取料盒MZ（圖44）。If all the release films 400 are loaded into the slots of the magazine MZ, the magazine lifting unit 314 moves in the horizontal direction (x direction) so that the magazine MZ is located at the unloading plate 3127 of the magazine loading unit 312 ( FIG. 43 ). In addition, the magazine lifting unit 314 can move backward to collect the magazine MZ from the loading plate 3121 in order to work on the next magazine MZ ( FIG. 44 ).

圖45示出了本發明的另一實施例的半導體條帶切割以及分類裝備1的概要構成。FIG. 45 shows a schematic structure of a semiconductor strip cutting and sorting apparatus 1 according to another embodiment of the present invention.

參照圖45，根據本發明的膜結合模組30可以構成在半導體條帶切割以及分類裝備1的內部。根據本實施例，可以是，離型膜400以結合於夾具托盤500的狀態提供到晶片拾取器218的周邊，半導體封裝體SP通過晶片拾取器218附著於離型膜400，若所有半導體封裝體SP附著於離型膜400，則離型膜400重新返回到膜結合模組30。45 , the film bonding module 30 according to the present invention may be constructed inside the semiconductor strip cutting and sorting equipment 1. According to this embodiment, the release film 400 may be provided to the periphery of the wafer picker 218 in a state of being bonded to the clamp tray 500, and the semiconductor package SP may be attached to the release film 400 through the wafer picker 218. If all the semiconductor packages SP are attached to the release film 400, the release film 400 may be returned to the film bonding module 30.

離型膜400以裝載在料盒MZ的狀態提供到料盒裝載單元312，並在被料盒升降單元314夾持的狀態下通過推動器單元316從料盒裝載單元312提供到膜搬動模組320。The release film 400 is provided to the magazine loading unit 312 in a state of being loaded in the magazine MZ, and is provided from the magazine loading unit 312 to the film moving module 320 through the pusher unit 316 in a state of being clamped by the magazine elevating unit 314.

根據本發明的實施例，膜搬動模組320包括引導離型膜400的移動路徑的膜導向單元324以及夾持離型膜400並使其沿著移動路徑移動的膜輸送單元322。According to an embodiment of the present invention, the film moving module 320 includes a film guide unit 324 that guides a moving path of the release film 400 and a film transport unit 322 that clamps the release film 400 and moves it along the moving path.

根據本發明的實施例，膜導向單元324可以包括構成為能夠在彼此相反方向上移動的一對導軌部件3241。導軌部件3241可以通過導軌驅動單元3243沿著x方向移動。在導軌部件3241中構成有掛台3242，從而可以在下方支承離型膜400的側部並提供用於離型膜400的水平方向移動的路徑。According to an embodiment of the present invention, the film guide unit 324 may include a pair of rail members 3241 configured to be movable in opposite directions to each other. The rail member 3241 may be movable along the x-direction via a rail drive unit 3243. A hanging platform 3242 is configured in the rail member 3241, so that the side of the release film 400 may be supported below and a path for the release film 400 to move in the horizontal direction may be provided.

根據本發明的實施例，可以是，當沿著水平方向輸送離型膜400時，一對導軌部件3241在彼此接近的方向上移動而位於導向位置，當離型膜400上升或者下降時，一對導軌部件3241在彼此遠離的方向上移動而位於避讓位置。According to an embodiment of the present invention, when the release film 400 is transported in the horizontal direction, the pair of guide rail components 3241 move in directions approaching each other and are located at the guiding position, and when the release film 400 rises or falls, the pair of guide rail components 3241 move in directions away from each other and are located at the avoiding position.

根據本發明的實施例，可以是，膜輸送單元322從料盒MZ夾持離型膜400並將其沿著導軌部件3241輸送到膜升降區域P3，膜輸送單元322將附著有半導體封裝體SP的離型膜400從膜升降區域P3輸送到料盒MZ。According to an embodiment of the present invention, the film transport unit 322 clamps the release film 400 from the material box MZ and transports it to the film lifting area P3 along the guide rail component 3241, and the film transport unit 322 transports the release film 400 attached with the semiconductor package body SP from the film lifting area P3 to the material box MZ.

膜輸送單元322包括可以夾持離型膜400的夾具3221、設置夾具3221的輸送塊3223、使輸送塊3223沿著水平方向（y方向）移動的輸送塊水平驅動部3225以及引導輸送塊3223的移動的輸送塊導向部件3227。The film transport unit 322 includes a clamp 3221 that can clamp the release film 400 , a transport block 3223 on which the clamp 3221 is installed, a transport block horizontal driving part 3225 that moves the transport block 3223 in a horizontal direction (y direction), and a transport block guide component 3227 that guides the movement of the transport block 3223 .

若料盒MZ通過料盒升降單元314位於膜搬動模組320的周邊，則離型膜400通過推動器單元316被推出到膜搬動模組320的周邊。膜輸送單元322的夾具3221夾持離型膜400，膜輸送單元322沿著導軌部件3241使離型膜400移動到膜升降區域P3。若離型膜400位於膜升降區域P3，並通過膜升降模組330吸附離型膜400，則膜輸送單元322的夾具3221放置離型膜400並移動到初始位置，一對導軌部件3241可以在彼此遠離的方向上移動而防止離型膜400升降時的干擾。If the material box MZ is located at the periphery of the film moving module 320 through the material box lifting unit 314, the release film 400 is pushed out to the periphery of the film moving module 320 through the pusher unit 316. The clamp 3221 of the film conveying unit 322 clamps the release film 400, and the film conveying unit 322 moves the release film 400 to the film lifting area P3 along the guide rail part 3241. If the release film 400 is located in the film lifting area P3 and the release film 400 is adsorbed by the film lifting module 330, the clamp 3221 of the film conveying unit 322 places the release film 400 and moves to the initial position, and a pair of guide rail parts 3241 can move in directions away from each other to prevent interference when the release film 400 is lifted.

根據本發明的實施例，可以是，若離型膜400位於膜升降區域P3，則膜升降模組330上升到膜升降區域P3的上升降位置H1而吸附離型膜400，並在吸附離型膜400的狀態下從上升降位置H1下降到下升降位置H2而結合離型膜400和夾具托盤500。According to an embodiment of the present invention, if the release film 400 is located in the film lifting area P3, the film lifting module 330 rises to the upper lifting position H1 of the film lifting area P3 to adsorb the release film 400, and descends from the upper lifting position H1 to the lower lifting position H2 while adsorbing the release film 400 to combine the release film 400 and the clamp tray 500.

離型膜400通過膜搬動模組320的膜輸送單元322從料盒MZ被輸送到膜升降區域P3，此時，離型膜400被導軌部件3241支承而位於上升降位置H1。然後，膜升降模組330的升降主體332上升而真空吸附單元334吸附離型膜400，升降主體332進一步上升而使離型膜400上升到高於上升降位置H1的位置。然後，導軌部件3241在彼此遠離的方向上移動，以使得離型膜400下降時不發生干擾，升降主體332下降而使離型膜400位於下升降位置H2。此時，離型膜400可以結合於夾具托盤500的托盤槽部520，並通過升降主體332的進一步下降而避免夾具托盤500水平移動時的干擾。The release film 400 is transported from the material box MZ to the film lifting area P3 by the film transport unit 322 of the film moving module 320. At this time, the release film 400 is supported by the guide rail component 3241 and is located at the upper lifting position H1. Then, the lifting body 332 of the film lifting module 330 rises and the vacuum adsorption unit 334 adsorbs the release film 400. The lifting body 332 further rises and the release film 400 rises to a position higher than the upper lifting position H1. Then, the guide rail component 3241 moves in a direction away from each other so that there is no interference when the release film 400 descends. The lifting body 332 descends and the release film 400 is located at the lower lifting position H2. At this time, the release film 400 can be combined with the tray groove 520 of the clamp tray 500, and the interference of the clamp tray 500 when the clamp tray 500 moves horizontally can be avoided by further descending the lifting body 332.

可以是，輸送器模組340將夾具托盤500沿著水平方向（x方向）輸送，並將結合有離型膜400的夾具托盤500從膜升降區域P3輸送到晶片拾取區域P4或者將夾具托盤500從晶片拾取區域P4輸送到膜升降區域P3。The conveyor module 340 may convey the jig tray 500 in the horizontal direction (x direction) and convey the jig tray 500 coupled with the release film 400 from the film lifting area P3 to the wafer pickup area P4 or convey the jig tray 500 from the wafer pickup area P4 to the film lifting area P3.

輸送器模組340可以包括沿著水平方向（x方向）延伸的輸送器本體342以及使夾具托盤500沿著水平方向（x方向）移動的輸送器皮帶344。The conveyor module 340 may include a conveyor body 342 extending in a horizontal direction (x direction) and a conveyor belt 344 that moves the jig tray 500 in the horizontal direction (x direction).

若離型膜400通過膜升降模組330位於膜升降區域P3的下升降位置H2，則離型膜400結合於夾具托盤500，結合有離型膜400的夾具托盤500通過輸送器模組340移動到晶片拾取區域P4。然後，晶片拾取器218可以將半導體封裝體SP附著於離型膜400的上方。If the release film 400 is located at the lower lifting position H2 of the film lifting area P3 through the film lifting module 330, the release film 400 is coupled to the clamp tray 500, and the clamp tray 500 coupled with the release film 400 is moved to the wafer pickup area P4 through the conveyor module 340. Then, the wafer pickup 218 can attach the semiconductor package SP to the top of the release film 400.

若完成了半導體封裝體SP在離型膜400的附著，則結合有離型膜400的夾具托盤500通過輸送器模組340被輸送到膜升降區域P3。根據本發明的實施例，若結合有附著有半導體封裝體SP的離型膜400的夾具托盤500位於膜升降區域P3的下升降位置H2，則膜升降模組330上升到上升降位置H1而從夾具托盤500分離離型膜400，若在上升降位置H1通過導軌部件3241支承離型膜400，則膜升降模組330解除真空吸附並下降到下升降位置H2。If the semiconductor package SP is attached to the release film 400, the clamp tray 500 coupled with the release film 400 is transported to the film lifting area P3 through the conveyor module 340. According to the embodiment of the present invention, if the clamp tray 500 coupled with the release film 400 attached with the semiconductor package SP is located at the lower lifting position H2 of the film lifting area P3, the film lifting module 330 rises to the upper lifting position H1 to separate the release film 400 from the clamp tray 500, and if the release film 400 is supported by the guide rail member 3241 at the upper lifting position H1, the film lifting module 330 releases the vacuum adsorption and descends to the lower lifting position H2.

夾具托盤500通過輸送器模組340位於膜升降區域P3的下升降位置H2，膜升降模組330的升降主體332上升而真空吸附單元334接觸於離型膜400的下方。若通過真空吸附單元334吸附離型膜400，則升降主體332上升而離型膜400從夾具托盤500分離。在這裡，離型膜400位於高於上升降位置H1的位置，一對導軌部件3241移動到彼此接近的位置，然後升降主體332下降，以使得離型膜400被安放於導軌部件3241的上方。此時，離型膜400位於上升降位置H1。若離型膜400被安放於導軌部件3241的上方，則真空吸附單元334解除針對離型膜400的吸附，升降主體332下降。The clamp tray 500 is located at the lower lifting position H2 of the film lifting area P3 through the conveyor module 340, and the lifting body 332 of the film lifting module 330 rises and the vacuum adsorption unit 334 contacts the lower part of the release film 400. If the release film 400 is adsorbed by the vacuum adsorption unit 334, the lifting body 332 rises and the release film 400 is separated from the clamp tray 500. Here, the release film 400 is located at a position higher than the upper lifting position H1, and the pair of guide rail members 3241 move to a position close to each other, and then the lifting body 332 descends so that the release film 400 is placed above the guide rail member 3241. At this time, the release film 400 is located at the upper lifting position H1. If the release film 400 is placed on the guide rail part 3241, the vacuum adsorption unit 334 releases the adsorption of the release film 400, and the lifting body 332 descends.

若離型膜400通過膜升降模組330位於膜升降區域P3的上升降位置H1，則一對導軌部件3241移動到彼此接近的位置而在下方支承離型膜400。然後，膜搬動模組320的夾具3221可以夾持離型膜400，並將離型膜400插入於料盒MZ。If the release film 400 is located at the upper lifting position H1 of the film lifting area P3 through the film lifting module 330, the pair of guide rail members 3241 moves to a position close to each other to support the release film 400 below. Then, the clamp 3221 of the film moving module 320 can clamp the release film 400 and insert the release film 400 into the material box MZ.

若離型膜400全部被裝載於料盒MZ的各槽，則料盒升降單元314在水平方向（x方向）上移動而使料盒MZ位於料盒裝載單元312的卸載板3127。並且，料盒升降單元314可以後退，為了針對下一個料盒MZ進行工作，從裝載板3121收取料盒MZ。If all the release films 400 are loaded in the slots of the magazine MZ, the magazine lifting unit 314 moves in the horizontal direction (x direction) to position the magazine MZ at the unloading plate 3127 of the magazine loading unit 312. In addition, the magazine lifting unit 314 can retreat to collect the magazine MZ from the loading plate 3121 in order to work on the next magazine MZ.

本實施例以及本說明書中所附的圖式只不過明確表示包括在本發明中的技術構思的一部分，顯而易見的是，由本領域技術人員能夠在包括在本發明的說明書以及圖式中的技術構思的範疇內容易導出的變形例和具體實施例均包括在本發明的範疇中。This embodiment and the drawings attached in this specification only clearly represent a part of the technical concept included in the present invention. Obviously, the variations and specific embodiments that can be easily derived by technical personnel in this field within the scope of the technical concept included in the specification and drawings of the present invention are all included in the scope of the present invention.

因此，本發明的構思不應局限於所說明的實施例，不僅是所附的申請專利範圍，與其申請專利範圍等同或均等變形的所有構思屬於本發明構思的範疇。Therefore, the concept of the present invention should not be limited to the described embodiments, but should be within the scope of the attached patent application. All concepts that are equivalent to or equally modified with the scope of the patent application belong to the scope of the concept of the present invention.

1:半導體條帶切割以及分類裝備 5:裝載單元 10:切割單元 102:料盒裝載器 104:入口軌道 106:條帶拾取器 108:卡盤台 110:切削模組 112:單元拾取器 114:清洗單元 116:緩衝台 118:緩衝拾取器 120:水平導向部件 20:分類單元 202:翻轉台 204:托盤台 206:工作台驅動部 208:球體視覺檢查部 210:標記視覺檢查部 212:上門架 214:對準視覺檢查部 216:水平導向部件 218:晶片拾取器 220:托盤輸送部 222:第一水平導向部件 224:第二水平導向部件 226:托盤拾取器 228:良品托盤保管部 230:重工托盤保管部 232:托盤裝載器 30:膜結合模組 310:料盒裝載器模組 311:底板 312:料盒裝載單元 3121:裝載板 3123:輸送器 3125:設置結構物 3127:卸載板 3127A:切開部 314:料盒升降單元 3141:升降驅動部 3143:手持單元 3145A:上夾具 3145B:下夾具 3147:水平驅動部 316:推動器單元 3161:升降驅動部 3163:水平驅動部 3165:推動桿 320:膜搬動模組 322:膜輸送單元 3221:夾具 3223:輸送塊 3225:輸送塊水平驅動部 3227:輸送塊導向部件 324:膜導向單元 3241:導軌部件 3242:掛台 3243:導軌驅動單元 330:膜升降模組 332:升降主體 334:真空吸附單元 336:升降驅動部 340:輸送器模組 342:輸送器本體 344:輸送器皮帶 400:離型膜 410:框架 500:夾具托盤 510:托盤主體 515:夾持部 520:托盤槽部 530:貫通孔 H1:上升降位置 H2:下升降位置 MZ:料盒 MZ1:條帶料盒 P1、P3:膜升降區域 P2:托盤拾取區域 P4:晶片拾取區域 S:半導體條帶 SP:半導體封裝體 1: Semiconductor strip cutting and sorting equipment 5: Loading unit 10: Cutting unit 102: Material box loader 104: Entry track 106: Strip picker 108: Chuck table 110: Cutting module 112: Unit picker 114: Cleaning unit 116: Buffer table 118: Buffer picker 120: Horizontal guide component 20: Sorting unit 202: Turntable 204: Tray table 206: Workbench drive unit 208: Ball visual inspection unit 210: Marking visual inspection unit 212: Upper door frame 214: Alignment visual inspection unit 216: horizontal guide member 218: wafer picker 220: tray conveyor 222: first horizontal guide member 224: second horizontal guide member 226: tray picker 228: good tray storage unit 230: rework tray storage unit 232: tray loader 30: membrane bonding module 310: cartridge loader module 311: bottom plate 312: cartridge loading unit 3121: loading plate 3123: conveyor 3125: setting structure 3127: unloading plate 3127A: cutting unit 314: cartridge lifting unit 3141: lifting drive unit 3143: handheld unit 3145A: Upper clamp 3145B: Lower clamp 3147: Horizontal drive unit 316: Pusher unit 3161: Lifting drive unit 3163: Horizontal drive unit 3165: Push rod 320: Membrane moving module 322: Membrane conveying unit 3221: Clamp 3223: Conveyor block 3225: Conveyor block horizontal drive unit 3227: Conveyor block guide component 324: Membrane guide unit 3241: Guide rail component 3242: Hanging platform 3243: Guide rail drive unit 330: Membrane lifting module 332: Lifting body 334: Vacuum adsorption unit 336: Lifting drive unit 340: Conveyor module 342: Conveyor body 344: Conveyor belt 400: Release film 410: Frame 500: Clamp tray 510: Tray body 515: Clamping unit 520: Tray slot 530: Through hole H1: Upper lifting position H2: Lower lifting position MZ: Material box MZ1: Strip material box P1, P3: Film lifting area P2: Tray picking area P4: Wafer picking area S: Semiconductor strip SP: Semiconductor package

圖1示出了能夠適用本發明的半導體條帶切割以及分類裝備的概要構成。FIG. 1 shows a schematic structure of a semiconductor strip cutting and sorting equipment to which the present invention can be applied.

圖2A以及圖2B示出了根據本發明的離型膜以及收納離型膜的料盒。2A and 2B show a release film and a material box for storing the release film according to the present invention.

圖3A以及圖3B示出了根據本發明的夾具托盤以及附著有離型膜的夾具托盤。FIG. 3A and FIG. 3B show a clamp tray according to the present invention and a clamp tray with a release film attached thereto.

圖4示出了在根據本發明的半導體條帶切割以及分類裝備中膜結合模組結合於分類單元的過程。FIG. 4 shows a process of bonding a film-bonded module to a classification unit in a semiconductor strip cutting and classification apparatus according to the present invention.

圖5示出了在根據本發明的半導體條帶切割以及分類裝備中結合於分類單元的膜結合模組的概要結構。FIG5 shows a schematic structure of a film bonding module incorporated in a sorting unit in a semiconductor strip cutting and sorting apparatus according to the present invention.

圖6示出了根據本發明的膜結合模組的料盒裝載器模組。Figure 6 shows a material box loader module of the membrane bonding module according to the present invention.

圖7至圖13示出了從料盒投入離型膜的過程。7 to 13 show the process of feeding the release film from the material box.

圖14示出了根據本發明的膜結合模組的膜搬動模組。Figure 14 shows a membrane moving module of the membrane bonding module according to the present invention.

圖15至圖20示出了將離型膜從料盒向膜升降區域輸送的過程。15 to 20 show the process of conveying the release film from the magazine to the film lifting area.

圖21以及圖22示出了根據本發明的膜結合模組的膜升降模組。Figures 21 and 22 show the membrane lifting module of the membrane bonding module according to the present invention.

圖23至圖27示出了在膜升降區域中將離型膜結合於夾具托盤的過程。23 to 27 illustrate the process of bonding the release film to the fixture tray in the film lifting area.

圖28示出了根據本發明的膜結合模組的輸送器模組。Figure 28 shows a conveyor module of the membrane bonding module according to the present invention.

圖29至圖30示出了在膜結合模組的輸送器模組中夾具托盤被輸送到托盤拾取區域的過程。29 to 30 illustrate the process of a gripper tray being transported to a tray picking area in a conveyor module of a film bonding module.

圖31至圖32示出了在膜結合模組的輸送器模組中夾具托盤被輸送到膜升降區域的過程。Figures 31 to 32 show the process in which the clamp tray is transported to the film lifting area in the conveyor module of the film bonding module.

圖33至圖37示出了在膜結合模組的膜升降模組中從夾具托盤分離離型膜的過程。Figures 33 to 37 show the process of separating the release film from the clamp tray in the film lifting module of the film bonding module.

圖38至圖42示出了在膜結合模組的膜搬動模組中離型膜被裝載於料盒的過程。38 to 42 show the process of loading the release film into the material box in the film moving module of the film bonding module.

圖43至圖44示出了裝載有離型膜的料盒被輸送到料盒裝載單元的過程。43 to 44 show a process in which a material box loaded with a release film is transported to a material box loading unit.

圖45示出了根據本發明的另一實施例的包括膜結合模組的半導體條帶切割以及分類裝備。Figure 45 shows a semiconductor strip cutting and sorting equipment including a film bonding module according to another embodiment of the present invention.

1:半導體條帶切割以及分類裝備 1: Semiconductor strip cutting and sorting equipment

5:裝載單元 5: Loading unit

10:切割單元 10: Cutting unit

102:料盒裝載器 102: Material box loader

104:入口軌道 104:Entrance track

106:條帶拾取器 106: Strip Picker

108:卡盤台 108: Chuck table

110:切削模組 110: Cutting module

112:單元拾取器 112: Unit Pickup

114:清洗單元 114: Cleaning unit

116:緩衝台 116: Buffer station

118:緩衝拾取器 118: Buffer Pickup

120:水平導向部件 120: Horizontal guide component

20:分類單元 20: Classification unit

202:翻轉台 202: Turntable

204:托盤台 204:Pallet table

206:工作台驅動部 206: Workbench drive unit

208:球體視覺檢查部 208: Spherical Vision Examination Department

210:標記視覺檢查部 210: Marking visual inspection department

212:上門架 212: Door frame

214:對準視覺檢查部 214: Alignment with the visual inspection unit

216:水平導向部件 216: Horizontal guide component

218:晶片拾取器 218: Wafer Picker

220:托盤輸送部 220: Pallet conveyor

222:第一水平導向部件 222: First horizontal guide component

224:第二水平導向部件 224: Second horizontal guide component

226:托盤拾取器 226:Tray Picker

228:良品托盤保管部 228: Good product pallet storage department

230:重工托盤保管部 230: Heavy Industry Pallet Storage Department

232:托盤裝載器 232:Tray loader

30:膜結合模組 30: Membrane binding module

400:離型膜 400: Release film

MZ1:條帶料盒 MZ1: Strip material box

S:半導體條帶 S: Semiconductor strip

Claims (20)

一種半導體條帶切割以及分類裝備，包括： 裝載單元，供應半導體條帶； 切割單元，切割從該裝載單元供應的該半導體條帶而將該半導體條帶單個化為複數個半導體封裝體； 分類單元，檢查單個化的該等半導體封裝體，並根據檢查結果將該等半導體封裝體分類而粘合於離型膜；以及 膜結合模組，與該分類單元相鄰設置，並將夾具托盤和該離型膜結合而供應於該分類單元，並且分離從該分類單元回收的該夾具托盤和該離型膜。 A semiconductor strip cutting and sorting equipment comprises: a loading unit for supplying semiconductor strips; a cutting unit for cutting the semiconductor strips supplied from the loading unit and singulating the semiconductor strips into a plurality of semiconductor packages; a sorting unit for inspecting the singulated semiconductor packages and classifying the semiconductor packages according to the inspection results and bonding them to release films; and a film bonding module, which is disposed adjacent to the sorting unit, and combines a clamp tray and the release film and supplies them to the sorting unit, and separates the clamp tray and the release film recovered from the sorting unit. 如請求項1之半導體條帶切割以及分類裝備，其中， 該膜結合模組收取裝載有該離型膜的料盒，從而將該離型膜結合於該夾具托盤並供應於該分類單元， 該膜結合模組從該夾具托盤分離粘合有該等半導體封裝體的該離型膜而裝載於該料盒， 該膜結合模組排出裝載有粘合有該等半導體封裝體的該離型膜的該料盒。 The semiconductor strip cutting and sorting equipment as claimed in claim 1, wherein, the film bonding module receives the material box loaded with the release film, thereby bonding the release film to the clamp tray and supplying it to the sorting unit, the film bonding module separates the release film bonded with the semiconductor packages from the clamp tray and loads it into the material box, the film bonding module discharges the material box loaded with the release film bonded with the semiconductor packages. 如請求項1之半導體條帶切割以及分類裝備，其中， 具有磁性的框架附著於該離型膜的外圍部， 該框架和該夾具托盤構成為通過磁力結合。 The semiconductor strip cutting and sorting equipment as claimed in claim 1, wherein, a magnetic frame is attached to the outer periphery of the release film, and the frame and the clamp tray are configured to be combined by magnetic force. 如請求項1之半導體條帶切割以及分類裝備，其中， 該分類單元包括： 晶片拾取器，沿著第一水平方向移動，並從托盤台拾取半導體封裝體，並根據檢查結果將該等半導體封裝體附著於該離型膜； 托盤輸送部，沿著與該第一水平方向垂直的第二水平方向移動，並輸送結合有該離型膜的夾具托盤； 托盤拾取器，在上方拾取該夾具托盤並輸送該夾具托盤；以及 托盤裝載器，保管該夾具托盤。 The semiconductor strip cutting and sorting equipment as claimed in claim 1, wherein, the sorting unit comprises: a wafer picker, which moves along a first horizontal direction, picks up semiconductor packages from a tray table, and attaches the semiconductor packages to the release film according to the inspection result; a tray conveyor, which moves along a second horizontal direction perpendicular to the first horizontal direction, and conveys a fixture tray combined with the release film; a tray picker, which picks up the fixture tray from above and conveys the fixture tray; and a tray loader, which keeps the fixture tray. 如請求項4之半導體條帶切割以及分類裝備，其中， 該膜結合模組設置於該托盤拾取器的移動路徑。 The semiconductor strip cutting and sorting equipment as claimed in claim 4, wherein the film bonding module is arranged in the moving path of the tray picker. 如請求項4之半導體條帶切割以及分類裝備，其中， 該托盤拾取器將與附著有該等半導體封裝體的該離型膜結合的該夾具托盤從該托盤輸送部輸送到該托盤裝載器， 該托盤拾取器在該膜結合模組中將其它夾具托盤從該膜結合模組輸送到該托盤輸送部， 該托盤拾取器將該夾具托盤從該托盤裝載器輸送到該膜結合模組。 The semiconductor strip cutting and sorting equipment as claimed in claim 4, wherein, the tray picker transports the fixture tray bonded with the release film to which the semiconductor packages are attached from the tray conveying section to the tray loader, the tray picker transports other fixture trays from the film bonding module to the tray conveying section in the film bonding module, the tray picker transports the fixture tray from the tray loader to the film bonding module. 一種膜結合模組，設置於半導體條帶切割以及分類裝備的分類單元，並將夾具托盤和離型膜結合而供應於該分類單元，並且分離從該分類單元回收的該夾具托盤和該離型膜，其中， 該膜結合模組包括： 料盒裝載器模組，被投入容納該離型膜的料盒； 膜搬動模組，從該料盒取出該離型膜並將該離型膜投入到該料盒； 膜升降模組，通過以吸附該離型膜的狀態進行升降而使該離型膜和該夾具托盤附著或者分離；以及 輸送器模組，搬送附著有該離型膜的該夾具托盤。 A film bonding module is provided in a sorting unit of a semiconductor strip cutting and sorting device, and combines a clamp tray and a release film and supplies them to the sorting unit, and separates the clamp tray and the release film recovered from the sorting unit, wherein, The film bonding module includes: A material box loader module, into which a material box containing the release film is put; A film moving module, which takes out the release film from the material box and puts the release film into the material box; A film lifting module, which attaches or separates the release film and the clamp tray by lifting in a state of adsorbing the release film; and A conveyor module, which transports the clamp tray with the release film attached. 如請求項7之膜結合模組，其中， 具有磁性的框架附著於該離型膜的外圍部， 該框架和該夾具托盤構成為通過磁力結合。 A film bonding module as claimed in claim 7, wherein a magnetic frame is attached to the outer periphery of the release film, and the frame and the clamp tray are configured to be bonded by magnetic force. 如請求項7之膜結合模組，其中， 該料盒裝載器模組包括： 料盒裝載單元，投入以及排出容納該離型膜的料盒； 料盒升降單元，夾持該料盒而使該料盒上升或者下降；以及 推動器單元，從該料盒推出該離型膜。 The film bonding module of claim 7, wherein, the material box loader module comprises: a material box loading unit for inserting and discharging a material box containing the release film; a material box lifting unit for clamping the material box to raise or lower the material box; and a pusher unit for pushing the release film out of the material box. 如請求項7之膜結合模組，其中， 該膜搬動模組包括： 膜導向單元，引導該離型膜的移動路徑；以及 膜輸送單元，夾持該離型膜並使該離型膜沿著該移動路徑移動。 The membrane bonding module of claim 7, wherein, the membrane moving module comprises: a membrane guiding unit for guiding the moving path of the release film; and a membrane transporting unit for clamping the release film and moving the release film along the moving path. 如請求項10之膜結合模組，其中， 該膜導向單元包括： 一對導軌部件，構成為能夠在彼此相反方向上移動。 A membrane-bonded module as claimed in claim 10, wherein the membrane guide unit comprises: a pair of guide rail components configured to be movable in opposite directions to each other. 如請求項11之膜結合模組，其中， 該一對導軌部件構成為： 當沿著水平方向輸送該離型膜時，該一對導軌部件在彼此接近的方向上移動而引導該離型膜的移動， 當該離型膜上升或者下降時，該一對導軌部件在彼此遠離的方向上移動而避免與該離型膜的干擾。 The membrane bonding module of claim 11, wherein, the pair of guide rail components are configured as follows: when the release film is transported in the horizontal direction, the pair of guide rail components move in directions approaching each other to guide the movement of the release film, when the release film rises or falls, the pair of guide rail components move in directions away from each other to avoid interference with the release film. 如請求項11之膜結合模組，其中， 該膜輸送單元從該料盒夾持該離型膜並將該離型膜沿著該導軌部件輸送到膜升降區域，並且將附著有半導體封裝體的該離型膜從該膜升降區域輸送到該料盒。 The film bonding module of claim 11, wherein, the film transport unit clamps the release film from the material box and transports the release film along the guide rail component to the film lifting area, and transports the release film with the semiconductor package attached thereto from the film lifting area to the material box. 如請求項7之膜結合模組，其中， 該膜升降模組包括： 升降主體，具有一定的面積並構成為在膜升降區域的下升降位置和上升降位置之間進行升降；以及 複數個真空吸附單元，形成在該升降主體的上方。 The membrane bonding module of claim 7, wherein, the membrane lifting module comprises: a lifting body having a certain area and configured to be lifted between a lower lifting position and an upper lifting position in a membrane lifting area; and a plurality of vacuum adsorption units formed above the lifting body. 如請求項14之膜結合模組，其中， 該等真空吸附單元在該升降主體中設置於與形成於該夾具托盤的複數個貫通孔相對應的位置而構成為穿過該夾具托盤的該等貫通孔。 The membrane bonding module of claim 14, wherein the vacuum adsorption units are arranged in the lifting body at positions corresponding to the plurality of through holes formed in the clamp tray and are configured to pass through the through holes in the clamp tray. 如請求項14之膜結合模組，其中， 若該離型膜位於該上升降位置，則該膜升降模組上升到該膜升降區域的該上升降位置而吸附該離型膜，並在吸附該離型膜的狀態下從該上升降位置下降到該下升降位置而使該離型膜和該夾具托盤結合。 The film bonding module of claim 14, wherein, if the release film is located at the upper lifting position, the film lifting module rises to the upper lifting position of the film lifting area to adsorb the release film, and descends from the upper lifting position to the lower lifting position while adsorbing the release film to bond the release film to the clamp tray. 如請求項16之膜結合模組，其中， 若與附著有半導體封裝體的該離型膜結合的該夾具托盤位於該下升降位置，則該膜升降模組上升到該上升降位置而從該夾具托盤分離該離型膜， 若該離型膜在該上升降位置定位，則該膜升降模組解除真空吸附並下降到該下升降位置。 The film bonding module of claim 16, wherein, if the fixture tray bonded to the release film with the semiconductor package attached is located at the lower lifting position, the film lifting module rises to the upper lifting position to separate the release film from the fixture tray, and if the release film is positioned at the upper lifting position, the film lifting module releases the vacuum adsorption and descends to the lower lifting position. 如請求項7之膜結合模組，其中， 該輸送器模組將附著有該離型膜的該夾具托盤從膜升降區域輸送到托盤拾取區域，並將與位於該托盤拾取區域的粘合有半導體封裝體的該離型膜結合的該夾具托盤輸送到該膜升降區域。 The film bonding module of claim 7, wherein, the conveyor module transports the clamp tray with the release film attached thereto from the film lifting area to the tray picking area, and transports the clamp tray bonded with the release film with the semiconductor package body bonded thereto located in the tray picking area to the film lifting area. 一種半導體條帶切割以及分類裝備，包括： 裝載單元，用於供應半導體條帶； 切割單元，切割從該裝載單元供應的該半導體條帶而將該半導體條帶單個化為複數個半導體封裝體； 分類單元，檢查單個化的該等半導體封裝體，並根據檢查結果將該等半導體封裝體分類而粘合於離型膜；以及 膜結合模組，能夠拆裝地設置於該分類單元，並將夾具托盤和該離型膜結合而供應於該分類單元，並且分離從該分類單元回收的該夾具托盤和該離型膜， 該膜結合模組包括： 料盒裝載器模組，被投入容納該離型膜的料盒； 膜搬動模組，從該料盒取出該離型膜； 膜升降模組，通過以吸附該離型膜的狀態進行升降而使該離型膜和該夾具托盤附著或者分離；以及 輸送器模組，搬送附著有該離型膜的該夾具托盤。 A semiconductor strip cutting and sorting device, comprising: A loading unit for supplying semiconductor strips; A cutting unit for cutting the semiconductor strips supplied from the loading unit and singulating the semiconductor strips into a plurality of semiconductor packages; A sorting unit for inspecting the singulated semiconductor packages and classifying the semiconductor packages according to the inspection results and bonding them to release films; and A film bonding module, which can be detachably arranged in the sorting unit, and combines a clamp tray and the release film and supplies them to the sorting unit, and separates the clamp tray and the release film recovered from the sorting unit, The film bonding module comprises: A material box loader module, into which a material box containing the release film is put; A film transport module, which takes out the release film from the material box; A film lifting module, which attaches or separates the release film and the clamp tray by lifting and lowering the release film while adsorbing the release film; and A conveyor module, which transports the clamp tray with the release film attached. 如請求項19之半導體條帶切割以及分類裝備，其中， 該分類單元包括： 晶片拾取器，沿著第一水平方向移動，並從托盤台拾取半導體封裝體，並根據檢查結果將該等半導體封裝體附著於該離型膜； 托盤輸送部，沿著導向部件移動，並輸送結合有該離型膜的夾具托盤，該導向部件沿著與該第一水平方向垂直的第二水平方向延伸； 托盤拾取器，在上方拾取該夾具托盤並輸送該夾具托盤；以及 托盤裝載器，保管該夾具托盤。 The semiconductor strip cutting and sorting equipment of claim 19, wherein, the sorting unit comprises: a wafer picker, which moves along a first horizontal direction and picks up semiconductor packages from a tray table, and attaches the semiconductor packages to the release film according to the inspection result; a tray conveyor, which moves along a guide component and conveys a fixture tray combined with the release film, the guide component extending along a second horizontal direction perpendicular to the first horizontal direction; a tray picker, which picks up the fixture tray from above and conveys the fixture tray; and a tray loader, which keeps the fixture tray.
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