TWI871716B - Ceramic wiring component motherboard and ceramic wiring component - Google Patents

Abstract

The ceramic wiring component mother substrate (100) is filled with a plurality of rectangular ceramic wiring components (110, 120) when viewed in the thickness direction and connected into one body. The plurality of ceramic wiring components (110, 120) include a first ceramic wiring component (110) and a second ceramic wiring component (120). The first ceramic wiring component (110) and the second ceramic wiring component (120) are arranged so that "the first side (111) of the first ceramic wiring component (110) and the second side (121) of the second ceramic wiring component (120) partially overlap". In the area where the first side (111) and the second side (121) overlap, a first through hole (131) and a first through hole conductor (28) are formed. The first ceramic wiring member (110) and the second ceramic wiring member (120) are arranged "point-symmetrically with respect to the first through-hole conductor (28)".

Description

Ceramic wiring component motherboard and ceramic wiring component

The present invention relates to a ceramic wiring component mother substrate and a ceramic wiring component.

A ceramic wiring component is known, which includes: a ceramic body having a plate-shaped portion; and a conductive portion contacting and arranged on the plate-shaped portion. This ceramic wiring component is used as a component for holding electronic components. The conductive portion constitutes a part of a path of current to or from the electronic components. From the perspective of improving the efficiency of the manufacturing process, this type of ceramic wiring component can be manufactured by: manufacturing a "ceramic wiring component mother substrate on which a plurality of ceramic wiring components are laid and connected into one body", and then dividing the mother substrate into a plurality of single-chip ceramic wiring components (see, for example, International Publication No. 2017/126596 (Patent Document 1), Japanese Patent Publication No. 2000-312060 (Patent Document 2), and Japanese Patent Publication No. 2016-66676 (Patent Document 3)).

[Prior Art Literature] [Patent Literature]

[Patent Document 1] International Publication No. 2017/126596

[Patent Document 2] Japanese Patent Publication No. 2000-312060

[Patent Document 3] Japanese Patent Publication No. 2016-66676

A ceramic wiring component is known, which includes: a main body portion made of ceramic having a plate-like portion; and a conductive portion arranged in contact with the plate-like portion, and having a rectangular shape when viewed in a direction perpendicular to the plate-like portion. This ceramic wiring component may have the following structure: the conductive portion, in a plan view on its upper surface, includes a frame-like portion arranged in a ring shape on the main body portion along the outer periphery of the rectangle; and in a plan view on its lower surface, includes a grounding terminal arranged on the main body portion. In a ceramic wiring component of this structure, electronic components such as crystal elements are stored in the space on the plate-like portion that is sealed by a metal cover portion joined to the frame-like portion. In addition, the grounding of the cover portion can be ensured by electrically connecting the frame-like portion to the grounding terminal. The electrical connection between the frame-shaped part and the ground terminal can be achieved, for example, by forming a through hole that penetrates the main body from the frame-shaped part to the ground terminal and filling the through hole with a conductive body.

In response to the recent demand for miniaturization of electronic equipment, ceramic wiring components are also required to be miniaturized. In order to miniaturize ceramic wiring components, the width of the frame-shaped portion must be reduced. As a result, the formation of the through hole will make it difficult to achieve electrical connection between the frame-shaped portion and the ground terminal. In this regard, the following countermeasures can be adopted: by forming a groove from the frame-shaped portion to the ground terminal on the outer periphery of the main body to replace the through hole, and arranging a conductor on the wall of the groove to achieve electrical connection between the frame-shaped portion and the ground terminal.

When manufacturing such a ceramic wiring component by the manufacturing process of the above-mentioned ceramic wiring component mother substrate in advance, the following process can be adopted: after manufacturing a ceramic wiring component mother substrate in which the ceramic wiring components are laid out in a matrix shape in a manner that four ceramic wiring components share the vertices of a rectangle, through holes are formed at positions corresponding to the vertices of the rectangle, and a conductor is arranged on the wall surface surrounding the through hole. Then, by dividing into ceramic wiring components along the outer periphery of the rectangle, the ceramic wiring component can be manufactured.

However, according to the review of the inventors of this case, when the above-mentioned procedure is adopted, the problem of the conductor arranged on the wall surface surrounding the through-hole falling off may occur when it is divided into ceramic wiring components. This can be regarded as that the conductor located at the vertex of the rectangle is separated into four parts due to the division, and the contact area between the wall surface of the through-hole and the conductor is reduced, making it easy to fall off. The falling off of the conductor leads to a decrease in the reliability of the electrical connection between the frame-shaped part and the ground terminal. On the other hand, by forming the above-mentioned through-hole and the conductor at a position corresponding to the side far from the vertex of the rectangle (rather than forming it at the vertex of the rectangle), the contact area between the conductor and the wall surface of the through-hole will increase, and the falling off of the conductor can be suppressed. However, when two ceramic wiring components that share the above-mentioned through-holes and conductors in the state of a ceramic wiring component mother substrate are separated into left and right sides, for example, a ceramic wiring component with a conductor on the left side and a ceramic wiring component with a conductor on the right side are obtained, resulting in two ceramic wiring components with different structures. In the manufacture of ceramic wiring components, it is preferable to mass-produce products with the same structure. Therefore, due to the manufacture of two ceramic wiring components with different structures, it is necessary to manage the structure of the ceramic wiring components, which creates an obstacle to improving the efficiency of the manufacturing process.

The purpose of the present invention is to solve the above-mentioned problems. One of the purposes of the present invention is to provide a ceramic wiring component mother substrate and a ceramic wiring component that can maintain the reliability of the electrical connection between the frame-shaped portion and the ground terminal and can improve the efficiency of the manufacturing process.

According to the ceramic wiring component mother substrate of the present invention, it has a surface in the thickness direction, namely the first surface, and a surface on the opposite side of the first surface in the thickness direction, namely the second surface. When viewed in the thickness direction, a plurality of rectangular ceramic wiring components are laid and connected into one body. The plurality of ceramic wiring components include a first ceramic wiring component and a second ceramic wiring component connected to the first ceramic wiring component.

The first ceramic wiring member and the second ceramic wiring member respectively include: a ceramic body having a plate-shaped portion; and a conductive portion contacting and arranged on the body. In the plan view of the first side, the conductive portion includes a frame-shaped portion arranged in a ring shape on the body along the outer periphery of the rectangle, and a pair of internal terminals arranged on the area of the body surrounded by the frame-shaped portion; in the plan view of the second side, it includes a pair of external terminals separated from each other and arranged on the body, and a ground terminal separated from the pair of external terminals and arranged on the body. One of the pair of internal terminals is electrically connected to one of the pair of external terminals. The other of the pair of internal terminals is electrically connected to the other of the pair of external terminals.

On at least one of the first surface and the second surface, there are formed disconnected grooves extending along the sides of the above-mentioned rectangle of the adjacent plurality of ceramic wiring components. The first ceramic wiring component and the second ceramic wiring component are arranged so that "one side of the rectangle of the first ceramic wiring component, namely the first side, partially overlaps with one side of the rectangle of the second ceramic wiring component, namely the second side, and the two ends of the first side and the two ends of the second side do not overlap." In the area where the first side and the second side overlap, there is formed a first through hole that penetrates the ceramic wiring component mother substrate in the thickness direction. The conductive part further includes a first through hole conductor, which is formed on the wall surface surrounding the first through hole, and connects the ground terminals of the first ceramic wiring component and the second ceramic wiring component to the frame-like parts of the first ceramic wiring component and the second ceramic wiring component. The first ceramic wiring component and the second ceramic wiring component are arranged point-symmetrically with respect to the first through-hole conductor when viewed in the thickness direction of the ceramic wiring component mother substrate. The plurality of ceramic wiring components are constructed by filling the first ceramic wiring component and the second ceramic wiring component connected to each other without any gaps.

The ceramic wiring component according to the present invention includes: a ceramic body having a plate-shaped portion; and a conductive portion that contacts and is arranged on the body and is rectangular when viewed in a direction perpendicular to the plate-shaped portion. The plate-shaped portion has a main surface in the thickness direction, namely the first main surface, and a second main surface located on the opposite side of the first main surface in the thickness direction. In the plan view on the first main surface side, the conductive portion includes a frame-shaped portion arranged in a ring shape on the body along the outer periphery of the rectangle, and a pair of internal terminals arranged on the area of the body surrounded by the frame-shaped portion; in the plan view on the second main surface side, it includes a pair of external terminals that are separated from each other and arranged on the body, and a ground terminal that is separated from the pair of external terminals and arranged on the body.

One of the pair of internal terminals is electrically connected to one of the pair of external terminals. The other of the pair of internal terminals is electrically connected to the other of the pair of external terminals. A first groove portion is formed on the outer periphery of the main body portion, which penetrates the main body portion in the thickness direction and is away from the vertex of the rectangle. The conductive portion further includes a first through-hole conductor formed on the wall surface of the first groove portion and connecting the ground terminal to the frame-shaped portion. In a plan view of at least one of the first main surface side and the second main surface side, a first notch portion is formed on the outer periphery of the ceramic wiring component, which is away from the vertex and is formed on the side of the rectangle formed by the first groove portion, that is, the third side; and a second notch portion is formed on the fourth side opposite to the third side, which is away from the vertex. The first notch portion and the second notch portion are located on the same straight line that is orthogonal to the third side and the fourth side. In addition, in this application, "rectangle" includes "square".

According to the above-mentioned ceramic wiring component mother substrate and ceramic wiring component, a ceramic wiring component mother substrate and ceramic wiring component that can maintain the reliability of the electrical connection between the frame-shaped portion and the ground terminal and can achieve improved efficiency of the manufacturing process can be provided.

1: Ceramic wiring components

10: Main body

11: Plate-shaped part

11A: 1st main surface

11B: Second main surface

12: Frame

12A: 1st end face

12B: 2nd end face

20: Conductive part

21: Frame-shaped part

22: Internal terminal

23: External terminal

24: Ground terminal

25: Second through-hole conductor

26: 1st connection part

27: 3rd through-hole conductor

28: 1st through-hole conductor

29: Second connection part

31: First groove

41: The first gap

42: The second gap

43: The third gap

44: The 4th gap

45: The 5th gap

46: The 6th gap

50: Hole

71: Edge

72: Edge

73: Edge

74: Edge

91: Straight line

100: Ceramic wiring component motherboard

100A: Page 1

100B: Page 2

110: No. 1 ceramic wiring component

111: Edge

111A: End

111B: End

112: Edge

113: Edge

114: Edge

120: Second ceramic wiring component

121: Edge

121A: End

121B: End

122: Edge

123: Edge

124: Edge

131: 1st through hole

151: Break the Gap

161: 1st perforation

191: Straight line

192: Straight line

d: depth

t: thickness

w: width

X: Direction

Y: Direction

Z: Direction

Figure 1 is a schematic plan view of the first side of the ceramic wiring component mother substrate of embodiment 1.

Figure 2 is a schematic plan view of the second side of the ceramic wiring component mother substrate of embodiment 1.

Figure 3 is a schematic plan view of the upper surface of the ceramic wiring component.

Figure 4 is a schematic side view of a ceramic wiring component.

Figure 5 is a schematic cross-sectional view along line segment V-V of Figures 3 and 6.

Figure 6 is a schematic plan view of the lower surface of the ceramic wiring component.

Figure 7 is a schematic side view of a ceramic wiring component.

Figure 8 is a schematic cross-sectional view along line segment VIII-VIII of Figures 3 and 6.

FIG9 is a schematic plan view of the first surface side of the ceramic wiring component mother substrate of embodiment 2.

FIG10 is a schematic plan view of the second surface of the ceramic wiring component mother substrate of embodiment 2.

[Form used to implement the invention] [Overview of implementation form]

First, the implementation of the present invention is described by way of example. The ceramic wiring component mother substrate of the present invention has a surface in the thickness direction, namely the first surface, and a surface on the opposite side of the first surface in the thickness direction, namely the second surface. When viewed in the thickness direction, a plurality of rectangular ceramic wiring components are laid and connected into one body. The plurality of ceramic wiring components include a first ceramic wiring component and a second ceramic wiring component connected to the first ceramic wiring component.

The first ceramic wiring member and the second ceramic wiring member respectively include: a ceramic body having a plate-shaped portion; and a conductive portion contacting and arranged on the body. In the plan view of the first side, the conductive portion includes a frame-shaped portion arranged in a ring shape on the body along the outer periphery of the rectangle, and a pair of internal terminals arranged on the area of the body surrounded by the frame-shaped portion; in the plan view of the second side, it includes a pair of external terminals separated from each other and arranged on the body, and a ground terminal separated from the pair of external terminals and arranged on the body. One of the pair of internal terminals is electrically connected to one of the pair of external terminals. The other of the pair of internal terminals is electrically connected to the other of the pair of external terminals.

On at least one of the first surface and the second surface, there are formed disconnected grooves extending along the sides of the above-mentioned rectangle of the adjacent plurality of ceramic wiring components. The first ceramic wiring component and the second ceramic wiring component are arranged so that "one side of the rectangle of the first ceramic wiring component, namely the first side, partially overlaps with one side of the rectangle of the second ceramic wiring component, namely the second side, and the two ends of the first side and the two ends of the second side do not overlap." In the area where the first side and the second side overlap, there is formed a first through hole that penetrates the ceramic wiring component mother substrate in the thickness direction. The conductive part further includes a first through hole conductor, which is formed on the wall surface surrounding the first through hole, and connects the ground terminals of the first ceramic wiring component and the second ceramic wiring component to the frame-like parts of the first ceramic wiring component and the second ceramic wiring component. The first ceramic wiring component and the second ceramic wiring component are arranged point-symmetrically with respect to the first through-hole conductor when viewed in the thickness direction of the ceramic wiring component mother substrate. The plurality of ceramic wiring components are constructed by filling the first ceramic wiring component and the second ceramic wiring component connected to each other without any gaps.

In the ceramic wiring component mother substrate of the present invention, a first through hole is formed in the area where the first side of the first ceramic wiring component and the second side of the second ceramic wiring component overlap, and the ground terminal and the frame-shaped portion are connected by the first through hole conductor formed on the wall surface surrounding the first through hole. In this way, by arranging the first through hole and the first through hole conductor at a position corresponding to the side of the rectangle (not the vertex of the rectangle), when the first ceramic wiring component and the second ceramic wiring component are separated along the first side and the second side, the contact area between the first through hole conductor and the wall surface of the through hole is increased, and the first through hole conductor can be suppressed from falling off. Furthermore, the first ceramic wiring member and the second ceramic wiring member are staggered with the first side and the second side partially overlapping, and are arranged to be point-symmetrical with respect to the first through-hole conductor, thereby forming the first ceramic wiring member and the second ceramic wiring member after separation into ceramic wiring members having the same structure. As a result, the efficiency of the manufacturing process can be improved.

In this way, according to the ceramic wiring component mother substrate of the present invention, the reliability of the electrical connection between the frame portion and the ground terminal can be maintained, and the efficiency of the manufacturing process can be improved.

In the above-mentioned ceramic wiring component mother substrate, the first through hole penetrating from the first surface to the second surface can also be formed at each vertex of the rectangle of the plurality of ceramic wiring components. With this structure, even if there is some error in the formation position of the disconnected grooves extending along each side of the rectangle, the disconnected grooves extending perpendicularly to each other can be connected to each other at the desired position.

In the plan view of the first side of the ceramic wiring component mother substrate, a pair of internal terminals of the first ceramic wiring component and a pair of internal terminals of the second ceramic wiring component can also be arranged in opposite directions along the first side and the second side in the area surrounded by the frame-shaped portion. With this structure, even if "the internal terminals are arranged offset due to the structure of the electronic components to be fixed to the ceramic wiring component", the efficiency of the manufacturing process can be improved.

The ceramic wiring component of the present invention includes: a ceramic body having a plate-shaped portion; and a conductive portion that contacts and is arranged on the body and is rectangular when viewed in a direction perpendicular to the plate-shaped portion. The plate-shaped portion has a main surface in the thickness direction, namely the first main surface, and a second main surface located on the opposite side of the first main surface in the thickness direction. In the plan view on the first main surface side, the conductive portion includes a frame-shaped portion arranged in a ring shape on the body along the outer periphery of the rectangle, and a pair of internal terminals arranged on the area of the body surrounded by the frame-shaped portion; in the plan view on the second main surface side, it includes a pair of external terminals that are separated from each other and arranged on the body, and a ground terminal that is separated from the pair of external terminals and arranged on the body.

One of the pair of internal terminals is electrically connected to one of the pair of external terminals. The other of the pair of internal terminals is electrically connected to the other of the pair of external terminals. A first groove portion penetrating the body portion in the thickness direction is formed on the outer periphery of the body portion away from the vertex of the rectangle. The conductive portion further includes a first through-hole conductor formed on the wall surface of the first groove portion and connecting the ground terminal to the frame-shaped portion. In a plan view of at least one of the first main surface side and the second main surface side, a first notch portion is formed on the outer periphery of the ceramic wiring member away from the vertex and formed on the side of the rectangle formed by the first groove portion, that is, the third side; and a second notch portion is formed on the fourth side opposite to the third side away from the vertex. The first notch and the second notch are located on the same straight line that is orthogonal to the third side and the fourth side.

By dividing the ceramic wiring component mother substrate of the present invention into ceramic wiring components along the disconnection groove, the reliability of the electrical connection between the frame-shaped portion and the ground terminal can be maintained, and the ceramic wiring component of the present invention can be manufactured with good efficiency. Here, the first notch portion and the second notch portion are formed corresponding to the area of the disconnection groove branch of the ceramic wiring component mother substrate.

In the above-mentioned ceramic wiring component, the first notch and the second notch can also penetrate the ceramic wiring component in the thickness direction of the main body. Such first notch and second notch are formed by forming a first through hole in the above-mentioned ceramic wiring component mother substrate. With this structure, since the disconnected grooves extending perpendicularly to each other can be connected to each other at a desired position in the above-mentioned ceramic wiring component mother substrate, the uneven shape of the ceramic wiring component can be suppressed.

In the above-mentioned ceramic wiring component, the first notch and the second notch can also be arranged in a direction offset along the third side and the fourth side. According to this structure, by mounting the electronic component on the ceramic wiring component and sealing it with a cover, even when the electronic component cannot be visually identified, the direction of the electronic component can be grasped by the first notch and the second notch.

[Specific examples of implementation forms]

Next, the specific implementation forms of the ceramic wiring component mother substrate and the ceramic wiring component of the present invention are described while referring to the drawings. In the following drawings, the same reference symbols are attached to the same or equivalent parts, and the description is not repeated.

(Implementation form 1)

FIG. 1 is a schematic plan view of the first side of the mother substrate of a ceramic wiring component of an embodiment of the present invention, namely, embodiment 1. FIG. 2 is a schematic plan view of the second side of the mother substrate of a ceramic wiring component of embodiment 1. FIG. 3 is a schematic plan view of the upper surface side of the ceramic wiring component. FIG. 4 is a schematic side view of the ceramic wiring component. FIG. 5 is a schematic cross-sectional view along the line segment V-V of FIG. 3 and FIG. 6. FIG. 6 is a schematic plan view of the lower surface side of the ceramic wiring component. FIG. 7 is a schematic side view of the ceramic wiring component. FIG. 8 is a schematic cross-sectional view along the line segment VIII-VIII of FIG. 3 and FIG. 6.

Referring to FIG. 1 and FIG. 2 , the ceramic wiring component mother substrate 100 of the present embodiment has a surface in the thickness direction (Z-axis direction), namely, a first surface 100A (see FIG. 1 ), and a surface on the opposite side of the first surface 100A in the thickness direction, namely, a second surface 100B (see FIG. 2 ). The ceramic wiring component mother substrate 100 has a structure in which a plurality of ceramic wiring components 110 and 120 in a rectangular shape are laid and connected into one body when viewed in the thickness direction (viewed along the Z-axis direction). The plurality of ceramic wiring components 110 and 120 include a first ceramic wiring component 110 and a second ceramic wiring component 120 connected to the first ceramic wiring component 110 . Although the first ceramic wiring member 110 and the second ceramic wiring member 120 are arranged in different directions in the ceramic wiring member mother substrate 100, as described below based on Figures 3 to 8, they are ceramic wiring members 1 having the same structure.

Referring to Fig. 3 to Fig. 8, the ceramic wiring member 1 (the first ceramic wiring member 110 and the second ceramic wiring member 120 respectively) includes a main body 10 made of ceramic and a conductive part 20 contacting and arranged on the main body 10. The ceramic constituting the main body 10 is not particularly limited, and alumina (alumina) can be used, for example. The main body 10 includes a plate-like part 11 in a flat plate shape, and a frame 12. The plate-like part 11 is rectangular when viewed in the thickness direction (Z-axis direction). The plate-like part 11 includes a first main surface 11A and a second main surface 11B located on the reverse side of the first main surface 11A in the thickness direction. The thickness t of the main body 10 can be, for example, greater than 0.1 mm and less than 0.6 mm.

The frame 12 is in the shape of a frame rising from the outer edge of the first main surface 11A of the plate-like portion 11. More specifically, it is in the shape of a ring along the outer edge of the first main surface 11A of the plate-like portion 11 whose plane shape is a rectangle. When viewed in a direction perpendicular to the first main surface 11A, the frame 12 surrounds the space on the first main surface 11A, i.e., the cavity 50. The frame 12 includes a planar first end surface 12A and a planar end surface on the opposite side of the first end surface 12A in the thickness direction of the plate-like portion 11, i.e., a second end surface 12B. The frame 12 is connected to the first main surface 11A of the plate-like portion 11 at the second end surface 12B. The entire area of the first end surface 12A is located on a single plane. As a result, the cavity 50 can be closed by placing a flat cover member on the first end surface 12A. Electronic components such as crystal elements that require airtightness can be accommodated in the cavity 50. This ceramic wiring component 1 can be used as a ceramic package for accommodating electronic components. For example, when the electrodes coated on both sides of the crystal element are respectively connected to a pair of internal terminals 22, a crystal oscillator is formed.

The conductive portion 20 includes a frame-shaped portion 21, a pair of internal terminals 22, a pair of external terminals 23, a pair of ground terminals 24, a first through-hole conductor 28, a second through-hole conductor 25, a third through-hole conductor 27, a first connecting portion 26, and a second connecting portion 29. The frame-shaped portion 21 is arranged to cover the first end surface 12A of the frame body 12. The frame-shaped portion 21 is in a ring shape corresponding to the first end surface 12A of the frame body 12. That is, in the plan view of the first surface 100A side (the viewpoint of Figures 1 and 3), the frame-shaped portion 21 is arranged in a ring shape on the frame body 12 of the main body 10 along the outer periphery of the rectangular ceramic wiring component 1. A pair of internal terminals 22 are arranged in contact with the first main surface 11A of the plate-shaped portion 11 surrounded by the frame body 12. That is, in the plan view of the first surface 100A side, a pair of internal terminals 22 are arranged on the first main surface 11A of the plate-shaped portion 11 included in the main body 10 and on the area surrounded by the frame-shaped portion 21.

In addition, the frame 12 may be omitted. That is, the conductive portion 20 includes a frame-shaped portion 21, a pair of internal terminals 22, a pair of external terminals 23, a pair of ground terminals 24, a first through-hole conductor 28, a second through-hole conductor 25, a third through-hole conductor 27, a first connecting portion 26, and a second connecting portion 29. In the plan view on the first surface 100A side (the viewpoint of FIG. 1 and FIG. 3 ), the frame-shaped portion 21 is arranged in a ring shape on the first main surface 11A of the main body 10 (plate-shaped portion 11) along the outer periphery of the rectangular ceramic wiring component 1. The pair of internal terminals 22 are arranged in contact with the first main surface 11A. In the plan view on the first surface 100A side, the pair of internal terminals 22 are arranged on the first main surface 11A of the plate-shaped portion 11 included in the main body 10, in the area surrounded by the frame-shaped portion 21.

As a result, by placing a bathtub-shaped cover member having a cavity on the frame-shaped portion 21, electronic components such as crystal elements that require airtightness can be stored in the cavity of the cover member. This ceramic wiring member 1 can be used as a ceramic package for storing electronic components. For example, when the electrodes coated on both sides of the crystal element are connected to a pair of internal terminals 22, a crystal oscillator is formed.

A pair of external terminals 23 are arranged in contact with the second main surface 11B of the plate-like portion 11. That is, in the plan view on the second surface 100B side (the viewpoint of Figures 2 and 6), the pair of external terminals 23 are separated from each other and arranged on the second main surface 11B of the plate-like portion 11 included in the main body 10. A pair of grounding terminals 24 are separated from the pair of external terminals 23 and are arranged in contact with the second main surface 11B of the plate-like portion 11. That is, in the plan view on the second surface 100B side, a pair of grounding terminals 24 are separated from the pair of external terminals 23 and are arranged on the second main surface 11B of the plate-like portion 11 included in the main body 10. In the plan view on the second surface 100B side, the pair of external terminals 23 are arranged on one diagonal of the rectangle, and the pair of grounding terminals 24 are arranged on the other diagonal of the rectangle. A pair of external terminals 23 and a pair of ground terminals 24 are respectively arranged at the four corners of the rectangle. This terminal arrangement can easily carry out the wiring design of the external substrate on which the ceramic wiring component 1 is to be mounted.

The second through-hole conductor 25 is arranged from the first main surface 11A to the second main surface 11B of the plate-like portion 11. More specifically, the second through-hole conductor 25 is formed to fill the "through hole formed in the plate-like portion 11". The second through-hole conductor 25 is physically and electrically connected to one of a pair of external terminals 23 at the end portion on the second main surface 11B side of the plate-like portion 11. The first connecting portion 26 is formed on the first main surface 11A of the plate-like portion 11. The first connecting portion 26 connects one of a pair of internal terminals 22 to the second through-hole conductor 25. The second through-hole conductor 25 is physically and electrically connected to one of a pair of internal terminals 22 at the end portion on the first main surface 11A side of the plate-like portion 11. That is, one of the pair of internal terminals 22 and one of the pair of external terminals 23 are electrically connected through the first connecting portion 26 and the second through-hole conductor 25.

The third through-hole conductor 27 is arranged from the first main surface 11A to the second main surface 11B of the plate-like portion 11. More specifically, the third through-hole conductor 27 is formed to fill the through hole formed in the plate-like portion 11. The third through-hole conductor 27 is physically and electrically connected to the other of the pair of external terminals 23 at the end on the second main surface 11B side of the plate-like portion 11. The third through-hole conductor 27 is physically and electrically connected to the other of the pair of internal terminals 22 at the end on the first main surface 11A side of the plate-like portion 11. That is, the other of the pair of internal terminals 22 and the other of the pair of external terminals 23 are electrically connected through the third through-hole conductor 27.

The second connection portion 29 is electrically connected to a pair of grounding terminals 24 inside the plate-like portion 11. In addition, the second connection portion 29 can also be formed on the second main surface 11B of the plate-like portion 11. At this time, a portion of the second connection portion 29 in the long side direction is preferably covered with an insulator. In this way, when the grounding terminal 24 is soldered to the wiring of the external substrate, "poor connection between the grounding terminals 24 due to solder connection" can be prevented. In addition, the second connection portion 29 can also be omitted. At this time, the grounding terminal 24 not connected to the first through-hole conductor 28 does not have the grounding function. As a result, there is only one grounding terminal 24 with the grounding function.

Referring to Figures 1 and 2, disconnect grooves 151 extending along "each side of the rectangle of the adjacent plurality of ceramic wiring components 110, 120" are formed on the first surface 100A and the second surface 100B. In addition, in the present embodiment, disconnect grooves 151 are formed on both the first surface 100A and the second surface 100B, or one of them may be omitted. The ceramic wiring component mother substrate 100 may be divided along the disconnect grooves 151. The depth of the disconnect grooves 151 may be, for example, greater than 0.025 mm and less than 0.200 mm. In addition, a dummy portion made of the same material may be provided around the ceramic wiring component mother substrate 100. By providing the dummy portion, accidental damage to the ceramic wiring component mother substrate 100 can be prevented.

Next, the arrangement details of the plurality of ceramic wiring members 110 and 120 will be described with attention to the unit structure composed of the first ceramic wiring member 110 located at the center of the leftmost row of FIG. 1 and the second ceramic wiring member 120 located at the center of the second row from the leftmost. The first ceramic wiring member 110 includes a side 111 which is "a first side that is one side of the rectangle", a side 112 opposite to the side 111, a side 113 orthogonal to the side 111 and the side 112, and a side 114 opposite to the side 113. The sides 111 and 112 correspond to the long sides extending in the Y-axis direction. The sides 113 and 114 correspond to the short sides extending in the X-axis direction. The second ceramic wiring member 120 includes a side 121 which is "a side of a rectangle, namely the second side", a side 122 opposite to the side 121, a side 123 orthogonal to the side 121 and the side 122, and a side 124 opposite to the side 123. The sides 121 and 122 correspond to the long sides extending along the Y-axis direction. The sides 123 and 124 correspond to the short sides extending along the X-axis direction.

The first ceramic wiring component 110 and the second ceramic wiring component 120 are arranged so that the side 111 serving as the first side of the first ceramic wiring component 110 and the side 121 serving as the second side of the second ceramic wiring component 120 partially overlap, and the two ends 111A, 111B of the side 111 and the two ends 121A, 121B of the side 121 do not overlap. More specifically, the side 111 and the side 121 are arranged staggered in the Y-axis direction so that a portion equivalent to approximately half of their respective lengths overlaps. When the ceramic wiring component mother substrate 100 is divided along the break groove 151, the side 111 and the side 121 become "the side 71 serving as the third side of the ceramic wiring component 1" (refer to Figures 3 and 6). Similarly, side 112 and side 122 will become "side 72 as the fourth side of ceramic wiring member 1". Side 113 and side 123 will become side 73 of ceramic wiring member 1. Side 114 and side 124 will become side 74 of ceramic wiring member 1.

In the area where the side 111 as the first side and the side 121 as the second side overlap, a first through hole 131 is formed that penetrates the ceramic wiring component mother substrate 100 in the thickness direction. When the ceramic wiring component mother substrate 100 is divided along the break groove 151, the first through hole 131 becomes the first groove 31 of the ceramic wiring component 1 (refer to Figures 3, 4 and 6). The first groove 31 is formed on the outer periphery of the main body 10. The first groove 31 is far from the vertex of the rectangle and penetrates the main body 10 in the thickness direction. The first groove 31 penetrates the frame portion 21, the frame 12, the plate portion 11 and one of the pair of ground terminals 24.

1 and 2, the first through-hole conductor 28 is formed on the wall surface surrounding the first through-hole 131. In the present embodiment, the first through-hole conductor 28 fills the first through-hole 131. The first through-hole conductor 28 may not fill the first through-hole 131, but cover the wall surface of the first through-hole 131. The first through-hole conductor 28 physically and electrically connects "one of the pair of ground terminals 24 of the first ceramic wiring member 110 and the second ceramic wiring member 120" and "the frame-like portion 21 of the first ceramic wiring member 110 and the second ceramic wiring member 120". When the ceramic wiring component mother substrate 100 is divided along the break groove 151, the first through-hole conductor 28 of the ceramic wiring component mother substrate 100 becomes "the first through-hole conductor 28 formed on the wall surface defining the first groove portion 31" (refer to Figures 3, 4 and 6). The first through-hole conductor 28 physically and electrically connects one of the pair of ground terminals 24 to the frame portion 21.

1 and 2, a first through hole 161 is formed at each vertex of the rectangle of the plurality of ceramic wiring members 110 and 120, penetrating from the first surface 100A to the second surface 100B. The first through hole 161 is arranged on "a straight line 191 extending in the X-axis direction to include the short sides 113 and 114 of the first ceramic wiring member 110, and a straight line 192 extending in the X-axis direction to include the short sides 123 and 124 of the second ceramic wiring member 120". When the ceramic wiring component mother substrate 100 is divided along the break groove 151, the first through hole 161 becomes the first notch 41, the second notch 42, the third notch 43, the fourth notch 44, the fifth notch 45 and the sixth notch 46 (refer to Figures 3 and 6). The first notch 41 is formed away from the vertex and at "the side 71 as the third side formed by the first groove 31". The second notch 42 is formed away from the vertex and at "the side 72 as the fourth side opposite to the side 71". The third notch 43 is formed at "a position corresponding to the intersection of the side 71 and the side 74". The fourth notch 44 is formed at "a position corresponding to the intersection of the side 71 and the side 73". The fifth notch 45 is formed at "a position corresponding to the intersection of the side 72 and the side 73". The sixth notch 46 is formed at a position corresponding to the intersection of the side 72 and the side 74. The area between the sixth notch 46 and the second notch 42 has a flat shape, and at least a portion of the area faces the first groove 31. The first notch 41, the second notch 42, the third notch 43, the fourth notch 44, the fifth notch 45, and the sixth notch 46 penetrate the ceramic wiring component 1 in the thickness direction of the main body 10. The ceramic of the main body 10 constituting the ceramic wiring components 110 and 120 is exposed in the entire area on each peripheral surface defining the first notch 41 and the second notch 42. The first notch 41 and the second notch 42 are located on a straight line 91 that is orthogonal to the side 71 serving as the third side and the side 72 serving as the fourth side. The width w of the first notch 41 and the second notch 42 may be, for example, greater than 0 μm and less than 40 μm. The depth d of the first notch 41 and the second notch 42 may be, for example, greater than 0 μm and less than 50 μm.

In addition, referring to FIG. 1 and FIG. 2 , the first through hole 161 may be omitted. At this time, when the ceramic wiring component mother substrate 100 is divided along the break groove 151, the first notch portion 41 and the second notch portion 42 are formed in a state that the ceramic wiring component 1 is not penetrated in the thickness direction (refer to FIG. 3 and FIG. 6 ). More specifically, the first notch portion 41 and the second notch portion 42 are formed to "have a depth corresponding to the depth of the break groove 151". The reason for this is that when the break groove 151 is formed in the manufacturing process, from the viewpoint of avoiding breakage in the region where the break groove 151 branches, it is formed so that "in this region, the break grooves 151 are intentionally slightly crossed with each other". From the perspective of forming the first notch 41 and the second notch 42 more clearly, the disconnected grooves 151 can be crossed at a distance corresponding to the "desired size of the first notch 41 and the second notch 42". In addition, during the manufacturing process, when the disconnected grooves 151 are formed by irradiating the green sheet with laser, the irradiated area will volatilize. In the area where the disconnected grooves 151 intersect, because the laser is irradiated twice, more volatilization occurs. Therefore, in the area where the disconnected grooves 151 intersect, the depth of the disconnected grooves 151 is deeper than other parts, for example, more than 1 times and less than 1.2 times.

As shown in FIG. 1 and FIG. 2, the ceramic wiring member 1 having the same structure as described above, namely, the first ceramic wiring member 110 and the second ceramic wiring member 120, are arranged point-symmetrically with respect to the first through-hole conductor 28 when viewed in the thickness direction of the ceramic wiring member mother substrate 100 (when rotated 180° with the first through-hole conductor 28 as the center, the entirety overlaps). In addition, the plurality of ceramic wiring members 110 and 120 included in the ceramic wiring member mother substrate 100 are formed by forming a unit structure with the first ceramic wiring member 110 and the second ceramic wiring member 120 connected to each other, and the unit structure is filled up without a gap. More specifically, the above-mentioned unit structures adjacent to each other in the long side direction (Y-axis direction) of the rectangle are arranged so that the sides 113 and 114 overlap in their entire length, and the sides 124 and 123 overlap in their entire length. In addition, the above-mentioned unit structures adjacent to each other in the short side direction (X-axis direction) of the rectangle are arranged so that the sides 112 and 122 overlap in about half of their entire length. In this way, the "unit structures composed of the first ceramic wiring member 110 and the second ceramic wiring member 120 having the same structure" are fully laid out and arranged in a matrix shape. Therefore, the raw materials can be used without waste.

In the ceramic wiring component mother substrate 100 of the present embodiment, a first through hole 131 is formed in the area where the edge 111 of the first ceramic wiring component 110 and the edge 121 of the second ceramic wiring component 120 overlap, and the ground terminal 24 is connected to the frame portion 21 by a first through hole conductor 28 formed on the wall surface surrounding the first through hole 131. In this way, by arranging the first through hole 131 and the first through hole conductor 28 at positions corresponding to the sides of the rectangle (not the vertices of the rectangle), when the first ceramic wiring component 110 and the second ceramic wiring component 120 are separated along the disconnecting groove 151 along the sides 111 and 121, the contact area between the first through hole conductor 28 and the wall of the first through hole 131 is increased, thereby preventing the first through hole conductor 28 from falling off. Furthermore, the first ceramic wiring member 110 and the second ceramic wiring member 120 are staggered to a state where the side 111 and the side 121 partially overlap, and are arranged to be "point-symmetrical with respect to the first through-hole conductor 28", thereby forming the "first ceramic wiring member 110 and the second ceramic wiring member 120 after separation" into a ceramic wiring member 1 having the same structure. As a result, the efficiency of the manufacturing process can be improved. Furthermore, by mounting the electronic component on the ceramic wiring member 1 and sealing it with a cover, even if the electronic component cannot be visually identified, the direction of the electronic component can be grasped by the first through-hole 131 (the first groove 31 after separation) and the first through-hole conductor 28.

In this way, the ceramic wiring component mother substrate 100 of this embodiment can maintain the reliability of the electrical connection between the frame portion 21 and the ground terminal 24, and can achieve improved efficiency of the manufacturing process.

In addition, in the ceramic wiring component mother substrate 100 of the present embodiment, a first through hole 161 is formed at each vertex of the rectangle of the plurality of ceramic wiring components 110 and 120, penetrating from the first surface 100A to the second surface 100B. Thus, even if there is some error in the formation position of the disconnected groove 151 extending along each side of the rectangle, the "disconnected groove 151 extending in the X-axis direction" and the "disconnected groove 151 extending in the Y-axis direction" can be connected at the desired position.

In addition, in the plan view of the first surface 100A side of the ceramic wiring component mother substrate 100 of this embodiment, a pair of internal terminals 22 of the first ceramic wiring component 110 and a pair of internal terminals 22 of the second ceramic wiring component 120 are offset in opposite directions along the first side 111 and the second side 121 (Y-axis direction) in the area surrounded by the frame-shaped portion 21. With this structure, even if "the internal terminals 22 are offset due to the structure of the electronic components to be fixed to the ceramic wiring component 1", the efficiency of the manufacturing process can be improved.

By dividing the ceramic wiring component mother substrate 100 of the present embodiment into ceramic wiring components 1 along the disconnection groove 151, the reliability of the electrical connection between the frame portion 21 and the ground terminal 24 can be maintained, and the ceramic wiring component 1 of the present embodiment can be manufactured with good efficiency.

In addition, in the ceramic wiring member 1 of the present embodiment, the first notch 41 and the second notch 42 penetrate the ceramic wiring member 1 in the thickness direction of the main body 10. Thus, since the disconnection grooves 151 extending perpendicularly to each other on the ceramic wiring member mother substrate 100 can be connected to each other at a desired position, the unevenness of the shape of the ceramic wiring member 1 can be suppressed.

In addition, in the ceramic wiring component 1 of the present embodiment, the first notch 41 and the second notch 42 are offset in one direction along the direction of the edge 111 and the edge 121 (Y-axis direction). Therefore, by placing the electronic component on the ceramic wiring component 1 and sealing it with a cover, even when the electronic component cannot be visually identified, the direction of the electronic component can be grasped by the first notch 41 and the second notch 42.

The ceramic wiring component mother substrate 100 of the present embodiment described above can be manufactured, for example, by the following steps. First, prepare a green sheet as the main body 10. Specifically, a ceramic powder constituting the main body 10, such as an alumina powder, is mixed with a resin, a solvent, etc. by a ball mill to obtain a slurry. The slurry is processed into a green sheet by a scraper method. In this way, a green sheet to be the main body 10 can be obtained. A plurality of sheets are prepared on the premise that the main body 10 is constituted by stacking green sheets.

Next, a paste to be used as the conductive part 20 is printed on the prepared green sheet. The paste is made by mixing and kneading additives, resins, solvents, etc. with powder of a conductive body such as metal. This paste is printed on a plurality of green sheets by, for example, screen printing. Then, after laminating a plurality of green sheets to form a laminate having the structure of the desired ceramic wiring component mother substrate 100, the first through hole 131 and the first through hole 161 are formed. The above-mentioned paste is filled in the first through hole 131. Furthermore, a disconnection groove 151 is formed by, for example, laser irradiation. Thereafter, by firing the laminate, the ceramic wiring component mother substrate 100 can be manufactured.

Furthermore, the ceramic wiring component 1 of the present embodiment can be manufactured by dividing the ceramic wiring component mother substrate 100 along the break groove 151.

(Implementation form 2)

Next, another embodiment of the present invention, namely, embodiment 2, is described. FIG. 9 is a schematic plan view of the first side of the ceramic wiring component mother substrate of embodiment 2. FIG. 10 is a schematic plan view of the second side of the ceramic wiring component mother substrate of embodiment 2.

Referring to Figures 9 and 10 as well as Figures 1 and 2, the ceramic wiring component mother substrate 100 of embodiment 2 basically has the same structure as embodiment 1, can exert the same effect, and can be manufactured in the same manner. However, the ceramic wiring component mother substrate 100 of embodiment 2 is different from embodiment 1 in the positional relationship between the first ceramic wiring component 110 and the second ceramic wiring component 120. The following is an explanation of the differences from embodiment 1.

Referring to FIG. 9 and FIG. 10 , the first ceramic wiring member 110 and the second ceramic wiring member 120 constituting the unit structure are staggered in the Y-axis direction and are arranged so that “the side 111 as the first side of the first ceramic wiring member 110 and the side 121 as the second side of the second ceramic wiring member 120 overlap at 3/4 of their respective lengths”. Moreover, between the above-mentioned unit structures adjacent to each other in the short side direction of the rectangle (X-axis direction), “the side 122 overlaps with the side 112 at 3/4 of the total length”. Even with such a positional relationship between the first ceramic wiring member 110 and the second ceramic wiring member 120, the same effect as that of the first embodiment can still be obtained. In addition, the ceramic wiring member 1 of the second embodiment has the same structure as the first embodiment, and exerts the same effect, except for the point where the formation positions of the first notch 41 and the second notch 42 change in the Y-axis direction, due to the change in the formation position of the first through hole 161 caused by the difference in the positional relationship between the first ceramic wiring member 110 and the second ceramic wiring member 120.

It should be understood that all aspects of the embodiments disclosed this time are illustrative and not limiting in any way. The scope of the present invention is not limited by the above description, but shall be based on the scope of the patent application, and is intended to include the meaning equivalent to the scope of the patent application and all changes within the scope.

20: Conductive part

21: Frame-shaped part

22: Internal terminal

23: External terminal

24: Ground terminal

25: Second through-hole conductor

26: 1st connection part

27: 3rd through-hole conductor

28: 1st through-hole conductor

29: Second connection part

100: Ceramic wiring component motherboard

100A: Page 1

110: No. 1 Ceramic Accessories

111: Edge

111A: End

111B: End

112: Edge

113: Edge

114: Edge

120: Second ceramic wiring component

121: Edge

121A: End

121B: End

122: Edge

123: Edge

124: Edge

131: 1st through hole

151: Break the Gap

161: 1st perforation

191: Straight line

192: Straight line

X: Direction

Y: Direction

Z: Direction

Claims (10)

A ceramic wiring component mother substrate has a first surface, which is one of the surfaces in the thickness direction, and a second surface, which is the opposite side of the first surface in the thickness direction. When viewed in the thickness direction, a plurality of ceramic wiring components in a rectangular shape are laid and connected into one body. The plurality of ceramic wiring components include: a first ceramic wiring component; a second ceramic wiring component connected to the first ceramic wiring component; the first ceramic wiring component and the second ceramic wiring component respectively include: a main body made of ceramic, which has a plate-shaped portion; a conductive portion, which is contacted and arranged on the main body; the conductive portion is in a plane view of the first surface side. , comprising: a frame-shaped portion, which is arranged in a ring shape on the main body along the outer periphery of the rectangle; a pair of internal terminals, which are arranged on the area of the main body surrounded by the frame-shaped portion; the conductive portion, in a plan view on the second side, comprises: a pair of external terminals, which are separated from each other and arranged on the main body; a ground terminal, which is separated from the pair of external terminals and arranged on the main body; one of the pair of internal terminals is electrically connected to one of the pair of external terminals, and the other of the pair of internal terminals is electrically connected to the other of the pair of external terminals, and the conductive portion is connected to the first side and the conductive portion is connected to the second side. At least one of the second surfaces is formed with disconnected grooves extending along the sides of the rectangle of the adjacent plurality of ceramic wiring components; the first ceramic wiring component and the second ceramic wiring component are arranged so that one side of the rectangle of the first ceramic wiring component, namely the first side, partially overlaps with one side of the rectangle of the second ceramic wiring component, namely the second side, and the two ends of the first side do not overlap with the two ends of the second side, and a first through hole is formed in the overlapping area of the first side and the second side, which penetrates the mother substrate of the ceramic wiring component in the thickness direction, and the conductive portion further includes the first through hole conductive The first through-hole conductor is formed on the wall surface surrounding the first through-hole, and the grounding terminals of the first ceramic wiring component and the second ceramic wiring component are connected to the frame-shaped parts of the first ceramic wiring component and the second ceramic wiring component. The first ceramic wiring component and the second ceramic wiring component are arranged to be point-symmetrical with respect to the first through-hole conductor when viewed in the thickness direction of the ceramic wiring component mother substrate. The plurality of ceramic wiring components are formed by the first ceramic wiring component and the second ceramic wiring component connected to each other as a unit structure, and the unit structure is filled without gaps. As in claim 1, the ceramic wiring component mother substrate, wherein a first through hole is formed at each vertex of the rectangle of the plurality of ceramic wiring components, penetrating from the first surface to the second surface. As in claim 1 or claim 2, the ceramic wiring component mother substrate, wherein in the plan view of the first side, the pair of internal terminals of the first ceramic wiring component and the pair of internal terminals of the second ceramic wiring component are arranged offset in opposite directions along the first side and the second side in the area surrounded by the frame-shaped portion. A ceramic wiring component, comprising a main body having a plate-shaped portion and a conductive portion contacting and arranged on the main body, and having a rectangular shape when viewed in a direction perpendicular to the plate-shaped portion, wherein the plate-shaped portion has a main surface in the thickness direction, namely a first main surface, and a second main surface located on the reverse side of the first main surface in the thickness direction, and the conductive portion, in a plan view on the first main surface side, comprises: A frame-shaped portion extending along the outer periphery of the rectangle, The conductive portion is configured in a ring shape on the main body; a pair of internal terminals are configured on the area of the main body surrounded by the frame-shaped portion; the conductive portion, in a plan view on the second main surface side, includes: a pair of external terminals, which are separated from each other and configured on the main body; a ground terminal, which is separated from the pair of external terminals and configured on the main body; one of the pair of internal terminals is electrically connected to one of the pair of external terminals, and the pair of internal terminals is electrically connected to the external terminals. The other terminal is electrically connected to the other of the pair of external terminals, and a first groove is formed on the outer periphery of the main body portion, which penetrates the main body portion in the thickness direction and is far from the vertex of the rectangle. The conductive portion further includes a first through-hole conductor formed on the wall surface of the first groove portion and connecting the ground terminal to the frame-shaped portion. In a plan view of at least one of the first main surface side and the second main surface side, the outer periphery of the ceramic wiring component , a first notch portion is formed away from the vertex and formed on the side of the rectangle formed by the first groove, that is, the third side, and a second notch portion is formed away from the vertex and formed on the fourth side opposite to the third side, the first notch portion and the second notch portion are located on the same straight line orthogonal to the third side and the fourth side; the ceramic constituting the main body is exposed in the entire area on each peripheral surface defining the first notch portion and the second notch portion. A ceramic wiring component comprises a main body having a plate-shaped portion and a conductive portion arranged in contact with the main body, and is rectangular when viewed in a direction perpendicular to the plate-shaped portion, wherein the plate-shaped portion has a main surface in the thickness direction, namely a first main surface, and a second main surface located on the reverse side of the first main surface in the thickness direction, and the conductive portion comprises, in a plan view on the first main surface side, a frame-shaped portion arranged in a ring on the main body along the outer periphery of the rectangle. a pair of internal terminals arranged on the area of the main body surrounded by the frame-shaped portion; the conductive portion, in a plan view on the second main surface side, includes: a pair of external terminals, which are separated from each other and arranged on the main body; a ground terminal, which is separated from the pair of external terminals and arranged on the main body; one of the pair of internal terminals is electrically connected to one of the pair of external terminals, and the other of the pair of internal terminals is electrically connected to the pair of external terminals. The main body is provided with a first groove portion which penetrates the main body in the thickness direction and is far from the vertex of the rectangle. The conductive portion further includes a first through-hole conductor formed on a wall surface of the first groove portion and connecting the ground terminal to the frame-shaped portion. In a plan view of at least one of the first main surface side and the second main surface side, the ceramic wiring member is provided with a first groove portion which is far from the vertex and is formed on the outer periphery of the ceramic wiring member. The first notch portion is formed on the third side of the rectangular shape, and the second notch portion is formed away from the vertex and on the fourth side opposite to the third side, and the first notch portion and the second notch portion are located on the same straight line orthogonal to the third side and the fourth side; the outer peripheral surface corresponding to the fourth side in the ceramic wiring component includes a region located between the vertex and the second notch portion; at least a portion of the region faces the first groove, and the region has a flat shape. A ceramic wiring component as claimed in claim 4 or claim 5, wherein the first notch portion and the second notch portion are offset in one direction along the third side and the fourth side. A ceramic wiring component includes a main body having a plate-shaped portion and a conductive portion contacting and arranged on the main body, and is rectangular when viewed in a direction perpendicular to the plate-shaped portion. The plate-shaped portion has a main surface in the thickness direction, namely a first main surface, and a second main surface located on the opposite side of the first main surface in the thickness direction. The conductive portion includes, in a plan view on the first main surface side: a frame-shaped portion extending along the outer periphery of the rectangle, The conductive portion is configured in a ring shape on the main body; a pair of internal terminals are configured on the area of the main body surrounded by the frame-shaped portion; the conductive portion, in a plan view on the second main surface side, includes: a pair of external terminals, which are separated from each other and configured on the main body; a ground terminal, which is separated from the pair of external terminals and configured on the main body; one of the pair of internal terminals is electrically connected to one of the pair of external terminals, and the pair of internal terminals is electrically connected to the external terminals. The other of the external terminals is electrically connected to the other of the pair of external terminals, and a first groove is formed on the outer periphery of the main body, which penetrates the main body in the thickness direction and is far from the vertex of the rectangle. The conductive part further includes a first through-hole conductor formed on the wall surface of the first groove and connecting the ground terminal to the frame-shaped part. In a plan view of at least one of the first main surface side and the second main surface side, outside the ceramic wiring component A first notch portion is formed on the side of the rectangle formed by the first groove, i.e., the third side, away from the vertex, and a second notch portion is formed on the fourth side opposite to the third side, away from the vertex. The first notch portion and the second notch portion are located on the same straight line orthogonal to the third side and the fourth side; the first notch portion and the second notch portion are offset in one direction along the direction of the third side and the fourth side. As in claim 7, the ceramic wiring component, wherein only one first notch is formed on the third side; and only one second notch is formed on the fourth side. A ceramic wiring component as in any one of claim 4, 5, 7, and 8, wherein the first notch and the second notch penetrate the ceramic wiring component in the thickness direction of the main body. As in claim 6, the first notch and the second notch penetrate the ceramic wiring component in the thickness direction of the main body.

Images