TWI870866B - Electrical connector - Google Patents
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- TWI870866B TWI870866B TW112118790A TW112118790A TWI870866B TW I870866 B TWI870866 B TW I870866B TW 112118790 A TW112118790 A TW 112118790A TW 112118790 A TW112118790 A TW 112118790A TW I870866 B TWI870866 B TW I870866B
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- 238000003466 welding Methods 0.000 claims abstract description 416
- 239000004020 conductor Substances 0.000 claims abstract description 32
- 230000005540 biological transmission Effects 0.000 claims abstract description 26
- 238000005476 soldering Methods 0.000 claims description 54
- 238000001514 detection method Methods 0.000 claims description 27
- 238000005452 bending Methods 0.000 claims description 10
- 238000011084 recovery Methods 0.000 claims description 4
- 238000013461 design Methods 0.000 abstract description 16
- 238000002955 isolation Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 8
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- 238000005516 engineering process Methods 0.000 description 3
- 230000007812 deficiency Effects 0.000 description 2
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- 238000012552 review Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
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- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
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Abstract
本發明為有關一種電連接器,為符合高畫質多媒體介面(High Definition Multimedia Interface,HDMI)及顯示埠(Display Port,DP)規範之電連接器,主要結構包括一上排傳輸導體群及一下排傳輸導體群,並分別界定有上排接觸部組、上排焊接部組,與下排接觸部組、下排焊接部組,且增設至少一附加接地焊接部於第一高頻焊接對一側,配合各接地焊接部的位置設置,使第一至第四高頻訊號導體對的左右兩側確保有接地焊接部,藉此僅增加一根導體即可利用特殊隔離設計之接地導體,達到兼顧導體設計難度及降低電磁干擾或射頻干擾之目的。 The present invention is related to an electrical connector that complies with the specifications of High Definition Multimedia Interface (HDMI) and Display Port (DP). The main structure includes an upper transmission conductor group and a lower transmission conductor group, and is respectively defined as an upper contact group, an upper welding group, and a lower contact group, and a lower welding group. At least one additional grounding welding part is added on one side of the first high-frequency welding pair, and the position of each grounding welding part is arranged to ensure that the left and right sides of the first to fourth high-frequency signal conductor pairs have grounding welding parts. In this way, only one conductor is added to utilize the grounding conductor with a special isolation design, so as to achieve the purpose of taking into account the difficulty of conductor design and reducing electromagnetic interference or radio frequency interference.
Description
本發明為提供一種可簡化端子結構設計、優化高頻訊號、降低電磁干擾與射頻干擾的電連接器。 The present invention provides an electrical connector that can simplify the terminal structure design, optimize high-frequency signals, and reduce electromagnetic interference and radio frequency interference.
按,HDMI又稱高畫質多媒體介面(High Definition Multimedia Interface,HDMI)是一種全數位元化影像和聲音傳送介面,而DP又稱顯示埠(Display Port,DP)是第一個依賴封包化資料傳輸技術的顯示連接埠,兩者同樣具有可進行非壓縮式的數位資料傳輸之特性,故主要適應於連接電腦和螢幕,或是電腦和家庭劇院系統,且總端子數20Pin的DP雖不直接相容於總端子數19Pin的HDMI,但二者的前12Pin之配置方式完全相同。 HDMI, also known as High Definition Multimedia Interface (HDMI), is a fully digital image and sound transmission interface, while DP, also known as Display Port (DP), is the first display port that relies on packetized data transmission technology. Both have the characteristics of uncompressed digital data transmission, so they are mainly suitable for connecting computers and monitors, or computers and home theater systems. Although DP with a total of 20 pins is not directly compatible with HDMI with a total of 19 pins, the configuration of the first 12 pins of the two are exactly the same.
由於HDMI與DP皆使用大量的高頻訊號端子,故高頻端子間常發生電磁干擾或射頻干擾,常見係以改良屏蔽殼體外形的方式,增加內部傳輸導體的密閉性,但效果不佳,另有調整接地端子的位置配置,使高頻訊號端子兩側具有接地迴路之設計,但因為第一組高頻訊號端子外側並無接地端子可用,故其高頻特性無法與其他高頻訊號端子一致,更有將各接地端子改良為分岔型態,並分別設置於各高頻訊號端子的兩側,以形成環繞接地之設計,但此設計卻大量增加焊接部的數量,而增加連接器與電路基板焊接不良的風險,且端子數量的大幅增加也造成製程工序的複雜化。 Since both HDMI and DP use a large number of high-frequency signal terminals, electromagnetic interference or radio frequency interference often occurs between high-frequency terminals. The common method is to improve the appearance of the shielding shell to increase the airtightness of the internal transmission conductor, but the effect is not good. There is also a design that adjusts the position of the grounding terminal so that both sides of the high-frequency signal terminal have a grounding loop. However, because there is no grounding terminal available on the outside of the first set of high-frequency signal terminals, its high-frequency characteristics cannot be consistent with other high-frequency signal terminals. There is also a design that improves each grounding terminal to a forked type and is respectively set on both sides of each high-frequency signal terminal to form a surrounding grounding design. However, this design greatly increases the number of welding parts, which increases the risk of poor welding between the connector and the circuit board. The substantial increase in the number of terminals also complicates the process.
是以,要如何解決上述習用之問題與缺失,即為本發明之申請人與從事此行業之相關廠商所亟欲研究改善之方向所在者。 Therefore, how to solve the above-mentioned problems and deficiencies in usage is the direction that the applicant of this invention and related manufacturers engaged in this industry are eager to study and improve.
故,本發明之申請人有鑑於上述缺失,乃蒐集相關資料,經由多方評估及考量,並以從事於此行業累積之多年經驗,經由不斷試作及修改,始 設計出此種可簡化端子結構設計、優化高頻訊號、降低電磁干擾與射頻干擾之電連接器的發明專利者。 Therefore, in view of the above-mentioned deficiencies, the applicant of this invention has collected relevant information, evaluated and considered various aspects, and used the years of experience accumulated in this industry, through continuous trials and modifications, to design the invention patent of this electrical connector that can simplify the terminal structure design, optimize high-frequency signals, and reduce electromagnetic interference and radio frequency interference.
本發明之主要目的在於:在HDMI或DP的第一高頻焊接對一側,簡單增設至少一附加接地焊接部,配合第一至第四接地焊接部的位置調整,使第一至第四高頻焊接對兩側皆具有接地端子,而形成環繞接地效果,以優化高頻訊號、降低電磁干擾與射頻干擾。 The main purpose of the present invention is to simply add at least one additional grounding soldering part on one side of the first high-frequency soldering pair of HDMI or DP, and adjust the positions of the first to fourth grounding soldering parts so that both sides of the first to fourth high-frequency soldering pairs have grounding terminals, thereby forming a surrounding grounding effect to optimize high-frequency signals and reduce electromagnetic interference and radio frequency interference.
為達成上述目的,本發明之主要結構包括:一包含有上排接觸部組及上排焊接部組之上排傳輸導體群、一包含有下排接觸部組及下排焊接部組之下排傳輸導體群,該上排接觸部組延伸形成於上排焊接部組一端,該下排接觸部組延伸形成於下排焊接部組一端,且下排焊接部組與上排焊接部組設於同一平面,上排焊接部組內具有至少一附加接地焊接部、一第一高頻焊接對、一第一接地焊接部、一第二高頻焊接對、一第二接地焊接部,該下排焊接部組內具有一第三接地焊接部、一第三高頻焊接對、一第四接地焊接部、一第四高頻焊接對,該第一高頻焊接對設於附加接地焊接部一側,該第三接地焊接部設於第一高頻焊接對背離附加接地焊接部一側,該第三高頻焊接對設於第三接地焊接部背離第一高頻焊接對一側,該第一接地焊接部設於第三高頻焊接對背離第三接地焊接部一側,該第二高頻焊接對設於第一接地焊接部背離第三高頻焊接對一側,該第四接地焊接部設於第二高頻焊接對背離第一接地焊接部一側,該第四高頻焊接對設於第四接地焊接部背離第二高頻焊接對一側,該第二接地焊接部設於第四高頻焊接對背離第四接地焊接部一側,而當電連接器為HDMI時,第二接地焊接部背離該第四高頻焊接對一側具有一界定於上排焊接部組內之預備焊接部(CEC),預備焊接部背離第四高頻焊接對一側具有一界定於下排焊接部組內之網路訊號焊接部(Reserved),網路訊號焊接部背離預備焊接部一側具有一界定於下排焊接部組內之第二低頻焊接部(SDA),第二低頻焊接部背離網路訊號焊接部一側具有一界定於上排焊接部組內之第一低頻焊接部(SCL),第一低頻焊接部背離第二低頻焊接部一側具有一界定於上排焊接部組內之數據顯示通道焊接部(DDC/CEC Ground),數據顯示通道焊接部背離第一低頻焊接部一側具有一界定於下排焊接部組內之電源焊接部(Power),電源焊接部背離數據顯示通道焊接部一側具有一界定於上排焊接部組內之一熱插拔偵測焊接部(Hot Plug Detect),而當電連接器為DP時,第二接地焊接部背離第四高頻焊接對一側具有一界定於上 排焊接部組內之第五接地焊接部(GNF),第五接地焊接部背離第二接地焊接部一側具有一界定於下排焊接部組內之一接地焊接對(GND),接地焊接對背離第五接地焊接部一側具有一界定於上排焊接部組內之附屬差分焊接對(AUX_CH),附屬差分焊接對背離接地焊接對一側具有一界定於下排焊接部組內之熱插拔偵測焊接部(Hot Plug),熱插拔偵測焊接部背離附屬差分焊接對一側具有一界定於上排焊接部組內之電源回覆焊接部(DP_POWER Return),電源回覆焊接部背離熱插拔偵測焊接部一側具有一界定於下排焊接部組內之電源焊接部(Power)。 To achieve the above-mentioned purpose, the main structure of the present invention includes: an upper row transmission conductor group including an upper row contact portion group and an upper row welding portion group, and a lower row transmission conductor group including a lower row contact portion group and a lower row welding portion group, wherein the upper row contact portion group is extended to form one end of the upper row welding portion group, and the lower row welding portion group is extended to form one end of the lower row welding portion group, and the lower row welding portion group and the upper row welding portion group are arranged in the same plane, and the upper row welding portion group has at least one additional grounding welding portion, a first high-frequency welding pair, a first grounding welding portion, and a second A high-frequency welding pair, a second grounding welding portion, the lower row welding portion group has a third grounding welding portion, a third high-frequency welding pair, a fourth grounding welding portion, and a fourth high-frequency welding pair, the first high-frequency welding pair is arranged on one side of the additional grounding welding portion, the third grounding welding portion is arranged on one side of the first high-frequency welding pair away from the additional grounding welding portion, the third high-frequency welding pair is arranged on one side of the third grounding welding portion away from the first high-frequency welding pair, the first grounding welding portion is arranged on one side of the third high-frequency welding pair away from the third grounding welding portion, the second high-frequency welding The first grounding welding portion is disposed on a side away from the third high-frequency welding pair, the fourth grounding welding portion is disposed on a side away from the second high-frequency welding pair, the fourth high-frequency welding pair is disposed on a side away from the fourth grounding welding portion, the second grounding welding portion is disposed on a side away from the fourth high-frequency welding pair, and when the electrical connector is HDMI, the second grounding welding portion has a pre-welded portion (CEC) defined in the upper row welding portion group on a side away from the fourth high-frequency welding pair, and the pre-welded portion is disposed on a side away from the fourth high-frequency welding pair. The high-frequency welding pair has a network signal welding portion (Reserved) defined in the lower welding portion group on one side, the network signal welding portion has a second low-frequency welding portion (SDA) defined in the lower welding portion group on one side away from the reserved welding portion, the second low-frequency welding portion has a first low-frequency welding portion (SCL) defined in the upper welding portion group on one side away from the network signal welding portion, and the first low-frequency welding portion has a data display channel welding portion (DDC/CEC) defined in the upper welding portion group on one side away from the second low-frequency welding portion. The data display channel welding part has a power welding part (Power) defined in the lower row welding part group on one side away from the first low frequency welding part, and the power welding part has a hot plug detection welding part (Hot Plug) defined in the upper row welding part group on one side away from the data display channel welding part. Detect), and when the electrical connector is DP, the second grounding welding portion has a fifth grounding welding portion (GNF) defined in the upper welding portion group on the side facing away from the fourth high-frequency welding pair, the fifth grounding welding portion has a grounding welding pair (GND) defined in the lower welding portion group on the side facing away from the second grounding welding portion, the grounding welding pair has an attached differential welding pair (AUX_CH) defined in the upper welding portion group on the side facing away from the fifth grounding welding portion, the attached differential welding pair has a hot plug detection welding portion (Hot Plug) defined in the lower welding portion group on the side facing away from the grounding welding pair, and the hot plug detection welding portion has a power recovery welding portion (DP_POWER) defined in the upper welding portion group on the side facing away from the attached differential welding pair. Return), the power return soldering part has a power soldering part (Power) defined in the lower row of soldering parts on one side away from the hot plug detection soldering part.
藉由上述結構,只要在第一高頻焊接對外側增設至少一附加接地焊接部,配合第一至第四接地焊接部的位置設置,使第一至第四高頻焊接對的左右兩側確保有附加接地焊接部或第一至第四接地焊接部,如此即可藉由簡單增加一根導體,即可利用特殊隔離設計之接地導體,達到兼顧導體設計難度及降低電磁干擾或射頻干擾之目的。 With the above structure, as long as at least one additional grounding welding part is added to the outer side of the first high-frequency welding pair, and the positions of the first to fourth grounding welding parts are arranged, the left and right sides of the first to fourth high-frequency welding pairs are ensured to have additional grounding welding parts or the first to fourth grounding welding parts. In this way, by simply adding a conductor, the grounding conductor with a special isolation design can be used to achieve the purpose of taking into account the difficulty of conductor design and reducing electromagnetic interference or radio frequency interference.
藉由上述技術,可針對習用HDMI與DP連接器所存在之高頻端子間常發生電磁干擾或射頻干擾,而僅以改變屏蔽殼體外形的方式解決效果不佳,以改變接地端子配置者無法解決第一組高頻端子的不一致問題,以分叉接地端子之方式解決又使結構複雜化等問題點加以突破,達到上述優點之實用進步性。 The above technology can solve the problem of electromagnetic interference or radio frequency interference between high-frequency terminals of HDMI and DP connectors. The effect of changing the appearance of the shielding shell is not good. Changing the configuration of the grounding terminal cannot solve the inconsistency problem of the first set of high-frequency terminals. The problem of bifurcated grounding terminals makes the structure complicated. The above advantages are achieved.
1:上排傳輸導體群 1: Upper row transmission conductor group
101:上排焊接部組 101: Upper welding group
102:上排接觸部組 102: Upper row contact group
111:附加接地焊接部 111: Additional grounding welding part
1111:附加抵觸部 1111: Additional contact part
112:附加接地接觸部 112: Additional grounding contact
121:第一高頻焊接對 121: The first high frequency welding pair
122:第一高頻接觸對 122: The first high-frequency contact pair
131:第一接地焊接部 131: First grounding welding part
1311:第一抵觸部 1311: First contact point
132:第一接地接觸部 132: First ground contact part
141:第二高頻焊接對 141: Second high frequency welding pair
142:第二高頻接觸對 142: Second highest frequency contact pair
151:第二接地焊接部 151: Second grounding welding part
152:第二接地接觸部 152: Second ground contact part
161:預備焊接部 161: Preparatory welding department
162:預備接觸部 162: Prepare contact parts
163:第五接地焊接部 163: Fifth grounding welding part
164:第五接地接觸部 164: Fifth ground contact
171:第一低頻焊接部 171: The first low-frequency welding section
172:第一低頻接觸部 172: First low-frequency contact part
173:附屬差分焊接對 173: Attached differential welding pair
174:附屬差分接觸對 174: Subordinate differential contact pair
181:數據顯示通道焊接部 181: Data display channel welding part
182:數據顯示通道接觸部 182: Data display channel contact part
183:電源回覆焊接部 183: Power recovery welding department
184:電源回覆接觸部 184: Power recovery contact
191、263:熱插拔偵測焊接部 191, 263: Hot-swap detection welding part
192、264:熱插拔偵測接觸部 192, 264: Hot-swap detection contacts
2:下排傳輸導體群 2: Lower row transmission conductor group
201:下排焊接部組 201: Lower welding group
202:下排接觸部組 202: Lower row contact group
211:第三接地焊接部 211: Third ground welding part
2111:第三抵觸部 2111: The third contact part
212:第三接地接觸部 212: Third ground contact
221:第三高頻焊接對 221: The third high frequency welding pair
222:第三高頻接觸對 222: The third highest frequency contact pair
231:第四接地焊接部 231: Fourth grounding welding part
2311:第四抵觸部 2311: Fourth contact point
232:第四接地接觸部 232: Fourth ground contact part
241:第四高頻焊接對 241: The fourth high frequency welding pair
242:第四高頻接觸對 242: The fourth high-frequency contact pair
251:網路訊號焊接部 251: Network signal welding department
252:網路訊號接觸部 252: Network signal contact part
253:接地焊接對 253: Ground welding pair
254:接地接觸對 254: Ground contact pair
261:第二低頻焊接部 261: Second low frequency welding section
262:第二低頻接觸部 262: Second low-frequency contact part
271、273:電源焊接部 271, 273: Power welding department
272、274:電源接觸部 272, 274: Power contact part
31:第一接地連接部 31: First ground connection part
32:第二接地連接部 32: Second ground connection part
33:第三接地連接部 33: Third ground connection part
34:第四接地連接部 34: Fourth ground connection part
4:彈性彎折部 4: Elastic bending part
41:破口部 41: Breach
42:彈性抵觸部 42: Elastic contact part
5:平面部 5: Plane part
51:開口部 51: Opening
6:屏蔽殼體 6: Shielding shell
第一圖 係為本發明第一較佳實施例之立體透視圖。 The first figure is a three-dimensional perspective view of the first preferred embodiment of the present invention.
第二圖 係為本發明第一較佳實施例之前視圖。 The second figure is a front view of the first preferred embodiment of the present invention.
第三圖 係為本發明第一較佳實施例之俯視圖(一)。 The third figure is a top view of the first preferred embodiment of the present invention (I).
第四圖 係為本發明第一較佳實施例之俯視圖(二)。 Figure 4 is a top view of the first preferred embodiment of the present invention (II).
第五圖 係為本發明第二較佳實施例之端子分解圖。 Figure 5 is a terminal exploded view of the second preferred embodiment of the present invention.
第六圖 係為本發明第二較佳實施例之端子立體圖。 Figure 6 is a three-dimensional diagram of the terminal of the second preferred embodiment of the present invention.
第七圖 係為本發明第三較佳實施例之端子立體圖。 Figure 7 is a three-dimensional diagram of the terminal of the third preferred embodiment of the present invention.
第八圖 係為本發明第三較佳實施例之實施示意圖。 Figure 8 is a schematic diagram of the implementation of the third preferred embodiment of the present invention.
第九圖 係為本發明第四較佳實施例之端子俯視圖(一)。 Figure 9 is a top view of the terminal of the fourth preferred embodiment of the present invention (I).
第十圖 係為本發明第四較佳實施例之端子俯視圖(二)。 Figure 10 is a top view of the terminal of the fourth preferred embodiment of the present invention (II).
第十一圖 係為本發明第四較佳實施例之實施示意圖。 Figure 11 is a schematic diagram of the fourth preferred embodiment of the present invention.
第十二圖 係為本發明第五較佳實施例之前視圖。 Figure 12 is a front view of the fifth preferred embodiment of the present invention.
第十三圖 係為本發明第五較佳實施例之另一角度立體圖。 Figure 13 is a three-dimensional diagram from another angle of the fifth preferred embodiment of the present invention.
為達成上述目的及功效,本發明所採用之技術手段及構造,茲繪圖就本發明較佳實施例詳加說明其特徵與功能如下,俾利完全了解。 In order to achieve the above-mentioned purpose and effect, the technical means and structure adopted by the present invention are described in detail in the following figure for the preferred embodiment of the present invention, and its features and functions are explained in detail for a complete understanding.
請參閱第一圖至第四圖所示,係為本發明第一較佳實施例之立體透視圖至俯視圖(二),其中第三圖為僅保留上排傳輸導體群1之俯視圖、第四圖為僅保留下排傳輸導體群2之俯視圖,由圖中可清楚看出本實施例之電連接器係為高畫質多媒體介面(High Definition Multimedia Interface,HDMI),且不限定為公頭連接器或母座連接器,本實施例則以公頭連接器作為舉例,其主要包括:
Please refer to the first to fourth figures, which are the three-dimensional perspective view to the top view (II) of the first preferred embodiment of the present invention, wherein the third figure is a top view of only the upper
一上排傳輸導體群1,包含一上排焊接部組101、及一延伸形成於該上排焊接部組101一端之上排接觸部組102;
An upper row
一下排傳輸導體群2,係設於該上排傳輸導體群1一側,並包含一下排焊接部組201、及一延伸形成於該下排焊接部組201一端之下排接觸部組202,該下排焊接部組201係與該上排焊接部組101設於同一平面;
The lower row
至少一附加接地焊接部111,係界定於該上排焊接部組101內;
At least one additional
一第一高頻焊接對121,係界定於該上排焊接部組101內、且設於該附加接地焊接部111一側;
A first high-
一第三接地焊接部211,係界定於該下排焊接部組201內、且設於該第一高頻焊接對121背離該附加接地焊接部111一側;
A third
一第三高頻焊接對221,係界定於該下排焊接部組201內、且設於該第三接地焊接部211背離該第一高頻焊接對121一側;
A third high-
一第一接地焊接部131,係界定於該上排焊接部組101內、且設於該第三高頻焊接對221背離該第三接地焊接部211一側;
A first
一第二高頻焊接對141,係界定於該上排焊接部組101內、且設於該第一接地焊接部131背離該第三高頻焊接對221一側;
A second high-
一第四接地焊接部231,係界定於該下排焊接部組201內、且設於該第二高頻焊接對141背離該第一接地焊接部131一側;
A fourth
一第四高頻焊接對241,係界定於該下排焊接部組201內、且設於該第四接地焊接部231背離該第二高頻焊接對141一側;
A fourth high-
一第二接地焊接部151,係界定於該上排焊接部組101內、且設於該第四高頻焊接對241背離該第四接地焊接部231一側;
A second
一預備焊接部161,係界定於該上排焊接部組101內、且設於該第二接地焊接部151背離該第四高頻焊接對241一側;
A
一網路訊號焊接部251,係界定於該下排焊接部組201內、且設於該預備焊接部161背離該第二接地焊接部151一側;
A network
一第二低頻焊接部261,係界定於該下排焊接部組201內、且設於該網路訊號焊接部251背離該預備焊接部161一側;
A second low-
一第一低頻焊接部171,係界定於該上排焊接部組101內、且設於該第二低頻焊接部261背離該網路訊號焊接部251一側;
A first low-
一數據顯示通道焊接部181,係界定於該上排焊接部組101內、且設於該第一低頻焊接部171背離該第二低頻焊接部261一側;
A data display
一電源焊接部271,係界定於該下排焊接部組201內、且設於該數據顯示通道焊接部181背離該第一低頻焊接部171一側;及
A
一熱插拔偵測焊接部191,係界定於該上排焊接部組101內、且設於該電源焊接部271背離數據顯示通道焊接部181一側。
A hot-swap
藉由上述之說明,已可了解本技術之結構,而依據這個結構之對應配合,更可達到簡化端子結構設計、優化高頻訊號、降低電磁干擾與射頻干擾等優勢,而詳細之解說將於下述說明。 Through the above explanation, we can understand the structure of this technology. According to the corresponding coordination of this structure, we can achieve the advantages of simplifying the terminal structure design, optimizing high-frequency signals, reducing electromagnetic interference and radio frequency interference, and the detailed explanation will be given below.
本發明之HDMI連接器為20PIN之電連接器,相較於標準19PIN的HDMI連接器,只多了附加接地焊接部111一根端子在基本配置端子的最外側(較靠近屏蔽殼體6的附加接地焊接部111為第二根附加接地焊接部111,其功能將於下段說明),且整體的焊接部數量也是20個,故僅以最小的幅度調整電連接器的端子配置,配合第一至第四接地焊接部131、151、211、231的位置設置,使第一至第四高頻焊接對121、141、221、241的左右兩側確保有附加接地焊接部111或第一至第四接地焊接部131
、151、211、231,充分完成環繞接地的接地迴路。具體而言,焊接部的排列順序為附加接地焊接部111、第一高頻焊接對121、第三接地焊接部211、第三高頻焊接對221、第一接地焊接部131、第二高頻焊接對141、第四接地焊接部231、第四高頻焊接對241、第二接地焊接部151、預備焊接部161、網路訊號焊接部251、第二低頻焊接部261、第一低頻焊接部171、數據顯示通道焊接部181、電源焊接部271、熱插拔偵測焊接部191,其中第一高頻焊接對121兩側分別為附加接地焊接部111及第三接地焊接部211、第二高頻焊接對141兩側分別為第一接地焊接部131及第四接地焊接部231、第三高頻焊接對221兩側分別為第一接地焊接部131及第三接地焊接部211、第四高頻焊接對241兩側分別為第二接地焊接部151及第四接地焊接部231。如此即可藉由簡單增加一根導體,而利用特殊隔離設計之接地導體,達到兼顧導體設計難度及降低電磁干擾或射頻干擾之目的。
The HDMI connector of the present invention is a 20-pin electrical connector. Compared with the standard 19-pin HDMI connector, it only has one additional
另外,因為附加接地焊接部111之性質為接地,其至少已經跟電路基板的接地迴路導通了,故電連接器在對接時可不用特別與其電性連接,也就是說,標準19PIN的HDMI連接器亦可與之正常插接,並發揮本案所具有之功效,當然本案之屏蔽殼體6外輪廓亦與標準19PIN的HDMI連接器為相同設計,又因為附加接地焊接部111之性質為接地,在設計屏蔽殼體6時,若能讓附加接地焊接部111與屏蔽殼體6內壁抵觸,還可使端子的接地迴路與屏蔽殼體6連通,而進一步提升接地屏蔽效果,為此乃將附加接地焊接部111設計為兩根,而與附加接地接觸部112形成Y型態樣,較靠近屏蔽殼體6的附加接地焊接部111則可與屏蔽殼體6接觸。
In addition, because the additional
再者,該上排接觸部組102內界定有一延伸形成於該附加接地焊接部111一端之附加接地接觸部112、一延伸形成於該第一高頻焊接對121一端之第一高頻接觸對122、一延伸形成於該第一接地焊接部131一端之第一接地接觸部132、一延伸形成於該第二高頻焊接對141一端之第二高頻接觸對142、一延伸形成於該第二接地焊接部151一端之第二接地接觸部152、一延伸形成於該預備焊接部161一端之預備接觸部162、一延伸形成於該第一低頻焊接部171一端之第一低頻接觸部172、一延伸形成於該數據顯示通道焊接部181一端之數據顯示通道接觸部182、及
一延伸形成於該熱插拔偵測焊接部一端之熱插拔偵測接觸部192,且該附加接地接觸部112、該第一高頻接觸對122、該第一接地接觸部132、該第二高頻接觸對142、該第二接地接觸部152、該預備接觸部162、該第一低頻接觸部172、該數據顯示通道接觸部182、該熱插拔偵測接觸部192乃依序並排設置,又該下排接觸部組202內界定有一延伸形成於該第三接地焊接部211一端且位於該第一高頻接觸對122之間的第三接地接觸部212、一延伸形成於該第三高頻焊接對221一端之第三高頻接觸對222、一延伸形成於該第四接地焊接部231一端之第四接地接觸部232、一延伸形成於該第四高頻焊接對241一端之第四高頻接觸對242、一延伸形成於該網路訊號焊接部251一端之網路訊號接觸部252、一延伸形成於該第二低頻焊接部261一端之第二低頻接觸部262、一延伸形成於該電源焊接部271一端之電源接觸部272,且該第三接地接觸部212、該第三高頻接觸對222、該第四接地接觸部232、該第四高頻接觸對242、該網路訊號接觸部252、該第二低頻接觸部262、該電源接觸部272乃依序並排設置。換言之,本實施例之HDMI連接器的接觸部不但符合協會規範,增加的附加接地接觸部112也可以在不影響屏蔽殼體6外型的情況下與之結合,對於整體的設計變化幅度可降至最低,以簡化製造工序與結構複雜度。
Furthermore, the upper row of
請同時配合參閱第五圖及第六圖所示,係為本發明第二較佳實施例之端子分解圖及端子立體圖,由圖中可清楚看出,本實施例與上述實施例為大同小異,僅於該第一接地接觸部132一側延伸形成一第一接地連接部31,係抵觸於該第三接地焊接部211一側之第三抵觸部2111,該第二接地接觸部152一側延伸形成一第二接地連接部32,係抵觸於該第四接地焊接部231一側之第四抵觸部2311,該第三接地接觸部212一側延伸形成一第三接地連接部33,係抵觸於該附加接地焊接部111一側之附加抵觸部1111,該第四接地接觸部232一側延伸形成一第四接地連接部34,係抵觸於該第一接地焊接部131一側之第一抵觸部1311。如此一來,使上排的第一接地焊接部131與下排的第三接地焊接部211搭接、使上排的第二接地焊接部151與下排的第四接地焊接部231搭接、使下排的第三接地焊接部211與上排的附加接地焊接部111搭接、及使下排的第四接地焊接部231與上排的第一接地焊接部131搭接,藉此,除了上下排各自形成接
地迴路環繞高頻端子,以在上排或下排的平面空間完成屏蔽外,上下排間的接地迴路也彼此搭接,而在高頻端子周圍的立體空間內完成屏蔽,使接地迴路更有連續性,隔離效果更佳。
Please refer to the fifth and sixth figures at the same time, which are the terminal exploded view and the terminal stereogram of the second preferred embodiment of the present invention. It can be clearly seen from the figures that the present embodiment is similar to the above-mentioned embodiment, except that the first
請同時配合參閱第七圖及第八圖所示,係為本發明第三較佳實施例之端子立體圖及實施示意圖,由圖中可清楚看出,本實施例同樣以HDMI的公頭連接器作為舉例,並於其上排接觸部組102及下排接觸部組202之各端子上分別具有一彈性彎折部4,且各該彈性彎折部4上具有一破口部41、及一由該破口部41一端延伸形成之彈性抵觸部42,該彈性抵觸部42係向該上排接觸部組102及該下排接觸部組202之間延伸形成。所述彈性彎折部4係指上排接觸部組102及下排接觸部組202延伸出絕緣膠體的部分,以於連接器插接時提供適當的彈力,且該彈性彎折部4整段寬度相同,並於彈性彎折部4背離絕緣膠體的端處附近,從破口部41處延伸出一較細的彈性抵觸部42,作為實際與母座連接器電性導通之部位,以藉由破口部41及彈性抵觸部42之設計調整高頻訊號,實現高頻優化。
Please refer to FIG. 7 and FIG. 8 at the same time, which are the three-dimensional diagram of the terminal and the schematic diagram of the implementation of the third preferred embodiment of the present invention. It can be clearly seen from the figure that the present embodiment also takes the HDMI male connector as an example, and each terminal of the upper row of
請同時配合參閱第九圖至第十一圖所示,係為本發明第四較佳實施例之端子俯視圖(一)至實施示意圖,其中第九圖為僅保留上排傳輸導體群1之俯視圖、第十圖為僅保留下排傳輸導體群2之俯視圖,由圖中可清楚看出,本實施例之電連接器係以HDMI的母座連接器作為舉例,並於第一高頻接觸對122、第二高頻接觸對142、第三高頻接觸對222、第四高頻接觸對242、第一低頻接觸部172、及數據顯示通道接觸部182上分別具有一平面部5,且各該平面部5上具有一開口部51,而該電連接器在與公頭連接器對接時,乃以該平面部5背離該開口部51之一側進行電性導通,換言之,如第十一圖所示,係為以第一高頻接觸對122的其中一根為基準之剖視圖,公頭連接器與母座連接器的插接深度比一般更深,端子的抵觸位置在開口部51後方,位置更接近絕緣膠體,藉此縮短高頻訊號的傳輸距離,達到調節高頻特性之目的。
Please refer to FIG. 9 to FIG. 11 at the same time, which are the top view (I) to the schematic diagram of the terminal of the fourth preferred embodiment of the present invention, wherein FIG. 9 is a top view of only the upper
請同時配合參閱第十二圖及第十三圖所示,係為本發明第五較佳實施例之前視圖及另一角度立體圖,由圖中可清楚看出,本實施例同樣以DP的母座連接器作為舉例,由於本發明之前13PIN配置可同時符合HDMI連接器與DP連接器的規範,只要將其餘8根端子的配置,使其符合DP連接器之規範,即可使
用於DP連接器的公頭連接器或母座連接器,具體而言其餘8根端子的配置為一第五接地焊接部163/第五接地接觸部164、一接地焊接對253/接地接觸對254、一附屬差分焊接對173/附屬差分接觸對174、一熱插拔偵測焊接部263/熱插拔偵測接觸部264、一電源回覆焊接部183/電源回覆接觸部184、一電源焊接部273/電源接觸部274,其中該第五接地焊接部163界定於該上排焊接部組內、且設於該第二接地焊接部151背離該第四高頻焊接對241一側,該接地焊接對253,係界定於該下排焊接部組內、且設於該第五接地焊接部163背離該第二接地焊接部151一側,該附屬差分焊接對173,係界定於該上排焊接部組內、且設於該接地焊接對253背離該第五接地焊接部163一側,該熱插拔偵測焊接部263,係界定於該下排焊接部組內、且設於該附屬差分焊接對173背離該接地焊接對253一側,該電源回覆焊接部183,係界定於該上排焊接部組內、且設於該熱插拔偵測焊接部263背離該附屬差分焊接對173一側,而該電源焊接部273,係界定於該下排焊接部組內、且設於該電源回覆焊接部183背離該熱插拔偵測焊接部263一側,當然接觸部的部分同樣於該上排接觸部組102內界定有一延伸形成於該第五接地焊接部163一端之第五接地接觸部164、一延伸形成於該附屬差分焊接對173一端之附屬差分接觸對174、及一延伸形成於該電源回覆焊接部183一端之電源回覆接觸部184,於該下排接觸部組202內界定有一延伸形成於該接地焊接對253一端之接地接觸對254、一延伸形成於該熱插拔偵測焊接部263一端之熱插拔偵測接觸部264、一延伸形成於該電源焊接部273一端之電源接觸部274。
Please refer to the twelfth and thirteenth figures at the same time, which are the front view and another angle stereogram of the fifth preferred embodiment of the present invention. It can be clearly seen from the figure that the present embodiment also takes the DP female connector as an example. Since the 13-pin configuration before the present invention can meet the specifications of both the HDMI connector and the DP connector, as long as the configuration of the remaining 8 terminals is made to meet the specifications of the DP connector, it can be used for the male connector or the female connector of the DP connector. Specifically, the configuration of the remaining 8 terminals is a fifth
惟,以上所述僅為本發明之較佳實施例而已,非因此即侷限本發明之專利範圍,故舉凡運用本發明說明書及圖式內容所為之簡易修飾及等效結構變化,均應同理包含於本發明之專利範圍內,合予陳明。 However, the above is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Therefore, all simple modifications and equivalent structural changes made by using the contents of the present invention's specification and drawings should be included in the patent scope of the present invention and should be stated.
綜上所述,本發明之電連接器於使用時,為確實能達到其功效及目的,故本發明誠為一實用性優異之發明,為符合發明專利之申請要件,爰依法提出申請,盼 審委早日賜准本發明,以保障申請人之辛苦發明,倘若 鈞局審委有任何稽疑,請不吝來函指示,申請人定當竭力配合,實感德便。 In summary, the electrical connector of this invention can truly achieve its effect and purpose when used. Therefore, this invention is truly an invention with excellent practicality. In order to meet the application requirements of invention patents, an application is filed in accordance with the law. I hope that the review committee will approve this invention as soon as possible to protect the applicant's hard work. If the review committee of the Jun Bureau has any doubts, please feel free to write to instruct. The applicant will do his best to cooperate and feel very grateful.
1:上排傳輸導體群 1: Upper row transmission conductor group
111:附加接地焊接部 111: Additional grounding welding part
112:附加接地接觸部 112: Additional grounding contact
2:下排傳輸導體群 2: Lower row transmission conductor group
6:屏蔽殼體 6: Shielding shell
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US9136649B2 (en) | 2012-06-21 | 2015-09-15 | Tyco Electronics Holdings (Bermuda) No. 7 Ltd. | HDMI type-D connector |
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9136649B2 (en) | 2012-06-21 | 2015-09-15 | Tyco Electronics Holdings (Bermuda) No. 7 Ltd. | HDMI type-D connector |
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