TWI867045B - Smart photomask and its exposure apparatus, exposure method and exposure pattern forming method - Google Patents

Abstract

The present invention provides a smart photomask and its exposure apparatus, an exposure method and an exposure pattern forming method. The smart photomask includes a backplane, a plurality of first micro LEDs, and a protective layer. The plurality of first micro LEDs are arranged, in an array, on the backplane with the same size as a traditional photomask. The light emitting state is determined based on the control signal received from the circuit on the backplane, thereby defining an exposure pattern. The protective layer covers at least one or more of the plurality of micro LEDs. The size and pitch of the plurality of first micro LEDs are designed to meet the line width requirement of the exposure process. Therefore, the size of the smart mask can meet the requirement of the mask chunk parts of the exposure apparatus.

Description

Smart mask and exposure device, exposure method and exposure pattern forming method thereof

The present invention relates to semiconductor manufacturing equipment and methods, in particular to a smart mask with adjustable patterns and exposure equipment and exposure methods using the same.

In the manufacturing process of semiconductor integrated circuits, lithography technology can accurately define specific patterns on the photoresist layer, and then transfer the pattern of the photoresist layer to the semiconductor substrate through the etching process to form the required circuit structure. In the common lithography process, it can be divided into the following steps in sequence: photoresist coating, baking, mask definition of exposure range, exposure, developing pattern, baking, etc. The photoresist layer can be formed using photosensitive polymer materials, so as to define the pattern of the microstructure by using the difference in developing ability before and after exposure.

Different process substrate sizes use different sized masks. Generally speaking, the mask size is slightly larger than the substrate to be processed. A metal pattern is defined on it as a light source mask to protect the photoresist from being affected by the exposure source.

The substrate of the common photomask itself is film, glass or quartz. The mask manufacturer plates a layer of opaque metal film on the mask substrate and covers it with photoresist. Then, a high-resolution laser is used to scan and expose the local defined pattern. After the defined photoresist pattern is developed, metal etching is performed to remove the masked part. Only in this way can a mask be completed. The general business model is that the process executor designs the mask pattern and entrusts the mask manufacturer to produce the mask for its use.

Nano-level or micron-level process flows require multiple different layers to be stacked to achieve the purpose of structures or multi-layer circuits. Therefore, a product often requires multiple masks with different patterns to achieve different graphic definition requirements.

The pattern provided by each mask is fixed and cannot be changed. Assuming there is a product whose production process requires the stacking of ten different patterns and structures, ten different masks may be needed to meet the demand, which means the manufacturing cost of ten masks is required.

In addition, since the mask production time is long and the time cost is high, it generally takes several days from the design outsourcing by the process executor to the mask output. After obtaining the mask, the process executor can start the production and manufacturing process, thus limiting the efficiency of production and manufacturing.

Many embodiments of the "present invention" are described in this summary. However, the term "present invention" is only used to describe certain embodiments disclosed in this specification (whether or not in the claims), rather than a complete description of all possible embodiments. Certain embodiments of the various features or aspects described below as "present invention" can be combined in different ways to form.

The present invention provides a new intelligent mask with adjustable pattern and an exposure device and exposure method using the same, which can reduce the mask manufacturing cost in the semiconductor manufacturing process and improve the production efficiency to solve the above problems.

The smart mask with adjustable pattern proposed by the present invention includes a base plate, a plurality of first micro-LED elements and a protective layer. The plurality of first micro-LED elements are arranged in an array on the base plate. The protective layer covers at least one or more of the plurality of micro-LED elements. The size of at least one of the plurality of first micro-LED elements is between 0.1 micron and 100 micron, and the spacing between at least two adjacent first micro-LED elements of the plurality of first micro-LED elements is between 0.01 micron and 20 micron. The plurality of first micro-LED elements determine the light-emitting state based on the control signal received from the circuit on the base plate, so as to define the exposure pattern.

In some embodiments of the present invention, the light emitting array composed of the plurality of first micro-LED elements has an area ranging from 625 square millimeters (mm ² ) to 52900 square millimeters.

In some embodiments of the present invention, the luminescent wavelength range of the plurality of first micro-LED elements is between 200 nanometers and 400 nanometers.

In some embodiments of the present invention, at least one of the plurality of first micro-light-emitting diode elements includes a light-emitting portion, a first electrode, and a second electrode. The light-emitting portion has a first surface and a second surface opposite to the first surface. The first electrode is disposed on the first surface of the light-emitting portion. The second electrode is disposed on the second surface of the light-emitting portion.

In some embodiments of the present invention, at least one of the plurality of first micro-LED elements includes a light-emitting portion, a first electrode, and a second electrode. The light-emitting portion has a first surface and a second surface opposite to the first surface. The first electrode and the second electrode are both disposed on the first surface of the light-emitting portion.

In some embodiments of the present invention, the base plate has a first area and a second area, and the plurality of first micro-light-emitting diode elements are disposed in the first area.

In some embodiments of the present invention, the adjustable pattern smart mask further includes a plurality of second micro-LED elements (micro-LEDs) disposed in the second area of the base plate and used to display alignment marks through control.

In some embodiments of the present invention, the first area includes the central area of the base plate, and the second area includes the peripheral area of the base plate.

In some embodiments of the present invention, the plurality of first micro-LED elements are divided into a plurality of exposure unit areas, and at least one of the plurality of exposure unit areas includes a plurality of the first micro-LED elements arranged in an x*y array, where x and y are natural numbers.

In some embodiments of the present invention, when there are z first micro-LED elements in one of the exposure unit regions that are not working properly, the luminous state of at least one of the remaining first micro-LED elements in one of the exposure unit regions that are in a normal working state is adjusted to compensate for the z first micro-LED elements that are not working properly, where z is a natural number and z<x*y.

In some embodiments of the present invention, when the plurality of first micro-LED elements are in a normal working state, the plurality of first micro-LED elements are controlled to remain lit during a first period.

In some embodiments of the present invention, when z of the first micro-LED elements in one of the exposure unit regions are in a state of being unable to work normally, the lighting time of at least one of the remaining first micro-LED elements in a normal working state is adjusted to a second period greater than the first period.

，其中，T1為所述第一期間，T2為所述第二期間， 並且n為一常數。 In some embodiments of the present invention, the first period and the second period meet the following relationship:

, wherein T1 is the first period, T2 is the second period, and n is a constant.

In some embodiments of the present invention, when the plurality of first micro-LED elements are in a normal working state, the plurality of first micro-LED elements are controlled to have a first brightness.

In some embodiments of the present invention, when z of the first micro-LED elements in one of the exposure unit regions are in a state of being unable to work normally, the light luminance of at least one of the remaining first micro-LED elements in a normal working state is adjusted to a second luminance greater than the first luminance.

In some embodiments of the present invention, each of the multiple exposure unit areas is less than or equal to the minimum line width in the exposure pattern.

In some embodiments of the present invention, the size of at least one of the plurality of first micro-LED elements is between 0.1 microns and 20 microns.

In some embodiments of the present invention, the distance between at least two adjacent first micro-LED elements among the plurality of first micro-LED elements is between 1 micron and 4 microns.

The embodiment of the present invention proposes an exposure device for applying the smart mask with adjustable pattern, including a supporting platform, the smart mask with adjustable pattern, a controller and a mask clamping part. The supporting platform has a supporting area suitable for setting the object to be exposed. The smart mask with adjustable pattern includes a plurality of first micro-light emitting diode elements (micro-LED), wherein each of the first micro-light emitting diode elements receives a control signal and determines a light emitting state based on the received control signal to define an exposure pattern. The controller is electrically connected to the plurality of first micro-light emitting diode elements to generate the control signal to control the light emitting states of the plurality of first micro-light emitting diode elements respectively. The mask clamping part is arranged relative to the carrying platform to fix the smart mask with adjustable pattern, wherein when the exposure device performs the alignment operation, the mask clamping part drives the smart mask with adjustable pattern to align with the object to be exposed set on the carrying area.

In some embodiments of the present invention, the exposure device further includes a detector. The detector is used to detect whether the plurality of first micro-LED elements are lit in response to the control signal.

The embodiment of the present invention provides an exposure method, including aligning a plurality of first micro-LED elements (micro-LED) formed in an array with a substrate, and making the light-emitting surfaces of the plurality of first micro-LED elements face the substrate; sending a first control signal to the plurality of first micro-LED elements, so that the plurality of first micro-LED elements light up in response to the control signal and display a first light-emitting pattern; and irradiating the object to be exposed with the first light-emitting pattern, thereby defining a first exposure pattern on the object to be exposed.

In some embodiments of the present invention, the exposure method further includes sending a second control signal to the plurality of first micro-LED elements, so that the plurality of first micro-LED elements light up in response to the control signal and display a second light-emitting pattern; and irradiating the object to be exposed with the second light-emitting pattern, thereby defining a second exposure pattern on the object to be exposed.

In some embodiments of the present invention, the exposure method further includes: sending an alignment signal to the plurality of second micro-LED elements, so that the plurality of second micro-LED elements light up in response to the alignment signal, and displaying an alignment pattern to illuminate the object to be exposed, so as to define an alignment mark corresponding to the alignment pattern on the object to be exposed.

In some embodiments of the present invention, the step of aligning a plurality of first micro-LED elements (micro-LEDs) formed in an array with an object to be exposed and making the light-emitting surfaces of the plurality of first micro-LED elements face the object to be exposed includes: identifying a first alignment mark on the base plate and a second alignment mark on the object to be exposed to obtain position information of the first alignment mark and the second alignment mark, wherein the first alignment mark and the second alignment mark correspond to the same first alignment pattern; and adjusting the relative position of the object to be exposed and the base plate to align the first alignment mark and the second alignment mark in a uniaxial direction.

In some embodiments of the present invention, the exposure method further includes: sending an alignment signal to the plurality of second micro-LED elements, so that the plurality of second micro-LED elements light up in response to the alignment signal, and display a second alignment pattern to illuminate the object to be exposed, so as to update the second alignment mark on the object to be exposed to a third alignment mark based on the second alignment pattern.

In some embodiments of the present invention, the third alignment mark includes a combination of the first alignment pattern and the second alignment pattern.

The present invention provides a pattern-adjustable smart mask suitable for use with an exposure device, wherein the smart mask comprises a base plate, a plurality of first micro-LED elements, and a protective layer. The base plate is suitable for being arranged on a mask clamping portion of the exposure device and fixed by the illumination clamping portion. The plurality of first micro-LED elements are arranged in an array on the base plate to be lit up to display a light pattern for defining an exposure pattern. The protective layer covers at least one or more of the plurality of micro-LED elements. The size of at least one of the plurality of first micro-LED elements is between 0.1 micron and 20 microns, and the number of the plurality of first micro-LED elements is set so that the array has a light-emitting area between 625 square millimeters and 52900 square millimeters.

In some embodiments of the present invention, the exposure equipment suitable for use with a smart mask includes a mask aligner or a stepper.

In some embodiments of the present invention, the mask clamping portion includes a vacuum suction groove.

The present invention provides a method for forming an exposure pattern of a smart mask, wherein the minimum resolution unit of the micro-LED array is defined so that the micro-LED array is divided into a plurality of exposure unit regions, wherein each of the exposure unit regions includes at least one micro-LED element; the smart mask includes a plurality of micro-LED elements arranged in an array, and the exposure pattern forming method includes: defining the minimum resolution unit of the micro-LED array so that the micro-LED array is divided into a plurality of exposure unit regions; exposure unit areas, wherein each of the exposure unit areas includes at least one micro-LED element; generating a visual graphic interface based on the defined minimum resolution unit, wherein the visual graphic interface includes a plurality of selection units, and the plurality of selection units correspond to the plurality of exposure unit areas respectively; and receiving parameter setting information through the plurality of selection units, and sending a control signal according to the parameter setting information to adjust the exposure parameters of the micro-LED elements in the corresponding unit area, thereby defining an exposure pattern.

In some embodiments of the present invention, the exposure parameters include one or more of the brightness, luminous intensity, continuous luminous time, and cumulative value of flashing luminous time of the micro-LED element.

10: Computer system

12: Visual Graphical Interface

100:Exposure equipment

110: Carrying platform

112: Loading area

120: Wisdom Light Shield

121: Base plate

122: Micro LEDs

130: Controller

140: Mask clamping part

150: Detector

50: Objects to be exposed

51: Photosensitive materials

511: Exposed area

512: Unexposed area

52: Substrate

220: Wisdom Light Shield

221: Base plate

222: Micro LEDs

222a: Micro LED array

223: Protective layer

310: Exposure unit area

322: Micro LEDs

410: Exposure unit area

422: Micro LEDs

503~507: Permanent dark spots

510: Exposure unit area

520: Exposure unit area

522: Micro LEDs

522a: micro LED array

522b: Permanent dark spot

530: Exposure unit area

620: Wisdom Light Shield

624: Alignment mark

6241~6244: Alignment pattern

6245:Blank range

FIG. 1 is a schematic diagram of an exposure system according to some embodiments of the present invention; FIG. 2A and FIG. 2B are schematic diagrams of a smart mask with adjustable pattern according to some embodiments of the present invention. pattern); FIG. 3 is a schematic diagram of the exposure pattern of the smart mask with adjustable pattern in some embodiments of the present invention; FIG. 4A, 4B and 4C are schematic diagrams of partial patterns of the smart mask in some embodiments of the present invention; FIG. 5 is a schematic diagram of dark spot compensation of the smart mask in some embodiments of the present invention; FIG. 6 is a schematic diagram of the smart mask with adjustable pattern in other embodiments of the present invention; FIG. 7 is a schematic diagram of the alignment mark in some embodiments according to FIG. 6; FIG. 8 is a schematic diagram of the control interface of the smart mask with adjustable pattern in some embodiments of the present invention; and FIG. 9 is a step flow chart of the exposure method in some embodiments of the present invention; and FIG. 10 is a step flow chart of the exposure method in some embodiments of the present invention.

The present invention proposes a new smart mask with adjustable pattern and an exposure device and exposure method using the same to solve the problems mentioned in the background technology and the above-mentioned problems. In order to make the above-mentioned purposes, features and advantages of the present invention more clear and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the attached figures. The following descriptions of the various embodiments of the present invention are only for illustration and are not intended to represent all embodiments of the present invention or to limit the present invention to specific embodiments. In addition, the same component number can be used to represent the same, corresponding or similar components, and is not limited to representing the same components.

In order to more clearly express the inventive concept that this disclosure intends to demonstrate, the size, proportion and quantity of the components shown in the drawings of this disclosure may be adjusted and do not represent the actual implementation status, which is hereby explained in advance.

In this disclosure, any reference to "first", "second", etc. is only used to describe different elements, regions, layers or steps, and is not used to limit the order of the elements, regions, layers or steps (except for those clearly required in the scope of the patent application).

The terms "approximately" or "substantially" mentioned in this disclosure are intended to recognize the range of numerical errors in the process that do not significantly change the operation of a specific component or do not significantly affect the function or purpose of the component. This error range is clear to those with ordinary knowledge in this field. For example, if a range of "approximately 0.1 to 1" is described, it can substantially include a range of 0%-5% deviation (assuming that it does not significantly affect the operation/purpose/function of the component).

The terms "connection" or "coupling" mentioned in this disclosure do not limit the existence of any intervening elements between the elements. In other words, the connection or coupling between two elements can mean that the two elements are directly connected/coupled to each other, or are connected/coupled to each other through other elements.

The spatial relationships mentioned in this disclosure, such as "above...", "below...", "upward", "downward", "to the left of...", "to the right of...", etc., are all exemplary descriptions based on the relative positions presented in the diagrams, and are not intended to limit the configuration status of the actual product.

FIG1 is a schematic diagram of an exposure device of some embodiments of the present invention. Referring to FIG1 , the exposure device 100 (also referred to as a self-luminous exposure system 100) includes a carrier platform 110, a smart mask 120 with adjustable patterns, a controller 130, and a mask clamping unit 140.

The carrying platform 110 has a carrying area 112 suitable for placing an object 50 to be exposed, wherein the object 50 to be exposed may be, for example, a wafer or a semiconductor substrate. In some embodiments, the carrying platform 110 may fix the object 50 to be exposed on the carrying area 112 by vacuum adsorption or mechanical clamping, but the present invention is not limited thereto.

The smart mask 120 includes a plurality of micro light emitting diode elements 122 (hereinafter referred to as "micro LEDs"), wherein each micro LED 122 receives a control signal and determines a light emitting state (e.g., whether to light up, light-up time, brightness, etc.) based on the received control signal to define an exposure pattern. In some embodiments, the smart mask 120 may also be referred to as a Micro LED array light, which may be, for example, an array composed of a plurality of micro LEDs 122 and directly or indirectly disposed on the base plate 121, wherein each micro LED 122 may be independently or regionally selected to control a corresponding light emitting state, and a single micro LED element 122 or a single micro LED element 122 array block may form a minimum resolution unit of an exposure process (e.g., a yellow light process). Multiple minimum resolution units will form corresponding exposure patterns to illuminate the object to be exposed 50, so that a photoresist pattern corresponding to the exposure pattern appears on the object to be exposed 50. It should be noted here that the type of micro-LED is not limited in the present invention. The configuration embodiment of the smart mask 120 will be further described in detail later.

The controller 130 is electrically connected to the micro LED 122 and is used to generate a control signal to control the light-emitting state of each micro LED 122. In some embodiments, the controller 130 can be a matrix circuit disposed in the base plate of the micro LED 122 to control the brightness of each micro LED 122.

The mask clamping part 140 is arranged relative to the supporting platform 110 to fix the smart mask 120, wherein when the exposure device 100 performs the alignment operation, the mask clamping part 140 will drive the smart mask 120 to align with the object to be exposed 50 disposed in the supporting area 112. In some embodiments, the mask clamping part 140 can fix the smart mask 120 by vacuum adsorption or mechanical clamping, for example, but the present invention is not limited thereto.

In some embodiments, the exposure device 100 further includes a detector 150. The detector 150 is used to detect whether each micro LED 122 is lit in response to the control signal, wherein the detector 150 can be, for example, a microscope set or an image sensor that can observe the micro pattern in real time. In some embodiments, the detector 150 can also be used to identify the alignment mark of the smart mask 120 and the object to be exposed 50, so as to obtain the relative position information between the smart mask 120 and the object to be exposed 50 according to the alignment mark. The subsequent embodiments will further explain.

In some embodiments, the exposure device 100 controls the operation of the smart mask 120 by, for example, executing control software through an external computer system 10. For example, the computer system 10 can receive the luminous data of each micro-LED detected by the detector 150, and calibrate the exposure parameters of each/each unit area of the micro LED 122 based on the luminous data. In some applications, the computer system 10 can be used to preset the light intensity of one or a unit area of the micro LED 122 before shipment or before exposure, and perform pre-compensation to achieve exposure uniformity. In addition, the control software of the exposure device 100 can provide a simple visual graphical interface (such as 12), allowing the user to instantly select the pattern to be exposed and the minimum resolution unit of each yellow light process, instantly adjust the exposure parameters for exposure, and edit, read, store, and save any exposure pattern design and exposure parameters, which may include but are not limited to: the brightness or darkness of the micro-luminescent diode, the luminous intensity, the accumulated time of continuous luminescence or flashing luminescence, etc. In some embodiments, the computer system 10 may further include control functions such as the luminous intensity compensation function of each single micro LED 122, luminous time control, luminous mode control, exposure pattern and parameter storage and editing functions.

In some embodiments, the carrying platform 110, the mask clamping part 140 and the detector 150 in the exposure device 100 can be implemented based on a general exposure device mechanism, such as a common mask aligner or stepper mechanism. Therefore, the exposure device 100 may also include (but not limited to) a mechanism that can adjust the horizontal relative position of the substrate to be processed and the mask, and a mechanism that can adjust the relative angle of the substrate to be processed and the mask on the horizontal plane. In other words, the smart mask 120 is compatible with the traditional exposure device mechanism. Taking the use of a registration type exposure machine as an example, the yellow light lithography process of a 4-inch (100mm) wafer generally uses a 5-inch mask (127mm x 127mm); an 8-inch (200mm) wafer uses a 9-inch mask (228mm x 228mm). Since the smart mask 120 in this embodiment is made using micro LEDs 122, the above mask size can be achieved while ensuring the process line width requirements, and is therefore compatible with traditional exposure equipment.

Specifically, the exposure device 100 described in this embodiment can use the smart mask 120 to replace or use the traditional mask in conjunction with the exposure process, and achieve the requirement of whether the photosensitive material in a specific area is exposed or not by using the brightness and darkness of the light-emitting diode. When performing exposure by the exposure device 100, the smart mask 120 can be first placed on the mask clamping part 140 (that is, the original mask position of the common alignment exposure machine), for example, by fixing the smart mask 120 through a vacuum suction groove mechanism. The object 50 to be exposed is fixed by the carrying area 112 of the carrying platform 110 for fixing the mask and its fixing mechanism (for example, a vacuum suction groove) in the original fixed substrate method of the common exposure machine. The luminous surface of the smart mask 120 faces the side of the object to be exposed 50 (e.g., a process substrate) where a photosensitive material 51 is disposed, wherein the photosensitive material 51 is disposed on a substrate 52 of the object to be exposed 50, and the photosensitive material 51 may be, for example, a photoresist or a photosensitive polymer material, but the present invention is not limited thereto. Generally speaking, the photosensitive material 51 of the object to be exposed 50 faces upward, that is, the luminous surface of the smart mask 120 faces downward. This exposure method can use an optical microscope or an image sensor and a mechanism of a common alignment exposure machine to adjust the relative position of the XY plane of the object to be exposed 50 and the smart mask 120 to complete the alignment procedure, and use an exposure machine or a similar mechanism to adjust the Z-direction distance between the process substrate plane and the smart mask 120 plane to the optimal exposure position to complete the pre-exposure action. Then, the lighting and lighting time of each micro LED 122 are controlled through the computer system 10 and the visual graphic interface 12 provided by the control software to achieve the desired exposure effect and exposure pattern. The illuminated area of the single/unit area of the micro LED 122 is the exposed area 511 of the photosensitive material 51; the unlit area of the micro LED 122 (dark area) is the unexposed area 512 of the photosensitive material 51. The exposure pattern composed of the light and dark of all micro LEDs 122 can be 1:1 with the pattern size of the actual exposure process to be performed (such as yellow light lithography process).

Compared to a traditional mask that only provides one pattern and is expensive, the innovative exposure device 100 and the exposure method implemented by the present disclosure can meet various exposure pattern requirements. Only by resetting the visual graphics interface 12 of the computer system 10, the micro LED 122 array in the smart mask 120 can form the required exposure pattern, so it can be reused multiple times, greatly reducing the process cost. In addition, since the exposure device 100 uses the computer system 10 and its control software to control a single or multiple micro LEDs 122 to form a specific exposure pattern in real time, there is no need to wait for the commissioned mask production time, which greatly reduces the time cost of research and development.

It is worth mentioning here that the smart mask described in the disclosed embodiment is not similar to the traditional mask, which is only used for light source shielding, but can be regarded as replacing the original exposure source and mask function (or can be regarded as the integration of the exposure source and the traditional mask), and can be used in conjunction with the traditional alignment exposure machine, so as to use the mechanism of the exposure machine to adjust the alignment and some exposure parameters. In addition, the exposure equipment 100 and its smart mask 120 proposed in the disclosure can provide the process executor with the choice of using the smart mask 120 or the traditional mask according to the key dimensions of different processes in the same manufacturing process, and can be used in a continuous single exposure mode or staggered. Since the traditional mask can realize a finer line width design, the combination of the two can improve the flexibility of process selection, thereby optimizing the process, so it has the value and benefit of combination.

The following uses the embodiments of Figures 2A to 2D to further illustrate the application examples of the smart light mask 120. Figures 2A and 2B are schematic diagrams of smart light masks with adjustable patterns in some embodiments of the present invention; Figures 2C and 2D are schematic diagrams of micro LEDs in some embodiments of the present invention.

Please refer to FIG. 2A and FIG. 2B simultaneously, where FIG. 2A is a side view embodiment of the smart light mask 220, and FIG. 2B is a top view embodiment of the smart light mask 220. In some embodiments, a micro-LED array 222a composed of a plurality of micro LEDs 222 arranged in an array can be regarded as a main component of the smart light mask 220, and the smart light mask 220 further includes a base plate 221 and a protective layer 223. The micro-LED array 222a is directly or indirectly mounted on the base plate 221. The protective layer 223 covers at least one or more of the plurality of micro LEDs 222. In the figure, the outermost layer of the light-emitting surface of the smart light cover 220 is completely covered by the protective layer 223 as an example, but the present invention is not limited to this. In addition, in some embodiments, the smart light cover 220 may also include an optical adjustment layer, or the protective layer 223 itself has an optical adjustment function.

In some embodiments, the micro LED 222 may be composed of a micro-light-emitting diode array 222a using micron-sized ultraviolet LED grains, wherein the planar size of the micro LED 222 may be, for example, between 0.1 microns and 100 microns, and in particular, between 5 microns and 20 microns. In some practical applications, the planar size of the micro LED 222 may be, for example, between 0.1 microns and 20 microns. In addition, the emission wavelength range of the micro LED 222 may be, for example, between 200 nanometers and 450 nanometers. In some applications, the emission wavelength range of the micro LED 222 may be, for example, between 200 nanometers and 400 nanometers.

In some embodiments, micro LED 222 can be realized by using flip-chip type and vertical type micro LED chips, which have different manufacturing processes and structural configurations. For example, the flip-chip type micro LED 222 includes a light-emitting portion and two electrodes, wherein the two electrodes are arranged on the same side of the light-emitting portion. The vertical type micro LED 222 also includes a light-emitting portion and two electrodes, and the difference between it and the flip-chip type is that the two electrodes of the vertical type are distributed on the upper and lower sides of the light-emitting portion. Generally speaking, the vertical type micro LED 222 can achieve higher resolution requirements.

Specifically, the size of the smart mask 220 can be similar to that of glass or quartz masks generally used in conventional alignment exposure machines. The base plate 221 may be made of glass, quartz, plastic, silicon, or silicon carbide, and its thickness may be, for example, between 500 microns and 1 centimeter. The maximum luminous area of the smart mask 220 (i.e., the area of the micro-LED array 222a) may be, for example, between 100 square millimeters (mm ² ) and 52,900 square millimeters. In some practical applications, it may be between 625 square millimeters and 52,900 square millimeters, which is roughly equivalent to a square with a side length of 1 inch to 9 inches. The overall size of the smart mask 220 can be designed to be slightly larger than the size of the object to be exposed (such as 50), and the actual maximum luminous area can be designed to be approximately equal to or smaller than the size of the object to be exposed.

In other words, the smart mask 220 can be designed to be similar in size and thickness to a traditional mask, so it can be directly set in the mask fixing position of a traditional alignment exposure machine and directly replace the original exposure light source and mask function. The multiple designated micro LEDs 222 of the micro-LED array 222a emit light by themselves to form an exposure pattern, thereby achieving the purpose of direct exposure.

The following is a more detailed description of the process of controlling the smart mask 220 to form an exposure pattern, with Figures 3 to 5, wherein Figure 3 is a schematic diagram of the exposure pattern of a smart mask with an adjustable pattern in some embodiments of the present invention; Figures 4A to 5B are schematic diagrams of partial patterns of the smart mask in some embodiments of the present invention.

Please refer to Figure 3. Before executing the exposure process, the user can use the computer system to define the minimum resolution unit of the smart mask so that the micro LED array is divided into multiple exposure unit areas 310, where each exposure unit area may include multiple micro LEDs arranged in an x*y array, where the x and y values are natural numbers that can be defined by the user. The dotted squares are the expected exposed area EA, and the blank squares are the expected non-exposed area NEA. The size P is the minimum line width required for this embodiment. The subsequent Figures 4A to 4C will use the area 300p composed of 3x3 exposure unit areas 310 (i.e., the minimum line width unit) to illustrate the Micro LED exposure mode corresponding to this area.

In some embodiments, if the size of a single micro LED is slightly smaller than the minimum line width required by the embodiment, a single micro LED 322 with a size of L1 will be responsible for the exposure behavior of an exposure unit area 410 (i.e., the area requiring the minimum line width unit P1xP1), as shown in FIG. 4A. There is a small spacing D1 between two micro LEDs 422. In some embodiments, the spacing D1 may be, for example, between 0.01 microns and 20 microns, and in particular, may be, for example, between 1 micron and 4 microns, so as to meet the line width requirements of the exposure process. In some practical applications, the minimum line width unit P1 may be designed to be greater than or equal to 1 micron, and the spacing D1 between two adjacent micro LEDs 422 is less than or equal to 1 micron.

Please refer to FIG. 4B. If the exposure pattern of the local area 300p of the embodiment of FIG. 3 is to be achieved, the micro LED 422 in the exposure unit area 410 to be exposed is expected to be driven to light up (marked as ON); the micro LED 422 in the exposure unit area 410 not to be exposed will remain as a dark spot (marked as OFF). All the lit micro LEDs 422 will form the expected exposure pattern. For all the micro LEDs that need to be lit, the lighting order is not limited to lighting up a single micro LED in sequence, lighting up multiple micro LEDs in batches, or lighting up all at once.

In some embodiments, if the size of a single micro LED is much smaller than the minimum line width required by the embodiment, that is, a required exposure unit area 410 includes multiple micro LEDs, as shown in FIG. 4C. To achieve the exposure pattern of area 300p in the embodiment of FIG. 3, the exposure behavior of an exposure unit area 510 (i.e., the required minimum line width unit P2xP2) will be responsible for multiple micro LEDs 522 of size L2, and there is a small spacing D2 between two micro LEDs. In some embodiments, the spacing D2 may be, for example, between 0.01 microns and 20 microns, and in particular, may be, for example, between 1 micron and 4 microns, so as to meet the line width requirements of the exposure process. In some practical applications, the minimum line width unit P2 is less than or equal to 1 micron, and the spacing D2 between two adjacent micro LEDs 522 is less than or equal to 1 micron. In this embodiment, each exposure unit area 510 includes 4x4 micro LEDs as an example. It is expected that the micro LED array 522a in the exposure unit area 510 to be exposed will be driven to light up (marked as ON); the micro LED array 522a in the exposure unit area 410 not to be exposed will remain as a dark spot (marked as OFF). All the lit micro LEDs 522 will form the expected exposure pattern. For all micro LEDs that need to be lit, the lighting order is not limited to lighting a single LED in sequence, lighting multiple LEDs in batches, or lighting all at once.

In the embodiment of FIG. 4C, such an ultra-high resolution micro LED array may have some micro LEDs that become permanent dark spots due to inherent local defects. In order to compensate for the impact of these dark spots on the exposure process, the present disclosure also proposes a control method for dark spot compensation to solve the above problem. Taking the exposure pattern of area 300p of the embodiment of FIG. 3 as an example, FIG. 5 shows a schematic diagram of the exposure pattern when dark spots occur.

Please refer to FIG. 5 , which continues the example of the exposure unit area 510 configuration of the embodiment of FIG. 4C , that is, each exposure unit area 510 includes 4x4 micro LEDs, and the micro LED array 522a in the area EA expected to be exposed will be driven to light up (marked as ON); the micro LED array 522a in the area NEA not expected to be exposed will remain as a dark spot (marked as OFF), wherein both the area EA expected to be exposed and the area NEA not expected to be exposed may contain micro LEDs that cannot work normally, such as permanent dark spots (such as 522b) caused by damaged micro LEDs, or aging of the micro LEDs due to long-term operation, resulting in a phenomenon of light intensity attenuation. The following uses a damaged permanent dark spot (marked as permanent OFF) as an example for explanation, but those with ordinary knowledge in the field can understand after referring to the following description that the compensation control described in this embodiment can be applied to compensate for various types of micro LEDs that cannot work normally, and is not limited to damaged permanent dark spots.

In some embodiments, when a dark spot is detected, the smart mask can compensate for it by adjusting the luminous state of the micro LED 522a around the permanent dark spot, such as adjusting the luminous brightness (for example, adjusting the luminous intensity of individual micro LEDs or the total luminous amount of all micro LEDs in the exposure unit area) or directly increasing the expected luminous time in the corresponding exposure unit area, so that each exposure unit area can maintain a uniform and equivalent exposure effect and maintain the stability of the process. The present invention does not limit the compensation calculation method.

In other words, when there are z micro LEDs in the exposure unit area that are not working properly, the light emission state of at least one of the remaining micro LEDs in the exposure unit area that are in normal working state will be adjusted to compensate for the z micro LEDs that are not working properly, where z is a natural number and z<x*y.

The following is an explanation of the compensation method for adjusting the luminous brightness. First, take the exposure unit area 520 with a bad spot as a permanent dark spot 503 as an example. The permanent dark spot 503 occupies 1/16 of the area of the exposure unit area 520. When the smart mask detects the dark spot 503 (which can be detected by a detector), the smart mask can select one or more micro LEDs around the dark spot 503 and increase their luminous brightness so that the overall brightness of the exposure unit area 520 can be maintained at the luminous brightness when there is no dark spot. Taking the exposure unit area 530 as an example, there are four bad spots in the exposure unit area 530 as permanent dark spots 504-507, which occupy 4/16 of the total minimum line width unit. When the smart mask detects a dark spot 504-507, the smart mask can select one or more micro LEDs around the dark spot 504-507 and increase their luminance, so that the overall brightness of the exposure unit area 530 can be maintained at the luminance when there is no dark spot, and substantially maintain the same/similar brightness as the exposure unit area 520.

In other words, in an exposure unit area where all micro LEDs are in a normal working state, each micro LED in the micro LED array has a first brightness. If one or more dark spots are generated in the exposure unit area, the smart mask will adjust the luminous brightness of at least one of the remaining micro LEDs in the exposure unit area that are in a normal working state to a second brightness greater than the first brightness. The control of adjusting the luminous brightness can be, for example, based on the number of dark spots, increasing the current value of the remaining micro LEDs that are in a normal working state to a set compensation current value, or determining the compensation current value of the remaining micro LEDs that are in a normal working state by detecting the brightness of the exposure unit area 520, but the present invention is not limited thereto.

Next, the compensation method for adjusting the luminous time is described. First, an exposure unit area 520 having a bad spot as a permanent dark spot 503 is used as an example. The permanent dark spot 503 occupies 1/16 of the area of the exposure unit area 520. When the smart mask detects the dark spot 503, the smart mask can select one or more micro LEDs around the dark spot 503 and extend their luminous period so that the exposure (luminous exposure, i.e., the luminous flux per unit area in a certain period of time, lx*s) of the exposure unit area 520 can be maintained the same as when there is no dark spot. For example, the smart mask can adjust the lighting time of the remaining 15 micro LEDs in the exposure unit area 520 that are working normally to 16/15 times the original time, so that the exposure of the exposure unit area 520 can be maintained the same. Taking the exposure unit area 530 as an example, there are four bad spots in the exposure unit area 530, which are permanent dark spots 504-507, accounting for 4/16 of the total minimum line width unit. When the smart mask detects the dark spots 504-507, the smart mask can select one or more micro LEDs around the dark spots 504-507 and extend their light-emitting period so that the exposure of the exposure unit area 530 can be maintained the same as when there is no dark spot. For example, the smart mask can adjust the lighting time of the remaining 15 micro LEDs in the exposure unit area 530 that are working normally to 16/12 times the original, so that the exposure of the exposure unit area 530 can be maintained the same, and substantially maintain the same/similar brightness as the exposure unit area 520.

In other words, under this compensation method, when z micro LEDs in the exposure unit area are not working properly, the lighting time of at least one of the remaining micro LEDs in normal working state will be adjusted to a second period that is greater than the original set period (or first period). In some embodiments, the first period and the second period may meet the following functional relationship:

Wherein, T1 is the first period, T2 is the second period, and n is a constant setting value used to compensate for environmental influences or process deviations.

After the above compensation, the micro LED array in each exposure unit area (regardless of whether there are dark spots) can also form the expected exposure pattern. For all micro LEDs that need to be lit, the lighting order is not limited to lighting a single one in sequence, lighting multiple ones in batches, or lighting all at once. In addition, in some embodiments, as shown in Figures 4C and 5, since the size L2 and the spacing D2 are both smaller than the minimum line width P2 of the exposure process capability, the permanent dark spots (such as 503-507) and the spacing between two micro LEDs will not affect the continuity of the overall exposure pattern.

Please refer to FIG. 2A and FIG. 2B again. The smart mask 220 may further include a plurality of alignment marks 224, which are used to assist the exposure mechanism in performing alignment operations during the manufacturing process. In some embodiments, the alignment mark 224 may be implemented using a metal film that is opaque to visible light. In other embodiments, the alignment mark 224 may also be combined with a micro LED to generate a new alignment mark on the object to be exposed.

In the embodiment of using the alignment mark 224 with the micro LED, the micro LED 222 used for the exposure process (hereinafter referred to as the exposure micro LED 222) can be, for example, set in the central area CTA of the bottom plate 221, and the micro LED used for generating the alignment mark (hereinafter referred to as the alignment micro LED) can be, for example, set in the peripheral area of the bottom plate 221 (i.e., the area on the bottom plate 221 other than the central area CTA). The figure takes the area set inside/around the alignment mark 224 as an example, but the present invention is not limited thereto. In some embodiments, the alignment micro LED can also be set in the array of the exposure micro LED 222, or a part of the exposure micro LED 222 can be used as the alignment micro LED control during the positioning period. In other words, the alignment micro LED can be located outside the exposure Micro LED array 222a or inside the array 222a, as long as the alignment micro LED is positioned so as to illuminate the exposure area of the object 50 to be exposed.

The following is a further explanation of the micro LED alignment configuration embodiments with reference to FIG6 and FIG7 , wherein FIG6 is a schematic diagram of an adjustable pattern smart mask of other embodiments of the present invention; FIG7 is a schematic diagram of alignment marks of some embodiments according to FIG6 .

Please refer to FIG. 6 and FIG. 7 at the same time. This embodiment is substantially the same as the embodiment of FIG. 2 above. The difference is that in addition to the alignment mark set in the alignment mark area 624 of the smart mask 620, there is also an alignment micro LED that assists in forming the substrate alignment mark. In this embodiment, the alignment mark 624 includes several alignment patterns as an example, such as a square, a cross, etc., but the present invention does not limit the shape of the alignment mark. A person with ordinary knowledge in the art can design the alignment patterns 6241 and 6242 composed of metal thin films and the alignment patterns 6243 and 6244 composed of micro LEDs 622' in the alignment mark area 624 based on the knowledge of the yellow light lithography process. The blank area 6245 in the alignment mark 624 area, for example, refers to an area where no mark or structure that is opaque to visible light or infrared light is set. The blank area 6245 may, for example, only have a base plate (such as 221), a protective layer (such as 223), and a transparent conductive film material wire that is transparent to visible light and infrared light, such as indium tin oxide (ITO), aluminum-doped zinc oxide (AZO), etc. Through the mixed design of alignment patterns 6241 to 6244, the smart mask 620 can be mixed with traditional masks to complete multiple-pass multi-layer stacked microstructure components when performing an exposure process with a conventional common alignment exposure machine. For example, if the first yellow light lithography process uses the smart mask 620 for exposure according to the use demand assessment, the alignment micro LEDs 622' (for example, 9 alignment micro LEDs 622' forming a cross pattern) that form the alignment pattern 6243 can be lit to generate a first set of alignment marks for use in subsequent processes. In other words, after the first exposure process, the object to be exposed 50 will have an alignment mark corresponding to the alignment pattern 6243, and the exposure equipment in the subsequent process will perform alignment operations based on this alignment mark. If the object 50 to be exposed has undergone at least one yellow light lithography process, and the object 50 to be exposed has the alignment mark required for the subsequent process (for example, the alignment mark corresponding to the alignment pattern 6242), then when executing a new exposure process, the exposure equipment can perform an alignment operation based on the opaque metal film alignment pattern 6242 on the smart mask 620 and the alignment mark on the object 50 to be exposed.

After the object 50 to be exposed has gone through multiple processes, the alignment mark on it may be affected in each process and become blurred, thereby causing the alignment accuracy to decrease or causing alignment errors/failures. In some embodiments, the smart mask 620 can generate new alignment marks on the object 50 to be exposed by aligning the micro LED 622' for use in subsequent processes, thereby solving the above-mentioned problems of reduced alignment accuracy or alignment failures. Taking FIG. 7 as an example, when the object 50 to be exposed already has an alignment mark corresponding to the alignment pattern 6241, when the smart mask 620 is used for exposure, the exposure equipment will first perform an alignment operation based on the alignment pattern 6241 in the alignment mark 624 and the alignment mark on the object 50 to be exposed. After the alignment is completed, the smart mask 620 is exposed and the alignment micro LEDs 622' that form the alignment pattern are lit up (for example, 9 alignment micro LEDs 622' that form the cross-shaped alignment pattern 6243 are lit up) to generate a new alignment pattern on the object to be exposed 50. This new alignment pattern can be used as a new alignment mark for the object to be exposed 50 for alignment in subsequent processes.

Although the above description is based on the example of forming a new alignment pattern 6243 at a position different from the old alignment pattern 6241 as an implementation example of generating a new alignment mark (i.e., the new alignment pattern 6243 is used alone as a new alignment mark of the object 50 to be exposed), the present invention is not limited thereto. In some embodiments, the smart mask 620 can also define a new alignment pattern within/near the old alignment mark of the object 50 to be exposed, so that the old alignment pattern of the object 50 to be exposed and the newly added alignment pattern are combined to form a new alignment mark. For example, when the object 50 to be exposed already has an alignment mark corresponding to the alignment pattern 6242, when the smart mask 620 is used for exposure, the exposure device will first perform an alignment operation based on the alignment pattern 6242 in the alignment mark 624 and the alignment mark on the object 50 to be exposed. After the alignment is completed, the smart mask 620 will be exposed and the alignment micro LEDs 622' (for example, 16 micro LEDs 622' forming four rectangular alignment patterns 6244) will be lit to generate a new alignment pattern on the object 50 to be exposed. At this time, the old rectangular frame pattern (corresponding to 6242) on the object to be exposed 50 and the newly defined four smaller rectangular patterns 6244 can be combined to form a new inverted cross-shaped alignment pattern as a new alignment mark for subsequent process alignment. By combining the old alignment pattern and the newly added alignment pattern to form a new alignment mark, in addition to maintaining the alignment accuracy requirements of the subsequent process, the area consumed by the alignment mark can be effectively limited, thereby improving wafer utilization.

FIG8 is a schematic diagram of the control interface of the smart mask with adjustable pattern in some embodiments of the present invention. Referring to FIG8, in this embodiment, the visual graphical interface provided by the control software can be configured with (but not limited to) the following functions: (1) directly click on the brightness setting of each single micro LED in the left exposure area (and zoom in and out the local exposure area through the mouse wheel or keyboard dark key); (2) one-click setting of the whole screen to bright (marked as "All clear") or dark (marked as "All dark"), negative mode (marked as "reverse color”, that is, one-click conversion of the pattern from light to dark and from dark to light. When selecting positive photoresist and negative photoresist, the pattern can be switched directly on the same pattern); (3) main parameter setting functions, including light intensity (labeled as “Intensity”), exposure time (labeled as “Time”), exposure frequency, etc.; (4) save/read pattern and all corresponding exposure parameter settings (save pattern/parameters are labeled as “Save” and “Save as”, read pattern is labeled as “Load pattern”, read parameter is labeled as “Load recipe”), execute exposure (labeled as “Go Exposure”), etc.

In addition, in some embodiments, the control software also includes a luminous compensation function for each single micro LED, which means that the software can set the degree of compensation for each single micro LED based on a direct or indirect result of detecting the luminous intensity of each micro LED to achieve overall luminous uniformity. For example, the smart mask of the disclosed embodiment can directly or indirectly scan the luminous intensity of all micro LEDs in the exposure range before leaving the factory to understand the luminous uniformity in the overall exposure range. During compensation, the controller will default to assign a higher current or voltage to the micro LED with lower light intensity to adjust the light intensity of the micro LED to the overall expected average value; while the micro LED with brighter light intensity will be defaulted to assign a lower current or voltage to adjust the light intensity of the micro LED to the overall expected average value. In addition, the compensation setting mentioned here also includes increasing the local light intensity of the micro LEDs around the permanent dark spot to the overall expected light intensity average value. Then, the corresponding compensation setting code is generated for the above compensation plan, so that the user can directly enter the compensation setting code when executing the software program for the first time to complete the initial compensation setting for the Micro LED array light. This procedure is used to meet calibration requirements before shipment, after maintenance, or before exposure.

In some embodiments, the computer system and control software can preset the light intensity of a Micro LED or an exposure unit area before shipment or exposure through initial measurement, and make advance compensation to achieve exposure uniformity. The control software also provides a simple interface, allowing users to instantly select the pattern to be exposed and the minimum resolution unit of each yellow light process, and instantly adjust the exposure parameters for exposure. It can also edit, read, save, and save any exposure pattern design and important exposure parameters including: the brightness or darkness of the Micro LED, the luminous intensity, the accumulated time of continuous luminescence or flashing luminescence, etc.

FIG9 is a flow chart of the steps of the exposure method of some embodiments of the present invention. Referring to FIG9, the exposure method described in this embodiment can be implemented in conjunction with the hardware, operation and interface described in the embodiments of FIG1 to FIG8. The exposure method includes the following steps: First, the exposure device (such as 100) performs an alignment operation to align a plurality of first micro-LED elements (such as 122/222/422/522/622) formed in an array on the smart mask (such as 120/220/620) with the object to be exposed (such as 50), and make the light-emitting surfaces of the plurality of first micro-LED elements (such as the side of the bottom plate 121/221 on which the first micro-LED elements are disposed) face the object to be exposed (step S910). For example, the exposure equipment can use an image sensor or a charged coupled device (CCD) to recognize/identify the alignment marks on the smart mask and the object to be exposed to obtain the position information of the smart mask and the object to be exposed, and then adjust the relative position of the smart mask and the object to be exposed based on the position information. For example, the alignment marks on the smart mask and the object to be exposed can be adjusted to overlap each other in the same axial direction to achieve alignment/alignment operations. Next, the smart mask can use a controller (such as 130) to send a first control signal to the plurality of first micro-LED elements, so that the plurality of first micro-LED elements respond to the control signal to light up and display a first light-emitting pattern, which can be, for example, the light-emitting pattern shown in FIG. 3 (step S920); and the first light-emitting pattern is used to illuminate the object to be exposed, so as to define a first exposure pattern on the object to be exposed (step S930). Here, the exposure pattern can be, for example, a pattern for forming a circuit on a conductive layer, or a pattern for forming a through hole on an insulating layer, but the present invention is not limited thereto. After the above-mentioned exposure process is completed, the exposed object can continue to undergo other processes, such as developing, hard baking, etching and/or photoresist removal, etc., but the present invention is not limited thereto.

After the subsequent process is completed, if the object needs to undergo the next exposure process, the smart mask described in this embodiment only needs to use the controller to send a second control signal to the multiple exposure micro LEDs after the alignment operation, so that the multiple exposure micro LEDs respond to the control signal to light up and display the second light-emitting pattern (i.e., repeat the above steps S910 to S930), and the second exposure process can be realized without replacing a new mask.

In some embodiments, the smart mask can also use the alignment micro LED to form an alignment mark on the object to be exposed for alignment in subsequent processes. For example, the smart mask can use the controller to send an alignment signal to the alignment micro LED, so that the alignment micro LED lights up in response to the alignment signal and forms an alignment mark on the object to be exposed (step S940). In step S940, if the object to be exposed is an unprocessed wafer (without an alignment mark), the smart mask can use the alignment micro LED to form the first alignment mark on the wafer for alignment in subsequent processes; if the object to be exposed is a wafer with an alignment mark, the smart mask can first be aligned based on the existing alignment mark, and the alignment mark of the wafer can be updated using the alignment micro LED during exposure to maintain the alignment accuracy of subsequent processes. The specific implementation example of step S940 can refer to the description of the embodiments of FIG6 and FIG7, and will not be repeated here. In addition, in the step flow of FIG9, although step S940 is shown as being subsequent to step S930, in actual application, these two steps are not necessarily sequential, and step S940 may be executed before step S930, or they may be executed at the same time. The present invention does not limit this, and the relevant requirements shall be subject to the description of the scope of the patent application.

In some embodiments, the exposure method may further include a correction and compensation step S900 before step S910. The correction and compensation step S900 includes: detecting whether any exposure micro LED in any exposure unit area is in a state of not being able to work normally (step S902); when z exposure micro LEDs in the exposure unit area are in a state of not being able to work normally, adjusting the luminous state of at least one of the remaining exposure micro LEDs in the corresponding exposure unit area that are in a normal working state to compensate for the z exposure micro LEDs that are not working normally (step S902). The specific implementation example of step S902 can refer to the description of the embodiment of Figure 5, and will not be repeated here.

FIG. 10 is a flow chart of the steps of the method for forming an exposure pattern of a smart mask according to some embodiments of the present invention. Referring to FIG. 10 , the method for forming an exposure pattern described in this embodiment can also be implemented in conjunction with the hardware, operation and interface described in the embodiments of FIGS. 1 to 8 . The method for forming an exposure pattern includes the following steps: defining the minimum resolution unit of the micro-LED element array (such as 222a/522a) so that the micro-LED element array is divided into a plurality of exposure unit areas (such as 310/510/520/530), wherein each of the exposure unit areas includes at least one micro-LED element (step S10); based on the defined The minimum resolution unit generates a visual graphic interface (such as the interface of the embodiment of FIG. 8 ), wherein the visual graphic interface includes a plurality of selection units (such as the grid area on the left side of FIG. 8 , each grid may, for example, represent a selection unit), and the plurality of selection units correspond to the plurality of exposure unit areas respectively (step S1020); receiving parameter setting information (such as the brightness or darkness of the Micro LED, the luminous intensity, the accumulated time of continuous luminescence or flashing luminescence, etc.) through the plurality of selection units (step S1030); and sending a control signal according to the parameter setting information to adjust the exposure parameters of the micro-LED element in the corresponding unit area, thereby defining an exposure pattern (step S1040).

In addition, it should be noted that in order to clearly explain the various inventive features of the present disclosure, this article uses multiple embodiments to explain each embodiment as follows. However, it does not mean that each embodiment can only be implemented alone. A technician familiar with this field can design feasible implementation examples together according to needs, or replace the replaceable components/modules in different embodiments according to design requirements. In other words, the implementation method taught by this case is not limited to the state described in the following embodiments, but also includes the replacement and arrangement combination between various embodiments/components/modules under feasible circumstances, which is described in advance.

10: Computer system

12: Visual Graphical Interface

100:Exposure equipment

110: Loading platform

112: Loading area

120: Wisdom Light Shield

121: Bottom plate

122: Micro LED

130: Controller

140: Mask clamping part

150: Detector

50: Objects to be exposed

51: Photosensitive materials

511: Exposed Area

512: Unexposed area

52: Substrate

Claims (15)

A smart light mask with adjustable pattern comprises: a base plate; a plurality of first micro-LED elements (micro-LED) arranged in an array on the base plate; and a protective layer covering at least one or more of the plurality of first micro-LED elements, wherein the size of at least one of the plurality of first micro-LED elements is between 0.1 micron and 100 micron, and the distance between at least two adjacent first micro-LED elements of the plurality of first micro-LED elements is between 0.1 micron and 100 micron. .01 micron to 20 microns, wherein the plurality of first micro-LED elements determine the luminous state based on the control signal received from the circuit on the base plate to define the exposure pattern, wherein the plurality of first micro-LED elements are divided into a plurality of exposure unit areas, at least one of the plurality of exposure unit areas includes a plurality of the first micro-LED elements arranged in an x*y array, and x and y are natural numbers, and wherein each of the plurality of exposure unit areas is less than or equal to the minimum line width in the exposure pattern. As described in claim 1, the smart mask with adjustable pattern, wherein the base plate has a first area and a second area, and the plurality of first micro-light-emitting diode elements are arranged in the first area. The smart mask with adjustable pattern as described in claim 2 further includes: a plurality of second micro-light emitting diode elements (micro-LEDs) disposed in the second area of the base plate and used to display the alignment pattern through control. The smart mask with adjustable pattern as described in claim 3, wherein the first area includes the central area of the base plate, and the second area includes the peripheral area of the base plate. The smart mask with adjustable pattern as described in claim 1, wherein when z first micro-LED elements in one of the exposure unit regions are in a state of not being able to work properly, the luminous state of at least one of the remaining first micro-LED elements in the one of the exposure unit regions that are in a normal working state is adjusted to compensate for the z first micro-LED elements that are not working properly, wherein z is a natural number, and z<x*y. As described in claim 5, the adjustable pattern smart mask, wherein when the plurality of first micro-LED elements are in a normal working state, the plurality of first micro-LED elements are controlled to remain lit during a first period. The smart mask with adjustable pattern as described in claim 6, wherein when z of the first micro-LED elements in one of the exposure unit regions are in a state of being unable to work normally, the lighting time of at least one of the remaining first micro-LED elements in a normal working state is adjusted to a second period greater than the first period. The smart mask with adjustable pattern as described in claim 7, wherein the first period and the second period satisfy the following relationship:

Wherein, T1 is the first period, T2 is the second period, and n is a constant. The smart mask with adjustable pattern as described in claim 5, wherein when the plurality of first micro-LED elements are in a normal working state, the plurality of first micro-LED elements are controlled to have a first brightness; and when z first micro-LED elements in one of the exposure unit regions are in a state where they cannot work normally, the light emitting brightness of at least one of the remaining first micro-LED elements in a normal working state is adjusted to a second brightness greater than the first brightness. An exposure device includes: a carrier platform having a carrier area suitable for setting an object to be exposed; a smart mask with adjustable pattern, including a plurality of first micro-light emitting diode elements (micro-LED), wherein each of the first micro-light emitting diode elements receives a control signal and determines a light emitting state based on the received control signal to define an exposure pattern; a controller electrically connected to the plurality of first micro-light emitting diode elements to generate the control signal to control the exposure pattern; The light-emitting states of the plurality of first micro-LED elements are controlled respectively; and a mask clamping portion is arranged relative to the carrying platform and is used to fix the smart mask with an adjustable pattern, wherein when the exposure device performs an alignment operation, the mask clamping portion drives the smart mask with an adjustable pattern to align with the object to be exposed disposed on the carrying area, wherein the mask clamping portion is suitable for fixing a conventional mask that does not include the plurality of first micro-LED elements, wherein The adjustable pattern smart mask further comprises: a base plate having a size consistent with the conventional mask, wherein the plurality of first micro-LED elements are arranged in an array on the base plate; and a protective layer covering at least one or more of the plurality of first micro-LED elements, wherein the size of at least one of the plurality of first micro-LED elements is between 0.1 micron and 100 micron, and the plurality of first micro-LED elements are The spacing between at least two adjacent first micro-LED elements in the element is between 0.01 microns and 20 microns, wherein the plurality of first micro-LED elements are divided into a plurality of exposure unit areas, at least one of the plurality of exposure unit areas includes a plurality of the first micro-LED elements arranged in an x*y array, and x and y are natural numbers, and wherein each of the plurality of exposure unit areas is less than or equal to the minimum line width in the exposure pattern. The exposure device as claimed in claim 10, wherein when z first micro-LED elements in one of the exposure unit regions are in a state of not being able to work properly, the luminous state of at least one of the remaining first micro-LED elements in the one of the exposure unit regions that are in a normal working state is adjusted to compensate for the z first micro-LED elements that are not working properly, wherein z is a natural number, and z<x*y. The exposure device as claimed in claim 11, wherein when the plurality of first micro-LED elements are in a normal working state, the plurality of first micro-LED elements are controlled to remain lit during a first period, and when z first micro-LED elements in one of the exposure unit regions are in a state where they cannot work normally, the lighting time of at least one of the remaining first micro-LED elements in a normal working state is adjusted to a second period greater than the first period. The exposure device as described in claim 12, wherein the first period and the second period satisfy the following relationship:

Wherein, T1 is the first period, T2 is the second period, and n is a constant. An exposure method for semiconductor manufacturing process, comprising: aligning a base plate provided with a plurality of first micro-LED elements (micro-LED) in an array with an object to be exposed, and making the light-emitting surfaces of the plurality of first micro-LED elements face the object to be exposed; sending a first control signal to the plurality of first micro-LED elements, so that the plurality of first micro-LED elements light up in response to the control signal and display a first light-emitting pattern; and irradiating the object to be exposed with the first light-emitting pattern, thereby defining a first exposure pattern on the object to be exposed, wherein the plurality of first micro-LED elements are divided into a plurality of exposure unit areas, the At least one of the multiple exposure unit areas includes multiple first micro-LED elements arranged in an x*y array, and x and y are natural numbers, wherein each of the multiple exposure unit areas is less than or equal to the minimum line width in the exposure pattern, wherein when z first micro-LED elements in one of the exposure unit areas are in a state of not being able to work normally, the exposure method further includes: adjusting the luminous state of at least one of the remaining first micro-LED elements in the one of the exposure unit areas that are in a normal working state to compensate for the z first micro-LED elements that are not working normally, wherein z is a natural number and z<x*y. The exposure method for semiconductor manufacturing process as described in claim 14 further includes: sending a second control signal to the plurality of first micro-LED elements, so that the plurality of first micro-LED elements light up and display a second light-emitting pattern in response to the control signal; and irradiating the object to be exposed with the second light-emitting pattern to define a second exposure pattern on the object to be exposed.