TWI866619B - Power distribution board - Google Patents

Abstract

A power distribution board includes: a complex programmable logic device (CPLD), a first buck chip and a second buck chip. The first buck chip is connected to the CPLD. The first buck chip is configured to receive a first direct-current (DC) voltage, lower the first DC voltage to a first voltage, and supply the first voltage to the CPLD. The second buck chip is configured to receive a second DC voltage, lower the second DC voltage to a second voltage, and supply the second voltage to a power module. The first DC voltage and the second DC voltage has a same voltage value.

Description

Power distribution board

The present invention relates to a power distribution board.

Most current immersive servers use 220 volt AC power through a power supply unit (PSU) to provide power to the server. However, this power supply method will cause high power loss.

In view of the above, the present invention provides a power distribution board that solves the above problems.

According to an embodiment of the present invention, a power distribution board includes: a complex programmable logic device, a first buck chip and a second buck chip. The first buck chip is connected to the complex programmable logic device, and the first buck chip is used to receive a first DC voltage, reduce the first DC voltage to a first voltage, and supply the first voltage to the complex programmable logic device. The second buck chip is used to receive a second DC voltage, reduce the second DC voltage to a second voltage, and supply the second voltage to the power module. The voltage values of the first DC voltage and the second DC voltage are the same.

In summary, compared to using 220 volt AC power to provide power to the server via a power supply unit, the power distribution board according to one or more embodiments of the present invention can effectively reduce the power consumption generated during the power transmission and conversion process.

The above description of the disclosed content and the following description of the implementation method are used to demonstrate and explain the spirit and principle of the present invention, and provide a further explanation of the scope of the patent application of the present invention.

The detailed features and advantages of the present invention are described in detail in the following implementation method. The content is sufficient for anyone familiar with the relevant technology to understand the technical content of the present invention and implement it accordingly. According to the content disclosed in this specification, the scope of the patent application and the drawings, anyone familiar with the relevant technology can easily understand the relevant purposes and advantages of the present invention. The following embodiments are to further illustrate the viewpoints of the present invention, but do not limit the scope of the present invention by any viewpoint.

Please refer to FIG. 1, which is a block diagram of a power distribution board according to the first embodiment of the present invention. As shown in FIG. 1, the power distribution board 1 includes a first buck chip 11, a second buck chip 12 and a complex programmable logic device 13. The first buck chip 11 is connected to the complex programmable logic device 13 and the DC power supply A1. The second buck chip 12 is connected to the DC power supply A1 and the power module A2.

The first buck chip 11 may be a buck converter. The input voltage of the second buck chip 12 may be 40 volts to 60 volts, the output voltage may be 12 volts, and the output power may be 1600 watts. For example, the second buck chip 12 may be a power module, and its model may be Q50SN120A4RKDS. The first buck chip 11 is used to receive a first DC voltage from a DC power source A1, reduce the first DC voltage to a first voltage, and supply the first voltage to a complex programmable logic device 13. The second buck chip 12 is used to receive a second DC voltage from a DC power source A1, reduce the second DC voltage to a second voltage, and supply the second voltage to a power module A2. The power module A2 may be a power connector for providing power to the server. The voltage values of the first DC voltage and the second DC voltage are the same. For example, the voltage values of the first DC voltage and the second DC voltage may be 48 volts to 54 volts. Further, the voltage values of the first DC voltage and the second DC voltage may be 48 volts. The first voltage may be a standby voltage, such as 3.3 volts. The second voltage may be 12 volts. Furthermore, the second step-down chip 12 may include a plurality of sub-chips, each of which is connected to its own power module and outputs a second voltage to its own power module, and the sub-chips may provide a total of 3200 watts of power.

Compared to using 220 volt AC to provide power to the server through a power supply unit (PSU), the above architecture can effectively reduce the power consumption generated during power transmission and conversion.

Please refer to FIG. 2, which is a block diagram of a power distribution board according to the second embodiment of the present invention. As shown in FIG. 2, the power distribution board 2 includes a fuse control chip 20, a first buck chip 21, a second buck chip 22, and a complex programmable logic device 23. The fuse control chip 20 is connected to the DC power supply A1, the first buck chip 21, and the second buck chip 22. The first buck chip 21 is connected to the complex programmable logic device 23. The second buck chip 22 is connected to the power module A2. The implementation of the first buck chip 21, the second buck chip 22 and the complex programmable logic device 23 of the power distribution board 2 can be the same as the first buck chip 11, the second buck chip 12 and the complex programmable logic device 13 in Figure 1, so they will not be described here in detail.

The fuse control chip 20 is used to receive power from the DC power source A1, and provide a first DC voltage and a second DC voltage to the first step-down chip 21 and the second step-down chip 22 respectively based on the received power. The fuse control chip 20 is, for example, a hot-swap voltage controller. In addition, a clip screw hold can be further provided between the fuse control chip 20 and the DC power source A1.

For example, after receiving power from the DC power source A1, the fuse control chip 20 outputs most of the power as the second DC voltage to the second buck chip 22 to power the mainboard, and outputs the remaining power as the first DC voltage to the first buck chip 21. For example, the first voltage can be a standby voltage, such as 3.3 volts.

Please refer to FIG. 3, which is a block diagram of a power distribution board according to the third embodiment of the present invention. As shown in FIG. 3, the power distribution board 3 includes a fuse control chip 30, a first buck chip 31, a second buck chip 32, a complex programmable logic device 33 and a sideband connector 34. The fuse control chip 30 is connected to the DC power supply A1, the first buck chip 31, the second buck chip 32 and the sideband connector 34. The first buck chip 31 is connected to the complex programmable logic device 33. The second buck chip 32 is connected to the power module A2. The fuse control chip 30, the first step-down chip 31, the second step-down chip 32 and the complex programmable logic device 33 of the power distribution board 3 can be implemented in the same way as the fuse control chip 20, the first step-down chip 21, the second step-down chip 22 and the complex programmable logic device 23 in FIG. 2, so they are not described here in detail.

The sideband connector 34 is connected to the complex programmable logic device 33, and is used to connect the baseboard management controller A3 on the main board to the fuse control chip 30, the first step-down chip 31, the second step-down chip 32 and the complex programmable logic device 33. The sideband connector 34 can be connected to the complex programmable logic device 33 through the interface between the integrated circuits, and connect the baseboard management controller A3 to the fuse control chip 30, the first step-down chip 31 and the second step-down chip 32 through the interface between the integrated circuits. Accordingly, the operating status of the power distribution board 3 can be output to the baseboard management controller A3 on the main board through the sideband connector 34. The operating status may include power consumption, voltage and current data of the fuse control chip 30, the first buck chip 31, the second buck chip 32 and the complex programmable logic device 33. The register of the complex programmable logic device 33 can be updated by the baseboard management controller A3 by connecting to the complex programmable logic device 33 through the sideband connector 34.

In addition, the first buck chip 31 and the second buck chip 32 can be used to output at least one of a power good signal, an alert signal, a DC power good (DCOK) signal, and an AC power good (ACOK) signal to the complex programmable logic device 33 through the sideband connector 34 for monitoring by the complex programmable logic device 33.

Please refer to FIG. 4, which is a block diagram of a power distribution board according to the fourth embodiment of the present invention. As shown in FIG. 4, the power distribution board 4 includes a fuse control chip 40, a first buck chip 41, a second buck chip 42, a complex programmable logic device 43, a sideband connector 44, a temperature sensor 45, a field replaceable unit (FRU) 46, and a general purpose parallel input/output expansion chip 47. The fuse control chip 40 is connected to the DC power supply A1, the first buck chip 41, the second buck chip 42, and the sideband connector 44. The first buck chip 41 is connected to the complex programmable logic device 43. The second buck chip 42 is connected to the power module A2. The implementation of the fuse control chip 40, the first buck chip 41, the second buck chip 42 and the complex programmable logic device 43 of the power distribution board 4 can be the same as the fuse control chip 30, the first buck chip 31, the second buck chip 32 and the complex programmable logic device 33 in Figure 3, so it is not described here in detail.

The sideband connector 44 further connects the baseboard management controller A3 to the temperature sensor 45, the field replaceable unit 46 and the universal parallel input/output expansion chip 47 through the interface between the integrated circuits. The temperature sensor 45, the field replaceable unit 46 and the universal parallel input/output expansion chip 47 are all selectively arranged components. The sideband connector 44 can be connected to at least one of the baseboard management controller A3 to the temperature sensor 45, the field replaceable unit 46 and the universal parallel input/output expansion chip 47.

The temperature sensor 45 can be used to sense the temperature of one or more components on the power distribution board 4. The universal parallel input/output expansion chip 47 can write data to the field replaceable unit 46 or read data from the field replaceable unit 46 via the sideband connector 44.

The first step-down chip 41 can be directly connected to the temperature sensor 45, the field replaceable unit 46 and the universal parallel input/output expansion chip 47 to provide a first voltage to the temperature sensor 45, the field replaceable unit 46 and the universal parallel input/output expansion chip 47.

In addition, the universal parallel input/output expansion chip 47 can be connected to the hitless pins of the complex programmable logic device 43 via the sideband connector 44. Therefore, when the baseboard management controller A3 updates the firmware of the complex programmable logic device 43 through the local area network (LAN), the complex programmable logic device 43 will not be powered off.

Please refer to FIG. 5, which is a block diagram of a power distribution board according to the fifth embodiment of the present invention. As shown in FIG. 5, the power distribution board 5 includes a first buck chip 51, a second buck chip 52, a complex programmable logic device 53, a temperature sensor 54, a field replaceable unit 55, and a universal parallel input/output expansion chip 56. The first buck chip 51 is connected to the DC power supply A1, the complex programmable logic device 53, the temperature sensor 54, the field replaceable unit 55, and the universal parallel input/output expansion chip 56. The second buck chip 52 is connected to the DC power supply A1 and the power module A2. The implementation of the first buck chip 51, the second buck chip 52 and the complex programmable logic device 53 of the power distribution board 5 can be the same as the first buck chip 11, the second buck chip 12 and the complex programmable logic device 13 in Figure 1, so they will not be described here in detail.

The temperature sensor 54, the field replaceable unit 55, and the universal parallel input/output expansion chip 56 may be respectively the same as the temperature sensor 45, the field replaceable unit 46, and the universal parallel input/output expansion chip 47 of FIG. 4.

The temperature sensor 54, the field replaceable unit 55, and the universal parallel input/output expansion chip 56 are all selectively arranged components. The first buck chip 51 can be connected to at least one of the temperature sensor 54, the field replaceable unit 55, and the universal parallel input/output expansion chip 56. After reducing the first DC voltage to the first voltage, the first buck chip 51 can further supply the first voltage to one or more of the temperature sensor 54, the field replaceable unit 55, and the universal parallel input/output expansion chip 56. For example, the first voltage received by each of the temperature sensor 54, the field replaceable unit 55, and the universal parallel input/output expansion chip 56 can be a standby voltage, such as 3.3 volts.

Please refer to FIG. 6, which is a block diagram of a power distribution board according to the sixth embodiment of the present invention. As shown in FIG. 6, the power distribution board 6 includes a first buck chip 61, a second buck chip 62, a complex programmable logic device 63, an electrically erasable programmable read-only memory (EEPROM) 64, and a light-emitting element 65. The first buck chip 61 is connected to the DC power supply A1, the complex programmable logic device 63, and the EEPROM 64. The second buck chip 62 is connected to the DC power supply A1 and the power module A2. The complex programmable logic device 63 is connected to the electronic erasable programmable read-only memory 64 and the light-emitting element 65. The light-emitting element 65 is an element that can be used to emit light of different colors, such as a light-emitting diode. The first buck chip 61, the second buck chip 62 and the complex programmable logic device 63 of the power distribution board 6 can be implemented in the same way as the first buck chip 11, the second buck chip 12 and the complex programmable logic device 13 in Figure 1, so they are not described here in detail.

Specifically, the first step-down chip 61 can provide a first voltage to the EEPROM 64, wherein the first voltage can be a standby voltage, such as 3.3 volts. The EEPROM 64 can be connected to the CPLD 63 through an interface between integrated circuits. The EEPROM 64 can be used to store a firmware backup of the CPLD 63. Therefore, when the CPLD 63 is updated (for example, by the aforementioned BMC), if an abnormality suddenly occurs during the update process, resulting in the update being suspended or failing, the CPLD 63 can be ensured to operate normally by reading the firmware backup of the CPLD 63. Furthermore, the CPLD 63 can control the light emitting element 65 to emit light corresponding to the state of the CPLD 63. For example, the normal operation state corresponds to green light. Therefore, when the complex programmable logic device 63 operates normally based on the aforementioned firmware backup, the complex programmable logic device 63 can control the light-emitting element 65 to emit green light.

Please refer to FIG. 7, which is a block diagram of a power distribution board according to the seventh embodiment of the present invention. As shown in FIG. 7, the power distribution board 7 includes a first buck chip 71, a second buck chip 72, and a complex programmable logic device 73. The first buck chip 71 is connected to the DC power supply A1 and the complex programmable logic device 73. The second buck chip 72 is connected to the DC power supply A1 and the power module A2.

The implementation of the first buck chip 71 and the complex programmable logic device 73 of the power distribution board 7 can be the same as the first buck chip 11 and the complex programmable logic device 13 in Figure 1, so they will not be described here in detail.

The second step-down chip 72 may include a connector 721. The connector 721 is used to receive at least one of a firmware update instruction and a firmware debug instruction associated with the second step-down chip 72. The firmware update instruction and the firmware debug instruction may be instructions given by a user. The firmware update instruction may be used to update the firmware of the second step-down chip 72, and the firmware debug instruction may be used to debug the firmware of the second step-down chip 72.

It should be noted that the power distribution board of the present invention can be implemented through the above multiple embodiments, as well as a combination of some or all of the above embodiments. Furthermore, the power distribution board of the present invention can be applied to immersive servers.

In summary, compared with using 220 volts of alternating current to provide power to the server through a power supply unit, the power distribution board according to one or more embodiments of the present invention can effectively reduce the power consumption generated in the process of power transmission and conversion. In addition, by connecting the baseboard management controller to the fuse control chip through the interface between the integrated circuits, the operating status of the power distribution board can be output to the baseboard management controller on the main board side, so that the baseboard management controller can monitor the operating status of the power distribution board. By connecting the universal parallel input/output expansion chip to the pins of the complex programmable logic device without interruption, the complex programmable logic device can be prevented from being powered off when being updated. By storing the firmware backup of the CPLD in electronically erasable read-only memory, the CPLD can still operate normally even if an error occurs during the update process.

Although the present invention is disclosed as above by the aforementioned embodiments, it is not intended to limit the present invention. Any changes and modifications made within the spirit and scope of the present invention are within the scope of patent protection of the present invention. Please refer to the attached patent application for the scope of protection defined by the present invention.

1,2,3,4,5,6,7: Power distribution board

11,21,31,41,51,61,71: The first step-down chip

12,22,32,42,52,62,72: Second step-down chip

13,23,33,43,53,63,73: Complex programmable logic devices

20,30,40: Fuse control chip

34,44: Sideband connector

45,54: Temperature sensor

46,55: Field replaceable unit

47,56: Universal parallel input/output expansion chip

64: Electronically erasable programmable read-only memory

65: Light-emitting element

721: Connector

A1: DC power supply

A2: Power module

A3: Baseboard management controller

FIG1 is a block diagram of a power distribution board according to the first embodiment of the present invention.

Figure 2 is a block diagram of a power distribution board according to the second embodiment of the present invention.

FIG3 is a block diagram of a power distribution board according to the third embodiment of the present invention.

FIG4 is a block diagram of a power distribution board according to the fourth embodiment of the present invention.

FIG5 is a block diagram of a power distribution board according to the fifth embodiment of the present invention.

FIG6 is a block diagram of a power distribution board according to the sixth embodiment of the present invention.

FIG. 7 is a block diagram of a power distribution board according to the seventh embodiment of the present invention.

1: Power distribution board

11: The first step-down chip

12: Second step-down chip

13: Complex programmable logic device

A1: DC power supply

A2: Power module

Claims (8)

A power distribution board includes: a complex programmable logic device; a first buck chip connected to the complex programmable logic device, the first buck chip is used to receive a first DC voltage, reduce the first DC voltage to a first voltage, and supply the first voltage to the complex programmable logic device; and a second buck chip is used to receive a second DC voltage, reduce the second DC voltage to a second voltage, and supply the second voltage to a power module, wherein the first DC voltage and the second DC voltage are The voltage value of the DC voltage is the same, wherein the power distribution board further includes: a fuse control chip connected to a DC power source, the first step-down chip and the second step-down chip, the fuse control chip is used to receive power from the DC power source, and provide the first DC voltage and the second DC voltage to the first step-down chip and the second step-down chip respectively based on the power; and a sideband connector, used to connect a baseboard management controller to the fuse control chip, the first step-down chip and the second step-down chip. The power distribution board as described in claim 1, wherein the sideband connector connects the baseboard management controller to the fuse control chip, the first buck chip and the second buck chip through an interface between integrated circuits. A power distribution board as claimed in claim 1, wherein the sideband connector connects the baseboard management controller to at least one of a temperature sensor, a field replaceable unit and a universal parallel input/output expansion chip through an interface between integrated circuits. The power distribution board as described in claim 1 further comprises: an electronic erasable programmable read-only memory connected to the complex programmable logic device through an interface between integrated circuits, and the electronic erasable programmable read-only memory is used to store the firmware backup of the complex programmable logic device. A power distribution board as described in claim 1, wherein the first step-down chip is further used to supply the first voltage to at least one of a temperature sensor, a field replaceable unit, and a universal parallel input/output expansion chip, wherein the first voltage is a standby voltage. The power distribution board as described in claim 1, wherein the second buck chip is further connected to the complex programmable logic device, and the first buck chip and the second buck chip are respectively used to output at least one of a power good signal, a warning signal, a DC power good signal, and an AC power good signal to the complex programmable logic device. A power distribution board as described in claim 1, wherein the second buck chip includes a connector for receiving at least one of a firmware update command and a firmware debug command associated with the second buck chip. A power distribution board as described in claim 1, wherein the CPLD is further connected to a light-emitting element for emitting light corresponding to the state of the CPLD.

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