TWI865198B - Antenna packaging structure - Google Patents

Abstract

An antenna packaging structure includes a flexible circuit substrate, an electronic component and an antenna substrate. The flexible circuit substrate includes a bottom conductive layer, a bottom dielectric layer, an interlayer dielectric layer and an interlayer conductive layer. The bottom dielectric layer is disposed on the bottom conductive layer. The interlayer dielectric layer and the interlayer conductive layer are stacked on the bottom dielectric layer. A first portion of the bottom conductive layer beyond the interlayer dielectric layer and a first portion of the bottom dielectric layer beyond the interlayer dielectric layer form a bendable portion of the flexible circuit substrate. The electronic component is disposed on the flexible circuit substrate and electrically connected to the flexible circuit substrate. The bendable portion of the flexible circuit substrate is bent toward the antenna substrate and is electrically connected to a coupling antenna of the antenna substrate.

Description

Antenna Package Structure

The present invention relates to a packaging structure, and in particular to an antenna packaging structure.

In order to reduce the size of the product and increase the value of the product, the antenna multi-layer structure and the chip circuit structure on the antenna multi-layer structure can be made using the redistribution layer process. Afterwards, the chip and the chip circuit structure are bonded to complete the small-volume antenna packaging structure. However, the expansion coefficients of the various material layers of the antenna packaging structure cannot be completely matched, which leads to the problem of warping of the antenna packaging structure, affecting the antenna performance.

The present invention provides an antenna packaging structure which is not prone to warping and has good performance.

The antenna packaging structure of the present invention includes a flexible circuit substrate, at least one electronic component and an antenna substrate. The flexible circuit substrate includes a bottom conductive layer, a bottom dielectric layer, at least one inter-layer dielectric layer and at least one inter-layer conductive layer. The bottom conductive layer has at least one joint. The bottom dielectric layer is disposed on the bottom conductive layer. At least one inter-layer dielectric layer and at least one inter-layer conductive layer are alternately stacked on the bottom dielectric layer. At least one inter-layer conductive layer is electrically connected to the bottom conductive layer. At least one first portion of the bottom conductive layer that exceeds at least one inter-layer dielectric layer and at least one inter-layer conductive layer and at least one first portion of the bottom dielectric layer that exceeds at least one inter-layer dielectric layer and at least one inter-layer conductive layer form at least one bendable portion of the flexible circuit substrate. The at least one bendable portion has at least one joint portion of the bottom conductive layer. At least one electronic component is disposed on the flexible circuit substrate and is electrically connected to the flexible circuit substrate. At least one inter-layer dielectric layer and at least one inter-layer conductive layer are located between at least one electronic component and the bottom dielectric layer. The antenna substrate includes a substrate and a plurality of coupling antennas disposed on two opposite surfaces of the substrate. At least one bendable portion of the flexible circuit substrate is bent toward the antenna substrate, and at least one joint portion of at least one bendable portion is electrically connected to one of the plurality of coupling antennas.

Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and description to represent the same or like parts.

It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it may be directly on or connected to another element, or an intermediate element may also exist. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intermediate elements. As used herein, "connected" may refer to physical and/or electrical connections. Furthermore, "electrically connected" or "coupled" may mean that there are other elements between two elements.

As used herein, "about," "approximately," or "substantially" includes the stated value and the average value within an acceptable deviation range of a particular value determined by a person of ordinary skill in the art, taking into account the measurement in question and the particular amount of error associated with the measurement (i.e., the limitations of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, ±5%. Furthermore, as used herein, "about," "approximately," or "substantially" can select a more acceptable deviation range or standard deviation depending on the optical property, etching property, or other property, and can apply to all properties without using one standard deviation.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by ordinary technicians in the field to which the present invention belongs. It will be further understood that those terms as defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology and the present invention, and will not be interpreted as an idealized or overly formal meaning unless expressly defined as such in this document.

1A to 1D are cross-sectional schematic diagrams of a manufacturing process of an antenna package structure according to an embodiment of the present invention.

1A , first, a release layer 120 is formed on a rigid substrate 110. For example, in one embodiment, the material of the rigid substrate 110 may be glass or stainless steel, but the present invention is not limited thereto.

Next, a flexible circuit substrate FS is formed on the release layer 120. The flexible circuit substrate FS includes a bottom conductive layer 130, a bottom dielectric layer 140, at least one inter-layer dielectric layer 150, and at least one inter-layer conductive layer 160. The bottom conductive layer 130 has at least one joint 134. The bottom dielectric layer 140 is disposed on the bottom conductive layer 130. The at least one inter-layer dielectric layer 150 and the at least one inter-layer conductive layer 160 are alternately stacked on the bottom dielectric layer 140. The at least one inter-layer conductive layer 160 is electrically connected to the bottom conductive layer 130. At least one first portion 132 of the bottom conductive layer 130 extending beyond at least one inter-layer dielectric layer 150 and at least one inter-layer conductive layer 160 and at least one first portion 142 of the bottom dielectric layer 140 extending beyond at least one inter-layer dielectric layer 150 and at least one inter-layer conductive layer 160 constitute at least one bendable portion FSa of the flexible circuit substrate FS, and the at least one bendable portion FSa has at least one joint portion 134 of the bottom conductive layer 130.

1A , in one embodiment, the flexible circuit substrate FS may selectively include a plurality of interlayer dielectric layers 150 and a plurality of interlayer conductive layers 160, wherein the plurality of interlayer dielectric layers 150 and the plurality of interlayer conductive layers 160 are alternately stacked to form a stacking structure S, the bottom conductive layer 130 has two first portions 132 extending beyond the stacking structure S and located at opposite sides of the stacking structure S, the bottom dielectric layer 140 has two first portions 142 extending beyond the stacking structure S and located at opposite sides of the stacking structure S, and the two first portions 132 of the bottom conductive layer 130 and the two first portions 142 of the bottom dielectric layer 140 constitute two bendable portions FSa of the flexible circuit substrate FS. However, the present invention is not limited thereto, and the number and positions of the bendable portions FSa may be designed differently according to actual needs.

1A , in one embodiment, the uppermost interlayer conductive layer 160 of the stacked structure S may have an electronic device pad 162, and the electronic device pad 162 is electrically connected to the joint 134 of the bottom conductive layer 130 through other interlayer conductive layers 160 below. In one embodiment, the bottom dielectric layer 140 may selectively have an opening 144, and the opening 144 of the bottom dielectric layer 140 overlaps the joint 134 of the bottom conductive layer 130. The flexible circuit substrate FS may further include a solder 170, and the solder 170 is disposed on the bottom dielectric layer 140 and fills the opening 144 to be electrically connected to the joint 134 of the bottom conductive layer 130. In one embodiment, the material of the solder 170 includes tin, for example, but the present invention is not limited thereto.

The material of the interlayer dielectric layer 150 and the bottom dielectric layer 140 may be a flexible insulating material. For example, in one embodiment, the material of the interlayer dielectric layer 150 and the bottom dielectric layer 140 may include polyimide (PI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polycarbonate (PC), polyether sulfone (PES) or polyarylate, or other suitable materials, or a combination of at least two of the aforementioned materials, but the present invention is not limited thereto.

Referring to FIG. 1B , at least one electronic component 180 is then disposed on the flexible circuit substrate FS, and the at least one electronic component 180 is electrically connected to the flexible circuit substrate FS. At least one interlayer dielectric layer 150 and at least one interlayer conductive layer 160 are located between the at least one electronic component 180 and the bottom dielectric layer 140. For example, in one embodiment, the electronic component 180 may be a driver chip, and the driver chip may be bonded to the electronic component pad 162. However, the present invention is not limited thereto, and in other embodiments, the electronic component 180 may also be other types of electronic components.

Referring to FIG. 1B , in this embodiment, a protective layer 190 may be selectively formed on the stacked structure S to cover the electronic element 180 . In one embodiment, the protective layer 190 may selectively include a molding compound. However, the present invention is not limited thereto, and in other embodiments, the protective layer 190 may also include other materials, such as a supporting substrate and an underfill disposed between the supporting substrate and the electronic element 180 .

1C , the flexible circuit substrate FS and the rigid substrate 110 are then separated. For example, in one embodiment, a laser lift-off process may be used to separate the flexible circuit substrate FS and the rigid substrate 110 , but the present invention is not limited thereto.

Fig. 2 is a top view schematic diagram of an unbent flexible circuit substrate and electronic components according to an embodiment of the present invention. Fig. 3 is a top view schematic diagram of an antenna substrate according to an embodiment of the present invention.

Please refer to FIG. 1D , FIG. 2 and FIG. 3 , then, assemble the flexible circuit substrate FS and the antenna substrate AS to complete the antenna package structure 10. The antenna substrate AS includes a substrate 210 and a plurality of coupling antennas 220 and 230 respectively disposed on two opposite surfaces 212 and 214 of the substrate 210. In detail, the two opposite surfaces 212 and 214 of the substrate 210 include a first surface 212 and a second surface 214. The coupling antenna 220 is disposed on the first surface 212 of the substrate 210 and includes a driving patch. The other coupling antenna 230 is disposed on the second surface 214 of the substrate 210 and includes a radiating patch. There is no electrical connection between the two coupling antennas 220 and 230. The substrate 210 of the antenna substrate AS has low roughness and small thickness variation. In one embodiment, the material of the substrate 210 is glass, for example, but the present invention is not limited thereto.

1D , after the flexible circuit substrate FS and the antenna substrate AS are assembled, the bendable portion FSa of the flexible circuit substrate FS bends toward the antenna substrate AS, and the joint portion 134 of the bendable portion FSa is electrically connected to the coupling antenna 220. The electronic component 180 is electrically connected to the coupling antenna 220 through the interlayer conductive layer 160 of the stacked structure S and the joint portion 134 of the bendable portion FSa.

It is worth mentioning that by bending the bendable portion FSa of the flexible circuit substrate FS to partially bond with the antenna substrate AS, the antenna substrate AS can be prevented from being warped by the flexible circuit substrate FS and affecting the flatness of the antenna substrate AS, thereby enabling the plurality of coupling antennas 220, 230 located on the two opposite surfaces 212, 214 of the base 210 to exert a good coupling effect.

Please refer to FIG. 1D . In one embodiment, the antenna package structure 10 may further optionally include a support element 192 disposed between the flexible circuit substrate FS and the antenna substrate AS. The support element 192 is used to support the flexible circuit substrate FS and its bendable portion FSa and form a stable structure with the antenna substrate AS. In one embodiment, the support element 192 may be a solid or hollow mold. For example, in one embodiment, the flexible circuit substrate FS and its bendable portion FSa and the antenna substrate AS may be assembled to the mold, and the mold may optionally have rigidity to facilitate the integration of the antenna package structure 10 into a car sunroof. However, the present invention is not limited thereto. In other embodiments, the antenna package structure 10 may also be integrated into other types of products. In one embodiment, the material of the supporting element 192 is, for example but not limited to, organic materials such as thermosetting plastic, thermoplastic plastic, and rubber.

Referring to FIG. 1D , in one embodiment, the bendable portion FSa of the flexible circuit substrate FS can be selectively bent downward to be electrically connected to the antenna substrate AS, and the stacked structure S can be disposed between the electronic component 180 and the antenna substrate AS, but the present invention is not limited thereto. In one embodiment, the first portion 132 of the bottom conductive layer 130 has a first surface 132a facing the bottom dielectric layer 140 and a second surface 132b facing away from the bottom dielectric layer 140, and a portion of the first surface 132a of the first portion 132 of the bottom conductive layer 130 can selectively face the antenna substrate AS and be connected to the antenna substrate AS, but the present invention is not limited thereto.

In one embodiment, the two opposite surfaces 212 and 214 of the base 210 of the antenna substrate AS include a first surface 212 and a second surface 214, the first surface 212 faces the stacking structure S, and the second surface 214 faces away from the stacking structure S. The base 210 of the antenna substrate AS further has a side wall 216 connecting the first surface 212 and the second surface 214, and the bendable portion FSa is disposed between the first surface 212 of the base 210 of the antenna substrate AS and the stacking structure S and does not bypass the side wall 216, but the present invention is not limited thereto.

It should be noted that the following embodiments use the same component numbers and some contents of the previous embodiments, wherein the same number is used to represent the same or similar components, and the description of the same technical contents is omitted. The description of the omitted parts can be referred to the previous embodiments, and the following embodiments will not be repeated.

FIG4 is a cross-sectional schematic diagram of an antenna package structure of another embodiment of the present invention. The antenna package structure 10A of FIG4 is similar to the antenna package structure 10 of FIG1D , and the difference between the two is that: in the embodiment of FIG1D , the bendable portion FSa is electrically connected to the antenna substrate AS using the first surface 132a of the bottom conductive layer 130; in the embodiment of FIG4 , the bendable portion FSa is electrically connected to the antenna substrate AS using the second surface 132b of the bottom conductive layer 130. 4 , in detail, in this embodiment, the first portion 132 of the bottom conductive layer 130 has a first surface 132a facing the bottom dielectric layer 140 and a second surface 132b facing away from the bottom dielectric layer 140, and a portion of the second surface 132b of the first portion 132 of the bottom conductive layer 130 faces the antenna substrate AS and is connected to the antenna substrate AS.

In this embodiment, the antenna substrate AS further includes a bridge element 240, which is disposed on the second surface 214 of the substrate 210 and penetrates the substrate 210 to be electrically connected to the coupling antenna 220 disposed on the first surface 212 of the substrate 210 and including the driving block. In this embodiment, the second surface 132b of the first portion 132 of the bottom conductive layer 130 is bonded to the bridge element 240, so that the bottom conductive layer 130 is electrically connected to the coupling antenna 220 including the driving block.

In this embodiment, the two opposite surfaces 212 and 214 of the base 210 of the antenna substrate AS include a first surface 212 and a second surface 214, the first surface 212 faces the stacking structure S, and the second surface 214 faces away from the stacking structure S. The base 210 of the antenna substrate AS further has a side wall 216 connecting the first surface 212 and the second surface 214, and the bendable portion FSa of the flexible circuit substrate FS can bypass the side wall 216.

Fig. 5 is a cross-sectional view of an antenna package structure of another embodiment of the present invention. The antenna package structure 10B of Fig. 5 is similar to the antenna package structure 10 of Fig. 1D, and the difference between the two is that in the embodiment of Fig. 5, the bendable portion FSa of the flexible circuit substrate FS is substantially bent upward to be electrically connected to the antenna substrate AS.

5 , in this embodiment, the electronic component 180 is disposed between the antenna substrate AS and the stacked structure S. In this embodiment, the first portion 132 of the bottom conductive layer 130 has a first surface 132a facing the bottom dielectric layer 140 and a second surface 132b facing away from the bottom dielectric layer 140, and a portion of the second surface 132b of the first portion 132 of the bottom conductive layer 130 faces the antenna substrate AS and is connected to the antenna substrate AS.

In the present embodiment, the two opposite surfaces 212 and 214 of the base 210 of the antenna substrate AS include a first surface 212 and a second surface 214. The first surface 212 of the base 210 of the antenna substrate AS faces the stacking structure S, and the second surface 214 of the base 210 of the antenna substrate AS faces away from the stacking structure S. The base 210 of the antenna substrate AS further has a side wall 216 connecting the first surface 212 and the second surface 214. The bendable portion FSa of the flexible circuit substrate FS is disposed between the first surface 212 of the base 210 of the antenna substrate AS and the stacking structure S and does not bypass the side wall 216.

FIG6 is a cross-sectional schematic diagram of an antenna package structure of another embodiment of the present invention. The antenna package structure 10C of FIG6 is similar to the antenna package structure 10B of FIG5 , and the difference between the two is that: in the embodiment of FIG5 , the bendable portion FSa is electrically connected to the antenna substrate AS using the second surface 132b of the bottom conductive layer 130; in the embodiment of FIG6 , the bendable portion FSa is electrically connected to the antenna substrate AS using the first surface 132a of the bottom conductive layer 130.

6 , in detail, in this embodiment, the first portion 132 of the bottom conductive layer 130 has a first surface 132a facing the bottom dielectric layer 140 and a second surface 132b facing away from the bottom dielectric layer 140, and a portion of the first surface 132a of the first portion 132 of the bottom conductive layer 130 faces the antenna substrate AS and is connected to the antenna substrate AS.

In this embodiment, the antenna substrate AS further includes a bridge element 240, which is disposed on the second surface 214 of the substrate 210 and penetrates the substrate 210 to be electrically connected to the coupling antenna 220 disposed on the first surface 212 of the substrate 210 and including the driving block. In this embodiment, the first surface 132a of the first portion 132 of the bottom conductive layer 130 is bonded to the bridge element 240, so that the bottom conductive layer 130 is electrically connected to the coupling antenna 220 including the driving block.

In the present embodiment, the two opposite surfaces 212 and 214 of the base 210 of the antenna substrate AS include a first surface 212 and a second surface 214. The first surface 212 of the base 210 of the antenna substrate AS faces the stacking structure S, and the second surface 214 of the base 210 of the antenna substrate AS faces away from the stacking structure S. The base 210 of the antenna substrate AS further has a side wall 216 connecting the first surface 212 and the second surface 214, and the bendable portion FSa of the flexible circuit substrate FS can bypass the side wall 216.

FIG7 is a cross-sectional schematic diagram of an antenna package structure of an embodiment of the present invention. The antenna package structure 10D of FIG7 is similar to the antenna package structure 10 of FIG1D, and the difference between the two is that: in the embodiment of FIG7, there is a space R between the stacking structure S of the flexible circuit substrate FS, the bendable portion FSa and the antenna substrate AS, and the antenna package structure 10 further includes a light-emitting element 310 disposed in the space R. The light-emitting element 310 can be selectively electrically connected to other parts of the bottom conductive layer 130 other than the joint portion 134. Please refer to FIG7, in this embodiment, the antenna package structure 10 further includes a light-emitting element 320, which is disposed on the bendable portion FSa. The light emitting element 320 may be selectively electrically connected to other portions of the bottom conductive layer 130 other than the joint portion 134. The light emitting elements 310 and 320 are, for example, light emitting diode packages, but the present invention is not limited thereto.

FIG8 is a cross-sectional schematic diagram of an antenna package structure of another embodiment of the present invention. The antenna package structure 10E of FIG8 is similar to the antenna package structure 10A of FIG4 , and the difference between the two is that: in the embodiment of FIG8 , the antenna package structure 10 further includes a light-emitting element 320, which is disposed on the bendable portion FSa. The light-emitting element 320 can be selectively electrically connected to other parts of the bottom conductive layer 130 other than the joint portion 134. In this embodiment, the light-emitting element 320 can be selectively located outside the space R or inside the space R.

FIG9 is a cross-sectional schematic diagram of an antenna package structure of another embodiment of the present invention. The antenna package structure 10F of FIG9 is similar to the antenna package structure 10B of FIG5 , and the difference between the two is that: in the embodiment of FIG9 , the antenna package structure 10 further includes a light emitting element 320 disposed on the bendable portion FSa, a light emitting element 330 disposed on the stacking structure S and electrically connected to the stacking structure S, and a light emitting element 340 disposed on the second surface 214 of the antenna substrate AS.

Fig. 10 is a cross-sectional view of an antenna package structure according to another embodiment of the present invention. The antenna package structure 10G of Fig. 10 is similar to the antenna package structure 10C of Fig. 6 , and the difference between the two is that in the embodiment of Fig. 10 , the antenna package structure 10 further includes a light emitting element 320 disposed on the bendable portion FSa.

7 , 8 , 9 and 10 , the light emitting elements 320 , 330 , 340 may be used as indicator lights and/or display elements to increase the additional functions of the antenna package structures 10D, 10E, 10F, 10G.

10, 10A, 10B, 10C, 10D, 10E, 10F, 10G: Antenna packaging structure 110: Rigid substrate 120: Release layer 130: Bottom conductive layer 132, 142: First part 132a: First surface 132b: Second surface 134: Joint 140: Bottom dielectric layer 144: Opening 150: Interlayer dielectric layer 160: Interlayer conductive layer 162: Electronic component pad 170: Solder 180: Electronic component 190: Protective layer 192: Support component 210: Base 212, 214: Surface 216: Sidewall 220, 230: coupling antenna 240: bridge element 310, 320, 330, 340: light-emitting element AS: antenna substrate FS: flexible circuit substrate FSa: bendable part R: space S: stacking structure

Figures 1A to 1D are cross-sectional schematic diagrams of the manufacturing process of the antenna packaging structure of an embodiment of the present invention. Figure 2 is a top view schematic diagram of an unbent flexible circuit substrate and electronic components of an embodiment of the present invention. Figure 3 is a top view schematic diagram of an antenna substrate of an embodiment of the present invention. Figure 4 is a cross-sectional schematic diagram of an antenna packaging structure of another embodiment of the present invention. Figure 5 is a cross-sectional schematic diagram of an antenna packaging structure of another embodiment of the present invention. Figure 6 is a cross-sectional schematic diagram of an antenna packaging structure of another embodiment of the present invention. Figure 7 is a cross-sectional schematic diagram of an antenna packaging structure of an embodiment of the present invention. Figure 8 is a cross-sectional schematic diagram of an antenna packaging structure of another embodiment of the present invention. FIG. 9 is a cross-sectional schematic diagram of an antenna packaging structure of another embodiment of the present invention. FIG. 10 is a cross-sectional schematic diagram of an antenna packaging structure of another embodiment of the present invention.

10: Antenna packaging structure

130: Bottom conductive layer

132, 142: Part 1

132a: first surface

132b: Second surface

134: Joint

140: Bottom dielectric layer

144: Open mouth

150: Interlayer dielectric layer

160: Interlayer conductive layer

162: Electronic component pads

170: Solder

180: Electronic components

190: Protective layer

192: Support element

210: Base

212, 214: Surface

216: Side wall

220, 230: coupled antenna

AS: Antenna substrate

FS: Flexible circuit substrate

FSa: Foldable part

S: stacking structure

Claims (14)

An antenna packaging structure includes: A flexible circuit substrate, including: A bottom conductive layer having at least one joint; A bottom dielectric layer disposed on the bottom conductive layer; At least one interlayer dielectric layer and at least one interlayer conductive layer are alternately stacked on the bottom dielectric layer, wherein the at least one interlayer conductive layer is electrically connected to the bottom conductive layer, and at least one first portion of the bottom conductive layer that exceeds the at least one interlayer dielectric layer and the at least one interlayer conductive layer and at least one first portion of the bottom dielectric layer that exceeds the at least one interlayer dielectric layer and the at least one interlayer conductive layer constitute at least one bendable portion of the flexible circuit substrate, and the at least one bendable portion has the at least one joint portion of the bottom conductive layer; At least one electronic component is disposed on the flexible circuit substrate and electrically connected to the flexible circuit substrate, wherein the at least one interlayer dielectric layer and the at least one interlayer conductive layer are located between the at least one electronic component and the bottom dielectric layer; and an antenna substrate, comprising: a substrate; and a plurality of coupling antennas, respectively disposed on two opposite surfaces of the substrate; wherein the at least one bendable portion of the flexible circuit substrate bends toward the antenna substrate, and the at least one joint portion of the at least one bendable portion is electrically connected to one of the coupling antennas. In the antenna package structure as described in claim 1, the at least one inter-conductive layer and the at least one inter-dielectric layer of the flexible circuit substrate are alternately stacked into a stacking structure, and the stacking structure is disposed between the at least one electronic component and the antenna substrate. An antenna packaging structure as described in claim 2, wherein the first portion of the bottom conductive layer has a first surface facing the bottom dielectric layer and a second surface facing away from the bottom dielectric layer, and a portion of the first surface of the first portion of the bottom conductive layer faces the antenna substrate and is connected to the antenna substrate. An antenna packaging structure as described in claim 3, wherein the two opposite surfaces of the base of the antenna substrate include a first surface and a second surface, the first surface faces the stacking structure, and the second surface faces away from the stacking structure, the base of the antenna substrate further has a side wall connecting the first surface and the second surface, and the bendable portion is arranged between the first surface of the base of the antenna substrate and the stacking structure and does not bypass the side wall. An antenna packaging structure as described in claim 2, wherein the first portion of the bottom conductive layer has a first surface facing the bottom dielectric layer and a second surface facing away from the bottom dielectric layer, and a portion of the second surface of the first portion of the bottom conductive layer faces the antenna substrate and is connected to the antenna substrate. An antenna packaging structure as described in claim 5, wherein the two opposite surfaces of the base of the antenna substrate include a first surface and a second surface, the first surface faces the stacking structure, and the second surface faces away from the stacking structure, the base of the antenna substrate further has a side wall connecting the first surface and the second surface, and the bendable portion of the flexible circuit substrate passes around the side wall. The antenna package structure as described in claim 1, wherein the at least one inter-conductive layer and the at least one inter-dielectric layer of the flexible circuit substrate are alternately stacked into a stacking structure, and the at least one electronic component is disposed between the antenna substrate and the stacking structure. An antenna packaging structure as described in claim 7, wherein the first portion of the bottom conductive layer has a first surface facing the bottom dielectric layer and a second surface facing away from the bottom dielectric layer, and a portion of the first surface of the first portion of the bottom conductive layer faces the antenna substrate and is connected to the antenna substrate. An antenna packaging structure as described in claim 8, wherein the two opposite surfaces of the base of the antenna substrate include a first surface and a second surface, the first surface of the base of the antenna substrate faces the stacking structure, and the second surface of the base of the antenna substrate faces away from the stacking structure, the base of the antenna substrate further has a side wall connecting the first surface and the second surface, and the bendable portion of the flexible circuit substrate passes around the side wall. An antenna packaging structure as described in claim 7, wherein the first portion of the bottom conductive layer has a first surface facing the bottom dielectric layer and a second surface facing away from the bottom dielectric layer, and a portion of the second surface of the first portion of the bottom conductive layer faces the antenna substrate and is connected to the antenna substrate. An antenna packaging structure as described in claim 10, wherein the two opposite surfaces of the base of the antenna substrate include a first surface and a second surface, the first surface of the base of the antenna substrate faces the stacking structure, and the second surface of the base of the antenna substrate faces away from the stacking structure, the base of the antenna substrate further has a side wall connecting the first surface and the second surface, and the bendable portion of the flexible circuit substrate is disposed between the first surface of the base of the antenna substrate and the stacking structure and does not bypass the side wall. The antenna packaging structure as described in claim 1, wherein the at least one inter-layer conductive layer and the at least one inter-layer dielectric layer of the flexible circuit substrate are alternately stacked to form a stacking structure, and there is a space between the stacking structure, the bendable portion and the antenna substrate, and the antenna packaging structure further includes: At least one light-emitting element, disposed in the space. The antenna package structure as described in claim 1 further includes: At least one light-emitting element disposed on the bendable portion. The antenna packaging structure as described in claim 1 further includes: A supporting element disposed between the flexible circuit substrate and the antenna substrate.

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