TWI859922B - Temperature control assembly - Google Patents
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- 238000010438 heat treatment Methods 0.000 claims abstract description 192
- 238000012360 testing method Methods 0.000 claims abstract description 26
- 229910052751 metal Inorganic materials 0.000 claims description 55
- 239000002184 metal Substances 0.000 claims description 55
- 239000004020 conductor Substances 0.000 claims description 22
- 239000010409 thin film Substances 0.000 claims description 21
- 239000000853 adhesive Substances 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 16
- 238000001514 detection method Methods 0.000 description 18
- 238000010586 diagram Methods 0.000 description 12
- 238000003752 polymerase chain reaction Methods 0.000 description 10
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 238000009413 insulation Methods 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000004590 computer program Methods 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000003753 real-time PCR Methods 0.000 description 2
- 229910018464 Al—Mg—Si Inorganic materials 0.000 description 1
- 229920001342 Bakelite® Polymers 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- -1 aluminum-magnesium-silicon Chemical compound 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
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Abstract
Description
本發明是關於一種加熱器,特別是一種溫度控制組件。The present invention relates to a heater, in particular to a temperature control component.
市場上應用PCR(聚合酶連鎖反應)或QPCR(定量聚合酶連鎖反應)原理的產品(如,基因檢測儀器)需要快速升降溫。現有檢測儀器同時可進行多個試管的樣品的檢測。在檢測過程中,檢測儀器利用旋轉方式使每一試管中的螢光試劑分別被光學感測器偵測,並且利用加熱器和風扇來控制溫度,藉以活化試管中的試劑反應。然而,現有檢測儀器是利用單一加熱器同時對多個試管加熱,以致無法有效達到均溫的效果。Products on the market that use the principles of PCR (polymerase chain reaction) or QPCR (quantitative polymerase chain reaction) (e.g., gene detection instruments) require rapid temperature rise and fall. Existing detection instruments can test samples in multiple test tubes at the same time. During the test process, the detection instrument uses a rotation method to allow the fluorescent reagent in each test tube to be detected by an optical sensor, and uses a heater and a fan to control the temperature to activate the reagent reaction in the test tube. However, existing detection instruments use a single heater to heat multiple test tubes at the same time, so that the temperature cannot be effectively uniformed.
在一些實施例中,一種溫度控制組件,其包括:複數加熱單元以及複數溫度感測器。複數加熱單元環狀配置,並且複數溫度感測器分別設置在此些加熱單元上。各加熱單元包括:一承載孔以及一發熱體。發熱體環繞承載孔。承載孔適用於可移除地設置一試管。In some embodiments, a temperature control assembly includes: a plurality of heating units and a plurality of temperature sensors. The plurality of heating units are arranged in a ring shape, and the plurality of temperature sensors are respectively arranged on the heating units. Each heating unit includes: a supporting hole and a heating body. The heating body surrounds the supporting hole. The supporting hole is suitable for removably arranging a test tube.
在一些實施例中,前述的溫度控制組件可更包括:一控制板,並且各加熱單元的發熱體與各溫度感測器個別電性連接控制板。於此,控制板用以根據各溫度感測器的運作結果驅動對應的發熱體。In some embodiments, the aforementioned temperature control assembly may further include: a control board, and the heating element of each heating unit and each temperature sensor are electrically connected to the control board. Here, the control board is used to drive the corresponding heating element according to the operating result of each temperature sensor.
在一些實施例中,前述各發熱體包括:一金屬基散熱板、一第一電路以及一第二電路。第一電路位於金屬基散熱板的一表面且環繞承載孔。第二電路位於金屬基散熱板的表面,與第一電路電隔離,且電性連接對應的溫度感測器。於此,第一電路透過電轉熱而發熱。In some embodiments, each of the aforementioned heat generating bodies includes: a metal-based heat sink, a first circuit, and a second circuit. The first circuit is located on a surface of the metal-based heat sink and surrounds the supporting hole. The second circuit is located on the surface of the metal-based heat sink, is electrically isolated from the first circuit, and is electrically connected to a corresponding temperature sensor. Here, the first circuit generates heat by converting electricity into heat.
在一些實施例中,前述的各發熱體可更包括:至少一導熱膠,且導熱膠將第一電路與第二電路黏貼於金屬基散熱板的表面。In some embodiments, each of the aforementioned heat generating bodies may further include: at least one thermally conductive adhesive, and the thermally conductive adhesive adheres the first circuit and the second circuit to the surface of the metal-based heat sink.
在一些實施例中,前述的各發熱體可更包括:一第三電路。此第三電路位於金屬基散熱板的另一表面,並透過至少一導體電性連接第一電路。其中,至少一導體可為導孔和導線其中至少一者。In some embodiments, each of the aforementioned heat generating bodies may further include: a third circuit. The third circuit is located on another surface of the metal-based heat sink and is electrically connected to the first circuit through at least one conductor. The at least one conductor may be at least one of a via and a wire.
在一些實施例中,前述的各發熱體可更包括:至少一導熱膠。於此,導熱膠將第一電路與第二電路黏貼於金屬基散熱板的表面,並且將第三電路黏貼於金屬基散熱板的另一表面。In some embodiments, each of the aforementioned heat generating bodies may further include: at least one thermally conductive adhesive, wherein the thermally conductive adhesive adheres the first circuit and the second circuit to the surface of the metal-based heat sink, and adheres the third circuit to another surface of the metal-based heat sink.
在一些實施例中,前述的溫度控制組件可更包括:複數第一連接器以及複數導線組。各第一連接器具有複數接點。複數導線組分別對應複數加熱單元且分別對應複數第一連接器。各導線組具有複數導線。於此,各導線組的複數導線的一端分別電性連接對應的加熱單元的第一電路與第二電路,並且另一端分別耦接對應的第一連接器的複數接點。In some embodiments, the aforementioned temperature control assembly may further include: a plurality of first connectors and a plurality of wire sets. Each first connector has a plurality of contacts. The plurality of wire sets correspond to a plurality of heating units and correspond to a plurality of first connectors. Each wire set has a plurality of wires. Here, one end of the plurality of wires of each wire set is electrically connected to the first circuit and the second circuit of the corresponding heating unit, and the other end is coupled to the plurality of contacts of the corresponding first connector.
在一些實施例中,前述的控制板可包括:複數第二連接器、一電路基板以及一控制電路。控制電路位於電路基板上,且電性連接各加熱單元與各溫度感測器。此些第二連接器位於電路基板上,且電性連接控制電路。於此,複數第二連接器分別與複數第一連接器匹配,並且各第二連接器可插拔地與對應的第一連接器對接。控制電路用以經由第二電路接收各溫度感測器的運作結果並根據各溫度感測器的運作結果供電給此溫度感測器所對應的加熱單元的第一電路。In some embodiments, the aforementioned control board may include: a plurality of second connectors, a circuit substrate, and a control circuit. The control circuit is located on the circuit substrate and electrically connects each heating unit and each temperature sensor. These second connectors are located on the circuit substrate and electrically connect the control circuit. Here, the plurality of second connectors are matched with the plurality of first connectors respectively, and each second connector is pluggable and docked with the corresponding first connector. The control circuit is used to receive the operating results of each temperature sensor through the second circuit and supply power to the first circuit of the heating unit corresponding to the temperature sensor according to the operating results of each temperature sensor.
在另一些實施例中,前述各發熱體包括:一隔熱固定件、一加熱塊以及一薄膜電熱片。薄膜電熱片夾設在隔熱固定件與加熱塊之間。於此,各溫度感測器位於對應的加熱單元的薄膜電熱片上,且承載孔貫穿對應的加熱單元的隔熱固定件、薄膜電熱片以及加熱塊。In other embodiments, each of the aforementioned heating elements includes: a heat-insulating fixture, a heating block, and a thin-film electric heater. The thin-film electric heater is sandwiched between the heat-insulating fixture and the heating block. Here, each temperature sensor is located on the thin-film electric heater of the corresponding heating unit, and the bearing hole penetrates the heat-insulating fixture, the thin-film electric heater, and the heating block of the corresponding heating unit.
在一些實施例中,前述的溫度控制組件可更包括:一絕緣隔熱基座。於此,複數加熱單元環繞且固定於絕緣隔熱基座上。在檢測儀器中,此絕緣隔熱基座可進一步固定在轉盤上。此時,轉軸的二端分別連接絕緣隔熱基座與轉動馬達。In some embodiments, the aforementioned temperature control assembly may further include: an insulating heat-insulating base. Here, a plurality of heating units surround and are fixed on the insulating heat-insulating base. In the detection instrument, the insulating heat-insulating base may be further fixed on a turntable. At this time, the two ends of the rotating shaft are respectively connected to the insulating heat-insulating base and the rotating motor.
在另一些實施例中,複數加熱單元亦可直接固定在轉盤上。In other embodiments, a plurality of heating units may also be directly fixed on the turntable.
在一些實施例中,前述的檢測儀器可更包括:一風扇組件,且此風扇組件位於溫度控制組件相對於轉盤的另一側。In some embodiments, the aforementioned detection instrument may further include: a fan assembly, and the fan assembly is located on the other side of the temperature control assembly relative to the turntable.
綜上,在任一實施例中,溫度控制組件適用於檢測儀器中,其能對多個試管各別獨立進行溫度監控,並且有效控制其溫度,以達到均溫。在一些實施例中,溫度控制組件採用降低質量的機構設計,其簡化結構,藉以降低整體成本。在一些實施例中,溫度控制組件使用鋁基板(即作為金屬基散熱板)製作加熱單元,藉以更進一步地降低整體成本。在一些實施例中,溫度控制組件的多個加熱單元個別獨立進行溫度監控,並且於需升溫時進行雙面加熱,藉以快速升溫至所需溫度。In summary, in any embodiment, the temperature control assembly is suitable for use in a detection instrument, which can independently monitor the temperature of multiple test tubes and effectively control their temperatures to achieve uniform temperature. In some embodiments, the temperature control assembly adopts a mechanism design that reduces mass, and simplifies the structure to reduce the overall cost. In some embodiments, the temperature control assembly uses an aluminum substrate (i.e., as a metal-based heat sink) to make a heating unit to further reduce the overall cost. In some embodiments, multiple heating units of the temperature control assembly independently monitor the temperature, and perform double-sided heating when the temperature needs to be increased, so as to quickly increase the temperature to the required temperature.
參照圖1及圖2,一種溫度控制組件10,其包括:複數加熱單元110以及複數溫度感測器120。每一加熱單元110可用以調節一試管(tube)20內的樣本的溫度。也就是說,此溫度控制組件10能同時監控多個試管20(含其內部的樣本)的溫度並有效控制多個試管20的溫度以達到均溫。1 and 2, a temperature control assembly 10 includes a plurality of
此些加熱單元110以環狀配置。換言之,此些加熱單元110的長軸呈放射狀。複數溫度感測器120分別設置在複數加熱單元上。於此,複數溫度感測器120一對一對應於複數加熱單元110,並且每一溫度感測器120設置在對應的加熱單元110上。在一些實施例中,各溫度感測器120可直接焊接在加熱單元110上。在一些實施例中,各溫度感測器120可為電阻溫度感測器(RTD Sensor)。The
參照圖3及圖4,各加熱單元110包括一承載孔111以及一發熱體113。發熱體113環繞承載孔111。換言之,發熱體113為加熱單元110的主體,而承載孔111為開在主體(即發熱體113)上的一個孔洞。3 and 4 , each
在使用時,承載孔111能可移除地設置一試管20,並且由發熱體113對設置在承載孔111上的試管20加熱,使試管20(含其內部的樣本)能達到所需的溫度。When in use, a test tube 20 can be removably disposed in the supporting hole 111 , and the
各溫度感測器120設置在對應的加熱單元110的發熱體113上並且鄰近於承載孔111。於使用時,溫度感測器120能進行溫度感測,以感測並得到周遭的溫度(即相當於得到試管20的溫度)。Each temperature sensor 120 is disposed on the
在一些實施例中,參照圖1至圖4,各加熱單元110可劃分為設置段110A、連接段110B與固定段110C。連接段110B與固定段110C連接設置段110A。換言之,設置段110A向外延伸出連接段110B與固定段110C。連接段110B是從設置段110A朝遠離溫度控制組件10的中心的方向延伸,以便於外部組件(即,控制板130)形成電性連接。固定段110C則用以將加熱單元110固定在其他組件上,以便於溫度控制組件10與外部組件組裝在一起。在一示範例中,此些加熱單元110設置呈環狀,並各加熱單元110的固定段110C鎖固在其他組件(如,絕緣隔熱基座170或轉盤)上。In some embodiments, referring to FIGS. 1 to 4 , each
承載孔111則位於設置段110A。在一示範例中,承載孔111可為貫孔,換言之,承載孔111是從設置段110A(即發熱體113的中段)的上表面113A貫穿設置段110A(即發熱體113的中段),而連通設置段110A(即發熱體113的中段)的下表面113B。The supporting hole 111 is located in the setting section 110A. In one example, the supporting hole 111 may be a through hole, that is, the supporting hole 111 penetrates the setting section 110A (i.e., the middle section of the heating element 113) from the upper surface 113A of the setting section 110A (i.e., the middle section of the heating element 113) and connects to the lower surface 113B of the setting section 110A (i.e., the middle section of the heating element 113).
在一些實施例中,溫度感測器120可位在設置段110A與連接段110B的連接處。In some embodiments, the temperature sensor 120 may be located at the connection between the setting section 110A and the connecting section 110B.
在一些實施例中,溫度控制組件10可更包括:一控制板130,並且各加熱單元110的發熱體113與各溫度感測器120個別電性連接控制板130。於使用時,控制板130會接收各溫度感測器120的運作結果並根據各溫度感測器120的運作結果驅動給對應的加熱單元110的發熱體113。具體而言,溫度感測器120感測到的溫度(即運作結果)會傳送給控制板130。因此,當樣品檢測程序執行到需要升溫的時間點時,控制板130能根據各溫度感測器120所感測的溫度供電給(驅動)對應的加熱單元110的發熱體113,使發熱體113透過轉電為熱而發熱,進而加熱試管20至所需的溫度。In some embodiments, the temperature control assembly 10 may further include: a control board 130, and the
在一些實施例中,參照圖3至圖5,各發熱體113包括:一金屬基散熱板1131、一第一電路1132以及一第二電路1133。第一電路1132位於金屬基散熱板1131的一表面(即下表面113B)且環繞承載孔111。第二電路1133與第一電路1132同樣位於金屬基散熱板1131的下表面113B,且與第一電路1132電隔離。於此,當供電給第一電路1132時,第一電路1132能透過電轉熱而發熱。第二電路1133電性連接對應的溫度感測器120。具體來說,此加熱單元110所對應的溫度感測器120銲接在第二電路1133上,並且由第二電路1133電性連接控制板130。因此,溫度感測器120所感測到的溫度能經由第二電路1133傳送給控制板130。In some embodiments, referring to FIG. 3 to FIG. 5 , each
在一些實施例中,各發熱體113可更包括:至少一導熱膠1135,且導熱膠1135將第一電路1132與第二電路1133黏貼於金屬基散熱板1131的下表面113B。In some embodiments, each
在一些實施例中,各發熱體113可更包括:一第三電路1134。此第三電路1134位於金屬基散熱板1131的另一表面(即上表面113A),並透過一個或多個導體161、162電性連接第一電路1132。其中,導體161、162可為導孔(圖未示)或導線(如圖5所示)。於此,當供電給發熱體113時,電力會供給至第一電路1132與第三電路1134,因此第一電路1132與第三電路1134能透過電轉熱而發熱,藉以進行雙面加熱。其中,導體161、162可均為導孔,或者均為導線。抑或是,配合實際需求,一部分的導體161、162採用導孔,而另一部分的導體161、162則採用導線。In some embodiments, each
在一些實施例中,參照圖5,導體161可為內連接,如,為穿透金屬基散熱板1131的導線,換言之,此導線經由貫穿金屬基散熱板1131的貫孔160分別耦接(如,銲接)位在不同表面的上的第一電路1132與第三電路1134。在一些實施例中,導體161亦可是在貫穿金屬基散熱板1131的貫孔160內填充或塗布導電材料所形成的導孔。於此,貫孔160的二端的導電材料會分別與貫孔160周邊的第一電路1132與第三電路1134電性連接。In some embodiments, referring to FIG. 5 , the
在一些實施例中,參照圖6至圖8,導體162可為外連接,即為位在金屬基散熱板1131的側壁上的導線。換言之,此導線是由金屬基散熱板1131的上表面113A沿著金屬基散熱板1131的側壁而延伸至金屬基散熱板1131的下表面113B,並且導線的二端分別耦接(如,銲接)位在不同表面的上的第一電路1132與第三電路1134。In some embodiments, referring to FIG. 6 to FIG. 8 , the conductor 162 may be an external connection, that is, a wire located on the side wall of the metal-based
在一些實施例中,參照圖9,各發熱體113可同時設置有內連接與外連接,即具有不同設置方式的多個導體161、162。In some embodiments, referring to FIG. 9 , each
在一些實施例中,各發熱體113可更包括:至少一導熱膠1135、1136。於此,導熱膠1135將第一電路1132與第二電路1133黏貼於金屬基散熱板1131的下表面113B,並且導熱膠1136將第三電路1134黏貼於金屬基散熱板1131的上表面113A。In some embodiments, each
在一些實施例中,各發熱體113可更包括:一第四電路1137。此第四電路1137位於金屬基散熱板1131的上表面113A,並且與第三電路1134電性隔離。於此,第四電路1137同樣透過至少一導體電性連接第三電路1134(圖未示)。其中,耦接第三電路1134與第四電路1137的導體可為導孔(圖未示)或導線(圖未示)。In some embodiments, each
在一些實施例中,導熱膠1136可將第三電路1134與第四電路1137黏貼於金屬基散熱板1131的上表面113A。In some embodiments, the thermal conductive adhesive 1136 can adhere the
在一些實施例中,金屬基散熱板1131可為低合金化的Al-Mg-Si(鋁-鎂-矽)系高塑性合金板。第一電路1132與第二電路1133可為銅箔。第三電路1134與第四電路1137可為銅箔。In some embodiments, the metal-based
在一些實施例中,參照圖1及圖2,控制板130可包括:一電路基板131以及一控制電路133。控制電路133位於電路基板131上,且控制電路133電性連接各加熱單元110與各溫度感測器120。於使用時,控制電路133能經由各加熱單元110的第二電路1133(與第四電路1137)接收各溫度感測器120所感測的溫度,並且根據各溫度感測器120所感測的溫度供電給此溫度感測器120所對應的加熱單元110的第一電路1132,以使發熱體113發熱。In some embodiments, referring to FIG. 1 and FIG. 2 , the control board 130 may include: a circuit substrate 131 and a control circuit 133. The control circuit 133 is located on the circuit substrate 131, and the control circuit 133 is electrically connected to each
在一些實施例中,控制板130與各加熱單元110可透過對接的二連接器電性連接。於此些實施例中,參照圖1至圖5,溫度控制組件10可更包括:複數第一連接器140以及複數導線組150。複數第一連接器140分別對應複數加熱單元110。各第一連接器140具有複數接點140a。複數導線組150分別對應複數加熱單元110,並且分別對應複數第一連接器140。各導線組150具有複數導線151、152。於此,各導線組150的複數導線151、152的一端分別電性連接此導線組150所對應的加熱單元110的第一電路1132與第二電路1133,並且另一端分別耦接此導線組150所對應的第一連接器140的複數接點140a。In some embodiments, the control board 130 and each
具體而言,在各導線組150中,各導線151的一端耦接(如,銲接或貼合)對應的加熱單元110的第一電路1132,或者是耦接(如,銲接或貼合)對應的加熱單元110的第三電路1134並經由第三電路1134與導體161及/或162電性連接第一電路1132。各導線151的另一端則耦接(如,貼合)對應的第一連接器140的多個接點140a中之一者。各導線152的一端耦接(如,銲接或貼合)對應的加熱單元110的第二電路1133,或者是耦接(如,銲接或貼合)對應的加熱單元110的第四電路1137並經由第四電路1137與導體161及/或162電性連接第二電路1133。各導線152的另一端則耦接(如,貼合)對應的第一連接器140的多個接點140a中之另一者。Specifically, in each
在一些實施例中,參照圖1及圖2,控制板130可更包括:複數第二連接器135。此些第二連接器135位於電路基板131上,且電性連接控制電路133。於此,複數第二連接器135分別與複數第一連接器140匹配,並且各第二連接器135可插拔地與對應的第一連接器140對接。換言之,當第一連接器140插接在對應的第二連接器135上時,第一連接器140的複數接點140a分別與第二連接器135的複數接點一對一接觸,以致於第一連接器140的複數接點140a分別與第二連接器135的複數接點電性連接。圖1及圖2中第二連接器135以虛線繪製以便於表現第一連接器140插入其中。In some embodiments, referring to FIG. 1 and FIG. 2 , the control board 130 may further include: a plurality of second connectors 135. These second connectors 135 are located on the circuit substrate 131 and are electrically connected to the control circuit 133. Here, the plurality of second connectors 135 are matched with the plurality of
因此,於使用時,控制電路133能經由各第二連接器135、第二連接器135對接的第一連接器140、連接第一連接器140的導線152與導線152所連接的第二電路1133接收各溫度感測器120所感測到的溫度。並且,控制電路133根據所接收到的溫度與預計溫度決定此溫度感測器120所對應的加熱單元110是否需進行加熱。當所接收到的溫度低於預計溫度時,控制電路133經由各第二連接器135、第二連接器135對接的第一連接器140與連接第一連接器140的導線151供電給此溫度感測器120所對應的加熱單元110的第一電路1132(即供電給發熱體113),以致使發熱體113發熱來升高此加熱單元110所承載的試管20的溫度。反之,控制電路133則停止供電給此溫度感測器120所對應的加熱單元110。Therefore, when in use, the control circuit 133 can receive the temperature sensed by each temperature sensor 120 through each second connector 135, the
在一些實施例中,承載孔111貫穿金屬基散熱板1131。第一電路1132分布在設置段110A與連接段110B的下表面113B。第一電路1132可分為一環狀走線與二連接走線(以下稱第一連接走線)。在設置段110A上的第一電路1132為環狀走線,其沿著承載孔111的邊緣設置在承載孔111旁的金屬基散熱板1131的下表面113B上。在連接段110B上的第一電路1132為第一連接走線,其從環狀走線開始朝金屬基散熱板1131的邊緣延伸,並且經由連接段110B而延伸至金屬基散熱板1131的邊緣。即二第一連接走線的一端(以下稱第一端)耦接環狀走線,而另一端(以下稱第二端)可直接或藉由導線151連接至控制板130。第二電路1133分布在連接段110B的下表面113B。第二電路1133可為另外二連接走線(以下稱第二連接走線)。第二連接走線從設置段110A與連接段110B的連接處開始朝金屬基散熱板1131的邊緣延伸,並且經由連接段110B而延伸至金屬基散熱板1131的邊緣。在設置段110A與連接段110B的連接處,溫度感測器120銲接在第二連接走線的一端(以下稱第一端)上,即此二第二連接走線的第一端分別耦接溫度感測器120的二電極。在金屬基散熱板1131的邊緣,第二連接走線的另一端(以下稱第二端)可直接或藉由導線152連接至控制板130。其中,第二電路1133的二第二連接走線能分布在第一電路1132的二第一連接走線之間。In some embodiments, the bearing hole 111 penetrates the metal-based
於此,第三電路1134分布在設置段110A與連接段110B的上表面113A,並且其結構與分布大致上相同於第一電路1132。連接金屬基散熱板1131的上表面113A與下表面113B的導體161及/或162將第三電路1134電性連接至第一電路1132。Here, the
在一示範例中,各導線組150可具有四導線151、152。其中,二導線151的一端分別銲接在第三電路1134的二第一連接走線的第二端,並且二導線151的另一端則分別接觸第一連接器140的二接點140a。二導線152的一端分別銲接在第四電路1137的二第一連接走線的第二端,並且二導線152的另一端則分別接觸第一連接器140的另外二接點140a。In one example, each wire set 150 may have four
舉例來說,第一電路1132與第二電路1133可為形成在金屬基散熱板1131的下表面113B上的圖案化電路層。其中,此圖案化電路層可利用PCB(印刷電路板)製程形成在金屬基散熱板1131的下表面113B上。第三電路1134與第四電路1137可為形成在金屬基散熱板1131的上表面113A上的圖案化電路層。其中,此圖案化電路層可利用PCB(印刷電路板)製程形成在金屬基散熱板1131的上表面113A上。For example, the
在一些實施例中,金屬基散熱板1131可具有良好的導熱性、電氣絕緣性能和機械加工性能。其中,金屬基散熱板1131可為鋁基板。鋁基板能夠承載更高的電流,其耐壓可達4500V,且其導熱係數大於2.0。第一電路1132與第二電路1133可為一圖案化鋁箔。第三電路1134與第四電路1137可為另一圖案化鋁箔。In some embodiments, the metal-based
在一些實施例中,溫度控制組件10可更包括:一絕緣隔熱基座170。於此,複數加熱單元110沿著絕緣隔熱基座170的邊緣環繞絕緣隔熱基座170且固定於絕緣隔熱基座170上。舉例來說,各加熱單元110的固定段110C鎖固在絕緣隔熱基座170上。在一些實施例中,絕緣隔熱基座170可為電木隔熱材。In some embodiments, the temperature control assembly 10 may further include: an insulating heat-insulating base 170. Here, a plurality of
在一些實施例中,溫度控制組件10可透過將絕緣隔熱基座170固定於其他組件上,而與其他組件組裝成一儀器。In some embodiments, the temperature control assembly 10 can be assembled with other components into an instrument by fixing the insulating and heat-insulating base 170 to other components.
具體而言,一種檢測儀器,其包括前述任一實施例的溫度控制組件10、轉盤40、光學感測器50、轉動馬達70以及轉軸72。溫度控制組件10位於轉盤40與光學感測器50之間且藉由絕緣隔熱基座170固定在轉盤40上。光學感測器50位於溫度控制組件10相對於轉盤40的另一側,並且用以朝上對位在加熱單元110的承載孔111上的試管20進行偵測。轉動馬達70連接轉軸72的一端,並且用以轉動轉軸72。轉軸72的另一端耦接絕緣隔熱基座170,並且用以帶動轉盤40與溫度控制組件10進行轉動,以致使多個加熱單元110的承載孔111依序移動到光學感測器50上。Specifically, a detection instrument includes the temperature control assembly 10 of any of the above embodiments, a turntable 40, an optical sensor 50, a rotary motor 70, and a rotating shaft 72. The temperature control assembly 10 is located between the turntable 40 and the optical sensor 50 and is fixed on the turntable 40 by an insulating and heat-insulating base 170. The optical sensor 50 is located on the other side of the temperature control assembly 10 relative to the turntable 40, and is used to detect the test tube 20 located on the supporting hole 111 of the
舉例來說,參照圖10及圖11,絕緣隔熱基座170和16組加熱單元110連接固定後,將16組加熱單元110的承載孔111分別對準轉盤40上的16個限位孔401,然後將絕緣隔熱基座170固定在轉盤40上。16組加熱單元110的第一連接器140一對一插接至控制板130的第二連接器135,並且將轉盤線42組裝連接轉盤40。然後,再將轉軸72的二端分別組裝連接絕緣隔熱基座170與組裝在機架80上的轉動馬達70。最後,再將組裝好的組件罩上機殼90。於使用時,試管20通過轉盤40上的限位孔401而插設在加熱單元110的承載孔111上,並且試管20的開口上能覆蓋固定蓋30。For example, referring to FIG. 10 and FIG. 11 , after the insulating heat-insulating base 170 and the 16 sets of
在一些實施例中,檢測儀器可更包括:一風扇組件60,且此風扇組件60位於溫度控制組件10相對於轉盤40的另一側。在一些實施例中,風扇組件60可包括一個或多個風扇610以及風扇罩620。在此實施例中,風扇罩620位於風扇610與溫度控制組件10之間。風扇罩620是由靠近風扇610的一端往靠近溫度控制組件10的一端漸縮,藉以將風扇610吹出的風導向溫度控制組件10的中間區域。In some embodiments, the detection instrument may further include: a fan assembly 60, and the fan assembly 60 is located on the other side of the temperature control assembly 10 relative to the turntable 40. In some embodiments, the fan assembly 60 may include one or more fans 610 and a fan cover 620. In this embodiment, the fan cover 620 is located between the fan 610 and the temperature control assembly 10. The fan cover 620 is gradually narrowed from one end close to the fan 610 to one end close to the temperature control assembly 10, so as to guide the wind blown by the fan 610 to the middle area of the temperature control assembly 10.
在一些實施例中,參照圖12及圖13,俯視下,各加熱單元110的外型可呈現矩形。In some embodiments, referring to FIG. 12 and FIG. 13 , each
在另一些實施例中,參照圖14及圖15,各發熱體113可包括:一隔熱固定件114、一加熱塊(Heating block)115以及一薄膜電熱片116。薄膜電熱片116夾設在隔熱固定件114與加熱塊115之間。參照圖14至圖16,各溫度感測器120位於對應的加熱單元110的薄膜電熱片116上,且承載孔111貫穿對應的加熱單元110的隔熱固定件114、薄膜電熱片116與加熱塊115。In other embodiments, referring to FIG. 14 and FIG. 15 , each
在一些實施例中,參照圖14至圖16,各薄膜電熱片116可包括:一設置段1161以及一連接段1162。設置段1161夾設在隔熱固定件114與加熱塊115之間。連接段1162連接設置段1161,並且電性連接控制板130。於此,薄膜電熱片116可在控制板130的供電下發熱。各溫度感測器120位於對應的加熱單元110的設置段1161與連接段1162的連接處,且承載孔111貫穿隔熱固定件114、設置段1161以及加熱塊115。In some embodiments, referring to FIGS. 14 to 16 , each thin film heater 116 may include: a setting section 1161 and a connecting section 1162. The setting section 1161 is sandwiched between the heat insulating fixture 114 and the heating block 115. The connecting section 1162 connects the setting section 1161 and is electrically connected to the control board 130. Here, the thin film heater 116 can generate heat under the power supply of the control board 130. Each temperature sensor 120 is located at the connection between the setting section 1161 and the connecting section 1162 of the
舉例來說,隔熱固定件114與加熱塊115對位後,將薄膜電熱片116的設置段1161夾設其中,然後以螺絲將隔熱固定件114與加熱塊115鎖固在一起,而形成加熱單元110。For example, after the heat insulating fixture 114 and the heating block 115 are aligned, the setting section 1161 of the thin film heater 116 is sandwiched therebetween, and then the heat insulating fixture 114 and the heating block 115 are screwed together to form the
在一些實施例中,連接段1162可直接耦接控制板130的控制電路133。舉例來說,連接段1162的一端銜接設置段1161,而連接段1162的另一端直接焊接控制電路133(圖未示)。In some embodiments, the connecting section 1162 can be directly coupled to the control circuit 133 of the control board 130. For example, one end of the connecting section 1162 is connected to the setting section 1161, and the other end of the connecting section 1162 is directly welded to the control circuit 133 (not shown).
在另一些實施例中,連接段1162亦可經由導線或導線與連接器的組合電性連接控制板130的控制電路133。In some other embodiments, the connecting section 1162 may also be electrically connected to the control circuit 133 of the control board 130 via a wire or a combination of a wire and a connector.
在一些實施例中,各薄膜電熱片116可為聚酰亞胺(PI)薄膜電熱片。In some embodiments, each thin film heater 116 may be a polyimide (PI) thin film heater.
在一些實施例中,參照圖17至圖19,在組裝成檢測儀器時,各加熱單元110可直接固定在轉盤40上。舉例來說,參照圖14至圖17,各加熱單元110的隔熱固定件114具有固定孔114a。因此,透過將螺絲穿過固定孔114a並鎖入轉盤40能將加熱單元110鎖固在轉盤40上。In some embodiments, referring to FIGS. 17 to 19 , when the detection instrument is assembled, each
在一些實施例中,參照圖17至圖19,風扇組件60亦可直接固定於轉盤40上。於此些實施例中,風扇組件60位於溫度控制組件10相對於轉盤40的另一側,並且固定在加熱單元110圍繞成的中空區域所裸露出的轉盤40上。換言之,溫度控制組件10的複數加熱單元110環繞風扇組件60。並且,轉軸72的另一端連接風扇組件60。In some embodiments, referring to FIGS. 17 to 19 , the fan assembly 60 may also be directly fixed on the turntable 40. In these embodiments, the fan assembly 60 is located on the other side of the temperature control assembly 10 relative to the turntable 40, and is fixed on the turntable 40 exposed by the hollow area surrounded by the
舉例來說,16組加熱單元110的承載孔111分別對準轉盤40的16個限位孔401後,將各加熱單元110的隔熱固定件114鎖固在轉盤40上。並且,將風扇610鎖固在16組加熱單元110圍繞成的中間區域處的轉盤40上。16組加熱單元110的第一連接器140分別與控制板130對應位置的第二連接器135對接。轉軸72的另一端組裝在風扇罩620的外側。然後,以風扇罩620罩住風扇610,然後固定在轉盤40上。For example, after the bearing holes 111 of the 16
如此一來,檢測儀器可進行需調控樣品的溫度的檢測程序。In this way, the detection instrument can perform detection procedures that require the temperature of the sample to be controlled.
舉例來說,以PCR(聚合酶連鎖反應)的檢測儀器為例,PCR第一階段需要約94℃的處理溫度、PCR第二階段需要約60℃的處理溫度,並且PCR第三階段需要約72℃的處理溫度。在PCR第一階段,檢測儀器需對試管20加熱以升溫至94℃,並且將溫度維持在94℃。此時,控制板130的控制電路133供電給加熱單元110,使加熱單元110的發熱體113發熱以升溫至94℃,並且利用電腦程式PID控制(比例積分微分控制;Proportional-Integral and Derivative Control)根據各溫度感測器120所感測的溫度控制加熱單元110與風扇610的運作,使溫度維持在94℃。在PCR第二階段,控制板130的控制電路133停止供電給加熱單元110以關掉發熱體113,並且開啟風扇610,使風扇610藉由風扇罩620吹向加熱單元110,以降溫至約60℃。然後,控制板130的控制電路133利用電腦程式PID控制根據各溫度感測器120所感測的溫度控制加熱單元110與風扇610的運作,使溫度維持在約60℃。在PCR第三階段,控制板130的控制電路133再次供電給加熱單元110,使加熱單元110的發熱體113發熱以升溫至72℃,並且利用電腦程式PID控制根據各溫度感測器120所感測的溫度控制加熱單元110與風扇610的運作,使溫度維持在72℃。For example, in a PCR (polymerase chain reaction) detection instrument, the first stage of PCR requires a processing temperature of about 94° C., the second stage of PCR requires a processing temperature of about 60° C., and the third stage of PCR requires a processing temperature of about 72° C. In the first stage of PCR, the detection instrument needs to heat the test tube 20 to 94° C. and maintain the temperature at 94° C. At this time, the control circuit 133 of the control board 130 supplies power to the heating unit 110, so that the heating element 113 of the heating unit 110 generates heat to raise the temperature to 94°C, and uses the computer program PID control (Proportional-Integral and Derivative Control) to control the operation of the heating unit 110 and the fan 610 according to the temperature sensed by each temperature sensor 120, so that the temperature is maintained at 94°C. In the second stage of PCR, the control circuit 133 of the control board 130 stops supplying power to the heating unit 110 to turn off the heating element 113, and turns on the fan 610, so that the fan 610 blows toward the heating unit 110 through the fan cover 620 to cool down to about 60°C. Then, the control circuit 133 of the control board 130 uses the computer program PID control to control the operation of the heating unit 110 and the fan 610 according to the temperature sensed by each temperature sensor 120, so that the temperature is maintained at about 60°C. In the third stage of PCR, the control circuit 133 of the control board 130 supplies power to the heating unit 110 again, so that the heating element 113 of the heating unit 110 generates heat to raise the temperature to 72°C, and uses the computer program PID control to control the operation of the heating unit 110 and the fan 610 according to the temperature sensed by each temperature sensor 120, so that the temperature is maintained at 72°C.
綜上,在任一實施例中,溫度控制組件10適用於檢測儀器中,其能對多個試管20各別獨立進行溫度監控,並且有效控制其溫度,以達到均溫。在一些實施例中,溫度控制組件10採用降低質量的機構設計,其簡化結構,藉以降低硬體及裝配成本。在一些實施例中,溫度控制組件10使用鋁基板(即作為金屬基散熱板1131)製作加熱單元110,藉以更進一步地降低整體成本。在一些實施例中,溫度控制組件10的多個加熱單元110個別獨立進行溫度監控,並且於需升溫時進行雙面加熱,藉以快速升溫至所需溫度。In summary, in any embodiment, the temperature control assembly 10 is suitable for use in a detection instrument, which can independently monitor the temperature of multiple test tubes 20 and effectively control their temperatures to achieve uniform temperature. In some embodiments, the temperature control assembly 10 adopts a mechanism design that reduces mass, and its simplified structure reduces hardware and assembly costs. In some embodiments, the temperature control assembly 10 uses an aluminum substrate (i.e., as a metal-based heat sink 1131) to make the
10:溫度控制組件 110:加熱單元 110A:設置段 110B:連接段 110C:固定段 111:承載孔 113:發熱體 113A:上表面 113B:下表面 1131:金屬基散熱板 1132:第一電路 1133:第二電路 1134:第三電路 1135:導熱膠 1136:導熱膠 1137:第四電路 114:隔熱固定件 114a:固定孔 115:加熱塊 116:薄膜電熱片 1161:設置段 1162:連接段 120:溫度感測器 130:控制板 131:電路基板 133:控制電路 135:第二連接器 140:第一連接器 140a:接點 150:導線組 151:導線 152:導線 160:貫孔 161:導體 162:導體 170:絕緣隔熱基座 20:試管 30:固定蓋 40:轉盤 42:轉盤線 401:限位孔 50:光學感測器 60:風扇組件 610:風扇 620:風扇罩 70:轉動馬達 72:轉軸 80:機架 90:機殼 10: Temperature control assembly 110: Heating unit 110A: Setting section 110B: Connecting section 110C: Fixing section 111: Carrying hole 113: Heating element 113A: Upper surface 113B: Lower surface 1131: Metal-based heat sink 1132: First circuit 1133: Second circuit 1134: Third circuit 1135: Thermal conductive adhesive 1136: Thermal conductive adhesive 1137: Fourth circuit 114: Thermal insulation fixing piece 114a: Fixing hole 115: Heating block 116: Thin film heater 1161: Setting section 1162: Connecting section 120: Temperature sensor 130: Control panel 131: Circuit board 133: Control circuit 135: Second connector 140: First connector 140a: Contact 150: Wire assembly 151: Wire 152: Wire 160: Through hole 161: Conductor 162: Conductor 170: Insulation and heat insulation base 20: Test tube 30: Fixed cover 40: Turntable 42: Turntable wire 401: Limiting hole 50: Optical sensor 60: Fan assembly 610: Fan 620: Fan cover 70: Rotating motor 72: Rotating shaft 80: Rack 90: Casing
圖1為一實施例的溫度控制組件的示意圖。 圖2為圖1的溫度控制組件的爆炸圖。 圖3為在一視角下圖1的一組加熱單元與溫度感測器的第一示範例的示意圖。 圖4為在圖3相反視角下同一組加熱單元與溫度感測器的示意圖。 圖5為圖3的加熱單元在延長軸的切線下的截面示意圖。 圖6為在一視角下圖1的一組加熱單元與溫度感測器的第二示範例的示意圖。 圖7為在圖6相反視角下同一組加熱單元與溫度感測器的示意圖。 圖8為圖6的加熱單元在延長軸的切線下的截面示意圖。 圖9為加熱單元的第三示範例的截面示意圖。 圖10為一實施例的檢測儀器的爆炸圖。 圖11為圖10的局部分大圖。 圖12為在一視角下圖1的一組加熱單元與溫度感測器的第三示範例的示意圖。 圖13為在圖12相反視角下同一組加熱單元與溫度感測器的示意圖。 圖14為一組加熱單元與溫度感測器的第四示範例的示意圖。 圖15為圖14的一組加熱單元與溫度感測器的爆炸圖。 圖16為圖14的薄膜電熱片的放大圖。 圖17為另一實施例的檢測儀器的局部示意圖。 圖18為圖17的局部的反向後的爆炸圖。 圖19為另一實施例的檢測儀器的爆炸圖。 FIG. 1 is a schematic diagram of a temperature control assembly of an embodiment. FIG. 2 is an exploded view of the temperature control assembly of FIG. 1. FIG. 3 is a schematic diagram of a first exemplary embodiment of a set of heating units and a temperature sensor of FIG. 1 at a viewing angle. FIG. 4 is a schematic diagram of the same set of heating units and a temperature sensor at an opposite viewing angle of FIG. 3. FIG. 5 is a schematic diagram of a cross section of the heating unit of FIG. 3 at a tangent to an extension axis. FIG. 6 is a schematic diagram of a second exemplary embodiment of a set of heating units and a temperature sensor of FIG. 1 at a viewing angle. FIG. 7 is a schematic diagram of the same set of heating units and a temperature sensor at an opposite viewing angle of FIG. 6. FIG. 8 is a schematic diagram of a cross section of the heating unit of FIG. 6 at a tangent to an extension axis. FIG. 9 is a schematic diagram of a cross section of a third exemplary embodiment of a heating unit. FIG. 10 is an exploded view of a detection instrument of an embodiment. FIG. 11 is a partial enlarged view of FIG. 10 . FIG. 12 is a schematic diagram of a third exemplary embodiment of a set of heating units and a temperature sensor in FIG. 1 at a certain viewing angle. FIG. 13 is a schematic diagram of the same set of heating units and a temperature sensor at the opposite viewing angle of FIG. 12 . FIG. 14 is a schematic diagram of a fourth exemplary embodiment of a set of heating units and a temperature sensor. FIG. 15 is an exploded view of a set of heating units and a temperature sensor in FIG. 14 . FIG. 16 is an enlarged view of the thin film heater in FIG. 14 . FIG. 17 is a partial schematic diagram of a detection instrument in another embodiment. FIG. 18 is a partially reversed exploded view of FIG. 17 . FIG. 19 is an exploded view of a detection instrument in another embodiment.
10:溫度控制組件 10: Temperature control components
110:加熱單元 110: Heating unit
111:承載孔 111: Loading hole
113:發熱體 113: Fever body
120:溫度感測器 120: Temperature sensor
130:控制板 130: Control panel
131:電路基板 131: Circuit board
133:控制電路 133: Control circuit
135:第二連接器 135: Second connector
140:第一連接器 140: First connector
170:絕緣隔熱基座 170: Insulation and heat insulation base
Claims (20)
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5795547A (en) * | 1993-09-10 | 1998-08-18 | Roche Diagnostic Systems, Inc. | Thermal cycler |
US20070292309A1 (en) * | 2006-06-15 | 2007-12-20 | Logan Instruments Corp. | Pharmaceutical product release rate testing device |
CN203298502U (en) * | 2013-06-04 | 2013-11-20 | 苏州市金翔钛设备有限公司 | Constant-temperature heater |
TW201726908A (en) * | 2015-10-01 | 2017-08-01 | 柏克萊燈光有限公司 | Multi-slot plate incubator |
TW201836442A (en) * | 2017-02-20 | 2018-10-01 | 美商瑪森科技公司 | Temperature control using temperature control element coupled to faraday shield |
-
2022
- 2022-08-19 TW TW112121506A patent/TWI859922B/en active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5795547A (en) * | 1993-09-10 | 1998-08-18 | Roche Diagnostic Systems, Inc. | Thermal cycler |
US20070292309A1 (en) * | 2006-06-15 | 2007-12-20 | Logan Instruments Corp. | Pharmaceutical product release rate testing device |
CN203298502U (en) * | 2013-06-04 | 2013-11-20 | 苏州市金翔钛设备有限公司 | Constant-temperature heater |
TW201726908A (en) * | 2015-10-01 | 2017-08-01 | 柏克萊燈光有限公司 | Multi-slot plate incubator |
TW201836442A (en) * | 2017-02-20 | 2018-10-01 | 美商瑪森科技公司 | Temperature control using temperature control element coupled to faraday shield |
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