TWI858567B - Shiftable circuit element, shiftable image sensor module, camera module and electronic device - Google Patents

Abstract

A shiftable image sensor module includes an image sensor, an inner frame, an outer frame, an elastic connecting portion and a conducting wire portion. Each of the inner frame and the outer frame has a plurality of electrical connecting terminals, the outer frame surrounds the inner frame, and the image sensor is disposed on the inner frame. The elastic connecting portion is connected to the outer frame and the inner frame, so that the inner frame moves relatively to the outer frame. The connecting wire portion is composed of a plurality of connecting wire units. Each of the connecting wire units has two ends, two ends of each of the connecting wire units are connected to each of the electrical connecting terminals of the outer frame and each of the electrical connecting terminals of the inner frame, respectively. Each two of the connecting wire units of the connecting wire portion are not directly contacted, and each of the connecting wire units is entirely made of a conductor material. Therefore, the problem of the signal short circuit can be prevented.

Description

Movable circuit element, movable electronic photosensitive module, camera module and electronic device

The present disclosure relates to a movable circuit element, a movable electronic photosensitive module and a camera module, and in particular to a movable circuit element, a movable electronic photosensitive module and a camera module applied to a portable electronic device.

In recent years, portable electronic devices have developed rapidly, such as smart electronic devices and tablet computers, which have been prevalent in modern people's lives. Camera modules, mobile electronic photosensitive modules and mobile circuit components installed on portable electronic devices have also developed vigorously. However, as technology becomes more and more advanced, users have higher and higher requirements for the quality of mobile circuit components. Therefore, the development of a mobile circuit component that can stably provide electronic signals and prevent signal short circuits has become an important and urgent problem in the industry.

The present disclosure provides a movable circuit element, a movable electronic photosensitive module, a camera module and an electronic device, which connect an inner frame and an outer frame through a wire portion to stably transmit electronic signals to prevent signal short circuit.

According to an implementation method of the present disclosure, a movable electronic photosensitive module is provided, which includes an electronic photosensitive element, an inner frame portion, an outer frame portion, an elastic connection portion and a wire portion. The inner frame portion has a plurality of electrical connection terminals, and the electronic photosensitive element is arranged in the inner frame portion. The outer frame portion is arranged around the inner frame portion, and the outer frame portion has a plurality of electrical connection terminals. The elastic connection portion connects the outer frame portion and the inner frame portion, so that the inner frame portion can move relative to the outer frame portion. The wire portion is composed of a plurality of wire units. Each wire unit has two ends, and the two ends of each wire unit are electrically connected to each electrical connection terminal of the outer frame portion and each electrical connection terminal of the inner frame portion, respectively. There is no physical contact between the wire units of the wire portion, and each wire unit is a conductive material as a whole.

According to the movable electronic photosensitive module of the implementation method described in the previous paragraph, there may be no physical contact between the elastic connecting part and the wire part.

In the movable electronic photosensitive module according to the implementation method described in the previous paragraph, the elastic connecting part can provide a restoring force for the inner frame part to return to an initial position.

According to the movable electronic photosensitive module of the embodiment described in the preceding paragraph, at least four of the wire units are arranged adjacent to each other, and the distance between two adjacent wire units is Dc, which can meet the following conditions: 0.05 mm ≤ Dc ≤ 0.35 mm. In addition, it can meet the following conditions: 0.10 mm ≤ Dc ≤ 0.30 mm.

According to the movable electronic photosensitive module of the embodiment described in the preceding paragraph, the width of each wire unit is Wc, which can meet the following conditions: Wc ≤ 0.07 mm. In addition, it can meet the following conditions: Wc ≤ 0.05 mm.

According to the movable electronic photosensitive module of the implementation method described in the previous paragraph, at least four of the wire units are arranged adjacent to each other, the distance between two adjacent wire units is Dc, and the width of each wire unit is Wc, which can meet the following conditions: 2 ≤ Dc/Wc ≤ 7.

According to the movable electronic photosensitive module of the implementation method described in the previous paragraph, the number of wire units is N, which can meet the following conditions: 20 ≤ N.

According to the movable electronic photosensitive module of the embodiment described in the preceding paragraph, the cross-sectional width of the elastic connection portion is We, and the cross-sectional height of the elastic connection portion is He, which can meet the following conditions: 0.01 ≤ We/He ≤ 0.9. In addition, it can meet the following conditions: 0.05 ≤ We/He ≤ 0.6.

According to the movable electronic photosensitive module of the implementation method described in the previous paragraph, each wire unit can be set on the same plane.

According to the movable electronic photosensitive module of the implementation method described in the previous paragraph, the surrounding surfaces of each wire unit can be directly in contact with the air.

According to the movable electronic photosensitive module of the implementation method described in the previous paragraph, the wire portion may include a copper metal material.

According to the movable electronic photosensitive module of the implementation method described in the previous paragraph, the conductive wire portion may include a copper alloy material.

According to the portable electronic photosensitive module of the implementation method described in the previous paragraph, the copper content of the copper alloy material is MCu, which can meet the following conditions: 98% < MCu < 100%.

According to an embodiment of the present disclosure, a camera module is provided, wherein the camera module includes the aforementioned movable electronic photosensitive module, an imaging lens module and an optical image stabilizing drive. The imaging lens module is used to image an imaging light on the electronic photosensitive element of the movable electronic photosensitive module. The optical image stabilizing drive is used to provide a driving force for the electronic photosensitive element to move relative to the imaging lens module.

According to an embodiment of the present disclosure, an electronic device is provided, wherein the electronic device includes the aforementioned camera module.

According to an implementation method of the present disclosure, a movable circuit element is provided, which includes an inner frame portion, an outer frame portion, an elastic connection portion and a conductor portion. The inner frame portion has a plurality of electrical connection terminals. The outer frame portion is arranged around the inner frame portion, and the outer frame portion has a plurality of electrical connection terminals. The elastic connection portion connects the outer frame portion and the inner frame portion, so that the inner frame portion can move relative to the outer frame portion. The conductor portion is composed of a plurality of conductor units. Each conductor unit has two ends, and the two ends of each conductor unit are electrically connected to each electrical connection terminal of the outer frame portion and each electrical connection terminal of the inner frame portion, respectively. There is no physical contact between the conductor units of the conductor portion, and each conductor unit is entirely made of a conductive material.

According to the movable circuit element of the implementation method described in the previous paragraph, each conductor unit can be arranged on the same plane.

In the movable circuit element according to the implementation method described in the previous paragraph, the surrounding surfaces of each conductor unit can be directly in contact with the air.

According to the movable circuit element of the embodiment described in the preceding paragraph, at least four of the wire units are arranged adjacent to each other, and the distance between two adjacent wire units is Dc, which can meet the following conditions: 0.05 mm ≤ Dc ≤ 0.35 mm. In addition, it can meet the following conditions: 0.10 mm ≤ Dc ≤ 0.30 mm.

According to the movable circuit element of the embodiment described in the preceding paragraph, the width of each conductor unit is Wc, which can meet the following conditions: Wc ≤ 0.07 mm. In addition, it can meet the following conditions: Wc ≤ 0.05 mm.

According to the movable circuit element of the implementation method described in the previous paragraph, at least four of the conductor units are arranged adjacent to each other, the distance between two adjacent conductor units is Dc, and the width of each conductor unit is Wc, which can meet the following conditions: 2 ≤ Dc/Wc ≤ 7.

According to the movable circuit element of the implementation method described in the previous paragraph, the number of wire units is N, which can meet the following condition: 20 ≤ N.

According to the movable circuit element of the embodiment described in the preceding paragraph, the cross-sectional width of the elastic connection portion is We, and the cross-sectional height of the elastic connection portion is He, which can meet the following conditions: 0.01 ≤ We/He ≤ 0.9. In addition, it can meet the following conditions: 0.05 ≤ We/He ≤ 0.6.

In the movable circuit element according to the embodiment described in the preceding paragraph, the conductor portion may include a copper metal material.

In the movable circuit element according to the embodiment described in the preceding paragraph, the conductor portion may include a copper alloy material.

According to the movable circuit element of the implementation method described in the previous paragraph, the copper content of the copper alloy material is MCu, which can meet the following conditions: 98% < MCu < 100%.

The present disclosure provides a movable electronic photosensitive module, which includes an electronic photosensitive element, an inner frame, an outer frame, an elastic connection portion and a wire portion. The inner frame has a plurality of electrical connection terminals, and the electronic photosensitive element is arranged in the inner frame. The outer frame is arranged around the inner frame, and the outer frame has a plurality of electrical connection terminals. The elastic connection portion connects the outer frame and the inner frame, so that the inner frame can move relative to the outer frame. The wire portion is composed of a plurality of wire units. Each wire unit has two ends, and the two ends of each wire unit are electrically connected to each electrical connection terminal of the outer frame and each electrical connection terminal of the inner frame, respectively. There is no physical contact between the wire units of the wire portion, and each wire unit is a conductive material as a whole.

Specifically, the present disclosure can transmit electronic signals more stably and prevent signal short circuit by setting up a plurality of independent pure conductive wire units to connect the inner frame and the outer frame.

Furthermore, the wire unit as a whole has high electrical conductivity, wherein the wire unit can be composed of copper, silver, gold, aluminum or their respective alloys, but not limited thereto. The wire unit can be a bare wire, and no insulating material is required to transmit electrical signals.

Both the outer frame and the inner frame have an electrical signal transmission part and an elastic support part, wherein the electrical signal transmission part can be welded with the wire unit so that the electrical signal can be transmitted between the outer frame and the inner frame, and the elastic support part is used to connect the elastic connection part to provide support for the outer frame and the inner frame, and provide the inner frame with a degree of freedom on a plane. Furthermore, the wire unit is directly welded to the electrical signal transmission part of the outer frame and the electrical signal transmission part of the inner frame, thereby effectively simplifying the difficulty of the process, providing the feasibility of mass production, and cooperating with the elastic connection part to support the overall structure, so that the wire part of the flexible circuit element is not easily damaged.

The elastic connection part can have no physical contact with the wire part. By staggering the elastic connection part and the wire part, it can prevent mechanical interference and prevent errors in signal transmission.

The elastic connection part can provide a restoring force for the inner frame part to return to an initial position. Specifically, after the inner frame part is displaced by an external driving force, the elastic connection part can provide a restoring force to return it to the initial position, wherein the initial position refers to the position where the inner frame part has not moved relative to the outer frame part. In this way, the elastic connection part provides a mechanical support function and stabilizes the force applied to the inner frame part when it is driven again.

Each wire unit can be arranged on the same plane, thereby providing the feasibility of automated manufacturing.

The surrounding surfaces of each wire unit can be in direct contact with the air. Thus, there is no need to set up external components to assist in supporting the wire unit.

The conductor portion may include a copper metal material. Alternatively, the conductor portion may include a copper alloy material. Thereby, a conductor portion material with higher toughness and good electrical conductivity can be provided. Furthermore, the copper alloy material may be a copper alloy doped with iron, zinc, tin, aluminum, nickel, titanium, and cobalt, but is not limited thereto, wherein the copper content of the copper alloy material is MCu, which may meet the following conditions: 98% < MCu < 100%. Through a copper alloy with a higher copper content, the production cost can be reduced and good electrical properties can be maintained. Furthermore, the copper alloy may be 99% copper and 1% titanium.

At least four of the wire units are arranged adjacent to each other, and the distance between two adjacent wire units is Dc, which can meet the following conditions: 0.05 mm ≤ Dc ≤ 0.35 mm. The above distance range can ensure that the wire units will not collide with each other when the flexible circuit element is in operation. In addition, it can meet the following conditions: 0.10 mm ≤ Dc ≤ 0.30 mm. In this way, a more flexible wiring design can be achieved, reducing the space occupied by the wire part, so as to achieve the miniaturization of the movable electronic photosensitive module.

The width of each conductor unit is Wc, which can meet the following conditions: Wc ≤ 0.07 mm. This can provide electronic signal transmission with a higher signal-to-noise ratio. In addition, it can meet the following conditions: Wc ≤ 0.05 mm. This can further reduce the interference of the conductor unit during driving.

The distance between two adjacent conductor units is Dc, and the width of each conductor unit is Wc, which can meet the following conditions: 2 ≤ Dc/Wc ≤ 7. When Dc/Wc meets the above conditions, the conductor unit can tolerate greater pulling and deformation.

The number of wire units is N, which satisfies the following condition: 20 ≤ N. Thus, a higher image signal transmission efficiency can be provided.

The cross-sectional width of the elastic connection is We, and the cross-sectional height of the elastic connection is He, which can meet the following conditions: 0.01 ≤ We/He ≤ 0.9. Specifically, the elastic connection can provide a larger lateral deformability and maintain the axial support function. In addition, it can meet the following conditions: 0.05 ≤ We/He ≤ 0.6. This helps to improve the reliability of the elastic connection and enhance the driving stability.

The various technical features of the above-mentioned movable electronic photosensitive module disclosed in the present invention can be configured in combination to achieve corresponding effects.

The present disclosure provides a camera module, wherein the camera module includes the aforementioned movable electronic photosensitive module, an imaging lens module and an optical image stabilizing actuator. The imaging lens module is used to image an imaging light on the electronic photosensitive element of the movable electronic photosensitive module. The optical image stabilizing actuator is used to provide a driving force for the electronic photosensitive element to move relative to the imaging lens module. Furthermore, the optical image stabilizing actuator may include an optical image stabilizing coil and a magnet corresponding to it, and the camera module may further include an autofocus actuator, wherein the autofocus actuator may include an autofocus coil and a magnet corresponding to it, to provide a driving force for the imaging lens module to move relative to the electronic photosensitive element.

The present disclosure provides an electronic device, wherein the electronic device includes the aforementioned camera module.

The present disclosure provides a movable circuit element, which includes an inner frame portion, an outer frame portion, an elastic connection portion and a conductor portion. The inner frame portion has a plurality of electrical connection terminals. The outer frame portion is arranged around the inner frame portion, and the outer frame portion has a plurality of electrical connection terminals. The elastic connection portion connects the outer frame portion and the inner frame portion, so that the inner frame portion can move relative to the outer frame portion. The conductor portion is composed of a plurality of conductor units. Each conductor unit has two ends, and the two ends of each conductor unit are electrically connected to each electrical connection terminal of the outer frame portion and each electrical connection terminal of the inner frame portion, respectively. There is no physical contact between the conductor units of the conductor portion, and each conductor unit is entirely made of a conductive material.

Specifically, the present disclosure can transmit electronic signals more stably and prevent signal short circuit by setting a plurality of independent pure conductor wire units to connect the inner frame and the outer frame. Furthermore, the wire units are directly welded to the electrical signal transmission part of the outer frame and the electrical signal transmission part of the inner frame, thereby effectively simplifying the difficulty of the process and providing the feasibility of mass production. With the flexible connection part to support the overall structure, the wire part of the flexible circuit element is not easily damaged.

Each wire unit can be arranged on the same plane, thereby providing the feasibility of automated manufacturing.

The surrounding surfaces of each wire unit can be in direct contact with the air. Thus, no external components are required to assist in supporting the wire unit.

The conductor part may include a copper metal material. Alternatively, the conductor part may include a copper alloy material. Thus, a conductor part material with high toughness and good electrical conductivity can be provided. Specifically, the copper content of the copper alloy material is MCu, which can meet the following conditions: 98% < MCu < 100%. Through the copper alloy with a higher copper content, the production cost can be reduced and good electrical properties can be maintained.

At least four of the wire units are arranged adjacent to each other, and the distance between two adjacent wire units is Dc, which can meet the following conditions: 0.05 mm ≤ Dc ≤ 0.35 mm. The above distance range can ensure that the wire units do not collide with each other when the flexible circuit element is in operation. In addition, it can meet the following conditions: 0.10 mm ≤ Dc ≤ 0.30 mm. In this way, a more flexible wiring design can be achieved, reducing the space occupied by the wire part, so as to achieve the miniaturization of the movable circuit element.

The width of each conductor unit is Wc, which can meet the following conditions: Wc ≤ 0.07 mm. This can provide electronic signal transmission with a higher signal-to-noise ratio. In addition, it can meet the following conditions: Wc ≤ 0.05 mm. This can further reduce the interference of the conductor unit during driving.

The distance between two adjacent conductor units is Dc, and the width of each conductor unit is Wc, which can meet the following conditions: 2 ≤ Dc/Wc ≤ 7. When Dc/Wc meets the above conditions, the conductor unit can tolerate greater pulling and deformation.

The number of wire units is N, which satisfies the following condition: 20 ≤ N. Thus, a higher image signal transmission efficiency can be provided.

The cross-sectional width of the elastic connection is We, and the cross-sectional height of the elastic connection is He, which can meet the following conditions: 0.01 ≤ We/He ≤ 0.9. In this way, the elastic connection can provide a larger lateral deformability and maintain the axial support function. In addition, it can meet the following conditions: 0.05 ≤ We/He ≤ 0.6. In this way, the reliability of the elastic connection is improved and the driving stability is enhanced.

The various technical features of the above-mentioned movable circuit element disclosed in the present invention can be configured in combination to achieve corresponding effects.

According to the above implementation, specific implementations and examples are proposed below and described in detail with reference to the drawings.

＜First implementation method＞

Please refer to FIG. 1A, which shows an exploded view of a camera module 10 according to a first embodiment of the present disclosure. As can be seen from FIG. 1A, the camera module 10 includes a movable electronic photosensitive module (not shown), an imaging lens module 11, an optical image stabilization drive (not shown), an autofocus drive (not shown), a filter 14, a movable base 15 and a fixed base 16.

The movable electronic photosensitive module includes an electronic photosensitive element 12 and a movable circuit element 13, wherein the electronic photosensitive element 12 is disposed on the movable circuit element 13, but the movable circuit element provided in the present disclosure can be used in conjunction with other electronic photosensitive elements and is not limited to the first embodiment. The imaging lens module 11 is used to image an imaging light on the electronic photosensitive element 12 of the movable electronic photosensitive module, the optical image stabilizing drive is used to provide a driving force for the electronic photosensitive element 12 to move relative to the imaging lens module 11, and the filter 14 is disposed on the image side of the imaging lens module 11 and the object side of the electronic photosensitive element 12.

The optical image stabilization drive may include an optical image stabilization coil 111 and a plurality of fixed magnets 112, wherein the fixed magnets 112 are disposed corresponding to the optical image stabilization coil 111 to drive the electronic photosensitive element 12 to move on a plane perpendicular to the optical axis (not shown). In the first embodiment, the number of the optical image stabilization coil 111 is four, and the number of the fixed magnets 112 is four, but this is not limited thereto.

The autofocus driver may include an autofocus coil 121, a plurality of fixed magnets 122, a spring 123, a magnet fixing member 124, a plurality of sensing elements 125, a plurality of sensing magnets 126, and a spring 127, wherein the fixed magnet 122 is disposed correspondingly to the autofocus coil 121 to drive the imaging lens module 11 to move in the optical axis direction and can be used to provide a driving force for the imaging lens module 11 to move relative to the electronic photosensitive element 12; the spring 123 and the spring 127 are disposed correspondingly to the autofocus coil 121 to drive the imaging lens module 11 to move in the optical axis direction and can be used to provide a driving force for the imaging lens module 11 to move relative to the electronic photosensitive element 12; The spring piece 127 is respectively arranged on the object side and the image side of the imaging lens module 11, and the upper spring piece 123 and the lower spring piece 127 are arranged opposite to each other; there is no relative displacement between the magnet fixing part 124 and the fixed base 16, and the fixed magnets 112 and 122 can be fixed to the magnet fixing part 124; the sensing element 125 is respectively arranged corresponding to a part of the optical image stabilizing coil 111 and a part of the sensing magnet 126, wherein the sensing element 125 is used to detect the relative position of the sensing magnet 126 corresponding thereto. In the first embodiment, the number of the fixed magnets 122 is two, the number of the sensing elements 125 is three, and the number of the sensing magnets 126 is two, but it is not limited thereto.

Please refer to Figures 1B to 1D, wherein Figure 1B shows a three-dimensional diagram of the movable circuit element 13 in the first embodiment according to the first embodiment of Figure 1A, Figure 1C shows a plan schematic diagram of the movable circuit element 13 in the first embodiment according to the first embodiment of Figure 1A, and Figure 1D shows a partial enlarged diagram of the movable circuit element 13 in the first embodiment according to the first embodiment of Figure 1C. As can be seen from FIG. 1A to FIG. 1D , the movable circuit element 13 includes an inner frame portion 131, an outer frame portion 132, an elastic connection portion 133, and a conductor portion 134, wherein the inner frame portion 131 has a plurality of electrical connection terminals 141, the electronic photosensitive element 12 is disposed in the inner frame portion 131, and the movable base 15 is fixed to the inner frame portion 131; the outer frame portion 132 is disposed around the inner frame portion 131, the outer frame portion 132 has a plurality of electrical connection terminals 142, and the fixed base 16 is fixed to the outer frame portion 132; the elastic connection portion 133 is connected to the outer frame portion 132 and the inner frame portion 131, so that the inner frame portion 131 can move relative to the outer frame portion 132; the wire portion 134 is composed of a plurality of wire units 143, each wire unit 143 has two ends, one of the two ends of each wire unit 143 is electrically connected to each electrical connection terminal 142 of the outer frame portion 132, and the other of the two ends of each wire unit 143 is electrically connected to each electrical connection terminal 141 of the inner frame portion 131, there is no physical contact between the wire units 143 of the wire portion 134, and each wire unit 143 is made of a conductive material as a whole.

Please refer to FIG. 1E and FIG. 1F, wherein FIG. 1E shows an exploded view of the movable circuit element 13 in the first embodiment of the first embodiment of FIG. 1A, and FIG. 1F shows a partially enlarged view of the movable circuit element 13 in the first embodiment of the first embodiment of FIG. 1E. As can be seen from FIG. 1B to FIG. 1F, by providing a plurality of independent pure conductive wire units 143 to connect the inner frame 131 and the outer frame 132, electronic signals can be transmitted more stably and signal short circuits can be prevented.

Furthermore, the wire unit 143 as a whole has high electrical conductivity, wherein the wire unit 143 may be composed of copper, silver, gold, aluminum or their respective alloys, but is not limited thereto. Furthermore, the wire unit 143 may be a bare wire, and no insulating material is required to transmit electrical signals.

As can be seen from Figure 1E, the inner frame portion 131 has an electrical signal transmission part P1 and an elastic supporting part P3, and the outer frame portion 132 has an electrical signal transmission part P2 and an elastic supporting part P4, wherein the electrical signal transmission parts P1 and P2 can be welded to the wire unit 143 so that the electrical signal can be transmitted between the outer frame portion 132 and the inner frame portion 131, and the elastic supporting parts P3 and P4 are used to connect the elastic connecting part 133 to provide support for the outer frame portion 132 and the inner frame portion 131, and provide the inner frame portion 131 with freedom on a plane.

Furthermore, the wire unit 143 is directly welded to the electrical signal transmission part P1 of the inner frame 131 and the electrical signal transmission part P2 of the outer frame 132, thereby effectively simplifying the difficulty of the manufacturing process and providing the feasibility of mass production. The flexible connecting part 133 is used to support the overall structure, so that the wire part 134 is not easily damaged.

Specifically, the electrical signal transmission parts P1 and P2 can be used to transmit the electrical signal of the electronic photosensitive element 12, the electrical signal of the optical image stabilizing coil 111, and the electrical signal of the sensing element 125.

As can be seen from FIG. 1C , there is no physical contact between the elastic connection portion 133 and the wire portion 134, and the elastic connection portion 133 provides a restoring force for the inner frame portion 131 to return to an initial position. The design of staggered arrangement of the elastic connection portion 133 and the wire portion 134 can prevent mechanical interference and prevent errors in signal transmission. Furthermore, after the inner frame portion 131 is displaced by an external driving force, the elastic connection portion 133 can provide a restoring force to restore it to its initial position. Accordingly, the elastic connection portion 133 can provide a mechanical support function and stabilize the force on the inner frame portion 131 when it is driven again.

Each wire unit 143 is disposed on the same plane to provide the feasibility of automated manufacturing, and the surrounding surfaces of each wire unit 143 are directly in contact with air. Thus, there is no need to set up external components to assist in supporting the wire unit 143.

The conductor portion 134 may include a copper metal material to provide a conductor portion material with higher toughness and good electrical conductivity. Alternatively, the conductor portion 134 may include a copper alloy material to provide a conductor portion material with higher toughness and good electrical conductivity, wherein the copper alloy material may be a copper alloy doped with iron, zinc, tin, aluminum, nickel, titanium, and cobalt, but is not limited thereto. Specifically, the copper content of the copper alloy material is MCu, which may meet the following conditions: 98% < MCu < 100%. By using a copper alloy with a higher copper content, the production cost can be reduced and good electrical properties can be maintained, and the copper alloy may be 99% copper and 1% titanium.

As can be seen from Figure 1D and Figure 1F, at least four of the wire units 143 are arranged adjacent to each other, and the distance between two adjacent wire units 143 is Dc; the width of each wire unit 143 is Wc; the number of wire units 143 is N; the cross-sectional width of the elastic connection portion 133 is We; and the cross-sectional height of the elastic connection portion 133 is He. The parameters meet the conditions of Table 1A below. Table 1A, first embodiment of the first embodiment Dc (mm) 0.14 We (mm) 0.07 Wc (mm) 0.04 He (mm) 0.25 DC/W 3.5 We/He 0.28 N 28

In the second embodiment of the first embodiment, at least four of the wire units 143 are arranged adjacent to each other, the distance between two adjacent wire units 143 is Dc; the width of each wire unit 143 is Wc; the number of wire units 143 is N; the cross-sectional width of the elastic connection portion 133 is We; the cross-sectional height of the elastic connection portion 133 is He, wherein the distance Dc between two adjacent wire units 143, the width Wc of each wire unit 143, the cross-sectional width We of the elastic connection portion 133 and the cross-sectional height He of the elastic connection portion 133 can be compared with the markings in Figure 1D and Figure 1F, and the parameters meet the conditions of Table 1B below. Table 1B, second embodiment of the first embodiment Dc (mm) 0.18 We (mm) 0.05 Wc (mm) 0.03 He (mm) 0.30 DC/W 6.0 We/He 0.167 N 36

In the third embodiment of the first embodiment, at least four of the wire units 143 are arranged adjacent to each other, and the distance between two adjacent wire units 143 is Dc; the width of each wire unit 143 is Wc; the number of wire units 143 is N; the cross-sectional width of the elastic connection portion 133 is We; and the cross-sectional height He of the elastic connection portion 133, wherein the distance Dc between two adjacent wire units 143, the width Wc of each wire unit 143, the cross-sectional width We of the elastic connection portion 133 and the cross-sectional height He of the elastic connection portion 133 can be compared with the markings in Figure 1D and Figure 1F, and the parameters meet the conditions of Table 1C below. Table 1C, third embodiment of the first embodiment Dc (mm) 0.10 We (mm) 0.08 Wc (mm) 0.04 He (mm) 0.20 DC/W 2.5 We/He 0.40 N 32

＜Second implementation method＞

Please refer to FIG. 2A and FIG. 2B, wherein FIG. 2A is a schematic diagram of an electronic device 20 according to a second embodiment of the present disclosure, and FIG. 2B is another schematic diagram of the electronic device 20 according to the second embodiment of FIG. 2A. As can be seen from FIG. 2A and FIG. 2B, the electronic device 20 is a smart phone, and the electronic device 20 includes a camera module and a user interface 21. Specifically, the camera module is an ultra-wide-angle camera module 22, a high-pixel camera module 23, and a telephoto camera module 24, and the user interface 21 is a touch screen, but is not limited thereto. Specifically, the camera module can be the camera module of the aforementioned first embodiment, but the present disclosure is not limited thereto.

The user enters the shooting mode through the user interface 21, wherein the user interface 21 is used to display the screen and can be used to manually adjust the shooting angle to switch different camera modules. At this time, the camera module gathers imaging light on an electronic photosensitive element (not shown) of the camera module and outputs electronic signals related to the image to the image signal processing element (Image Signal Processor, ISP) 25.

As can be seen from FIG. 2B , in response to the camera specifications of the electronic device 20 , the electronic device 20 may further include an optical image stabilization component (not shown). Furthermore, the electronic device 20 may further include at least one focus assist module (not shown) and at least one sensor element (not shown). The focus assist module may be a flash module 26 for compensating color temperature, an infrared ranging element, a laser focus module, etc. The sensing element may have the function of sensing physical momentum and motion energy, such as an accelerometer, a gyroscope, or a Hall Effect Element, so as to sense the shaking and trembling imposed by the user's hand or the external environment, thereby facilitating the automatic focus function and the optical image stabilization component configured in the camera module of the electronic device 20 to obtain good imaging quality, and helping the electronic device 20 according to the present disclosure to have multiple modes of shooting functions, such as optimized Selfie, low-light HDR (High Dynamic Range) imaging, high-resolution 4K (4K Resolution) recording, etc. In addition, the user can directly view the camera's shooting screen through the user interface 21 and manually operate the framing range on the user interface 21 to achieve a WYSIWYG auto focus function.

Furthermore, the camera module, optical image stabilization assembly, sensor element and focus assist module can be arranged on a flexible printed circuit board (FPC) (not shown), and electrically connected to the imaging signal processing element 25 and other related elements through a connector (not shown) to execute the shooting process. Current electronic devices such as smart phones have a trend of being thin and light. The camera module and related components are arranged on a flexible circuit board, and then the circuit is integrated into the main board of the electronic device using a connector. This can meet the requirements of the mechanism design and circuit layout of the limited space inside the electronic device and obtain a larger margin, and also make the auto focus function of the camera module more flexible to control through the touch screen of the electronic device. In the second embodiment, the electronic device 20 may include a plurality of sensing elements and a plurality of focus assisting modules, which are disposed on a flexible circuit board and at least one other flexible circuit board (not shown), and are electrically connected to the imaging signal processing element 25 and other related elements through corresponding connectors to execute the shooting process. In other embodiments (not shown), the sensing elements and the auxiliary optical elements may also be disposed on the main board of the electronic device or other forms of carrier boards according to the mechanism design and circuit layout requirements.

In addition, the electronic device 20 may further include but is not limited to a display unit (Display), a control unit (Control Unit), a storage unit (Storage Unit), a RAM (RAM), a read-only memory unit (ROM) or a combination thereof.

FIG. 2C is a schematic diagram showing an image captured by the electronic device 20 in the second embodiment of FIG. 2A. As can be seen from FIG. 2C, the ultra-wide-angle camera module 22 can capture images of a wider range, and has the function of accommodating more scenery.

FIG. 2D is another schematic diagram of an image captured by the electronic device 20 in the second embodiment of FIG. 2A. As can be seen from FIG. 2D, the high-pixel camera module 23 can capture images with high resolution and low distortion within a certain range.

FIG. 2E is another schematic diagram of an image captured by the electronic device 20 in the second embodiment of FIG. 2A. As can be seen from FIG. 2E, the telephoto camera module 24 has a high-magnification function, and can capture images at a distance and magnify them to a high magnification.

As can be seen from FIG. 2C to FIG. 2E , by framing with camera modules having different focal lengths and combining with image processing technology, the zoom function can be realized in the electronic device 20 .

＜Third implementation method＞

Please refer to FIG. 3, which shows a schematic diagram of an electronic device 30 in accordance with the third embodiment of the present disclosure. As can be seen from FIG. 3, the electronic device 30 is a smart phone, and the electronic device 30 includes a camera module. Specifically, the camera modules are ultra-wide-angle camera modules 311, 312, wide-angle camera modules 313, 314, telephoto camera modules 315, 316, 317, 318, and a TOF module (Time-Of-Flight) 319, and the TOF module 319 can also be other types of camera modules, and is not limited to this configuration. Specifically, the camera module can be the camera module of the aforementioned first embodiment, but the present disclosure is not limited thereto.

Furthermore, the telephoto camera modules 317 and 318 are used to deflect the optical path, but the present disclosure is not limited thereto.

In response to the camera specifications of the electronic device 30, the electronic device 30 may further include an optical image stabilization component (not shown). Furthermore, the electronic device 30 may further include at least one focus assist module (not shown) and at least one sensor element (not shown). The focus assist module may be a flash module 320 for compensating color temperature, an infrared ranging element, a laser focus module, etc. The sensing element may have the function of sensing physical momentum and motion energy, such as an accelerometer, a gyroscope, or a Hall Effect Element, so as to sense the shaking and trembling imposed by the user's hand or the external environment, thereby facilitating the automatic focus function and the optical image stabilization component configured in the camera module of the electronic device 30 to obtain good imaging quality, and helping the electronic device 30 according to the present disclosure to have multiple modes of shooting functions, such as optimized Selfie, low-light HDR (High Dynamic Range), high-resolution 4K (4K Resolution) recording, etc.

In addition, the structures and configurations of the remaining components of the third embodiment are the same as those of the second embodiment and will not be further described herein.

<Fourth implementation method>

Please refer to FIG. 4A to FIG. 4C, wherein FIG. 4A is a schematic diagram of a vehicle tool 40 according to a fourth embodiment of the present disclosure, FIG. 4B is another schematic diagram of the vehicle tool 40 according to the fourth embodiment of FIG. 4A, and FIG. 4C is another schematic diagram of the vehicle tool 40 according to the fourth embodiment of FIG. 4A. It can be seen from FIG. 4A to FIG. 4C that the vehicle tool 40 includes a plurality of camera modules 41. In the fourth embodiment, the number of the camera modules 41 is six, and the camera modules 41 can be the camera modules of the first embodiment described above, but are not limited to this number.

As can be seen from FIG. 4A and FIG. 4B , the camera module 41 is a vehicle camera module, and the two camera modules 41 are respectively located below the left and right rearview mirrors, and are used to capture image information of a viewing angle θ. Specifically, the viewing angle θ can meet the following conditions: 40 degrees < θ < 90 degrees. In this way, image information within the left and right lanes can be captured.

As can be seen from FIG. 4B , the other two of the camera modules 41 can be disposed in the space inside the vehicle tool 40. Specifically, the two camera modules 41 are disposed respectively near the rearview mirror inside the vehicle and near the rear window. Furthermore, the other camera modules 41 can be disposed respectively on the non-mirror surface of the left and right rearview mirrors of the vehicle tool 40, but the invention is not limited thereto.

As can be seen from FIG. 4C , two of the camera modules 41 can be disposed at the front and rear ends of the vehicle tool 40. The configuration of the camera modules 41 at the front and rear ends of the vehicle tool 40 and below the left and right rearview mirrors can help the driver obtain external spatial information outside the cockpit, such as external spatial information I1, I2, I3, and I4, but not limited thereto. In this way, more viewing angles can be provided to reduce blind spots, thereby helping to improve driving safety. Furthermore, by arranging the camera modules 41 around the vehicle tool 40, it is helpful to identify road condition information outside the vehicle tool 40, so as to help realize the function of automatic driving assistance.

Although the present invention has been disclosed as above by way of implementation and examples, they are not intended to limit the present invention. Any person with ordinary knowledge in the relevant technical field may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the definition of the attached patent application scope.

10,41: Camera module 11: Imaging lens module 12: Electronic photosensitive element 13: Movable circuit element 14: Filter 15: Movable base 16: Fixed base 111: Optical image stabilization coil 112,122: Fixed magnet 121: Autofocus coil 123: Upper spring 124: Magnet fixing part 125: Sensing element 126: Sensing magnet 127: Lower spring 131: Inner frame 132: Outer frame 133: Elastic connection part 134: Wire part 141,142: Electrical connection terminal 143: Wire unit 20,30: Electronic device 21: User interface 22,311,312: Ultra-wide-angle camera module 23: High-pixel camera module 24,315,316,317,318: Telephoto camera module 25: Imaging signal processing element 26,320: Flash module 313,314: Wide-angle camera module 319: TOF module 40: Vehicle tools P1, P2: Electrical signal transmission part P3, P4: Elastic support part I1, I2, I3, I4: External spatial information Dc: Distance between two adjacent wire units Wc: Width of each wire unit We: Cross-sectional width of the elastic connection part He: Cross-sectional height of the elastic connection part θ: Viewing angle

FIG. 1A shows an exploded view of a camera module in a first embodiment of the present disclosure; FIG. 1B shows a three-dimensional view of a movable circuit element in a first embodiment of the first embodiment of FIG. 1A; FIG. 1C shows a plan view of a movable circuit element in a first embodiment of the first embodiment of FIG. 1A; FIG. 1D shows a partially enlarged view of a movable circuit element in a first embodiment of the first embodiment of FIG. 1C; FIG. 1E shows an exploded view of a movable circuit element in a first embodiment of the first embodiment of FIG. 1A; FIG. 1F shows a partially enlarged view of a movable circuit element in a first embodiment of the first embodiment of FIG. 1E; FIG. 2A shows a schematic view of an electronic device in a second embodiment of the present disclosure; FIG. 2B shows another schematic view of an electronic device in a second embodiment of FIG. 2A; FIG. 2C is a schematic diagram of an image captured by an electronic device in the second embodiment of FIG. 2A; FIG. 2D is a schematic diagram of another image captured by an electronic device in the second embodiment of FIG. 2A; FIG. 2E is a schematic diagram of another image captured by an electronic device in the second embodiment of FIG. 2A; FIG. 3 is a schematic diagram of an electronic device in the third embodiment of the present disclosure; FIG. 4A is a schematic diagram of a vehicle tool in the fourth embodiment of the present disclosure; FIG. 4B is another schematic diagram of a vehicle tool in the fourth embodiment of FIG. 4A; and FIG. 4C is another schematic diagram of a vehicle tool in the fourth embodiment of FIG. 4A.

10: Camera module

11: Imaging lens module

12: Electronic photosensitive element

13: Movable circuit components

14: Filter

15: Movable base

16:Fixed base

111: Optical image stabilizing coil

112,122:Fixed magnet

121: Autofocus coil

123: Reel in the spring

124: Magnetic fixings

125: Sensing element

126: Detecting magnets

127: Downward spring

Claims (31)

A movable electronic photosensitive module comprises: an electronic photosensitive element; an inner frame portion having a plurality of electrical connection terminals, and the electronic photosensitive element is arranged in the inner frame portion; an outer frame portion is arranged around the inner frame portion, and the outer frame portion has a plurality of electrical connection terminals; an elastic connection portion connecting the outer frame portion and the inner frame portion, so that the inner frame portion can move relative to the outer frame portion; and a wire portion, It is composed of a plurality of wire units; wherein each of the wire units has two ends, and the two ends of each of the wire units are electrically connected to each of the electrical connection terminals of the outer frame and each of the electrical connection terminals of the inner frame respectively, and there is no physical contact between the wire units of the wire part, and each of the wire units is a conductive material as a whole; wherein there is no physical contact between the elastic connection part and the wire part. A movable electronic photosensitive module as described in claim 1, wherein the elastic connection portion provides a restoring force for the inner frame portion to return to an initial position. The movable electronic photosensitive module as described in claim 1, wherein at least four of the wire units are arranged adjacent to each other, and the distance between two adjacent wire units of the at least four wire units is Dc, which satisfies the following conditions: 0.05 mm

Dc

0.35mm. The movable electronic photosensitive module as described in claim 3, wherein the distance between the two adjacent ones of the at least four wire units is Dc, which satisfies the following conditions: 0.10 mm

Dc

0.30mm. The movable electronic photosensitive module as described in claim 1, wherein the width of each wire unit is Wc, which satisfies the following conditions:

0.07mm. The movable electronic photosensitive module as described in claim 5, wherein the width of each wire unit is Wc, which satisfies the following conditions:

0.05mm. The movable electronic photosensitive module as described in claim 1, wherein at least four of the wire units are arranged adjacent to each other, the distance between two adjacent wire units of the at least four wire units is Dc, and the width of each wire unit is Wc, which satisfies the following conditions:

DC/W

7. The movable electronic photosensitive module as claimed in claim 1, wherein the number of the wire units is N, which satisfies the following conditions:

N. The movable electronic photosensitive module as described in claim 1, wherein the cross-sectional width of the elastic connection portion is We, and the cross-sectional height of the elastic connection portion is He, which satisfies the following conditions: 0.01

We/He

0.9. The movable electronic photosensitive module as described in claim 9, wherein the cross-sectional width of the elastic connection portion is We, and the cross-sectional height of the elastic connection portion is He, which satisfies the following conditions: 0.05

We/He

0.6. The movable electronic photosensitive module as described in claim 1, wherein each of the wire units is arranged on the same plane. As described in claim 1, the movable electronic photosensitive module, wherein the surrounding surfaces of each wire unit are in direct contact with the air. The movable electronic photosensitive module as described in claim 1, wherein the conductive wire portion comprises a copper metal material. The movable electronic photosensitive module as described in claim 1, wherein the conductive wire portion comprises a copper alloy material. As described in claim 14, the copper content of the copper alloy material is MCu, which meets the following conditions: 98%<MCu<100%. A camera module comprises: a movable electronic photosensitive module as described in claim 1; an imaging lens module for imaging an imaging light on the electronic photosensitive element of the movable electronic photosensitive module; and an optical image stabilizing drive for providing a driving force for the electronic photosensitive element to move relative to the imaging lens module. An electronic device, comprising: a camera module as described in claim 16. A movable circuit element comprises: an inner frame portion having a plurality of electrical connection terminals; an outer frame portion disposed around the inner frame portion and having a plurality of electrical connection terminals; an elastic connection portion connecting the outer frame portion and the inner frame portion so that the inner frame portion can move relative to the outer frame portion; and a wire portion consisting of a plurality of wire units; wherein each of the wire units has two ends, and the two ends of each of the wire units are electrically connected to each of the electrical connection terminals of the outer frame portion and each of the electrical connection terminals of the inner frame portion, respectively, and there is no physical contact between the wire units of the wire portion, and each of the wire units is a conductive material as a whole; wherein there is no physical contact between the elastic connection portion and the wire portion. A movable circuit element as described in claim 18, wherein each of the conductor units is arranged on the same plane. A movable circuit element as described in claim 18, wherein the surrounding surfaces of each of the conductor units are in direct contact with the air. A movable circuit element as described in claim 18, wherein at least four of the conductor units are arranged adjacent to each other, and the distance between two adjacent conductor units of the at least four conductor units is Dc, which satisfies the following conditions: 0.05 mm

Dc

0.35mm. A movable circuit element as claimed in claim 21, wherein the distance between two adjacent ones of the at least four conductor units is Dc, which satisfies the following conditions: 0.10 mm

Dc

0.30mm. The movable circuit element as claimed in claim 18, wherein the width of each of the conductor units is Wc, which satisfies the following conditions:

0.07mm. The movable circuit element as claimed in claim 23, wherein the width of each of the conductor units is Wc, which satisfies the following conditions:

0.05mm. The movable circuit element as claimed in claim 18, wherein at least four of the conductor units are arranged adjacent to each other, the distance between two adjacent conductor units of the at least four conductor units is Dc, and the width of each conductor unit is Wc, which satisfies the following conditions:

DC/W

7. A movable circuit element as claimed in claim 18, wherein the number of the conductive line units is N, which satisfies the following conditions:

N. The movable circuit element as claimed in claim 18, wherein the cross-sectional width of the elastic connection portion is We, and the cross-sectional height of the elastic connection portion is He, which satisfies the following conditions: 0.01

We/He

0.9. The movable circuit element as claimed in claim 27, wherein the cross-sectional width of the elastic connection portion is We, and the cross-sectional height of the elastic connection portion is He, which satisfies the following conditions: 0.05

We/He

0.6. A movable circuit element as described in claim 18, wherein the conductor portion comprises a copper metal material. A movable circuit element as described in claim 18, wherein the conductor portion comprises a copper alloy material. As described in claim 30, the copper content of the copper alloy material is MCu, which meets the following conditions: 98%<MCu<100%.

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