TWI857602B - Cooling film with enhancing magnetism - Google Patents

Abstract

A cooling film with enhancing magnetism used for electronic device with a wireless charging coil inside is provided. The cooling film has a front layer, a back layer and a middle layer. The back layer is flatly attached to the electronic device. The middle layer is sandwiched and fixed between the front layer and the back layer, and has a metal frame and a heat conduction sheet. The metal frame is corresponding to the wireless charging coil and has a hollow portion. The heat conduction sheet has a heat conduction center corresponding to and accommodation in the hollow portion. The metal frame and the heat conduction sheet are combined to form the middle layer. The cooling film is therefore increasing heat dissipation and enhancing magnetism to improve wireless charging efficiency through the metal frame.

Description

Heat sink structure with magnetic lifting function

This application relates to a heat sink used on the back of an electronic device, and more particularly to a heat sink structure with a magnetic lifting function.

With regard to electronic devices that are becoming more and more common today (e.g., smartphones or tablets), the software updates very quickly, so some older electronic devices often have hardware that cannot keep up with the new software, causing them to overheat.

Furthermore, in order to protect such electronic devices from being damaged or dropped, a protective case is usually installed outside the electronic device. Since the protective case mainly covers the back of the electronic device, the heat generated by the electronic device is difficult to dissipate, which may affect the operation of the electronic device.

In order to increase heat dissipation, a heat dissipation film can be added to the back of the electronic device, but it will hinder wireless charging. In detail, in order to be wirelessly charged, the current electronic device must add a wireless charging coil and its related components inside itself, and place the electronic device on a wireless charging base with another wireless charging coil inside to wirelessly charge the electronic device. However, the aforementioned heat dissipation film added for heat dissipation will be separated between the two wireless charging coils, which will cause the magnetism between the two wireless charging coils to be weakened due to being blocked by the heat dissipation film, thereby reducing the wireless charging efficiency.

Therefore, how to increase heat dissipation while overcoming the above-mentioned shortcomings of the prior art is a major issue that the creators of this application are eager to solve.

The purpose of this application is to provide a heat sink structure with a magnetic enhancement function. By adding a metal frame to the heat conductive sheet, in addition to using the heat conductive sheet to increase heat dissipation, the metal frame can also be used to enhance magnetic properties to facilitate wireless charging.

In order to achieve the above-mentioned purpose, the present application provides a heat sink structure with a magnetic lifting function, which is used for an electronic device with a wireless charging coil inside and includes: a front layer; a back layer, which is flatly attached to the electronic device; and an intermediate layer, which is sandwiched and fixed between the front layer and the back layer, and the intermediate layer includes a metal frame and a heat conductive sheet, the metal frame has a hollow part, the heat conductive sheet includes a heat conductive center part, and the heat conductive center part is correspondingly arranged in the hollow part. The metal frame and the heat conductive sheet are combined together to form the intermediate layer, and the metal frame corresponds to the wireless charging coil.

The present application also provides a heat sink structure with a magnetic lifting function, comprising: a front layer; a back layer; and a middle layer, which is sandwiched and fixed between the front layer and the back layer, and the middle layer includes a metal frame and a heat conductive sheet, the metal frame has a hollow portion, and the heat conductive sheet includes a heat conductive center portion, and the heat conductive center portion is correspondingly arranged in the hollow portion. The metal frame and the heat conductive sheet are combined together to form the middle layer.

Compared with the prior art, the present application has the following effects: by adding a metal frame to the heat conductive sheet, in addition to utilizing the heat conductive sheet to increase heat dissipation, the metal frame can also be utilized to enhance magnetism, thereby increasing the heat dissipation effect and facilitating wireless charging and improving wireless charging efficiency.

The detailed description and technical contents of this application are described below with the help of drawings. However, the attached drawings are only provided for reference and description and are not used to limit this application.

As shown in FIGS. 1 to 3 and 5, the present application provides a heat sink structure (hereinafter referred to as heat sink structure) 100 with a magnetic enhancement function, which is used in an electronic device 500. A wireless charging coil (not shown) is disposed inside the electronic device 500. The heat sink structure 100 of the present application can increase heat dissipation and enhance magnetic properties of the electronic device 500. Among them, FIGS. 1 to 4 are the first embodiment of the present application, and FIGS. 5 to 6 are the second embodiment of the present application.

As shown in FIG. 1 to FIG. 3 , the first embodiment of the heat sink structure 100 of the present application includes: a front layer 3 a, a back layer 4 a and a middle layer M.

The front layer 3a can be a sheet made of any material, and can be a cloth sheet (such as a velvet sheet), but is not limited thereto.

The back layer 4a is used to be flatly attached or flatly attached and adhesively fixed to the back of the electronic device 500. In other words, the back layer 4a does not necessarily have to be adhesive, as long as it can be flatly attached and positioned on the back of the electronic device 500. In order to have adhesiveness, the back layer 4a may have a backing glue (not shown) or be an adhesive itself to form an adhesive layer; in addition, when it is not an adhesive itself, the back layer 4a may be a film (such as polyethylene terephthalate (PET or PETE)), but it is not limited thereto.

The middle layer M includes a metal frame 1 and a heat conductive sheet 2a. The metal frame 1 has a hollow portion 11. The heat conductive sheet 2a can be a heat conductive sheet or a heat conductive insulating sheet with a thickness between 0.15 mm and 0.3 mm (but not limited thereto), and the heat conductive sheet 2a can be, for example, a sheet of graphite material, but the present application is not limited thereto. In the first embodiment, the heat conductive sheet 2a can include a heat conductive central portion 21 and a heat conductive peripheral portion 22, the heat conductive peripheral portion 22 surrounds the heat conductive central portion 21 and forms a spacing space 23 between the heat conductive peripheral portion 22 and the heat conductive central portion 21. The metal frame 1 is correspondingly embedded in the spacing space 23, so that the metal frame 1 and the heat conductive sheet 2a are combined together to form the required middle layer M. The metal frame 1 and the heat-conducting sheet 2a may be roughly flush with each other, or even have the same thickness, but this application does not limit this. In other words, the metal frame 1 and the heat-conducting sheet 2a may also have different thicknesses.

The middle layer M is sandwiched and fixed between the front layer 3a and the back layer 4a, so that the middle layer M, the front layer 3a and the back layer 4a together form the heat sink structure 100 of this application. The front layer 3a and the back layer 4a have the same area, and the area of the middle layer M is equal to or slightly smaller than the area of the front layer 3a (or the back layer 4a).

Thus, as shown in FIG3 , the heat sink structure 100 of the present application is firstly attached or attached and adhesively fixed to the back of the electronic device 500 with the back layer 4a, so that the metal frame 1 corresponds to the wireless charging coil in the electronic device 500. Therefore, when the electronic device 500 needs to be wirelessly charged, the electronic device 500 is placed on a wireless charging stand (not shown) together with the heat sink structure 100 of the present application, so that the heat dissipation can be increased by the heat conductive sheet 2a, and the magnetism between one wireless charging coil in the electronic device 500 and another wireless charging coil in the wireless charging stand can be enhanced by the metal frame 1, which is beneficial to wireless charging, thereby improving the wireless charging efficiency.

As shown in FIG. 4 , when the electronic device 500 is also covered with a protective case 700, the heat sink structure 100 of the present application is sandwiched between the back surface of the electronic device 500 and the inner surface of the protective case 700, and as shown in the figure, the back surface layer 4a is flatly attached or flatly attached and adhesively fixed to the inner surface of the protective case 700 (or the back surface of the electronic device 500 (not shown)), so it also has all the aforementioned effects. In other words, the heat sink structure 100 of the present application can be used alone on the back surface of the electronic device 500, or between the electronic device 500 and the protective case 700, and no matter which method of use is used, heat dissipation can be increased, and magnetism can be enhanced to facilitate wireless charging.

In other embodiments not shown in the figures, when the electronic device 500 is also covered with a protective case 700, the heat sink structure 100 of the present application can also be disposed outside the protective case 700, and its back layer 4a is flatly attached and adhesively fixed to the outside of the protective case 700, which also has all the aforementioned effects.

As shown in FIG5 and FIG6, the second embodiment of the heat sink structure 100 of the present application is shown. The second embodiment is substantially the same as the first embodiment, except that the overall area of the second embodiment is smaller than that of the first embodiment, as described below.

The second embodiment of the heat sink structure 100 of the present application also includes a middle layer M, a front layer 3 and a back layer 4. The middle layer M in the second embodiment only includes a heat-conducting central portion 21, that is, it does not include the heat-conducting peripheral portion 22 in the first embodiment. The heat-conducting central portion 21 is correspondingly arranged in the hollow portion 11 of the metal frame 1, so that the metal frame 1 and the heat-conducting sheet 2 having only the heat-conducting central portion 21 are combined together to form the required middle layer M. Since the heat-conducting sheet 2 in the second embodiment does not include the heat-conducting peripheral portion 22, the area of the heat-conducting sheet 2 (or middle layer M) in the second embodiment must be smaller than the area of the heat-conducting sheet 2a (or middle layer M) in the first embodiment. In addition, the middle layer M is also sandwiched and fixed between the front layer 3 and the back layer 4 to form the heat sink structure 100 of the present application.

It should be noted that the front layer 3 and the back layer 4 have the same area, and the area of the front layer 3 (or the back layer 4) may be equal to or slightly larger than the area of the middle layer M.

The above is only the preferred feasible embodiment of the present application, and does not limit the patent scope of the present application. All equivalent structural changes made by using the contents of the description and drawings of the present application are also included in the scope of the rights of the present application and shall be stated.

100: heat sink structure 1: metal frame 11: hollow part 2,2a: heat conducting sheet 21: heat conducting center 22: heat conducting peripheral part 23: spacer 3,3a: front layer 4,4a: back layer 500: electronic device 700: protective case M: middle layer

FIG1 is a three-dimensional exploded view of the first embodiment of the present application.

FIG. 2 is a schematic cross-sectional view of the first embodiment of the present application after assembly.

FIG3 is a schematic plan view of the first embodiment of the present application disposed on the back of an electronic device.

FIG. 4 is a cross-sectional view of the first embodiment of the present application disposed between an electronic device and a protective casing.

FIG5 is a three-dimensional exploded view of the second embodiment of the present application.

FIG6 is a schematic cross-sectional view of the second embodiment of the present application after assembly.

100: Heat sink structure

1:Metal frame

11: Hollow part

2: Heat sink

21: Heat conduction center

3: Front layer

4: Back layer

M: Middle layer

Claims (9)

A heat sink structure with a magnetic lifting function is used for an electronic device with a wireless charging coil inside and comprises: a front layer; a back layer flatly attached to the electronic device; and an intermediate layer sandwiched and fixed between the front layer and the back layer, the intermediate layer comprising a metal frame and a heat conductive sheet, the metal frame having a hollow portion, the heat conductive sheet comprising a heat conductive center portion, the heat conductive center portion being correspondingly arranged in the hollow portion, the metal frame and the heat conductive sheet are combined together to form the intermediate layer, and the metal frame corresponds to the wireless charging coil. A heat sink structure with magnetic lifting function includes: a front layer; a back layer; and an intermediate layer, which is sandwiched and fixed between the front layer and the back layer, and the intermediate layer includes a metal frame and a heat conductive sheet, the metal frame has a hollow part, the heat conductive sheet includes a heat conductive center part, and the heat conductive center part is correspondingly arranged in the hollow part. The metal frame and the heat conductive sheet are combined to form the intermediate layer. A heat sink structure with magnetic lifting function as described in claim 1 or 2, wherein the metal frame and the heat conductive sheet are flush with each other. A heat sink structure with a magnetic lifting function as described in claim 1 or 2, wherein the heat conductive sheet further includes a heat conductive peripheral portion, the heat conductive peripheral portion surrounds the heat conductive central portion and forms a spacing space between the heat conductive peripheral portion and the heat conductive central portion, and the metal frame is correspondingly embedded in the spacing space. A heat sink structure with magnetic lifting function as described in claim 1 or 2, wherein the thermally conductive sheet is a thermally conductive sheet or a thermally conductive insulating sheet with a thickness ranging from 0.15 mm to 0.3 mm. A heat sink structure with magnetic lifting function as described in claim 1 or 2, wherein the heat conductive sheet is a graphite sheet. The heat sink structure with magnetic lifting function as described in claim 1 or 2, wherein the back layer is an adhesive layer. A heat sink structure with magnetic lifting function as described in claim 1 or 2, wherein the back layer has a backing adhesive. A heat sink structure with magnetic lifting function as described in claim 1 or 2, wherein the front layer is a velvet sheet.

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